JP6611293B1 - Transmission line, transmission line manufacturing method, and transmission line manufacturing apparatus - Google Patents
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Abstract
【課題】銅張積層板を互いに接合する構成によって全周に亘ってシールドしてクロストークを低減した薄型の伝送線路を提供する。【解決手段】伝送線路２０は、伝送線路導体３２と伝送線路導体３２の入力端および出力端にそれぞれ近接するグランド導体３３とからなる第１導体３１がシート状で熱可塑性樹脂からなる第１基材３４の第１主面３４ａに形成されたベース３０を備え、第１基材３４における第１主面３４ａとカバーレイ３５、ベース３０における第１主面３４ａの反対側の面と第１シールド４０の第２主面４２ａの側、ベース３０における第１主面３４ａの反対側の面と第１シールド４０の第２主面４２ａの側、及びカバーレイ３５と第２シールド４５の第２主面４２ａの側とは互いに熱圧着されており、且つ、第２導体４１と第３導体４６とは互いに超音波接合されており、第２導体４１と第３導体４６とで伝送線路導体３２を各々囲むように配設される。【選択図】図６Provided is a thin transmission line in which a copper-clad laminate is bonded to each other to shield the entire circumference and reduce crosstalk. A transmission line includes a first conductor composed of a thermoplastic resin and a first conductor comprising a transmission line conductor and a ground conductor close to the input end and the output end of the transmission line conductor. A base 30 formed on the first main surface 34a of the material 34; a first main surface 34a of the first base material 34; a cover lay 35; a surface of the base 30 opposite to the first main surface 34a; 40, the second main surface 42a side of the base 30, the surface of the base 30 opposite to the first main surface 34a and the second main surface 42a side of the first shield 40, and the second main surface of the coverlay 35 and the second shield 45. The second conductor 41 and the third conductor 46 are ultrasonically bonded to each other on the surface 42 a side, and the transmission line conductor 32 is connected by the second conductor 41 and the third conductor 46. It is arranged to surround each . [Selection] Figure 6
Description
本発明は、伝送線路、伝送線路の製造方法及び伝送線路の製造装置に関する。 The present invention relates to a transmission line, a transmission line manufacturing method, and a transmission line manufacturing apparatus.
近年、電子機器における高密度実装技術の発展は著しく、銅張積層板（ＣＣＬ）を用いた薄型の伝送線路の需要は益々高まっている。 In recent years, the development of high-density mounting technology in electronic devices has been remarkable, and the demand for thin transmission lines using copper clad laminates (CCL) is increasing.
従来、液晶ポリマーから成る絶縁体層の一主面の片側領域ないし中央領域に、互いに絶縁隔離して信号配線およびグランド配線を形成する工程と、前記絶縁体層の他主面に、前記グランド配線に接続可能な導電性突起部を有する導電性箔を位置決めして積層配置する工程と、前記積層体を加圧して一体化し、前記絶縁体層を貫挿する導電性突起部をグランド配線に電気的に接続させる工程と、前記絶縁体層を前記各配線の形成領域の外側に沿って非形成領域を折り曲げ、各配線の形成領域面および非形成領域面を対向させて一体化し、前記他主面の導電性箔をシールド層化する工程と、を有するフラット型シールドケーブルの製造方法が提案されている（特許文献１：特許第３４９７１１０号公報）。 Conventionally, a step of forming a signal wiring and a ground wiring by insulating and isolating from each other on one side region or a central region of one main surface of an insulating layer made of a liquid crystal polymer, and the ground wiring on the other main surface of the insulating layer The conductive foil having conductive protrusions that can be connected to the substrate is positioned and laminated, and the laminate is pressed and integrated, and the conductive protrusions that penetrate the insulator layer are electrically connected to the ground wiring. Connecting the insulating layer to the wiring layer, bending the non-formation region along the outside of the formation region of each wiring, and integrating the formation region surface and the non-formation region surface of each wiring so as to face each other. A method of manufacturing a flat shield cable having a step of forming a conductive layer on the surface into a shield layer has been proposed (Patent Document 1: Japanese Patent No. 3497110).
また、可撓性を有する誘電体素体（液晶ポリマー）と、前記誘電体素体に設けられている線状の信号線と、前記誘電体素体に設けられ、かつ、前記信号線と対向しているグランド導体と、前記誘電体素体の主面の法線方向において、前記信号線に関して前記グランド導体の反対側に設けられている補助グランド導体であって、該法線方向から平面視したときに、前記信号線を挟んでいると共に、該信号線に沿って延在している２つの主要部と、該２つの主要部を接続していると共に、該信号線と交差するブリッジ部とを含んでいる補助グランド導体と、前記補助グランド導体と前記グランド導体とを電気的に接続しているビアホール導体と、を備えており、前記法線方向において、前記信号線と前記補助グランド導体との間隔が前記信号線と前記グランド導体との間隔よりも小さい構成の高周波信号線路が提案されている（特許文献２：実用新案登録第３１７３１４３号公報）。 Further, a flexible dielectric element (liquid crystal polymer), a linear signal line provided on the dielectric element, and provided on the dielectric element and facing the signal line And an auxiliary ground conductor provided on the opposite side of the ground conductor with respect to the signal line in the normal direction of the main surface of the dielectric element body, as viewed in plan from the normal direction The two main parts extending along the signal line, and the bridge part connecting the two main parts and intersecting the signal line. And a via-hole conductor that electrically connects the auxiliary ground conductor and the ground conductor, and the signal line and the auxiliary ground conductor in the normal direction. And the signal line is Serial high-frequency signal transmission line of smaller construction than the distance between the ground conductor has been proposed (Patent Document 2: JP Utility Model Registration No. 3173143).
そして、信号導体の両側に、信号導体と同一平面上に接地導体を配置し、これら信号導体および接地導体を上下双方向から電気絶縁薄膜で被覆し、導電性接着層を設けた面同士が向き合うようにして電気絶縁薄膜の外側に金属遮蔽層で被覆した信号伝送用ケーブルが提案されている（特許文献３：特開２００６−２０２７１４号公報）。 Then, ground conductors are arranged on the same plane as the signal conductors on both sides of the signal conductors, the signal conductors and the ground conductors are covered with an electrically insulating thin film from above and below, and the surfaces provided with the conductive adhesive layer face each other. Thus, a signal transmission cable in which the outer side of the electrically insulating thin film is covered with a metal shielding layer has been proposed (Patent Document 3: Japanese Patent Application Laid-Open No. 2006-202714).
伝送線路は、外来ノイズを抑えるシールド性能を維持しつつ、省スペースに対応した薄型構造が要求される。特に、伝送線路間のクロストークの低減が課題となっている。また、伝送線路の製造メーカに対して、伝送線路またはその中間体を、携帯情報端末等の急な需要拡大に対応可能な短い生産時間で生産することが要求される。 The transmission line is required to have a thin structure corresponding to space saving while maintaining shielding performance for suppressing external noise. In particular, reduction of crosstalk between transmission lines is a problem. In addition, transmission line manufacturers are required to produce a transmission line or an intermediate thereof in a short production time that can cope with a sudden increase in demand for portable information terminals and the like.
ここで、伝送線路の中間体は、伝送線路となる前段階の半製品であって、特に、全周に亘ってシールドする構造となっている状態の半製品を指している。 Here, the intermediate body of the transmission line is a semi-finished product in a previous stage that becomes a transmission line, and particularly indicates a semi-finished product in a state of being shielded over the entire circumference.
上記の課題に対して、特許文献１の伝送線路は、銅張積層板を折り曲げる構造上、全周に亘ってシールドする場合に薄型化が困難である。また、特許文献２の伝送線路は、側面にシールドが施されていないので、全周に亘ってシールドする構造に比べてシールド性能が劣るうえ、クロストークが大きくなる。そして、特許文献２および特許文献３の伝送線路は、クリームはんだや導電性接着剤等の導電ペーストを熱硬化させてグランド導体とシールド導体とを接続しているので、導電ペーストの熱硬化時間がネックとなって、生産時間（タクトタイム）を熱硬化時間よりも短くすることができない。また、接着剤を用いて銅張積層板同士を接合する場合にも同様の問題がある。従来技術として、伝送線路間にビアを打ってクロストーク低減を図る方法も考えられるが、多数のビア加工が必要となるため、製造コストが高くなってしまう。 With respect to the above-described problem, the transmission line of Patent Document 1 is difficult to reduce in thickness when it is shielded over the entire circumference because of the structure in which the copper-clad laminate is bent. Further, since the transmission line of Patent Document 2 is not shielded on the side surface, the shielding performance is inferior to that of a structure that shields the entire circumference, and crosstalk increases. And since the transmission line of patent document 2 and patent document 3 heat-cures conductive pastes, such as cream solder and a conductive adhesive, and connects the ground conductor and the shield conductor, the thermosetting time of a conductive paste is carried out. As a result, the production time (tact time) cannot be made shorter than the heat curing time. Moreover, there is a similar problem when copper-clad laminates are bonded together using an adhesive. As a conventional technique, a method of reducing the crosstalk by placing vias between transmission lines is conceivable. However, since a large number of vias are required, the manufacturing cost is increased.
本発明は、上記事情に鑑みてなされ、対向配置された銅張積層板を互いに接合する構成によって全周に亘ってシールドしてクロストークを低減した薄型の伝送線路、及び薄型の伝送線路またはその中間体を一貫した製造ラインで製造し、かつ、接着剤や導電ペーストを用いずに銅張積層板同士を接合することによって生産時間（タクトタイム）を導電ペーストや接着剤の熱硬化時間よりも短くすることができる構成の伝送線路の製造方法並びに伝送線路の製造装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and has a thin transmission line that is shielded over the entire circumference by a configuration in which opposed copper clad laminates are joined to each other to reduce crosstalk, and a thin transmission line or the same The production time (tact time) can be made longer than the heat curing time of the conductive paste or adhesive by manufacturing the intermediate on a consistent production line and joining the copper clad laminates without using the adhesive or conductive paste. It is an object of the present invention to provide a transmission line manufacturing method and a transmission line manufacturing apparatus that can be shortened.
一実施形態として、以下に開示するような解決手段により、前記課題を解決する。 As an embodiment, the above-described problem is solved by a solution as disclosed below.
本発明の伝送線路は、伝送線路導体と前記伝送線路導体の入力端および出力端にそれぞれ近接するグランド導体とからなる第１導体が熱可塑性樹脂からなるシート状の第１基材における第１主面に形成されるとともに前記第１導体のうち少なくとも前記伝送線路導体が所定ピッチで複数形成されたベースと、各前記伝送線路導体を覆う熱可塑性樹脂からなるシート状のカバーレイと、第２導体が熱可塑性樹脂からなるシート状の第２基材における第２主面に形成された第１シールドと、第３導体が熱可塑性樹脂からなるシート状の第３基材に形成された第２シールドとを備え、前記第１基材における第１主面に前記カバーレイを接着した構成であり、前記第１基材の第１主面の反対側の面に前記第１シールドの第２導体面を接着した構成であり、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を接着した構成であり、前記第２導体面に前記第３導体面を接合した構成であり、且つ、前記第２導体と前記第３導体とで前記伝送線路導体を各々囲むように配設した構成によって、複数の前記伝送線路導体を各々シールドした薄型構造となっていることを特徴とする。 The transmission line of the present invention is a first main body in a sheet-like first base material in which a first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is made of a thermoplastic resin. a base at least the transmission line conductors of said first conductor is formed with a plurality at a predetermined pitch is formed in a plane, the coverlay sheet made of a thermoplastic resin covering each said transmission line conductors, second conductors second shield but formed on the first shield and the third base material sheet of the third conductor is formed of a thermoplastic resin formed on the second major surface of the second substrate sheet formed of a thermoplastic resin with the door, wherein the first major surface of the first substrate is configured to coverlay was against wear, a second conductor of the first shield on the opposite side of the first main surface of said first substrate configuration der the surface was against wearing A configuration in which the third contact the conductor surface wear of the second shield on the opposite side of the bonding surface between the first substrate of the coverlay, joining the third conductor surface to the second conductor surface And a thin structure in which a plurality of the transmission line conductors are shielded by the second conductor and the third conductor so as to surround the transmission line conductors. It is characterized by.
