TW202045359A - Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate - Google Patents

Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate Download PDF

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TW202045359A
TW202045359A TW109101479A TW109101479A TW202045359A TW 202045359 A TW202045359 A TW 202045359A TW 109101479 A TW109101479 A TW 109101479A TW 109101479 A TW109101479 A TW 109101479A TW 202045359 A TW202045359 A TW 202045359A
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adhesive
state
adhesion area
adhesive composition
low
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Chinese (zh)
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仲野武史
片岡賢一
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日商日東電工股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Abstract

An intermediate laminate 1 comprises a pressure-sensitive adhesive sheet 4 provided with a base material 2 and a pressure-sensitive adhesive layer 3 disposed on one surface of the base material 2, and an adherend 5 disposed on one surface of the pressure-sensitive adhesive sheet 4. The pressure-sensitive adhesive layer 3 is composed of a pressure-sensitive adhesive composition that can irreversibly change its state between a state with a high adhesive and a state with a low adhesive force. The pressure-sensitive adhesive layer 3 comprises a high-adhesion region 10 made of a pressure-sensitive adhesive composition in a state with a high adhesive force and a low-adhesion region 11 made of a pressure-sensitive adhesive composition in a state with a low adhesive force.

Description

中間積層體、中間積層體之製造方法及製品積層體之製造方法Intermediate laminate, method for manufacturing intermediate laminate, and method for manufacturing product laminate

本發明係關於一種中間積層體、中間積層體之製造方法及製品積層體之製造方法，詳細而言係關於一種中間積層體、製造該中間積層體之方法、及使用該中間積層體所獲得之製品積層體之製造方法。The present invention relates to an intermediate layered body, a method of manufacturing an intermediate layered body, and a method of manufacturing a product layered body, and more specifically, it relates to an intermediate layered body, a method of manufacturing the intermediate layered body, and a method obtained by using the intermediate layered body Manufacturing method of product laminate.

已知，於進行電子器件等各種器件之組裝、加工、輸送等步驟之前，藉由對器件之表面暫時黏附黏著性膜，而謀求表面保護或賦予耐衝擊性。It is known that before the steps of assembling, processing, and transporting various devices such as electronic devices, an adhesive film is temporarily adhered to the surface of the device to seek surface protection or impart impact resistance.

作為此種黏著性膜，已知有一種包含塑膠膜與黏著層之積層體之應力分散膜(例如參照專利文獻1)。As such an adhesive film, a stress dispersion film including a laminate of a plastic film and an adhesive layer is known (for example, refer to Patent Document 1).

又，作為此種黏著性膜，已知有一種於加熱前或紫外線之照射前黏著力較弱，藉由加熱或照射紫外線而發揮黏著性之硬化性接著片材(例如參照專利文獻2)。Moreover, as such an adhesive film, there is known a curable adhesive sheet that has weak adhesive force before heating or ultraviolet irradiation, and exhibits adhesiveness by heating or ultraviolet irradiation (for example, refer to Patent Document 2).

又，作為此種黏著性膜，已知有於照射紫外線後，可無糊劑殘留地進行剝離之半導體基板加工用黏著帶(例如參照專利文獻3)。In addition, as such an adhesive film, there is known an adhesive tape for semiconductor substrate processing that can be peeled off without a paste remaining after irradiation with ultraviolet rays (for example, refer to Patent Document 3).

專利文獻3之半導體基板加工用黏著帶貼合於器件，於結束組裝或加工等步驟後藉由進行紫外線照射，可使黏著力降低，而可將其自器件剝離。 [先前技術文獻] [專利文獻]The adhesive tape for semiconductor substrate processing of Patent Document 3 is attached to the device, and after the steps of assembling or processing are completed, by irradiating with ultraviolet rays, the adhesive force can be reduced and the device can be peeled off. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開2017-132977號公報 [專利文獻2]日本專利特開2011-127054號公報 [專利文獻3]日本專利特開2005-050953號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-132977 [Patent Document 2] Japanese Patent Laid-Open No. 2011-127054 [Patent Document 3] Japanese Patent Laid-Open No. 2005-050953

[發明所欲解決之問題][The problem to be solved by the invention]

另一面，就補強器件之觀點而言，期望不將暫時黏附之黏著性膜之一部分剝離而欲使其以貼合於器件之狀態殘存。On the other hand, from the viewpoint of reinforcing the device, it is desirable not to peel off a part of the temporarily adhered adhesive film, but to leave it in a state of being attached to the device.

但，專利文獻1之應力分散膜係以為了補強被接著體而貼合之情況為前提，因此有黏著力較強而無法容易地僅將該應力分散膜之一部分去除之缺陷。However, the stress dispersion film of Patent Document 1 is based on the premise that it is bonded to reinforce the adherend. Therefore, it has a defect that only a part of the stress dispersion film cannot be easily removed due to its strong adhesive force.

又，關於專利文獻2之硬化性接著片材，若於加熱前或紫外線之照射前將硬化性接著片材之一部分切斷而去除，則有因黏著力較弱而於切斷部分之周邊產生***而發生剝離之缺陷。In addition, regarding the curable adhesive sheet of Patent Document 2, if a part of the curable adhesive sheet is cut and removed before heating or UV irradiation, the adhesive force is weak and there is generated around the cut portion. Defects caused by swelling and peeling.

又，專利文獻3之加熱剝離型黏著片材係以於上述步驟結束後被去除之情況為前提之工藝材料，並且以不會對器件產生糊劑殘留之方式調整了黏著力。In addition, the heat-peelable adhesive sheet of Patent Document 3 is a process material based on the premise that it is removed after the above-mentioned steps, and the adhesive force is adjusted so that no paste remains on the device.

因此，專利文獻3之加熱剝離型黏著片材就器件之補強之觀點而言，有黏著力不充分之缺陷。Therefore, the heat-peelable adhesive sheet of Patent Document 3 has the disadvantage of insufficient adhesive force from the viewpoint of device reinforcement.

本發明之目的在於提供一種為了補強被接著體而一併具有以貼合於被接著體之狀態殘存之區域及自被接著體去除之區域之中間積層體、製造該中間積層體之方法、及使用該中間積層體所獲得之製品積層體之製造方法。 [解決問題之技術手段]The object of the present invention is to provide an intermediate laminate having a region remaining in a state of being attached to the adhered body and an area removed from the adhered body in order to reinforce the adherend, a method of manufacturing the intermediate laminate, and A method of manufacturing a product laminate obtained by using this intermediate laminate. [Technical means to solve the problem]

本發明[1]係一種中間積層體，其包含：黏著片材，其具備基材及配置於上述基材之一面之黏著層；及被接著體，其配置於上述黏著片材之一面；且上述黏著層包含能夠不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物，上述黏著層具備包含黏著力較高之狀態之黏著性組合物之高黏著區域、與包含黏著力較低之狀態之黏著性組合物之低黏著區域。The present invention [1] is an intermediate laminate comprising: an adhesive sheet having a substrate and an adhesive layer arranged on one side of the substrate; and an adherend, which is arranged on one side of the adhesive sheet; and The adhesive layer includes an adhesive composition that can irreversibly change into a state with a higher adhesive force and a state with a lower adhesive force, and the adhesive layer has a high-adhesive area including the adhesive composition with a higher adhesive force, And the low-adhesion area of the adhesive composition containing the state of low adhesive force.

本發明[2]包含如上述[1]所記載之中間積層體，其中上述黏著層包含能夠自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態之第1黏著性組合物，且上述高黏著區域包含狀態變化前之上述第1黏著性組合物，上述低黏著區域包含狀態變化後之上述第1黏著性組合物。The present invention [2] includes the intermediate laminate as described in [1] above, wherein the adhesive layer includes a first adhesive composition capable of irreversibly changing from a state with a high adhesive force to a state with a low adhesive force, In addition, the high-adhesion area includes the first adhesive composition before the state change, and the low-adhesion area includes the first adhesive composition after the state change.

本發明[3]包含如上述[1]所記載之中間積層體，其中上述黏著層包含能夠自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態之第2黏著性組合物，上述高黏著區域包含狀態變化後之上述第2黏著性組合物，上述低黏著區域包含狀態變化前之上述第2黏著性組合物。The present invention [3] includes the intermediate laminate as described in [1] above, wherein the adhesive layer includes a second adhesive composition capable of irreversibly changing from a state with low adhesive force to a state with high adhesive force, The high adhesion area includes the second adhesive composition after the state change, and the low adhesion area includes the second adhesive composition before the state change.

本發明[4]包含如上述[1]至[3]中任一項所記載之中間積層體，其中將上述高黏著區域以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/分鐘藉由180度剝離試驗所測得之黏著力為5 N/25 mm以上。The present invention [4] includes the intermediate laminate as described in any one of [1] to [3] above, wherein the high-adhesion region is bonded to a polyimide film at 25°C and a peeling speed of 300 mm/ The adhesive force measured by the 180-degree peel test in minutes is more than 5 N/25 mm.

本發明[5]包含如上述[1]至[4]中任一項所記載之中間積層體，其中將上述低黏著區域以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/分鐘藉由180度剝離試驗所測得之黏著力為4 N/25 mm以下。The present invention [5] includes the intermediate laminate as described in any one of [1] to [4], wherein the low-adhesion region is bonded to a polyimide film at 25°C and a peeling speed of 300 mm/ The adhesive force measured by a 180-degree peel test in minutes is 4 N/25 mm or less.

本發明[6]係一種中間積層體之製造方法，其包括如下步驟：準備黏著片材，該黏著片材具備基材、及配置於上述基材之一面且包含能夠藉由光照射不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物之黏著層；將被接著體配置於上述黏著片材之一面；及藉由對上述黏著層之一部分進行光照射，於上述黏著層形成經光照射之照射部分與未經光照射之非照射部分，而使上述照射部分及上述非照射部分中之任一者成為包含黏著力較高之狀態之黏著性組合物之高黏著區域，另一者成為包含黏著力較低之狀態之黏著性組合物之低黏著區域。The present invention [6] is a method for manufacturing an intermediate laminate, which includes the steps of preparing an adhesive sheet, which has a substrate and is arranged on one side of the substrate and includes a state that can be irreversibly irradiated by light The adhesive layer of the adhesive composition that changes into a state with higher adhesive force and a state with lower adhesive force; arranging the adherend on one side of the adhesive sheet; and by irradiating a part of the adhesive layer with light, A light-irradiated portion and a non-irradiated portion that are not irradiated with light are formed on the adhesive layer, so that any one of the irradiated portion and the non-irradiated portion becomes an adhesive composition that includes a state of high adhesive force In the high adhesion area, the other becomes the low adhesion area including the adhesive composition in a state of low adhesion.

本發明[7]包含如上述[6]所記載之中間積層體之製造方法，其中上述黏著層包含能夠藉由光照射自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態之第1黏著性組合物，且上述照射部分成為上述低黏著區域，上述非照射部分成為上述高黏著區域。The present invention [7] includes the method for manufacturing an intermediate laminate as described in [6] above, wherein the adhesive layer includes a state capable of irreversibly changing from a state with a high adhesive force to a state with a low adhesive force by light irradiation In the first adhesive composition, the irradiated portion becomes the low-adhesion area, and the non-irradiated portion becomes the high-adhesion area.

本發明[8]包含如上述[6]所記載之中間積層體之製造方法，其中上述黏著層包含能夠藉由光照射自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態之第2黏著性組合物，且上述照射部分成為上述高黏著區域，上述非照射部分成為上述低黏著區域。The present invention [8] includes the method for manufacturing an intermediate laminate as described in [6] above, wherein the adhesive layer includes a state capable of irreversibly changing from a state with a low adhesive force to a state with a high adhesive force by light irradiation In the second adhesive composition, the irradiated portion becomes the high-adhesion area, and the non-irradiated portion becomes the low-adhesion area.

本發明[9]包含一種製品積層體之製造方法，其包括如下步驟：準備中間積層體，該中間積層體係藉由如上述[6]至[8]中任一項所記載之中間積層體之製造方法而製造；及去除上述黏著層中之上述低黏著區域。 [發明之效果]The present invention [9] includes a method for manufacturing a product laminate, which includes the steps of preparing an intermediate laminate, the intermediate laminate system being formed by the intermediate laminate described in any one of [6] to [8] above Manufacturing method; and removing the low adhesion area in the adhesion layer. [Effects of Invention]

本發明之中間積層體之黏著層包含能夠不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物。The adhesive layer of the intermediate laminate of the present invention contains an adhesive composition that can irreversibly change into a state with high adhesive force and a state with low adhesive force.

因此，藉由狀態變化，可形成包含黏著力較高之狀態之黏著性組合物之高黏著區域、及包含黏著力較低之狀態之黏著性組合物之低黏著區域。Therefore, by changing the state, a high-adhesion area including an adhesive composition in a state with higher adhesive force and a low-adhesion area including an adhesive composition in a state with lower adhesive force can be formed.

即，該中間積層體可藉由自同一組成之黏著性組合物形成高黏著區域及低黏著區域而一併具有高黏著區域與低黏著區域，而非藉由自黏著力較高之黏著性組合物形成高黏著區域，自黏著力較低之黏著性組合物形成低黏著區域，而一併具有該等區域。That is, the intermediate laminate can form a high-adhesion area and a low-adhesion area from an adhesive composition of the same composition, and have both a high-adhesion area and a low-adhesion area, instead of a combination of higher self-adhesive strength. The material forms a high adhesion area, and the adhesive composition with a lower self-adhesive force forms a low adhesion area, and these areas are also included.

並且，中間積層體之黏著層由於具備高黏著區域及低黏著區域，因此高黏著區域可以貼合於被接著體之狀態殘存，並與所對應之基材一起用於被接著體之補強，另一方面，低黏著區域可與所對應之基材一起自被接著體去除。In addition, since the adhesive layer of the intermediate laminate has a high-adhesion area and a low-adhesion area, the high-adhesion area can remain in the state of being attached to the adherend, and used together with the corresponding base material to reinforce the adherend. On the one hand, the low adhesion area can be removed from the adherend together with the corresponding substrate.

其結果為，可獲得被接著體經補強之製品積層體。As a result, a product laminate in which the adherend is reinforced can be obtained.

本發明之中間積層體之製造方法包括如下步驟：藉由對包含能夠藉由光照射不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物的黏著層之一部分進行光照射，於黏著層形成經光照射之照射部分與未經光照射之非照射部分，而使照射部分及非照射部分中之任一者成為包含黏著力較高之狀態之黏著性組合物之高黏著區域，另一者成為包含黏著力較低之狀態之黏著性組合物之低黏著區域。The manufacturing method of the intermediate laminate of the present invention includes the following steps: by comparing a part of an adhesive layer containing an adhesive composition that can be irreversibly changed into a state with high adhesive force and a state with low adhesive force by light irradiation Light irradiation is carried out to form an irradiated part irradiated with light and a non-irradiated part not irradiated with light on the adhesive layer, so that any one of the irradiated part and the non-irradiated part becomes an adhesive composition containing a state of high adhesive force The high adhesion area, the other becomes the low adhesion area containing the adhesive composition in a state of low adhesion.

因此，可製造具備具有高黏著區域及低黏著區域之黏著層之中間積層體。Therefore, it is possible to manufacture an intermediate laminate having an adhesion layer with a high adhesion area and a low adhesion area.

又，於該中間積層體之製造方法中，藉由光照射使黏著性組合物局部地光硬化，而形成高黏著區域及低黏著區域。In addition, in the manufacturing method of the intermediate laminate, the adhesive composition is locally photocured by light irradiation to form a high-adhesion area and a low-adhesion area.

因此，與藉由加熱使黏著性組合物熱硬化之情形相比，可抑制被接著體之由熱造成之損傷。Therefore, compared with the case where the adhesive composition is heat-cured by heating, the heat-induced damage of the adherend can be suppressed.

本發明之製品積層體之製造方法包括如下步驟：將藉由本發明之中間積層體之製造方法所製造之中間積層體中之黏著層之低黏著區域去除。The manufacturing method of the product laminate of the present invention includes the steps of removing the low-adhesion area of the adhesive layer in the intermediate laminate manufactured by the manufacturing method of the intermediate laminate of the present invention.

由於低黏著區域之黏著力較低，因此可容易地將低黏著區域與所對應之基材一起自中間積層體去除。另一方面，高黏著區域可殘存於中間積層體而與所對應之基材一起用於被接著體之補強。Since the adhesion of the low adhesion area is low, the low adhesion area and the corresponding substrate can be easily removed from the intermediate laminate. On the other hand, the high adhesion area can remain in the intermediate laminate and be used for the reinforcement of the adherend together with the corresponding base material.

參照圖1對本發明之中間積層體之一實施形態進行說明。An embodiment of the intermediate laminate of the present invention will be described with reference to Fig. 1.

1.中間積層體 如圖1所示，中間積層體1包含具有規定厚度之膜形狀(包含片形狀)，沿與厚度方向正交之方向(面方向)延伸，且具有平坦之上表面及平坦之下表面。1. Intermediate layered body As shown in FIG. 1, the intermediate laminate 1 includes a film shape (including a sheet shape) having a predetermined thickness, extends in a direction (plane direction) orthogonal to the thickness direction, and has a flat upper surface and a flat lower surface.

