TWI642044B - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereof Download PDFInfo
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- TWI642044B TWI642044B TW107100815A TW107100815A TWI642044B TW I642044 B TWI642044 B TW I642044B TW 107100815 A TW107100815 A TW 107100815A TW 107100815 A TW107100815 A TW 107100815A TW I642044 B TWI642044 B TW I642044B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
一種電子裝置，包括：第一基板、第二基板、夾設於第一基板與第二基板之間的介質層、設置於第一基板之內表面上的至少二子畫素、至少二信號線、分別覆蓋信號線的鄰近於第一基板之至少一側面的一部份，以形成至少二個重疊區的至少二導電圖案、設置於第一基板與第二基板之間，並覆蓋信號線的一部份與重疊區的黏膠，且黏膠之部份表面與重疊區的至少一部份形成多個容納區、以及設置於第一基板之至少一側面上的至少二側電極。其中，側電極之一部份分別延伸至容納區並分別覆蓋導電圖案，且側電極之另一部份與至少一電路元件電性連接。An electronic device includes: a first substrate, a second substrate, a dielectric layer sandwiched between the first substrate and the second substrate, at least two sub-pixels disposed on an inner surface of the first substrate, at least two signal lines, A portion of the signal line adjacent to at least one side of the first substrate is respectively covered to form at least two conductive patterns of at least two overlapping regions, disposed between the first substrate and the second substrate, and covering one of the signal lines. A part of the adhesive and the overlapping area, and a part of the surface of the adhesive and at least a part of the overlapping area form a plurality of accommodating areas and at least two side electrodes disposed on at least one side of the first substrate. Wherein, a part of the side electrode extends to the accommodating area and covers the conductive pattern, and another part of the side electrode is electrically connected to at least one circuit element.
Description
本發明是有關於一種電子裝置，且特別是有關於一種應用側邊接合技術的電子裝置。The present invention relates to an electronic device, and more particularly, to an electronic device using a side bonding technology.
隨著技術的發展，顯示面板的邊框逐漸縮小，甚至出現無邊框的設計。With the development of technology, the frame of the display panel is gradually shrinking, and even a frameless design appears.
而為了實現顯示面板的窄邊框，需要改變面板與其他電子元件的接合方式。然而，二者於接合時，所接觸的導通面積較小，使得導通性較低。再者，在進行接合前與後的過程仍有可能產生走線損傷及/或接合不牢的情況發生。In order to realize the narrow frame of the display panel, it is necessary to change the bonding method of the panel and other electronic components. However, when the two are joined, the conductive area that they contact is small, making the conductivity low. Furthermore, the process of bonding before and after bonding may still cause damage to the wiring and / or poor bonding.
有鑑於此，本發明提供一種電子裝置，其可能夠解決於側邊接合製程的導通面積過小、走線損傷、及/或接合不牢的問題。In view of this, the present invention provides an electronic device, which can solve the problems that the conduction area of the side bonding process is too small, the wiring is damaged, and / or the bonding is not strong.
本發明的電子裝置包括：第一基板、第二基板、夾設於第一基板與第二基板之間的介質層、設置於第一基板之內表面上的至少二子畫素、設置於第一基板之內表面上並與子畫素電性連接，且延伸至鄰近於第一基板之至少一側面的至少二信號線、分別設置於信號線上，並分別覆蓋信號線的鄰近於第一基板之至少一側面的一部份，以形成至少二個重疊區的至少二導電圖案、設置於第一基板與第二基板之間，並覆蓋信號線的一部份與重疊區的黏膠，且黏膠之部份表面與重疊區的至少一部份形成多個容納區、以及設置於第一基板之至少一側面上的至少二側電極。其中，側電極之一部份分別延伸至容納區並分別覆蓋導電圖案，且側電極之另一部份與至少一電路元件電性連接。The electronic device of the present invention includes a first substrate, a second substrate, a dielectric layer interposed between the first substrate and the second substrate, at least two sub-pixels disposed on an inner surface of the first substrate, and disposed on the first substrate. The inner surface of the substrate is electrically connected to the sub-pixels, and extends to at least two signal lines adjacent to at least one side of the first substrate, respectively disposed on the signal lines, and respectively covering the signal lines adjacent to the first substrate. A portion of at least one side to form at least two conductive patterns of at least two overlapping regions, disposed between the first substrate and the second substrate, and covering a portion of the signal line and the adhesive of the overlapping regions, and adhering A part of the surface of the glue and at least a part of the overlapping area form a plurality of accommodating areas and at least two side electrodes disposed on at least one side surface of the first substrate. Wherein, a part of the side electrode extends to the accommodating area and covers the conductive pattern, and another part of the side electrode is electrically connected to at least one circuit element.
在本發明的一實施例中，上述的介質層為顯示介質或絕緣層。In an embodiment of the present invention, the dielectric layer is a display medium or an insulating layer.
在本發明的一實施例中，上述的信號線包含資料線、掃描線、共用電極線及電源供應線其中至少一者。In an embodiment of the present invention, the signal line includes at least one of a data line, a scan line, a common electrode line, and a power supply line.
在本發明的一實施例中，上述的導電圖案的材料包含透明導電材料。In an embodiment of the present invention, a material of the conductive pattern includes a transparent conductive material.
在本發明的一實施例中，上述的側電極更設置於第二基板之至少一側面上。In an embodiment of the present invention, the above-mentioned side electrode is further disposed on at least one side surface of the second substrate.
在本發明的一實施例中，上述的黏膠之部份表面係為黏膠之部份下表面，且容納區分別由黏膠之部份下表面與重疊區的至少一部份所形成。In an embodiment of the present invention, the above-mentioned part of the surface of the viscose is a part of the lower surface of the viscose, and the receiving areas are respectively formed by at least a part of the lower surface of the viscose and the overlapping area.
在本發明的一實施例中，上述的黏膠之部份表面係為黏膠之側面，且容納區分別由黏膠之部份側面、第二基板之部份內表面與重疊區的至少一部份所形成。In an embodiment of the present invention, a part of the surface of the adhesive is a side of the adhesive, and the receiving area is at least one of the side of the adhesive, a part of the inner surface of the second substrate, and the overlapping area Partly formed.
在本發明的一實施例中，上述的黏膠包含第一部份與第二部份，且第一部份與第二部份分離設置。In an embodiment of the present invention, the above-mentioned adhesive includes a first part and a second part, and the first part and the second part are disposed separately.
本發明更提供一種電子裝置的製造方法，包括下列步驟： 提供第一基板，第一基板的內表面具有：至少二子畫素、至少二信號線、以及至少二導電圖案，其中信號線與子畫素電性連接，且延伸至與鄰近於第一基板之至少一側面，導電圖案分別設置於信號線上，且分別覆蓋信號線的鄰近於第一基板之至少一側面的一部份，以形成至少二個重疊區； 分別提供第二基板與黏膠，以黏合第一基板與第二基板，其中，黏膠位於第一基板與第二基板之間，且覆蓋信號線的一部份與重疊區；以及 移除部份黏膠，以使黏膠之部份表面與重疊區的至少一部份形成多個容納區。The invention further provides a method for manufacturing an electronic device, comprising the following steps: providing a first substrate, the inner surface of the first substrate having at least two sub-pixels, at least two signal lines, and at least two conductive patterns, wherein the signal lines and the sub-pictures Are electrically connected and extend to at least one side adjacent to the first substrate, and conductive patterns are respectively disposed on the signal lines, and respectively cover a portion of the signal lines adjacent to at least one side of the first substrate to form at least Two overlapping areas; a second substrate and an adhesive are respectively provided to adhere the first substrate and the second substrate, wherein the adhesive is located between the first substrate and the second substrate and covers a part of the signal line and the overlapping area And removing a part of the adhesive so that a part of the surface of the adhesive and at least a part of the overlapping area form a plurality of receiving areas.
在本發明的一實施例中，於移除部份黏膠時，移除部分第一基板之側面以及部份第二基板之側面的至少一者。In an embodiment of the present invention, when removing part of the adhesive, at least one of the side surface of the first substrate and the side surface of the second substrate is removed.
在本發明的一實施例中，上述的移除部份黏膠、部份第一基板之側面與部分第二基板之側面的方法包括研磨方法。In an embodiment of the present invention, the method for removing part of the adhesive, part of the side surface of the first substrate, and part of the side surface of the second substrate includes the grinding method.
