TW202019010A - Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus - Google Patents

Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus Download PDF

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TW202019010A
TW202019010A TW108119199A TW108119199A TW202019010A TW 202019010 A TW202019010 A TW 202019010A TW 108119199 A TW108119199 A TW 108119199A TW 108119199 A TW108119199 A TW 108119199A TW 202019010 A TW202019010 A TW 202019010A
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conductor
transmission line
shield
main surface
base material
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TW108119199A
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Chinese (zh)
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TWI748191B (en
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竹村勇一
久保田重計
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日商天龍精機股份有限公司
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Priority claimed from JP2018195188A external-priority patent/JP6507302B1/en
Priority claimed from JP2019029386A external-priority patent/JP6611293B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0246—Termination of transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The purpose of the present invention is to provide a thin transmission line that is shielded over the entire periphery to reduce crosstalk. As a solution, a transmission line (20) comprises a base (30) in which a first conductor (31) composed of a transmission line conductor (32) and a ground conductor (33) is formed on a first main surface (34a) of a first base material (34). The first main surface (34a) in the first base material (34) and a coverlay (35), the surface of the base (30) on the side opposite to the first main surface (34a) and the side of a second main surface (42a) of a first shield (40), the surface of the base (30) on the side opposite to the first main surface (34a) and the second main surface (42a) side of a first shield (40), and the coverlay (35) and the second main surface (42a) side of a second shield (45) are respectively the rmocompression bonded together. A second conductor (41) and a third conductor (46) are ultrasonically bonded to each other, and the second conductor (41) and the third conductor (46) are disposed to surround each of the transmission line conductors (32).

Description

傳送線路、傳送線路的製造方法及傳送線路的製造裝置 Transmission line, transmission line manufacturing method, and transmission line manufacturing device

本發明係關於傳送線路、傳送線路的製造方法及傳送線路的製造裝置。 The invention relates to a transmission line, a method for manufacturing a transmission line, and a device for manufacturing a transmission line.

近年來，電子機器之高密度安裝技術的發展顯著，使用敷銅層板(CCL；Copper Clad Laminate)之薄型傳送線路的需要日益升高。 In recent years, the development of high-density mounting technology for electronic equipment has been remarkable, and the need for thin transmission lines using copper-clad laminates (CCL; Copper Clad Laminate) is increasing.

以往，有提出一種平板(flat)型屏蔽電纜的製造方法(專利文獻1：日本特許第3497110號公報)，其係具有：在由液晶聚合物構成之絕緣體層的一主面的單側區域或中央區域，以彼此絕緣隔離之方式形成信號配線及接地配線之工程；在前述絕緣體層的另一主面，將具有可與前述接地配線連接的導電性突起部之導電性箔定位並積層配置之工程；將前述積層體加壓並一體化，使貫穿前述絕緣體層的導電性突起部與接地配線電性連接之工程；使前述絕緣體層沿著前述各配線之形成區域的外側彎折非形成區域，而使各配線的形成區域面及非形成區域面對向並一體化，將前述另一主面的導電性箔進行屏蔽層化之工程。 Conventionally, there has been proposed a method of manufacturing a flat-type shielded cable (Patent Document 1: Japanese Patent No. 3497110), which has a single-sided region on one main surface of an insulator layer composed of a liquid crystal polymer or In the central area, the signal wiring and the ground wiring are formed in an insulated manner; on the other main surface of the insulator layer, a conductive foil having conductive protrusions that can be connected to the ground wiring is positioned and stacked The process of pressurizing and integrating the laminate to electrically connect the conductive protrusions penetrating the insulator layer to the ground wiring; bending the insulator layer along the outside of the formation area of the wires The area in which the formation area surface and the non-formation area of each wiring face each other is integrated, and the conductive foil of the other main surface is shielded.

有提出一種高頻信號線路(專利文獻2：日本實用新案登錄第3173143號公報)，其構成為具備：具有可撓性的介電元件(液晶聚合物)；線狀信號線，設置於前述介電元件；接地導體，設於前述介電元件且與前述信號線對向；和輔助接地導體，在前述介電元件之主面的法線方向，相對於前述信號線設置在前 述接地導體的相反側，其中包含兩個主要部及橋接部，在從該法線方向俯視觀看時，該兩個主要部係挾持前述信號線，並且沿著該信號線延伸，該橋接部係連接該兩個主要部，並且與該信號線交叉；及通孔導體，將前述輔助接地導體與前述接地導體電性連接；在前述法線方向，前述信號線與前述輔助接地導體的間隔係小於前述信號線與前述接地導體的間隔。 There is proposed a high-frequency signal line (Patent Document 2: Japanese Utility Model Registration No. 3173143), which is configured to include: a flexible dielectric element (liquid crystal polymer); and a linear signal line provided on the aforementioned dielectric Electrical components; ground conductors, which are provided on the dielectric components and opposite to the signal lines; and auxiliary ground conductors, which are disposed in front of the signal lines in the normal direction of the main surface of the dielectric components The opposite side of the ground conductor includes two main parts and a bridge part. When viewed from above in the normal direction, the two main parts hold the aforementioned signal line and extend along the signal line. The bridge part is Connecting the two main parts and crossing the signal line; and a via conductor, electrically connecting the auxiliary ground conductor and the ground conductor; in the normal direction, the distance between the signal line and the auxiliary ground conductor is less than The distance between the signal line and the ground conductor.

且，有提出一種在信號導體的兩側，將接地導體配置在與信號導體相同的平面上，將該等信號導體及接地導體從上下兩方向以電性絕緣薄膜被覆，作成設有導電性接著層的面彼此面對並以金屬遮蔽層被覆於電性絕緣薄膜的外側而成之信號傳送用纜線(專利文獻3：日本特開2006-202714號公報)。 Furthermore, it is proposed to arrange the ground conductors on the same plane as the signal conductors on both sides of the signal conductors, and cover the signal conductors and the ground conductors with electrical insulating films from the top and bottom directions to make them conductive. A signal transmission cable formed by the surfaces of the layers facing each other and covering the outer side of the electrical insulating film with a metal shielding layer (Patent Document 3: Japanese Patent Laid-Open No. 2006-202714).

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特許第3497110號公報 [Patent Document 1] Japanese Patent No. 3497110

[專利文獻2]日本實用新案登錄第3173143號公報 [Patent Document 2] Japanese Utility Model Registration No. 3173143

[專利文獻3]日本特開2006-202714號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2006-202714

期望傳送線路具有可維持抑制外來雜訊的屏蔽性能並且與省空間對應之薄型構造。尤其，降低傳送線路間的串音(cross talk)是課題所在。又，對於傳送線路的製造廠商，要求以可因應於行動資訊終端等急速需求擴大的短生產時間來生產傳送線路或其中間體。 The transmission line is expected to have a thin structure that can maintain the shielding performance of suppressing extraneous noise and corresponds to space saving. In particular, reducing cross talk between transmission lines is a problem. In addition, manufacturers of transmission lines are required to produce transmission lines or their intermediates in a short production time that can be expanded in response to rapid demands such as mobile information terminals.

此處，傳送線路的中間體係指成為傳送線路之前階 段的半成品，尤其是指涵蓋全周進行屏蔽之構造的狀態之半成品。 Here, the intermediate system of the transmission line refers to the stage before the transmission line The semi-finished products of the segment, especially the semi-finished products covering the state of the shielding structure throughout the week.

對於上述課題，專利文獻1的傳送線路，在將敷銅層板彎曲的構造上，於涵蓋全周範圍進行屏蔽的情況時難以薄型化。又，專利文獻2的傳送線路，由於在側面未實施屏蔽，所以與涵蓋全周進行屏蔽的構造相比，屏蔽性能變差，且串音變大。 而專利文獻2及專利文獻3的傳送線路，由於係使焊料膏或導電性接著劑等的導電糊熱硬化來連接接地導體與屏蔽導體，所以導電糊的熱硬化時間成為瓶頸，無法將生產時間(生產節拍：takt time)設成比熱硬化時間還短。又，在使用接著劑將敷銅層板彼此接合的情況也會有同樣的問題。在習知技術方面，也想到在傳送線路間打設通路來謀求降低串音之方法，惟因需要多數的通路加工，所以製造成本會變高。 Regarding the above-mentioned problems, the transmission line of Patent Document 1 is difficult to be thinned when the copper-clad laminate is bent to shield the entire circumference. In addition, since the transmission line of Patent Document 2 is not shielded on the side, the shielding performance becomes worse and the crosstalk becomes larger than the structure covering the entire circumference. In the transmission lines of Patent Document 2 and Patent Document 3, since the conductive paste such as solder paste or conductive adhesive is thermally hardened to connect the ground conductor and the shield conductor, the thermal curing time of the conductive paste becomes a bottleneck, and the production time cannot be reduced. (Production cycle: takt time) is set to be shorter than the heat hardening time. In addition, the same problem occurs when bonding copper-clad laminates to each other using an adhesive. In terms of conventional technology, it is also thought of a method of establishing a path between transmission lines to reduce crosstalk. However, since a large amount of path processing is required, the manufacturing cost becomes higher.

本發明係有鑑於上述情事而完成者，目的在提供一種藉由將對向配置的敷銅層板相互接合的構成涵蓋全周進行屏蔽而降低串音之薄型傳送線路、及以一貫的生產線製造將薄型傳送線路或其中間體且藉由在不使用接著劑或導電糊的情況下將敷銅層板彼此接合，使得生產時間(生產節拍)比導電糊或接著劑的熱硬化時間還短之構成的傳送線路的製造方法、以及傳送線路的製造裝置。 The present invention has been completed in view of the above circumstances, and aims to provide a thin transmission line that reduces crosstalk by shielding the copper-clad laminates arranged opposite to each other to cover the entire circumference, and is manufactured on a consistent production line The thin transmission line or its intermediates and by bonding the copper-clad laminates without using an adhesive or conductive paste, the production time (production cycle) is shorter than the thermal hardening time of the conductive paste or adhesive A method for manufacturing a transmission line and a device for manufacturing a transmission line.

作為一實施形態，藉由如以下揭示之解決手段，得以解決前述課題。 As an embodiment, the aforementioned problems can be solved by the solution means disclosed below.

本發明的傳送線路，其特徵為：具備：基底，係將由傳送線路導體和與前述傳送線路導體的 輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面而成；覆蓋層，為覆蓋前述傳送線路導體的片狀且由熱塑性樹脂所構成；第1屏蔽物，係將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成；及第2屏蔽物，係將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成；前述第1基材中之前述第1主面與前述覆蓋層、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、及前述覆蓋層與前述第2屏蔽物的前述第2主面之側係彼此熱壓接；前述第2導體和前述第3導體係彼此藉由超音波接合，配設成以前述第2導體和前述第3導體包圍前述傳送線路導體。 The transmission line of the present invention is characterized by comprising: a base which is composed of the transmission line conductor and the transmission line conductor The first conductor composed of ground conductors close to the input end and the output end is formed on the first main surface of the first substrate made of a thermoplastic resin; the cover layer is a sheet covering the above-mentioned transmission line conductor It is made of thermoplastic resin; the first shield is formed by forming the second conductor on the second main surface of the second substrate made of sheet resin and made of thermoplastic resin; and the second shield is made of 3 The conductor is formed on a sheet-shaped third base material composed of a thermoplastic resin; the first main surface of the first base material is opposite to the first main surface of the cover layer and the base The side opposite to the second main surface of the first shield, the side opposite to the first main surface of the substrate, the side of the second main surface of the first shield, and the cover layer and The side of the second main surface of the second shield is thermocompression bonded to each other; the second conductor and the third conductor system are ultrasonically bonded to each other and arranged to be surrounded by the second conductor and the third conductor The aforementioned transmission line conductor.

本發明的傳送線路，其特徵為：具備：基底，係將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成之第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面，並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成；覆蓋層，為覆蓋各前述傳送線路導體的片狀且由熱塑性樹脂所構成；第1屏蔽物，係將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成；及第2屏蔽物，係將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成；前述第1基材中之前述第1主面與前述覆蓋層、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、前述基底中之前述第1主面的相反側的面與前述第1屏蔽 物的前述第2主面之側、及前述覆蓋層與前述第2屏蔽物的前述第2主面之側係彼此熱壓接；對向配置的前述第2導體和前述第3導體係彼此藉由超音波接合，配設成以前述第2導體和前述第3導體將前述傳送線路導體分別包圍。 The transmission line of the present invention is characterized by comprising: a substrate formed of a sheet-shaped thermoplastic resin and a first conductor formed of a transmission line conductor and a ground conductor close to the input end and the output end of the transmission line conductor respectively The first main surface of the first base material formed, and at least the transmission line conductor of the first conductor is formed with a plurality of predetermined pitches; a covering layer is a sheet-like shape covering each of the transmission line conductors and is composed of Made of thermoplastic resin; the first shield is formed by forming the second conductor on the second main surface of the second base material formed of a thermoplastic resin; and the second shield is formed by the third conductor In a sheet-like third base material composed of a thermoplastic resin; the surface opposite to the first main surface of the first main surface and the cover layer and the base of the first base material and the surface The side of the second main surface of the first shield, the surface of the base opposite to the first main surface and the first shield The side of the second main surface of the object, and the side of the cover layer and the side of the second main surface of the second shield are thermocompression-bonded to each other; the second conductor and the third conductive system disposed opposite each other By ultrasonic bonding, it is arranged that the second conductor and the third conductor respectively surround the transmission line conductor.