一例として、ベース及びカバーレイを挟んで対向配置された第１シールドの第２導体と第２シールドの第３導体とが超音波接合された状態で伝送線路導体を囲むように、全周に亘ってシールドする構造の伝送線路となる。そして、接着剤や導電ペーストを用いずに、第１シールドの第２導体と第２シールドの第３導体とが超音波接合されるので、少なくとも接着剤や導電ペーストの厚みの分薄型構造にできる。 As an example , the second conductor of the first shield and the third conductor of the second shield, which are arranged to face each other with the base and the coverlay interposed therebetween, are ultrasonically joined to surround the transmission line conductor over the entire circumference. A transmission line with a shielded structure. And since the 2nd conductor of a 1st shield and the 3rd conductor of a 2nd shield are ultrasonically joined without using an adhesive agent or an electrically conductive paste, it can be made thin structure at least by the thickness of an adhesive agent or an electrically conductive paste. .
一例として、長手方向の両側に切断面が形成されている。この構成によれば、長手方向の両側が切断されているので幅寸法が一定となる。 As an example, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, since the both sides in the longitudinal direction are cut, the width dimension is constant.
本発明の伝送線路の製造方法は、伝送線路導体と前記伝送線路導体の入力端および出力端にそれぞれ近接するグランド導体とからなる第１導体が熱可塑性樹脂からなるシート状の第１基材における第１主面に形成されるとともに前記第１導体のうち少なくとも前記伝送線路導体が所定ピッチで複数形成されたベースと、各前記伝送線路導体を覆うシート状のカバーレイと、第２導体が熱可塑性樹脂からなるシート状の第２基材における第２主面に形成された第１シールドと、第３導体が熱可塑性樹脂からなるシート状の第３基材に形成された第２シールドとを用いて複数の前記伝送線路導体を各々シールドした薄型構造とするために、前記第１基材の第１主面に前記カバーレイを熱圧着する第１熱圧着ステップと、前記カバーレイが熱圧着された第１中間体に対し、前記伝送線路導体と前記伝送線路導体との間の不要領域を除去して前記第１中間体を厚み方向に貫通する貫通穴を複数形成する不要領域除去ステップと、前記貫通穴が複数形成された第２中間体に対し、前記第１基材における第１主面の反対側の面に前記第１シールドの第２導体面を熱圧着するとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を熱圧着する第２熱圧着ステップと、前記第１シールドの第２導体面が熱圧着された状態であるとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面が熱圧着された状態で、前記第２導体面に前記第３導体面を超音波接合する第１接合ステップとを有することを特徴とする。 In the method for manufacturing a transmission line according to the present invention, the first conductor composed of the transmission line conductor and the ground conductor adjacent to the input end and the output end of the transmission line conductor is a sheet-like first base material made of a thermoplastic resin . A base formed on the first main surface and at least a plurality of the transmission line conductors at a predetermined pitch among the first conductors, a sheet-like cover lay covering each of the transmission line conductors, and a second conductor being heat a first shield which is formed on the second main surface of the second substrate sheet formed of a thermoplastic resin, and a second shield third conductors are formed on the third base material sheet made of a thermoplastic resin A first thermocompression bonding step for thermocompression bonding the coverlay to the first main surface of the first base material, and the coverlay is thermocompression-bonded to form a thin structure in which a plurality of the transmission line conductors are shielded. The First to an intermediate, and unnecessary region removal step of forming a plurality of unnecessary region is removed through holes through the first intermediate in the thickness direction between said transmission line conductor and the transmission line conductor, The second conductor surface of the first shield is thermocompression-bonded to the surface opposite to the first main surface of the first base material with respect to the second intermediate body in which the plurality of through holes are formed . A second thermocompression bonding step for thermocompression bonding of the third conductor surface of the second shield to a surface opposite to the adhesive surface with the first substrate; and a state in which the second conductor surface of the first shield is thermocompression bonded And the third conductor on the second conductor surface in a state where the third conductor surface of the second shield is thermocompression bonded to the surface of the coverlay opposite to the adhesive surface with the first substrate. And a first joining step for ultrasonically joining the surfaces .
この構成によれば、ベース、カバーレイ、第１シールド、及び第２シールドを所定ピッチで送ることで、第１熱圧着ステップ、不要領域除去ステップ、第２熱圧着ステップ、及び第１接合ステップを経て、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路またはその中間体を一貫した製造ラインで製造できる。そして、接着剤や導電ペーストを用いずに、第１シールドの第２導体と第２シールドの第３導体とを超音波接合するので、生産時間（タクトタイム）を導電ペーストや接着剤の熱硬化時間よりも短くすることができ、必要な構成部材も最小限に抑えられる。 According to this configuration, the first thermocompression bonding step, the unnecessary region removing step, the second thermocompression bonding step, and the first joining step are performed by sending the base, the coverlay, the first shield, and the second shield at a predetermined pitch. As a result, it is possible to manufacture a thin transmission line or an intermediate body thereof that is shielded over the entire circumference to reduce crosstalk, or an intermediate product thereof. Since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or conductive paste, the production time (tact time) can be set by thermosetting the conductive paste or adhesive. It can be shorter than the time, and the necessary components are minimized.
この構成によれば、第１シールドや第２シールドの皺の発生を防止できる。 According to this configuration, it is possible to prevent the occurrence of wrinkles of the first shield and the second shield.
本発明の伝送線路の製造装置は、伝送線路導体と前記伝送線路導体の入力端および出力端にそれぞれ近接するグランド導体とからなる第１導体が所定ピッチで熱可塑性樹脂からなるシート状の第１基材における第１主面に形成されるとともに前記第１導体のうち少なくとも前記伝送線路導体が所定ピッチで複数形成されたベースを供給するベース供給機と、各前記伝送線路導体を覆うシート状のカバーレイを供給するカバーレイ供給機と、第２導体が熱可塑性樹脂からなるシート状の第２基材における第２主面に形成された第１シールドを供給する第１シールド供給機と、第３導体が熱可塑性樹脂からなるシート状の第３基材に形成された第２シールドを供給する第２シールド供給機と、前記第１基材における第１主面に前記カバーレイを熱圧着する第１熱圧着機と、前記カバーレイが熱圧着された第１中間体に対し、前記伝送線路導体と前記伝送線路導体との間の不要領域を除去して前記第１中間体を厚み方向に貫通する貫通穴を複数形成する構成の不要領域除去機と、前記貫通穴が複数形成された第２中間体に対し、前記第１基材における第１主面の反対側の面に前記第１シールドにおける第２導体面を熱圧着する構成であり、且つ、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を熱圧着する構成である第２熱圧着機と、前記第１シールドの第２導体面が熱圧着された状態であるとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面が熱圧着された状態で、前記第２導体面に前記第３導体面を超音波接合する構成の第１接合機とを備え、複数の前記伝送線路導体を各々シールドした薄型構造とすることを特徴とする。 The transmission line manufacturing apparatus of the present invention is a sheet-shaped first in which a first conductor composed of a transmission line conductor and a ground conductor adjacent to the input end and the output end of the transmission line conductor is made of a thermoplastic resin at a predetermined pitch. A base feeder for supplying a base formed on the first main surface of the substrate and at least a plurality of the transmission line conductors at a predetermined pitch among the first conductors; and a sheet-like covering the transmission line conductors A coverlay supply machine for supplying a coverlay, a first shield supply machine for supplying a first shield formed on a second main surface of a sheet-like second base material made of a thermoplastic resin as a second conductor, 3 conductor and the second shield and the second shield feeder supplies formed in the third substrate sheet formed of a thermoplastic resin, heat the coverlay to the first major surface of said first substrate Thickness and first thermocompression bonding device to wear, with respect to the first intermediate the coverlay is thermocompression said first intermediate to remove unnecessary area between the transmission line conductor and the transmission line conductor The unnecessary region removing machine configured to form a plurality of through holes penetrating in the direction and the second intermediate body formed with a plurality of the through holes on the surface opposite to the first main surface of the first base material The second conductor surface of the first shield is thermocompression-bonded , and the third conductor surface of the second shield is thermocompression-bonded to the surface of the coverlay opposite to the adhesive surface with the first base material. a second thermocompression bonding device is configured, with the second conductor surface of the first shield is in the state of being thermo-compression bonding, the on the opposite side of the bonding surface between the first substrate of the coverlay first in a state in which the third conductive surface of the second shield is thermocompression said third electrically to said second conductor surface And a first bonding machine arrangement for ultrasonic bonding surfaces, characterized in that with each shielded thin structure a plurality of the transmission line conductors.
この構成によれば、第１熱圧着機、打ち抜き機、第２熱圧着機、及び第１接合機が連係動作して、ベース及びカバーレイを挟んで対向配置された第１シールドの第２導体と第２シールドの第３導体とを貫通穴を通して超音波接合する。よって、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路またはその中間体を一貫した製造ラインで製造できる。そして、接着剤や導電ペーストを用いずに、第１シールドの第２導体と第２シールドの第３導体とを超音波接合するので、生産時間（タクトタイム）を導電ペーストや接着剤の熱硬化時間よりも短くすることができ、短時間で生産できる。 According to this structure, the 1st thermocompression bonding machine, the punching machine, the 2nd thermocompression bonding machine, and the 1st joining machine operate | move in cooperation, and the 2nd conductor of the 1st shield arrange | positioned across the base and coverlay And the third conductor of the second shield are ultrasonically bonded through the through hole. Therefore, it is possible to manufacture a thin transmission line or an intermediate body thereof, which is shielded over the entire circumference to reduce crosstalk, or an intermediate thereof. Since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or conductive paste, the production time (tact time) can be set by thermosetting the conductive paste or adhesive. It can be made shorter than the time and can be produced in a short time.
本発明の伝送線路によれば、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路が実現できる。また、本発明の伝送線路の製造方法並びに伝送線路の製造装置によれば、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路またはその中間体を一貫した製造ラインで製造できる。 According to the transmission line of the present invention, it is possible to realize a thin transmission line that is shielded over the entire circumference to reduce crosstalk. Moreover, according to the transmission line manufacturing method and the transmission line manufacturing apparatus of the present invention, a thin transmission line that is shielded over the entire circumference to reduce crosstalk or an intermediate body thereof can be manufactured on a consistent manufacturing line.
（第１の実施形態）
以下、図面を参照して、本発明の実施形態について詳しく説明する。図１は本実施形態の伝送線路の製造装置１の例を模式的に示す構成図であり、図中の左側が上流側であり、図中の右側が下流側である。伝送線路の製造装置１は、上流側から順に、第１熱圧着機２、不要領域除去機３、第２熱圧着機４、第１接合機５、第２接合機６、レーザ加工機７、検査機８、分割取出し機９、移載機１７が配設されており、そして、これらを制御するコントローラ１０を備える。なお、実施形態を説明するための全図において、同一の機能を有する部材には同一の符号を付し、その繰り返しの説明は省略する場合がある。
(First embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a configuration diagram schematically showing an example of a transmission line manufacturing apparatus 1 of the present embodiment, in which the left side in the figure is the upstream side and the right side in the figure is the downstream side. The transmission line manufacturing apparatus 1 includes, in order from the upstream side, a first thermocompression bonding machine 2, an unnecessary area removal machine 3, a second thermocompression bonding machine 4, a first bonding machine 5, a second bonding machine 6, a laser processing machine 7, An inspection machine 8, a division take-out machine 9, and a transfer machine 17 are arranged, and a controller 10 is provided for controlling these. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof may be omitted.