在本發明的一實施例中，上述的移除第一基板之側面與第二基板之側面的移除速率小於移除黏膠的移除速率。In an embodiment of the present invention, the removal rate of removing the side surface of the first substrate and the side surface of the second substrate is lower than the removal rate of removing the adhesive.
在本發明的一實施例中，上述的移除部份黏膠的方法包括雷射移除法。In an embodiment of the present invention, the method for removing a part of the adhesive includes a laser removal method.
在本發明的一實施例中，上述的移除部份黏膠的方法包括水解法。In an embodiment of the present invention, the method for removing a part of the adhesive includes a hydrolysis method.
在本發明的一實施例中，當提供黏膠以黏合第一基板與第二基板時，分別形成黏膠之第一部份與黏膠之第二部份於第一基板與第二基板之間，且第一部份與第二部份分離設置。In an embodiment of the present invention, when an adhesive is provided to adhere the first substrate and the second substrate, a first portion of the adhesive and a second portion of the adhesive are formed on the first substrate and the second substrate, respectively. And the first part is separated from the second part.
在本發明的一實施例中，移除部份黏膠時，移除黏膠的第一部份之至少一部份。In an embodiment of the present invention, when removing a part of the adhesive, at least a part of the first part of the adhesive is removed.
在本發明的一實施例中，上述的移除第一基板之側面與第二基板之側面的移除速率小於移除黏膠的第一部份的移除速率。In an embodiment of the present invention, the removal rate of removing the side surface of the first substrate and the side surface of the second substrate is lower than the removal rate of the first portion of the adhesive.
在本發明的一實施例中，上述的電子裝置的製造方法更包括：於第一基板之至少一側面上形成至少二側電極，側電極之一部份分別延伸至容納區並分別覆蓋導電圖案，且側電極之另一部份與至少一電路元件電性連接。In an embodiment of the present invention, the above-mentioned method for manufacturing an electronic device further includes: forming at least two side electrodes on at least one side surface of the first substrate, and a part of the side electrodes respectively extends to the receiving area and covers the conductive patterns respectively. And another part of the side electrode is electrically connected to at least one circuit element.
基於上述，本發明的電子裝置能夠解決側邊接合製程的導通面積過小以及走線損傷的問題，而能進一步縮小面板的邊框面積，同時也不影響其導通性。Based on the above, the electronic device of the present invention can solve the problems of too small conduction area and trace damage of the side bonding process, and can further reduce the area of the frame of the panel without affecting its conductivity.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
在附圖中，為了清楚起見，放大了層、膜、面板、區域等的厚度。在整個說明書中，相同的附圖標記表示相同的元件。應當理解，當諸如層、膜、區域或基板的元件被稱為在另一元件”上”或”連接到”另一元件時，其可以直接在另一元件上或與另一元件連接，或者中間元件可以也存在。相反，當元件被稱為”直接在另一元件上”或”直接連接到”另一元件時，不存在中間元件。如本文所使用的，”連接”可以指物理及/或電性連接。再者，”電性連接”或”耦接/耦合”係可為二元件間存在其它元件。In the drawings, the thicknesses of layers, films, panels, regions, etc. are exaggerated for clarity. Throughout the description, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and / or electrical connection. Furthermore, "electrically connected" or "coupled / coupled" means that there are other components between the two components.
本文使用的”約”、”近似”、或”實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值，考慮到所討論的測量和與測量相關的誤差的特定數量(即，測量系統的限制)。例如，”約”可以表示在所述值的一個或多個標準偏差內，或±30％、±20％、±10％、±5％內。再者，本文使用的“約”、”近似”或“實質上”可依光學性質、蝕刻性質或其它性質，來選擇較可接受的偏差範圍或標準偏差，而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation range of a particular value determined by one of ordinary skill in the art, taking into account the measurements in question and A specific number of measurement-related errors (ie, limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Furthermore, "about", "approximately" or "substantially" as used herein may select a more acceptable range of deviations or standard deviations based on optical properties, etching properties, or other properties, and all properties can be applied without one standard deviation .
除非另有定義，本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是，諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義，並且將不被解釋為理想化的或過度正式的意義，除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the related art and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.
本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此，可以預期到作為例如製造技術及/或公差的結果的圖示的形狀變化。因此，本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀，而是包括例如由製造導致的形狀偏差。例如，示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外，所示的銳角可以是圓的。因此，圖中所示的區域本質上是示意性的，並且它們的形狀不是旨在示出區域的精確形狀，並且不是旨在限制權利要求的範圍。Exemplary embodiments are described herein with reference to cross-sectional views that are schematic views of idealized embodiments. Accordingly, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Therefore, the embodiments described herein should not be construed as limited to the particular shape of the area as shown herein, but include shape deviations caused by, for example, manufacturing. For example, a region shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be round. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
本文的示意圖僅是用以示意本發明部分的實施例。因此，示意圖中所示之各個元件的形狀、數量及比例大小不應被用來限制本發明。舉例來說，示意圖中之側電極以及容納區的實際數量、大小以及形狀僅是用來作為示意，並不代表本發明之側電極以及容納區的實際數量、大小以及形狀一定要如圖中所示。The diagrams herein are only examples of parts of the invention. Therefore, the shape, number, and proportion of each element shown in the schematic diagram should not be used to limit the present invention. For example, the actual numbers, sizes, and shapes of the side electrodes and the accommodating area in the schematic diagram are only for illustration, and do not represent that the actual numbers, sizes, and shapes of the side electrodes and the accommodating area of the present invention must be as shown in the figure. Show.
首先，對本發明的電子裝置進行說明。First, the electronic device of the present invention will be described.
圖1A是本發明的一實施例的電子裝置的局部立體透視示意圖。圖1B是圖1A的電子裝置的預定方向(例如：D3方向)側視示意圖。圖1C是圖1A的電子裝置的沿剖面線A-A’的剖面示意圖。FIG. 1A is a schematic partial perspective perspective view of an electronic device according to an embodiment of the invention. FIG. 1B is a schematic side view of the electronic device of FIG. 1A in a predetermined direction (for example, the D3 direction). FIG. 1C is a schematic cross-sectional view of the electronic device of FIG. 1A along a section line A-A '.
請同時參考圖1A、圖1B，電子裝置1包括第一基板100、第二基板200、夾設於第一基板100與第二基板200之間的介質層150、設置於第一基板100與第二基板200之間的黏膠140以及設置於第一基板100之至少一側面101上的側電極160。第二基板200也具有至少一側面201。舉例而言，第一基板100之至少一側面101與第二基板200之至少一側面201係為同一側，也可視為電子裝置1之同一側。1A and 1B, the electronic device 1 includes a first substrate 100, a second substrate 200, a dielectric layer 150 interposed between the first substrate 100 and the second substrate 200, and the first substrate 100 and the first substrate 100. An adhesive 140 between the two substrates 200 and a side electrode 160 disposed on at least one side surface 101 of the first substrate 100. The second substrate 200 also has at least one side surface 201. For example, at least one side surface 101 of the first substrate 100 and at least one side surface 201 of the second substrate 200 are on the same side, and can also be regarded as the same side of the electronic device 1.
在本實施例中，第一基板100例如為薄膜電晶體畫素陣列(Thin Film Transistor Array，TFT array)基板，但不以此為限。在圖1A中，第一基板100的內表面102上設置有至少二子畫素114。In this embodiment, the first substrate 100 is, for example, a thin film transistor array (TFT array) substrate, but is not limited thereto. In FIG. 1A, at least two sub-pixels 114 are disposed on the inner surface 102 of the first substrate 100.