具體而言，中間積層體1包含：黏著片材4，其具備基材2及配置於基材2之一面之黏著層3；及被接著體5，其配置於黏著片材4之一面。Specifically, the intermediate laminate 1 includes: an adhesive sheet 4 including a base material 2 and an adhesive layer 3 arranged on one surface of the base material 2; and an adherend body 5 arranged on one surface of the adhesive sheet 4.

詳情將於後文敍述，中間積層體1係藉由將黏著片材4貼附於被接著體5而獲得。Details will be described later. The intermediate laminate 1 is obtained by attaching the adhesive sheet 4 to the adherend 5.

又，中間積層體1為製品積層體12(下述)之中間零件。In addition, the intermediate laminate 1 is an intermediate part of the product laminate 12 (described below).

以下，對各層進行詳細敍述。Hereinafter, each layer will be described in detail.

2.黏著片材 黏著片材4包含具有規定厚度之膜形狀(包含片形狀)，沿與厚度方向正交之方向(面方向)延伸，且具有平坦之上表面及平坦之下表面。2. Adhesive sheet The adhesive sheet 4 includes a film shape (including a sheet shape) having a predetermined thickness, extends in a direction (plane direction) orthogonal to the thickness direction, and has a flat upper surface and a flat lower surface.

具體而言，黏著片材4具備基材2、與配置於基材2之一面之黏著層3。Specifically, the adhesive sheet 4 includes a substrate 2 and an adhesive layer 3 arranged on one surface of the substrate 2.

以下，對構成黏著片材4之各層進行說明。Hereinafter, each layer constituting the adhesive sheet 4 will be described.

2-1.基材 基材2係黏著片材4之下層。基材2係確保黏著片材4之機械強度之支持層(支持材)。又，基材2係於中間積層體1中用以補強被接著體5之補強材。又，基材2具有沿面方向延伸之膜形狀，且具有平坦之平面及平坦之下表面。2-1. Substrate The base material 2 is the lower layer of the adhesive sheet 4. The base material 2 is a support layer (support material) that ensures the mechanical strength of the adhesive sheet 4. In addition, the base material 2 is a reinforcing material for reinforcing the adherend 5 in the intermediate laminated body 1. In addition, the substrate 2 has a film shape extending in the surface direction, and has a flat plane and a flat lower surface.

基材2包含可撓性塑膠材料。The substrate 2 includes a flexible plastic material.

作為此種塑膠材料，可列舉：例如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯樹脂；例如聚甲基丙烯酸酯等(甲基)丙烯酸系樹脂(丙烯酸系樹脂及/或甲基丙烯酸系樹脂)；例如聚乙烯、聚丙烯、環烯烴聚合物(COP)等聚烯烴樹脂；例如聚碳酸酯樹脂、例如聚醚碸樹脂、例如聚芳酯樹脂、例如三聚氰胺樹脂、例如聚醯胺樹脂、例如聚醯亞胺樹脂、例如纖維素樹脂、例如聚苯乙烯樹脂、例如降𦯉烯樹脂之合成樹脂等。Examples of such plastic materials include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate; for example, polymethacrylate. (Meth) acrylic resins (acrylic resins and/or methacrylic resins); for example, polyolefin resins such as polyethylene, polypropylene, and cycloolefin polymer (COP); for example, polycarbonate resins, such as polyether turpentine Resins, such as polyarylate resins, such as melamine resins, such as polyamide resins, such as polyimide resins, such as cellulose resins, such as polystyrene resins, synthetic resins such as norene resins, and the like.

詳情將於後文敍述，於自基材2側照射光而使黏著層3硬化之情形時，較佳為基材2具有對光之透明性。The details will be described later. When the adhesive layer 3 is cured by irradiating light from the side of the substrate 2, it is preferable that the substrate 2 has transparency to light.

就兼顧對光之透明性及機械強度之觀點而言，作為塑膠材料，較佳可列舉聚酯樹脂，更佳可列舉聚對苯二甲酸乙二酯(PET)。From the viewpoint of both light transparency and mechanical strength, as the plastic material, a polyester resin is preferable, and polyethylene terephthalate (PET) is more preferable.

基材2之厚度例如為4 μm以上，就補強被接著體5(下述)之觀點而言，較佳為20 μm以上，更佳為30 μm以上，進而較佳為45 μm以上，又，例如為500 μm以下，就可撓性及處理性之觀點而言，較佳為300 μm以下，更佳為200 μm以下，進而較佳為100 μm以下。The thickness of the substrate 2 is, for example, 4 μm or more. From the viewpoint of reinforcing the adherend 5 (described below), it is preferably 20 μm or more, more preferably 30 μm or more, and still more preferably 45 μm or more. For example, it is 500 μm or less, and from the viewpoint of flexibility and handleability, it is preferably 300 μm or less, more preferably 200 μm or less, and still more preferably 100 μm or less.

2-2.黏著層 黏著層3配置於基材2之一整面，且黏著層3為黏著片材4之上層。2-2. Adhesive layer The adhesive layer 3 is disposed on the entire surface of the substrate 2, and the adhesive layer 3 is the upper layer of the adhesive sheet 4.

黏著層3係用以將黏著片材4接著於被接著體5之感壓接著層。又，黏著層3具有沿面方向延伸之膜形狀，且具有平坦之平面及平坦之下表面。The adhesive layer 3 is a pressure-sensitive adhesive layer for bonding the adhesive sheet 4 to the adherend 5. In addition, the adhesive layer 3 has a film shape extending along the surface direction, and has a flat plane and a flat lower surface.

黏著層3包含能夠不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物。The adhesive layer 3 includes an adhesive composition that can irreversibly change into a state with higher adhesive force and a state with lower adhesive force.

作為此種黏著性組合物，可列舉：能夠自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態之第1黏著性組合物、及能夠自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態之第2黏著性組合物。Examples of such an adhesive composition include: the first adhesive composition capable of irreversibly changing from a state with high adhesive force to a state with low adhesive force, and a state capable of irreversibly changing from a state with low adhesive force The second adhesive composition changed to a state with higher adhesive force.

第1黏著性組合物包含聚合物、第1光硬化劑及光聚合起始劑。The first adhesive composition contains a polymer, a first photocuring agent, and a photopolymerization initiator.

作為聚合物，例如可列舉丙烯酸系聚合物、聚矽氧系聚合物、胺基甲酸酯系聚合物、橡膠系聚合物等，就控制光學透明性、接著性及儲存模數之觀點而言，可列舉丙烯酸系聚合物。Examples of polymers include acrylic polymers, silicone polymers, urethane polymers, rubber polymers, etc., from the viewpoint of controlling optical transparency, adhesiveness, and storage modulus Examples include acrylic polymers.

丙烯酸系聚合物係藉由包含(甲基)丙烯酸烷基酯作為主成分之單體成分之聚合而獲得。The acrylic polymer is obtained by polymerization of monomer components containing alkyl (meth)acrylate as the main component.

(甲基)丙烯酸烷基酯為丙烯酸酯及/或甲基丙烯酸酯，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異三(十二烷基)酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等直鏈狀或支鏈狀之(甲基)丙烯酸C1-20烷基酯等，較佳可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯，更佳可列舉甲基丙烯酸甲酯、丙烯酸丁酯、丙烯酸2-乙基己酯。Alkyl (meth)acrylate is acrylate and/or methacrylate, and examples include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, (meth) )Butyl acrylate, isopropyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tertiary butyl (meth)acrylate, amyl (meth)acrylate , Isoamyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (methyl) )Octyl acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylate Base) undecyl acrylate, dodecyl (meth)acrylate, isotri(dodecyl) (meth)acrylate, tetradecyl (meth)acrylate, (meth) Isotetradecyl acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate Ester, isostearyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate and other linear or branched (meth)acrylic acid C1 -20 alkyl esters, etc., preferably methyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, more preferably methyl methacrylate, acrylic acid Butyl ester, 2-ethylhexyl acrylate.

(甲基)丙烯酸烷基酯可單獨使用或併用兩種以上。The alkyl (meth)acrylate can be used alone or in combination of two or more.

作為(甲基)丙烯酸烷基酯，較佳可列舉(甲基)丙烯酸丁酯之單獨使用。As the alkyl (meth)acrylate, preferably, butyl (meth)acrylate is used alone.

又，作為(甲基)丙烯酸烷基酯，就調整玻璃轉移溫度及剪切儲存模數G'之觀點而言，較佳可列舉甲基丙烯酸甲酯與(甲基)丙烯酸C4-12烷基酯之併用，更佳可列舉甲基丙烯酸甲酯與丙烯酸2-乙基己酯之併用。In addition, as the alkyl (meth)acrylate, from the viewpoint of adjusting the glass transition temperature and the shear storage modulus G', preferably, methyl methacrylate and (meth)acrylic acid C4-12 alkyl The combined use of esters, more preferably, the combined use of methyl methacrylate and 2-ethylhexyl acrylate.

於併用甲基丙烯酸甲酯與(甲基)丙烯酸C4-12烷基酯作為(甲基)丙烯酸烷基酯之情形時，相對於甲基丙烯酸甲酯及(甲基)丙烯酸C4-12烷基酯之總量100質量份，甲基丙烯酸甲酯之調配比率例如為5質量份以上，又，例如為20質量份以下，又，(甲基)丙烯酸C4-12烷基酯之調配比率例如為80質量份以上，又，例如為95質量份以下。When methyl methacrylate and C4-12 alkyl (meth)acrylate are used together as alkyl (meth)acrylate, compared to methyl methacrylate and C4-12 alkyl (meth)acrylate The total amount of the ester is 100 parts by mass, the blending ratio of methyl methacrylate is, for example, 5 parts by mass or more, and, for example, 20 parts by mass or less, and the blending ratio of C4-12 alkyl (meth)acrylate is, for example, 80 parts by mass or more, and, for example, 95 parts by mass or less.

關於(甲基)丙烯酸烷基酯之調配比率，相對於單體成分，例如為50質量%以上，較佳為60質量%以上，又，例如為99質量%以下，較佳為80質量%以下。Regarding the blending ratio of the alkyl (meth)acrylate, relative to the monomer components, it is, for example, 50% by mass or more, preferably 60% by mass or more, and, for example, 99% by mass or less, preferably 80% by mass or less .

又，單體成分較佳為包含能夠與(甲基)丙烯酸烷基酯進行共聚之含官能基之乙烯基單體。In addition, the monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the alkyl (meth)acrylate.

作為含官能基之乙烯基單體，例如可列舉：含羥基之乙烯基單體、含羧基之乙烯基單體、含氮之乙烯基單體、含氰基之乙烯基單體、含縮水甘油基之乙烯基單體、含磺基之乙烯基單體、含磷酸基之乙烯基單體、芳香族乙烯基單體、乙烯酯單體、乙烯醚單體等。Examples of functional group-containing vinyl monomers include hydroxyl-containing vinyl monomers, carboxyl-containing vinyl monomers, nitrogen-containing vinyl monomers, cyano group-containing vinyl monomers, and glycidol-containing vinyl monomers. Vinyl monomers, vinyl monomers containing sulfo groups, vinyl monomers containing phosphoric acid groups, aromatic vinyl monomers, vinyl ester monomers, vinyl ether monomers, etc.

作為含羥基之乙烯基單體，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸4-(羥基甲基)環己基)甲酯等，較佳可列舉(甲基)丙烯酸2-羥基乙酯，更佳可列舉丙烯酸2-羥基乙酯。Examples of hydroxyl-containing vinyl monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth) 6-hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)acrylate Cyclohexyl)methyl and the like, preferably 2-hydroxyethyl (meth)acrylate, and more preferably 2-hydroxyethyl acrylate.

作為含羧基之乙烯基單體，例如可列舉：(甲基)丙烯酸、(甲基)丙烯酸2-羧基乙酯、羧基戊基(甲基)丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、丁烯酸等，較佳可列舉(甲基)丙烯酸，更佳可列舉丙烯酸。Examples of carboxyl group-containing vinyl monomers include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, Fumaric acid, crotonic acid, etc., preferably (meth)acrylic acid, more preferably acrylic acid.

又，作為含羧基之乙烯基單體，例如亦可列舉馬來酸酐、伊康酸酐等含酸酐基之單體。Moreover, as a vinyl monomer containing a carboxyl group, monomers containing an acid anhydride group, such as maleic anhydride and itaconic anhydride, can also be mentioned, for example.

作為含氮之乙烯基單體，例如可列舉：N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯𠰌啉、N-丙烯醯𠰌啉、N-乙烯基羧醯胺類、N-乙烯基己內醯胺等。Examples of nitrogen-containing vinyl monomers include: N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, vinyl Pyridine, vinyl pyrrole, vinyl imidazole, vinyl azole, vinyl pyridine, N-acrylamide, N-vinyl carboxamides, N-vinyl caprolactam and the like.

作為含氰基之乙烯基單體，例如可列舉(甲基)丙烯腈等。Examples of the cyano group-containing vinyl monomer include (meth)acrylonitrile.

作為含縮水甘油基之乙烯基單體，例如可列舉(甲基)丙烯酸縮水甘油酯等。As a glycidyl group-containing vinyl monomer, glycidyl (meth)acrylate etc. are mentioned, for example.

作為含磺基之乙烯基單體，例如可列舉苯乙烯磺酸、烯丙基磺酸等。Examples of sulfo group-containing vinyl monomers include styrene sulfonic acid and allyl sulfonic acid.

作為含磷酸基之乙烯基單體，例如可列舉丙烯醯磷酸2-羥基乙酯等。Examples of the phosphoric acid group-containing vinyl monomer include 2-hydroxyethyl acrylate phosphate and the like.

作為芳香族乙烯基單體，例如可列舉：苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、α-甲基苯乙烯等。Examples of the aromatic vinyl monomer include styrene, p-methylstyrene, o-methylstyrene, α-methylstyrene, and the like.

作為乙烯酯單體，例如可列舉：乙酸乙烯酯、丙酸乙烯酯等。As a vinyl ester monomer, vinyl acetate, vinyl propionate, etc. are mentioned, for example.

作為乙烯醚單體，例如可列舉甲基乙烯醚等。As a vinyl ether monomer, methyl vinyl ether etc. are mentioned, for example.

含官能基之乙烯基單體可單獨使用或併用兩種以上。於調配交聯劑(下述)之情形時，就向聚合物導入交聯結構之觀點而言，較佳可列舉含羥基之乙烯基單體，又，就提高凝集力之觀點而言，較佳可列舉含氮之乙烯基單體，更佳為將含羥基之乙烯基單體與含氮之乙烯基單體併用。The functional group-containing vinyl monomer can be used alone or in combination of two or more. In the case of compounding a crosslinking agent (described below), from the viewpoint of introducing a crosslinked structure into the polymer, a vinyl monomer containing a hydroxyl group is preferably mentioned. In addition, from the viewpoint of increasing the cohesive force, it is more Preferably, a nitrogen-containing vinyl monomer is used, and it is more preferable to use a combination of a hydroxyl-containing vinyl monomer and a nitrogen-containing vinyl monomer.

於將含羥基之乙烯基單體及含氮之乙烯基單體併用之情形時，相對於含羥基之乙烯基單體及含氮之乙烯基單體之總量100質量份，含羥基之乙烯基單體之調配比率例如為40質量份以上，又，例如為60質量份以下，又，含氮之乙烯基單體之調配比率例如為40質量份以上，又，例如為60質量份以下。In the case of combining hydroxyl-containing vinyl monomers and nitrogen-containing vinyl monomers, relative to 100 parts by mass of the total amount of hydroxyl-containing vinyl monomers and nitrogen-containing vinyl monomers, hydroxyl-containing vinyl The compounding ratio of the base monomer is, for example, 40 parts by mass or more, and, for example, 60 parts by mass or less, and the compounding ratio of the nitrogen-containing vinyl monomer is, for example, 40 parts by mass or more, and, for example, 60 parts by mass or less.

關於含官能基之乙烯基單體之調配比率，相對於單體成分，例如為1質量%以上，較佳為5質量%以上，更佳為10質量%以上，進而較佳為15質量%以上，又，例如為30質量%以下，較佳為20質量%以下。Regarding the blending ratio of the functional group-containing vinyl monomer, relative to the monomer components, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 10% by mass or more, and more preferably 15% by mass or more Also, for example, it is 30% by mass or less, and preferably 20% by mass or less.

並且，丙烯酸系聚合物係將上述單體成分進行聚合而成之聚合物。In addition, the acrylic polymer is a polymer obtained by polymerizing the aforementioned monomer components.

於使單體成分聚合時，例如將(甲基)丙烯酸烷基酯、與視需要而定之含官能基之乙烯基單體進行調配而製備單體成分，將該單體成分例如藉由溶液聚合、塊狀聚合、乳化聚合等公知之聚合方法進行製備。When polymerizing monomer components, for example, alkyl (meth)acrylate and optionally functional group-containing vinyl monomers are prepared to prepare monomer components, for example, by solution polymerization , Block polymerization, emulsion polymerization and other known polymerization methods.

作為聚合方法，較佳可列舉溶液聚合。As a polymerization method, solution polymerization is preferably mentioned.

