TW202019659A - Plunger replacement method, plunger unit and resin molding apparatus - Google Patents

Plunger replacement method, plunger unit and resin molding apparatus Download PDF

Info

Publication number
TW202019659A
TW202019659A TW108141044A TW108141044A TW202019659A TW 202019659 A TW202019659 A TW 202019659A TW 108141044 A TW108141044 A TW 108141044A TW 108141044 A TW108141044 A TW 108141044A TW 202019659 A TW202019659 A TW 202019659A
Authority
TW
Taiwan
Prior art keywords
plunger
block
body block
unit
groove
Prior art date
Application number
TW108141044A
Other languages
Chinese (zh)
Other versions
TWI725612B (en
Inventor
市橋秀男
山根眞
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202019659A publication Critical patent/TW202019659A/en
Application granted granted Critical
Publication of TWI725612B publication Critical patent/TWI725612B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1756—Handling of moulds or mould parts, e.g. mould exchanging means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The present invention relates to a plunger replacement method, a plunger unit, and a resin molding apparatus, which prevent a mold surface of a molding die from being damaged during a plunger replacement operation. Provided is a method of replacing a plunger 51 of a resin molding apparatus 100, the resin molding apparatus 100 including: a plunger unit 5, having the plunger 51 that extrudes a resin material J from a pot 21 formed in a molding die 2; and a driving mechanism 6, moving the plunger unit 5 in such a manner that the plunger 51 moves forward and backward in the pot 21, wherein the plunger unit 5 may be divided into a plunger block 5A having the plunger 51, and a main body block 5B supporting the plunger block 5A, and the plunger block 5A and the main body block 5B are separately attached to and detached from between the molding die 2 and the driving mechanism 6.

Description

柱塞的更換方法、柱塞單元及樹脂成形裝置Plunger replacement method, plunger unit and resin molding device

本發明是有關於一種柱塞（plunger）的更換方法、柱塞單元（plunger unit）及樹脂成形裝置。The invention relates to a plunger replacement method, plunger unit and resin molding device.

例如，在將搭載於基板或引線框架（lead frame）的電子零件進行樹脂密封時，使用轉注模製（transfer molding）法的樹脂成形裝置。For example, when resin-mounting electronic components mounted on a substrate or a lead frame, a resin molding device using a transfer molding method is used.

所述樹脂成形裝置如專利文獻1所示，於形成於下模的槽（pot）收納樹脂材料，藉由利用柱塞將在所述槽內熔融的樹脂材料壓出而對模穴（cavity）供給樹脂材料從而進行樹脂密封。As described in Patent Document 1, the resin molding apparatus accommodates a resin material in a pot formed in a lower mold, and presses the resin material melted in the groove by a plunger to align the cavity Resin material is supplied to perform resin sealing.

而且，當在樹脂成形裝置中卸下柱塞時，藉由使柱塞自槽朝模具面（分模線（parting line）（PL面））側突出，自所述模具面側拉拔而進行。又，在安裝柱塞時，藉由將柱塞自模具面側***槽而進行。 [現有技術文獻] [專利文獻]Further, when the plunger is removed in the resin molding apparatus, the plunger protrudes from the groove toward the mold surface (parting line (PL surface)) side, and is drawn from the mold surface side . In addition, when installing the plunger, it is performed by inserting the plunger into the groove from the mold surface side. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利第3144714號公報[Patent Document 1] Japanese Patent No. 3144714

[發明所欲解決之課題][Problems to be solved by the invention]

然而，在所述更換方法中，有因柱塞或工具等損傷模具面的擔憂。所述模具面的劃痕會導致樹脂成形品的不良。However, in the replacement method described above, there is a concern that the plunger, tool, or the like may damage the mold surface. Scratches on the mold surface can cause defects in the resin molded product.

因此，本發明為了解決所述問題點而完成，其主要課題在於防止在柱塞的更換作業時損傷成形模具的模具面。 [解決課題之手段]Therefore, the present invention has been completed to solve the above-mentioned problems, and its main subject is to prevent damage to the mold surface of the forming mold during the plunger replacement operation. [Means to solve the problem]

即本發明的柱塞的更換方法是樹脂成形裝置的所述柱塞的更換方法，所述樹脂成形裝置包括：柱塞單元，具有柱塞，所述柱塞自形成於成形模具的槽壓出樹脂材料；以及驅動機構，以所述柱塞在所述槽內進退的方式使所述柱塞單元移動；且所述柱塞的更換方法的特徵在於：所述柱塞單元能夠分離為具有所述柱塞的柱塞塊體、以及支撐所述柱塞塊體的本體塊體，而自所述成形模具與所述驅動機構之間分別拆裝所述柱塞塊體與所述本體塊體。 [發明的效果]That is, the method of replacing the plunger of the present invention is the method of replacing the plunger of the resin molding apparatus. The resin molding apparatus includes a plunger unit having a plunger that is pressed out from a groove formed in the molding die Resin material; and a driving mechanism to move the plunger unit in such a manner that the plunger advances and retreats in the groove; and the method of replacing the plunger is characterized in that the plunger unit can be separated to have all A plunger block body of the plunger and a body block body supporting the plunger block body, and the plunger block body and the body block body are respectively assembled and disassembled from the forming mold and the driving mechanism . [Effect of invention]

根據如此般構成的本發明，可防止在柱塞的更換作業時損傷成形模具的模具面。According to the present invention thus constituted, it is possible to prevent damage to the mold surface of the mold during replacement of the plunger.

下面，對於本發明舉出示例進一步詳細地進行說明。然而，本發明並不受以下說明限定。Hereinafter, examples of the present invention will be described in further detail. However, the present invention is not limited by the following description.

本發明的柱塞的更換方法如前文所述般，是樹脂成形裝置的所述柱塞的更換方法，所述樹脂成形裝置包括：柱塞單元，具有柱塞，所述柱塞自形成於成形模具的槽壓出樹脂材料；以及驅動機構，以所述柱塞在所述槽內進退的方式使所述柱塞單元移動；且所述柱塞的更換方法的特徵在於：所述柱塞單元能夠分離為具有所述柱塞的柱塞塊體、以及支撐所述柱塞塊體的本體塊體，而自所述成形模具與所述驅動機構之間分別拆裝所述柱塞塊體與所述本體塊體。 若為所述柱塞的更換方法，則由於柱塞單元構成為能夠分離為柱塞塊體與本體塊體，而自形成槽的成形模具與驅動機構之間分別拆裝所述塊體，故可防止在柱塞的更換作業時柱塞或工具與成形模具的模具面接觸，而可防止損傷模具面。又，由於無需在成形模具的模具面側進行作業，故可降低因觸碰為了樹脂成形而被加熱的成形模具而被燙傷的可能性。The method of replacing the plunger of the present invention is the method of replacing the plunger of the resin molding device as described above. The resin molding device includes a plunger unit having a plunger, and the plunger is self-formed in molding The groove of the mold presses out the resin material; and a drive mechanism that moves the plunger unit in such a manner that the plunger advances and retreats in the groove; and the method of replacing the plunger is characterized in that the plunger unit It can be separated into a plunger block with the plunger and a body block supporting the plunger block, and the plunger block and The body block. In the method of replacing the plunger, since the plunger unit is configured to be separable into a plunger block body and a body block body, the block body is separately detached from the groove-forming mold and the driving mechanism, so It can prevent the plunger or tool from contacting the mold surface of the forming mold during the replacement of the plunger, and can prevent damage to the mold surface. In addition, since there is no need to work on the mold surface side of the molding die, the possibility of being burned by touching the molding die heated for resin molding can be reduced.