第一基板100的內表面102上設置有至少二信號線SL，並與對應的子畫素114電性連接，且信號線SL可延伸至鄰近於第一基板100之至少一側面101。信號線SL包含資料線110、掃描線111、共用電極線112、電源供應線(未標示)及其它合適的線路其中至少一者。舉例而言，信號線SL之種類可依當介質層150為顯示介質150(例如：非自發光材料、自發光材料、或其它合適的材料)之類型，來改變且運用。在圖1A中，信號線SL例如是資料線110、掃描線111以及/或共用電極線112，但不限於此。於其它實施例中，共用電極線112可與後述的畫素電極113耦合而與對應的子畫素114電性連接。At least two signal lines SL are disposed on the inner surface 102 of the first substrate 100 and are electrically connected to corresponding sub-pixels 114. The signal lines SL may extend to at least one side surface 101 adjacent to the first substrate 100. The signal line SL includes at least one of a data line 110, a scan line 111, a common electrode line 112, a power supply line (not labeled), and other suitable lines. For example, the type of the signal line SL can be changed and applied according to the type when the dielectric layer 150 is a display medium 150 (for example, a non-self-luminous material, a self-luminous material, or another suitable material). In FIG. 1A, the signal line SL is, for example, a data line 110, a scan line 111, and / or a common electrode line 112, but is not limited thereto. In other embodiments, the common electrode line 112 may be coupled to a pixel electrode 113 described later and electrically connected to a corresponding sub-pixel 114.
舉例而言，子畫素114至少包括至少一開關元件T、信號線SL(例如資料線110、掃描線111以及/或共用電極線112)以及至少一畫素電極113。於其它實施例中，子畫素114可選擇性的不包含信號線SL中的共用電極線112。如圖1A所示，開關元件T可以分別配置在第一基板100上，可位於多條信號線SL的交錯處(interlace)，例如：開關元件T可以配置在二條信號線SL(例如：資料線110以及掃描線111)的交錯處，且分別與二條信號線SL(例如：資料線110以及掃描線111)電性連接，但不限於此。於其它實施例中，開關元件T可位於鄰近交錯處或非交錯處，且分別與二條信號線SL(例如：資料線110以及掃描線111)電性連接。在本實施例中，開關元件T例如為薄膜電晶體（TFT），且其可包括底閘極式（bottom-gate）、頂閘極式（top-gate）、立體式的電晶體（vertical TFT）、或其它合適的電晶體，本發明並不特別限制。開關元件T可以以矩陣的形式配置在第一基板100上，並分別電性連接所對應的至少一條信號線SL(例如：資料線110及/或掃描線111)。For example, the sub-pixel 114 includes at least one switching element T, a signal line SL (such as a data line 110, a scan line 111, and / or a common electrode line 112) and at least one pixel electrode 113. In other embodiments, the sub-pixel 114 may optionally not include the common electrode line 112 in the signal line SL. As shown in FIG. 1A, the switching elements T may be respectively disposed on the first substrate 100 and may be located at the interlace of a plurality of signal lines SL. For example, the switching elements T may be disposed on two signal lines SL (for example, a data line). 110 and the scanning line 111) are electrically connected to two signal lines SL (for example, the data line 110 and the scanning line 111), but are not limited thereto. In other embodiments, the switching element T may be located at an adjacent staggered or non-staggered position, and is electrically connected to the two signal lines SL (eg, the data line 110 and the scan line 111). In this embodiment, the switching element T is, for example, a thin film transistor (TFT), and it may include a bottom-gate, a top-gate, and a three-dimensional transistor (vertical TFT). ), Or other suitable transistors, the present invention is not particularly limited. The switching elements T can be arranged on the first substrate 100 in a matrix form, and are electrically connected to at least one corresponding signal line SL (for example, the data line 110 and / or the scanning line 111).
第一基板100的內表面102上設置有至少二導電圖案120，分別設置於對應的信號線SL(例如：資料線110、掃描線111、共用電極線112、電源供應線(未標示)、或其它合適的線路其中至少一者、或是前述線路之至少二條)上，並分別覆蓋信號線SL鄰近於第一基板100之至少一側面101的一部份，以形成至少二個重疊區122。在一實施例中，導電圖案120可為單層或多層結構，且其材料包含透明導電材料，例如氧化銦錫(ITO)、銦鋅氧化物(IZO)、鋁鋅氧化物(AZO)、奈米碳管或奈米碳桿、或其它合適的材料。藉由導電圖案120的設置，可使信號線SL與側電極160之間電性連接，同時也可保護信號線SL，以避免在加工過程中因信號線SL氧化而產生的良率降低。At least two conductive patterns 120 are disposed on the inner surface 102 of the first substrate 100, and are respectively disposed on the corresponding signal lines SL (for example, the data line 110, the scan line 111, the common electrode line 112, the power supply line (not labeled), or At least one of the other suitable lines or at least two of the foregoing lines), and respectively covers a portion of the signal line SL adjacent to at least one side 101 of the first substrate 100 to form at least two overlapping regions 122. In one embodiment, the conductive pattern 120 may have a single-layer or multi-layer structure, and the material thereof includes a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), nanocrystalline Carbon tubes or nano carbon rods, or other suitable materials. By providing the conductive pattern 120, the signal line SL and the side electrode 160 can be electrically connected, and at the same time, the signal line SL can be protected to avoid a decrease in yield due to the oxidation of the signal line SL during processing.
此處，所謂「覆蓋信號線SL鄰近於第一基板100之至少一側面101的一部份」是指：導電圖案120設置在第一基板100上，且其設置位置鄰近於第一基板100的至少一側面101，且導電圖案120覆蓋信號線SL的至少一部份。以圖1A、圖1B為例，導電圖案120設置在鄰近於第一基板100的側面101處，且覆蓋做為信號線SL(例如：掃描線111及/或共用電極線112)，且在預定方向(例如：D3方向)上觀測時，導電圖案120可更覆蓋信號線SL(例如：掃描線111及/或共用電極線112)之外的部份第一基板100，但是兩相鄰的導電圖案120仍是相分隔開來。Here, the “covering a portion of the signal line SL adjacent to at least one side surface 101 of the first substrate 100” means that the conductive pattern 120 is disposed on the first substrate 100 and its position is adjacent to the first substrate 100. At least one side surface 101 and the conductive pattern 120 covers at least a portion of the signal line SL. Taking FIG. 1A and FIG. 1B as examples, the conductive pattern 120 is disposed at the side 101 adjacent to the first substrate 100, and is covered as the signal line SL (for example, the scan line 111 and / or the common electrode line 112), When viewed in a direction (eg, D3 direction), the conductive pattern 120 may further cover a portion of the first substrate 100 other than the signal line SL (eg, the scan line 111 and / or the common electrode line 112), but two adjacent conductive lines The patterns 120 are still separated from each other.
或者，也可如圖2A的變形例所示，導電圖案120設置在鄰近於第一基板100的側面101處，且覆蓋信號線SL(例如：掃描線111)，並在預定方向(例如：D3方向)上觀測時，導電圖案120僅覆蓋信號線SL(例如：掃描線111及/或共用電極線112)。於其它實施例中，為保護或其它設計需求，也可如圖2A的變形例所示，於第二基板200的內表面204上選擇性的設置導電圖案202(或稱為另一導電圖案)。導電圖案202可為單層或多層結構，且其材料包含透明導電材料，可選用前述導電圖案120之材料，而導電圖案202之材料可實質上相同或不同於導電圖案120之材料。圖2A所示的變形例中，導電圖案202可僅設置於未設置有側電極160的第二基板200的內表面204上，則導電圖案202與導電圖案120垂直投影於第一基板100內表面102上呈現交錯排列（staggered arrangement，或者稱為錯位排列(alternated arrangement)），但不限於此。於部份實施例中，導電圖案202也可設置於設置有側電極160的第二基板200的內表面204上。Alternatively, as shown in a modified example of FIG. 2A, the conductive pattern 120 may be disposed at the side surface 101 adjacent to the first substrate 100 and cover the signal line SL (for example, the scan line 111) and be in a predetermined direction (for example: D3 When viewed in the direction), the conductive pattern 120 only covers the signal line SL (for example, the scanning line 111 and / or the common electrode line 112). In other embodiments, for protection or other design requirements, a conductive pattern 202 (or another conductive pattern) may be selectively disposed on the inner surface 204 of the second substrate 200 as shown in a modified example of FIG. 2A. . The conductive pattern 202 may be a single-layer or multi-layer structure, and its material includes a transparent conductive material. The material of the aforementioned conductive pattern 120 may be selected, and the material of the conductive pattern 202 may be substantially the same or different from the material of the conductive pattern 120. In the modification shown in FIG. 2A, the conductive pattern 202 may be disposed only on the inner surface 204 of the second substrate 200 without the side electrode 160, and the conductive pattern 202 and the conductive pattern 120 are vertically projected on the inner surface of the first substrate 100. A staggered arrangement (also referred to as an alternate arrangement) is shown on 102, but is not limited thereto. In some embodiments, the conductive pattern 202 may also be disposed on the inner surface 204 of the second substrate 200 provided with the side electrode 160.