第１熱圧着機２の上流側には、ベース供給機１１およびテンション調節機１５と、カバーレイ供給機１２およびテンション調節機１５とがそれぞれ配設されている。第２熱圧着機４の上流側には、第１シールド供給機１３とテンション調節機１５、および、第２シールド供給機１４とテンション調節機１５が配設されている。ここで、テンション調節機１５は一例としてテンションローラを有し、当該テンションローラの位置によってシート状のワーク（ベース３０、カバーレイ３５、第１中間体５１、第１シールド４０、第２シールド４５）の張力を一定範囲内に保っている。 On the upstream side of the first thermocompression bonding machine 2, a base feeder 11 and a tension adjuster 15, and a cover lay feeder 12 and a tension adjuster 15 are arranged, respectively. A first shield supplier 13 and a tension adjuster 15, and a second shield supplier 14 and a tension adjuster 15 are disposed on the upstream side of the second thermocompression bonding machine 4. Here, the tension adjuster 15 has a tension roller as an example, and a sheet-like work (base 30, cover lay 35, first intermediate 51, first shield 40, second shield 45) depending on the position of the tension roller. The tension is kept within a certain range.
そして、第２熱圧着機４の上流側にはピッチ送り機１６が配設されており、また、検査機８の上流側にはピッチ送り機１６が配設されている。ピッチ送り機１６は一例として送りローラを有し、前記送りローラの送り量によってシート状のワーク（第１中間体５２、第６中間体５６）の送りピッチを一定値に保っている。 A pitch feeder 16 is disposed upstream of the second thermocompression bonding machine 4, and a pitch feeder 16 is disposed upstream of the inspection machine 8. The pitch feeder 16 has a feed roller as an example, and the feed pitch of the sheet-like workpieces (the first intermediate body 52 and the sixth intermediate body 56) is kept at a constant value by the feed amount of the feed roller.
図８Ａは第１熱圧着機２を模式的に示す図である。第１熱圧着機２は一例としてヒータが内蔵されたプレス板を有し、対向配置された２つの前記プレス板によって、ベース３０およびカバーレイ３５を上下方向から挟んで加圧するとともに加熱して第１中間体５１を形成する構成である。 FIG. 8A is a diagram schematically showing the first thermocompression bonding machine 2. The first thermocompression bonding machine 2 has, for example, a press plate with a built-in heater, and presses and heats the base 30 and the coverlay 35 sandwiched from above and below by the two press plates arranged opposite to each other. It is the structure which forms the 1 intermediate body 51. FIG.
図８Ｂは不要領域除去機３を模式的に示す図である。不要領域除去機３は一例として打ち抜き刃および打ち抜き刃を受ける受台を有し、前記打ち抜き刃によって第１中間体５１の不要領域Ｒ１を打ち抜くことで当該不要領域Ｒ１を除去して第１中間体５１を貫通する貫通穴Ｕ１を形成し、第２中間体５２を形成する構成である。上記以外の構成として、不要領域除去機３は、レーザ照射によって不要領域Ｒ１を除去するレーザ加工機を適用可能である。 FIG. 8B is a diagram schematically showing the unnecessary area removing machine 3. The unnecessary area removing machine 3 has, as an example, a punching blade and a receiving base for receiving the punching blade, and the unnecessary area R1 of the first intermediate body 51 is punched out by the punching blade to remove the unnecessary area R1 and the first intermediate body. In this configuration, a through hole U1 penetrating 51 is formed, and a second intermediate 52 is formed. As a configuration other than the above, the unnecessary area removing machine 3 can be a laser processing machine that removes the unnecessary area R1 by laser irradiation.
図８Ｃは第２熱圧着機４を模式的に示す図である。第２熱圧着機４は一例としてヒータが内蔵されたプレス板を有し、対向配置された２つの前記プレス板によって、第１シールド４０および第２中間体５２を上下方向から挟んで加圧するとともに加熱する構成であり、かつ、ベース３０に第１シールド４０を熱圧着すると同時に、カバーレイ３５に第２シールド４５を熱圧着する構成である。 FIG. 8C is a diagram schematically showing the second thermocompression bonding machine 4. As an example, the second thermocompression bonding machine 4 has a press plate with a built-in heater, and pressurizes the first shield 40 and the second intermediate body 52 by sandwiching the first shield 40 and the second intermediate body 52 from above and below by the two press plates arranged opposite to each other. The first shield 40 is thermocompression-bonded to the base 30 and the second shield 45 is thermocompression-bonded to the cover lay 35 at the same time.
ここで、第１熱圧着機２と第２熱圧着機４とは、同様の装置構成とすることができる。これにより、装置のメンテナンスがし易くなる。 Here, the 1st thermocompression bonding machine 2 and the 2nd thermocompression bonding machine 4 can be set as the same apparatus structure. This facilitates maintenance of the apparatus.
図９Ａは第１接合機５（第１超音波接合機）または第２接合機６（第２超音波接合機）を模式的に示す図である。第１接合機５は一例として振動体が内蔵された本体部と当該本体部に付設されて振動体から伝達された振動で超音波振動するヘッド部（ホーン）と当該ヘッド部を受ける受け部とを有する。第１接合機５（第１超音波接合機）は、対向配置された前記ヘッド部および受け部によって、ベース３０に第１シールド４０が熱圧着されるとともに、カバーレイ３５に第２シールド４５が熱圧着された状態のワークを上下方向から挟んで挟持するとともに前記ヘッド部を超音波振動させて超音波接合によって第４中間体５４を形成する構成である。 FIG. 9A is a diagram schematically showing the first bonding machine 5 (first ultrasonic bonding machine) or the second bonding machine 6 (second ultrasonic bonding machine). As an example, the first bonding machine 5 includes a main body portion with a built-in vibrating body, a head portion (horn) attached to the main body portion and ultrasonically vibrated by vibration transmitted from the vibrating body, and a receiving portion for receiving the head portion. Have In the first bonding machine 5 (first ultrasonic bonding machine), the first shield 40 is thermocompression bonded to the base 30 and the second shield 45 is bonded to the coverlay 35 by the head portion and the receiving portion that are arranged to face each other. The fourth intermediate body 54 is formed by ultrasonic bonding by sandwiching and sandwiching a workpiece in a thermocompression-bonded state from above and below and ultrasonically vibrating the head portion.
若しくは、第１接合機５（第１超音波接合機）は、対向配置された前記ヘッド部および受け部によって、ベース３０に第１シールド４０が熱圧着された第３中間体５３に第２シールド４５が重なった状態のワークを上下方向から挟んで挟持するとともに前記ヘッド部を超音波振動させて超音波接合によって第４中間体５４を形成する構成である。 Alternatively, in the first bonding machine 5 (first ultrasonic bonding machine), the second shield is applied to the third intermediate body 53 in which the first shield 40 is thermocompression bonded to the base 30 by the head part and the receiving part that are arranged to face each other. The fourth intermediate body 54 is formed by ultrasonic bonding by sandwiching and holding the workpiece in a state where 45 is overlapped from above and below, and ultrasonically vibrating the head portion.
ここで、第４中間体５４は、伝送線路２０となる前段階の半製品であって、全周に亘ってシールドする構造となっている状態の半製品を指している。 Here, the fourth intermediate body 54 is a semi-finished product of the previous stage that becomes the transmission line 20, and indicates a semi-finished product in a state of being shielded over the entire circumference.
第２接合機６（第２超音波接合機）は一例として振動体が内蔵された本体部と当該本体部に付設されて振動体から伝達された振動で超音波振動するヘッド部（ホーン）と当該ヘッド部を受ける受け部とを有し、対向配置された前記ヘッド部および受け部によって、第４中間体５４を上下方向から挟んで挟持するとともに前記ヘッド部を超音波振動させて超音波接合によって第５中間体５５を形成する構成である。ここで、第１接合機５と第２接合機６とは、同様の装置構成とすることができる。これにより、装置のメンテナンスがし易くなる。または、超音波振動するヘッド部を対向配置して第１接合機５と第２接合機６の両方の機能を兼ねた構成とする場合もある。 The second bonding machine 6 (second ultrasonic bonding machine) includes, as an example, a main body portion in which a vibrating body is built in, and a head portion (horn) that is attached to the main body portion and ultrasonically vibrates with vibration transmitted from the vibrating body. The fourth intermediate body 54 is sandwiched from above and below by the head portion and the receiving portion disposed opposite to each other, and the head portion is ultrasonically vibrated to perform ultrasonic bonding. Thus, the fifth intermediate body 55 is formed. Here, the 1st joining machine 5 and the 2nd joining machine 6 can be set as the same apparatus structure. This facilitates maintenance of the apparatus. Or the head part which ultrasonically vibrates may be opposingly arranged, and it may be set as the structure which served as both the function of the 1st joining machine 5 and the 2nd joining machine 6. FIG.
図９Ｂはレーザ加工機７を模式的に示す図である。レーザ加工機７は、レーザ照射によって所定領域を除去して第３導体４６を一部露出させて第６中間体５６を形成する構成である。 FIG. 9B schematically shows the laser processing machine 7. The laser processing machine 7 is configured to form a sixth intermediate 56 by removing a predetermined region by laser irradiation and partially exposing the third conductor 46.
図９Ｃは検査機８を模式的に示す図である。検査機８は、所定間隔で下向きに突出した接触ピンを伝送線路導体３２に接触させて通電することで伝送線路導体３２が断線していないか導通レベルが正常範囲内であるか否かを検査する構成である。上記以外の構成として、検査機８は、カメラによって伝送線路導体３２の画像を撮像し画像解析することで伝送線路導体３２が断線していないか導通レベルが正常範囲内であるか否かを検査する構成とする場合があり、または、検査機８は、伝送線路導体３２を通電することによる電気特性検査と、伝送線路導体３２を撮像し画像解析することによる外観特性検査との両方を行う構成とする場合がある。 FIG. 9C is a diagram schematically illustrating the inspection machine 8. The inspection device 8 inspects whether or not the transmission line conductor 32 is disconnected or the conduction level is within a normal range by contacting the transmission line conductor 32 with a contact pin protruding downward at a predetermined interval and energizing it. It is the structure to do. As a configuration other than the above, the inspection machine 8 inspects whether the transmission line conductor 32 is disconnected or the conduction level is within a normal range by capturing an image of the transmission line conductor 32 with a camera and analyzing the image. Or the inspection machine 8 performs both an electrical characteristic inspection by energizing the transmission line conductor 32 and an appearance characteristic inspection by imaging the transmission line conductor 32 and analyzing the image. It may be.
図１に示すように、検査機８の下流側には第６中間体５６から伝送線路２０を取り出す分割取出し機９が配設されている。分割取出し機９は一例として打ち抜き刃および打ち抜き刃を受ける受台を有し、前記打ち抜き刃によって、インライン検査された第６中間体５６を所定のカットラインに沿って打ち抜くことで伝送線路２０を分離して、伝送線路２０を取り出す構成である。上記以外の構成として、分割取出し機９は、インライン検査された第６中間体５６を所定のカットラインに沿ってスクライブして伝送線路２０を分離して、伝送線路２０を取り出す構成とする場合があり、または、分割取出し機９は、インライン検査された第６中間体５６を所定のカットラインに沿ってレーザ照射して伝送線路２０を分離して、伝送線路２０を取り出す構成とする場合がある。 As shown in FIG. 1, a division take-out machine 9 for taking out the transmission line 20 from the sixth intermediate body 56 is disposed on the downstream side of the inspection machine 8. The division unloader 9 has, as an example, a punching blade and a receiving base for receiving the punching blade, and the transmission line 20 is separated by punching the sixth intermediate body 56 in-line tested along a predetermined cut line by the punching blade. Thus, the transmission line 20 is taken out. As a configuration other than the above, the split take-out machine 9 may be configured to scribe the sixth intermediate body 56 that has been subjected to in-line inspection along a predetermined cut line to separate the transmission line 20 and take out the transmission line 20. Yes, or the split take-out machine 9 may be configured to take out the transmission line 20 by irradiating the sixth intermediate body 56 subjected to in-line inspection with a laser along a predetermined cut line to separate the transmission line 20. .