具體而言，在卸下所述柱塞時，理想的是自所述成形模具與所述驅動機構之間卸下所述本體塊體，使所述柱塞塊體移動至卸下所述本體塊體而形成的空間部後，自所述成形模具與所述驅動機構之間卸下所述柱塞塊體。 如此般使柱塞塊體移動至卸下本體塊體而形成的空間部，藉此可自成形模具的槽抽出柱塞，而可自成形模具與驅動機構之間卸下柱塞塊體。Specifically, when removing the plunger, it is desirable to remove the body block from between the forming mold and the driving mechanism, so that the plunger block moves to remove the body After the space formed by the block, the plunger block is removed from between the forming die and the drive mechanism. In this way, the plunger block is moved to the space formed by removing the body block, whereby the plunger can be drawn from the groove of the forming mold, and the plunger block can be removed from the forming mold and the driving mechanism.

又，在安裝所述柱塞時，理想的是自所述成形模具與所述驅動機構之間***所述柱塞塊體，且以所述柱塞位於所述槽內的方式使所述柱塞塊體移動，其後，自所述成形模具與所述驅動機構之間安裝所述本體塊體。Also, when installing the plunger, it is desirable to insert the plunger block from between the forming mold and the driving mechanism, and to make the post so that the plunger is located in the groove The plug block moves, and thereafter, the body block is installed from between the forming mold and the driving mechanism.

理想的是在自所述成形模具與所述驅動機構之間拆裝所述本體塊體前，藉由固定構件將所述柱塞塊體暫時地固定於裝置側（例如，所述成形模具或保持所述成形模具的模具保持構件），而在拆裝所述本體塊體後，將所述固定構件卸下。 具體而言，在自所述成形模具與所述驅動機構之間卸下所述本體塊體前，藉由固定構件將所述柱塞塊體暫時地固定於裝置側，而在卸下所述本體塊體後，將所述固定構件卸下。又，在自所述成形模具與所述驅動機構之間安裝所述本體塊體前，藉由固定構件將所述柱塞塊體暫時地固定於裝置側，而在安裝所述本體塊體後，將所述固定構件卸下。 如此般藉由固定構件將柱塞塊體暫時地固定於裝置側，藉此在拆裝本體塊體時柱塞塊體不會成為妨礙，從而可提高拆裝本體塊體的作業性。It is desirable to temporarily fix the plunger block to the device side by a fixing member before disassembling the body block between the forming mold and the driving mechanism (for example, the forming mold or A mold holding member that holds the forming mold), and after disassembling the body block, the fixing member is removed. Specifically, before removing the body block from the forming die and the driving mechanism, the plunger block is temporarily fixed to the device side by the fixing member, and then the After the body block, the fixing member is removed. In addition, before the body block is installed between the forming die and the drive mechanism, the plunger block is temporarily fixed to the device side by a fixing member, and after the body block is installed To remove the fixing member. In this way, the plunger block is temporarily fixed to the device side by the fixing member, whereby the plunger block does not become an obstacle when the main body block is detached, so that the workability of the detachable main body block can be improved.

在卸下所述本體塊體的狀態下，理想的是藉由所述驅動機構使所述柱塞塊體移動至所述空間部。 如此般藉由利用驅動機構使柱塞塊體移動，而無需準備用以使柱塞塊體移動的其他驅動源，又，與利用手動作業進行使柱塞塊體移動至所期望的位置（例如，柱塞***槽的位置或柱塞被自槽抽出的位置）的作業的情況相比可容易地進行。In the state where the body block is removed, it is desirable that the plunger block is moved to the space portion by the driving mechanism. In this way, by using the driving mechanism to move the plunger block, it is not necessary to prepare another driving source for moving the plunger block, and the manual operation is used to move the plunger block to the desired position (for example , The position where the plunger is inserted into the groove or the position where the plunger is drawn out of the groove) can be performed relatively easily.

在利用驅動機構使柱塞塊體移動時，為了使柱塞塊體穩定地移動，理想的是在卸下所述本體塊體的狀態下，藉由較所述本體塊體短的治具塊體在由所述驅動機構而致的所述柱塞的進退方向上將所述柱塞塊體與所述驅動機構加以連結而使所述柱塞塊體移動。 又，藉由利用治具塊體而無需增大驅動機構的移動量，可防止驅動機構的大型化，進而，可防止樹脂成形裝置的大型化。When the plunger block is moved by the driving mechanism, in order to stably move the plunger block, it is desirable to use a jig block shorter than the body block in a state where the body block is removed The body connects the plunger block body and the drive mechanism in the advancing and retreating direction of the plunger by the driving mechanism to move the plunger block body. In addition, by using the jig block without increasing the amount of movement of the drive mechanism, it is possible to prevent the drive mechanism from increasing in size, and further, it is possible to prevent the resin molding device from increasing in size.

在樹脂成形裝置為多柱塞（multi plunger）方式的情況下，理想的是所述柱塞塊體具有多個柱塞。 在此種構成的情況下，可一齊拆裝多個柱塞，而可高效率地進行更換多個柱塞的作業，從而可縮短柱塞的更換作業的時間。When the resin molding apparatus is a multi plunger system, it is desirable that the plunger block has a plurality of plungers. In the case of such a configuration, a plurality of plungers can be detached together, and the operation of replacing a plurality of plungers can be efficiently performed, so that the time for the plunger replacement can be shortened.

又，本發明的柱塞單元具有柱塞，所述柱塞自成形模具的槽朝模穴壓出樹脂材料，所述柱塞單元的特徵在於包括具有所述柱塞的柱塞塊體、以及支撐所述柱塞塊體的本體塊體，所述柱塞塊體與所述本體塊體相互滑動而構成為能夠分離。 若為此種柱塞單元，則由於在柱塞單元中，柱塞塊體與本體塊體相互滑動而構成為能夠分離，故可設為適宜於上文所述的柱塞的更換作業的構成。In addition, the plunger unit of the present invention has a plunger that presses a resin material toward the cavity from the groove of the forming mold. The plunger unit is characterized by including a plunger block with the plunger, and A body block that supports the plunger block, and the plunger block and the body block slide so as to be separable. In the case of this type of plunger unit, the plunger block and the main body block slide to be separable in the plunger unit, so it can be configured to be suitable for the plunger replacement operation described above .

