TW202041557A - 感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法 - Google Patents

感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法 Download PDF

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Publication number
TW202041557A
TW202041557A TW109110258A TW109110258A TW202041557A TW 202041557 A TW202041557 A TW 202041557A TW 109110258 A TW109110258 A TW 109110258A TW 109110258 A TW109110258 A TW 109110258A TW 202041557 A TW202041557 A TW 202041557A
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TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
acid
group
substrate
Prior art date
Application number
TW109110258A
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English (en)
Chinese (zh)
Inventor
小野悠樹
井元千春
内田一幸
尾畑恵美
Original Assignee
日商日鐵化學材料股份有限公司
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Publication of TW202041557A publication Critical patent/TW202041557A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Optical Filters (AREA)
TW109110258A 2019-03-29 2020-03-26 感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法 TW202041557A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019068558 2019-03-29
JP2019-068558 2019-03-29
JP2020-045160 2020-03-16
JP2020045160A JP2020166254A (ja) 2019-03-29 2020-03-16 感光性樹脂組成物、感光性樹脂組成物を硬化してなる硬化膜、硬化膜付き基板および硬化膜付き基板の製造方法

Publications (1)

Publication Number Publication Date
TW202041557A true TW202041557A (zh) 2020-11-16

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TW109110258A TW202041557A (zh) 2019-03-29 2020-03-26 感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法

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JP (1) JP2020166254A (ja)
KR (1) KR20200115270A (ja)
TW (1) TW202041557A (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240075890A (ko) * 2021-11-09 2024-05-29 후지필름 가부시키가이샤 경화성 조성물, 경화물의 제조 방법, 막, 광학 소자, 이미지 센서, 고체 촬상 소자, 화상 표시 장치, 및, 라디칼 중합 개시제
KR20230103406A (ko) * 2021-12-31 2023-07-07 주식회사 동진쎄미켐 감광성 수지 조성물, 표시장치 및 패턴 형성 방법
JP2023150423A (ja) 2022-03-31 2023-10-16 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物、感光性樹脂組成物を硬化してなる硬化膜、硬化膜付き基板及び硬化膜付き基板の製造方法

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JP4660986B2 (ja) 2001-06-28 2011-03-30 Ｊｓｒ株式会社 カラー液晶表示装置用感放射線性組成物、およびカラーフィルタ

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KR20200115270A (ko) 2020-10-07

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