そして、分割取出し機９の下流側には伝送線路２０を収納するトレイ１８が配置されている。上述の一貫した製造ラインで製造されインライン検査された伝送線路２０は、移載機１７によって、一例として、真空吸着された状態で搬送されてトレイ１８に収納される。 A tray 18 for storing the transmission line 20 is disposed on the downstream side of the division take-out machine 9. The transmission line 20 manufactured in the above-described consistent manufacturing line and inline-inspected is, for example, conveyed in a vacuum-sucked state by the transfer machine 17 and stored in the tray 18.
本実施形態によれば、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路２０を一つの製造ラインで一貫して製造できる。そして、接着剤や導電ペーストを用いずに、熱圧着や超音波接合を行って伝送線路２０を製造するので、生産時間（タクトタイム）を導電ペーストや接着剤の熱硬化時間よりも短くすることができ、必要な構成部材も最小限に抑えられる。 According to the present embodiment, the thin transmission line 20 that is shielded over the entire circumference to reduce crosstalk can be manufactured consistently on a single manufacturing line. And since the transmission line 20 is manufactured by performing thermocompression bonding or ultrasonic bonding without using an adhesive or conductive paste, the production time (tact time) should be shorter than the heat curing time of the conductive paste or adhesive. And the necessary components are minimized.
上述のとおり、第２熱圧着機４は、ベース３０に第１シールド４０を熱圧着するとともに、第２シールド４５を熱圧着する構成である。この構成によれば、第１シールド４０と第２シールド４５とを一括して同時に熱圧着するので、熱圧着の際に、第１シールド４０や第２シールド４５に皺が出来るのを防止できる。 As described above, the second thermocompression bonding machine 4 has a configuration in which the first shield 40 is thermocompression bonded to the base 30 and the second shield 45 is thermocompression bonded. According to this configuration, since the first shield 40 and the second shield 45 are simultaneously thermocompression bonded, it is possible to prevent the first shield 40 and the second shield 45 from being wrinkled during thermocompression bonding.
上記の製造装置は一例である。伝送線路の製造装置１は上記実施形態に限定されない。上記以外の構成として、例えば接合機５の下流側の製造設備や検査機器等を省く場合がある。この場合、全周に亘ってシールドする構造の第４中間体５４の状態で、伝送線路の製造装置１での製造が完了する。そして、リール状態、短冊状態、個装状態等で搬送容器やトレイに収納されるなどして、第４中間体５４として出荷される、または第４中間体５４が別の製造ラインにて後加工される、或いは第４中間体５４が電子機器の組立ラインで組み立て加工されて、伝送線路２０となる。 The above manufacturing apparatus is an example. The transmission line manufacturing apparatus 1 is not limited to the above embodiment. As a configuration other than the above, for example, a manufacturing facility or an inspection device on the downstream side of the bonding machine 5 may be omitted. In this case, the production in the transmission line production apparatus 1 is completed in the state of the fourth intermediate body 54 having a structure in which the entire circumference is shielded. And it is shipped as a fourth intermediate body 54 by being stored in a transport container or a tray in a reel state, a strip state, an individual packaging state, or the like, or the fourth intermediate body 54 is post-processed on another production line. Alternatively, the fourth intermediate body 54 is assembled and processed on the assembly line of the electronic device to become the transmission line 20.
上記以外の構成として、例えば第２超音波接合機６に代えてはんだ接合機を配置し、はんだ接合機に対向配置されたヘッド部および受け部によって、第４中間体５４を上下方向から挟んで挟持するとともにヘッド部からはんだを供給し加熱する等して、はんだ接合によって第５中間体５５を形成する構成とする場合がある。または、第２超音波接合機６に代えて接着接合機を配置し、接着剤や導電ペーストを用いた接合によって第５中間体５５を形成する構成とする場合がある。 As a configuration other than the above, for example, a solder bonding machine is arranged instead of the second ultrasonic bonding machine 6, and the fourth intermediate body 54 is sandwiched from above and below by the head part and the receiving part arranged opposite to the solder bonding machine. In some cases, the fifth intermediate body 55 is formed by soldering by sandwiching and supplying solder from the head portion and heating. Alternatively, an adhesive bonding machine may be arranged instead of the second ultrasonic bonding machine 6 and the fifth intermediate 55 may be formed by bonding using an adhesive or a conductive paste.
また、上記以外の構成として、例えばレーザ加工機７に代えてエッチング加工機を配置し、エッチングによって所定領域を除去して第３導体４６を一部露出させて第６中間体５６を形成する構成とする場合がある。 As a configuration other than the above, for example, an etching processing machine is arranged instead of the laser processing machine 7, a predetermined region is removed by etching, and the third conductor 46 is partially exposed to form the sixth intermediate body 56. It may be.
続いて、本発明に係る伝送線路の製造装置１の他の例について、以下に説明する。 Next, another example of the transmission line manufacturing apparatus 1 according to the present invention will be described below.
図１０は上記実施形態の伝送線路の製造装置１の他の例の配置構成を模式的に示す構成図である。図１０の例では、第２熱圧着機４の上流側に、第１シールド供給機１３およびテンション調節機１５が配設されている。また、第１接合機５の上流側に、第２シールド供給機１４およびテンション調節機１５が配設されている。この構成の場合は、第２熱圧着機４によって、ベース３０に第１シールド４０が熱圧着されて第３中間体５３となる。そして、第１接合機５によって、第３中間体５３に第２シールド４５が重なった状態のワークに第２シールド４５が超音波溶着されて第４中間体５４となる。 FIG. 10 is a configuration diagram schematically showing another example of the arrangement configuration of the transmission line manufacturing apparatus 1 of the embodiment. In the example of FIG. 10, a first shield feeder 13 and a tension adjuster 15 are disposed on the upstream side of the second thermocompression bonding machine 4. In addition, a second shield feeder 14 and a tension adjuster 15 are disposed on the upstream side of the first bonding machine 5. In the case of this configuration, the first shield 40 is thermocompression bonded to the base 30 by the second thermocompression bonding machine 4 to form the third intermediate body 53. Then, the second shield 45 is ultrasonically welded to the work in a state in which the second shield 45 is overlapped with the third intermediate body 53 by the first bonding machine 5 to become the fourth intermediate body 54.
この構成によれば、例えば、第１シールド４０のサイズや熱容量が第２シールド４５のサイズや熱容量よりも大きい場合に、ベース３０に第１シールド４０を熱圧着することが容易かつ確実となり、また、ベース３０に第２シールド４５を超音波溶着することが容易かつ確実となる。 According to this configuration, for example, when the size and heat capacity of the first shield 40 are larger than the size and heat capacity of the second shield 45, it becomes easy and reliable to thermocompression-bond the first shield 40 to the base 30. It becomes easy and reliable to ultrasonically weld the second shield 45 to the base 30.
伝送線路２０のサイズや材質等の規格や構成部品のサイズや材質等の規格に応じて図１の構成や図１０の構成を選択することができ、また、図１や図２の構成の製造設備や検査機器等を適宜追加したり省いたりすることが可能である。 The configuration shown in FIG. 1 or the configuration shown in FIG. 10 can be selected according to the standard such as the size and material of the transmission line 20 and the standard such as the size and material of the component, and the manufacturing of the configuration shown in FIG. It is possible to add or omit equipment and inspection equipment as appropriate.
続いて、本発明に係る伝送線路２０及び伝送線路２０の製造方法について、以下に説明する。 Next, the transmission line 20 and the method for manufacturing the transmission line 20 according to the present invention will be described below.
図１１は、伝送線路２０の製造手順を示すフローチャート図である。伝送線路２０は一例として、第１熱圧着ステップＳ１、不要領域除去ステップＳ２、第２熱圧着ステップＳ３、第１接合ステップＳ４、第２接合ステップＳ５、レーザ加工ステップＳ６、検査ステップＳ７、分割ステップＳ８の順に製造される。 FIG. 11 is a flowchart showing the manufacturing procedure of the transmission line 20. As an example, the transmission line 20 includes a first thermocompression bonding step S1, an unnecessary region removal step S2, a second thermocompression bonding step S3, a first joining step S4, a second joining step S5, a laser processing step S6, an inspection step S7, and a dividing step. Manufactured in the order of S8.
上記の製造手順は一例である。伝送線路２０の製造手順は、上記以外の構成として、第１接合ステップＳ４と第２接合ステップＳ５とを同時に行うことが可能であり、第２接合ステップＳ５を省くことが可能である。また、上記以外に、レーザ加工ステップＳ６を省くことが可能であり、検査ステップＳ７を省くことが可能であり、分割ステップＳ８を省くことが可能である。そして、第４中間体５４、第５中間体５５、第６中間体５６、または伝送線路２０を、一つのシートに長手方向の所定ピッチで複数配された状態で出荷し、次工程の電子機器の組立ラインにてシートを分割し、伝送線路２０を取り出して使用する場合がある。 The above manufacturing procedure is an example. The manufacturing procedure of the transmission line 20 can be performed simultaneously with the first joining step S4 and the second joining step S5 as a configuration other than the above, and the second joining step S5 can be omitted. In addition to the above, the laser processing step S6 can be omitted, the inspection step S7 can be omitted, and the division step S8 can be omitted. Then, the fourth intermediate body 54, the fifth intermediate body 55, the sixth intermediate body 56, or the transmission line 20 are shipped in a state in which a plurality of the fourth intermediate body 54, the fifth intermediate body 55, and the transmission line 20 are arranged at a predetermined pitch in the longitudinal direction. In some cases, the sheet is divided in the assembly line and the transmission line 20 is taken out and used.
図２Ａはベース３０を示す概略の平面図であり、図２Ｂは第１中間体５１を示す概略の平面図であり、図２Ｃは第２中間体５２を示す概略の平面図である。また、図３Ａは第４中間体５４を示す概略の平面図であり、図３Ｂは第６中間体５６を示す概略の平面図である。そして、図４Ａは伝送線路２０を示す概略の平面図であり、図４Ｂは伝送線路２０を示す概略の側面図である。 2A is a schematic plan view showing the base 30, FIG. 2B is a schematic plan view showing the first intermediate body 51, and FIG. 2C is a schematic plan view showing the second intermediate body 52. FIG. 3A is a schematic plan view showing the fourth intermediate body 54, and FIG. 3B is a schematic plan view showing the sixth intermediate body 56. 4A is a schematic plan view showing the transmission line 20, and FIG. 4B is a schematic side view showing the transmission line 20.
図５Ａはベース３０を伝送線路導体３２の位置にて示す概略の断面図であり、同様に、図５Ｂは第１中間体５１を示す概略の断面図であり、図５Ｃは第２中間体５２を示す概略の断面図である。また、図６Ａは第４中間体５４を示す概略の断面図であり、そして、図６Ｂは伝送線路２０を伝送線路導体３２の位置にて示す概略の断面図である。 5A is a schematic sectional view showing the base 30 at the position of the transmission line conductor 32. Similarly, FIG. 5B is a schematic sectional view showing the first intermediate body 51, and FIG. FIG. FIG. 6A is a schematic cross-sectional view showing the fourth intermediate body 54, and FIG. 6B is a schematic cross-sectional view showing the transmission line 20 at the position of the transmission line conductor 32.