進而，本發明的樹脂成形裝置的特徵在於包括：柱塞單元，具有柱塞，所述柱塞自成形模具的槽朝模穴壓出樹脂材料；以及驅動機構，以所述柱塞在所述槽內進退移動的方式使所述柱塞單元移動；且所述柱塞單元包括具有所述柱塞的柱塞塊體、以及支撐所述柱塞塊體的本體塊體，所述柱塞塊體與所述本體塊體相互滑動而構成為能夠分離。 若為此種樹脂成形裝置，則可進行上文所述的柱塞的更換作業，由於在更換柱塞時不易損傷成形模具的模具面，故可降低樹脂成形品的不良。Furthermore, the resin molding apparatus of the present invention is characterized by including: a plunger unit having a plunger that presses out the resin material from the groove of the molding die toward the mold cavity; and a driving mechanism that uses the plunger in the The plunger unit is moved in a forward and backward movement in the groove; and the plunger unit includes a plunger block with the plunger, and a body block supporting the plunger block, the plunger block The body and the main body block slide to be separable. With such a resin molding device, the plunger replacement operation described above can be performed, and the mold surface of the molding die is less likely to be damaged when the plunger is replaced, so that the defects of the resin molded product can be reduced.

＜本發明的一實施形態＞ 以下，參照圖式對本發明的樹脂成形裝置的一實施形態進行說明。另外，關於以下所示的所有的圖，為了易於理解，均適當地省略或誇張地示意性地進行描繪。關於相同的構成元件，標註相同的符號並且適當省略說明。<An embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, for ease of understanding, all the drawings shown below are appropriately omitted or exaggerated and schematically depicted. Regarding the same constituent elements, the same symbols are attached and the description is omitted as appropriate.

＜樹脂成形裝置的整體構成＞ 本實施形態的樹脂成形裝置100藉由使用樹脂材料J的轉注成形（transfer molding），而使封裝有電子零件Wx的成形對象物W樹脂成形。<Overall configuration of resin molding equipment> The resin molding apparatus 100 of the present embodiment molds the object to be molded W in which the electronic component Wx is packaged by transfer molding using the resin material J.

此處，作為成形對象物W，例如為金屬基板、樹脂基板、玻璃基板、陶瓷基板、電路基板、半導體基板、配線基板、引線框架等，不論配線的有無。又，用以樹脂成形的樹脂材料J例如是包含熱硬化性樹脂的複合材料，樹脂材料J的形態例如為小片（tablet）狀的固態。又，作為封裝於成形對象物W的上表面的電子零件Wx，例如是裸晶片（bare chip）或經樹脂密封的晶片（chip）。Here, the object W to be molded is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of the presence or absence of wiring. Moreover, the resin material J molded with resin is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is, for example, a tablet-shaped solid state. The electronic component Wx packaged on the upper surface of the object to be molded W is, for example, a bare chip or a resin-sealed chip.

具體而言，樹脂成形裝置100如圖1所示，包括：一個成形模具2（以下，下模2），形成有收納樹脂材料J的槽21；另一個成形模具3（以下，上模3），與所述下模2相向而設置，形成有被注入樹脂材料J的模穴31；以及合模機構（未圖示），使下模2與上模3合模。下模2經由下模保持構件4而設置於藉由合模機構而升降的可動盤（未圖示）。上模3經由上模保持構件（未圖示）而設置於上部固定盤（未圖示）。再者，下模保持構件4例如具有加熱板（heater plate）或絕熱板等。Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes: one molding die 2 (hereinafter, lower die 2) formed with a groove 21 for storing the resin material J; another molding die 3 (hereinafter, upper die 3) , Which is opposite to the lower mold 2 and has a cavity 31 into which the resin material J is injected; and a mold clamping mechanism (not shown), which causes the lower mold 2 and the upper mold 3 to be clamped. The lower mold 2 is provided on a movable plate (not shown) that is raised and lowered by a mold clamping mechanism via a lower mold holding member 4. The upper mold 3 is provided on an upper fixed plate (not shown) via an upper mold holding member (not shown). In addition, the lower mold holding member 4 has, for example, a heater plate or a heat insulating plate.

於下模2的上表面（模具面），多個槽21呈直線狀配置於一行。又，於上模3的下表面（模具面），在與槽21相向的部分形成有凹部即坳部（col）32，並且形成有澆道（runner）33，所述澆道33將所述坳部32與模穴31加以連接。On the upper surface (mold surface) of the lower mold 2, a plurality of grooves 21 are linearly arranged in a row. In addition, on the lower surface (mold surface) of the upper mold 3, a col 32, which is a concave portion, is formed in a portion facing the groove 21, and a runner 33 is formed. The depression 32 is connected to the mold cavity 31.

又，樹脂成形裝置100包括：柱塞單元5，具有將收納於下模2的槽21的樹脂材料J壓出的多個柱塞51；以及驅動機構6，以柱塞51在槽21內進退移動的方式使柱塞單元5移動。In addition, the resin molding apparatus 100 includes a plunger unit 5 having a plurality of plungers 51 that press out the resin material J housed in the groove 21 of the lower mold 2 and a drive mechanism 6 that advances and retreats in the groove 21 with the plunger 51 The movement mode moves the plunger unit 5.

柱塞單元5設置於下模2的下方，柱塞51構成下模的槽21的底部。又，柱塞51按壓在槽21中被加熱而熔融的樹脂材料J。The plunger unit 5 is provided below the lower mold 2, and the plunger 51 constitutes the bottom of the groove 21 of the lower mold. Moreover, the plunger 51 presses the resin material J heated and melted in the groove 21.

驅動機構6使柱塞單元5相對於下模2相對移動，藉此，柱塞51在槽21內進退。本實施形態的驅動機構6設置於相對於柱塞單元5與下模2為相反側（柱塞單元5的下側）。此處，作為驅動機構6，例如可使用組合伺服馬達（servomotor）與滾珠螺桿機構者，或可使用組合氣缸或油壓缸與桿者等。The drive mechanism 6 relatively moves the plunger unit 5 relative to the lower die 2, whereby the plunger 51 advances and retreats in the groove 21. The drive mechanism 6 of this embodiment is provided on the opposite side (lower side of the plunger unit 5) to the plunger unit 5 and the lower die 2. Here, as the drive mechanism 6, for example, a combination of a servomotor and a ball screw mechanism may be used, or a combination of a cylinder, hydraulic cylinder, and rod may be used.

而且，若在藉由合模機構使下模2與上模3合模的狀態下使柱塞單元5上升，則藉由樹脂成形裝置100所包括的加熱器（未圖示）的加熱而熔融的樹脂材料J被注入模穴31。藉此，將收納於模穴31內的成形對象物W的電子零件Wx進行樹脂密封。Furthermore, if the plunger unit 5 is raised with the lower mold 2 and the upper mold 3 being clamped by the mold clamping mechanism, it is melted by the heating of the heater (not shown) included in the resin molding apparatus 100 The resin material J is injected into the cavity 31. With this, the electronic component Wx of the object to be molded W housed in the cavity 31 is resin-sealed.