或者，也可如圖2B的變形例所示，導電圖案120設置在鄰近於第一基板100的側面101處，且覆蓋信號線SL(例如：掃描線111及/或共用電極線112)，並在預定方向(例如：D3方向)上觀測時，導電圖案120僅覆蓋信號線SL(例如：掃描線111及/或共用電極線112)的其中一部分。Alternatively, as shown in the modified example of FIG. 2B, the conductive pattern 120 may be disposed adjacent to the side surface 101 of the first substrate 100 and cover the signal line SL (for example, the scan line 111 and / or the common electrode line 112), and When viewed in a predetermined direction (for example, the D3 direction), the conductive pattern 120 covers only a part of the signal line SL (for example, the scan line 111 and / or the common electrode line 112).
第二基板200例如是色彩轉換基板，其上具有色轉換層（例如：彩色濾光層、量子點或量子桿膜、或其它合適的膜層，未標示)，但不以此為限。在一實施例中，第二基板200也可為透明基板或者可選擇性的設置其它膜層(例如：電極層、平坦層、或其它合適的膜層)，且色彩轉換層(未標示)也可設置於第一基板100上。The second substrate 200 is, for example, a color conversion substrate, and has a color conversion layer (eg, a color filter layer, a quantum dot or quantum rod film, or other suitable film layer, not labeled), but is not limited thereto. In an embodiment, the second substrate 200 may also be a transparent substrate or other film layers (such as electrode layers, flat layers, or other suitable film layers) may be selectively provided, and the color conversion layer (not labeled) is also It can be disposed on the first substrate 100.
介質層150夾設於第一基板100與第二基板200之間。在一實施例中，介質層150可為顯示介質或絕緣層。其中，顯示介質的材料如前所述，而絕緣層之材料可為有機材料、無機材料、或其它合適的材料、或前述之組合。此處應說明的是，介質層150與第一基板100上的信號線SL之間通常可設置有另一絕緣層(未繪示)，此處為進一步說明信號線SL與導電圖案120的相對關係，而省略了該絕緣層的繪示。絕緣層的設置與否可依據需求而決定。The dielectric layer 150 is interposed between the first substrate 100 and the second substrate 200. In one embodiment, the dielectric layer 150 may be a display medium or an insulating layer. The material of the display medium is as described above, and the material of the insulating layer may be an organic material, an inorganic material, or other suitable materials, or a combination thereof. It should be noted here that another dielectric layer (not shown) may be generally provided between the dielectric layer 150 and the signal line SL on the first substrate 100. Here, the relative relationship between the signal line SL and the conductive pattern 120 is further explained. Relationship, and the drawing of the insulating layer is omitted. The setting of the insulation layer can be determined according to requirements.
黏膠140設置於第一基板100與第二基板200之間，並覆蓋信號線SL的一部份與重疊區122，且黏膠140之部份表面與重疊區122的至少一部份形成多個容納區148。從另一方面觀之，黏膠140可位於第一基板100與第二基板200之間，且黏膠140至少部分圍繞介質層150，然而本發明不以此為限。舉例而言，黏膠140可以將介質層150密封於第一基板100、第二基板200與黏膠140之間，可避免介質層150於側面101及側面201之間而暴露於電子裝置1之外。再者，於圖1A中僅繪示部份黏膠140而其它部份的黏膠140雖然未繪出，但對於在本領域人士而言，為了讓電子裝置1的介質層150(例如：顯示介質層)不易損失且仍位於黏膠140所形成的區域內，電子裝置1仍可存在其它部份的黏膠140。The adhesive 140 is disposed between the first substrate 100 and the second substrate 200 and covers a part of the signal line SL and the overlapping area 122, and a part of the surface of the adhesive 140 and at least a part of the overlapping area 122 form a plurality of Accommodation area 148. From another aspect, the adhesive 140 may be located between the first substrate 100 and the second substrate 200, and the adhesive 140 at least partially surrounds the dielectric layer 150, but the present invention is not limited thereto. For example, the adhesive 140 can seal the dielectric layer 150 between the first substrate 100, the second substrate 200, and the adhesive 140, which can prevent the dielectric layer 150 from being exposed to the electronic device 1 between the side 101 and the side 201. outer. Furthermore, only a part of the adhesive 140 is shown in FIG. 1A and other parts of the adhesive 140 are not shown, but for those skilled in the art, in order to make the dielectric layer 150 of the electronic device 1 (for example: display The dielectric layer) is not easily lost and is still located in the area formed by the adhesive 140. The electronic device 1 may still have other portions of the adhesive 140.
在一實施例中，如圖1B、圖1C所示，上述的黏膠140之部份表面係為黏膠140之側面141(例如：遠離介質層150之側面)，且容納區148分別由黏膠140之部份側面141、第二基板200之部份內表面204與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。於其它實施例中，若第二基板200之部份內表面204上具有其它膜層(例如：前述之膜層，但不限於此)，則容納區148分別由黏膠140之部份側面141、第二基板200之部份內表面204上的其它膜層與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。In an embodiment, as shown in FIG. 1B and FIG. 1C, a part of the surface of the above-mentioned adhesive 140 is the side surface 141 of the adhesive 140 (for example, the side away from the dielectric layer 150), and the receiving areas 148 are respectively made of adhesive. A part of the side surface 141 of the glue 140, a part of the inner surface 204 of the second substrate 200, and at least a part of the overlapping area 122 (for example, at least a part of the surface of the conductive pattern 120) are formed. In other embodiments, if there is another film layer on a part of the inner surface 204 of the second substrate 200 (for example, the aforementioned film layer, but is not limited thereto), the receiving areas 148 are respectively formed by the side surfaces 141 of the adhesive 140 2. The other film layers on a part of the inner surface 204 of the second substrate 200 and at least a part of the overlapping area 122 (for example, at least a part of the surface of the conductive pattern 120) are formed.
此外，也可如圖3A的變形例所示，上述的黏膠140之部份表面係為黏膠140之部份下表面143，且容納區148分別由黏膠140之部份下表面143與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。In addition, as shown in a modified example of FIG. 3A, a part of the surface of the above-mentioned adhesive 140 is a portion of the lower surface 143 of the adhesive 140, and the receiving area 148 is formed by a portion of the lower surface 143 of the adhesive 140 and At least a portion of the overlap region 122 (for example, at least a portion of a surface of the conductive pattern 120) is formed.
此外，也可如圖3B、圖3C的變形例所示，將黏膠140分為第一部份142以及第二部分144。舉例而言，黏膠140的第一部份142設置於第二部分144的外周部。因此，黏膠140的第一部份142較第二部分144遠離介質層150(例如：顯示介質層)。黏膠140的第一部份142以及第二部分144呈分離方式設置，因此，在設置過程中會有空隙146的產生，但也可以使空隙146不存在的方式設置黏膠140的第一部份142以及第二部分144。In addition, as shown in the modified examples of FIGS. 3B and 3C, the adhesive 140 may be divided into a first portion 142 and a second portion 144. For example, the first portion 142 of the adhesive 140 is disposed on the outer peripheral portion of the second portion 144. Therefore, the first portion 142 of the adhesive 140 is farther away from the dielectric layer 150 (eg, the display medium layer) than the second portion 144. The first part 142 and the second part 144 of the adhesive 140 are disposed separately. Therefore, a gap 146 may be generated during the setting process, but the first part of the adhesive 140 may be disposed in a manner that the void 146 does not exist. 142 and second part 144.