図２Ａと図５Ａとに示すように、ベース３０は銅張積層板（ＣＣＬ）からなり、伝送線路導体３２が長手方向の所定ピッチＰ１でシート状の第１基材３４の第１主面３４ａに形成されている。第１導体３１は、直線状に形成された伝送線路導体３２と、伝送線路導体３２の入力端と出力端とにそれぞれ近接し、入力端や出力端に近接する側が「Ｕ字状」または「コ字状」に形成されたグランド導体３３とからなる。一例として、グランド導体３３および伝送線路導体３２の入力端および出力端に、一例として、はんだや導電ペーストを介してコネクタが接合される（不図示）。上記以外の構成として、第１導体３１が、伝送線路導体３２の入力端と出力端とにそれぞれ一対一で近接し、「Ｕ字状」または「コ字状」に形成された複数のグランド導体３３とからなる場合がある。 As shown in FIGS. 2A and 5A, the base 30 is made of a copper clad laminate (CCL), and the transmission line conductors 32 have a first main surface 34a of the sheet-like first base material 34 at a predetermined pitch P1 in the longitudinal direction. Is formed. The first conductor 31 is adjacent to the transmission line conductor 32 formed in a straight line, the input end and the output end of the transmission line conductor 32, and the side close to the input end or the output end is “U-shaped” or “ The ground conductor 33 is formed in a “U” shape. As an example, a connector is joined to the input end and output end of the ground conductor 33 and the transmission line conductor 32 by way of solder or conductive paste as an example (not shown). As a configuration other than the above, the first conductor 31 is close to the input end and the output end of the transmission line conductor 32 on a one-to-one basis, and a plurality of ground conductors formed in a “U-shape” or “U-shape”. 33.
ベース３０は、シート状の第１基材３４に、伝送線路導体３２が長手方向の所定ピッチで複数配されており、図２Ａの状態では、伝送線路導体３２と伝送線路導体３２との間に不要領域Ｒ１がある。 In the base 30, a plurality of transmission line conductors 32 are arranged at a predetermined pitch in the longitudinal direction on a sheet-like first base material 34, and in the state of FIG. 2A, between the transmission line conductor 32 and the transmission line conductor 32. There is an unnecessary area R1.
第１導体３１は一例として、銅箔からなる。第１基材３４は一例として、熱可塑性樹脂からなる。第１基材３４は一例として、液晶ポリマー（ＬＣＰ）、ポリイミド（ＰＩ）、ポリアミド（ＰＡ）、またはポリエーテルエーテルケトン（ＰＥＥＫ）からなる。シート状のベース３０は一例として、リール状態でベース供給機１１に取り付けられて、連続加工可能に供給される。 The 1st conductor 31 consists of copper foil as an example. As an example, the first base material 34 is made of a thermoplastic resin. As an example, the first substrate 34 is made of liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyether ether ketone (PEEK). As an example, the sheet-like base 30 is attached to the base feeder 11 in a reel state and is supplied so as to be continuously processed.
第１導体３１は一例として、厚みが５[μｍ]以上かつ２５[μｍ]以下の銅箔である。第１基材３４は一例として、厚みが５０[μｍ]以上かつ１５０[μｍ]以下の液晶ポリマー（ＬＣＰ）である。第１導体３１は一例として、銅張積層板（ＣＣＬ）をパターンエッチングして形成される。 As an example, the first conductor 31 is a copper foil having a thickness of 5 [μm] to 25 [μm]. As an example, the first base material 34 is a liquid crystal polymer (LCP) having a thickness of 50 [μm] or more and 150 [μm] or less. For example, the first conductor 31 is formed by pattern-etching a copper-clad laminate (CCL).
ベース３０は一例として、第１熱圧着ステップＳ１の前処理として、プラズマ照射装置によって、第１導体３１が貼り合わさった側の面（第１主面３４ａ）に酸素含有プラズマを照射して、有機物を除去するとともに、改質する。酸素含有プラズマを照射することで、第１熱圧着の際、密着度が向上する。上記以外に、第１熱圧着機２の上流側にプラズマ照射装置を配設して、第１主面３４ａに酸素含有プラズマを照射する場合がある（不図示）。 As an example, the base 30 irradiates the surface containing the first conductor 31 (first main surface 34a) with an oxygen-containing plasma as a pretreatment of the first thermocompression bonding step S1 by using a plasma irradiation device. Is removed and reformed. Irradiation with the oxygen-containing plasma improves the degree of adhesion during the first thermocompression bonding. In addition to the above, there may be a case where a plasma irradiation device is disposed upstream of the first thermocompression bonding machine 2 and the first main surface 34a is irradiated with oxygen-containing plasma (not shown).
カバーレイ３５は一例として、熱可塑性樹脂からなる。カバーレイ３５は一例として、液晶ポリマー（ＬＣＰ）、ポリイミド（ＰＩ）、ポリアミド（ＰＡ）、またはポリエーテルエーテルケトン（ＰＥＥＫ）からなる。一例として、カバーレイ３５は、リール状態でカバーレイ供給機１２に取り付けられて、連続加工可能に供給される。 As an example, the coverlay 35 is made of a thermoplastic resin. As an example, the coverlay 35 is made of liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyether ether ketone (PEEK). As an example, the cover lay 35 is attached to the cover lay feeder 12 in a reel state and is supplied so as to be continuously processed.
カバーレイ３５は一例として、厚みが２５[μｍ]以上かつ１２５[μｍ]以下の液晶ポリマー（ＬＣＰ）である。 For example, the coverlay 35 is a liquid crystal polymer (LCP) having a thickness of 25 [μm] or more and 125 [μm] or less.
第１シールド４０は一例として銅張積層板（ＣＣＬ）からなり、第２導体４１がシート状の第２基材４２の第２主面４２ａに形成されている。第２導体４１は、第２基材４２の全面に貼り合わされている場合、若しくはメッシュ状で貼り合わされている場合がある。 The 1st shield 40 consists of a copper clad laminated board (CCL) as an example, and the 2nd conductor 41 is formed in the 2nd main surface 42a of the sheet-like 2nd base material 42. As shown in FIG. The second conductor 41 may be bonded to the entire surface of the second base material 42 or may be bonded in a mesh shape.
第２導体４１は一例として、銅箔からなる。第２基材４２は一例として、熱可塑性樹脂からなる。第２基材４２は一例として、液晶ポリマー（ＬＣＰ）、ポリイミド（ＰＩ）、ポリアミド（ＰＡ）、またはポリエーテルエーテルケトン（ＰＥＥＫ）からなる。第１シールド４０は一例として、リール状態で第１シールド供給機１３に取り付けられて、連続加工可能に供給される。 The 2nd conductor 41 consists of copper foil as an example. The 2nd base material 42 consists of thermoplastic resins as an example. As an example, the second substrate 42 is made of liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyether ether ketone (PEEK). As an example, the first shield 40 is attached to the first shield feeder 13 in a reel state and is supplied so as to be continuously processed.
第２導体４１は一例として、厚みが５[μｍ]以上かつ２５[μｍ]以下の銅箔である。第２基材４２は一例として、厚みが５[μｍ]以上かつ２５[μｍ]以下のポリイミド（ＰＩ）である。第１シールド４０は一例として、銅張積層板（ＣＣＬ）がそのままの状態で用いられる。 For example, the second conductor 41 is a copper foil having a thickness of 5 [μm] to 25 [μm]. As an example, the second base material 42 is polyimide (PI) having a thickness of 5 [μm] to 25 [μm]. As an example, the first shield 40 is used with a copper clad laminate (CCL) as it is.
第１シールド４０は一例として、第２熱圧着ステップＳ３の前処理として、プラズマ照射装置によって、第２導体４１が貼り合わされている側の面（第２主面４２ａ）に酸素含有プラズマを照射して、有機物を除去するとともに、改質する。酸素含有プラズマを照射することで、第２熱圧着の際、密着度が向上する。上記以外に、第２熱圧着機４の上流側にプラズマ照射装置を配設して、第２主面４２ａに酸素含有プラズマを照射する場合がある（不図示）。 As an example, as a pretreatment of the second thermocompression bonding step S3, the first shield 40 irradiates the surface containing the second conductor 41 (second main surface 42a) with oxygen-containing plasma by a plasma irradiation apparatus. In addition, the organic substances are removed and modified. Irradiation with the oxygen-containing plasma improves the degree of adhesion during the second thermocompression bonding. In addition to the above, a plasma irradiation device may be disposed upstream of the second thermocompression bonding machine 4 to irradiate the second main surface 42a with oxygen-containing plasma (not shown).
第２シールド４５は一例として、銅張積層板（ＣＣＬ）からなり、第３導体４６がシート状の第３基材４７の片面に形成されている。第３導体４６は、第３基材４７の全面に貼り合わされている場合、若しくはメッシュ状で貼り合わされている場合がある。 The 2nd shield 45 consists of a copper clad laminated board (CCL) as an example, and the 3rd conductor 46 is formed in the single side | surface of the sheet-like 3rd base material 47. FIG. The third conductor 46 may be bonded to the entire surface of the third base material 47 or may be bonded in a mesh shape.
第３導体４６は一例として、銅箔からなる。第３基材４７は一例として、熱可塑性樹脂からなる。第３基材４７は一例として、液晶ポリマー（ＬＣＰ）、ポリイミド（ＰＩ）、ポリアミド（ＰＡ）、またはポリエーテルエーテルケトン（ＰＥＥＫ）からなる。第２シールド４５は一例として、リール状態で第２シールド供給機１４に取り付けられて、連続加工可能に供給される。 As an example, the third conductor 46 is made of copper foil. The 3rd base material 47 consists of thermoplastic resins as an example. As an example, the third base material 47 is made of liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyether ether ketone (PEEK). As an example, the second shield 45 is attached to the second shield feeder 14 in a reel state and is supplied so as to be continuously processed.
第３導体４６は一例として、厚みが５[μｍ]以上かつ２５[μｍ]以下の銅箔である。第３基材４７は一例として、厚みが５[μｍ]以上かつ２５[μｍ]以下のポリイミド（ＰＩ）である。第２シールド４５は一例として、銅張積層板（ＣＣＬ）がそのままの状態で用いられる。第２シールド４５は一例として、第１シールド４０と同一材料構成である。 As an example, the third conductor 46 is a copper foil having a thickness of 5 [μm] to 25 [μm]. As an example, the third base material 47 is polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the second shield 45 is a copper clad laminate (CCL) as it is. As an example, the second shield 45 has the same material configuration as that of the first shield 40.
第２シールド４５は一例として、第１接合ステップＳ４の前処理として、プラズマ照射装置によって、第３導体４６が貼り合わされている側の面に酸素含有プラズマを照射して、有機物を除去するとともに、改質する。酸素含有プラズマを照射することで、第１接合ステップＳ４における、密着度が向上する。上記以外に、第１接合機５の上流側にプラズマ照射装置を配設して、第３導体４６が貼り合わさった側の面に酸素含有プラズマを照射する場合がある（不図示）。 As an example, as a pretreatment of the first bonding step S4, the second shield 45 is irradiated with oxygen-containing plasma on the surface on which the third conductor 46 is bonded by a plasma irradiation apparatus to remove organic substances, Reform. By irradiating the oxygen-containing plasma, the adhesion degree in the first bonding step S4 is improved. In addition to the above, there may be a case where a plasma irradiation device is disposed on the upstream side of the first bonding machine 5 and the surface on which the third conductor 46 is bonded is irradiated with oxygen-containing plasma (not shown).