根據此構成，成為以夾著基底及覆蓋層而對向配置之第1屏蔽物的第2導體與第2屏蔽物的第3導體藉由超音波接合的狀態下包圍傳送線路導體之方式涵蓋全周範圍屏蔽而降低串音之薄型傳送線路。且，由於係在不使用接著劑或導電糊的情況下，將第1屏蔽物的第2導體與第2屏蔽物的第3導體藉由超音波接合，所以至少可作成接著劑或導電糊的厚度程度之薄型構造。 According to this configuration, the second conductor of the first shield and the third conductor of the second shield that are opposed to each other sandwiching the base and the cover layer surround the transmission line conductor in a state of ultrasonic bonding, covering all A thin transmission line that shields around to reduce crosstalk. Furthermore, since the second conductor of the first shield and the third conductor of the second shield are joined by ultrasound without using an adhesive or conductive paste, at least the adhesive or conductive paste can be made Thin structure of thickness.

舉例來說，在長度方向的兩側形成有切斷面。根據此構成，由於長度方向的兩側被切斷，所以寬度尺寸會成為一定。 For example, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, since both sides in the longitudinal direction are cut, the width dimension becomes constant.

本發明的傳送線路的製造方法，係為具備將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體以既定節距形成於片狀第1基材的第1主面而成之基底、覆蓋前述傳送線路導體的片狀覆蓋層、將第2導體形成於片狀第2基材的第2主面而成之第1屏蔽物、以及將第3導體形成於片狀第3基材而成之第2屏蔽物之傳送線路的製造方法，或者具備將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成之基底、為覆蓋各前述傳送線路導體的片狀且由熱塑性樹脂所構成之 覆蓋層、將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成之第1屏蔽物、以及將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成之第2屏蔽物之傳送線路的製造方法，其特徵為具備：第1熱壓接步驟，將前述覆蓋層熱壓接於前述第1主面；不要區域去除步驟，對熱壓接有前述覆蓋層的第1中間體，去除前述傳送線路導體與前述傳送線路導體之間的不要區域以形成貫通前述第1中間體之貫通孔；第2熱壓接步驟，對形成有前述貫通孔的第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面；及第1接合步驟，在熱壓接有前述第1屏蔽物的狀態下，將前述第3導體的露出面藉由超音波接合於前述第2導體的露出面。 The method for manufacturing a transmission line of the present invention includes a first conductor composed of a transmission line conductor and a ground conductor close to the input end and the output end of the transmission line conductor, respectively, formed on a sheet-shaped first base at a predetermined pitch A substrate formed by the first main surface of the material, a sheet-like covering layer covering the transmission line conductor, a first shield formed by forming the second conductor on the second main surface of the sheet-shaped second base material, and a first A method for manufacturing a transmission line of a second shield formed by a 3-conductor formed on a sheet-like third base material, or comprising a transmission line conductor and a ground conductor close to the input and output ends of the transmission line conductor, respectively The first conductor is formed on the first main surface of the first base material formed of a sheet-shaped thermoplastic resin, and at least the transmission line conductor of the first conductor is formed with a plurality of bases at a predetermined pitch to cover each The sheet of the aforementioned transmission line conductor is made of thermoplastic resin Cover layer, first shield formed by forming the second conductor on the second main surface of the second base material made of thermoplastic resin, and forming the third conductor in the form of sheet, and composed of thermoplastic resin The method for manufacturing the transmission line of the second shield made of the third base material is characterized by the following: a first thermocompression bonding step, which is to thermocompression bond the cover layer to the first main surface; an unnecessary area removal step, For the first intermediate body to which the cover layer is thermocompression-bonded, an unnecessary area between the transmission line conductor and the transmission line conductor is removed to form a through hole penetrating the first intermediate body; the second thermocompression bonding step is to form A second intermediate body having the through hole, thermocompression bonding the side of the second main surface of the first shield to the surface of the substrate opposite to the first main surface; and the first bonding step, in In a state where the first shield is thermocompression-bonded, the exposed surface of the third conductor is ultrasonically bonded to the exposed surface of the second conductor.

根據此構成，藉由將基底、覆蓋層、第1屏蔽物及第2屏蔽物以既定節距傳送，可經由第1熱壓接步驟、不要區域去除步驟、第2熱壓接步驟、及第1接合步驟，將涵蓋全周範圍屏蔽而降低串音之薄型傳送線路或其中間體以一貫的生產線製造。且，由於係在不使用接著劑或導電糊下，將第1屏蔽物的第2導體與第2屏蔽物的第3導體藉由超音波接合，所以可使生產時間(生產節拍)比導電糊或接著劑的熱硬化時間更短，所需的構成構件也可抑制為最小限度。 According to this configuration, by transferring the substrate, the cover layer, the first shield, and the second shield at a predetermined pitch, the first thermocompression bonding step, the unnecessary area removal step, the second thermocompression bonding step, and the second 1 The joining step will cover the entire circumference of the shield and reduce the crosstalk of the thin transmission line or its intermediate production on a consistent production line. Furthermore, since the second conductor of the first shield and the third conductor of the second shield are joined by ultrasound without using an adhesive or conductive paste, the production time (production cycle) can be made shorter than that of the conductive paste Or the heat hardening time of the adhesive is shorter, and the required constituent members can also be suppressed to a minimum.

較佳為，前述第2熱壓接步驟係對前述第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面，並且將前述第2屏蔽物的前述第2主面之側熱壓接於前述覆蓋層。根據此構成，由於係對第2中 間體，將第1屏蔽物的第2主面之側熱壓接於基底之第1主面的相反側之面，同時，將第2屏蔽物的第2主面之側熱壓接於覆蓋層，所以可防止第1屏蔽物或第2屏蔽物產生皺褶。 Preferably, the second thermocompression bonding step is thermocompression bonding the side of the second main surface of the first shield to the side opposite to the first main surface of the substrate to the second intermediate body Surface, and the side of the second main surface of the second shield is thermocompression bonded to the cover layer. According to this configuration, since the system Intermediate body, thermocompression bonding the side of the second main surface of the first shield to the opposite side of the first main surface of the substrate, and thermocompression bonding the side of the second main surface of the second shield to the cover Layer, so the first shield or the second shield can be prevented from being wrinkled.

本發明的傳送線路的製造裝置，其特徵為具備：基底供給機，係供給將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體以既定節距形成於片狀第1基材的第1主面而成之基底，或者供給將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成之基底；覆蓋層供給機，供給覆蓋前述傳送線路導體的片狀覆蓋層；第1屏蔽物供給機，供給將第2導體形成於片狀第2基材的第2主面而成之第1屏蔽物；第2屏蔽物供給機，供給將第3導體形成於片狀第3基材而成之第2屏蔽物；第1熱壓接機，將前述覆蓋層熱壓接於第1主面；不要區域去除機，對熱壓接有前述覆蓋層的第1中間體，去除前述傳送線路導體和前述傳送線路導體之間的不要區域以形成貫通前述第1中間體的貫通孔；第2熱壓接機，對形成有前述貫通孔的第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面；以及第1接合機，在熱壓接有前述第1屏蔽物的狀態下，將前述第3導體的露出面藉由超音波接合於前述第2導體的露出面。 The transmission line manufacturing apparatus of the present invention is characterized by comprising: a substrate feeder for feeding a first conductor composed of a transmission line conductor and a ground conductor close to the input end and output end of the transmission line conductor A base formed from the first main surface of the sheet-shaped first base material, or a first conductor formed of a transmission line conductor and a ground conductor close to the input and output ends of the transmission line conductor, respectively A sheet-shaped substrate composed of a first main surface of a thermoplastic resin and a plurality of substrates in which at least the transmission line conductors are formed at a predetermined pitch in the first conductor; Sheet coating layer of transmission line conductor; first shield supply machine, supply the first shield formed by forming the second conductor on the second main surface of the sheet second base material; second shield supply machine, supply The second shield formed by forming the third conductor on the sheet-like third substrate; the first thermocompression bonding machine, thermocompression bonding the aforementioned cover layer to the first main surface; the area removal machine is unnecessary, and the thermocompression bonding The first intermediate body of the cover layer removes an unnecessary area between the transmission line conductor and the transmission line conductor to form a through hole penetrating the first intermediate body; a second thermocompression bonding machine A second intermediate body, thermocompression bonding the side of the second main surface of the first shield to the surface opposite to the first main surface of the substrate; and the first bonding machine, which is thermocompression bonded In the state of the first shield, the exposed surface of the third conductor was ultrasonically bonded to the exposed surface of the second conductor.

根據此構成，第1熱壓接機、沖切機、第2熱壓接機及第1接合機係關聯地動作，將挾持基底及覆蓋層而對向配置之第1屏蔽物的第2導體與第2屏蔽物的第3導體經由貫通孔進行超音波接合。因此，能以一貫的生產線製造將涵蓋全周範圍屏蔽而降低串音之薄型傳送線路或其中間體。且，由於係在不使用接著劑或導電糊下，將第1屏蔽物的第2導體與第2屏蔽物的第3導體進行超音波接合，所以可使生產時間(生產節拍)比導電糊或接著劑的熱硬化時間還短，可在短時間生產。 According to this configuration, the first thermocompression bonding machine, the punching machine, the second thermocompression bonding machine, and the first bonding machine operate in association, and the second conductor of the first shield that is opposed to each other by holding the substrate and the cover layer Ultrasonic bonding is performed with the third conductor of the second shield through the through hole. Therefore, it is possible to manufacture thin transmission lines or intermediates that can shield the entire circumference and reduce crosstalk with a consistent production line. Furthermore, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or conductive paste, the production time (production cycle) can be made faster than that of the conductive paste or The thermal curing time of the adhesive is still short and can be produced in a short time.

根據本發明的傳送線路，由於係在不使用接著劑或導電糊下，將第1屏蔽物的第2導體與第2屏蔽物的第3導體進行超音波接合，所以可實現涵蓋全周屏蔽而降低串音的薄型傳送線路。又，根據本發明的傳送線路的製造方法及傳送線路的製造裝置，能以一貫的生產線製造將涵蓋全周屏蔽而降低串音的薄型傳送線路或其中間體。 According to the transmission line of the present invention, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or a conductive paste, it is possible to cover the entire circumference. A thin transmission line that reduces crosstalk. In addition, according to the transmission line manufacturing method and the transmission line manufacturing apparatus of the present invention, it is possible to manufacture a thin transmission line or an intermediate thereof that will cover the entire circumference of the shield and reduce crosstalk on a consistent production line.