在圖3B的變形例中，上述的黏膠140之部份表面係為第一部份142之側面141’，且容納區148分別由第一部份142之部份側面141’、第二基板200之部份內表面204與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。於其它實施例中，若第二基板200之部份內表面204上具有其它膜層(例如：前述之膜層，但不限於此)，則容納區148分別由黏膠140之部份側面141’、第二基板200之部份內表面204上的其它膜層與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。In the modified example of FIG. 3B, a part of the surface of the above-mentioned adhesive 140 is the side surface 141 ′ of the first portion 142, and the receiving area 148 is formed by the side surface 141 ′ of the first portion 142 and the second substrate, respectively. A part of the inner surface 204 of 200 and at least a part of the overlapping area 122 (for example, at least a part of the surface of the conductive pattern 120) are formed. In other embodiments, if there is another film layer on a part of the inner surface 204 of the second substrate 200 (for example, the aforementioned film layer, but is not limited thereto), the receiving areas 148 are respectively formed by the side surfaces 141 of the adhesive 140 ', Formed by other film layers on part of the inner surface 204 of the second substrate 200 and at least a part of the overlapping area 122 (eg, at least a part of the surface of the conductive pattern 120).
在圖3C的變形例中，上述的黏膠140之部份表面係為第一部份142之部份下表面143’，且容納區148分別由第一部份142之部份下表面143’與重疊區122的至少一部份(例如：導電圖案120的至少一部份表面)所形成。In the modified example of FIG. 3C, a part of the surface of the above-mentioned adhesive 140 is a part of the lower surface 143 ′ of the first part 142, and the receiving areas 148 are respectively a part of the lower surface 143 ′ of the first part 142. And at least a portion of the overlap region 122 (eg, at least a portion of the surface of the conductive pattern 120).
黏膠140的使用材料並無特別限制，例如可使用一般的框膠(例如：商品名：723K1，協立化學製)、封端膠(例如：商品名：784-180，積水化學製)、UV膠、或者水解膠(例如：商品名：FR156，永寬化學製)、或其它合適的材料。在黏膠140分為第一部份142以及第二部分144的實施例中，較佳地，第一部份142之材料物性及/或化性可不同於第二部分144之材料，例如：第一部份142可為蕭氏硬度(Shore Durometer)低於第二部分144的材料、第一部份142可為接著能力較第二部分144差的材料、第一部份142可為流動性較第二部分144高的材料、或者第一部份142可為可經由水解、雷射或其他蝕刻方式移除的材料。舉例來說，當第二部分144較佳地使用框膠時，而第一部份142較佳地可使用UV膠、封端膠或者水解膠，但不限於此。於其它實施例中，第一部份142與第二部分144做用實質上相同的材料，但二者的物性及/或化性不同。The material of the adhesive 140 is not particularly limited. For example, a general frame adhesive (for example, a trade name: 723K1, manufactured by Kyoritsu Chemical), a capping adhesive (for example, a trade name: 784-180, Sekisui Chemical), UV glue, or hydrolyzed glue (for example: trade name: FR156, made by Yongkuan Chemical), or other suitable materials. In the embodiment where the adhesive 140 is divided into the first part 142 and the second part 144, preferably, the material properties and / or chemical properties of the first part 142 may be different from those of the second part 144, for example: The first portion 142 may be a material having a Shore Durometer lower than that of the second portion 144, the first portion 142 may be a material having a weaker adhesion than the second portion 144, and the first portion 142 may be fluid The material higher than the second portion 144 or the first portion 142 may be a material that can be removed by hydrolysis, laser, or other etching methods. For example, when the second part 144 preferably uses a frame glue, and the first part 142 preferably uses a UV glue, a capping glue, or a hydrolyzing glue, but is not limited thereto. In other embodiments, the first portion 142 and the second portion 144 are made of substantially the same material, but their physical properties and / or chemical properties are different.
側電極160可設置於第一基板100之至少一側面101上。其中，側電極160之一部份可延伸至容納區148並覆蓋導電圖案120，且側電極160之另一部份與至少一電路元件300電性連接。舉例而言，側電極160可包括延伸部162以及側邊部164。側電極160的側邊部164設置於第一基板100之至少一側面101上，延伸部162延伸至容納區148並覆蓋對應的導電圖案120，且側邊部164與至少一電路元件300電性連接。The side electrode 160 may be disposed on at least one side surface 101 of the first substrate 100. A part of the side electrode 160 may extend to the receiving area 148 and cover the conductive pattern 120, and another part of the side electrode 160 is electrically connected to at least one circuit element 300. For example, the side electrode 160 may include an extension portion 162 and a side portion 164. The side edge portion 164 of the side electrode 160 is disposed on at least one side surface 101 of the first substrate 100. The extension portion 162 extends to the receiving area 148 and covers the corresponding conductive pattern 120. The side edge portion 164 is electrically connected to the at least one circuit element 300. connection.
在圖1A、圖1B中，側電極160可設置於第一基板100之一側面101上，而透過導電圖案120與信號線SL(例如：掃描線112或共用電極線111)連接，但本發明並不限制於此情形。於部份實施例中，側電極160也可設置於第一基板100之另一側面103上，而透過導電圖案120與信號線SL(例如：資料線110)連接，而信號線SL(例如：資料線110)與其相關之描述亦可參閱前述來加以變動。於其它實施例中，圖2A至圖3C中的側電極160也可設置於第一基板100之另一側面103上，而透過導電圖案120與信號線SL(例如：資料線110)連接，而信號線SL(例如：資料線110)與其相關之描述亦可參閱前述之說明來加以變動。側面101與另一側面103不為同一側面，可視為二側面位於電子裝置1之不同側面。In FIGS. 1A and 1B, the side electrode 160 may be disposed on a side surface 101 of the first substrate 100, and is connected to the signal line SL (for example, the scan line 112 or the common electrode line 111) through the conductive pattern 120, but the present invention It is not limited to this case. In some embodiments, the side electrode 160 may also be disposed on the other side 103 of the first substrate 100, and connected to the signal line SL (for example, the data line 110) through the conductive pattern 120, and the signal line SL (for example: The description of the data line 110) and the related information can also be changed with reference to the foregoing. In other embodiments, the side electrode 160 in FIGS. 2A to 3C may also be disposed on the other side 103 of the first substrate 100, and connected to the signal line SL (for example, the data line 110) through the conductive pattern 120, and The description of the signal line SL (for example, the data line 110) and the related description can also be changed by referring to the foregoing description. The side surface 101 and the other side surface 103 are not the same side surface, and the two side surfaces can be regarded as different side surfaces of the electronic device 1.
延伸部162以及側邊部164的設置方式並無特別限制。在一實施例中，如圖1A、圖1B所示，一個側電極160具有一個延伸部162以及一個側邊部164，且延伸部162的寬度可小於側邊部164。There are no particular restrictions on how the extension portion 162 and the side portion 164 are provided. In an embodiment, as shown in FIGS. 1A and 1B, one side electrode 160 has an extension portion 162 and a side portion 164, and the width of the extension portion 162 may be smaller than that of the side portion 164.
或者，也可如圖2A的變形例所示，一個側電極160具有一個延伸部162以及一個側邊部164，且延伸部162的寬度實質上等於側邊部164。Alternatively, as shown in the modification of FIG. 2A, one side electrode 160 may have one extension portion 162 and one side portion 164, and the width of the extension portion 162 may be substantially equal to the side portion 164.
或者，也可如圖2B的變形例所示，一個側電極160具有兩個以上的延伸部162以及一個側邊部164。Alternatively, as shown in a modified example of FIG. 2B, one side electrode 160 may have two or more extension portions 162 and one side portion 164.
另外，在圖1A至圖3C中，側電極160(例如：側邊部164)可選擇性的更設置於第二基板200之至少一側面201上，例如：側電極160可更延伸設置於第二基板200之至少一側面201上，但於其它實施例中，側電極160也可設置於第一基板100之一側面101上，但未延伸至第二基板200之至少一側面201上。In addition, in FIGS. 1A to 3C, the side electrode 160 (for example, the side portion 164) may be selectively disposed on at least one side surface 201 of the second substrate 200. For example, the side electrode 160 may be further extended to be disposed on the first substrate 201. At least one side surface 201 of the two substrates 200, but in other embodiments, the side electrode 160 may be disposed on one side surface 101 of the first substrate 100, but does not extend to at least one side surface 201 of the second substrate 200.
前述實施例中的側電極160的使用材料並無特別限制，例如可使用一般的聚合物摻有導電粒子(例如：導電膠)、導電聚合物、銀、銅、鋁、鎳、錫等基底銲料、或其它合適的材料、或前述材料之組合或堆疊。The material of the side electrode 160 in the foregoing embodiment is not particularly limited. For example, a general polymer mixed with conductive particles (for example, conductive adhesive), conductive polymer, silver, copper, aluminum, nickel, tin, and other base solders can be used. Or other suitable materials, or a combination or stack of the foregoing materials.