第１熱圧着ステップＳ１は、図２Ｂと図５Ｂとに示すように、第１基材３４の第１主面３４ａにカバーレイ３５を熱圧着する。一例として、第１基材３４とカバーレイ３５を同種材料として、第１基材３４及びカバーレイ３５の融点以下の加熱温度であり、かつ、荷重たわみ温度または荷重たわみ温度を中心としてプラスマイナス５０[℃]以内の加熱温度で、所定圧力で所定時間加圧しながら加熱して熱圧着し、第１中間体５１とする。 In the first thermocompression bonding step S1, as shown in FIGS. 2B and 5B, the cover lay 35 is thermocompression bonded to the first main surface 34a of the first base material 34. As an example, the first base material 34 and the cover lay 35 are made of the same material, the heating temperature is equal to or lower than the melting point of the first base material 34 and the cover lay 35, and the load deflection temperature or the load deflection temperature is plus or minus 50. A first intermediate 51 is obtained by heating and thermocompression bonding while applying pressure at a predetermined pressure for a predetermined time at a heating temperature within [° C.].
第１熱圧着ステップＳ１は一例として、１８０[℃]以上で２８０[℃]以下の加熱温度、１０[ＭＰａ]以上で６０[ＭＰａ]以下の加圧力、５[秒]以上で２４０[秒]以下の加熱・加圧時間で熱圧着する。熱圧着は一例として、大気中で行う。 The first thermocompression bonding step S1 is, for example, a heating temperature of 180 [° C.] or higher and 280 [° C. or lower, a pressure of 10 [MPa] or higher and 60 [MPa] or lower, 5 [seconds] or higher and 240 [seconds]. Thermocompression bonding is performed with the following heating and pressurization time. Thermocompression bonding is performed in the atmosphere as an example.
不要領域除去ステップＳ２は、図２Ｃと図５Ｃとに示すように、第１中間体５１に対し、伝送線路導体３２と伝送線路導体３２との間の不要領域Ｒ１を打ち抜くことで除去して第１中間体５１を貫通する貫通穴Ｕ１を形成し、第２中間体５２とする。貫通穴Ｕ１は一例として、長方形状、または角丸の長方形状であり、長手方向に所定間隔Ｐ２で形成される。所定間隔Ｐ２は２．５[ｍｍ]以下が好ましい。これにより、クロストークの低減効果が高くなる。一例として、貫通穴Ｕ１の長さは伝送線路導体３２の全長に対して０．２倍以上かつ１．０倍未満に設定される。 The unnecessary region removing step S2 is performed by removing the unnecessary region R1 between the transmission line conductor 32 and the transmission line conductor 32 by punching the first intermediate body 51 as shown in FIGS. 2C and 5C. A through hole U <b> 1 penetrating the first intermediate body 51 is formed as a second intermediate body 52. As an example, the through holes U1 have a rectangular shape or a rounded rectangular shape, and are formed at a predetermined interval P2 in the longitudinal direction. The predetermined interval P2 is preferably 2.5 [mm] or less. Thereby, the reduction effect of crosstalk becomes high. As an example, the length of the through hole U <b> 1 is set to be 0.2 times or more and less than 1.0 times the total length of the transmission line conductor 32.
伝送線路導体３２の全長が５００[ｍｍ]超の場合、一例として、所定間隔Ｐ２は１．５[ｍｍ]以上に設定される。これにより、第２導体４１と第３導体４６との接合が容易となる。伝送線路導体３２の全長が５００[ｍｍ]以下の場合、一例として、所定間隔Ｐ２は０．５[ｍｍ]未満に設定される。これにより、クロストークの低減効果がより高くなる。一例として、所定間隔Ｐ２は０．０[ｍｍ]に設定される。これにより、クロストークの低減効果が最も高くなる。 When the total length of the transmission line conductor 32 exceeds 500 [mm], for example, the predetermined interval P2 is set to 1.5 [mm] or more. Thereby, joining of the 2nd conductor 41 and the 3rd conductor 46 becomes easy. When the total length of the transmission line conductor 32 is 500 [mm] or less, for example, the predetermined interval P2 is set to be less than 0.5 [mm]. Thereby, the reduction effect of crosstalk becomes higher. As an example, the predetermined interval P2 is set to 0.0 [mm]. Thereby, the effect of reducing crosstalk is the highest.
第２熱圧着ステップＳ３は、図３Ａと図６Ａとに示すように、第２中間体５２に対し、ベース３０における第１主面３４ａと反対側の面に、第１シールド４０の第２主面４２ａの側を熱圧着する、それと同時に、ベース３０における第１主面３４ａに第２シールド４６を熱圧着する。一例として、第１基材３４と第２基材４２とを異種材料として、第２基材４２と第３基材４７とを同一材料として、第１基材３４の融点以下の加熱温度であり、かつ、第１基材３４の荷重たわみ温度または第１基材３４の荷重たわみ温度を中心としてプラスマイナス５０[℃]以内の加熱温度で、所定圧力で所定時間加圧しながら加熱して熱圧着する。 As shown in FIG. 3A and FIG. 6A, the second thermocompression bonding step S3 is performed on the surface of the base 30 opposite to the first main surface 34a with respect to the second intermediate body 52. At the same time, the second shield 46 is thermocompression bonded to the first main surface 34a of the base 30. As an example, the first base material 34 and the second base material 42 are made of different materials, the second base material 42 and the third base material 47 are made of the same material, and the heating temperature is equal to or lower than the melting point of the first base material 34. Further, thermocompression bonding is performed by applying pressure at a predetermined pressure for a predetermined time at a heating temperature within plus or minus 50 [° C.] centering on the deflection temperature under load of the first substrate 34 or the deflection temperature under load of the first substrate 34. To do.
若しくは、第２熱圧着ステップＳ３は、第２中間体５２に対し、ベース３０における第１主面３４ａの反対側の面に、第１シールド４０の第２主面４２ａの側を熱圧着する。一例として、第１基材３４と第２基材４２を異種材料として、第１基材３４の融点以下の加熱温度であり、かつ、第１基材３４の荷重たわみ温度または第１基材３４の荷重たわみ温度を中心としてプラスマイナス５０[℃]以内の加熱温度で、所定圧力で所定時間加圧しながら加熱して熱圧着する。 Alternatively, in the second thermocompression bonding step S3, the second main surface 42a side of the first shield 40 is thermocompression bonded to the second intermediate body 52 on the surface of the base 30 opposite to the first main surface 34a. As an example, the first base material 34 and the second base material 42 are different materials, the heating temperature is equal to or lower than the melting point of the first base material 34, and the deflection temperature under load of the first base material 34 or the first base material 34. Heating and thermocompression bonding are performed while heating at a predetermined pressure for a predetermined time at a heating temperature within plus or minus 50 [° C.] centering on the deflection temperature under load.
第２熱圧着ステップＳ３は一例として、１８０[℃]以上で２８０[℃]以下の加熱温度、１０[ＭＰａ]以上で６０[ＭＰａ]以下の加圧力、５[秒]以上で２４０[秒]以下の加熱・加圧時間で熱圧着する。熱圧着は一例として、大気中で行う。 The second thermocompression bonding step S3 is, for example, a heating temperature of 180 [° C.] or higher and 280 [° C.] or lower, a pressure of 10 [MPa] or higher and 60 [MPa] or lower, 5 [seconds] or higher and 240 [seconds]. Thermocompression bonding is performed with the following heating and pressurization time. Thermocompression bonding is performed in the atmosphere as an example.
第２熱圧着ステップＳ３に続いて、第１接合ステップＳ４は、第２導体４１の露出面に第３導体４６の露出面を超音波接合する。一例として、第２導体４１と第３導体４６を同一材料として、ホーンの押圧力が５００[Ｎ]以上かつ２５００[Ｎ]以下の押圧力で押圧しながら、周波数が１５[ｋＨｚ]以上かつ２００[ｋＨｚ]以下の超音波振動を加えることで超音波接合し、第４中間体５４とする。 Subsequent to the second thermocompression bonding step S3, the first joining step S4 ultrasonically joins the exposed surface of the third conductor 46 to the exposed surface of the second conductor 41. As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency is 15 [kHz] or more and 200 while the pressing force of the horn is 500 [N] or more and 2500 [N] or less. Ultrasonic bonding is performed by applying ultrasonic vibration of [kHz] or less to obtain a fourth intermediate 54.
上述のように、一貫した製造ラインで製造された第４中間体５４は、全周に亘ってシールドする構造の第４中間体５４として出荷される、または第４中間体５４が別の製造ラインにて後加工される、或いは第４中間体５４が電子機器の組立ラインで組み立て加工されて、伝送線路２０となる。 As described above, the fourth intermediate body 54 manufactured in a consistent manufacturing line is shipped as the fourth intermediate body 54 having a structure that shields the entire circumference, or the fourth intermediate body 54 is supplied to another manufacturing line. Or the fourth intermediate body 54 is assembled and processed in the assembly line of the electronic device to become the transmission line 20.
図１１の例では、第１接合ステップＳ４に引き続いて第２接合ステップＳ５を行う。第２接合ステップＳ５は、第４中間体５４に対し、グランド導体３３の端部に第３導体４６の端部を超音波接合する。ここで、グランド導体３３の端部は、伝送線路導体３２の側の各々の端部である。また、第３導体４６の端部は、両方の端部である。一例として、第２導体４１と第３導体４６を同一材料として、ホーンの押圧力が５００[Ｎ]以上かつ２５００[Ｎ]以下の押圧力で押圧しながら、周波数が１５[ｋＨｚ]以上かつ２００[ｋＨｚ]以下の超音波振動を加えることで超音波接合し、第５中間体５５とする。 In the example of FIG. 11, the second joining step S5 is performed subsequent to the first joining step S4. In the second joining step S <b> 5, the end portion of the third conductor 46 is ultrasonically joined to the end portion of the ground conductor 33 with respect to the fourth intermediate body 54. Here, the end portion of the ground conductor 33 is each end portion on the transmission line conductor 32 side. Moreover, the edge part of the 3rd conductor 46 is both edge parts. As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency is 15 [kHz] or more and 200 while the pressing force of the horn is 500 [N] or more and 2500 [N] or less. Ultrasonic bonding is performed by applying ultrasonic vibration of [kHz] or less to obtain a fifth intermediate 55.
図１１の例では、第２接合ステップＳ５に引き続いてレーザ加工ステップＳ６を行う。レーザ加工ステップＳ６は、図３Ｂに示すように、第５中間体５５に対し、第３導体４６におけるグランド導体３３との接合面の反対側の面を、レーザ照射にて一部露出させて所定間隔で窓部Ｖ１を形成し、第６中間体５６とする。窓部Ｖ１は一例として、四角形状または角丸四角形状であり、所定間隔で複数形成される。レーザ照射は、所定出力で所定時間照射する。レーザ照射は、既知の設備と既知の工法が適用可能である。なお、レーザ加工ステップＳ６は、省く場合がある。 In the example of FIG. 11, the laser processing step S6 is performed following the second joining step S5. In the laser processing step S6, as shown in FIG. 3B, a part of the surface of the third conductor 46 opposite to the joint surface with the ground conductor 33 is partially exposed by laser irradiation, as shown in FIG. The window portions V <b> 1 are formed at intervals to form a sixth intermediate body 56. As an example, the window portion V1 has a quadrangular shape or a rounded quadrangular shape, and a plurality of window portions V1 are formed at predetermined intervals. Laser irradiation is performed at a predetermined output for a predetermined time. For the laser irradiation, known facilities and known methods can be applied. Note that the laser processing step S6 may be omitted.