於溶液聚合中，例如向溶劑中調配單體成分與聚合起始劑而製備單體溶液，然後對單體溶液進行加熱。In solution polymerization, for example, a monomer component and a polymerization initiator are prepared in a solvent to prepare a monomer solution, and then the monomer solution is heated.

作為溶劑，例如可列舉有機溶劑等。As a solvent, an organic solvent etc. are mentioned, for example.

作為有機溶劑，可列舉：例如甲苯、苯、二甲苯等芳香族烴系溶劑、例如二***等醚系溶劑、例如丙酮、甲基乙基酮等酮系溶劑、例如乙酸乙酯等酯系溶劑、例如N,N-二甲基甲醯胺等醯胺系溶劑，較佳可列舉酯系溶劑，更佳可列舉乙酸乙酯。Examples of organic solvents include aromatic hydrocarbon solvents such as toluene, benzene, and xylene; ether solvents such as diethyl ether; ketone solvents such as acetone and methyl ethyl ketone; and ester solvents such as ethyl acetate. For example, amine-based solvents such as N,N-dimethylformamide, preferably ester-based solvents, and more preferably ethyl acetate.

溶劑可單獨使用或併用兩種以上。The solvent can be used alone or in combination of two or more.

溶劑之調配比率相對於單體成分100質量份，例如為100質量份以上，較佳為200質量份以上，又，例如為500質量份以下，較佳為300質量份以下。The blending ratio of the solvent relative to 100 parts by mass of the monomer components is, for example, 100 parts by mass or more, preferably 200 parts by mass or more, and, for example, 500 parts by mass or less, preferably 300 parts by mass or less.

作為聚合起始劑，例如可列舉過氧化物系聚合起始劑、偶氮系聚合起始劑等。Examples of the polymerization initiator include peroxide-based polymerization initiators, azo-based polymerization initiators, and the like.

作為過氧化物系聚合起始劑，例如可列舉：過氧化碳酸酯、過氧化酮、過氧縮酮、過氧化氫、過氧化二烷基、過氧化二醯基、過氧酯等有機過氧化物。Examples of peroxide-based polymerization initiators include organic peroxides such as peroxycarbonate, ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, diacyl peroxide, and peroxyester. Oxide.

作為偶氮系聚合起始劑，例如可列舉：2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-甲基丁腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙異丁酸二甲酯等偶氮化合物。As the azo polymerization initiator, for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis (2,4-Dimethylvaleronitrile), 2,2'-Dimethyl azobisisobutyrate and other azo compounds.

作為聚合起始劑，較佳可列舉偶氮系聚合起始劑，更佳可列舉2,2'-偶氮雙異丁腈。The polymerization initiator preferably includes an azo polymerization initiator, and more preferably includes 2,2'-azobisisobutyronitrile.

聚合起始劑可單獨使用或併用兩種以上。The polymerization initiator can be used alone or in combination of two or more.

聚合起始劑之調配比率相對於單體成分100質量份，例如為0.05質量份以上，較佳為0.1質量份以上，又，例如為1質量份以下，較佳為0.5質量份以下。The blending ratio of the polymerization initiator relative to 100 parts by mass of the monomer components is, for example, 0.05 parts by mass or more, preferably 0.1 parts by mass or more, and, for example, 1 part by mass or less, preferably 0.5 parts by mass or less.

加熱溫度例如為50℃以上80℃以下，加熱時間例如為1小時以上8小時以下。The heating temperature is, for example, 50°C or more and 80°C or less, and the heating time is, for example, 1 hour or more and 8 hours or less.

藉此，將單體成分進行聚合而獲得包含丙烯酸系聚合物之丙烯酸系聚合物溶液。In this way, the monomer components are polymerized to obtain an acrylic polymer solution containing an acrylic polymer.

丙烯酸系聚合物溶液之固形物成分濃度例如為20質量%以上，又，例如為80質量%以下。The solid content concentration of the acrylic polymer solution is, for example, 20% by mass or more, and for example, 80% by mass or less.

丙烯酸系聚合物之重量平均分子量例如為100000以上，較佳為300000以上、500000以上，又，例如為5000000以下，較佳為3000000以下，更佳為2000000以下。The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, and 500,000 or more, for example, 5,000,000 or less, preferably 3,000,000 or less, and more preferably 2,000,000 or less.

再者，上述重量平均分子量係藉由GPC(凝膠滲透層析)進行測定並藉由聚苯乙烯換算而算出之值。In addition, the said weight average molecular weight is the value calculated by the polystyrene conversion measured by GPC (gel permeation chromatography).

於光硬化性組合物中，聚合物之調配比率相對於聚合物、第1光硬化劑及光聚合起始劑之總量，例如為70質量%以上，又，例如為95質量%以下。In the photocurable composition, the blending ratio of the polymer relative to the total amount of the polymer, the first photocuring agent, and the photopolymerization initiator is, for example, 70% by mass or more, and, for example, 95% by mass or less.

作為第1光硬化劑，就藉由光照射而使黏著層3之黏著力充分地降低之觀點而言，可列舉官能基數4以上、較佳為5以上且6以下之多官能(甲基)丙烯酸酯，具體而言，可列舉：二-三羥甲基丙烷四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等4官能(甲基)丙烯酸酯；例如二季戊四醇聚(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等6官能(甲基)丙烯酸酯，較佳可列舉6官能(甲基)丙烯酸酯，更佳可列舉二季戊四醇六丙烯酸酯。As the first light curing agent, from the viewpoint of sufficiently reducing the adhesive force of the adhesive layer 3 by light irradiation, a polyfunctional (methyl) group having a functional group number of 4 or more, preferably 5 or more and 6 or less can be mentioned. Acrylates, specifically, include: di-trimethylolpropane tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate and other tetrafunctional (methyl) ) Acrylate; for example, 6-functional (meth)acrylate such as dipentaerythritol poly(meth)acrylate, dipentaerythritol hexa(meth)acrylate, preferably 6-functional (meth)acrylate, more preferably List dipentaerythritol hexaacrylate.

第1光硬化劑可單獨使用或併用兩種以上。The first light hardener can be used alone or in combination of two or more.

又，第1光硬化劑之官能基當量例如為50 g/eq以上，又，例如為500 g/eq以下。In addition, the functional group equivalent of the first light curing agent is, for example, 50 g/eq or more, and for example, 500 g/eq or less.

第1光硬化劑於25℃下之黏度例如為100 mPa・s以上，較佳為400 mPa・s以上，更佳為1000 mPa・s以上，進而較佳為3000 mPa・s以上，尤佳為4000 mPa・s以上，最佳為5000 mPa・s以上，進而最佳為6000 mPa・s以上，又，通常為8000 mPa・s以下。The viscosity of the first light hardener at 25°C is, for example, 100 mPa·s or more, preferably 400 mPa·s or more, more preferably 1000 mPa·s or more, and still more preferably 3000 mPa·s or more, especially 4000 mPa·s or more, preferably 5000 mPa·s or more, more preferably 6000 mPa·s or more, and usually 8000 mPa·s or less.

再者，上述黏度可藉由B型黏度計進行測定，具體而言，可使用東機產業 VISCOMETER(BH型)於測定溫度25℃、轉子3號、轉速10 rpm、測定時間5分鐘之條件下進行測定。Furthermore, the above-mentioned viscosity can be measured with a B-type viscometer. Specifically, Toki Sangyo VISCOMETER (BH-type) can be used under the conditions of measuring temperature 25℃, rotor No. 3, rotating speed 10 rpm, and measuring time 5 minutes Perform the measurement.

第1光硬化劑之分子量就相溶性之觀點而言，例如為1500以下，較佳為1000以下，又，例如為100以上。From the viewpoint of compatibility, the molecular weight of the first light curing agent is, for example, 1500 or less, preferably 1000 or less, and for example, 100 or more.

又，第1光硬化劑較佳為選擇與聚合物相溶者。In addition, it is preferable that the first light hardener is selected to be compatible with the polymer.

若第1光硬化劑與聚合物相溶，則可提高未被光照射之黏著層3之黏著力(下述)。If the first light hardener is compatible with the polymer, the adhesive force of the adhesive layer 3 that is not irradiated with light can be improved (described below).

具體而言，若聚合物之漢森溶解度參數(HSP)與第1光硬化劑之漢森溶解度參數(HSP)之差例如為4以下、較佳為3.5以下，則第1光硬化劑與聚合物相溶，其結果為可提高未被光照射之黏著層3之黏著力(下述)。Specifically, if the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the first light hardener is, for example, 4 or less, preferably 3.5 or less, the first light hardener and the polymer The substances are compatible, and as a result, the adhesive force of the adhesive layer 3 not irradiated with light can be improved (described below).

再者，聚合物之漢森溶解度參數(HSP)係基於構成聚合物之單體之漢森溶解度參數(HSP)而算出。Furthermore, the Hansen solubility parameter (HSP) of the polymer is calculated based on the Hansen solubility parameter (HSP) of the monomers constituting the polymer.

關於第1光硬化劑之調配比率，相對於聚合物100質量份例如為10質量份以上，又，例如為50質量份以下，較佳為30質量份以下。Regarding the blending ratio of the first light hardener, relative to 100 parts by mass of the polymer, for example, 10 parts by mass or more, for example, 50 parts by mass or less, and preferably 30 parts by mass or less.

又，關於第1光硬化劑之調配比率，相對於聚合物、第1光硬化劑及光聚合起始劑之總量，例如為5質量%以上，又，例如為30質量%以下。In addition, the blending ratio of the first light hardener is, for example, 5% by mass or more, and, for example, 30% by mass or less with respect to the total amount of the polymer, the first light hardener, and the photopolymerization initiator.

光聚合起始劑促進第1光硬化劑之硬化反應，根據第1光硬化劑之種類等適宜選擇，可列舉：例如光陽離子起始劑(光酸產生劑)、例如1-羥基環己基苯基酮等羥基酮類、苯偶醯二甲基縮酮類、胺基酮類、醯基膦氧化物類、二苯甲酮類、含三氯甲基之三𠯤衍生物等光自由基起始劑、例如光陰離子起始劑(光鹼產生劑)等。The photopolymerization initiator promotes the curing reaction of the first photocuring agent, and is appropriately selected according to the type of the first photocuring agent. Examples include photocation initiators (photoacid generators), such as 1-hydroxycyclohexylbenzene Hydroxy ketones such as ketones, benzil dimethyl ketals, amino ketones, phosphine oxides, benzophenones, trichloromethyl-containing tertiary derivatives and other light free radicals Starting agent, for example, photoanion initiator (photobase generator) and the like.

光聚合起始劑可單獨使用或併用兩種以上。The photopolymerization initiator can be used alone or in combination of two or more.

此種光聚合起始劑中，於使用多官能(甲基)丙烯酸酯作為第1光硬化劑之情形時，較佳為採用光自由基起始劑，更佳為採用羥基酮類。Among such photopolymerization initiators, when a polyfunctional (meth)acrylate is used as the first photohardener, a photoradical initiator is preferably used, and hydroxyketones are more preferably used.

光聚合起始劑之光吸收區域例如為300 nm以上，又，例如為450 nm以下。The light absorption region of the photopolymerization initiator is, for example, 300 nm or more, and for example, 450 nm or less.

關於光聚合起始劑之調配比率，相對於聚合物100質量份，例如為0.01質量份以上，又，例如為1質量份以下，較佳為0.5質量份以下。The blending ratio of the photopolymerization initiator is, for example, 0.01 parts by mass or more, for example, 1 part by mass or less, and preferably 0.5 parts by mass or less with respect to 100 parts by mass of the polymer.

又，關於光聚合起始劑之調配比率，相對於聚合物、第1光硬化劑及光聚合起始劑之總量，例如為0.01質量%以上，又，例如為1質量%以下，較佳為0.5質量份以下。In addition, the blending ratio of the photopolymerization initiator relative to the total amount of the polymer, the first photohardener, and the photopolymerization initiator is, for example, 0.01% by mass or more, and, for example, 1% by mass or less, preferably It is 0.5 parts by mass or less.

並且，於製備第1黏著性組合物時，將聚合物(於藉由溶液聚合而製備聚合物之情形時為聚合物溶液)、第1光硬化劑及光聚合起始劑以上述比率進行調配並加以混合。In addition, when preparing the first adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization, the polymer solution), the first photohardener and the photopolymerization initiator are blended in the above ratio And mix.

於第1黏著性組合物中，就向聚合物導入交聯結構之觀點而言，較佳為調配交聯劑。In the first adhesive composition, it is preferable to formulate a crosslinking agent from the viewpoint of introducing a crosslinked structure into the polymer.

作為交聯劑，例如可列舉異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等，較佳可列舉異氰酸酯系交聯劑。Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, azoline crosslinking agents, aziridine-based crosslinking agents, carbodiimide-based crosslinking agents, and metal chelate compounds. The crosslinking agent and the like preferably include an isocyanate crosslinking agent.

作為異氰酸酯系交聯劑，可列舉：例如伸丁基二異氰酸酯、六亞甲基二異氰酸酯等脂肪族二異氰酸酯、例如伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族二異氰酸酯、例如2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族二異氰酸酯。Examples of the isocyanate-based crosslinking agent include aliphatic diisocyanates such as butylene diisocyanate and hexamethylene diisocyanate, such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, etc. Alicyclic diisocyanates, for example, aromatic diisocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate.

又，作為異氰酸酯系交聯劑，亦可列舉上述異氰酸酯之衍生物(例如異氰尿酸酯改性體、多元醇改性體等)。In addition, as the isocyanate-based crosslinking agent, derivatives of the above-mentioned isocyanate (for example, an isocyanurate modified product, a polyol modified product, etc.) can also be cited.

作為異氰酸酯系交聯劑，可使用市售品，例如可列舉：Coronate L(甲苯二異氰酸酯之三羥甲基丙烷加成體，東梭製造)、Coronate HL(六亞甲基二異氰酸酯之三羥甲基丙烷加成體，東梭製造)、Coronate HX(六亞甲基二異氰酸酯之異氰尿酸酯體)、Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成體，三井化學製造)等。As the isocyanate-based crosslinking agent, commercially available products can be used, for example, Coronaate L (trimethylolpropane adduct of toluene diisocyanate, manufactured by Tosuo), Coronate HL (trihydroxymethyl of hexamethylene diisocyanate) Methyl propane adduct, manufactured by Toso), Coronaate HX (isocyanurate of hexamethylene diisocyanate), Takenate D110N (trimethylolpropane adduct of xylylene diisocyanate, Mitsui Chemical manufacturing) etc.

作為環氧系交聯劑，例如可列舉二縮水甘油基苯胺、N,N,N',N'-四縮水甘油基-間苯二甲胺等。As an epoxy-type crosslinking agent, diglycidyl aniline, N,N,N',N'-tetraglycidyl-m-xylylenediamine, etc. are mentioned, for example.

作為環氧系交聯劑，亦可使用市售品，例如可列舉Tetrad C(三菱瓦斯化學製造)等。As the epoxy-based crosslinking agent, a commercially available product may also be used, and examples thereof include Tetrad C (manufactured by Mitsubishi Gas Chemical Co., Ltd.).

作為環氧系交聯劑，較佳可列舉N,N,N',N'-四縮水甘油基-間苯二甲胺。The epoxy-based crosslinking agent preferably includes N,N,N',N'-tetraglycidyl-m-xylylenediamine.

交聯劑可單獨使用或併用兩種以上。The crosslinking agent can be used alone or in combination of two or more.

若於第1黏著性組合物中調配交聯劑，則聚合物中之羥基等官能基與交聯劑進行反應，而向聚合物導入交聯結構。If a crosslinking agent is blended in the first adhesive composition, functional groups such as hydroxyl groups in the polymer react with the crosslinking agent to introduce a crosslinking structure into the polymer.

交聯劑之官能基當量例如為50 g/eq以上，又，例如為500 g/eq以下。The functional group equivalent of the crosslinking agent is, for example, 50 g/eq or more, and for example, 500 g/eq or less.

關於交聯劑之調配比率，相對於聚合物100質量份，例如為0.1質量份以上，較佳為1.0質量份以上，更佳為1.5質量份以上，進而較佳為2.0質量份以上，又，例如為10質量份以下，較佳為5質量份以下，更佳為4質量份以下。Regarding the blending ratio of the crosslinking agent relative to 100 parts by mass of the polymer, for example, it is 0.1 parts by mass or more, preferably 1.0 parts by mass or more, more preferably 1.5 parts by mass or more, and still more preferably 2.0 parts by mass or more. For example, it is 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 4 parts by mass or less.

又，於在第1黏著性組合物中調配交聯劑之情形時，亦可為了促進交聯反應而調配交聯觸媒。Moreover, when a crosslinking agent is blended in the first adhesive composition, a crosslinking catalyst may be blended in order to promote the crosslinking reaction.

作為交聯觸媒，例如可列舉：鈦酸四正丁酯、鈦酸四異丙酯、三乙醯丙酮鐵、氧化丁基錫、二月桂酸二辛基錫等金屬系交聯觸媒等。Examples of the crosslinking catalyst include metal-based crosslinking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, iron triacetone acetone, butyl tin oxide, and dioctyl tin dilaurate.

交聯觸媒可單獨使用或併用兩種以上。The crosslinking catalyst can be used alone or in combination of two or more.