＜柱塞單元5的具體的構成＞ 本實施形態的柱塞單元5如圖1及圖2（a）～圖2（b）所示，構成為沿著由驅動機構6移動柱塞51的進退方向，能夠分離為具有多個柱塞51的柱塞塊體5A、以及支撐所述柱塞塊體5A的本體塊體5B。具體而言，柱塞塊體5A與本體塊體5B相互滑動地分離。藉此，將柱塞塊體5A與本體塊體5B相對於樹脂成形裝置100分別拆裝。此處，所謂「拆裝」意指安裝於樹脂成形裝置，或自樹脂成形裝置卸下。<Specific configuration of plunger unit 5> As shown in FIGS. 1 and 2(a) to 2(b), the plunger unit 5 of the present embodiment is configured to be separable into a plurality of plungers along the advancing and retreating direction in which the plunger 51 is moved by the driving mechanism 6 The plunger block 5A of 51 and the body block 5B supporting the plunger block 5A. Specifically, the plunger block 5A and the body block 5B are slidably separated from each other. As a result, the plunger block 5A and the body block 5B are separately attached to and detached from the resin molding apparatus 100. Here, "removable" means to be attached to or detached from the resin molding device.

柱塞塊體5A具有多個柱塞51、以及保持多個柱塞51的基座（base）體52。多個柱塞51對應於槽21的配置而設置，如圖2（a）～圖2（b）所示，於基座體52呈直線狀設置於一行。以下，將所述多個柱塞51呈直線狀排列的列方向稱為長度方向。再者，在多個槽21配置有多列的情況下，多個柱塞51與多列槽對應而設置有多列。The plunger block 5A has a plurality of plungers 51 and a base body 52 that holds the plurality of plungers 51. The plurality of plungers 51 are provided corresponding to the arrangement of the grooves 21, and as shown in FIGS. 2(a) to 2(b), the base body 52 is linearly arranged in a row. Hereinafter, the column direction in which the plurality of plungers 51 are arranged linearly is referred to as a longitudinal direction. In addition, when a plurality of rows are arranged in the plurality of grooves 21, a plurality of plungers 51 are provided in a plurality of rows corresponding to the plurality of rows of grooves.

於本體塊體5B，內置有對柱塞51施加彈性復位力的彈性構件55。所述彈性構件55吸收樹脂材料J（具體而言為樹脂小片）的形狀的偏差，而使各柱塞51的按壓力均一。在本實施形態中，分別與多個柱塞51對應而設置有多個彈性構件55。The body block 5B includes an elastic member 55 that applies an elastic restoring force to the plunger 51. The elastic member 55 absorbs variations in the shape of the resin material J (specifically, a small resin piece), and makes the pressing force of each plunger 51 uniform. In this embodiment, a plurality of elastic members 55 are provided corresponding to the plurality of plungers 51, respectively.

而且，於柱塞塊體5A或本體塊體5B的一者，形成有在長度方向延伸的滑槽53，於柱塞塊體5A或本體塊體5B的另一者，形成有滑動部54，所述滑動部54沿著滑槽53滑動地嵌合。在本實施形態中，於本體塊體5B形成有滑槽53，於柱塞塊體5A形成有滑動部54。柱塞塊體5A的滑動部54利用基座體52而構成。Furthermore, a slide groove 53 extending in the longitudinal direction is formed on one of the plunger block 5A or the body block 5B, and a sliding portion 54 is formed on the other of the plunger block 5A or the body block 5B. The sliding portion 54 is slidably fitted along the sliding groove 53. In this embodiment, the slide groove 53 is formed in the main body block 5B, and the sliding portion 54 is formed in the plunger block 5A. The sliding portion 54 of the plunger block 5A is configured by the base body 52.

又，於本體塊體5B的下表面，形成有滑動部56，所述滑動部56滑動地嵌合於驅動機構6的滑槽61。再者，驅動機構6的滑槽61亦與所述滑槽53同樣地，在長度方向延伸。In addition, a sliding portion 56 is formed on the lower surface of the body block 5B, and the sliding portion 56 is slidably fitted into the sliding groove 61 of the drive mechanism 6. In addition, the slide groove 61 of the drive mechanism 6 also extends in the longitudinal direction in the same manner as the slide groove 53 described above.

於柱塞51，設置有用以將柱塞塊體5A固定於下模保持構件4的例如為切口等的固定部511。於所述固定部511，供固定構件7（參照圖3）***。又，於下模保持構件4亦設置有供固定構件7***的固定部41（參照圖1），藉由例如平板狀的固定構件7***柱塞51的固定部511與下模保持構件4的固定部41，而將柱塞塊體5A固定於下模保持構件4。藉此，防止柱塞塊體5A在卸下本體塊體5B的狀態下掉落。The plunger 51 is provided with a fixing portion 511 such as a slit or the like for fixing the plunger block 5A to the lower mold holding member 4. In the fixing portion 511, the fixing member 7 (see FIG. 3) is inserted. In addition, the lower mold holding member 4 is also provided with a fixing portion 41 (see FIG. 1) into which the fixing member 7 is inserted. The fixing portion 511 of the plunger 51 is inserted into the fixing portion 511 of the lower mold holding member 4 by, for example, a flat plate-shaped fixing member 7. The fixing portion 41 fixes the plunger block 5A to the lower mold holding member 4. Thereby, the plunger block 5A is prevented from falling in a state where the body block 5B is detached.

又，於本體塊體5B，設置有握持部58。藉由抓著所述握持部58進行操作，而容易地進行如下的操作：自樹脂成形裝置100卸下本體塊體5B、或將本體塊體5B安裝於樹脂成形裝置100。In addition, the body block 5B is provided with a grip portion 58. By grasping the grip portion 58 and performing the operation, the following operations are easily performed: the body block 5B is detached from the resin molding device 100 or the body block 5B is mounted on the resin molding device 100.

另外，於柱塞單元5設置有固定銷57，於柱塞塊體5A及本體塊體5B，於將該等連結而一體化的狀態下位置相互對齊的部位，各自形成有供固定銷57***的孔。在使柱塞塊體5A的滑動部54滑動地嵌合於本體塊體5B的滑槽53而一體化後，柱塞塊體5A與本體塊體5B藉由固定銷57固定。藉此，可防止一體化的柱塞塊體5A與本體塊體5B沿著長度方向的前後的位置偏移。In addition, the plunger unit 5 is provided with a fixing pin 57, and the plunger block 5A and the main body block 5B are aligned with each other in a state where they are connected and integrated, and the fixing pin 57 is formed for insertion Hole. After the sliding portion 54 of the plunger block 5A is slidably fitted into the slide groove 53 of the body block 5B and integrated, the plunger block 5A and the body block 5B are fixed by the fixing pin 57. Thereby, the positional displacement of the integrated plunger block 5A and the main body block 5B in the longitudinal direction can be prevented.

＜柱塞51的更換方法＞ 其次，參照圖3～圖9對柱塞51的更換方法進行說明。<How to replace plunger 51> Next, the method of replacing the plunger 51 will be described with reference to FIGS. 3 to 9.