接著，對本發明的電子裝置1的製造方法進行說明。在此必須說明的是，下述實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。Next, a method for manufacturing the electronic device 1 according to the present invention will be described. It must be explained here that the component numbers and parts of the following embodiments are the same, in which the same or similar symbols are used to indicate the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.
首先，提供第一基板100。在第一基板100的內表面102上具有至少二信號線SL(例如資料線110、掃描線111以及/或共用電極線112、電源供應線(未繪示)、或其它合適的線路)、至少二子畫素114以及至少二導電圖案120。子畫素114包括開關元件T、信號線SL(例如資料線110、掃描線111、共用電極線112、電源供應線(未繪示)、或其它合適的線路)以及畫素電極113。信號線SL(例如：資料線110、掃描線111以及共用電極線112、電源供應線(未繪示)、或其它合適的線路)與對應的子畫素114電性連接，且可延伸至鄰近於第一基板100之至少一側面101。導電圖案120可設置於對應的信號線SL(例如資料線110、掃描線111、共用電極線112、電源供應線(未繪示)、或其它合適的線路)上，且分別覆蓋信號線SL鄰近於第一基板100之至少一側面101的一部份，以形成至少二個重疊區122。First, a first substrate 100 is provided. There are at least two signal lines SL (such as data lines 110, scan lines 111, and / or common electrode lines 112, power supply lines (not shown), or other suitable lines) on the inner surface 102 of the first substrate 100. Two sub-pixels 114 and at least two conductive patterns 120. The sub-pixel 114 includes a switching element T, a signal line SL (such as a data line 110, a scan line 111, a common electrode line 112, a power supply line (not shown), or other suitable lines), and a pixel electrode 113. The signal line SL (for example, the data line 110, the scanning line 111, the common electrode line 112, the power supply line (not shown), or other suitable lines) is electrically connected to the corresponding sub-pixel 114, and can be extended to the vicinity On at least one side surface 101 of the first substrate 100. The conductive pattern 120 may be disposed on the corresponding signal line SL (for example, the data line 110, the scan line 111, the common electrode line 112, the power supply line (not shown), or other suitable lines), and respectively cover the signal line SL adjacently. A portion of at least one side surface 101 of the first substrate 100 to form at least two overlapping regions 122.
接著，分別提供第二基板200與黏膠140，以黏合第一基板100與第二基板200。其中，黏膠140位於第一基板100與第二基板200之間，且覆蓋信號線SL的一部份與重疊區122。Next, a second substrate 200 and an adhesive 140 are provided to adhere the first substrate 100 and the second substrate 200, respectively. The adhesive 140 is located between the first substrate 100 and the second substrate 200 and covers a part of the signal line SL and the overlapping area 122.
在一實施例中，當提供黏膠140之前或之後，可提供介質層150，使黏膠140設置於介質層150的外周部或外表面。當介質層150為顯示介質(材料可參閱前述描述)，且其為非自發光材料時，提供介質層150可於黏膠140之後或之前，較佳地提供介質層150可於黏膠140之後；當介質層150為顯示介質(材料可參閱前述描述)，且其為自發光材料時，提供介質層150可於黏膠140之前；當介質層150(材料可參閱前述描述)為絕緣層時，提供介質層150可依設計需要於黏膠140之前或之後。In one embodiment, the dielectric layer 150 may be provided before or after the adhesive 140 is provided, so that the adhesive 140 is disposed on the outer periphery or the outer surface of the dielectric layer 150. When the dielectric layer 150 is a display medium (see the foregoing description for materials) and it is a non-self-luminous material, the dielectric layer 150 may be provided after or before the adhesive 140, and preferably the dielectric layer 150 may be provided after the adhesive 140. ; When the dielectric layer 150 is a display medium (for the material, please refer to the foregoing description), and it is a self-luminous material, the dielectric layer 150 may be provided before the adhesive 140; when the dielectric layer 150 (for the material, please refer to the foregoing description) is an insulating layer The dielectric layer 150 may be provided before or after the adhesive 140 according to design requirements.
在另一實施例中，當提供黏膠140以黏合第一基板100與第二基板200時，可分別形成黏膠140之第一部份142與第二部份144於第一基板100與第二基板200之間。第一部份142設置於第二部份144的外周部或外表面，且第一部份142與第二部份144分離設置。In another embodiment, when the adhesive 140 is provided to adhere the first substrate 100 and the second substrate 200, the first portion 142 and the second portion 144 of the adhesive 140 may be formed on the first substrate 100 and the first substrate 100, respectively. Between two substrates 200. The first portion 142 is disposed on the outer peripheral portion or the outer surface of the second portion 144, and the first portion 142 is disposed separately from the second portion 144.
接著，移除部分黏膠140，以使黏膠140之部份表面與重疊區122的至少一部份形成多個容納區148。於其它實施例中，與容納區148相關之元件設置與描述可採用圖1A至圖3C所述之任一種實施例。Then, a part of the adhesive 140 is removed, so that a part of the surface of the adhesive 140 and at least a part of the overlapping area 122 form a plurality of receiving areas 148. In other embodiments, the arrangement and description of the components related to the receiving area 148 may adopt any one of the embodiments described in FIGS. 1A to 3C.
移除部分黏膠140的方法並無特別限制，例如可列舉研磨法、蝕刻法、雷射移除法、水解法、或其它合適的方法。The method of removing a part of the adhesive 140 is not particularly limited, and examples thereof include a grinding method, an etching method, a laser removal method, a hydrolysis method, or other suitable methods.
此外，也可如同圖4A、圖4B所示，對藉由黏膠140的第二部分144而組裝好的第一基板100與第二基板200進行部份移除，例如：可先對第一基板100與第二基板200其中至少一個的側面移除(例如：切割、研磨、或其它合適的方式)部份基板(例如：圖4A所示的移除區180)，之後，可在第一基板100與第二基板200的側面塗佈黏膠140的第一部份142。舉例而言：可選擇性的施加壓力F(例如：在第二基板200的外表面施加壓力F及/或在第一基板100的外表面施加壓力F)，並在施加壓力F的同時在第一基板100與第二基板200的側面(例如:101、201)塗佈黏膠140的第一部份142。如此，在移除壓力F之後，黏膠140的第一部份142會因壓力變化而被吸入第一基板100與第二基板200之間。在使用上述方法塗佈第一部份142時，第一部份142的材料例如為光固化的樹脂(例如：UV膠)、熱固化的樹脂、或其它合適的材料，然而本發明不限於此。其中，圖4A、圖4B僅繪示部份元件，而未繪示的元件可參閱前述實施例所述。In addition, as shown in FIGS. 4A and 4B, the first substrate 100 and the second substrate 200 assembled by the second portion 144 of the adhesive 140 may be partially removed. For example, the first substrate 100 may be removed first. At least one of the substrate 100 and the second substrate 200 is removed (eg, cut, polished, or other suitable methods) from a side of the substrate (eg, the removal area 180 shown in FIG. 4A). A first portion 142 of the adhesive 140 is coated on the sides of the substrate 100 and the second substrate 200. For example, the pressure F may be selectively applied (for example, the pressure F is applied to the outer surface of the second substrate 200 and / or the pressure F is applied to the outer surface of the first substrate 100), and the pressure F is applied at the same time as A first portion 142 of the adhesive 140 is coated on the sides (for example, 101 and 201) of a substrate 100 and a second substrate 200. In this way, after the pressure F is removed, the first portion 142 of the adhesive 140 is sucked between the first substrate 100 and the second substrate 200 due to the pressure change. When the first portion 142 is coated using the above method, the material of the first portion 142 is, for example, a photo-curable resin (such as UV glue), a heat-curable resin, or other suitable materials, but the present invention is not limited thereto. . Wherein, FIG. 4A and FIG. 4B only show a part of the components, and the components not shown can refer to the foregoing embodiments.