1‧‧‧傳送線路的製造裝置 1‧‧‧ Transmission line manufacturing device

2‧‧‧第1熱壓接機 2‧‧‧The first thermocompression bonding machine

3‧‧‧不要區域去除機 3‧‧‧No area remover

4‧‧‧第2熱壓接機 4‧‧‧The second thermocompression bonding machine

5‧‧‧接合機(第1超音波接合機) 5‧‧‧Splicer (1st ultrasonic splicer)

6‧‧‧接合機(第2超音波接合機) 6‧‧‧Splicer (second ultrasonic splicer)

7‧‧‧雷射加工機 7‧‧‧Laser processing machine

8‧‧‧檢查機 8‧‧‧Check machine

9‧‧‧分割取出機 9‧‧‧Splitting and extracting machine

10‧‧‧控制器 10‧‧‧Controller

11‧‧‧基底供給機 11‧‧‧ substrate feeder

12‧‧‧覆蓋層供給機 12‧‧‧Overlay supply machine

13‧‧‧第1屏蔽物供給機 13‧‧‧The first shield supply machine

14‧‧‧第2屏蔽物供給機 14‧‧‧The second shield supply machine

15‧‧‧張力調節機 15‧‧‧Tension regulator

16‧‧‧節距進給機 16‧‧‧pitch feeder

17‧‧‧移載機 17‧‧‧Transfer machine

18‧‧‧托盤 18‧‧‧Tray

20‧‧‧傳送線路 20‧‧‧ Transmission line

30‧‧‧基底 30‧‧‧ base

31‧‧‧第1導體 31‧‧‧The first conductor

32‧‧‧傳送線路導體 32‧‧‧Transmission line conductor

33‧‧‧接地導體 33‧‧‧Ground conductor

34‧‧‧第1基材 34‧‧‧1st base material

34a‧‧‧第1主面 34a‧‧‧The first main face

35‧‧‧覆蓋層 35‧‧‧overlay

40‧‧‧第1屏蔽物 40‧‧‧ 1st shield

41‧‧‧第2導體 41‧‧‧ 2nd conductor

42‧‧‧第2基材 42‧‧‧2nd base material

42a‧‧‧第2主面 42a‧‧‧The second main face

45‧‧‧第2屏蔽物 45‧‧‧ 2nd shield

46‧‧‧第3導體 46‧‧‧The third conductor

47‧‧‧第3基材 47‧‧‧3rd base material

51‧‧‧第1中間體 51‧‧‧The first intermediate

52‧‧‧第2中間體 52‧‧‧The second intermediate

53‧‧‧第3中間體 53‧‧‧ Third Intermediate

54‧‧‧第4中間體 54‧‧‧4th intermediate

55‧‧‧第5中間體 55‧‧‧ 5th intermediate

56‧‧‧第6中間體 56‧‧‧ 6th intermediate

P1‧‧‧節距 P1‧‧‧Pitch

R1‧‧‧不要區域 R1‧‧‧Unwanted area

U1‧‧‧貫通孔 U1‧‧‧Through hole

V1‧‧‧窗部 V1‧‧‧Window

圖1係示意地表示本發明的實施形態之傳送線路的製造裝置的配置構成之構成圖。 FIG. 1 is a configuration diagram schematically showing an arrangement configuration of a transmission line manufacturing apparatus according to an embodiment of the present invention.

圖2A係表示本實施形態的基底的概略的平面圖，圖2B係表示本實施形態的覆蓋層熱壓接於基底而成的第1中間體的概略之平面圖，圖2C係表示形成有本實施形態的貫通孔之第2中間體的概略之平面圖。 2A is a plan view showing the outline of the substrate of this embodiment, FIG. 2B is a plan view showing the outline of the first intermediate body formed by thermal compression bonding of the cover layer to the substrate of this embodiment, and FIG. 2C is a view showing that this embodiment is formed. A schematic plan view of the second intermediate body of the through hole.

圖3A係表示藉由超音波接合有本實施形態的第2屏蔽物的第4中間體的概略之平面圖，圖3B係表示形成有本實施形態的 窗部之第6中間體的概略之平面圖。 FIG. 3A shows a schematic plan view of the fourth intermediate body in which the second shield of the present embodiment is joined by ultrasound, and FIG. 3B shows the embodiment in which the present embodiment is formed. A schematic plan view of the sixth intermediate body of the window.

圖4A係表示本實施形態的傳送線路的概略之平面圖，圖4B係表示本實施形態的傳送線路的概略之側面圖。 4A is a plan view showing the outline of the transmission line of this embodiment, and FIG. 4B is a side view showing the outline of the transmission line of this embodiment.

圖5A係表示本實施形態的基底的概略之剖面圖，圖5B係表示本實施形態的覆蓋層熱壓接於基底而成的第1中間體的概略之剖面圖，圖5C係表示形成有本實施形態的貫通孔之第2中間體的概略之剖面圖。 FIG. 5A is a schematic cross-sectional view showing the substrate of the present embodiment, FIG. 5B is a schematic cross-sectional view showing the first intermediate body formed by subjecting the cover layer of the present embodiment to thermocompression bonding to the substrate, and FIG. A schematic cross-sectional view of the second intermediate body of the through hole of the embodiment.

圖6A係表示藉由超音波接合有本實施形態的第2屏蔽物之第4中間體的概略之剖面圖，圖6B係表示本實施形態的傳送線路的概略之剖面圖。 FIG. 6A is a schematic cross-sectional view of a fourth intermediate body to which a second shield of this embodiment is joined by ultrasound, and FIG. 6B is a schematic cross-sectional view of a transmission line of this embodiment.

圖7A係表示本實施形態的傳送線路的其他例的概略之剖面圖，圖7B係表示本實施形態的傳送線路的其他例的概略之剖面圖。 7A is a schematic cross-sectional view showing another example of the transmission line of this embodiment, and FIG. 7B is a schematic cross-sectional view showing another example of the transmission line of this embodiment.

圖8A係示意地表示本實施形態的第1熱壓接機之圖，圖8B係示意地表示本實施形態的不要區域去除機之圖，圖8C係示意地表示本實施形態的第2熱壓接機之圖。 FIG. 8A is a diagram schematically showing the first thermocompression bonding machine of the present embodiment, FIG. 8B is a diagram schematically showing the unnecessary area removing machine of the present embodiment, and FIG. 8C is a schematic diagram showing the second thermocompression of the present embodiment. Picture of pick up.

圖9A係示意地表示本實施形態的超音波接合機之圖，圖9B係示意地表示本實施形態的雷射加工機之圖，圖9C係示意地表示本實施形態的檢查機之圖。 9A is a diagram schematically showing the ultrasonic bonding machine of the present embodiment, FIG. 9B is a diagram schematically showing the laser processing machine of the present embodiment, and FIG. 9C is a diagram schematically showing the inspection machine of the present embodiment.

圖10係示意地表示本發明的實施形態之傳送線路的製造裝置的其他例的配置構成之構成圖。 FIG. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus according to the embodiment of the present invention.

圖11係表示本發明的實施形態之傳送線路的製造程序之流程圖。 FIG. 11 is a flowchart showing the manufacturing procedure of the transmission line according to the embodiment of the present invention.

[用以實施發明的形態] [Form for carrying out the invention] (第1實施形態) (First embodiment)

以下，參照圖式，詳細說明關於本發明的實施形態。圖1係示意地顯示本實施形態的傳送線路的製造裝置1的例子之構成圖，圖中的左側為上游側，圖中的右側為下游側。傳送線路的製造裝置1從上游側依序配設有第1熱壓接機2、不要區域去除機3、第2熱壓接機4、第1接合機5、第2接合機6、雷射加工機7、檢查機8、分割取出機9、移載機17、以及控制此等的控制器10。此外，在用以說明實施形態的全圖中，有在具有相同功能的構件附上相同符號，並省略其重複說明的情況。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a configuration diagram schematically showing an example of a transmission line manufacturing apparatus 1 of the present embodiment. The left side in the figure is the upstream side, and the right side in the figure is the downstream side. The transmission line manufacturing apparatus 1 is provided with a first thermocompression bonding machine 2, an unnecessary area removing machine 3, a second thermocompression bonding machine 4, a first bonding machine 5, a second bonding machine 6, and a laser in order from the upstream side The processing machine 7, the inspection machine 8, the division and extraction machine 9, the transfer machine 17, and the controller 10 that controls these. In addition, in all drawings for explaining the embodiments, members having the same functions are given the same symbols, and repeated descriptions thereof may be omitted.

在第1熱壓接機2的上游側，有基底供給機11和張力調節機15、以及覆蓋層(cover lay)供給機12和張力調節機15分別配設。在第2熱壓接機4的上游側，配設有第1屏蔽物供給機13和張力調節機15、以及第2屏蔽物供給機14和張力調節機15。此處，舉例來說，張力調節機15係具有張力輥，藉由該張力輥的位置將片狀工件(基底30、覆蓋層35、第1中間體51、第1屏蔽物40、第2屏蔽物45)的張力保持在一定範圍內。 On the upstream side of the first thermocompression bonding machine 2, there are a substrate feeder 11 and a tension adjuster 15, and a cover lay feeder 12 and a tension adjuster 15 respectively. On the upstream side of the second thermocompression bonding machine 4, a first shield supply machine 13 and a tension adjuster 15 and a second shield supply machine 14 and a tension adjuster 15 are arranged. Here, for example, the tension adjuster 15 has a tension roller, and the sheet-like work (the base 30, the covering layer 35, the first intermediate body 51, the first shield 40, the second shield The tension of object 45) is kept within a certain range.

在第2熱壓接機4的上游側配設有節距進給機(pitch feeding device)16，又，在檢查機8的上游側配設有節距進給機16。節距進給機16舉例來說，具有進給輥，藉由前述進給輥的進給量將片狀工件(第1中間體52、第6中間體56)的進給節距保持為一定值。 A pitch feeding device 16 is arranged on the upstream side of the second thermocompression bonding machine 4, and a pitch feeding device 16 is arranged on the upstream side of the inspection machine 8. The pitch feeder 16 has, for example, a feed roller, and the feed pitch of the sheet-like workpiece (the first intermediate body 52 and the sixth intermediate body 56) is kept constant by the feed amount of the aforementioned feed roller value.

圖8A係示意地顯示第1熱壓接機2之圖。第1熱壓接機2舉例來說，係構成為內建有加熱器的加壓板，藉由對向 配置的兩個前述加壓板，將基底30及覆蓋層35從上下方向挾持且加壓，並且進行加熱而形成第1中間體51。 FIG. 8A is a diagram schematically showing the first thermocompression bonding machine 2. For example, the first thermocompression bonding machine 2 is configured as a pressure plate with a built-in heater. The two pressure plates arranged above hold and press the base 30 and the cover layer 35 from above and below, and are heated to form the first intermediate body 51.

圖8B係示意地顯示不要區域去除機3的圖。不要區域去除機3舉例來說，係構成為具有沖切刀及承接沖切刀的墊座，藉由利用前述沖切刀沖切第1中間體51的不要區域R1以去除該不要區域R1來形成貫通第1中間體51的貫通孔U1，並形成第2中間體52。作為上述以外的構成，不要區域去除機3係可適用利用雷射照射去除不要區域R1的雷射加工機。 FIG. 8B is a diagram schematically showing the unnecessary area removing machine 3. For example, the unnecessary area removing machine 3 is configured to have a punching blade and a pedestal for receiving the punching blade. The unnecessary area R1 of the first intermediate body 51 is cut by the aforementioned punching blade to remove the unnecessary area R1. A through hole U1 penetrating the first intermediate body 51 is formed, and a second intermediate body 52 is formed. As a configuration other than the above, the unnecessary region removing machine 3 series is applicable to a laser processing machine that removes the unnecessary region R1 by laser irradiation.

圖8C係示意地顯示第2熱壓接機4之圖。第2熱壓接機4舉例來說，係構成為具有內建有加熱器的加壓板，藉由對向配置的兩個前述加壓板，將第1屏蔽物40及第2中間體52從上下方向挾持且加壓並且進行加熱，且構成為在將第1屏蔽物40熱壓接於基底30之同時，將第2屏蔽物45熱壓接於覆蓋層35。 FIG. 8C is a diagram schematically showing the second thermocompression bonding machine 4. For example, the second thermocompression bonding machine 4 is configured to have a pressure plate with a built-in heater, and the first shield 40 and the second intermediate body 52 are formed by two pressure plates arranged opposite to each other. It is sandwiched and pressurized and heated from above and below, and is configured to thermally press-bond the second shield 45 to the cover layer 35 while thermally crimping the first shield 40 to the base 30.

在此，第1熱壓接機2與第2熱壓接機4係可作成同樣的裝置構成。藉此，裝置的維修(maintenance)變容易。 Here, the 1st thermocompression bonding machine 2 and the 2nd thermocompression bonding machine 4 can be made into the same device structure. Thereby, maintenance of the device becomes easy.

圖9A係示意地顯示第1接合機5(第1超音波接合機)或第2接合機6(第2超音波接合機)之圖。第1接合機5舉例來說，係構成為具有：內建有振動體之本體部；附設於該本體部且以傳達自振動體的振動進行超音波振動之頭部(焊頭(horn))；以及承接該頭部之承接部。第1接合機5(第1超音波接合機)係構成為藉由對向配置的前述頭部及承接部，使第1屏蔽物40熱壓接於基底30，並且將第2屏蔽物45被熱壓接於覆蓋層35的狀態下之工件從上下方向挾持，並且使前述頭部超音波振動以藉由超音波接合形成第4中間體54。 FIG. 9A is a diagram schematically showing the first bonding machine 5 (first ultrasonic bonding machine) or the second bonding machine 6 (second ultrasonic bonding machine). For example, the first bonding machine 5 is configured to include: a body portion with a built-in vibrating body; a head (horn) attached to the body portion and performing ultrasonic vibration by transmitting vibration from the vibrating body ; And the undertaking part to accept the head. The first bonding machine 5 (first ultrasonic bonding machine) is configured such that the first shield 40 is thermally pressure-bonded to the base 30 by the head and the receiving portion arranged opposite to each other, and the second shield 45 is The workpiece in the state of being thermally pressure-bonded to the cover layer 35 is held from above and below, and the head ultrasonic vibration is vibrated to form the fourth intermediate body 54 by ultrasonic bonding.