（1）在卸下柱塞51時 首先，如圖3所示，使驅動機構6上升或下降而配置於合適的位置後，卸下***柱塞塊體5A的孔與本體塊體5B的孔的固定銷57，將固定構件7自側面***柱塞塊體5A的固定部511及下模保持構件4的固定部41，而將柱塞塊體5A暫時地固定於下模保持構件4。然後，如圖4所示，藉由將握持部58朝與樹脂成形裝置100相反側拉，而使本體塊體5B自下模2與驅動機構6之間滑動而卸下。此時的卸下方向是與由驅動機構6移動柱塞51的進退方向正交的方向（橫方向）。藉由卸下本體塊體5B，而如圖5所示，在柱塞塊體5A與驅動機構6之間形成有空間部X。(1) When removing the plunger 51 First, as shown in FIG. 3, after the driving mechanism 6 is raised or lowered and placed in a proper position, the fixing pin 57 inserted into the hole of the plunger block 5A and the hole of the body block 5B is removed, and the fixing member 7 is removed from the The fixing portion 511 of the plunger block 5A and the fixing portion 41 of the lower die holding member 4 are inserted into the side surfaces, and the plunger block 5A is temporarily fixed to the lower die holding member 4. Then, as shown in FIG. 4, the main body block 5B is slid from between the lower mold 2 and the drive mechanism 6 by pulling the grip portion 58 toward the side opposite to the resin molding device 100 to remove it. The removal direction at this time is a direction (horizontal direction) orthogonal to the advancing and retreating direction of the plunger 51 moved by the drive mechanism 6. By removing the body block 5B, as shown in FIG. 5, a space X is formed between the plunger block 5A and the drive mechanism 6.

然後，使驅動機構6朝柱塞塊體5A側上升，處於用以固定治具塊體8的規定位置。藉由在位於此位置的驅動機構6與柱塞塊體5A之間***治具塊體8，而如圖6所示，將柱塞塊體5A與治具塊體8加以連結。於此種狀態下，在卸下固定構件7而解除柱塞塊體5A向下模保持構件4的暫時的固定後，將固定銷57***柱塞塊體5A的孔與治具塊體8的孔，而將柱塞塊體5A與治具塊體8加以固定。Then, the drive mechanism 6 is raised toward the plunger block 5A side, and is at a predetermined position for fixing the jig block 8. By inserting the jig block 8 between the drive mechanism 6 at this position and the plunger block 5A, as shown in FIG. 6, the plunger block 5A and the jig block 8 are connected. In this state, after removing the fixing member 7 and releasing the temporary fixing of the plunger block 5A to the lower die holding member 4, the fixing pin 57 is inserted into the hole of the plunger block 5A and the jig block 8 Hole to fix the plunger block 5A and the jig block 8.

此處，如圖6所示，治具塊體8具有較本體塊體5B的高度方向（由驅動機構6移動柱塞51的進退方向）更短的尺寸，且具有：滑槽81，供柱塞塊體5A的滑動部54滑動；滑動部82，於驅動機構6的滑槽61滑動；以及握持部83（參照圖8），用以容易地操作朝樹脂成形裝置100的***或抽出。Here, as shown in FIG. 6, the jig block 8 has a shorter size than the height direction of the body block 5B (the direction in which the plunger 51 is moved by the drive mechanism 6 ), and has: a chute 81 for the column The sliding portion 54 of the plug block 5A slides; the sliding portion 82 slides on the sliding groove 61 of the drive mechanism 6; and the grip portion 83 (see FIG. 8) for easy operation of insertion or extraction into the resin molding apparatus 100.

使驅動機構6下降，而如圖7所示，使柱塞塊體5A移動至空間部X。藉此，柱塞51自下模2的槽21被朝下側抽出。其後，如圖8所示，藉由將握持部83朝與樹脂成形裝置100相反側拉，而使柱塞塊體5A及治具塊體8自下模2與驅動機構6之間滑動而卸下。藉此，如圖9所示，成為將柱塞單元5自下模2與驅動機構6之間卸下的狀態。再者，亦可在將治具塊體8安裝於驅動機構6的狀態下，卸下固定銷57，而僅將柱塞塊體5A自下模2與驅動機構6之間卸下。The drive mechanism 6 is lowered, and as shown in FIG. 7, the plunger block 5A is moved to the space portion X. As a result, the plunger 51 is drawn downward from the groove 21 of the lower mold 2. Thereafter, as shown in FIG. 8, the plunger block 5A and the jig block 8 are slid from between the lower die 2 and the drive mechanism 6 by pulling the grip 83 toward the side opposite to the resin molding device 100 And remove. As a result, as shown in FIG. 9, the plunger unit 5 is removed from between the lower mold 2 and the drive mechanism 6. Furthermore, in a state where the jig block 8 is attached to the drive mechanism 6, the fixing pin 57 may be removed, and only the plunger block 5A may be removed from between the lower die 2 and the drive mechanism 6.

藉由如以上所述的步驟，在較下模2的模具面更下側（驅動機構6側）進行柱塞單元5（柱塞51）的卸下作業。With the steps described above, the plunger unit 5 (plunger 51) is removed from the mold surface of the lower mold 2 (driving mechanism 6 side).

（2）在安裝柱塞51時 首先，將治具塊體8及柱塞塊體5A安裝於驅動機構6，所述治具塊體8及柱塞塊體5A連結、一體化且利用固定銷57固定（參照圖8）。此時，於安裝柱塞塊體5A時，驅動機構6處於下降狀態以不使柱塞塊體5A與下模2接觸（參照圖9）。(2) When installing the plunger 51 First, the jig block 8 and the plunger block 5A are attached to the drive mechanism 6, the jig block 8 and the plunger block 5A are connected, integrated, and fixed by the fixing pin 57 (see FIG. 8 ). At this time, when installing the plunger block 5A, the drive mechanism 6 is in a lowered state so as not to contact the plunger block 5A with the lower mold 2 (see FIG. 9 ).

在將柱塞塊體5A安裝於驅動機構6後（參照圖7），使驅動機構6上升，而將柱塞51***下模2的槽21內。再者，雖未圖示，但槽21的下側開口部為了易於***柱塞51而被設置為錐形（taper）面。After the plunger block 5A is attached to the drive mechanism 6 (see FIG. 7 ), the drive mechanism 6 is raised, and the plunger 51 is inserted into the groove 21 of the lower mold 2. In addition, although not shown, the lower opening of the groove 21 is provided with a tapered surface for easy insertion of the plunger 51.

於此種狀態下，在卸下固定銷57而解除治具塊體8與柱塞塊體5A的固定後，如圖6所示，藉由將固定構件7***柱塞塊體5A的固定部511與下模保持構件4的固定部41，而將柱塞塊體5A暫時地固定於下模保持構件4。在此種固定之後，如圖5所示，卸下治具塊體8。藉此，柱塞塊體5A與驅動機構6的連結被解除。In this state, after removing the fixing pin 57 to release the fixing of the jig block 8 and the plunger block 5A, as shown in FIG. 6, by inserting the fixing member 7 into the fixing portion of the plunger block 5A 511 and the fixed portion 41 of the lower mold holding member 4 temporarily fix the plunger block 5A to the lower mold holding member 4. After such fixing, as shown in FIG. 5, the jig block 8 is removed. With this, the connection between the plunger block 5A and the drive mechanism 6 is released.

然後，在使驅動機構6下降而配置於合適的位置後，自下模2與驅動機構6之間***本體塊體5B（參照圖4）。藉此，如圖3所示，本體塊體5B與柱塞塊體5A被一體化，並且將本體塊體5B與驅動機構6加以連結。Then, after lowering the drive mechanism 6 and arranging it in a proper position, the body block 5B is inserted between the lower die 2 and the drive mechanism 6 (see FIG. 4 ). Thereby, as shown in FIG. 3, the body block 5B and the plunger block 5A are integrated, and the body block 5B and the drive mechanism 6 are connected.