在一實施例中，使用研磨法移除部分黏膠140時，有時也會移除部分第一基板100之側面101以及部份第二基板200之側面201的至少一者。只要在移除第一基板100之側面101與第二基板200之側面201的移除速率小於移除黏膠140的移除速率的情況下，可較易使得容納區148(例如：圖4B所示)產生。In an embodiment, when a part of the adhesive 140 is removed by a grinding method, at least one of the side surface 101 of the first substrate 100 and the side surface 201 of the second substrate 200 are sometimes removed. As long as the removal rate of the side surface 101 of the first substrate 100 and the side 201 of the second substrate 200 is less than the removal rate of the adhesive 140, the receiving area 148 (for example, as shown in FIG. 4B) can be easily made. Show) produced.
在研磨過程中，黏膠140會因研磨而發生剝落(peeling)現象，進而導致黏膠140的部分下表面(例如：圖3A或圖3C其中一者)與第一基板100的重疊區122(例如：導電圖案120之表面)分離，而使第一基板100上的重疊區122露出。因此，此時的容納區148由黏膠140之部份下表面(例如：圖3A或圖3C其中一者)與重疊區122的至少一部份所形成。During the grinding process, the adhesive 140 may peel due to grinding, which may cause a portion of the lower surface of the adhesive 140 (eg, one of FIG. 3A or FIG. 3C) and the overlapping area 122 of the first substrate 100 ( For example, the surface of the conductive pattern 120 is separated, so that the overlapping region 122 on the first substrate 100 is exposed. Therefore, the receiving area 148 at this time is formed by a part of the lower surface of the adhesive 140 (for example, one of FIG. 3A or FIG. 3C) and at least a part of the overlapping area 122.
或者，在研磨過程中，黏膠140會因與第一基板100與第二基板200的移除速率的差異，而使黏膠140的外側或側面(例如：圖1C或圖3B其中一者)的移除程度大於第一基板100與第二基板200的移除程度，進而使得黏膠140的側面向內凹陷，而使第一基板100上的重疊區122以及第二基板200之部份內表面204露出。因此，此時的容納區148由黏膠140之部份側面(例如：圖1C或圖3B其中一者)、第二基板200之部份內表面204與重疊區122的至少一部份(例如：導電圖案120之表面)所形成。Alternatively, during the grinding process, the adhesive 140 may cause the outside or side of the adhesive 140 due to the difference in the removal rate from the first substrate 100 and the second substrate 200 (for example, one of FIG. 1C or FIG. 3B). The degree of removal is greater than the degree of removal of the first substrate 100 and the second substrate 200, so that the sides of the adhesive 140 are recessed inward, so that the overlapping area 122 on the first substrate 100 and a portion of the second substrate 200 are within Surface 204 is exposed. Therefore, at this time, the receiving area 148 is formed by a part of the side surface of the adhesive 140 (for example, one of FIG. 1C or FIG. 3B), at least a part of the inner surface 204 of the second substrate 200, and at least a part of the overlapping area 122 (for example, : The surface of the conductive pattern 120).
在一實施例中，若將黏膠140設置為第一部份142與第二部份144時，「移除部分黏膠140」指的是移除黏膠140的第一部份142之至少一部份。舉例而言，於進行上述研磨時，是對第一部份142(例如外側部份，其鄰近第一基板之側面101)進行研磨，此時，容納區148的產生方式與僅設置黏膠140的情形類似，可參閱前述實施例之描述，在此不另贅述。In an embodiment, if the adhesive 140 is set to the first part 142 and the second part 144, "removing part of the adhesive 140" refers to removing at least at least the first part 142 of the adhesive 140. a part. For example, during the above-mentioned grinding, the first portion 142 (for example, the outer portion, which is adjacent to the side surface 101 of the first substrate) is polished. At this time, the generation manner of the receiving area 148 and only the adhesive 140 are provided. The situation is similar. Please refer to the description of the foregoing embodiment, which will not be repeated here.
在一實施例中，若將黏膠140設置為第一部份142與第二部份144時，可使第一部份142的蕭氏硬度(Shore Durometer)低於第二部分144，或者使第一部份142的接著能力較第二部分144差，以利於研磨的進行，同時又不損及位於基板內部的第二部分144以及介質層150(例如:顯示介質層)。若介質層150為絕緣層時，可依需求於部份移除第一部份142，將介質層150移除或保留，在此不另贅述。在使用上述方法移除部份第一部份142時，第一部份142的材料例如為UV膠、封端膠、或者其它合適的材料(例如：色轉換層、黑矩陣、或其它合適的材料)。In an embodiment, if the adhesive 140 is set to the first portion 142 and the second portion 144, the Shore Durometer of the first portion 142 can be lower than that of the second portion 144, or The bonding ability of the first portion 142 is inferior to that of the second portion 144 to facilitate the grinding process without damaging the second portion 144 and the dielectric layer 150 (for example, a display dielectric layer) located inside the substrate. If the dielectric layer 150 is an insulating layer, the first portion 142 may be partially removed according to requirements, and the dielectric layer 150 may be removed or retained, and details are not described herein again. When using the above method to remove a portion of the first portion 142, the material of the first portion 142 is, for example, UV glue, capping glue, or other suitable materials (such as a color conversion layer, a black matrix, or other suitable materials). material).
在一實施例中，使用蝕刻法移除部分黏膠140時，可利用雷射對特定區域的黏膠140進行移除。當使用雷射移除法移除黏膠140時，可依據黏膠140、第一基板100與第二基板200的材料不同而適宜選擇所使用的雷射波長。在一實施例中，若使用玻璃基板做為第一基板100以及第二基板200，使用框膠做為黏膠140時，可使用波長例如：約為1 μm的雷射，則此雷射對黏膠140(例如：樹脂類)有最佳能量吸收率及最低玻璃和導電層(例如：銅或其合金，或其它合適的材料)之吸收率。In one embodiment, when a part of the adhesive 140 is removed by an etching method, a laser can be used to remove the adhesive 140 in a specific area. When the laser 140 is used to remove the adhesive 140, the laser wavelength used may be appropriately selected according to different materials of the adhesive 140, the first substrate 100, and the second substrate 200. In an embodiment, if a glass substrate is used as the first substrate 100 and the second substrate 200 and a frame adhesive is used as the adhesive 140, a laser having a wavelength of, for example, about 1 μm can be used. Adhesive 140 (for example: resins) has the best energy absorption rate and the lowest absorption rate of glass and conductive layer (for example: copper or its alloy, or other suitable materials).
或者，在另一實施例中，也可利用水解法移除位於第一基板100與第二基板200的側面的黏膠140。當使用水解法移除黏膠140時，較佳將黏膠140的設置分為第一部份142與第二部份144，此時第一部份142的材料例如為水解膠，第二部份144的材料例如為非水解膠(例如：框膠)等不會透過水解法而被移除的材料。Alternatively, in another embodiment, the adhesive 140 on the sides of the first substrate 100 and the second substrate 200 may be removed by a hydrolysis method. When the adhesive 140 is removed by a hydrolysis method, the setting of the adhesive 140 is preferably divided into a first part 142 and a second part 144. At this time, the material of the first part 142 is, for example, a hydrolyzed adhesive, and the second part The material of part 144 is, for example, a material that cannot be removed by a hydrolysis method, such as a non-hydrolytic glue (for example, a frame glue).
最後，前述實施例之電子裝置1製造方法中，於第一基板100之至少一側面101上形成至少二側電極160，側電極160之一部份延伸至容納區148並覆蓋導電圖案120，且側電極160之另一部份與至少一電路元件300電性連接。舉例而言，側電極160的延伸部162設置於容納區148中，而側邊部164設置於第一基板100之至少一側面101上，並與電路元件300電性連接。於部份實施例中，側電極160(例如：側邊部164)可選擇性的更設置於第二基板200之至少一側面201上，但側電極160也可僅設置於第一基板100之一側面101上。側電極160之形成可包含噴墨印刷方式、網版印刷方式、轉印方式、塗佈與部份移除方式、或其它合適的方式。再者，前述實施例之電子裝置1製造方法中，對於信號線SL、容納區148、電路元件300或其它相關元件之描述，可參閱前述實施例之圖1A至圖3C所述之內容。Finally, in the manufacturing method of the electronic device 1 of the foregoing embodiment, at least two side electrodes 160 are formed on at least one side surface 101 of the first substrate 100, and a part of the side electrodes 160 extends to the receiving area 148 and covers the conductive pattern 120, and Another part of the side electrode 160 is electrically connected to at least one circuit element 300. For example, the extension portion 162 of the side electrode 160 is disposed in the receiving area 148, and the side edge portion 164 is disposed on at least one side surface 101 of the first substrate 100 and is electrically connected to the circuit element 300. In some embodiments, the side electrode 160 (eg, the side edge portion 164) may be selectively disposed on at least one side surface 201 of the second substrate 200, but the side electrode 160 may be disposed only on the first substrate 100. On one side 101. The formation of the side electrode 160 may include an inkjet printing method, a screen printing method, a transfer method, a coating and partial removal method, or other suitable methods. Furthermore, in the method for manufacturing the electronic device 1 of the foregoing embodiment, for the description of the signal line SL, the receiving area 148, the circuit element 300, or other related components, reference may be made to the content described in FIG. 1A to FIG. 3C of the foregoing embodiment.