關於交聯觸媒之調配比率，相對於聚合物100質量份，例如為0.001質量份以上，較佳為0.01質量份以上，又，例如為0.05質量份以下。Regarding the blending ratio of the crosslinking catalyst, relative to 100 parts by mass of the polymer, it is, for example, 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and, for example, 0.05 parts by mass or less.

又，於第1黏著性組合物中，可於無損本發明之效果之範圍內視需要含有例如矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑、基於螢光燈下或自然光下之穩定化之觀點的紫外線吸收劑、基於螢光燈下或自然光下之穩定化之觀點的抗氧化劑、界面活性劑、抗靜電劑等添加劑等各種添加劑。In addition, the first adhesive composition may optionally contain a silane coupling agent, an adhesiveness imparting agent, a plasticizer, a softening agent, an anti-deterioration agent, a filler, and a coloring agent within the range that does not impair the effects of the present invention. , UV absorbers based on the viewpoint of stabilization under fluorescent lamps or natural light, antioxidants, surfactants, antistatic agents and other additives based on the viewpoint of stabilization under fluorescent lamps or natural light.

藉此，獲得第1黏著性組合物。In this way, the first adhesive composition was obtained.

關於聚合物之調配比率，相對於第1黏著性組合物，例如為50質量%以上，較佳為80質量%以上，又，例如為90質量%以下。Regarding the blending ratio of the polymer, relative to the first adhesive composition, it is, for example, 50% by mass or more, preferably 80% by mass or more, and, for example, 90% by mass or less.

關於第1光硬化劑之調配比率，相對於第1黏著性組合物，例如為10質量%以上，又，例如為50質量%以下。Regarding the blending ratio of the first light curing agent, relative to the first adhesive composition, it is, for example, 10% by mass or more, and, for example, 50% by mass or less.

關於光聚合起始劑之調配比率，相對於第1黏著性組合物，例如為0.01質量%以上，又，例如為0.5質量%以下，較佳為0.1質量%以下。Regarding the blending ratio of the photopolymerization initiator, relative to the first adhesive composition, it is, for example, 0.01% by mass or more, for example, 0.5% by mass or less, and preferably 0.1% by mass or less.

第2黏著性組合物包含上述聚合物、第2光硬化劑及上述光聚合起始劑。The second adhesive composition contains the above-mentioned polymer, a second photocuring agent, and the above-mentioned photopolymerization initiator.

作為聚合物，可列舉與上述第1黏著性組合物中所調配之聚合物相同者，較佳可列舉丙烯酸系聚合物。The polymer may be the same as the polymer compounded in the above-mentioned first adhesive composition, preferably an acrylic polymer.

聚合物可單獨使用或併用兩種以上。The polymers can be used alone or in combination of two or more.

聚合物之調配比率與上述第1黏著性組合物中所調配之聚合物之調配比率相同。The blending ratio of the polymer is the same as the blending ratio of the polymer blended in the above-mentioned first adhesive composition.

第2光硬化劑就藉由光照射而使黏著層3之黏著力充分地提高之觀點而言，例如可列舉官能基數2以上3以下之多官能(甲基)丙烯酸酯，具體而言，可列舉：聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、雙酚A環氧乙烷改性二(甲基)丙烯酸酯、雙酚A環氧丙烷改性二(甲基)丙烯酸酯、烷二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯等2官能(甲基)丙烯酸酯、例如乙氧化異三聚氰酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯等3官能(甲基)丙烯酸酯等，較佳可列舉2官能(甲基)丙烯酸酯，更佳可列舉聚丙二醇二丙烯酸酯。In terms of the second light curing agent that sufficiently improves the adhesive force of the adhesive layer 3 by light irradiation, for example, polyfunctional (meth)acrylates having a functional group number of 2 or more and 3 or less can be cited. Specifically, List: polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A ethylene oxide modified two ( Meth) acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, pentaerythritol di( Difunctional (meth)acrylates such as meth)acrylate, neopentyl glycol di(meth)acrylate, glycerol di(meth)acrylate, such as ethoxylated isocyanuric acid tri(meth)acrylic acid Trifunctional (meth)acrylates such as esters, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, etc., preferably bifunctional (meth)acrylates, more preferably List polypropylene glycol diacrylate.

第2光硬化劑可單獨使用或併用兩種以上。The second light hardener may be used alone or in combination of two or more kinds.

又，第2光硬化劑之官能基當量例如為50 g/eq以上，又，例如為500 g/eq以下。In addition, the functional group equivalent of the second light curing agent is, for example, 50 g/eq or more, and, for example, 500 g/eq or less.

第2光硬化劑於25℃下之黏度例如為5 mPa・s以上，又，例如為1000 mPa・s以下。The viscosity of the second light hardener at 25°C is, for example, 5 mPa·s or more, and, for example, 1000 mPa·s or less.

第2光硬化劑之分子量就相溶性之觀點而言，例如為200以下，又，例如為1000以上。From the viewpoint of compatibility, the molecular weight of the second light curing agent is, for example, 200 or less, and for example, 1000 or more.

又，第2光硬化劑較佳為選擇不與聚合物相溶者。In addition, it is preferable to select the second light hardener that is not compatible with the polymer.

若第2光硬化劑不與聚合物相溶，則可使未被光照射之黏著層3之黏著力(下述)變低。If the second light hardener is not compatible with the polymer, the adhesive force (described below) of the adhesive layer 3 not irradiated with light can be reduced.

具體而言，若聚合物之漢森溶解度參數(HSP)與第2光硬化劑之漢森溶解度參數(HSP)之差例如為3以上、較佳為4以上，則第2光硬化劑與聚合物不相溶，其結果為，可使未被光照射之黏著層3之黏著力(下述)變低。Specifically, if the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the second light hardener is, for example, 3 or more, preferably 4 or more, the second light hardener and the polymer The substances are incompatible, and as a result, the adhesive force (described below) of the adhesive layer 3 not irradiated with light can be reduced.

第2光硬化劑之調配比率與上述第1黏著性組合物中所調配之第1光硬化劑之調配比率相同。The compounding ratio of the second light hardener is the same as the compounding ratio of the first light hardener compounded in the above-mentioned first adhesive composition.

作為光聚合起始劑，可列舉與上述第1黏著性組合物中所調配之光聚合起始劑相同者，於使用多官能(甲基)丙烯酸酯作為第2光硬化劑之情形時，較佳為採用光自由基起始劑，更佳為採用羥基酮類。As the photopolymerization initiator, the same as the photopolymerization initiator formulated in the above-mentioned first adhesive composition can be cited. When a polyfunctional (meth)acrylate is used as the second photocuring agent, it is more Preferably, a photo-radical initiator is used, and more preferably, a hydroxyketone is used.

光聚合起始劑可單獨使用或併用兩種以上。The photopolymerization initiator can be used alone or in combination of two or more.

光聚合起始劑之調配比率與上述第1黏著性組合物中所調配之光聚合起始劑之調配比率相同。The blending ratio of the photopolymerization initiator is the same as the blending ratio of the photopolymerization initiator blended in the first adhesive composition.

並且，於製備第2黏著性組合物時，將聚合物(於藉由溶液聚合而製備聚合物之情形時為聚合物溶液)、第2光硬化劑及光聚合起始劑以上述比率進行調配並加以混合。In addition, when preparing the second adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization, the polymer solution), the second photohardener, and the photopolymerization initiator are blended in the above ratio And mix.

於第2黏著性組合物中，就向聚合物導入交聯結構之觀點而言，較佳為調配交聯劑。In the second adhesive composition, it is preferable to blend a crosslinking agent from the viewpoint of introducing a crosslinked structure into the polymer.

作為交聯劑，可列舉與上述第1黏著性組合物中所調配之交聯劑相同者，較佳可列舉異氰酸酯系交聯劑、環氧系交聯劑。As the crosslinking agent, the same ones as the crosslinking agent blended in the above-mentioned first adhesive composition can be cited, preferably, isocyanate-based crosslinking agents and epoxy-based crosslinking agents can be cited.

交聯劑可單獨使用或併用兩種以上。The crosslinking agent can be used alone or in combination of two or more.

交聯劑之調配比率與上述第1黏著性組合物中所調配之交聯劑之調配比率相同。The blending ratio of the crosslinking agent is the same as the blending ratio of the crosslinking agent blended in the first adhesive composition.

又，於在第2黏著性組合物中調配交聯劑之情形時，亦可為了促進交聯反應而調配交聯觸媒。Moreover, when a crosslinking agent is blended in the second adhesive composition, a crosslinking catalyst may be blended in order to promote the crosslinking reaction.

作為交聯觸媒，可列舉與上述第1黏著性組合物中所調配之交聯觸媒相同者。Examples of the crosslinking catalyst include the same ones as the crosslinking catalyst blended in the first adhesive composition.

交聯觸媒可單獨使用或併用兩種以上。The crosslinking catalyst can be used alone or in combination of two or more.

交聯觸媒之調配比率與上述第1黏著性組合物中所調配之交聯觸媒之調配比率相同。The blending ratio of the cross-linking catalyst is the same as that of the cross-linking catalyst blended in the first adhesive composition.

又，於第2黏著性組合物中，可於無損本發明之效果之範圍內視需要含有上述第1黏著性組合物中所調配之各種添加劑。In addition, the second adhesive composition may contain various additives formulated in the above-mentioned first adhesive composition as needed within a range that does not impair the effects of the present invention.

藉此，獲得第2黏著性組合物。Thus, the second adhesive composition was obtained.

相對於第2黏著性組合物之聚合物之調配比率、第2光硬化劑之調配比率及光聚合起始劑之調配比率與上述相對於第1黏著性組合物之聚合物之調配比率、第1光硬化劑之調配比率及光聚合起始劑之調配比率相同。The blending ratio of the polymer relative to the second adhesive composition, the blending ratio of the second light hardener, and the blending ratio of the photopolymerization initiator, and the blending ratio of the polymer relative to the first adhesive composition, the first 1 The mixing ratio of light hardener and the mixing ratio of photopolymerization initiator are the same.

即，第1黏著性組合物及第2黏著性組合物於包含聚合物、光聚合起始劑、及視需要調配之交聯劑、交聯觸媒及各種添加劑之方面共通，而不同之處在於：第1黏著性組合物包含作為官能基數4以上之多官能(甲基)丙烯酸酯之第1光硬化劑，另一方面，第2黏著性組合物包含作為官能基數3以下之多官能(甲基)丙烯酸酯之第2光硬化劑。That is, the first adhesive composition and the second adhesive composition are common in terms of including a polymer, a photopolymerization initiator, and optionally a crosslinking agent, a crosslinking catalyst, and various additives, but they are different It is that the first adhesive composition contains the first light hardening agent as a polyfunctional (meth)acrylate having a functional group number of 4 or more, and on the other hand, the second adhesive composition contains a polyfunctional ( The second light hardener for meth)acrylate.

即，藉由調配第1光硬化劑及第2光硬化劑中之任一者，可選擇性地製備第1黏著性組合物或第2黏著性組合物。That is, by blending any one of the first light hardener and the second light hardener, the first adhesive composition or the second adhesive composition can be selectively prepared.

並且，藉由下述方法，自第1黏著性組合物或第2黏著性組合物形成黏著層3。In addition, the adhesive layer 3 is formed from the first adhesive composition or the second adhesive composition by the following method.

黏著層3之厚度就黏著性之觀點而言，例如為5 μm以上，較佳為10 μm以上，更佳為15 μm以上，進而較佳為20 μm以上，又，就處理性之觀點而言，例如為300 μm以下，較佳為100 μm以下，更佳為50 μm以下，進而較佳為40 μm以下，尤佳為30 μm以下。The thickness of the adhesive layer 3 from the standpoint of adhesiveness is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, and still more preferably 20 μm or more, and from the viewpoint of handling properties For example, it is 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, still more preferably 40 μm or less, and particularly preferably 30 μm or less.

2-3.黏著片材之製造方法 其次，參照圖2對製造黏著片材4之方法進行說明。2-3. Manufacturing method of adhesive sheet Next, a method of manufacturing the adhesive sheet 4 will be described with reference to FIG. 2.

製造該黏著片材4之方法包括：準備基材2之第1步驟、及於基材2之一面配置黏著層3之第2步驟。The method of manufacturing the adhesive sheet 4 includes the first step of preparing the base material 2 and the second step of disposing the adhesive layer 3 on one surface of the base material 2.

於第1步驟中，如圖2A所示，準備基材2。In the first step, as shown in FIG. 2A, the substrate 2 is prepared.

於第2步驟中，如圖2B所示，於基材2之一面配置黏著層3。In the second step, as shown in FIG. 2B, an adhesive layer 3 is disposed on one surface of the substrate 2.

於在基材2之一面配置黏著層3時，例如於基材2之一面塗佈上述第1黏著性組合物或第2黏著性組合物，並根據需要將溶劑乾燥去除。When arranging the adhesive layer 3 on one surface of the substrate 2, for example, the above-mentioned first adhesive composition or the second adhesive composition is applied to one surface of the substrate 2, and the solvent is dried and removed as necessary.

作為第1黏著性組合物或第2黏著性組合物之塗佈方法，例如可列舉：輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥式塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、模嘴塗佈等。As the coating method of the first adhesive composition or the second adhesive composition, for example, roll coating, touch roll coating, gravure coating, reverse coating, roll brushing, spraying, Dip roll coating, bar coating, knife coating, air knife coating, curtain coating, die lip coating, die nozzle coating, etc.

作為乾燥條件，乾燥溫度例如為50℃以上，較佳為70℃以上，更佳為100℃以上，又，例如為200℃以下，較佳為180℃以下，更佳為150℃以下，乾燥時間例如為5秒以上，較佳為10秒以上，又，例如為20分鐘以下，較佳為15分鐘以下，更佳為10分鐘以下。As the drying conditions, the drying temperature is, for example, 50°C or higher, preferably 70°C or higher, more preferably 100°C or higher, and, for example, 200°C or lower, preferably 180°C or lower, more preferably 150°C or lower, drying time For example, it is 5 seconds or more, preferably 10 seconds or more, and for example, it is 20 minutes or less, preferably 15 minutes or less, and more preferably 10 minutes or less.

藉此，於基材2之一面形成黏著層3，而獲得具備基材2、及配置於基材2之一面之黏著層3之黏著片材4。In this way, an adhesive layer 3 is formed on one surface of the substrate 2 to obtain an adhesive sheet 4 having the substrate 2 and the adhesive layer 3 disposed on one surface of the substrate 2.

再者，於第1黏著性組合物或第2黏著性組合物包含交聯劑之情形時，在乾燥去除之同時、或溶劑之乾燥後(於黏著層3之一面積層有剝離膜6(下述)後)，較佳為藉由熟化使交聯進行。Furthermore, when the first adhesive composition or the second adhesive composition contains a cross-linking agent, it is dried and removed at the same time or after the solvent is dried (a release film 6 (below) is layered on one area of the adhesive layer 3 After the above), crosslinking is preferably performed by aging.

熟化條件根據交聯劑之種類進行適宜設定，熟化溫度例如為20℃以上，又，例如為160℃以下，較佳為50℃以下，又，熟化時間為1分鐘以上，較佳為12小時以上，更佳為1天以上，又，例如為7天以下。The curing conditions are appropriately set according to the type of crosslinking agent. The curing temperature is, for example, 20°C or higher, and, for example, 160°C or lower, preferably 50°C or lower, and the curing time is 1 minute or longer, preferably 12 hours or longer. , More preferably 1 day or more, and, for example, 7 days or less.

如上所述，黏著片材4中之黏著層3係藉由第1黏著性組合物或第2黏著性組合物之任一者所形成。As described above, the adhesive layer 3 in the adhesive sheet 4 is formed by either the first adhesive composition or the second adhesive composition.

第1黏著性組合物能夠自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態。具體而言，第1黏著性組合物能夠藉由光照射，自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態。The first adhesive composition can irreversibly change from a state with a high adhesive force to a state with a low adhesive force. Specifically, the first adhesive composition can irreversibly change from a state with high adhesive force to a state with low adhesive force by light irradiation.

即，若對由此種第1黏著性組合物所形成之黏著層3進行光照射，則光硬化後之黏著層3之黏著力會小於光硬化前之黏著層3之黏著力。That is, if light is irradiated to the adhesive layer 3 formed of such a first adhesive composition, the adhesive force of the adhesive layer 3 after photocuring will be lower than the adhesive force of the adhesive layer 3 before photocuring.

因此，若於下述第5步驟中對黏著層3之一部分照射光，則未被光照射之包含第1黏著性組合物之黏著層3成為高黏著區域10，被光照射之包含第1黏著性組合物之黏著層3成為低黏著區域11。藉此，黏著層3具備高黏著區域10與低黏著區域11。Therefore, if light is irradiated to a part of the adhesive layer 3 in the fifth step below, the adhesive layer 3 containing the first adhesive composition that has not been irradiated by the light becomes the high-adhesion region 10, and the light irradiated includes the first adhesive The adhesive layer 3 of the sexual composition becomes the low adhesive area 11. Thereby, the adhesion layer 3 has a high adhesion area 10 and a low adhesion area 11.