在安裝本體塊體5B後，卸下固定構件7，藉由固定銷57將本體塊體5B與柱塞塊體5A加以固定。After the body block 5B is installed, the fixing member 7 is removed, and the body block 5B and the plunger block 5A are fixed by the fixing pin 57.

藉由如以上所述的步驟，而於較下模2的模具面更下側（驅動機構6側）進行柱塞單元5（柱塞51）的安裝作業。By the steps described above, the installation operation of the plunger unit 5 (plunger 51) is performed on the lower side (the drive mechanism 6 side) of the lower die 2 mold surface.

＜本實施形態的效果＞ 根據本實施形態的樹脂成形裝置100，由於柱塞單元5構成為能夠分離為柱塞塊體5A與本體塊體5B，而自形成有槽21的下模2與驅動機構6之間分別拆裝所述塊體5A、塊體5B，故可在更換柱塞51時防止柱塞51或工具與下模2及上模3的模具面接觸，從而可防止損傷模具面。其結果為，可降低因模具面損傷而產生的樹脂成形品的不良。又，由於無需在下模2與上模3之間作業，故可降低因誤觸碰為了樹脂成形而被加熱的成形模具而被燙傷的可能性。<Effects of this embodiment> According to the resin molding apparatus 100 of the present embodiment, since the plunger unit 5 is configured to be separable into the plunger block 5A and the main body block 5B, it is separately detachable from the lower mold 2 in which the groove 21 is formed and the drive mechanism 6 The block 5A and block 5B can prevent the plunger 51 or tool from contacting the mold surfaces of the lower mold 2 and the upper mold 3 when replacing the plunger 51, thereby preventing damage to the mold surface. As a result, defects of the resin molded product caused by damage to the die surface can be reduced. In addition, since there is no need to work between the lower mold 2 and the upper mold 3, the possibility of being scalded by accidentally touching the molding mold heated for resin molding can be reduced.

在本實施形態中，由於在自下模2與驅動機構6之間拆裝本體塊體5B之前，藉由固定構件7將柱塞塊體5A暫時地固定於裝置側，故在拆裝本體塊體5B時，柱塞塊體5A不會成為妨礙，從而可提高拆裝本體塊體5B的作業性。In this embodiment, the plunger block 5A is temporarily fixed to the device side by the fixing member 7 before the body block 5B is detached from the lower mold 2 and the drive mechanism 6, so the body block is detached In the case of the body 5B, the plunger block 5A does not interfere, and the workability of attaching and detaching the body block 5B can be improved.

又，由於藉由驅動機構6使柱塞塊體5A移動至空間部X，故無需準備用以使柱塞塊體5A移動的其他驅動源，又，與利用手動作業進行使柱塞塊體5A移動至所期望的位置（例如，柱塞***槽的位置或柱塞被自槽抽出的位置）的作業的情況相比可容易地進行。此處，由於藉由較本體塊體5B短的治具塊體8將柱塞塊體5A與驅動機構6加以連結，故不僅使柱塞塊體5A穩定地移動，而且無需增大驅動機構6的移動量（即無需過大地確保空間部X），而可防止驅動機構6的大型化，進而可防止樹脂成形裝置100的大型化。In addition, since the plunger block 5A is moved to the space portion X by the driving mechanism 6, there is no need to prepare another driving source for moving the plunger block 5A. Moreover, the plunger block 5A is manually operated. The operation of moving to a desired position (for example, the position where the plunger is inserted into the groove or the position where the plunger is drawn out of the groove) can be performed relatively easily. Here, since the plunger block 5A and the drive mechanism 6 are connected by the jig block 8 shorter than the body block 5B, not only does the plunger block 5A move stably, but the drive mechanism 6 does not need to be enlarged The amount of movement (ie, it is not necessary to secure the space portion X excessively) can prevent the drive mechanism 6 from increasing in size, and furthermore can prevent the resin molding apparatus 100 from increasing in size.

進而，於多柱塞方式的樹脂成形裝置100中，由於柱塞塊體5A具有多個柱塞51，故可一齊拆裝多個柱塞51，可高效率地進行更換多個柱塞51的作業，從而可縮短更換柱塞51的作業時間。Furthermore, in the multi-plunger resin molding apparatus 100, since the plunger block 5A has a plurality of plungers 51, the plurality of plungers 51 can be detached together, and the plurality of plungers 51 can be replaced efficiently The work can shorten the work time for replacing the plunger 51.

＜其他變形實施形態＞ 再者，本發明並不限於所述實施形態。<Other modified embodiments> Furthermore, the present invention is not limited to the above-mentioned embodiment.

例如，在所述實施形態中，利用固定構件7將柱塞塊體5A暫時地固定於下模保持構件4，但亦可固定於下模2或樹脂成形裝置100的衝壓機構部等柱塞單元5的周邊的構件。For example, in the above embodiment, the plunger block 5A is temporarily fixed to the lower die holding member 4 by the fixing member 7, but it may also be fixed to the plunger unit such as the lower die 2 or the press mechanism portion of the resin molding apparatus 100 5 Peripheral components.

又，所述實施形態的治具塊體8為嵌於柱塞塊體5A的滑動部54及驅動機構6的滑槽61的結構，但只要為例如夾緊（clamp）機構或螺桿機構等般將柱塞塊體5A及驅動機構6機械地加以連結者即可。In addition, the jig block 8 of the above-described embodiment has a structure that is fitted into the sliding portion 54 of the plunger block 5A and the sliding groove 61 of the drive mechanism 6, but as long as it is, for example, a clamp mechanism or a screw mechanism, etc. It suffices to mechanically connect the plunger block 5A and the drive mechanism 6.

在所述實施形態中，利用固定螺桿57將柱塞塊體5A與本體塊體5B的連結、或柱塞塊體5A與治具塊體8的連結加以固定，但可利用能夠防止連結物的前後的位置偏移的適當的機構。又，拆裝固定螺桿57及固定構件7的順序可根據裝置的結構或固定的必要性而適當調換。In the above embodiment, the fixing screw 57 is used to fix the connection between the plunger block 5A and the main body block 5B, or the connection between the plunger block 5A and the jig block 8, but it is possible to use Appropriate mechanism for front-to-back position shift. In addition, the order of attaching and detaching the fixing screw 57 and the fixing member 7 can be appropriately changed according to the structure of the device or the necessity of fixing.

進而，在所述實施形態中，於下模形成有槽，於上模形成有模穴，但槽或模穴可形成於任一成形模具。Furthermore, in the above embodiment, a groove is formed in the lower mold and a cavity is formed in the upper mold, but the groove or cavity may be formed in any molding die.

此外，樹脂成形裝置並不限定於多柱塞方式，亦可具有一個柱塞即可。此時，柱塞塊體成為具有一個柱塞的構成。In addition, the resin molding apparatus is not limited to the multi-plunger system, and may have only one plunger. At this time, the plunger block has a configuration with one plunger.

本體塊體亦可為不具有用以使柱塞的按壓力均一化的彈性構件的構成。The main body block may be a structure that does not have an elastic member for equalizing the pressing force of the plunger.