或者，第1接合機5(第1超音波接合機)係構造成藉由對向配置的前述頭部及承接部，將第2屏蔽物45重疊於第3中間體53的狀態下的工件從上下方向挾住而挾持，並且使前述頭部超音波振動以藉由超音波接合形成第4中間體54，該第3中間體53係第1屏蔽物40熱壓接於基底30而成。 Alternatively, the first bonding machine 5 (first ultrasonic bonding machine) is configured such that the workpiece in a state where the second shield 45 is superimposed on the third intermediate body 53 by the aforementioned head and the receiving portion arranged oppositely The upper and lower directions are held and held, and the head ultrasonic vibration is vibrated to form the fourth intermediate body 54 by ultrasonic bonding. The third intermediate body 53 is formed by thermally pressing the first shield 40 to the base 30.

在此，第4中間體54係指作為傳送線路20之前階段的半成品，且為涵蓋全周範圍進行屏蔽之構造的狀態下之半成品。 Here, the fourth intermediate 54 refers to a semi-finished product in a state of being a semi-finished product in the previous stage of the transmission line 20 and shielding the entire circumference.

第2接合機6(第2超音波接合機)舉例來說，係建構成具有：內建有振動體之本體部；附設於該本體部且以傳達自振動體的振動進行超音波振動之頭部(焊頭)；以及承接該頭部之承接部；藉由對向配置的前述頭部及承接部，將第4中間體54從上下方向挾住而挾持，並且使前述頭部超音波振動以藉由超音波接合形成第5中間體55。在此，第1接合機5和第2接合機6係作成同樣的裝置構成。藉此，裝置的維修變容易。或者，也有將進行超音波振動的頭部對向配置以作成兼具第1接合機5和第2接合機6兩者的功能之構成的情況。 The second splicer 6 (second ultrasonic splicer) has, for example, a structure including: a body part with a built-in vibrating body; a head attached to the body part and performing ultrasonic vibration by transmitting vibration from the vibrating body Part (welding head); and the receiving part that receives the head; the head and the receiving part arranged opposite to each other hold the fourth intermediate body 54 from the up and down direction and make the head ultrasound vibrate The fifth intermediate body 55 is formed by ultrasonic bonding. Here, the first bonding machine 5 and the second bonding machine 6 are configured in the same device. By this, the maintenance of the device becomes easy. Alternatively, there may be a case where the head that performs ultrasonic vibration is opposed to have a structure that has both the functions of the first bonding machine 5 and the second bonding machine 6.

圖9B係示意地顯示雷射加工機7之圖。雷射加工機7係構成為藉由雷射照射去除既定區域以使第3導體46局部露出而形成第6中間體56。 FIG. 9B is a diagram schematically showing the laser processing machine 7. The laser processing machine 7 is configured to remove a predetermined area by laser irradiation to partially expose the third conductor 46 to form a sixth intermediate body 56.

圖9C係示意地顯示檢查機8之圖。檢查機8係構成為使接觸銷與傳送線路導體32接觸並通電，藉此來檢查傳送線路導體32是否沒有斷線、或者導通程度是否在正常範圍內，該接觸銷係以既定間隔向下方突出。作為上述以外的構成，係有檢查機8構成為利用相機拍攝傳送線路導體32的影像並進行影 像解析，藉此檢查傳送線路導體32是否斷線或者導通程度是否在正常範圍內之情況，或者，有檢查機8構成為進行藉由將傳送線路導體32通電所致之電氣特性檢查、和拍攝傳送線路導體32且進行影像解析所致之外觀特性檢查兩者。 9C is a diagram schematically showing the inspection machine 8. The inspection machine 8 is configured to contact the contact pin with the transmission line conductor 32 and energize it to check whether the transmission line conductor 32 is not disconnected or whether the degree of conduction is within a normal range. The contact pin protrudes downward at a predetermined interval . As a configuration other than the above, the inspection machine 8 is configured to take an image of the transmission line conductor 32 with a camera and perform Image analysis, to check whether the transmission line conductor 32 is disconnected or whether the degree of conduction is within the normal range, or there is an inspection machine 8 configured to perform electrical characteristics inspection and shooting by energizing the transmission line conductor 32 Both the transmission line conductor 32 and the appearance characteristics due to image analysis are checked.

如圖1所示，在檢查機8的下游側，配設有從第6中間體56取出傳送線路20的分割取出機9。舉例來說，分割取出機9係構成為具有沖切刀及承接沖切刀的墊座，利用前述沖切刀，將經線上(in-line)檢查的第6中間體56沿著既定的切割線沖切而將傳送線路20分離，以取出傳送線路20。在上述以外的構成方面，有分割取出機9將經線上檢查的第6中間體56沿著既定的切割線進行劃線(scribe)以將傳送線路20分離，而取出傳送線路20之構成的情況，或者分割取出機9將經線上檢查的第6中間體56沿著既定的切割線進行雷射照射以將傳送線路20分離，而取出傳送線路20之構成的情況。 As shown in FIG. 1, on the downstream side of the inspection machine 8, a dividing and extracting machine 9 that extracts the transmission line 20 from the sixth intermediate body 56 is arranged. For example, the separating and extracting machine 9 is configured to have a punching blade and a pedestal for receiving the punching blade, and the sixth intermediate body 56 that has undergone in-line inspection along the predetermined cutting is cut using the aforementioned punching blade The line is die cut to separate the transmission line 20 to take out the transmission line 20. In terms of the configuration other than the above, the dividing and extracting machine 9 may scribe the sixth intermediate body 56 that has been inspected on the line along a predetermined cutting line to separate the transmission line 20 and take out the configuration of the transmission line 20 Or, the dividing and extracting machine 9 laser-irradiates the sixth intermediate body 56 that has been inspected on the line along a predetermined cutting line to separate the transmission line 20, and takes out the configuration of the transmission line 20.

在分割取出機9的下游側，配置有收納傳送線路20的托盤(tray)18。以上述一貫的生產線製造且經線上檢查的傳送線路20，係藉由移載機17，例如在被真空吸附的狀態下搬送且收納於托盤18。 On the downstream side of the dividing and extracting machine 9, a tray 18 for storing the transport line 20 is arranged. The transmission line 20 manufactured on the above-mentioned conventional production line and subjected to on-line inspection is transferred and stored in the tray 18 by the transfer machine 17, for example, in a vacuum suction state.

根據本實施形態，能以一個生產線一貫地製造將涵蓋整周屏蔽且降低串音的薄型傳送線路20。接著，由於係未使用接著劑或導電糊，而進行熱壓接或超音波接合來製造傳送線路20，所以可使生產時間(生產節拍)變得比導電糊或接著劑的熱硬化時間更短，所需的構成構件也被抑制為最小限度。 According to the present embodiment, the thin transmission line 20 that covers the entire circumference of the shield and reduces crosstalk can be consistently manufactured on one production line. Next, since the adhesive or conductive paste is not used, the transmission line 20 is manufactured by thermocompression bonding or ultrasonic bonding, so that the production time (production cycle) can be shorter than the thermal hardening time of the conductive paste or adhesive The required components are also kept to a minimum.

如上述，第2熱壓接機4係將第1屏蔽物40熱壓接於基底30，並將第2屏蔽物45熱壓接之構成。根據此構成， 由於係將第1屏蔽物40和第2屏蔽物45一次同時地進行熱壓接，所以在熱壓接時，可防止在第1屏蔽物40或第2屏蔽物45產生皺摺。 As described above, the second thermocompression bonding machine 4 is configured to thermocompression-bond the first shield 40 to the base 30 and thermocompression-bond the second shield 45. According to this composition, Since the first shield 40 and the second shield 45 are thermocompression bonded at the same time, it is possible to prevent the first shield 40 or the second shield 45 from being wrinkled during the thermocompression bonding.

上述的製造裝置係為一例。傳送線路的製造裝置1並不限定於上述實施形態。在上述以外的構成方面，例如，有省略接合機5的下游側之製造設備或檢查機器等的情況。在此情況下，在涵蓋全周進行屏蔽之構造的第4中間體54的狀態，完成傳送線路的製造裝置1的製造。而且，經由在捲取狀態、長條狀態、個別包裝狀態等下收容於搬送容器或托盤等，而以第4中間體54的形式被出貨，或者第4中間體54在其他的生產線進行後加工，或者第4中間體54在電子機器的組裝線被組裝並加工，而成為傳送線路20。 The above-mentioned manufacturing apparatus is an example. The transmission line manufacturing apparatus 1 is not limited to the above-mentioned embodiment. In the configuration other than the above, for example, there may be a case where the manufacturing equipment or the inspection equipment on the downstream side of the bonding machine 5 is omitted. In this case, the manufacturing of the transmission line manufacturing apparatus 1 is completed in the state of the fourth intermediate body 54 that covers the structure of shielding the entire circumference. In addition, it is shipped in the form of the fourth intermediate 54 by being stored in a transport container, tray, etc. in a reeling state, a long state, an individual packaging state, etc., or after the fourth intermediate 54 is carried out on another production line Processing, or the fourth intermediate 54 is assembled and processed on the assembly line of the electronic device to become the transmission line 20.

在上述以外的構成方面，例如有構成為配置焊接機來取代第2超音波接合機6，藉由與焊接機對向配置的頭部及承接部，將第4中間體54從上下方向挾住而挾持，並且從頭部供給焊劑並加熱等，利用焊接來形成第5中間體55的情況。或者，有構成為配置接著接合機來取代第2超音波接合機6，藉由使用接著劑或導電糊的接合來形成第5中間體55的情況。 In a configuration other than the above, for example, there is a configuration in which a welding machine is arranged instead of the second ultrasonic bonding machine 6, and the fourth intermediate body 54 is nipped from above and below by a head portion and a receiving portion arranged to face the welding machine On the other hand, the fifth intermediate body 55 is formed by welding, soldering, heating, etc. from the head, and welding. Alternatively, there may be a configuration in which a bonding machine is arranged instead of the second ultrasonic bonding machine 6, and the fifth intermediate body 55 is formed by bonding using an adhesive or a conductive paste.

又，在上述以外的構成方面，例如有構成為配置蝕刻加工機來取代雷射加工機7，藉由蝕刻去除既定區域以使第3導體46局部露出來形成第6中間體56之情況。 In addition, for a configuration other than the above, for example, a configuration is provided in which an etching processing machine is arranged instead of the laser processing machine 7, and a predetermined area is removed by etching to partially expose the third conductor 46 to form the sixth intermediate body 56.

接著，以下，說明關於本發明之傳送線路的製造裝置1的其他例。 Next, another example of the transmission line manufacturing apparatus 1 of the present invention will be described below.

圖10係示意地顯示上述實施形態之傳送線路的製造裝置1的其他例的配置構成之構成圖。圖10的例子中，在第 2熱壓接機4的上游側，配設有第1屏蔽物供給機13及張力調節機15。又，在第1接合機5的上游側，配設有第2屏蔽物供給機14及張力調節機15。於此構成的情況，藉由第2熱壓接機4，第1屏蔽物40被熱壓接於基底30而成為第3中間體53。且，藉由第1接合機5，第2屏蔽物45被超音波熔接於第2屏蔽物45與第3中間體53經重疊之狀態下的工件，而成為第4中間體54。 FIG. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus 1 of the above embodiment. In the example of Figure 10, in the first 2 On the upstream side of the thermocompression bonding machine 4, a first shield supply machine 13 and a tension adjuster 15 are arranged. In addition, on the upstream side of the first bonding machine 5, a second shield supply machine 14 and a tension adjuster 15 are arranged. In the case of this configuration, with the second thermocompression bonding machine 4, the first shield 40 is thermocompression bonded to the base 30 to become the third intermediate body 53. In addition, with the first bonding machine 5, the second shield 45 is ultrasonically welded to the workpiece in a state where the second shield 45 and the third intermediate body 53 overlap, and becomes the fourth intermediate body 54.

根據此構成，例如，在第1屏蔽物40的尺寸或熱容量比第2屏蔽物45的尺寸或熱容量大的情況，將第1屏蔽物40熱壓接於基底30是容易且確實的，又，將第2屏蔽物45超音波熔接於基底30是容易且確實的。 According to this configuration, for example, when the size or thermal capacity of the first shield 40 is larger than the size or thermal capacity of the second shield 45, it is easy and reliable to thermally press-bond the first shield 40 to the base 30. It is easy and reliable to weld the second shield 45 ultrasonically to the base 30.

可依據傳送線路20的尺寸、材質等的規格或者構成零件的尺寸、材質等的規格，選擇圖1的構成或圖10的構成，又，可適當地追加或省略圖1或圖2之構成的製造設備或檢查機器等。 The configuration of FIG. 1 or the configuration of FIG. 10 can be selected according to the specifications of the size, material, etc. of the transmission line 20 or the size, material, etc. of the constituent parts, and the configuration of FIG. 1 or FIG. 2 can be appropriately added or omitted Manufacturing equipment or inspection machines, etc.

