TW202225837A - 感光性元件、固化物之製造方法、固化物圖案之製造方法及配線板之製造方法 - Google Patents
感光性元件、固化物之製造方法、固化物圖案之製造方法及配線板之製造方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- Polymers & Plastics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Structural Engineering (AREA)
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- Manufacturing & Machinery (AREA)
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- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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WOPCT/JP2020/042510 | 2020-11-13 | ||
PCT/JP2020/042510 WO2022102101A1 (ja) | 2020-11-13 | 2020-11-13 | 感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法 |
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TW202225837A true TW202225837A (zh) | 2022-07-01 |
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TW110141999A TW202225837A (zh) | 2020-11-13 | 2021-11-11 | 感光性元件、固化物之製造方法、固化物圖案之製造方法及配線板之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022102675A1 (ja) |
KR (1) | KR20230107474A (ja) |
CN (1) | CN116830037A (ja) |
TW (1) | TW202225837A (ja) |
WO (2) | WO2022102101A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001013681A (ja) | 1999-06-28 | 2001-01-19 | Hitachi Chem Co Ltd | 感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP2014074764A (ja) | 2012-10-03 | 2014-04-24 | Hitachi Chemical Co Ltd | 感光性エレメント及びこれを用いたレジストパターンの形成方法、プリント配線板の製造方法 |
JPWO2018100730A1 (ja) * | 2016-12-02 | 2019-10-17 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 |
JP7137370B2 (ja) * | 2017-12-04 | 2022-09-14 | 旭化成株式会社 | 感光性樹脂積層体ロール |
-
2020
- 2020-11-13 WO PCT/JP2020/042510 patent/WO2022102101A1/ja active Application Filing
-
2021
- 2021-11-10 CN CN202180038977.0A patent/CN116830037A/zh active Pending
- 2021-11-10 WO PCT/JP2021/041406 patent/WO2022102675A1/ja active Application Filing
- 2021-11-10 KR KR1020227038217A patent/KR20230107474A/ko active Search and Examination
- 2021-11-10 JP JP2022561974A patent/JPWO2022102675A1/ja active Pending
- 2021-11-11 TW TW110141999A patent/TW202225837A/zh unknown
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Publication number | Publication date |
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KR20230107474A (ko) | 2023-07-17 |
WO2022102675A1 (ja) | 2022-05-19 |
CN116830037A (zh) | 2023-09-29 |
JPWO2022102675A1 (ja) | 2022-05-19 |
WO2022102101A1 (ja) | 2022-05-19 |
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