而且，一對成形模具並不限於上模及下模，亦可為能夠用於轉注成形的其他成形模具（例如，存在中間板的頂部澆口型（top gate type）的成形模具）。In addition, the pair of forming dies is not limited to the upper and lower dies, and may be other forming dies that can be used for injection molding (for example, a top gate type forming die with an intermediate plate).

此外，當然，本發明並不限於所述實施形態，在不脫離本發明主旨的範圍內可進行各種變形。In addition, of course, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention.

2:成形模具（下模） 3:成形模具（上模） 4:下模保持構件（模保持構件） 5:柱塞單元 5A:柱塞塊體（塊體） 5B:本體塊體（塊體） 6:驅動機構 7:固定構件 8:治具塊體 21:槽 31:模穴 32:坳部 33:澆道 41:固定部 51:柱塞 52:基座體 53、61、81:滑槽 54、56、82:滑動部 55:彈性構件 57:固定銷（固定螺桿） 58、83:握持部 100:樹脂成形裝置 511:固定部 J:樹脂材料 W:成形對象物 Wx:電子零件 X:空間部2: Forming mold (lower mold) 3: Forming mold (upper mold) 4: Lower die holding member (die holding member) 5: Plunger unit 5A: Plunger block (block) 5B: Ontology block (block) 6: Drive mechanism 7: fixed member 8: Fixture block 21: slot 31: Mold cavity 32: Depression 33: Sprue 41: fixed part 51: plunger 52: base body 53, 61, 81: Chute 54, 56, 82: sliding part 55: elastic member 57: fixed pin (fixed screw) 58, 83: Grip 100: resin molding device 511: fixed part J: resin material W: Forming object Wx: electronic parts X: Space Department

圖1是示意性地表示本發明一實施形態的樹脂成形裝置的構成的剖視圖。 圖2（a）是本實施形態的柱塞單元的立體圖，圖2（b）是柱塞單元的分解立體圖。 圖3是表示藉由本實施形態的固定構件將柱塞塊體暫時地固定的狀態的剖視圖。 圖4是表示本實施形態的本體塊體卸下或安裝的中途的圖。 圖5是表示將本實施形態的本體塊體卸下的狀態的剖視圖。 圖6是表示藉由治具塊體連結本實施形態的柱塞塊體與驅動機構的狀態的剖視圖。 圖7是表示使本實施形態的柱塞塊體朝空間部移動的狀態的剖視圖。 圖8是表示本實施形態的柱塞塊體卸下或安裝的中途的圖。 圖9是表示將本實施形態的柱塞單元卸下的狀態的剖視圖。FIG. 1 is a cross-sectional view schematically showing the structure of a resin molding apparatus according to an embodiment of the present invention. FIG. 2(a) is a perspective view of the plunger unit of this embodiment, and FIG. 2(b) is an exploded perspective view of the plunger unit. 3 is a cross-sectional view showing a state where the plunger block is temporarily fixed by the fixing member of this embodiment. FIG. 4 is a diagram showing the process of removing or attaching the main body block of this embodiment. 5 is a cross-sectional view showing a state in which the body block of this embodiment is removed. 6 is a cross-sectional view showing a state in which the plunger block and the driving mechanism of this embodiment are connected by the jig block. 7 is a cross-sectional view showing a state where the plunger block of the present embodiment is moved toward the space. FIG. 8 is a diagram showing the process of removing or attaching the plunger block of this embodiment. 9 is a cross-sectional view showing a state in which the plunger unit of this embodiment is removed.

2:成形模具(下模) 2: Forming mold (lower mold)

3:成形模具(上模) 3: Forming mold (upper mold)

4:下模保持構件 4: Lower mold holding member

5:柱塞單元 5: Plunger unit

5A:柱塞塊體(塊體) 5A: Plunger block (block)

5B:本體塊體(塊體) 5B: Ontology block (block)

6:驅動機構 6: Drive mechanism

21:槽 21: slot

31:模穴 31: Mold cavity

32:坳部 32: Depression

33:澆道 33: Sprue

41:固定部 41: fixed part

51:柱塞 51: plunger

52:基座體 52: base body

53、61:滑槽 53, 61: Chute

54、56:滑動部 54, 56: sliding part

55:彈性構件 55: elastic member

100:樹脂成形裝置 100: resin molding device

511:固定部 511: fixed part

J:樹脂材料 J: resin material

W:成形對象物 W: Forming object

Wx:電子零件 Wx: electronic parts

Claims (9)