接著，以下，說明關於本發明之傳送線路20及傳送線路20的製造方法。 Next, the transmission line 20 and the method for manufacturing the transmission line 20 of the present invention will be described below.

圖11係顯示傳送線路20的製造程序之流程圖。傳送線路20舉例來說，係依第1熱壓接步驟S1、不要區域去除步驟S2、第2熱壓接步驟S3、第1接合步驟S4、第2接合步驟S5、雷射加工步驟S6、檢查步驟S7、分割步驟S8的順序來製造。 11 is a flowchart showing the manufacturing process of the transmission line 20. For example, the transmission line 20 is based on the first thermocompression bonding step S1, unnecessary area removal step S2, second thermocompression bonding step S3, first bonding step S4, second bonding step S5, laser processing step S6, inspection Step S7, the order of step S8 is divided and manufactured.

上述的製造程序係為一例。傳送線路20的製造程序，在上述以外的構成方面，係可同時進行第1接合步驟S4焊第2接合步驟S5，且可省略第2接合步驟S5。又，除上述外， 可省略雷射加工步驟S6，可省略檢查步驟S7，可省略分割步驟S8。且，有將第4中間體54、第5中間體55、第6中間體56或傳送線路20在一個薄片(sheet)以長度方向的既定節距配置有複數個狀態下出貨，在接下來的工程之電子機器的組裝線分割薄片，將傳送線路20取出來使用的情況。 The above-mentioned manufacturing procedure is an example. In the manufacturing process of the transmission line 20, in a configuration other than the above, the first joining step S4 and the second joining step S5 can be performed simultaneously, and the second joining step S5 can be omitted. Also, in addition to the above, The laser processing step S6 may be omitted, the inspection step S7 may be omitted, and the division step S8 may be omitted. In addition, the fourth intermediate body 54, the fifth intermediate body 55, the sixth intermediate body 56, or the transmission line 20 may be shipped in a plurality of states in which a sheet is arranged at a predetermined pitch in the longitudinal direction. When the assembly line of the electronic equipment of the project is divided into sheets and the transmission line 20 is taken out for use.

圖2A係顯示基底30的概略之平面圖，圖2B係顯示第1中間體51的概略之平面圖，圖2C係顯示第2中間體52的概略之平面圖。又，圖3A係顯示第4中間體54的概略之平面圖，圖3B係顯示第6中間體56的概略之平面圖。且，圖4A係顯示傳送線路20的概略之平面圖，圖4B係顯示傳送線路20的概略之側面圖。 2A is a schematic plan view showing the substrate 30, FIG. 2B is a schematic plan view showing the first intermediate body 51, and FIG. 2C is a schematic plan view showing the second intermediate body 52. 3A is a schematic plan view showing the fourth intermediate body 54, and FIG. 3B is a schematic plan view showing the sixth intermediate body 56. 4A is a schematic plan view showing the transmission line 20, and FIG. 4B is a schematic side view showing the transmission line 20.

圖5A係在傳送線路導體32的位置顯示基底30的概略之剖面圖，同樣地，圖5B係顯示第1中間體51的概略之剖面圖，圖5C係顯示第2中間體52的概略之剖面圖。又，圖6A係顯示第4中間體54的概略之剖面圖，且，圖6B係在傳送線路導體32的位置顯示傳送線路20的概略之剖面圖。 FIG. 5A is a schematic cross-sectional view showing the base 30 at the position of the transmission line conductor 32. Similarly, FIG. 5B is a schematic cross-sectional view showing the first intermediate body 51, and FIG. 5C is a schematic cross-sectional view showing the second intermediate body 52. Figure. 6A is a schematic cross-sectional view showing the fourth intermediate body 54, and FIG. 6B is a schematic cross-sectional view showing the transmission line 20 at the position of the transmission line conductor 32.

如圖2A和圖5A所示，基底30係由敷銅層板(CCL)所構成，傳送線路導體32係以長度方向的既定節距P1形成於片狀第1基材34的第1主面34a。第1導體31包含：形成直線狀的傳送線路導體32；及接地導體33，與傳送線路導體32的輸入端與輸出端分別接近，接近輸入端、輸出端的側形成「U字狀」或「ㄈ字狀」。舉例來說，在接地導體33及傳送線路導體32的輸入端及輸出端，例如透過焊劑或導電糊接合連接器(未圖示)。在上述以外的構成方面，有第1導體31係由和傳送線路導體32的輸入端和輸出端分別一對一地接近，且形成為「U字 狀」或「ㄈ字狀」的複數個接地導體33所構成之情況。 As shown in FIGS. 2A and 5A, the base 30 is composed of a copper-clad laminate (CCL), and the transmission line conductor 32 is formed on the first main surface of the sheet-shaped first substrate 34 at a predetermined pitch P1 in the longitudinal direction 34a. The first conductor 31 includes: a transmission line conductor 32 formed in a linear shape; and a ground conductor 33, which are close to the input end and the output end of the transmission line conductor 32, respectively, and the sides close to the input end and the output end form a "U" shape or "ㄈ" Zigzag". For example, at the input and output ends of the ground conductor 33 and the transmission line conductor 32, a connector (not shown) is joined by solder or conductive paste, for example. In terms of the structure other than the above, the first conductor 31 is made one-to-one close to the input end and the output end of the transmission line conductor 32, respectively, and is formed as "U-shaped" The case where a plurality of ground conductors 33 of "shape" or "shape" is formed.

關於基底30方面，在片狀的第1基材34，傳送線路導體32係以長度方向的既定節距配設有複數個，在圖2A的狀態下，在傳送線路導體32和傳送線路導體32之間有不要區域R1。 Regarding the substrate 30, on the sheet-like first base material 34, the transmission line conductors 32 are arranged at a predetermined pitch in the longitudinal direction. In the state of FIG. 2A, the transmission line conductors 32 and the transmission line conductors 32 There is an unnecessary area R1.

第1導體31係由例如銅箔所構成。第1基材34係例如由熱塑性樹脂所構成。第1基材34係由例如液晶聚合物(LCP)、聚醯亞胺(PI)、聚醯胺(PA)、或聚醚醚酮(PEEK)所構成。片狀基底30係例如在捲取狀態下安裝於基底供給機11，以可連續加工的方式供給。 The first conductor 31 is made of, for example, copper foil. The first base 34 is composed of, for example, thermoplastic resin. The first substrate 34 is composed of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). The sheet-like substrate 30 is attached to the substrate feeder 11 in a wound state, for example, and is supplied in a manner that enables continuous processing.

第1導體31係例如厚度為5[μm]以上且25[μm]以下的銅箔。第1基材34係例如厚度為50[μm]以上且150[μm]以下的液晶聚合物(LCP)。第1導體31係例如將敷銅層板(CCL)進行圖案蝕刻而形成。 The first conductor 31 is, for example, a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. The first substrate 34 is, for example, a liquid crystal polymer (LCP) having a thickness of 50 [μm] or more and 150 [μm] or less. The first conductor 31 is formed by pattern-etching a copper-clad laminate (CCL), for example.

基底30例如作為第1熱壓接步驟S1的前處理，係藉由電漿照射裝置，對貼合有第1導體31之側的面(第1主面34a)照射含氧的電漿，以去除有機物，並進行改質。藉由照射含氧的電漿，在第1熱壓接時，密接度得以提升。除上述外，有在第1熱壓接機2的上游側配設電漿照射裝置，對第1主面34a照射含氧的電漿之情況(未圖示)。 The substrate 30 is used as a pretreatment of the first thermocompression bonding step S1, for example, by irradiating an oxygen-containing plasma to the surface (first main surface 34a) to which the first conductor 31 is bonded by a plasma irradiation device, to Remove organic matter and modify it. By irradiating oxygen-containing plasma, the adhesion degree is improved during the first thermocompression bonding. In addition to the above, a plasma irradiation device is arranged on the upstream side of the first thermocompression bonding machine 2 to irradiate the first main surface 34a with oxygen-containing plasma (not shown).

覆蓋層35例如係由熱塑性樹脂構成。覆蓋層35，例如係由液晶聚合物(LCP)、聚醯亞胺(PI)、聚醯胺(PA)、或聚醚醚酮(PEEK)所構成。例如，覆蓋層35係以捲取狀態安裝於覆蓋層供給機12，並以可連續加工的方式供給。 The cover layer 35 is made of, for example, thermoplastic resin. The cover layer 35 is made of, for example, liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). For example, the cover layer 35 is attached to the cover layer supplying machine 12 in a wound state, and is supplied in a continuous processable manner.

覆蓋層35係為例如厚度為25[μm]以上且 125[μm]以下的液晶聚合物(LCP)。 The cover layer 35 is, for example, having a thickness of 25 [μm] or more and Liquid crystal polymer (LCP) below 125 [μm].

第1屏蔽物40係例如由敷銅層板(CCL)所構成，第2導體41係形成於片狀第2基材42的第2主面42a。第2導體41有貼合於第2基材42整面的情況、或者以網目狀貼合的情況。 The first shield 40 is composed of, for example, a copper-clad laminate (CCL), and the second conductor 41 is formed on the second main surface 42 a of the sheet-shaped second base material 42. The second conductor 41 may be bonded to the entire surface of the second base material 42 or may be bonded in a mesh shape.

第2導體41係例如由銅箔所構成。第2基材42係例如由熱塑性樹脂所構成。第2基材42係例如由液晶聚合物(LCP)、聚醯亞胺(PI)、聚醯胺(PA)、或聚醚醚酮(PEEK)所構成。第1屏蔽物40係例如以捲取狀態安裝於第1屏蔽物供給機13，並以可連續加工的方式供給。 The second conductor 41 is composed of, for example, copper foil. The second base material 42 is composed of, for example, a thermoplastic resin. The second substrate 42 is composed of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyether ether ketone (PEEK). The first shield 40 is attached to the first shield supply machine 13 in a wound state, for example, and is supplied in a manner that enables continuous processing.

第2導體41係例如厚度為5[μm]以上且25[μm]以下的銅箔。第2基材42係例如厚度為5[μm]以上且25[μm]以下的聚醯亞胺(PI)。第1屏蔽物40係為例如敷銅層板(CCL)在其原樣的狀態下被使用。 The second conductor 41 is, for example, a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. The second base material 42 is, for example, polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. The first shield 40 is, for example, a copper-clad laminate (CCL) used as it is.

第1屏蔽物40係例如作為第2熱壓接步驟S3的前處理，係藉由電漿照射裝置，對貼合有第2導體41之側的面(第2主面42a)照射含氧的電漿，以去除有機物，並進行改質。藉由照射含氧的電漿，在第2熱壓接時，密接度得以提升。除上述外，有在第2熱壓接機4的上游側配設電漿照射裝置，對第2主面42a照射含氧的電漿之情況(未圖示)。 The first shield 40 is, for example, as a pre-treatment of the second thermocompression bonding step S3, and a plasma irradiation device is used to irradiate the surface (second main surface 42a) to which the second conductor 41 is bonded to the side containing the oxygen Plasma to remove organic matter and modify it. By irradiating oxygen-containing plasma, the adhesion degree is improved during the second thermocompression bonding. In addition to the above, there is a case where a plasma irradiation device is arranged on the upstream side of the second thermocompression bonding machine 4 to irradiate an oxygen-containing plasma to the second main surface 42a (not shown).

第2屏蔽物45係例如由敷銅層板(CCL)所構成，第3導體46係形成於片狀第3基材47的單面。第3導體46有貼合於第3基材47整面的情況、或者以網目狀貼合的情況。 The second shield 45 is composed of, for example, a copper-clad laminate (CCL), and the third conductor 46 is formed on one side of the sheet-shaped third base 47. The third conductor 46 may be bonded to the entire surface of the third base 47, or may be bonded in a mesh shape.

第3導體46係由例如銅箔所構成。第3基材47係例如由熱塑性樹脂所構成。第3基材47係例如由液晶聚合物 (LCP)、聚醯亞胺(PI)、聚醯胺(PA)、或聚醚醚酮(PEEK)所構成。第2屏蔽物45係例如以捲取狀態安裝於第2屏蔽物供給機14，並以可連續加工的方式供給。 The third conductor 46 is composed of, for example, copper foil. The third base 47 is made of, for example, thermoplastic resin. The third base 47 is made of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). The second shield 45 is attached to the second shield supply machine 14 in a wound state, for example, and is supplied so that it can be processed continuously.