並且，未被光照射之黏著層3之黏著力(高黏著區域10之黏著力)例如為5 N/25 mm以上，較佳為8 N/25 mm以上，更佳為10 N/25 mm以上，進而較佳為12 N/25 mm以上。In addition, the adhesive force of the adhesive layer 3 that is not irradiated by light (the adhesive force of the high adhesion area 10) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, and more preferably 10 N/25 mm or more , And more preferably 12 N/25 mm or more.

又，被光照射之黏著層3之黏著力(低黏著區域11之黏著力)例如為4 N/25 mm以下，較佳為3 N/25 mm以上。In addition, the adhesive force of the adhesive layer 3 irradiated by light (the adhesive force of the low-adhesion area 11) is, for example, 4 N/25 mm or less, preferably 3 N/25 mm or more.

若高黏著區域10之黏著力為上述下限以上，則可使高黏著區域10以貼合於被接著體5之狀態殘存，而與所對應之基材2一起用於被接著體5之補強。If the adhesive force of the high-adhesion area 10 is greater than the above lower limit, the high-adhesion area 10 can be left in a state of being attached to the adherend 5 and used for the reinforcement of the adherend 5 together with the corresponding base material 2.

又，若低黏著區域11之黏著力為上述上限以下，則可容易地將低黏著區域11與所對應之基材2一起自中間積層體1去除。Moreover, if the adhesive force of the low-adhesion region 11 is below the above upper limit, the low-adhesion region 11 can be easily removed from the intermediate laminate 1 together with the corresponding base material 2.

再者，關於上述黏著力，詳情將於下述實施例中進行敍述，其係藉由將黏著片材4以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/分鐘進行180度剝離試驗而進行測定。Furthermore, regarding the above-mentioned adhesive force, details will be described in the following example, which is performed by attaching the adhesive sheet 4 to the polyimide film at 25°C and performing 180° at a peeling speed of 300 mm/min. It is measured by a peel test.

又，未被光照射之黏著層3於25℃下之剪切儲存模數G'例如為6×104 Pa以上，較佳為7×104 Pa以上，又，例如為9×104 Pa以下，較佳為8×104 Pa以下。Furthermore, the shear storage modulus G'of the adhesive layer 3 not irradiated by light at 25°C is, for example, 6×10 4 Pa or more, preferably 7×10 4 Pa or more, and, for example, 9×10 4 Pa Below, it is preferably 8×10 4 Pa or less.

又，被光照射之黏著層3於25℃下之剪切儲存模數G'為2.00×106 Pa以上，較佳為2.50×106 Pa以上，更佳為3.0×106 Pa以上。In addition, the shear storage modulus G′ of the adhesive layer 3 irradiated by light at 25° C. is 2.00×10 6 Pa or more, preferably 2.50×10 6 Pa or more, and more preferably 3.0×10 6 Pa or more.

再者，關於上述剪切儲存模數G'，詳情將於下述實施例中進行敍述，其係藉由在頻率1 Hz、升溫速度5℃/分鐘、溫度範圍-50℃～150℃之條件下之動態黏彈性測定而測定。Furthermore, regarding the above-mentioned shear storage modulus G', the details will be described in the following embodiment, which is based on the conditions of a frequency of 1 Hz, a heating rate of 5°C/min, and a temperature range of -50°C to 150°C The following dynamic viscoelasticity measurement is determined.

另一方面，第2黏著性組合物能夠自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態。具體而言，第2黏著性組合物能夠藉由光照射自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態。On the other hand, the second adhesive composition can irreversibly change from a state with a low adhesive force to a state with a high adhesive force. Specifically, the second adhesive composition can irreversibly change from a state with a low adhesive force to a state with a high adhesive force by light irradiation.

即，若對由第2黏著性組合物所形成之黏著層3進行光照射，則光硬化後之黏著層3之黏著力會大於光硬化前之黏著層3之黏著力。That is, if the adhesive layer 3 formed of the second adhesive composition is irradiated with light, the adhesive force of the adhesive layer 3 after photocuring will be greater than the adhesive force of the adhesive layer 3 before photocuring.

因此，若於下述第5步驟中對黏著層3之一部分照射光，則未被光照射之包含第2黏著性組合物之黏著層3成為低黏著區域11，被光照射之包含第2黏著性組合物之黏著層3成為高黏著區域10。藉此，黏著層3具備高黏著區域10與低黏著區域11。Therefore, if light is irradiated to a part of the adhesive layer 3 in the fifth step below, the adhesive layer 3 containing the second adhesive composition that has not been irradiated by the light becomes the low-adhesion area 11, and the light irradiated includes the second adhesive The adhesive layer 3 of the sexual composition becomes a high adhesive area 10. Thereby, the adhesion layer 3 has a high adhesion area 10 and a low adhesion area 11.

並且，被光照射之黏著層3之黏著力(高黏著區域10之黏著力)例如為5 N/25 mm以上，較佳為8 N/25 mm以上，更佳為10 N/25 mm以上，進而較佳為12 N/25 mm以上。Moreover, the adhesive force of the adhesive layer 3 irradiated by light (the adhesive force of the high-adhesion area 10) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, and more preferably 10 N/25 mm or more, More preferably, it is 12 N/25 mm or more.

又，未被光照射之黏著層3之黏著力(低黏著區域11之黏著力)例如為4 N/25 mm以下，較佳為1 N/25 mm以下。In addition, the adhesive force of the adhesive layer 3 (the adhesive force of the low-adhesion region 11) not irradiated by light is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less.

若高黏著區域10之黏著力為上述下限以上，則可使高黏著區域10以貼合於被接著體5狀態殘存，而與所對應之基材2一起用於被接著體5之補強。If the adhesive force of the high-adhesion area 10 is greater than the above lower limit, the high-adhesion area 10 can be left in a state of being attached to the adherend 5 and used for the reinforcement of the adherend 5 together with the corresponding substrate 2.

又，若低黏著區域11之黏著力為上述上限以下，則可容易地將低黏著區域11與所對應之基材2一起自中間積層體1去除。Moreover, if the adhesive force of the low-adhesion region 11 is below the above upper limit, the low-adhesion region 11 can be easily removed from the intermediate laminate 1 together with the corresponding base material 2.

又，未被光照射之黏著層3於25℃下之剪切儲存模數G'例如為1×104 Pa以上，較佳為5×104 Pa以上，又，例如為1.2×105 Pa以下，較佳為1×105 Pa以下。Furthermore, the shear storage modulus G'of the adhesive layer 3 not irradiated by light at 25°C is, for example, 1×10 4 Pa or more, preferably 5×10 4 Pa or more, and, for example, 1.2×10 5 Pa Below, it is preferably 1×10 5 Pa or less.

又，被光照射之黏著層3於25℃下之剪切儲存模數G'例如為1.00×105 Pa以上，較佳為1.3×105 Pa以上，更佳為1.5×105 Pa以上，又，例如為1.0×106 Pa以下。In addition, the shear storage modulus G'of the adhesive layer 3 irradiated by light at 25°C is, for example, 1.00×10 5 Pa or more, preferably 1.3×10 5 Pa or more, more preferably 1.5×10 5 Pa or more, Also, for example, it is 1.0×10 6 Pa or less.

又，如圖2C所示，黏著片材4亦可視需要於黏著層3之一面積層剝離膜6。In addition, as shown in FIG. 2C, the adhesive sheet 4 may also peel off the film 6 on an area of the adhesive layer 3 as needed.

於此種情形時，黏著片材4依序具備基材2、黏著層3及剝離膜6。In this case, the adhesive sheet 4 includes a base material 2, an adhesive layer 3, and a release film 6 in this order.

作為剝離膜6，例如可列舉聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等可撓性塑膠膜。Examples of the release film 6 include flexible plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films.

剝離膜6之厚度例如為3 μm以上，較佳為10 μm以上，又，例如為200 μm以下，較佳為100 μm以下，更佳為50 μm以下。The thickness of the release film 6 is, for example, 3 μm or more, preferably 10 μm or more, and for example, 200 μm or less, preferably 100 μm or less, and more preferably 50 μm or less.

對於剝離膜6，較佳為實施藉由聚矽氧系、氟系、長鏈烷基系、脂肪酸醯胺系等離型劑進行之離型處理、或藉由矽粉進行之離型處理。For the release film 6, it is preferable to perform a release treatment with a silicone-based, fluorine-based, long-chain alkyl-based, fatty acid amide-based release agent, or a release treatment with silicon powder.

3.被接著體 被接著體5係由黏著片材4補強之被補強體，例如可列舉光學器件、電子器件及其構成零件等。3. Subsequent body The adherend body 5 is a reinforced body reinforced by the adhesive sheet 4, and examples thereof include optical devices, electronic devices, and their constituent parts.

再者，圖1中，被接著體5具有平板形狀，但被接著體5之形狀並無特別限定，可根據光學器件、電子器件及其構成零件之種類選擇各種形狀。In addition, in FIG. 1, the bonded body 5 has a flat plate shape, but the shape of the bonded body 5 is not particularly limited, and various shapes can be selected according to the types of optical devices, electronic devices and their constituent parts.

4.中間積層體之製造方法 參照圖3及圖4對中間積層體1之製造方法之一實施形態進行說明。4. Manufacturing method of intermediate laminate An embodiment of the manufacturing method of the intermediate laminate 1 will be described with reference to FIGS. 3 and 4.

該中間積層體1之製造方法包括如下步驟：準備黏著片材4(第3步驟)；將被接著體5配置於黏著片材4之一面(第4步驟)；及藉由對黏著層3之一部分進行光照射，於黏著層3形成經光照射之照射部分7、與未經光照射之非照射部分8，而使照射部分7及非照射部分8中之任一者成為包含黏著力較高之狀態之黏著性組合物之高黏著區域10，另一者成為包含黏著力較低之狀態之黏著性組合物之低黏著區域11(第5步驟)。The manufacturing method of the intermediate laminate 1 includes the following steps: preparing the adhesive sheet 4 (the third step); arranging the adherend 5 on one side of the adhesive sheet 4 (the fourth step); and by contrasting the adhesive layer 3 A part is irradiated with light, and an irradiated part 7 irradiated with light and a non-irradiated part 8 not irradiated with light are formed on the adhesive layer 3, so that any one of the irradiated part 7 and the non-irradiated part 8 includes a higher adhesive force The high-adhesion area 10 of the adhesive composition in the state of, and the other becomes the low-adhesion area 11 of the adhesive composition in the state of lower adhesion (Step 5).

於第5步驟中，照射部分7及非照射部分8中之一者成為高黏著區域10，另一者成為低黏著區域11，但憑藉黏著層3係由第1黏著性組合物或第2黏著性組合物之何種所形成，而決定照射部分7及非照射部分8中何者成為高黏著區域10或低黏著區域11。In the fifth step, one of the irradiated part 7 and the non-irradiated part 8 becomes the high-adhesion area 10, and the other becomes the low-adhesion area 11, but the adhesive layer 3 is made of the first adhesive composition or the second adhesive What kind of sexual composition is formed determines which of the irradiated part 7 and the non-irradiated part 8 becomes the high adhesion area 10 or the low adhesion area 11.

因此，分為藉由第1黏著性組合物形成黏著層3之情形、與藉由第2黏著性組合物形成黏著層3之情形，進行以下說明。Therefore, it is divided into a case where the adhesive layer 3 is formed by the first adhesive composition and a case where the adhesive layer 3 is formed by the second adhesive composition, and the following description will be given.

4-1.藉由第1黏著性組合物形成黏著層之中間積層體之製造方法 第一，參照圖3對藉由第1黏著性組合物形成黏著層3之中間積層體1之製造方法(製法1)進行說明。4-1. Manufacturing method of an intermediate laminate in which an adhesive layer is formed from the first adhesive composition First, with reference to FIG. 3, the manufacturing method (manufacturing method 1) of the intermediate laminated body 1 which forms the adhesive layer 3 from the 1st adhesive composition is demonstrated.

於第3步驟中，如圖3A所示，準備黏著片材4。In the third step, as shown in FIG. 3A, the adhesive sheet 4 is prepared.

其次，於第4步驟中，如圖3B所示，以配置於基材2之一面之黏著層3與被接著體5接觸之方式將黏著片材4貼合於被接著體5。Next, in the fourth step, as shown in FIG. 3B, the adhesive sheet 4 is attached to the adherend 5 in such a manner that the adhesive layer 3 arranged on one surface of the substrate 2 contacts the adherend 5.

其次，於第5步驟中，如圖3C所示，藉由對黏著層3之一部分照射光，而形成高黏著區域10與低黏著區域11。Secondly, in the fifth step, as shown in FIG. 3C, by irradiating a part of the adhesive layer 3 with light, the high adhesion area 10 and the low adhesion area 11 are formed.

再者，於以下說明中，將黏著片材4沿面方向三等分，並將其中之兩端部分之2處設為非照射部分8(換言之，將黏著片材4沿面方向三等分，僅其中之中央部分之1處為照射部分7)進行說明。Furthermore, in the following description, the adhesive sheet 4 is divided into three equal parts along the surface direction, and two of the two end portions thereof are designated as non-irradiated parts 8 (in other words, the adhesive sheet 4 is divided into three equal parts along the surface direction, and only One of the central parts is the irradiation part 7) for description.

於第5步驟中，在黏著片材4中，對照射部分7照射光，對非照射部分8不照射光。In the fifth step, in the adhesive sheet 4, the irradiated portion 7 is irradiated with light, and the non-irradiated portion 8 is not irradiated with light.

具體而言，對照射部分7不配置遮罩9，對非照射部分8配置將光阻斷之遮罩9。Specifically, the mask 9 is not arranged for the irradiated part 7 and the mask 9 for blocking light is arranged for the non-irradiated part 8.

如上所述，若對由第1黏著性組合物所形成之黏著層3進行光照射而使其光硬化，則光硬化後之黏著層3之黏著力會小於光硬化前之黏著層3之黏著力。As described above, if the adhesive layer 3 formed from the first adhesive composition is irradiated with light to cause it to be photocured, the adhesive force of the adhesive layer 3 after photocuring will be lower than that of the adhesive layer 3 before photocuring force.

即，照射部分7中之黏著層3之黏著力降低，另一方面，非照射部分8中之黏著層3不發生黏著力之降低，而在仍保持強黏著力之狀態下殘留。That is, the adhesive force of the adhesive layer 3 in the irradiated part 7 is reduced. On the other hand, the adhesive layer 3 in the non-irradiated part 8 does not decrease in adhesive force, but remains while still maintaining a strong adhesive force.

如此，照射部分7相較於非照射部分8，黏著力相對地變低，因此照射部分7(具體而言為包含狀態變化後(光硬化後)之第1黏著性組合物之黏著層3)成為低黏著區域11，非照射部分8(具體而言為包含狀態變化前(光硬化前)之第1黏著性組合物之黏著層3)成為高黏著區域10。In this way, the irradiated part 7 has a relatively low adhesive force compared to the non-irradiated part 8, so the irradiated part 7 (specifically, the adhesive layer 3 including the first adhesive composition after the state change (after photocuring)) It becomes the low-adhesion area 11, and the non-irradiated portion 8 (specifically, the adhesive layer 3 including the first adhesive composition before the state change (before photocuring)) becomes the high-adhesion area 10.

藉此，獲得具備高黏著區域10與低黏著區域11之黏著層3。又，獲得依序具備黏著片材4與被接著體5(換言之，依序具備基材2、黏著層3及被接著體5)之中間積層體1。In this way, an adhesive layer 3 having a high adhesion area 10 and a low adhesion area 11 is obtained. Moreover, the intermediate laminated body 1 provided with the adhesive sheet 4 and the adherend body 5 in this order (in other words, the base material 2, the adhesive layer 3, and the adherend body 5 in this order) was obtained.

圖3中，基材2具有平板形狀，因此可於基材2之上表面之任意部分配置遮罩9，但存在根據基材2之形狀而難以於特定部分配置遮罩9之情況。於是，存在將難以配置遮罩9之部分去除之情況。In FIG. 3, the substrate 2 has a flat plate shape, so the mask 9 can be arranged on any part of the upper surface of the substrate 2. However, depending on the shape of the substrate 2, it may be difficult to arrange the mask 9 on a specific part. Therefore, there are cases where the part where it is difficult to arrange the mask 9 is removed.

於此種情形時，於藉由第2黏著性組合物形成黏著層3之中間積層體1中，配置遮罩9之非照射部分8成為低黏著區域11，即，需要於難以配置遮罩9之部分配置遮罩9，因此作業變得繁雜，但，於藉由第1黏著性組合物形成黏著層3之中間積層體1中，未配置遮罩9之照射部分7成為低黏著區域11，即，無需於難以配置遮罩9之部分配置遮罩9而可於其以外之部分配置遮罩9，因此作業變得簡便。In this case, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the second adhesive composition, the non-irradiated portion 8 where the mask 9 is arranged becomes the low adhesion area 11, that is, it is necessary to place the mask 9 where it is difficult to arrange the mask 9 Since the mask 9 is arranged in the part, the work becomes complicated. However, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the first adhesive composition, the irradiated part 7 without the mask 9 becomes the low adhesion area 11. That is, it is not necessary to arrange the mask 9 in a part where it is difficult to arrange the mask 9 and the mask 9 can be arranged in a part other than that, so the work becomes simple.