一種柱塞的更換方法，是樹脂成形裝置的柱塞的更換方法，所述樹脂成形裝置包括：柱塞單元，具有所述柱塞，所述柱塞自形成於成形模具的槽壓出樹脂材料；以及驅動機構，以所述柱塞在所述槽內進退的方式使所述柱塞單元移動；且 所述柱塞單元能夠分離為具有所述柱塞的柱塞塊體、以及支撐所述柱塞塊體的本體塊體； 自所述成形模具與所述驅動機構之間分別拆裝所述柱塞塊體與所述本體塊體。A method of replacing a plunger is a method of replacing a plunger of a resin molding device. The resin molding device includes a plunger unit having the plunger. The plunger presses out a resin material from a groove formed in a molding die And a drive mechanism to move the plunger unit in such a manner that the plunger advances and retreats in the groove; and The plunger unit can be separated into a plunger block with the plunger and a body block supporting the plunger block; The plunger block and the body block are separately assembled and disassembled from the forming mold and the driving mechanism. 如申請專利範圍第1項所述的柱塞的更換方法，其中在卸下所述柱塞時，自所述成形模具與所述驅動機構之間卸下所述本體塊體，使所述柱塞塊體移動至卸下所述本體塊體而形成的空間部後，自所述成形模具與所述驅動機構之間卸下所述柱塞塊體。The method of replacing a plunger as described in item 1 of the patent application range, wherein when the plunger is removed, the body block is removed from between the forming mold and the driving mechanism to make the post After the plug block moves to the space formed by removing the body block, the plunger block is removed from between the forming mold and the drive mechanism. 如申請專利範圍第1項所述的柱塞的更換方法，其中在安裝所述柱塞時，自所述成形模具與所述驅動機構之間***所述柱塞塊體，且以所述柱塞位於所述槽內的方式使所述柱塞塊體移動，其後，自所述成形模具與所述驅動機構之間安裝所述本體塊體。The method for replacing a plunger according to item 1 of the patent application range, wherein when installing the plunger, the plunger block is inserted from between the forming mold and the driving mechanism, and the post The plunger block is moved in such a way that the plug is located in the groove, and thereafter, the body block is installed from between the forming mold and the driving mechanism. 如申請專利範圍第1項所述的柱塞的更換方法，其中在自所述成形模具與所述驅動機構之間拆裝所述本體塊體前，藉由固定構件將所述柱塞塊體暫時地固定於裝置側，而在拆裝所述本體塊體後，將所述固定構件卸下。The method of replacing a plunger according to item 1 of the patent application range, wherein the plunger block is fixed by a fixing member before the body block is disassembled from the forming mold and the drive mechanism It is temporarily fixed to the device side, and after the body block is detached, the fixing member is removed. 如申請專利範圍第2項所述的柱塞的更換方法，其中在卸下所述本體塊體的狀態下，藉由所述驅動機構使所述柱塞塊體移動至所述空間部。The method for replacing a plunger according to item 2 of the patent application range, wherein the plunger block is moved to the space portion by the driving mechanism in a state where the body block is removed. 如申請專利範圍第5項所述的柱塞的更換方法，其中在卸下所述本體塊體的狀態下，藉由較所述本體塊體短的治具塊體在由所述驅動機構而致的所述柱塞的進退方向上將所述柱塞塊體與所述驅動機構加以連結而使所述柱塞塊體移動。The method of replacing a plunger as described in item 5 of the patent application range, wherein in the state where the body block is removed, the driving mechanism is used by the jig block shorter than the body block. The plunger block is connected to the drive mechanism in the advancing and retreating direction of the plunger to move the plunger block. 如申請專利範圍第1項至第6項中任一項所述的柱塞的更換方法，其中所述柱塞塊體具有多個所述柱塞。The method of replacing a plunger according to any one of the first to sixth patent application ranges, wherein the plunger block has a plurality of plungers. 一種柱塞單元，具有柱塞，所述柱塞自成形模具的槽朝模穴壓出樹脂材料，且所述柱塞單元具有： 柱塞塊體，具有所述柱塞；以及本體塊體，支撐所述柱塞塊體； 所述柱塞塊體與所述本體塊體相互滑動而構成為能夠分離。A plunger unit has a plunger, the plunger presses a resin material from a groove of a forming mold toward a mold cavity, and the plunger unit has: A plunger block with the plunger; and a body block supporting the plunger block; The plunger block and the body block are slidable with each other to be separable. 一種樹脂成形裝置，包括：柱塞單元，具有柱塞，所述柱塞自成形模具的槽朝模穴壓出樹脂材料；以及 驅動機構，以所述柱塞在所述槽內進退的方式使所述柱塞單元移動；且 所述柱塞單元具有：柱塞塊體，具有所述柱塞；以及本體塊體，支撐所述柱塞塊體；所述柱塞塊體與所述本體塊體相互滑動而構成為能夠分離。A resin molding device, including: a plunger unit having a plunger, the plunger pressing out a resin material from a groove of a molding die toward a die cavity; and A driving mechanism to move the plunger unit in such a manner that the plunger advances and retreats in the groove; and The plunger unit includes: a plunger block having the plunger; and a body block supporting the plunger block; the plunger block and the body block slide to each other to be separable .
TW108141044A 2018-11-21 2019-11-12 Plunger replacement method, plunger unit and resin molding apparatus TWI725612B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-217985 2018-11-21
JP2018217985A JP6701308B1 (en) 2018-11-21 2018-11-21 Plunger replacement method, plunger unit, and resin molding device

Publications (2)

Publication Number Publication Date
TW202019659A true TW202019659A (en) 2020-06-01
TWI725612B TWI725612B (en) 2021-04-21

Family

ID=70773073

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108141044A TWI725612B (en) 2018-11-21 2019-11-12 Plunger replacement method, plunger unit and resin molding apparatus

Country Status (5)

Country Link
JP (1) JP6701308B1 (en)
KR (1) KR102463979B1 (en)
CN (1) CN112889139B (en)
TW (1) TWI725612B (en)
WO (1) WO2020105384A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7341115B2 (en) * 2020-11-24 2023-09-08 Ｔｏｗａ株式会社 Resin powder collection member, plunger unit, resin molding device, and method for manufacturing resin molded products

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382716A (en) * 1986-09-26 1988-04-13 Yazaki Corp Mold equipment of transfer molding tool
JP3515580B2 (en) * 1991-08-07 2004-04-05 ルーク ラメレン ウント クツプルングスバウ ベタイリグングス コマンディートゲゼルシャフト Disc-shaped components for belt transmission
JP3144714B2 (en) 1992-08-27 2001-03-12 アピックヤマダ株式会社 Transfer mold equipment
JP3200151B2 (en) * 1992-04-13 2001-08-20 アピックヤマダ株式会社 Transfer molding method and transfer molding apparatus
JP3710219B2 (en) * 1996-08-07 2005-10-26 アピックヤマダ株式会社 Plunger support structure for resin molding equipment
JPH11163012A (en) * 1997-12-02 1999-06-18 Shibaura Mechatronics Corp Die for molding and method for setting up die for molding
JP3274835B2 (en) * 1998-05-26 2002-04-15 松下電工株式会社 Plunger replacement method and replacement structure for sealing mold
JP4320921B2 (en) * 2000-05-31 2009-08-26 住友ベークライト株式会社 Resin material supply apparatus and method
JP4194596B2 (en) * 2005-11-25 2008-12-10 第一精工株式会社 Resin sealing mold apparatus and resin sealing method
US10706980B2 (en) 2011-06-02 2020-07-07 Australian Nuclear Science And Technology Organisation Filling devices, systems and methods for transferring hazardous waste material into a sealable container

Also Published As

Publication number Publication date
WO2020105384A1 (en) 2020-05-28
TWI725612B (en) 2021-04-21
JP6701308B1 (en) 2020-05-27
KR102463979B1 (en) 2022-11-07
KR20210049903A (en) 2021-05-06
CN112889139A (en) 2021-06-01
JP2020088079A (en) 2020-06-04
CN112889139B (en) 2024-03-26

Similar Documents

Publication Publication Date Title
JP6320448B2 (en) Resin sealing device and resin sealing method
TWI750369B (en) Resin molding die and resin molding device
JP2020064919A (en) Transfer device, resin molding device, transfer method, and resin molding product manufacturing method
TWI725612B (en) Plunger replacement method, plunger unit and resin molding apparatus
TWI730336B (en) Resin molding apparatus and method for manufacturing resin molded product
CN110621463A (en) Molding die and resin molding method
JP6423677B2 (en) Mold, molding apparatus, and method for manufacturing molded product
CN112677422B (en) Method for producing resin molded article and resin molding apparatus
JP6693798B2 (en) Resin molding apparatus and resin molding method
JP2012143937A (en) Resin molding apparatus
JP2009148934A (en) Resin sealing mold and usage method of resin sealing mold
TWI744088B (en) Manufacturing method of resin molded product and resin molding device
JPS61114824A (en) Resin molding apparatus
JP2802272B2 (en) Semiconductor device manufacturing method suitable for high-mix low-volume production
JP7430125B2 (en) Molding mold, resin molding equipment, and method for manufacturing resin molded products
JP4164504B2 (en) Resin molding equipment
JP7068144B2 (en) Resin mold press equipment and resin mold equipment
JPH0716879A (en) Molding die for electronic component
TWM488386U (en) Injection mold for embedded positioning apparatus
JPH06349872A (en) Metal mold for molding electronic parts
JP2022039710A (en) Resin molding device and manufacturing method of the resin molding
JPH05124069A (en) Molding die for electronic part
JP2020108973A (en) Resin molding apparatus and resin molding method
CN114474564A (en) Resin sealing device and workpiece conveying method
JPH08108446A (en) Apparatus for producing resin mold