第3導體46係例如厚度為5[μm]以上且25[μm]以下的銅箔。第3基材47係例如厚度為5[μm]以上且25[μm]以下的聚醯亞胺(PI)。第2屏蔽物45係為例如敷銅層板(CCL)在其原樣的狀態下被使用。第2屏蔽物45例如係以第1屏蔽物40同一材料構成。 The third conductor 46 is, for example, a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. The third base 47 is, for example, polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. The second shield 45 is, for example, a copper-clad laminate (CCL) used as it is. The second shield 45 is made of the same material as the first shield 40, for example.

第2屏蔽物45係為例如作為第1接合步驟S4的前處理，藉由電漿照射裝置，對貼合有第3導體46之側的面照射含氧的電漿，以去除有機物，並進行改質。藉由照射含氧的電漿，第1接合步驟S4中之密接度得以提升。除上述外，有在第1接合機5的上游側配設電漿照射裝置，對貼合有第3導體46之側的面照射含氧的電漿之情況(未圖示)。 The second shield 45 is, for example, the pre-processing of the first bonding step S4, and the surface on which the third conductor 46 is bonded is irradiated with an oxygen-containing plasma by a plasma irradiation device to remove organic matter and perform Improve. By irradiating the plasma containing oxygen, the adhesion in the first bonding step S4 is improved. In addition to the above, there is a case where a plasma irradiation device is arranged on the upstream side of the first bonding machine 5 to irradiate an oxygen-containing plasma to the surface to which the third conductor 46 is bonded (not shown).

第1熱壓接步驟S1係如圖2B和圖5B所示，將覆蓋層35熱壓接於第1基材34的第1主面34a。舉例而言，將第1基材34和覆蓋層35設為同種材料，以第1基材34及覆蓋層35之熔點以下的加熱溫度，且以荷重撓曲溫度或以荷重撓曲溫度為中心而在正負20[℃]以內的加熱溫度、較佳為正負5[℃]以內的加熱溫度、更佳為正負2[℃]以內的加熱溫度，在既定壓力下一邊加壓既定時間一邊加熱並進行熱壓接，而作成第1中間體51。 In the first thermocompression bonding step S1, as shown in FIGS. 2B and 5B, the cover layer 35 is thermocompression bonded to the first main surface 34a of the first base material 34. For example, the first base material 34 and the cover layer 35 are made of the same material, the heating temperature below the melting point of the first base material 34 and the cover layer 35, and the load deflection temperature or the load deflection temperature as the center The heating temperature within plus or minus 20 [℃], preferably within plus or minus 5 [℃], and more preferably within plus or minus 2 [℃], is heated at a predetermined pressure while being pressurized for a predetermined period of time. The first intermediate body 51 was prepared by thermocompression bonding.

第1熱壓接步驟S1係以例如180[℃]以上280[℃]以下的加熱溫度、10[MPa]以上60[MPa]以下的加壓力、5[秒]以上240[秒]以下的加熱．加壓時間進行熱壓接。熱壓接係例如 在大氣中進行。 The first thermocompression bonding step S1 is, for example, a heating temperature of 180 [°C] or more and 280 [°C] or less, an applied pressure of 10 [MPa] or more and 60 [MPa] or less, and heating of 5 [sec] or more and 240 [sec] or less . Thermocompression bonding is performed during the pressurization time. Thermocompression bonding system for example Carried out in the atmosphere.

不要區域去除步驟S2係如圖2C和圖5C所示，對第1中間體51，將傳送線路導體32與傳送線路導體32之間的不要區域R1藉由沖切去除以形成貫通第1中間體51的貫通孔U1，而作成第2中間體52。貫通孔U1係為例如長方形狀或圓角的長方形狀，在長度方向以既定間隔P2形成。既定間隔P2宜為2.5[mm]以下。藉此，串音的降低效果變高。舉例來說，貫通孔U1的長度係設定為相對於傳送線路導體32的全長為0.2倍以上且小於1.0倍。 The unnecessary region removal step S2 is to remove the unnecessary region R1 between the transmission line conductor 32 and the transmission line conductor 32 by punching out the first intermediate body 51 as shown in FIGS. 2C and 5C to form a through first intermediate body The through hole U1 of 51 forms the second intermediate body 52. The through hole U1 is, for example, rectangular or rounded, and is formed at a predetermined interval P2 in the longitudinal direction. The predetermined interval P2 should be 2.5 [mm] or less. As a result, the effect of reducing crosstalk becomes higher. For example, the length of the through hole U1 is set to be 0.2 times or more and less than 1.0 times the total length of the transmission line conductor 32.

在傳送線路導體32的全長超過500[mm]的情況下，舉例來說，既定間隔P2設定為1.5[mm]以上。藉此，第2導體41與第3導體46的接合變容易。在傳送線路導體32的全長為500[mm]以下的情況下，舉例來說，既定間隔P2設定為小於0.5[mm]。藉此，串音的降低效果變更高。例如，既定間隔P2被設定為0.0[mm]。藉此，串音的降低效果變得最高。 When the total length of the transmission line conductor 32 exceeds 500 [mm], for example, the predetermined interval P2 is set to 1.5 [mm] or more. As a result, the second conductor 41 and the third conductor 46 are easily joined. When the total length of the transmission line conductor 32 is 500 [mm] or less, for example, the predetermined interval P2 is set to less than 0.5 [mm]. With this, the effect of reducing crosstalk is changed to be high. For example, the predetermined interval P2 is set to 0.0 [mm]. With this, the crosstalk reduction effect becomes the highest.

第2熱壓接步驟S3係如圖3A和圖6A所示，對第2中間體52，在基底30之與第1主面34a相反側的面，將第1屏蔽物40的第2主面42a之側進行熱壓接，與此同時，將第2屏蔽物46熱壓接於基底30的第1主面34a。舉例來說，將第1基材34和第2基材42設為不同種材料，將第2基材42和第3基材47設為相同材料，以第1基材34之熔點以下的加熱溫度，且以第1基材34的荷重撓曲溫度或第1基材34的荷重撓曲溫度為中心而在正負20[℃]以內的加熱溫度、較佳為正負5[℃]以內的加熱溫度、更佳為正負2[℃]以內的加熱溫度，在既定壓力下一邊加壓既定時間一邊加熱並進行熱壓接。 In the second thermocompression bonding step S3, as shown in FIGS. 3A and 6A, for the second intermediate body 52, the second main surface of the first shield 40 is placed on the surface of the base 30 opposite to the first main surface 34a At the side of 42a, thermocompression bonding is performed, and at the same time, the second shield 46 is thermocompression bonded to the first main surface 34a of the base 30. For example, the first base material 34 and the second base material 42 are made of different materials, the second base material 42 and the third base material 47 are made of the same material, and the first base material 34 is heated below the melting point Temperature, and a heating temperature within plus or minus 20 [°C], preferably plus or minus 5 [°C], with the load deflection temperature of the first base material 34 or the load deflection temperature of the first base material 34 as the center The temperature, more preferably, is a heating temperature within plus or minus 2 [°C], which is heated and thermocompression-bonded while being pressurized at a predetermined pressure for a predetermined time.

或者，第2熱壓接步驟S3係對第2中間體52，在基底30之與第1主面34a相反側的面，將第1屏蔽物40的第2主面42a之側進行熱壓接。舉例來說，將第1基材34和第2基材42設為不同材料，以第1基材34之熔點以下的加熱溫度，且以第1基材34的荷重撓曲溫度或第1基材34的荷重撓曲溫度為中心而在正負20[℃]以內的加熱溫度、較佳為正負5[℃]以內的加熱溫度、更佳為正負2[℃]以內的加熱溫度，以既定壓力一邊加壓既定時間一邊加熱並進行熱壓接。 Alternatively, in the second thermocompression bonding step S3, the second intermediate body 52 is thermocompression bonded to the side of the second main surface 42a of the first shield 40 on the surface of the base 30 opposite to the first main surface 34a . For example, the first base material 34 and the second base material 42 are different materials, the heating temperature below the melting point of the first base material 34, and the load deflection temperature of the first base material 34 or the first base material The load deflection temperature of the material 34 is the center and the heating temperature is within plus or minus 20 [℃], preferably the plus or minus 5 [℃] heating temperature, more preferably plus or minus 2 [℃] heating temperature, with a predetermined pressure It heats and performs thermocompression bonding while applying pressure for a predetermined time.

第2熱壓接步驟S3係在例如180[℃]以上280[℃]以下的加熱溫度、10[MPa]以上60[MPa]以下的加壓力、5[秒]以上240[秒]以下的加熱．加壓時間進行熱壓接。熱壓接係例如在大氣中進行。 The second thermocompression bonding step S3 is, for example, a heating temperature of 180 [°C] or more and 280 [°C] or less, an applied pressure of 10 [MPa] or more and 60 [MPa] or less, and heating of 5 [sec] or more and 240 [sec] or less . Thermocompression bonding is performed during the pressurization time. The thermocompression bonding system is performed in the atmosphere, for example.

接續第2熱壓接步驟S3，第1接合步驟S4係將第3導體46的露出面藉由超音波接合於第2導體41的露出面。舉例來說，將第2導體41和第3導體46設為相同材料，藉由一邊以焊頭的按壓力為500[N]以上且2500[N]以下的按壓力按壓，一邊施加頻率為15[kHz]以上且200[kHz]以下的超音波振動來進行超音波接合，而作成第4中間體54。 Following the second thermocompression bonding step S3 and the first bonding step S4, the exposed surface of the third conductor 46 is ultrasonically bonded to the exposed surface of the second conductor 41. For example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency of 15 is applied by pressing with a pressing force of the welding head of 500 [N] or more and 2500 [N] or less. Ultrasonic vibration above [kHz] and below 200 [kHz] is performed by ultrasonic bonding, and the fourth intermediate body 54 is prepared.

如上述，以一貫的生產線所製造出的第4中間體54係以涵蓋全周範圍屏蔽的構造之第4中間體54的形式出貨，或者第4中間體54係在其他生產線進行後加工，或者第4中間體54係在電子機器的組裝線組裝且加工，而成為傳送線路20。 As mentioned above, the fourth intermediate 54 manufactured on a consistent production line is shipped in the form of a fourth intermediate 54 that covers the entire shielding structure, or the fourth intermediate 54 is post-processed on other production lines. Or the fourth intermediate 54 is assembled and processed on the assembly line of the electronic device, and becomes the transmission line 20.

圖11的例子中，接續第1接合步驟S4而進行第2接合步驟S5。第2接合步驟S5，係對第4中間體54，將第3導體46的端部藉由超音波接合於接地導體33的端部。在此，接 地導體33的端部係為傳送線路導體32的側之各者的端部。又，第3導體46的端部係兩者的端部。舉例來說，將第2導體41與第3導體46設為同一材料，藉由一邊以焊頭的按壓力為500[N]以上且2500[N]以下的按壓力按壓，一邊施加頻率為15[kHz]以上且200[kHz]以下的超音波振動來進行超音波接合，而作成第5中間體55。 In the example of FIG. 11, the second bonding step S5 is performed following the first bonding step S4. In the second joining step S5, the end of the third conductor 46 is joined to the end of the ground conductor 33 by ultrasonic waves to the fourth intermediate body 54. Here, take The end of the ground conductor 33 is the end of each of the sides of the transmission line conductor 32. In addition, the ends of the third conductor 46 are both ends. For example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency of 15 is applied by pressing with a pressing force of the welding head of 500 [N] or more and 2500 [N] or less. Ultrasonic vibration above [kHz] to 200 [kHz] is performed by ultrasonic vibration, and the fifth intermediate body 55 is prepared.

圖11的例子中，接續第2接合步驟S5，進行雷射加工步驟S6。雷射加工步驟S6係如圖3B所示，針對第5中間體55，藉由雷射照射使第3導體46中之與接地導體33接合面之相反側的面局部露出並以既定間隔形成窗部V1，而作成第6中間體56。窗部V1係為例如四角形狀或圓角四角形狀，且以既定間隔形成複數個。雷射照射係以既定輸出照射既定時間。雷射照射係可適用已知的設備和已知的工法。此外，也有省略雷射加工步驟S6的情況。 In the example of FIG. 11, the second bonding step S5 is continued, and the laser processing step S6 is performed. In the laser processing step S6, as shown in FIG. 3B, for the fifth intermediate body 55, the surface of the third conductor 46 opposite to the bonding surface with the ground conductor 33 is partially exposed by laser irradiation and windows are formed at predetermined intervals Part V1, and the sixth intermediate body 56 is made. The window portion V1 is, for example, a quadrangular shape or a rounded quadrangular shape, and a plurality of windows are formed at predetermined intervals. Laser irradiation is to irradiate for a predetermined time with a predetermined output. The laser irradiation system can be applied to known equipment and known construction methods. In addition, the laser processing step S6 may be omitted.