4-2.藉由第2黏著性組合物形成黏著層之中間積層體之製造方法 第二，參照圖4對藉由第2黏著性組合物形成黏著層3之中間積層體1之製造方法(製法2)進行說明。4-2. Method of manufacturing an intermediate laminate in which the adhesive layer is formed from the second adhesive composition Second, referring to FIG. 4, a method for manufacturing the intermediate laminate 1 (manufacturing method 2) in which the adhesive layer 3 is formed from the second adhesive composition will be described.

於第3步驟中，如圖4A所示，準備黏著片材4。In the third step, as shown in FIG. 4A, the adhesive sheet 4 is prepared.

其次，於第4步驟中，如圖4B所示，以配置於基材2之一面之黏著層3與被接著體5接觸之方式將黏著片材4貼合於被接著體5。Next, in the fourth step, as shown in FIG. 4B, the adhesive sheet 4 is attached to the adherend 5 in such a manner that the adhesive layer 3 arranged on one surface of the substrate 2 contacts the adherend 5.

其次，於第5步驟中，如圖4C所示，藉由對黏著層3之一部分照射光，而形成高黏著區域10與低黏著區域11。Next, in the fifth step, as shown in FIG. 4C, by irradiating a part of the adhesive layer 3 with light, the high-adhesion area 10 and the low-adhesion area 11 are formed.

再者，於以下說明中，將黏著片材4沿面方向三等分，並將其中之兩端部分之2處設為照射部分7(換言之，將黏著片材4沿面方向三等分，僅其中之中央部分之1處為非照射部分8)進行說明。Furthermore, in the following description, the adhesive sheet 4 is divided into three halves in the plane direction, and two of the two end portions are set as the irradiated portions 7 (in other words, the adhesive sheet 4 is divided into three halves in the plane direction. One of the central parts is the non-irradiated part 8).

於第5步驟中，於黏著片材4中，對照射部分7照射光，對非照射部分8不照射光。In the fifth step, in the adhesive sheet 4, the irradiated part 7 is irradiated with light, and the non-irradiated part 8 is not irradiated with light.

具體而言，對照射部分7不配置遮罩9，對非照射部分8配置將光阻斷之遮罩9。Specifically, the mask 9 is not arranged for the irradiated part 7 and the mask 9 for blocking light is arranged for the non-irradiated part 8.

如上所述，若對由第2黏著性組合物所形成之黏著層3進行光照射而使其光硬化，則光硬化後之黏著層3之黏著力會大於光硬化前之黏著層3之黏著力。As described above, if the adhesive layer 3 formed from the second adhesive composition is irradiated with light to cause it to be photocured, the adhesive force of the adhesive layer 3 after photocuring will be greater than that of the adhesive layer 3 before photocuring force.

即，照射部分7中之黏著層3之黏著力提高，另一方面，非照射部分8中之黏著層3不發生黏著力之提高。That is, the adhesive force of the adhesive layer 3 in the irradiated part 7 is improved, on the other hand, the adhesive force of the adhesive layer 3 in the non-irradiated part 8 is not improved.

如此，照射部分7相較於非照射部分8，黏著力相對地變高，因此照射部分7(具體而言為包含狀態變化後(光硬化後)之第2黏著性組合物之黏著層3)成為高黏著區域10，非照射部分8(具體而言為包含狀態變化前(光硬化前)之第2黏著性組合物之黏著層3)成為低黏著區域11。In this way, the irradiated part 7 has a relatively higher adhesive force than the non-irradiated part 8, so the irradiated part 7 (specifically, the adhesive layer 3 including the second adhesive composition after the state change (after photocuring)) It becomes the high-adhesion area 10, and the non-irradiated portion 8 (specifically, the adhesive layer 3 including the second adhesive composition before the state change (before photocuring)) becomes the low-adhesion area 11.

藉此，獲得具備高黏著區域10與低黏著區域11之黏著層3。又，獲得依序具備黏著片材4與被接著體5(換言之，依序具備基材2、黏著層3及被接著體5)之中間積層體1。In this way, an adhesive layer 3 having a high adhesion area 10 and a low adhesion area 11 is obtained. Moreover, the intermediate laminated body 1 provided with the adhesive sheet 4 and the adherend body 5 in this order (in other words, the base material 2, the adhesive layer 3, and the adherend body 5 in this order) was obtained.

圖4中，基材2具有平板形狀，因此可於基材2之上表面之任意部分配置遮罩9，但存在根據基材2之形狀而難以於特定部分配置遮罩9之情況。於是，存在使難以配置遮罩9之部分殘存之情況。In FIG. 4, the substrate 2 has a flat plate shape, so the mask 9 can be arranged on any part of the upper surface of the substrate 2. However, depending on the shape of the substrate 2, it may be difficult to arrange the mask 9 on a specific part. Therefore, there are cases where the part where it is difficult to arrange the mask 9 remains.

於此種情況下，於藉由第1黏著性組合物形成黏著層3之中間積層體1中，未配置遮罩9之非照射部分8成為高黏著區域10，即，需要於難以配置遮罩9之部分配置遮罩9，因此作業變得繁雜，但，於藉由第2黏著性組合物形成黏著層3之中間積層體1中，未配置遮罩9之非照射部分8成為高黏著區域10，即，無需於難以配置遮罩9之部分配置遮罩9而可於其以外之部分配置遮罩9，因此作業變得簡便。In this case, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the first adhesive composition, the non-irradiated portion 8 where the mask 9 is not arranged becomes the high adhesion area 10, that is, it is necessary to make it difficult to arrange the mask The mask 9 is arranged in the part of 9 and the work becomes complicated. However, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the second adhesive composition, the non-irradiated part 8 where the mask 9 is not arranged becomes a high adhesion area 10. That is, it is not necessary to arrange the mask 9 in the part where it is difficult to arrange the mask 9 but the mask 9 can be arranged in the other part, so the operation becomes simple.

5.中間積層體及中間積層體之製造方法之作用效果 中間積層體1之黏著層3包含能夠不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物。5. The effect of the intermediate laminate and the manufacturing method of the intermediate laminate The adhesive layer 3 of the intermediate laminate 1 includes an adhesive composition that can irreversibly change into a state with high adhesive force and a state with low adhesive force.

因此，藉由狀態變化(光硬化)，可形成包含黏著力較高之狀態之黏著性組合物之高黏著區域10、及包含黏著力較低之狀態之黏著性組合物之低黏著區域11。Therefore, by the state change (light curing), a high-adhesion area 10 including an adhesive composition in a state with higher adhesive force and a low-adhesion area 11 including an adhesive composition in a state with lower adhesive force can be formed.

即，該中間積層體1可藉由自同一組成之黏著性組合物形成高黏著區域10及低黏著區域11而一併具有高黏著區域10與低黏著區域11，而非藉由自黏著力較高之黏著性組合物形成高黏著區域10，自黏著力較低之黏著性組合物形成低黏著區域11，而一併具有該等區域。That is, the intermediate laminate 1 can form the high-adhesion area 10 and the low-adhesion area 11 from the adhesive composition of the same composition, and have both the high-adhesion area 10 and the low-adhesion area 11, instead of having higher self-adhesive strength. The high-adhesive composition forms a high-adhesive area 10, and the self-adhesive composition forms a low-adhesive area 11, and these areas are also present.

並且，中間積層體1之黏著層3由於具備高黏著區域10與低黏著區域11，因此可使高黏著區域10以貼合於被接著體5之狀態殘存，而與所對應之基材2一起用於被接著體5之補強，另一方面，可將低黏著區域11與所對應之基材2一起自被接著體5去除。In addition, since the adhesive layer 3 of the intermediate laminate 1 has a high-adhesion area 10 and a low-adhesion area 11, the high-adhesion area 10 can be left in a state of being attached to the adherend 5, together with the corresponding substrate 2 It is used for the reinforcement of the adherend 5, on the other hand, the low adhesion area 11 and the corresponding base material 2 can be removed from the adherend 5 together.

其結果為，可獲得被接著體5經補強之製品積層體12(下述)。As a result, a product laminate 12 (described below) in which the adherend 5 is reinforced can be obtained.

中間積層體1之製造方法包括藉由對黏著層3之一部分照射光而形成高黏著區域10與低黏著區域11之第5步驟。The manufacturing method of the intermediate laminate 1 includes a fifth step of forming a high adhesion area 10 and a low adhesion area 11 by irradiating a part of the adhesion layer 3 with light.

因此，可獲得具備高黏著區域10及低黏著區域11之黏著層。其結果為，可製造具備此種黏著層3之中間積層體1。Therefore, an adhesive layer having a high adhesion area 10 and a low adhesion area 11 can be obtained. As a result, the intermediate laminate 1 provided with such an adhesive layer 3 can be manufactured.

又，於該中間積層體1之製造方法中，藉由光照射使黏著性組合物局部地光硬化，而形成高黏著區域10及低黏著區域11。Moreover, in the manufacturing method of this intermediate laminated body 1, the adhesive composition is locally photocured by light irradiation, and the high adhesion area 10 and the low adhesion area 11 are formed.

因此，與藉由加熱而使黏著性組合物熱硬化之情形相比，可抑制被接著體5之由熱造成之損傷。Therefore, compared with the case where the adhesive composition is thermally hardened by heating, damage to the adherend 5 due to heat can be suppressed.

6.製品積層體及製品積層體之製造方法 製品積層體12係最終形態之器件或該器件之構成零件。6. Product laminate and method of manufacturing product laminate The product laminate 12 is a device in its final form or a component part of the device.

製品積層體12係藉由自上述中間積層體1去除低黏著區域11而製造。The product laminate 12 is manufactured by removing the low-adhesion region 11 from the intermediate laminate 1 described above.

具體而言，製品積層體12係藉由製品積層體之製造方法而製造，該積層體之製造方法包括：準備藉由上述中間積層體11之製造方法而製造之中間積層體1之第6步驟、及去除黏著層3中之低黏著區域11之第7步驟。Specifically, the product layered body 12 is manufactured by a method of manufacturing a product layered body, and the method of manufacturing the layered body includes: the sixth step of preparing the intermediate layered body 1 manufactured by the above-mentioned method of manufacturing the intermediate layered body 11 , And the seventh step of removing the low adhesion area 11 in the adhesion layer 3.

參照圖5，對製品積層體12之製造方法之一實施形態進行說明。5, an embodiment of a method of manufacturing the product laminate 12 will be described.

於第6步驟中，如圖5A所示，藉由利用第1黏著性組合物形成黏著層3之中間積層體1之製造方法(製法1)、或利用第2黏著性組合物形成黏著層3之中間積層體1之製造方法(製法2)製造中間積層體1，而準備中間積層體1。In the sixth step, as shown in FIG. 5A, a method for manufacturing an intermediate laminate 1 (manufacturing method 1) using a first adhesive composition to form an adhesive layer 3, or a second adhesive composition to form an adhesive layer 3 The manufacturing method of the intermediate laminated body 1 (the manufacturing method 2) manufactures the intermediate laminated body 1, and the intermediate laminated body 1 is prepared.

於第7步驟中，如圖5B所示，自中間積層體1去除低黏著區域11。In the seventh step, as shown in FIG. 5B, the low adhesion area 11 is removed from the intermediate laminate 1.

具體而言，將包含高黏著區域10及與其對應之基材2之殘存部分13、與包含低黏著區域11及與其對應之基材2之去除部分14例如藉由CO2 雷射等進行切割，然後僅將去除部分14以去除部分14之端部作為起點進行剝離。Specifically, the remaining part 13 including the high-adhesion area 10 and the corresponding substrate 2 and the removed part 14 including the low-adhesion area 11 and the corresponding substrate 2 are cut by, for example, CO 2 lasers. Then, only the removed portion 14 is peeled off with the end of the removed portion 14 as the starting point.

此時，去除部分14中之低黏著區域11之黏著力降低，因此可容易地自中間積層體1將去除部分14剝離。At this time, the adhesive force of the low-adhesion region 11 in the removed part 14 is reduced, so the removed part 14 can be easily peeled from the intermediate laminate 1.

另一方面，殘存部分13中之高黏著區域10之黏著力未降低，具有上述較高之黏著力，因此殘存部分13殘存於中間積層體1。On the other hand, the adhesive force of the high-adhesion area 10 in the remaining portion 13 does not decrease, and has the above-mentioned higher adhesive force, so the remaining portion 13 remains in the intermediate laminated body 1.

又，高黏著區域10由於具有上述較高之黏著力，因此即便將去除部分14剝離，亦可抑制與去除部分14相接之殘存部分13之端部發生***。In addition, since the high-adhesion region 10 has the above-mentioned high adhesive force, even if the removed portion 14 is peeled off, the end of the remaining portion 13 which is in contact with the removed portion 14 can be suppressed from bulging.

於是，殘存部分13可直接用於被接著體5之補強。Therefore, the remaining part 13 can be directly used for the reinforcement of the adherend 5.

藉此，獲得製品積層體12。In this way, the product laminate 12 is obtained.

7.製品積層體之製造方法之作用效果 製品積層體12之製造方法包括第7步驟，其係將藉由上述中間積層體之製造方法(藉由第1黏著性組合物形成黏著層3之中間積層體1之製造方法(製法1)或藉由第2黏著性組合物形成黏著層3之中間積層體1之製造方法(製法2))而製造之中間積層體1中之黏著層3之低黏著區域11去除。7. The effect of the manufacturing method of the product laminate The manufacturing method of the product layered body 12 includes the seventh step, which is to use the above-mentioned manufacturing method of the intermediate layered body (the manufacturing method of the intermediate layered body 1 in which the adhesive layer 3 is formed from the first adhesive composition (the manufacturing method 1)) or The low-adhesion region 11 of the adhesive layer 3 in the intermediate laminate 1 manufactured by the manufacturing method (manufacturing method 2)) of the adhesive layer 3 formed by the second adhesive composition is removed.

低黏著區域11中之黏著力較低，因此可將去除部分14自中間積層體1容易地去除。The adhesive force in the low-adhesion area 11 is low, so the removed portion 14 can be easily removed from the intermediate laminate 1.

另一方面，殘存部分13可殘存於中間積層體1而補強被接著體5。On the other hand, the remaining portion 13 can remain in the intermediate laminate 1 to reinforce the adherend 5.

又，藉由殘存部分13而賦予適度之剛性，因此處理性提高。In addition, the remaining portion 13 imparts moderate rigidity, so that the handling properties are improved.

尤其於被接著體5為電子器件之情形時，電子器件有隨著高積體化、小型輕量化及構成零件之薄型化而電子器件之構成零件之厚度變小之傾向。因該薄型化，而容易於構成零件之積層界面產生起因於應力之彎曲或捲曲。又，因薄型化，而容易產生因自身重量導致之撓曲。Particularly when the bonded body 5 is an electronic device, the electronic device tends to have a smaller thickness with the increase in integration, size and weight reduction, and thinning of the constituent parts. Due to this thinning, bending or curling due to stress is likely to occur at the laminated interface of the constituent parts. Also, due to the thinning, it is prone to bend due to its own weight.

即便於此種情形時，根據該黏著片材4，亦可藉由殘存部分13對電子器件賦予剛性，因此可抑制因應力或自身重量等導致之彎曲、捲曲、撓曲等，從而提高處理性。Even in this case, according to the adhesive sheet 4, the remaining portion 13 can impart rigidity to the electronic device, so bending, curling, and bending due to stress or its own weight can be suppressed, thereby improving handling .

又，於在電子器件之製造步驟中藉由經自動化之裝置進行搬送或加工之情形時，存在電子器件之構成零件與搬送臂及銷等構件接觸，導致構成零件破損之情況。In addition, when the electronic device is transported or processed by an automated device in the manufacturing step of the electronic device, the component parts of the electronic device may come into contact with the components such as the transport arm and pins, causing the component parts to be damaged.

尤其於經高積體化、小型輕量化及薄型化之器件中，存在於搬送裝置等之接觸或切斷加工時產生因局部應力之集中導致之破損或尺寸變化之情況。Especially in devices that have been increased in size, size, weight, and thickness, there are cases where damage or dimensional changes due to local stress concentration occur during contact or cutting processing of conveying equipment.

即便於此種情形時，根據該黏著片材4，亦可藉由殘存部分13賦予適度之剛性，並且對應力加以緩和、分散，而抑制龜裂、破裂、剝落、尺寸變化等。Even in this case, according to the adhesive sheet 4, the remaining portion 13 can provide moderate rigidity, and the stress can be alleviated and dispersed, so that cracks, cracks, peeling, dimensional changes, etc. can be suppressed.

8.變化例 低黏著區域11之形狀並無特別限定，例如亦可為十字形(圖6)、圓形(圖7)。8. Variations The shape of the low-adhesion area 11 is not particularly limited. For example, it may also be a cross (FIG. 6) or a circle (FIG. 7).

參照圖6，對低黏著區域11為十字形(具體而言為包括黏著片材4之面之兩端之十字形狀)之情形進行說明。6, the case where the low adhesion area 11 is a cross shape (specifically, a cross shape including both ends of the surface of the adhesive sheet 4) will be described.