図１１の例では、レーザ加工ステップＳ６に引き続いて検査ステップＳ７を行う。検査ステップＳ７は、第６中間体５６に対し、検査機８の接触ピンを伝送線路導体３２に接触させて通電することで伝送線路導体３２が断線していないこと、及び導通レベルが正常範囲内であることを検査する。導通検査は、既知の設備と既知の工法が適用可能である。なお、検査ステップＳ７は、ここでは行わず、別の製造ラインで行う場合がある。 In the example of FIG. 11, the inspection step S7 is performed following the laser processing step S6. In the inspection step S7, the transmission line conductor 32 is not disconnected by energizing the sixth intermediate body 56 by bringing the contact pin of the inspection machine 8 into contact with the transmission line conductor 32, and the conduction level is within the normal range. Check that it is. For the continuity test, a known facility and a known method can be applied. Note that the inspection step S7 may not be performed here, but may be performed in another production line.
図１１の例では、検査ステップＳ７に引き続いて分割ステップＳ８を行う。分割ステップＳ８は、分割取出し機９の打ち抜き刃によって、インライン検査された第６中間体５６を所定のカットラインに沿って打ち抜くことで、伝送線路２０を分離して取り出す。分割取出しは、既知の設備と既知の工法が適用可能である。なお、分割ステップＳ８は、ここでは行わず、別の製造ラインで行う場合がある。 In the example of FIG. 11, a division step S8 is performed subsequent to the inspection step S7. In the dividing step S8, the transmission line 20 is separated and taken out by punching the sixth intermediate body 56 in-line-inspected along a predetermined cut line by the punching blade of the split take-out machine 9. A known equipment and a known construction method can be applied to the divided extraction. Note that the division step S8 is not performed here, and may be performed in another production line.
そして、上述のように、一貫した製造ラインで製造されてインライン検査された伝送線路２０は、移載機１７によって、一例として、真空吸着された状態で搬送されてトレイ１８に収納される。 Then, as described above, the transmission line 20 manufactured on a consistent manufacturing line and inline-inspected is, for example, conveyed in a vacuum-sucked state by the transfer machine 17 and stored in the tray 18.
一例として、図４Ａと図６Ｂは伝送線路導体３２が２つ平行して配設されている二芯構造の伝送線路２０である。上記以外の構成として、図７Ａに示すように、伝送線路導体３２が３つそれぞれ平行して配設されている三芯構造の伝送線路２０とする場合がある。或いは、図７Ｂに示すように、伝送線路導体３２が４つ以上それぞれ平行して配設されている多芯構造の伝送線路２０とする場合がある。 As an example, FIGS. 4A and 6B show a transmission line 20 having a two-core structure in which two transmission line conductors 32 are arranged in parallel. As a configuration other than the above, as shown in FIG. 7A, a transmission line 20 having a three-core structure in which three transmission line conductors 32 are arranged in parallel may be used. Alternatively, as shown in FIG. 7B, a transmission line 20 having a multi-core structure in which four or more transmission line conductors 32 are arranged in parallel may be used.
本実施形態によれば、ベース３０、カバーレイ３５、第１シールド４０、及び第２シールド４５を所定ピッチＰ１で送ることで、第１熱圧着ステップＳ１、不要領域除去ステップＳ２、第２熱圧着ステップＳ３、および、第１接合ステップＳ４を経て、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路２０を一貫したラインで製造できる。そして、接着剤や導電ペーストを用いずに、第１シールド４０の第２導体と第２シールドの第３導体とを超音波接合するので、生産時間（タクトタイム）を導電ペーストや接着剤の熱硬化時間よりも短くすることができ、必要な構成部材も最小限に抑えられる。 According to the present embodiment, the base 30, the cover lay 35, the first shield 40, and the second shield 45 are sent at a predetermined pitch P1, so that the first thermocompression bonding step S1, the unnecessary region removal step S2, and the second thermocompression bonding. Through the step S3 and the first joining step S4, the thin transmission line 20 that is shielded over the entire circumference to reduce crosstalk can be manufactured with a consistent line. Since the second conductor of the first shield 40 and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the production time (tact time) is reduced by the heat of the conductive paste or the adhesive. It can be shorter than the curing time, and the necessary components are minimized.
また、この構成によれば、第２導体４１と第３導体４６とが超音波接合された状態で、伝送線路導体３２の入力端および出力端に近接配置されたグランド導体３３を同時に第３導体４６に超音波接合することができる。そして、第１シールド４０と第２シールド４５とが一体構造体となっているので、グランド導体３３を同時に第３導体４６に超音波接合する際の皺の発生や応力歪みを防止できる。そして、この構成によれば、第３導体４６は第２シールド４５と一体構造体となっているので、第３導体４６におけるグランド導体３３との接合面の反対側の面をレーザにて一部露出させる窓部Ｖ１を所定間隔で形成することが容易にできる。 In addition, according to this configuration, the ground conductor 33 disposed close to the input end and the output end of the transmission line conductor 32 is simultaneously connected to the third conductor with the second conductor 41 and the third conductor 46 being ultrasonically bonded. 46 can be ultrasonically bonded. And since the 1st shield 40 and the 2nd shield 45 are an integral structure, generation | occurrence | production of the wrinkles and stress distortion at the time of carrying out the ultrasonic bonding of the ground conductor 33 to the 3rd conductor 46 simultaneously can be prevented. According to this configuration, since the third conductor 46 is integrated with the second shield 45, a part of the surface of the third conductor 46 opposite to the joint surface with the ground conductor 33 is partially irradiated with a laser. It is possible to easily form the window portions V1 to be exposed at a predetermined interval.
上述した実施形態の伝送線路の製造装置１並びに伝送線路の製造方法によって、シールド性能に優れるとともに伝送線路間のクロストークを低減した薄型で、省スペースに対応した構造の伝送線路２０が製造できる。 According to the transmission line manufacturing apparatus 1 and the transmission line manufacturing method of the above-described embodiment, a thin transmission line 20 having excellent shielding performance and reduced crosstalk between transmission lines and having a structure corresponding to space saving can be manufactured.
本実施形態の伝送線路２０は、伝送線路導体３２と伝送線路導体３２の入力端および出力端にそれぞれ近接するグランド導体３３とからなる第１導体３１がシート状で熱可塑性樹脂からなる第１基材３４の第１主面３４ａに形成されるとともに第１導体３１のうち少なくとも伝送線路導体３２が所定ピッチＰ１で複数形成されたベース３０と、各伝送線路導体３２を覆うシート状で熱可塑性樹脂からなるカバーレイ３５と、第２導体４１がシート状で熱可塑性樹脂からなる第２基材４２の第２主面４２ａに形成された第１シールド４０と、第３導体４６がシート状で熱可塑性樹脂からなる第３基材４７に形成された第２シールド４５と、を備え、第１基材３４における第１主面３４ａとカバーレイ３５、ベース３０における第１主面３４ａの反対側の面と第１シールド４０の第２主面４２ａの側、ベース３０における第１主面３４ａの反対側の面と第１シールド４０の第２主面４２ａの側、及びカバーレイ３５と第２シールド４５の第２主面４２ａの側とは互いに熱圧着されており、且つ、対向配置された第２導体４１と第３導体４６とは互いに超音波接合されており、第２導体４１と第３導体４６とで伝送線路導体３２を各々囲むように配設されている。 In the transmission line 20 of the present embodiment, the first conductor 31 composed of the transmission line conductor 32 and the ground conductor 33 adjacent to the input end and the output end of the transmission line conductor 32 is a sheet-like first base made of a thermoplastic resin. A base 30 formed on the first main surface 34a of the material 34 and at least a plurality of transmission line conductors 32 of the first conductor 31 formed at a predetermined pitch P1, and a sheet-like thermoplastic resin covering each transmission line conductor 32 A first shield 40 formed on the second main surface 42a of the second base material 42 made of a thermoplastic resin, and a third conductor 46 made of a sheet-like heat. A second shield 45 formed on a third base material 47 made of a plastic resin, and includes a first main surface 34a and a cover lay 35 in the first base material 34, and a first main surface 34a in the base 30. The opposite surface and the second main surface 42a side of the first shield 40, the surface of the base 30 opposite to the first main surface 34a, the second main surface 42a side of the first shield 40, and the coverlay 35 The second shield 45 is thermocompression bonded to the second main surface 42 a side, and the second conductor 41 and the third conductor 46 that are arranged opposite to each other are ultrasonically bonded to each other. And the third conductor 46 so as to surround the transmission line conductor 32.
図４Ａ，図４Ｂ及び図６Ｂに示すように、本実施形態によれば、ベース３０及びカバーレイ３５を挟んで対向配置された第１シールド４０の第２導体４１と第２シールド４５の第３導体４６とが超音波接合された状態で伝送線路導体３２を囲むように、全周に亘ってシールドしてクロストークを低減した薄型の伝送線路２０となる。そして、接着剤や導電ペーストを用いずに、第１シールド４０の第２導体４１と第２シールド４５の第３導体４６とが超音波接合されるので、少なくとも接着剤や導電ペーストの厚みの分薄型構造にできる。また、従来技術の、伝送線路間にビアを打ってクロストーク低減を図る方法に比べて、製造コストを大幅に削減できる。 As shown in FIGS. 4A, 4B, and 6B, according to the present embodiment, the second conductor 41 of the first shield 40 and the third of the second shield 45 that are arranged to face each other with the base 30 and the coverlay 35 interposed therebetween. The thin transmission line 20 is reduced in crosstalk by shielding the entire circumference so as to surround the transmission line conductor 32 in a state where the conductor 46 is ultrasonically bonded. Since the second conductor 41 of the first shield 40 and the third conductor 46 of the second shield 45 are ultrasonically bonded without using an adhesive or a conductive paste, at least the thickness of the adhesive or the conductive paste is used. Can be made thin. Further, the manufacturing cost can be greatly reduced as compared with the conventional method of reducing the crosstalk by placing vias between the transmission lines.
一例として、グランド導体３３の端部と第３導体４６の端部とは互いに超音波接合されている。この構成によれば、伝送線路導体３２の入力端および出力端へのシールド効果によって外来ノイズが防止できる。 As an example, the end portion of the ground conductor 33 and the end portion of the third conductor 46 are ultrasonically bonded to each other. According to this configuration, external noise can be prevented by the shielding effect to the input end and output end of the transmission line conductor 32.
また、第３基材４７に所定間隔で複数の窓部Ｖ１が形成されており、窓部Ｖ１によって第３導体４６の一部が外部接続可能に露出している。この構成によれば、一例として、窓部Ｖ１によって露出している第３導体４６の一部を携帯情報端末の筐体やグランド配線と外部接続してシールド性能を高めることが容易な構成となる。 A plurality of window portions V1 are formed at predetermined intervals on the third base material 47, and a part of the third conductor 46 is exposed by the window portions V1 so as to be externally connectable. According to this configuration, as an example, a part of the third conductor 46 exposed by the window portion V1 is externally connected to the casing of the portable information terminal or the ground wiring, so that it is easy to improve the shielding performance. .
図６Ｂに示すように、長手方向の両側に切断面が形成されている。この構成によれば、長手方向の両側が切断されることで幅寸法が一定となる。 As shown in FIG. 6B, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, the width dimension is constant by cutting both sides in the longitudinal direction.
以上、本発明は、上述した実施の形態に限定されるものではない。上述の例では、シート状のベース３０をリール状態で供給する構成としたが、これに限定されず、所定サイズの枚葉状でマガジンに積み重ねて、前記マガジンから供給ローラ等によって製造ラインに供給することも可能である。カバーレイ３５、第１シールド４０、第２シールド４５についても同様に、所定サイズの枚葉状でマガジンに積み重ねて、前記マガジンから供給ローラ等によって製造ラインに供給することも可能である。 As described above, the present invention is not limited to the embodiment described above. In the above-described example, the sheet-like base 30 is supplied in a reel state. However, the present invention is not limited to this. The sheet-like base 30 is stacked in a magazine in a sheet size of a predetermined size and is supplied from the magazine to the production line by a supply roller or the like. It is also possible. Similarly, the cover lay 35, the first shield 40, and the second shield 45 can be stacked in a magazine in a sheet shape of a predetermined size and supplied from the magazine to the production line by a supply roller or the like.