圖11的例子中，接續雷射加工步驟S6來進行檢查步驟S7。檢查步驟S7係針對第6中間體56，使檢查機8的接觸銷與傳送線路導體32接觸來進行通電，藉此檢查傳送線路導體32沒有斷線、以及導通程度在正常範圍內。導通檢查係可適用已知的設備和已知的工法。此外，也有沒有在此進行檢查步驟S7，而是在其他的生產線進行檢查步驟S7之情況。 In the example of FIG. 11, the inspection step S7 is performed following the laser processing step S6. In the inspection step S7, for the sixth intermediate body 56, the contact pins of the inspection machine 8 are brought into contact with the transmission line conductor 32 to conduct electricity, thereby checking that the transmission line conductor 32 is not disconnected and the degree of conduction is within a normal range. The continuity check system can apply known equipment and known construction methods. In addition, the inspection step S7 may not be performed here, but the inspection step S7 may be performed on another production line.

圖11的例子中，接續檢查步驟S7而進行分割步驟S8。分割步驟S8係利用分割取出機9的沖切刀，將經線上檢查的第6中間體56沿著既定的切割線沖切，藉此將傳送線路20分離並取出。分割取出係可適用已知的設備和已知的工法。此外，也有沒有在此進行分割步驟S8，而是在其他的生產線進行之情 況。 In the example of FIG. 11, the division step S8 is performed following the inspection step S7. In the dividing step S8, the sixth intermediate body 56 inspected on the line is punched along a predetermined cutting line by using the punching blade of the dividing and extracting machine 9, thereby separating and removing the conveying line 20. The division and extraction system can be applied to known equipment and known construction methods. In addition, there is a case where the division step S8 is not performed here, but is performed on other production lines condition.

如上述，以一貫的生產線製造且經線上檢查的傳送線路20，係藉由移載機17，例如在被真空吸附的狀態下搬送且收納於托盤18。 As described above, the transmission line 20 manufactured on a consistent production line and subjected to on-line inspection is transferred and stored in the tray 18 by the transfer machine 17 in a state of being vacuum-sucked, for example.

舉例來說，圖4A和圖6B係顯示平行配設有兩條傳送線路導體32之二芯構造的傳送線路20。在上述以外的構成方面，如圖7A所示，有作成三條傳送線路導體32分別平行配設的三芯構造的傳送線路20之情況。或者，如圖7B所示，有作成分別四條以上的傳送線路導體32分別平行配設的多芯構造的傳送線路20之情況。 For example, FIGS. 4A and 6B show a two-core transmission line 20 with two transmission line conductors 32 arranged in parallel. In the configuration other than the above, as shown in FIG. 7A, there may be a three-core transmission line 20 in which three transmission line conductors 32 are arranged in parallel. Alternatively, as shown in FIG. 7B, there may be a multi-core transmission line 20 in which four or more transmission line conductors 32 are respectively arranged in parallel.

根據本實施形態，藉由將基底30、覆蓋層35、第1屏蔽物40、及第2屏蔽物45以既定節距P1傳送，可經由第1熱壓接步驟S1、不要區域去除步驟S2、第2熱壓接步驟S3、及第1接合步驟S4，以一貫的生產線製造涵蓋全周範圍進行屏蔽且降低串音的薄型傳送線路20。且，因不使用接著劑或導電糊，而使第1屏蔽物40的第2導體和第2屏蔽物的第3導體進行超音波接合，所以可使生產時間(生產節拍)比導電糊或接著劑的熱硬化時間更短，所需的構成構件也能夠抑制為最小限度。 According to the present embodiment, by transferring the substrate 30, the cover layer 35, the first shield 40, and the second shield 45 at a predetermined pitch P1, the first thermocompression bonding step S1, the unnecessary area removal step S2, In the second thermocompression bonding step S3 and the first bonding step S4, a thin transmission line 20 that is shielded over the entire circumference and reduces crosstalk is manufactured on a consistent production line. In addition, since the adhesive or the conductive paste is not used, the second conductor of the first shield 40 and the third conductor of the second shield are ultrasonically bonded, so the production time (production cycle) can be made faster than that of the conductive paste or the adhesive. The thermal curing time of the agent is shorter, and the required constituent members can also be suppressed to a minimum.

又，根據此構成，在第2導體41與第3導體46藉由超音波接合的狀態下，可將與傳送線路導體32的輸入端及輸出端接近配置之接地導體33同時藉由超音波接合於第3導體46。因第1屏蔽物40和第2屏蔽物45成為一體構造體，所以可防止在將接地導體33同時藉由超音波接合於第3導體46時產生皺褶或應力變形。且，根據此構成，由於第3導體46係與第2屏蔽物45成為一體構造體，所以可容易地將藉由雷射使第 3導體46中之與導體33接合面的相反側的面局部露出之窗部V1以既定間隔形成。 Further, according to this configuration, in a state where the second conductor 41 and the third conductor 46 are joined by ultrasound, the ground conductor 33 disposed close to the input end and the output end of the transmission line conductor 32 can be simultaneously joined by ultrasound于第3 conductor 46. Since the first shield 40 and the second shield 45 form an integrated structure, it is possible to prevent the occurrence of wrinkles or stress deformation when the ground conductor 33 is ultrasonically bonded to the third conductor 46 at the same time. Moreover, according to this configuration, since the third conductor 46 and the second shield 45 form an integral structure, it is possible to easily use Among the three conductors 46, the window portion V1 partially exposed at the surface opposite to the surface to which the conductor 33 is joined is formed at a predetermined interval.

藉由上述實施形態之傳送線路的製造裝置1及傳送線路的製造方法，可製造屏蔽性能優異且降低傳送線路間的串音之薄型並且與省空間之構造對應的傳送線路20。 According to the transmission line manufacturing apparatus 1 and the transmission line manufacturing method of the above embodiment, the transmission line 20 which is excellent in shielding performance and reduces crosstalk between transmission lines and corresponds to a space-saving structure can be manufactured.

本實施形態的傳送線路20係具備：基底30，係第1導體31形成於片狀且由熱塑性樹脂所構成之第1基材34的第1主面34a，並且第1導體31中至少傳送線路導體32以既定節距P1形成有複數個，該第1導體31係包含傳送線路導體32、和傳送線路導體32的輸入端及輸出端分別接近之接地導體33；覆蓋層35，為覆蓋各傳送線路導體32的片狀且由熱塑性樹脂所構成；第1屏蔽物40，第2導體41形成於片狀且由熱塑性樹脂所構成之第2基材42的第2主面42a；及第2屏蔽物45，第3導體46形成於片狀且由熱塑性樹脂所構成的第3基材47；第1基材34中之第1主面34a與覆蓋層35、基底30中之第1主面34a的相反側的面與第1屏蔽物40的第2主面42a之側、基底30中之第1主面34a的相反側的面與第1屏蔽物40的第2主面42a之側、及覆蓋層35與第2屏蔽物45的第2主面42a之側係彼此熱壓接，且經對向配置的第2導體41與第3導體46係彼此藉由超音波接合，配設成以第2導體41和第3導體46分別包圍傳送線路導體32的方式配設。 The transmission line 20 of the present embodiment includes a base 30, the first conductor 31 is formed on the first main surface 34a of the sheet-shaped first base material 34 composed of a thermoplastic resin, and at least the transmission line in the first conductor 31 A plurality of conductors 32 are formed at a predetermined pitch P1. The first conductor 31 includes a transmission line conductor 32 and a ground conductor 33 close to the input end and output end of the transmission line conductor 32; The sheet conductor of the line conductor 32 is composed of a thermoplastic resin; the first shield 40 and the second conductor 41 are formed on the second main surface 42a of the second base material 42 composed of a sheet of thermoplastic resin; and the second shield Object 45, the third conductor 46 is formed on a sheet-shaped third base material 47 made of thermoplastic resin; the first main surface 34a and the cover layer 35 in the first base material 34, and the first main surface 34a in the base 30 The surface on the opposite side to the side of the second main surface 42a of the first shield 40, the surface of the base 30 opposite the side of the first main surface 34a and the side of the second main surface 42a of the first shield 40, and The cover layer 35 and the side of the second main surface 42a of the second shield 45 are thermocompression-bonded to each other, and the second conductor 41 and the third conductor 46 which are opposed to each other are ultrasonically bonded to each other and are arranged such that The second conductor 41 and the third conductor 46 are arranged so as to surround the transmission line conductor 32, respectively.

如圖4A、圖4B及圖6B所示，根據本實施形態，以在夾著基底30及覆蓋層35而對向配置之第1屏蔽物40的第2導體41與第2屏蔽物45的第3導體46藉由超音波接合的狀態下包圍傳送線路導體32之方式，成為涵蓋全周範圍屏蔽且已 降低串音之薄型的傳送線路20。且，因不使用接著劑或導電糊，而使第1屏蔽物40的第2導體41與第2屏蔽物45的第3導體46進行超音波接合，所以至少可作成接著劑或導電糊的厚度的程度之薄型構造。又，與習知技術在傳送線路間打設通路以謀求串音降低的方法相比較，可大幅降低製造成本。 As shown in FIGS. 4A, 4B, and 6B, according to this embodiment, the second conductor 41 of the first shield 40 and the second shield 45 of the first shield 40 that are opposed to each other with the substrate 30 and the cover layer 35 interposed therebetween The 3-conductor 46 surrounds the transmission line conductor 32 in a state of ultrasonic bonding, and becomes a shield covering the entire circumference and has A thin transmission line 20 that reduces crosstalk. Moreover, since no adhesive or conductive paste is used, the second conductor 41 of the first shield 40 and the third conductor 46 of the second shield 45 are ultrasonically bonded, so at least the thickness of the adhesive or conductive paste can be made The degree of thin structure. In addition, compared with the conventional technique of establishing a path between transmission lines to reduce crosstalk, the manufacturing cost can be greatly reduced.

舉例來說，接地導體33的端部和第3導體46的端部係彼此藉由超音波接合。根據此構成，藉由對於傳送線路導體32的輸入端及輸出端之屏蔽效果，可防止外來雜訊。 For example, the end of the ground conductor 33 and the end of the third conductor 46 are ultrasonically joined to each other. According to this configuration, by shielding the input and output ends of the transmission line conductor 32, extraneous noise can be prevented.

又，在第3基材47以既定間隔形成有複數個窗部V1，藉由窗部V1，使第3導體46的一部分以可進行外部連接的方式露出。根據此構成，舉例來說，構成為可容易將藉由窗部V1而露出之第3導體46的一部分與行動資訊終端的框體或接地配線外部連接以提高屏蔽性能。 In addition, a plurality of window portions V1 are formed at a predetermined interval on the third base material 47, and a part of the third conductor 46 is exposed through the window portion V1 so as to be externally connectable. According to this configuration, for example, it is possible to easily connect a part of the third conductor 46 exposed through the window portion V1 to the housing or ground wiring of the mobile information terminal to improve the shielding performance.

如圖6B所示，在長度方向的兩側形成有切斷面。根據此構成，因長度方向的兩側被切斷，故寬度尺寸成為一定。 As shown in FIG. 6B, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, since both sides in the longitudinal direction are cut, the width dimension becomes constant.

以上，本發明並不受限於上述的實施形態。上述的例子中，係設成將片狀基底30以捲取狀態供給之構成，但不受限於此，也能夠以既定尺寸的單片狀堆疊於匣盒(magazine)中，並從前述匣盒藉由供給輥等供給到生產線。關於覆蓋層35、第1屏蔽物40、第2屏蔽物45，也同樣地以既定尺寸的單片狀堆疊於匣盒，也可從前述匣盒藉由供給輥等供給到生產線。 As described above, the present invention is not limited to the above-mentioned embodiments. In the above example, the sheet substrate 30 is configured to be supplied in a wound state, but it is not limited to this, and it can also be stacked in a single sheet of a predetermined size in a magazine and removed from the aforementioned magazine The boxes are supplied to the production line by supply rollers and the like. The cover layer 35, the first shield 40, and the second shield 45 are similarly stacked on the cassette in a single piece of a predetermined size, and may be supplied from the cassette to the production line by a supply roller or the like.