於第6步驟中，如圖6A所示，藉由利用第1黏著性組合物形成黏著層3之中間積層體1之製造方法(製法1)、或利用第2黏著性組合物形成黏著層3之中間積層體1之製造方法(製法2)製造中間積層體1，而準備中間積層體1。In the sixth step, as shown in FIG. 6A, the manufacturing method of the intermediate laminate 1 (manufacturing method 1) using the first adhesive composition to form the adhesive layer 3, or the second adhesive composition to form the adhesive layer 3 The manufacturing method of the intermediate laminated body 1 (the manufacturing method 2) manufactures the intermediate laminated body 1, and the intermediate laminated body 1 is prepared.

如圖6A所示，於中間積層體1中，低黏著區域11為十字形，高黏著區域10成為十字形以外之部分。As shown in FIG. 6A, in the intermediate laminated body 1, the low adhesion area 11 has a cross shape, and the high adhesion area 10 becomes a part other than the cross shape.

其次，於第7步驟中，如圖6B所示，藉由上述方法自中間積層體1去除低黏著區域11(去除部分14)。Next, in the seventh step, as shown in FIG. 6B, the low adhesion region 11 (removed portion 14) is removed from the intermediate laminate 1 by the above-mentioned method.

藉此，獲得製品積層體12。In this way, the product laminate 12 is obtained.

又，於上述說明中，在第7步驟中，以去除部分14之端部為起點自中間積層體1將去除部分14剝離，但其中存在難以使去除部分14之端部成為起點之情況。In addition, in the above description, in the seventh step, the removed portion 14 is peeled off from the intermediate laminate 1 with the end of the removed portion 14 as a starting point. However, it may be difficult to make the end of the removed portion 14 a starting point.

具體而言，如圖7A所示，於低黏著區域11在黏著片材4中且在黏著片材4之中央部為圓形之情形時，去除部分14不包含黏著片材4之面之端部，因此難以將去除部分14之端部作為起點而將去除部分14剝離。Specifically, as shown in FIG. 7A, when the low-adhesion area 11 is in the adhesive sheet 4 and the central part of the adhesive sheet 4 is circular, the removed portion 14 does not include the end of the surface of the adhesive sheet 4 Therefore, it is difficult to peel off the removed portion 14 using the end of the removed portion 14 as a starting point.

但，於該情形時，如圖7B所示，藉由在第7步驟中利用黏著滾筒15來黏著去除部分14，可將去除部分14剝離。However, in this case, as shown in FIG. 7B, by adhering the removed portion 14 with the adhesive roller 15 in the seventh step, the removed portion 14 can be peeled off.

如此，根據該中間積層體1，可將任意部分去除。 [實施例]In this way, according to the intermediate laminate 1, arbitrary parts can be removed. [Example]

以下，示出實施例及比較例，更具體地說明本發明。再者，本發明不受實施例及比較例任何限定。又，以下記載中所使用之調配比率(含有比率)、物性值、參數等具體數值可代替為上述「實施方式」中所記載之與其等對應之調配比率(含有比率)、物性值、參數等該記載之上限值(定義為「以下」、「未達」之數值)或下限值(定義為「以上」、「超過」之數值)。Hereinafter, examples and comparative examples are shown to explain the present invention more specifically. Furthermore, the present invention is not limited in any way by the examples and comparative examples. In addition, specific numerical values such as blending ratios (content ratios), physical property values, and parameters used in the following descriptions can be replaced with blending ratios (content ratios), physical property values, parameters, etc. corresponding to them described in the above-mentioned "embodiment" The upper limit (defined as "below" or "not reached") or lower limit (defined as "above" or "exceeding").

再者，「份」及「%」只要未特別提及，便為質量基準。Furthermore, "parts" and "%" are quality standards as long as they are not specifically mentioned.

1.成分之詳情 將各實施例及各比較例中所使用之各成分記載於以下。1. Details of ingredients Each component used in each Example and each comparative example is described below.

Takenate D110N：苯二甲基二異氰酸酯之三羥甲基丙烷加成體之75%乙酸乙酯溶液，三井化學製造 A-DPH：二季戊四醇六丙烯酸酯；官能基當量96 g/eq APG700：聚丙二醇#700(n=12)二丙烯酸酯；官能基當量404 g/eq A200：聚乙二醇#200(n=4)二丙烯酸酯 Tetrad C：N,N,N',N'-四縮水甘油基-間苯二甲胺(4官能之環氧化合物)，三菱瓦斯化學製造) Irgacure 184：1-羥基環己基苯基酮，BASF製造Takenate D110N: 75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Chemicals A-DPH: Dipentaerythritol hexaacrylate; functional group equivalent 96 g/eq APG700: Polypropylene glycol #700 (n=12) diacrylate; functional group equivalent 404 g/eq A200: Polyethylene glycol #200 (n=4) diacrylate Tetrad C: N,N,N',N'-tetraglycidyl-m-xylylenediamine (4-functional epoxy compound), manufactured by Mitsubishi Gas Chemical) Irgacure 184: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF

2.聚合物之製備 合成例12. Preparation of polymer Synthesis example 1

向具備溫度計、攪拌機、回流冷卻管及氮氣導入管之反應容器中投入作為單體之甲基丙烯酸甲酯(MMA)9重量份、丙烯酸2-乙基己酯(2EHA)63重量份、丙烯酸2-羥基乙酯(HEA)13重量份、N-乙烯基吡咯啶酮(NVP)15重量份、作為聚合起始劑之偶氮雙異丁腈0.2重量份、以及作為溶劑之乙酸乙酯233重量份，通入氮氣，一面攪拌一面進行約1小時氮氣置換。然後，加熱至60℃，反應7小時而獲得重量平均分子量(Mw)為1200000之丙烯酸系聚合物之溶液。9 parts by weight of methyl methacrylate (MMA), 63 parts by weight of 2-ethylhexyl acrylate (2EHA), and 2 parts by weight of acrylic acid were put into a reaction vessel equipped with a thermometer, a stirrer, a reflux cooling tube, and a nitrogen introduction tube. -13 parts by weight of hydroxyethyl (HEA), 15 parts by weight of N-vinylpyrrolidone (NVP), 0.2 parts by weight of azobisisobutyronitrile as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent Then, let in nitrogen gas, and perform nitrogen replacement for about 1 hour while stirring. Then, it heated to 60 degreeC, and reacted for 7 hours, and obtained the solution of the acrylic polymer with a weight average molecular weight (Mw) of 1.2 million.

合成例2 將單體變更為丙烯酸丁酯95重量份、丙烯酸5重量份，除此以外，與合成例1同樣地進行聚合，而獲得重量平均分子量(Mw)為600000之丙烯酸系聚合物之溶液。Synthesis Example 2 Except having changed the monomers to 95 parts by weight of butyl acrylate and 5 parts by weight of acrylic acid, polymerization was carried out in the same manner as in Synthesis Example 1 to obtain a solution of an acrylic polymer having a weight average molecular weight (Mw) of 600,000.

3.黏著性組合物之製備 製備例1(第1黏著性組合物之製備)3. Preparation of adhesive composition Preparation Example 1 (Preparation of the first adhesive composition)

向合成例1之丙烯酸系聚合物溶液中添加相對於聚合物之固形物成分100重量份為2.5質量份之Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成體之75%乙酸乙酯溶液，三井化學製造)作為交聯劑，添加相對於聚合物之固形物成分100重量份為20質量份之A-DPH(二季戊四醇六丙烯酸酯)作為光硬化劑，添加相對於聚合物之固形物成分100重量份為0.1質量份之Irgacure 184(1-羥基環己基苯基酮，BASF公司製造)作為光聚合起始劑，並均勻地混合，而製備第1黏著性組合物。To the acrylic polymer solution of Synthesis Example 1, 2.5 parts by mass of Takenate D110N (75% acetic acid of trimethylolpropane adduct of xylylene diisocyanate) was added to 100 parts by weight of the solid content of the polymer. Ethyl acetate solution, manufactured by Mitsui Chemicals) as a crosslinking agent, 20 parts by mass of A-DPH (dipentaerythritol hexaacrylate) is added as a light hardening agent to 100 parts by weight of the solid content of the polymer, and added to the polymer 100 parts by weight of the solid content is 0.1 parts by weight of Irgacure 184 (1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Corporation) as a photopolymerization initiator and uniformly mixed to prepare the first adhesive composition.

製備例2(第2黏著性組合物之製備) 將光硬化劑變更為APG700(聚丙二醇#700(n=12)二丙烯酸酯)，除此以外，與製備例1同樣地製備第2黏著性組合物。Preparation Example 2 (Preparation of the second adhesive composition) Except having changed the light hardener to APG700 (polypropylene glycol #700 (n=12) diacrylate), the second adhesive composition was prepared in the same manner as in Preparation Example 1.

製備例3(第2黏著性組合物之製備) 向合成例2之丙烯酸系聚合物溶液中添加相對於聚合物之固形物成分100重量份為0.5質量份之Tetrad C(N,N,N',N'-四縮水甘油基-間苯二甲胺(4官能之環氧化合物，三菱瓦斯化學製造))作為交聯劑，添加相對於聚合物之固形物成分100重量份為30質量份之A200(聚乙二醇#200(n=4)二丙烯酸酯)作為光硬化劑，添加相對於聚合物之固形物成分100重量份為0.1質量份之Irgacure 184作為光聚合起始劑，均勻地混合，而製備第2黏著性組合物。Preparation Example 3 (Preparation of the second adhesive composition) To the acrylic polymer solution of Synthesis Example 2 was added 0.5 parts by mass of Tetrad C(N,N,N',N'-tetraglycidyl-isoxylylene with respect to 100 parts by weight of the solid content of the polymer Amine (4-functional epoxy compound, manufactured by Mitsubishi Gas Chemical Co., Ltd.) is used as a cross-linking agent, and 30 parts by weight of A200 (polyethylene glycol #200 (n=4) is added to 100 parts by weight of the solid content of the polymer. Diacrylate) as a light curing agent, 0.1 parts by mass of Irgacure 184 as a photopolymerization initiator with respect to 100 parts by weight of the solid content of the polymer was added and mixed uniformly to prepare a second adhesive composition.

4.黏著片材之製造 製造例1 將未經表面處理之厚度75 μm之聚對苯二甲酸乙二酯膜(東麗製造之「Lumirror S10」)作為基材，於該基材上將製備例1之光硬化性組合物以乾燥後之厚度成為25 μm之方式藉由槽輥進行塗佈。以130℃乾燥1分鐘而去除溶劑。藉此，於基材之一面形成黏著層。進而，於黏著層之一面貼合剝離膜(表面經聚矽氧離型處理之厚度25 μm之聚對苯二甲酸乙二酯膜)之離型處理面。然後，於25℃之氛圍中進行4天熟化處理，使聚合物與交聯劑進行交聯反應。藉此製造黏著片材。4. Manufacture of adhesive sheet Manufacturing example 1 A 75 μm thick polyethylene terephthalate film (“Lumirror S10” manufactured by Toray) without surface treatment was used as a substrate, and the photocurable composition of Preparation Example 1 was dried on the substrate After the thickness becomes 25 μm, it is coated with a grooved roll. The solvent was removed by drying at 130°C for 1 minute. In this way, an adhesive layer is formed on one surface of the substrate. Furthermore, the release treatment surface of a release film (a polyethylene terephthalate film with a thickness of 25 μm on which a silicone release treatment is applied) was attached to one surface of the adhesive layer. Then, the aging treatment was carried out in an atmosphere of 25°C for 4 days to cause the polymer and the crosslinking agent to undergo a crosslinking reaction. In this way, an adhesive sheet is manufactured.

製造例2 將黏著性組合物變更為製備例2之第2黏著性組合物，除此以外，與製造例1同樣地製造黏著片材。Manufacturing example 2 Except having changed the adhesive composition into the second adhesive composition of Production Example 2, the adhesive sheet was produced in the same manner as Production Example 1.

製造例3 將黏著性組合物變更為製備例3之第2黏著性組合物，除此以外，與製造例1同樣地製造黏著片材。Manufacturing example 3 Except having changed the adhesive composition to the second adhesive composition of Production Example 3, the adhesive sheet was produced in the same manner as Production Example 1.

5.中間積層體之製造 實施例1 於自製造例1之黏著片材將剝離膜剝離後，將該黏著片材貼附於厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)。5. Manufacturing of intermediate laminate Example 1 After peeling the release film from the adhesive sheet of Production Example 1, the adhesive sheet was attached to a polyimide film with a thickness of 12.5 μm (“Kapton 50EN” manufactured by Toray DuPont).

其次，對黏著層之一部分照射光。Secondly, light is irradiated to a part of the adhesive layer.

具體而言，對於將黏著片材沿面方向三等分中之兩端部分之2處(非照射部分)，藉由配置遮罩而不照射光，對於將黏著片材沿面方向三等分中之中央部分之1處(照射部分)未配置遮罩而照射光。Specifically, for two of the two end portions (non-irradiated parts) of the three-halves of the adhesive sheet in the surface direction, by arranging the mask without irradiating light, the adhesive sheet is divided into three equally in the surface direction. One of the central part (irradiation part) is irradiated without a mask.

根據下述黏著力之評價明確可知，於製造例1之黏著片材中，光硬化後之黏著力小於光硬化前之黏著力。According to the following evaluation of the adhesive force, it is clear that in the adhesive sheet of Manufacturing Example 1, the adhesive force after photocuring is smaller than the adhesive force before photocuring.

據此可知，照射部分相較於非照射部分，黏著力相對地變低，照射部分成為低黏著區域，非照射部分成為高黏著區域。From this, it can be seen that the irradiated part has a relatively lower adhesive force than the non-irradiated part, the irradiated part becomes a low-adhesion area, and the non-irradiated part becomes a high-adhesion area.

藉此製造中間積層體。In this way, an intermediate laminate is manufactured.

實施例2 於自製造例2之黏著片材將剝離膜剝離後，將該黏著片材貼附於厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)。Example 2 After peeling the release film from the adhesive sheet of Production Example 2, the adhesive sheet was attached to a polyimide film with a thickness of 12.5 μm (“Kapton 50EN” manufactured by Toray DuPont).

其次，對黏著層之一部分照射光。Secondly, light is irradiated to a part of the adhesive layer.

具體而言，對於將黏著片材沿面方向三等分中之兩端部分之2處(照射部分)，不配置遮罩而照射光，對於將黏著片材沿面方向三等分中之中央部分之1處(非照射部分)，藉由配置遮罩而未照射光。Specifically, for two of the two end parts (irradiated parts) of the three-division of the adhesive sheet in the surface direction, light is irradiated without a mask, and for the central part of the three-quarters of the adhesive sheet in the surface direction One place (non-irradiated part) is not irradiated with light by arranging a mask.

根據下述黏著力之評價明確可知，於製造例2之黏著片材中，光硬化後之黏著力高於光硬化前之黏著力。According to the following evaluation of the adhesive force, it is clear that in the adhesive sheet of Manufacturing Example 2, the adhesive force after photocuring is higher than the adhesive force before photocuring.

據此可知，照射部分相較於非照射部分，黏著力相對地變高，照射部分成為高黏著區域，非照射部分成為低黏著區域。From this, it can be seen that the irradiated part has relatively higher adhesion than the non-irradiated part, the irradiated part becomes a high adhesion area, and the non-irradiated part becomes a low adhesion area.

藉此製造中間積層體。In this way, an intermediate laminate is manufactured.

實施例3 於自製造例3之黏著片材將剝離膜剝離後，將該黏著片材貼附於厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)。Example 3 After peeling the release film from the adhesive sheet of Production Example 3, the adhesive sheet was attached to a polyimide film with a thickness of 12.5 μm (“Kapton 50EN” manufactured by Toray DuPont).

其次，對黏著層之一部分照射光。Secondly, light is irradiated to a part of the adhesive layer.

具體而言，對於將黏著片材沿面方向三等分中之兩端部分之2處(照射部分)，未配置遮罩而照射光，對於將黏著片材沿面方向三等分中之中央部分之1處(非照射部分)，藉由配置遮罩而未照射光。Specifically, for two of the two end parts (irradiated parts) of the three-division of the adhesive sheet in the surface direction, light is irradiated without a mask, and for the central part of the three-quarters of the adhesive sheet in the surface direction One place (non-irradiated part) is not irradiated with light by arranging a mask.

根據下述黏著力之評價明確可知，於製造例3之黏著片材中，光硬化後之黏著力高於光硬化前之黏著力。According to the following evaluation of the adhesive force, it is clear that in the adhesive sheet of Production Example 3, the adhesive force after photocuring is higher than the adhesive force before photocuring.

據此可知，照射部分相較於非照射部分，黏著力相對地變高，照射部分成為高黏著區域，非照射部分成為低黏著區域。From this, it can be seen that the irradiated part has relatively higher adhesion than the non-irradiated part, the irradiated part becomes a high adhesion area, and the non-irradiated part becomes a low adhesion area.

藉此製造中間積層體。In this way, an intermediate laminate is manufactured.

比較例1 使用拾取膠帶作為黏著片材，將該拾取膠帶貼附於厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)。Comparative example 1 Using a pickup tape as an adhesive sheet, the pickup tape was attached to a polyimide film ("Kapton 50EN" manufactured by Toray DuPont) with a thickness of 12.5 μm.

藉此製造中間積層體。In this way, an intermediate laminate is manufactured.