１ 伝送線路の製造装置
２ 第１熱圧着機
３ 不要領域除去機
４ 第２熱圧着機
５ 接合機（第１超音波接合機）
６ 接合機（第２超音波接合機）
７ レーザ加工機
８ 検査機
９ 分割取出し機
１０ コントローラ
１１ ベース供給機
１２ カバーレイ供給機
１３ 第１シールド供給機
１４ 第２シールド供給機
１５ テンション調節機
１６ ピッチ送り機
１７ 移載機
１８ トレイ
２０ 伝送線路
３０ ベース
３１ 第１導体
３２ 伝送線路導体
３３ グランド導体
３４ 第１基材
３４ａ 第１主面
３５ カバーレイ
４０ 第１シールド
４１ 第２導体
４２ 第２基材
４２ａ 第２主面
４５ 第２シールド
４６ 第３導体
４７ 第３基材
５１ 第１中間体
５２ 第２中間体
５３ 第３中間体
５４ 第４中間体
５５ 第５中間体
５６ 第６中間体
Ｐ１ ピッチ
Ｒ１ 不要領域
Ｕ１ 貫通穴
Ｖ１ 窓部
DESCRIPTION OF SYMBOLS 1 Transmission line manufacturing apparatus 2 1st thermocompression bonding machine 3 Unnecessary area removal machine 4 2nd thermocompression bonding machine 5 Bonding machine (1st ultrasonic bonding machine)
6 Bonding machine (2nd ultrasonic bonding machine)
7 Laser processing machine 8 Inspection machine 9 Split take-out machine 10 Controller 11 Base supply machine 12 Coverlay supply machine 13 First shield supply machine 14 Second shield supply machine 15 Tension adjuster 16 Pitch feeder 17 Transfer machine 18 Tray 20 Transmission Line 30 Base 31 First conductor 32 Transmission line conductor 33 Ground conductor 34 First base material 34a First main surface 35 Coverlay 40 First shield 41 Second conductor 42 Second base material 42a Second main surface 45 Second shield 46 3rd conductor 47 3rd base material 51 1st intermediate body 52 2nd intermediate body 53 3rd intermediate body 54 4th intermediate body 55 5th intermediate body 56 6th intermediate body P1 Pitch R1 Unnecessary area | region U1 Through-hole V1 Window part
Claims (9)
前記第１基材における第１主面に前記カバーレイを接着した構成であり、前記第１基材の第１主面の反対側の面に前記第１シールドの第２導体面を接着した構成であり、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を接着した構成であり、前記第２導体面に前記第３導体面を接合した構成であり、且つ、前記第２導体と前記第３導体とで前記伝送線路導体を各々囲むように配設した構成によって、複数の前記伝送線路導体を各々シールドした薄型構造となっているとともに、
前記第３基材に所定間隔で複数の窓部が各々形成されており、前記窓部を形成したことで前記第３導体における前記カバーレイの反対側の面の一部が外部接続可能に露出していること
を特徴とする伝送線路。 A first conductor composed of a transmission line conductor and ground conductors close to the input end and the output end of the transmission line conductor is formed on the first main surface of the sheet-like first base material made of thermoplastic resin, and A base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch among the first conductors, a sheet-like cover lay made of a thermoplastic resin that covers each of the transmission line conductors, and a sheet made of a thermoplastic resin as the second conductor A first shield formed on the second main surface of the second base material having a shape, and a second shield formed on a sheet-like third base material made of a thermoplastic resin as a third conductor,
A configuration in which the coverlay is bonded to a first main surface of the first base material, and a second conductor surface of the first shield is bonded to a surface opposite to the first main surface of the first base material. And the third conductor surface of the second shield is bonded to the surface of the coverlay opposite to the bonding surface with the first base material, and the third conductor surface is attached to the second conductor surface. A thin structure in which a plurality of the transmission line conductors are shielded by a configuration in which the transmission line conductors are disposed so as to surround each of the second conductors and the third conductors. With
A plurality of window portions are respectively formed at predetermined intervals on the third base material, and by forming the window portions, a part of the surface on the opposite side of the cover lay in the third conductor is exposed to be externally connectable. transmission line characterized in that it.
を特徴とする請求項１記載の伝送線路。 The transmission line according to claim 1, wherein cut surfaces are formed on both sides in the longitudinal direction.
を特徴とする請求項１または２記載の伝送線路。 The transmission line according to claim 1 or 2, wherein an end of the third conductor is joined to an end of the ground conductor.
前記第１基材の第１主面に前記カバーレイを熱圧着する第１熱圧着ステップと、
前記カバーレイが熱圧着された第１中間体に対し、前記伝送線路導体と前記伝送線路導体との間の不要領域を除去して前記第１中間体を厚み方向に貫通する貫通穴を複数形成する不要領域除去ステップと、
前記貫通穴が複数形成された第２中間体に対し、前記第１基材における第１主面の反対側の面に前記第１シールドの第２導体面を熱圧着するとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を熱圧着する第２熱圧着ステップと、
前記第１シールドの第２導体面が熱圧着された状態であるとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面が熱圧着された状態で、前記第２導体面に前記第３導体面を超音波接合する第１接合ステップとを有すること
を特徴とする伝送線路の製造方法。 A first conductor composed of a transmission line conductor and ground conductors close to the input end and the output end of the transmission line conductor is formed on the first main surface of the sheet-like first base material made of thermoplastic resin, and A base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch among the first conductors, a sheet-like cover lay covering each of the transmission line conductors, and a sheet-like second base in which the second conductor is made of a thermoplastic resin. A plurality of transmission line conductors each using a first shield formed on a second main surface of the material and a second shield formed on a sheet-like third base material made of a thermoplastic resin as a third conductor. To make a shielded thin structure,
A first thermocompression bonding step for thermocompression bonding the coverlay to the first main surface of the first substrate;
A plurality of through-holes penetrating the first intermediate body in the thickness direction by removing unnecessary regions between the transmission line conductor and the transmission line conductor are formed on the first intermediate body on which the coverlay is thermocompression bonded. An unnecessary area removing step,
The second conductor surface of the first shield is thermocompression-bonded to the surface opposite to the first main surface of the first base material with respect to the second intermediate body in which the plurality of through holes are formed. A second thermocompression bonding step, wherein the third conductor surface of the second shield is thermocompression bonded to the surface opposite to the adhesive surface with the first substrate;
The second conductor surface of the first shield is in a thermocompression-bonded state, and the third conductor surface of the second shield is thermocompression-bonded to the surface of the coverlay opposite to the adhesive surface with the first base material. And a first joining step for ultrasonically joining the third conductor surface to the second conductor surface.
を特徴とする請求項４記載の伝送線路の製造方法。 In a state where the third conductor surface is ultrasonically bonded to the second conductor surface, a second bonding step of ultrasonically bonding the end portion of the third conductor to the end portion of the ground conductor is provided. The manufacturing method of the transmission line of Claim 4 .
を特徴とする請求項４または５記載の伝送線路の製造方法。 In the state in which the end portion of the third conductor is ultrasonically bonded to the end portion of the ground conductor, a plurality of window portions are respectively formed at predetermined intervals on the third base material by laser irradiation. method for producing a transmission line according to claim 4 or 5, wherein it has a laser processing step of partially externally connectable exposed opposite to the surface of the coverlay.
前記第１基材における第１主面に前記カバーレイを熱圧着する第１熱圧着機と、
前記カバーレイが熱圧着された第１中間体に対し、前記伝送線路導体と前記伝送線路導体との間の不要領域を除去して前記第１中間体を厚み方向に貫通する貫通穴を複数形成する構成の不要領域除去機と、
前記貫通穴が複数形成された第２中間体に対し、前記第１基材における第１主面の反対側の面に前記第１シールドにおける第２導体面を熱圧着する構成であり、且つ、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面を熱圧着する構成である第２熱圧着機と、
前記第１シールドの第２導体面が熱圧着された状態であるとともに、前記カバーレイの前記第１基材との接着面の反対側の面に前記第２シールドの第３導体面が熱圧着された状態で、前記第２導体面に前記第３導体面を超音波接合する構成の第１接合機とを備え、複数の前記伝送線路導体を各々シールドした薄型構造とすること
を特徴とする伝送線路の製造装置。 A first conductor composed of a transmission line conductor and a ground conductor adjacent to the input end and the output end of the transmission line conductor is formed on the first main surface of the sheet-like first base material made of thermoplastic resin at a predetermined pitch. And a base feeder for supplying a base in which a plurality of the transmission line conductors are formed at a predetermined pitch among the first conductors, and a coverlay supplier for supplying a sheet-like coverlay covering each of the transmission line conductors A first shield feeder for supplying a first shield formed on the second main surface of the sheet-like second base material in which the second conductor is made of a thermoplastic resin, and a sheet-like shape in which the third conductor is made of a thermoplastic resin. A second shield feeder for supplying a second shield formed on the third base material of
A first thermocompression bonding machine for thermocompression bonding the coverlay to the first main surface of the first substrate;
A plurality of through-holes penetrating the first intermediate body in the thickness direction by removing unnecessary regions between the transmission line conductor and the transmission line conductor are formed on the first intermediate body on which the coverlay is thermocompression bonded. An unnecessary area removing machine configured to
The second intermediate body in which a plurality of the through holes are formed is configured to thermocompression-bond the second conductor surface of the first shield to the surface opposite to the first main surface of the first base material, and A second thermocompression bonding machine configured to thermocompression-bond the third conductor surface of the second shield to a surface opposite to the adhesive surface of the coverlay with the first base material;
The second conductor surface of the first shield is in a thermocompression-bonded state, and the third conductor surface of the second shield is thermocompression-bonded to the surface of the coverlay opposite to the adhesive surface with the first base material. And a first bonding machine configured to ultrasonically bond the third conductor surface to the second conductor surface, and having a thin structure in which a plurality of the transmission line conductors are shielded from each other. Transmission line manufacturing equipment.
を特徴とする請求項７記載の伝送線路の製造装置。 A second bonding machine for ultrasonically bonding the end portion of the third conductor to the end portion of the ground conductor in a state where the third conductor surface is ultrasonically bonded to the second conductor surface. The transmission line manufacturing apparatus according to claim 7 .
を特徴とする請求項７または８記載の伝送線路の製造装置。 In the state in which the end portion of the third conductor is ultrasonically bonded to the end portion of the ground conductor, a plurality of window portions are respectively formed at predetermined intervals on the third base material by laser irradiation. apparatus for producing a transmission line according to claim 7 or 8, characterized in that it comprises a laser cutting machine to expose a part of the opposite surface of the coverlay to be externally connected.
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| JP2019029386A JP6611293B1 (en) | 2019-02-21 | 2019-02-21 | Transmission line, transmission line manufacturing method, and transmission line manufacturing apparatus |
| PCT/JP2019/019210 WO2020008729A1 (en) | 2018-07-06 | 2019-05-15 | Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus |
| CN201980022963.2A CN111971850B (en) | 2018-07-06 | 2019-05-15 | Transmission line, method for manufacturing transmission line, and device for manufacturing transmission line |
| KR1020207027590A KR102369036B1 (en) | 2018-07-06 | 2019-05-15 | Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus |
| TW108119199A TWI748191B (en) | 2018-07-06 | 2019-06-03 | Transmission line, transmission line manufacturing method, and transmission line manufacturing device |
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| WO2024009856A1 (en) * | 2022-07-04 | 2024-01-11 | 天竜精機株式会社 | Transmission line, and method for manufacturing transmission line |
| JP2024006773A (en) * | 2022-07-04 | 2024-01-17 | 天竜精機株式会社 | Transmission line and manufacturing method of the transmission line |
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