20‧‧‧傳送線路 20‧‧‧ Transmission line

32‧‧‧傳送線路導體 32‧‧‧Transmission line conductor

34‧‧‧第1基材 34‧‧‧1st base material

35‧‧‧覆蓋層 35‧‧‧overlay

40‧‧‧第1屏蔽物 40‧‧‧ 1st shield

41‧‧‧第2導體 41‧‧‧ 2nd conductor

42‧‧‧第2基材 42‧‧‧2nd base material

42a‧‧‧第2主面 42a‧‧‧The second main face

45‧‧‧第2屏蔽物 45‧‧‧ 2nd shield

46‧‧‧第3導體 46‧‧‧The third conductor

47‧‧‧第3基材 47‧‧‧3rd base material

54‧‧‧第4中間體 54‧‧‧4th intermediate

Claims (13)

一種傳送線路，其特徵為：具備：基底，係將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面而成；覆蓋層，為覆蓋前述傳送線路導體的片狀且由熱塑性樹脂所構成；第1屏蔽物，係將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成；及第2屏蔽物，係將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成，前述第1基材中之前述第1主面與前述覆蓋層、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、及前述覆蓋層與前述第2屏蔽物的前述第2主面之側係彼此熱壓接，前述第2導體和前述第3導體係彼此藉由超音波接合，配設成以前述第2導體和前述第3導體包圍前述傳送線路導體。 A transmission line is characterized by comprising: a base, a first conductor formed by a transmission line conductor and a ground conductor close to the input end and output end of the transmission line conductor, respectively, formed in a sheet shape and composed of a thermoplastic resin The first main surface of the first base material is formed; the cover layer is a sheet covering the transmission line conductor and is composed of a thermoplastic resin; the first shield is formed by forming the second conductor in a sheet shape and is composed of a thermoplastic resin Formed by the second main surface of the second base material formed; and the second shield is formed by forming the third conductor on a sheet-shaped third base material composed of a thermoplastic resin, in the aforementioned first base material The side of the first main surface and the cover layer, the side of the base opposite to the side of the first main surface and the side of the second main surface of the first shield, the side of the first main surface of the base The surface on the opposite side and the side of the second main surface of the first shield, and the side of the cover layer and the second main surface of the second shield are thermocompression-bonded to each other, the second conductor and the first The three-conductor systems are ultrasonically joined to each other and arranged to surround the transmission line conductor with the second conductor and the third conductor. 一種傳送線路，其特徵為：具備：基底，係將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成之第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面，並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成；覆蓋層，為覆蓋各前述傳送線路導體的片狀且由熱塑性樹脂所構成；第1屏蔽物，將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成；及第2屏蔽物，將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成， 前述第1基材中之前述第1主面與前述覆蓋層、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、前述基底中之前述第1主面的相反側的面與前述第1屏蔽物的前述第2主面之側、及前述覆蓋層與前述第2屏蔽物的前述第2主面之側係彼此熱壓接，對向配置的前述第2導體和前述第3導體係彼此藉由超音波接合，配設成以前述第2導體和前述第3導體分別包圍前述傳送線路導體。 A transmission line is characterized by comprising: a base, a first conductor formed of a transmission line conductor and a ground conductor close to the input end and the output end of the transmission line conductor respectively formed in a sheet shape and composed of a thermoplastic resin The first main surface of the first base material, and at least the transmission line conductor of the first conductor is formed with a plurality of predetermined pitches; the covering layer is a sheet-like material covering each of the transmission line conductors and made of thermoplastic resin The first shield is formed by forming the second conductor on the second main surface of the second base material made of thermoplastic resin; and the second shield is formed by forming the third conductor in the sheet and Made of a third base material made of thermoplastic resin, The first main surface of the first base material and the cover layer, the surface of the substrate opposite to the first main surface, and the side of the second main surface of the first shield, the substrate The surface opposite to the first main surface and the side of the second main surface of the first shield, and the side of the cover layer and the second main surface of the second shield are thermocompression bonded to each other The second conductor and the third conductor system that are arranged toward each other are joined by ultrasound, and are arranged so as to surround the transmission line conductor with the second conductor and the third conductor, respectively. 如請求項1或2之傳送線路，其中在長度方向的兩側形成有切斷面。 The transmission line according to claim 1 or 2, in which cut surfaces are formed on both sides in the longitudinal direction. 如請求項1至3中任一項之傳送線路，其中前述接地導體的端部和前述第3導體的端部係彼此藉由超音波接合。 The transmission line according to any one of claims 1 to 3, wherein the end of the ground conductor and the end of the third conductor are ultrasonically joined to each other. 如請求項1至4中任一項之傳送線路，其中在前述第3基材以既定間隔形成有複數個窗部，藉由前述窗部使前述第3導體的一部分以可進行外部連接的方式露出。 The transmission line according to any one of claims 1 to 4, wherein a plurality of window portions are formed at predetermined intervals on the third base material, and a part of the third conductor can be externally connected by the window portion Exposed. 一種傳送線路的製造方法，係為具備由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體以既定節距形成於片狀第1基材的第1主面而成之基底、覆蓋前述傳送線路導體的片狀覆蓋層、將第2導體形成於片狀第2基材的第2主面而成之第1屏蔽物、以及將第3導體形成於片狀第3基材而成之第2屏蔽物之傳送線路的製造方法，或者具備將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成之基底、為覆 蓋各前述傳送線路導體的片狀且由熱塑性樹脂所構成之覆蓋層、將第2導體形成於片狀且由熱塑性樹脂所構成之第2基材的第2主面而成之第1屏蔽物、以及將第3導體形成於片狀且由熱塑性樹脂所構成的第3基材而成之第2屏蔽物之傳送線路的製造方法，其特徵為具備：第1熱壓接步驟，將前述覆蓋層熱壓接於前述第1主面；不要區域去除步驟，對熱壓接有前述覆蓋層的第1中間體，去除前述傳送線路導體與前述傳送線路導體之間的不要區域以形成貫通前述第1中間體之貫通孔；第2熱壓接步驟，對形成有前述貫通孔的第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面；及第1接合步驟，在熱壓接有前述第1屏蔽物的狀態下，將前述第3導體的露出面藉由超音波接合於前述第2導體的露出面。 A method of manufacturing a transmission line is provided with a first conductor composed of a transmission line conductor and a ground conductor close to the input end and the output end of the transmission line conductor, respectively, formed on a sheet-shaped first base material at a predetermined pitch The base formed by the first main surface, the sheet-like covering layer covering the transmission line conductor, the first shield formed by forming the second conductor on the second main surface of the sheet-like second base material, and the third conductor A method for manufacturing a transmission line of a second shield formed on a sheet-shaped third base material, or a first including a transmission line conductor and a ground conductor close to the input end and output end of the transmission line conductor, respectively The conductor is formed on the first main surface of the first substrate made of a thermoplastic resin, and at least the transmission line conductor of the first conductor is formed with a plurality of bases at a predetermined pitch, and is covered A sheet-shaped cover layer composed of a thermoplastic resin covering each of the aforementioned transmission line conductors, and a first shield formed by forming a second conductor on the second main surface of a sheet-shaped thermoplastic resin-made second base material And a method for manufacturing a transmission line of a second shield in which a third conductor is formed on a sheet-shaped third substrate made of a thermoplastic resin, characterized by comprising: a first thermocompression bonding step, covering the foregoing The layer is thermally pressure-bonded to the first main surface; the unnecessary area removal step is to remove the unnecessary area between the transmission line conductor and the transmission line conductor for the first intermediate body that is thermally pressure-bonded with the cover layer to form a through-hole 1 through hole of the intermediate body; second thermocompression bonding step, for the second intermediate body formed with the through hole, the side of the second main surface of the first shield is thermocompression bonded to the first 1 the surface opposite to the main surface; and the first bonding step, in a state where the first shield is thermocompression bonded, the exposed surface of the third conductor is ultrasonically bonded to the exposed surface of the second conductor . 如請求項6之傳送線路的製造方法，其中前述第2熱壓接步驟係對前述第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面，並且將前述第2屏蔽物的前述第2主面之側熱壓接於前述覆蓋層。 The method of manufacturing a transmission line according to claim 6, wherein the second thermocompression bonding step is to thermocompression-bond the side of the second main surface of the first shield to the second intermediate body of the second intermediate body The surface on the opposite side of the first main surface, and the side of the second main surface of the second shield is thermocompression-bonded to the cover layer. 如請求項6或7之傳送線路的製造方法，其係具有在前述第2導體和前述第3導體藉由超音波接合的狀態下，將前述第3導體的端部藉由超音波接合於前述接地導體的端部之第2接合步驟。 The method for manufacturing a transmission line according to claim 6 or 7, which comprises ultrasonically joining the end of the third conductor to the foregoing in a state where the second conductor and the third conductor are joined by ultrasonic The second bonding step of the end of the ground conductor. 如請求項8之傳送線路的製造方法，其係具有在前述接地導體和前述第3導體藉由超音波接合的狀態下，藉由雷射照 射使前述第3導體的一部分露出之雷射加工步驟。 The method for manufacturing a transmission line according to claim 8, which is provided by laser irradiation in a state where the ground conductor and the third conductor are joined by ultrasound A laser processing step that exposes a part of the third conductor. 一種傳送線路的製造裝置，其特徵為具備：基底供給機，係供給將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體以既定節距形成於片狀第1基材的第1主面而成之基底，或者供給將由傳送線路導體和與前述傳送線路導體的輸入端及輸出端分別接近之接地導體所構成的第1導體形成於片狀且由熱塑性樹脂所構成之第1基材的第1主面並且前述第1導體中至少前述傳送線路導體以既定節距形成有複數個而成之基底；覆蓋層供給機，供給覆蓋前述傳送線路導體的片狀覆蓋層；第1屏蔽物供給機，供給將第2導體形成於片狀第2基材的第2主面而成之第1屏蔽物；第2屏蔽物供給機，供給將第3導體形成於片狀第3基材而成之第2屏蔽物；第1熱壓接機，將前述覆蓋層熱壓接於第1主面；不要區域去除機，對熱壓接有前述覆蓋層的第1中間體，去除前述傳送線路導體和前述傳送線路導體之間的不要區域以形成貫通前述第1中間體的貫通孔；第2熱壓接機，對形成有前述貫通孔的第2中間體，將前述第1屏蔽物的前述第2主面之側熱壓接於前述基底中之前述第1主面的相反側的面；以及第1接合機，在熱壓接有前述第1屏蔽物的狀態下，將前述第3導體的露出面藉由超音波接合於前述第2導體的露出面。 A transmission line manufacturing apparatus, characterized by comprising: a substrate feeder for supplying a first conductor composed of a transmission line conductor and a ground conductor close to the input and output ends of the transmission line conductor at a predetermined pitch A base formed on the first main surface of the sheet-shaped first base material, or a first conductor formed of a transmission line conductor and a ground conductor close to the input end and output end of the transmission line conductor, respectively, is formed in a sheet shape And a first main surface of a first base material composed of a thermoplastic resin and at least the transmission line conductor of the first conductor is formed with a plurality of substrates at a predetermined pitch; a coating layer supplying machine is provided to cover the transmission line Sheet covering layer of conductor; first shield supply machine, supplying the first shield formed by forming the second conductor on the second main surface of the sheet-like second base material; second shield supply machine, supplying the first shield 3 The second shield formed by forming the conductor on the sheet-like third base material; the first thermocompression bonding machine, which thermocompression-bonds the above-mentioned cover layer to the first main surface; the area-removing machine is unnecessary, and the aforementioned cover is applied to thermocompression bonding The first intermediate body of the layer, removing unnecessary areas between the transmission line conductor and the transmission line conductor to form a through hole penetrating the first intermediate body; a second thermocompression bonding machine An intermediate body, thermocompression bonding the side of the second main surface of the first shield to the surface opposite to the first main surface of the substrate; and a first bonding machine, which is thermocompression bonded to the first In the state of the shield, the exposed surface of the third conductor was ultrasonically bonded to the exposed surface of the second conductor. 如請求項10之傳送線路的製造裝置，其中前述第2熱壓接機係構成為對前述第2中間體，將前述第1屏蔽物的前述 第2主面之側熱壓接於前述基底中之前述第1主面的相反側之面，並且將前述第2屏蔽物的前述第2主面之側熱壓接於前述覆蓋層。 The transmission line manufacturing apparatus according to claim 10, wherein the second thermocompression bonding machine is configured to apply the second shield to the second intermediate body The side of the second main surface is thermocompression bonded to the surface of the substrate opposite to the first main surface, and the side of the second main surface of the second shield is thermocompression bonded to the cover layer. 如請求項10或11之傳送線路的製造裝置，其具備第2接合機，該第2接合機係在前述第2導體和前述第3導體藉由超音波接合的狀態下，將前述第3導體的端部藉由超音波接合於前述接地導體的端部。 The transmission line manufacturing apparatus according to claim 10 or 11, comprising a second bonding machine which connects the third conductor in a state where the second conductor and the third conductor are ultrasonically bonded The end of is joined to the end of the aforementioned ground conductor by ultrasound. 如請求項12之傳送線路的製造裝置，其具備雷射加工機，該雷射加工機係在前述接地導體和前述第3導體藉由超音波接合的狀態下，藉由雷射照射使前述第3導體的一部分露出。 A transmission line manufacturing apparatus according to claim 12, which includes a laser processing machine that irradiates the first and second conductors with ultrasonic waves in a state where the ground conductor and the third conductor are joined by ultrasound 3 A part of the conductor is exposed.
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