此外，前述實施例之電子裝置1可為已製造完成。然而，若需要對製造完成的電子裝置1進行再調尺寸製程時，則也可接著對電子裝置1進行前述實施例之電子裝置1製造方法，並可獲得前述實施例所示之結構。再者，於圖4A未進行再調整尺寸時，電子裝置1之圖示可包含實線（例如：左部份）與虛線部份（例如：右部份），當電子裝置1進行再調整尺寸時，電子裝置1之圖示就只包含實線部份（例如：左部份），而虛線部份（例如：右部份）的圖示就被當作電子裝置1於切割後被移除的部份。於其它實施例中，可依需要保留的位置來確定電子裝置1進行再調整尺寸時可移除的部份(虛線部份)，例如：左部份、下部份、上部份、一部份之中間部份、或其它合適的部份、或前述至少二者之組合。於部份實施例中，若電子裝置1於再調尺寸時，係為部份移除（例如：電子裝置1的一側、二側、或三側），則電子裝置1會存在原先的密封膠(未標示)於預定框膠區(未標示)，而本實施例所述的黏膠140就稱為新的密封膠或者是再調尺寸密封膠於另一預定框膠區(未標示)，且預定框膠區(未標示)與另一預定框膠區(未標示)可為不同側。因此，本實施例填入的黏膠140可較為避免顯示介質層150（例如：液晶）於再調尺寸過程中減少（例如：流失）而影響電子裝置1的顯示品質。In addition, the electronic device 1 of the foregoing embodiment may be manufactured. However, if it is necessary to perform the resizing process on the electronic device 1 after manufacturing, the electronic device 1 manufacturing method of the foregoing embodiment may be performed on the electronic device 1 and the structure shown in the foregoing embodiment may be obtained. Moreover, when the resizing is not performed in FIG. 4A, the icon of the electronic device 1 may include a solid line (for example, the left part) and a dotted line (for example, the right part). When the electronic device 1 is resized, At this time, the icon of the electronic device 1 only includes the solid line part (for example: the left part), and the icon of the dotted line part (for example: the right part) is regarded as the electronic device 1 and is removed after cutting. The part. In other embodiments, the positions (dotted lines) that can be removed when the electronic device 1 resizes can be determined according to the positions that need to be retained, such as: left part, lower part, upper part, one part. The middle portion, or other suitable portion, or a combination of at least two of the foregoing. In some embodiments, if the electronic device 1 is partially removed during resizing (for example, one side, two sides, or three sides of the electronic device 1), the original sealing of the electronic device 1 will exist. The glue (not marked) is in the predetermined frame glue area (not marked), and the adhesive 140 described in this embodiment is called a new sealant or the resizing sealant is placed in another predetermined frame glue area (not marked). , And the predetermined frame rubber area (not labeled) and another predetermined frame rubber area (not labeled) may be on different sides. Therefore, the adhesive 140 filled in this embodiment can avoid the display medium layer 150 (eg, liquid crystal) from being reduced (eg, lost) during the resizing process, thereby affecting the display quality of the electronic device 1.
綜上所述，本發明的電子裝置能夠解決側邊接合製程的導通面積過小以及走線損傷的問題，而能進一步縮小面板的邊框面積，同時也不影響其導通性。In summary, the electronic device of the present invention can solve the problems of too small conduction area of the side bonding process and damage to the wiring, and can further reduce the area of the frame of the panel without affecting its continuity.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
1‧‧‧電子裝置1‧‧‧ electronic device
100‧‧‧第一基板100‧‧‧first substrate
101、103、141、141’、201‧‧‧側面101, 103, 141, 141 ’, 201‧‧‧ side
102、204‧‧‧內表面102, 204‧‧‧ inner surface
110‧‧‧資料線110‧‧‧data line
111‧‧‧掃描線111‧‧‧scan line
112‧‧‧共用電極線112‧‧‧Common electrode wire
113‧‧‧畫素電極113‧‧‧pixel electrode
114‧‧‧子畫素114‧‧‧ sub pixels
120、202‧‧‧導電圖案120, 202‧‧‧ conductive pattern
122‧‧‧重疊區122‧‧‧ Overlap
140‧‧‧黏膠140‧‧‧Viscose
142‧‧‧第一部份142‧‧‧Part I
143、143’‧‧‧下表面143、143’‧‧‧ lower surface
144‧‧‧第二部分144‧‧‧Part Two
146‧‧‧空隙146‧‧‧Gap
148‧‧‧容納區148‧‧‧accommodation area
150‧‧‧介質層150‧‧‧ dielectric layer
160‧‧‧側電極160‧‧‧ side electrode
162‧‧‧延伸部162‧‧‧ extension
164‧‧‧側邊部164‧‧‧side
180‧‧‧移除部180‧‧‧Removal
200‧‧‧第二基板200‧‧‧ second substrate
300‧‧‧電路元件300‧‧‧Circuit Components
SL‧‧‧訊號線SL‧‧‧Signal line
T‧‧‧開關元件T‧‧‧switching element
D1、D2、D3‧‧‧方向D1, D2, D3 ‧‧‧ directions
圖1A是本發明的實施例的電子裝置的局部立體透視示意圖。 圖1B是圖1A的電子裝置的預定方向(例如：D3方向)側視示意圖。 圖1C是圖1A的電子裝置的沿剖面線A-A’的剖面示意圖。 圖2A是本發明的變形例的電子裝置的預定方向(例如：D3方向)側視示意圖。 圖2B是本發明的變形例的電子裝置的預定方向(例如：D3方向)側視示意圖。 圖3A是本發明的變形例的電子裝置的沿圖1A的剖面線A-A’的剖面示意圖。 圖3B是本發明的變形例的電子裝置的沿圖1A的剖面線A-A’的剖面示意圖。 圖3C是本發明的變形例的電子裝置的沿圖1A的剖面線A-A’的剖面示意圖。 圖4A是本發明的電子裝置的製造方法的示意圖。 圖4B是本發明的電子裝置的製造方法的示意圖。FIG. 1A is a schematic partial perspective perspective view of an electronic device according to an embodiment of the present invention. FIG. 1B is a schematic side view of the electronic device of FIG. 1A in a predetermined direction (for example, the D3 direction). FIG. 1C is a schematic cross-sectional view of the electronic device of FIG. 1A along a section line A-A '. 2A is a schematic side view of a predetermined direction (for example, a D3 direction) of an electronic device according to a modification of the present invention. 2B is a schematic side view of a predetermined direction (for example, a D3 direction) of an electronic device according to a modification of the present invention. Fig. 3A is a schematic cross-sectional view of an electronic device according to a modification of the present invention, taken along the line A-A 'of Fig. 1A. 3B is a schematic cross-sectional view of an electronic device according to a modification of the present invention, taken along the line A-A 'of FIG. 1A. Fig. 3C is a schematic cross-sectional view of the electronic device according to a modification of the present invention, taken along the line A-A 'of Fig. 1A. FIG. 4A is a schematic diagram of a method for manufacturing an electronic device according to the present invention. FIG. 4B is a schematic diagram of a method for manufacturing an electronic device according to the present invention.
Claims (18)
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| CN110568681B (en) * | 2019-08-06 | 2021-03-16 | 深圳市华星光电半导体显示技术有限公司 | Display panel and liquid crystal display |
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| CN113257127B (en) * | 2020-08-14 | 2023-03-14 | 友达光电股份有限公司 | Display device |
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| CN108490700A (en) | 2018-09-04 |
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