6.評價 (剪切儲存模數) 將各製備例之光硬化性組合物以乾燥後之厚度成為25 μm之方式塗佈於已實施離型處理之PET膜，然後進行乾燥及熟化，藉此獲得黏著層。以同樣順序準備60片黏著層，積層該黏著層，而製作1.5 mm之剪切儲存模數測定用樣品(光硬化前)。又，對於以上述方式所獲得之剪切儲存模數測定用樣品(光硬化前)，使用化學燈將照度5 mW/cm2 之紫外線照射360秒鐘，藉此製備剪切儲存模數測定用樣品(光硬化後)。6. Evaluation (shear storage modulus) The photocurable composition of each preparation example was applied to a PET film that had been subjected to a release treatment so that the thickness after drying became 25 μm, and then dried and cured, thereby Obtain an adhesive layer. In the same procedure, 60 adhesive layers were prepared, and the adhesive layers were laminated to prepare a 1.5 mm sample for measuring the shear storage modulus (before light curing). Also, for the sample for measuring the shear storage modulus obtained in the above manner (before photocuring), a chemical lamp was used to irradiate ultraviolet light with an illuminance of 5 mW/cm 2 for 360 seconds to prepare a sample for measuring the shear storage modulus. Sample (after light hardening).

對於剪切儲存模數測定用樣品(光硬化前)及剪切儲存模數測定用樣品(光硬化後)，使用Rheometric Scientific公司製造之「Advanced Rheometric Expansion System(ARES)」，藉由以下條件測定剪切儲存模數。將該結果示於表1。For the samples for measuring the shear storage modulus (before photocuring) and the samples for measuring the shear storage modulus (after photocuring), the "Advanced Rheometric Expansion System (ARES)" manufactured by Rheometric Scientific is used for measurement under the following conditions Shear storage modulus. The results are shown in Table 1.

(測定條件) 變形模式：扭曲 測定頻率：1 Hz 升溫速度：5℃/分鐘 測定溫度：-50～150℃ 形狀：平行板 8.0 mmϕ(Measurement conditions) Deformation mode: twist Measuring frequency: 1 Hz Heating rate: 5℃/min Measuring temperature: -50～150℃ Shape: parallel plate 8.0 mmϕ

(黏著力) 將厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)經由雙面接著帶(日東電工製造之「No.531」)貼附於玻璃板，而獲得測定用聚醯亞胺膜基板。自切成寬25 mm×長100 mm之各製造例之黏著片材去除剝離膜，使用手壓輥於25℃下將黏著片材與測定用聚醯亞胺膜基板貼合，而製備光硬化前之測定用試樣。(Adhesion) A polyimide film with a thickness of 12.5 μm ("Kapton 50EN" manufactured by Toray DuPont) was attached to a glass plate via a double-sided adhesive tape ("No.531" manufactured by Nitto Denko) to obtain a polyimide film for measurement. Amine film substrate. Remove the release film from the adhesive sheet of each manufacturing example cut into a width of 25 mm × length of 100 mm, and use a hand roller at 25°C to bond the adhesive sheet to the polyimide film substrate for measurement to prepare a photocuring The previous test sample.

另外，以與上述相同之順序製備光硬化前之黏著片材，自光硬化前之黏著片材之基材側照射紫外線而使黏著層光硬化，而製備光硬化後之測定用試樣。In addition, the adhesive sheet before photocuring was prepared in the same procedure as above, and ultraviolet rays were irradiated from the substrate side of the adhesive sheet before photocuring to photocur the adhesive layer to prepare a measurement sample after photocuring.

對該光硬化前之測定用試樣及光硬化後之測定用試樣分別測定黏著力。The adhesive force was measured on the measurement sample before light curing and the measurement sample after light curing.

具體而言，利用夾頭保持光硬化前之測定用試樣及光硬化後之測定用試樣之端部(黏著片材之端部)，以拉伸速度300 mm/分鐘實施補強膜之180°剝離，測定剝離強度。將該結果示於表1。Specifically, the end of the measurement sample before photocuring and the end of the measurement sample after photocuring (the end of the adhesive sheet) is held by the chuck, and the 180 of the reinforced film is implemented at a stretching speed of 300 mm/min. ° Peel off and measure the peel strength. The results are shown in Table 1.

(剝離後之外觀) 於各實施例之中間積層體中，切斷高黏著區域及低黏著區域，然後僅將低黏著區域以低黏著區域之端部為起點進行剝離。(Appearance after peeling) In the intermediate laminate of each embodiment, the high adhesion area and the low adhesion area were cut, and then only the low adhesion area was peeled off from the end of the low adhesion area as a starting point.

又，關於比較例1，切斷拾取膠帶之沿面方向三等分中之中央部分，將該部分剝離。In addition, in Comparative Example 1, the central part of the three-part in the surface direction of the pickup tape was cut, and the part was peeled off.

藉由目視評價剝離後之外觀。The appearance after peeling was evaluated visually.

關於剝離後之外觀，根據以下基準評價優劣。將該結果示於表1。 ○：於殘存於中間積層體之黏著片材未觀察到剝落。 ×：於殘存於中間積層體之黏著片材觀察到剝落。The appearance after peeling was evaluated according to the following criteria. The results are shown in Table 1. ○: No peeling was observed in the adhesive sheet remaining in the intermediate laminate. ×: Peeling was observed in the adhesive sheet remaining in the intermediate laminate.

[表1] 實施例、比較例No. 實施例1 實施例2 實施例3 比較例1 黏著力(N/25 mm) 光硬化前 13.47 1.30 0.15 - 光硬化後 2.79 19.57 9.80 - 剪切儲存模數G'(Pa) 光硬化前 7.85×104 6.65×104 6.00×104 - 光硬化後 3.43×106 2.17×105 1.50×105 - HSP 3.25 4.97 1.90 - 剝離後之外觀 ○ ○ ○ × [Table 1] Example, Comparative Example No. Example 1 Example 2 Example 3 Comparative example 1 Adhesion (N/25 mm) Before light hardening 13.47 1.30 0.15 - After light hardening 2.79 19.57 9.80 - Shear storage modulus G'(Pa) Before light hardening 7.85×10 4 6.65×10 4 6.00×10 4 - After light hardening 3.43×10 6 2.17×10 5 1.50×10 5 - HSP 3.25 4.97 1.90 - Appearance after peeling ○ ○ ○ ×

再者，上述發明係作為本發明之例示之實施形態而提供，但其僅為單純之示例，不應限定性地進行解釋。藉由該技術領域之從業者而明確可知之本發明之變化例包含於下述發明申請專利範圍中。 [產業上之可利用性]In addition, the above-mentioned invention is provided as an exemplary embodiment of the present invention, but it is only a mere example and should not be interpreted restrictively. Variations of the present invention that are clearly known by practitioners in this technical field are included in the scope of the following invention applications. [Industrial availability]

本發明之中間積層體、中間積層體之製造方法及製品積層體之製造方法可較佳地用於各種器件之製造。The intermediate laminate, the manufacturing method of the intermediate laminate, and the manufacturing method of the product laminate of the present invention can be preferably used for the production of various devices.

1:中間積層體 2:基材 3:黏著層 4:黏著片材 5:被接著體 6:剝離膜 7:照射部分 8:非照射部分 9:遮罩 10:高黏著區域 11:低黏著區域 12:製品積層體 13:殘存部分 14:去除部分 15:黏著滾筒1: Intermediate layered body 2: substrate 3: Adhesive layer 4: Adhesive sheet 5: Subsequent body 6: peeling film 7: Irradiation part 8: Non-irradiated part 9: Mask 10: High adhesion area 11: Low adhesion area 12: product laminate 13: Remaining part 14: Remove part 15: Adhesion roller

圖1表示本發明之中間積層體之一實施形態之概略圖。 圖2係表示黏著片材之製造方法之一實施形態之概略圖，圖2A表示準備基材之第1步驟，圖2B表示於基材之一面積層黏著層之第2步驟，圖2C表示於黏著層一面積層剝離膜之步驟。 圖3係表示由第1黏著性組合物形成黏著層之情形時之本發明之中間積層體之製造方法之一實施形態的概略圖，圖3A表示準備黏著片材之第3步驟，圖3B表示於黏著片材之一面配置被接著體之第4步驟，圖3C表示對黏著層之一部分進行光照射而形成高黏著區域及低黏著區域之第5步驟。 圖4係表示由第2黏著性組合物形成黏著層之情形時之本發明之中間積層體之製造方法之一實施形態的概略圖，圖4A表示準備黏著片材之第3步驟，圖4B表示於黏著片材之一面配置被接著體之第4步驟，圖4C表示對黏著層之一部分進行光照射而形成高黏著區域及低黏著區域之第5步驟。 圖5係表示本發明之製品積層體之製造方法之一實施形態之概略圖，圖5A表示準備中間積層體之第6步驟，圖5B表示去除黏著層中之低黏著區域之第7步驟。 圖6係表示低黏著區域為十字形之情形時之本發明之製品積層體之製造方法之一實施形態的概略圖，圖6A表示準備中間積層體之第6步驟，圖6B表示去除黏著層中之低黏著區域之第7步驟。 圖7係表示低黏著區域為圓形之情形時之本發明之製品積層體之製造方法之一實施形態的概略圖，圖7A表示準備中間積層體之第6步驟，圖7B表示去除黏著層中之低黏著區域之第7步驟。Fig. 1 shows a schematic view of an embodiment of the intermediate laminate of the present invention. Fig. 2 is a schematic diagram showing an embodiment of the method of manufacturing an adhesive sheet. Fig. 2A shows the first step of preparing the substrate, Fig. 2B shows the second step of layering an adhesive layer on an area of the substrate, and Fig. 2C shows the adhesive The step of peeling off the film layer by layer. Fig. 3 is a schematic diagram showing an embodiment of the method for manufacturing an intermediate laminate of the present invention when the adhesive layer is formed from the first adhesive composition, Fig. 3A shows the third step of preparing an adhesive sheet, and Fig. 3B shows The fourth step of arranging the adherend on one surface of the adhesive sheet. FIG. 3C shows the fifth step of irradiating a part of the adhesive layer with light to form a high adhesion area and a low adhesion area. Fig. 4 is a schematic diagram showing an embodiment of the method for manufacturing an intermediate laminate of the present invention when the adhesive layer is formed from the second adhesive composition, Fig. 4A shows the third step of preparing an adhesive sheet, and Fig. 4B shows The fourth step of arranging the adherend on one surface of the adhesive sheet. FIG. 4C shows the fifth step of irradiating a part of the adhesive layer with light to form a high adhesion area and a low adhesion area. Fig. 5 is a schematic diagram showing an embodiment of the method for manufacturing the product laminate of the present invention. Fig. 5A shows the sixth step of preparing the intermediate laminate, and Fig. 5B shows the seventh step of removing the low-adhesion area in the adhesive layer. Fig. 6 is a schematic diagram showing an embodiment of the method for manufacturing the product laminate of the present invention when the low adhesion area is a cross shape, Fig. 6A shows the sixth step of preparing the intermediate laminate, and Fig. 6B shows the removal of the adhesive layer The 7th step of the low adhesion area. Fig. 7 is a schematic diagram showing an embodiment of the method for manufacturing the product laminate of the present invention when the low adhesion area is circular. Fig. 7A shows the sixth step of preparing the intermediate laminate, and Fig. 7B shows the removal of the adhesive layer The 7th step of the low adhesion area.

1:中間積層體 1: Intermediate layered body

2:基材 2: substrate

3:黏著層 3: Adhesive layer

5:被接著體 5: Subsequent body

10:高黏著區域 10: High adhesion area

11:低黏著區域 11: Low adhesion area

Claims (9)

一種中間積層體，其特徵在於包含：黏著片材，其具備基材及配置於上述基材之一面之黏著層；及被接著體，其配置於上述黏著片材之一面；且 上述黏著層包含能夠不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物， 上述黏著層具備包含黏著力較高之狀態之黏著性組合物之高黏著區域、與包含黏著力較低之狀態之黏著性組合物之低黏著區域。An intermediate laminated body, characterized by comprising: an adhesive sheet having a base material and an adhesive layer arranged on one side of the base material; and an adherend body, which is arranged on one side of the adhesive sheet; and The above-mentioned adhesive layer includes an adhesive composition that can irreversibly change into a state with higher adhesive force and a state with lower adhesive force, The above-mentioned adhesive layer has a high-adhesion area including an adhesive composition in a state with a higher adhesive force, and a low-adhesion area including an adhesive composition in a state with a lower adhesive force. 如請求項1之中間積層體，其中上述黏著層包含能夠自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態之第1黏著性組合物，且 上述高黏著區域包含狀態變化前之上述第1黏著性組合物， 上述低黏著區域包含狀態變化後之上述第1黏著性組合物。The intermediate laminate of claim 1, wherein the adhesive layer comprises a first adhesive composition capable of irreversibly changing from a state with a high adhesive force to a state with a low adhesive force, and The high adhesion area includes the first adhesive composition before the state change, The low-adhesion area includes the first adhesive composition after the state change. 如請求項1之中間積層體，其中上述黏著層包含能夠自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態之第2黏著性組合物，且 上述高黏著區域包含狀態變化後之上述第2黏著性組合物， 上述低黏著區域包含狀態變化前之上述第2黏著性組合物。The intermediate laminate of claim 1, wherein the adhesive layer includes a second adhesive composition that can irreversibly change from a state with low adhesive force to a state with high adhesive force, and The high adhesion area includes the second adhesive composition after the state change, The said low adhesion area|region contains the said 2nd adhesive composition before a state change. 如請求項1至3中任一項之中間積層體，其中將上述高黏著區域以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/分鐘藉由180度剝離試驗所測得之黏著力為5 N/25 mm以上。The intermediate laminate of any one of claims 1 to 3, wherein the above-mentioned high adhesion area is bonded to the polyimide film at 25°C and the peeling speed is 300 mm/min, as measured by a 180-degree peel test Adhesion is above 5 N/25 mm. 如請求項1至3中任一項之中間積層體，其中將上述低黏著區域以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/分鐘藉由180度剝離試驗所測得之黏著力為4 N/25 mm以下。The intermediate laminate according to any one of claims 1 to 3, wherein the above-mentioned low-adhesive area is attached to the polyimide film at 25°C and measured by a 180-degree peel test at a peeling speed of 300 mm/min Adhesion is 4 N/25 mm or less. 一種中間積層體之製造方法，其特徵在於包括如下步驟：準備黏著片材，該黏著片材具備基材、及配置於上述基材之一面且包含能夠藉由光照射不可逆地狀態變化成黏著力較高之狀態與黏著力較低之狀態之黏著性組合物之黏著層； 將被接著體配置於上述黏著片材之一面；及 藉由對上述黏著層之一部分進行光照射，於上述黏著層形成經光照射之照射部分與未經光照射之非照射部分，而使上述照射部分及上述非照射部分中之任一者成為包含黏著力較高之狀態之黏著性組合物之高黏著區域，另一者成為包含黏著力較低之狀態之黏著性組合物之低黏著區域。A method for manufacturing an intermediate laminate, which is characterized by comprising the steps of: preparing an adhesive sheet, which has a substrate and is arranged on one surface of the substrate and includes a state that can be irreversibly changed into adhesive force by light irradiation The adhesive layer of the adhesive composition in the higher state and the lower state of the adhesive force; Arranging the bonded body on one side of the above-mentioned adhesive sheet; and By irradiating a part of the adhesive layer with light, an irradiated part irradiated with light and a non-irradiated part not irradiated with light are formed on the adhesive layer, so that any one of the irradiated part and the non-irradiated part is included The high-adhesion area of the adhesive composition in the state of higher adhesive force becomes the low-adhesion area of the adhesive composition in the state of lower adhesive force. 如請求項6之中間積層體之製造方法，其中上述黏著層包含能夠藉由光照射自黏著力較高之狀態不可逆地狀態變化成黏著力較低之狀態之第1黏著性組合物，且 上述照射部分成為上述低黏著區域， 上述非照射部分成為上述高黏著區域。The method for manufacturing an intermediate laminate according to claim 6, wherein the adhesive layer includes a first adhesive composition that can irreversibly change from a state with a high adhesive force to a state with a low adhesive force by light irradiation, and The above irradiated part becomes the above low adhesion area, The non-irradiated portion becomes the high adhesion area. 如請求項6之中間積層體之製造方法，其中上述黏著層包含能夠藉由光照射自黏著力較低之狀態不可逆地狀態變化成黏著力較高之狀態之第2黏著性組合物，且 上述照射部分成為上述高黏著區域， 上述非照射部分成為上述低黏著區域。The method for manufacturing an intermediate laminate according to claim 6, wherein the adhesive layer includes a second adhesive composition capable of irreversibly changing from a state with a low adhesive force to a state with a high adhesive force by light irradiation, and The above irradiated part becomes the above high adhesion area, The non-irradiated portion becomes the low adhesion area. 一種製品積層體之製造方法，其特徵在於包括如下步驟：準備中間積層體，該中間積層體係藉由如請求項6至8中任一項之中間積層體之製造方法而製造；及 去除上述黏著層中之上述低黏著區域。A method for manufacturing a product laminate, characterized by comprising the steps of preparing an intermediate laminate, which is manufactured by the method for manufacturing an intermediate laminate according to any one of claims 6 to 8; and Remove the low adhesion area in the adhesion layer.
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