TWI609164B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- TWI609164B TWI609164B TW105112500A TW105112500A TWI609164B TW I609164 B TWI609164 B TW I609164B TW 105112500 A TW105112500 A TW 105112500A TW 105112500 A TW105112500 A TW 105112500A TW I609164 B TWI609164 B TW I609164B
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本發明係一種散熱裝置，尤其有關於應用於散熱之散熱裝置。 The present invention is a heat sink device, and more particularly relates to a heat sink device for heat dissipation.
隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。所以業界為了有效解決電子設備內的元件散熱問題，便分別提出具有導熱效能較佳的均溫板(Vapor chamber)及熱管(Heat pipe)，以有效解決現階段的散熱問題。 With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem.
均溫板(Vapor chamber)係包括呈矩型狀之殼體及其殼體內部腔室壁面的毛細結構，且該殼體內部填充有工作液體，並該殼體的一側(即蒸發區)係貼設在一發熱元件(如中央處理器、南北橋晶片、電晶體或其他電子元件等)上吸附該發熱元件所產生之熱量，使液態之工作液體於該殼體之蒸發區產生蒸發轉換為汽態，將熱量傳導至該殼體之冷凝區，該汽態之工作液體於冷凝區受冷卻後冷凝為液態，該液態之工作液體再透過重力或毛細結構回流至蒸發區繼續汽液循環，以有效達到均溫散熱之效果。 The Vapor chamber includes a capillary structure in a rectangular shape and a wall surface of the inner chamber of the housing, and the inside of the housing is filled with a working liquid, and one side of the housing (ie, an evaporation zone) Attaching a heat generating component (such as a central processing unit, a north-south bridge chip, a transistor, or other electronic components) to heat generated by the heat generating component, so that the liquid working fluid is evaporated in the evaporation zone of the casing. In the vapor state, heat is transferred to the condensation zone of the casing, and the vaporous working liquid is cooled and condensed into a liquid state in the condensation zone, and the liquid working liquid is again returned to the evaporation zone by gravity or capillary structure to continue the vapor-liquid circulation. In order to effectively achieve the effect of uniform temperature heat dissipation.
熱管(Heat pipe)的原理與理論架構與均溫板相同，主要是在圓管口徑的熱管內之中空部分填入金屬粉末，並透過燒結之方式於該熱管之內壁形成一環狀的毛細結構，其後將該熱管抽真空並填充工作液體，最後封閉以形成熱管結構。當 工作液體由蒸發部受熱蒸發後擴散至該冷凝端，並該工作液體於該蒸發部係為汽態，由該蒸發部離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態，並且再透過毛細結構回流至該蒸發部。 The principle and theoretical structure of the heat pipe are the same as that of the temperature equalizing plate. The hollow part of the heat pipe of the circular pipe is filled with metal powder, and a ring-shaped capillary is formed on the inner wall of the heat pipe by sintering. The structure is followed by evacuating the heat pipe and filling the working liquid, and finally closing to form a heat pipe structure. when The working liquid is evaporated by the evaporation portion and then diffused to the condensation end, and the working liquid is in a vapor state in the evaporation portion. When the evaporation portion is separated and diffused toward the condensation end, the liquid is gradually cooled and condensed into a liquid state, and then re-permeated. The capillary structure is returned to the evaporation portion.
比較均溫板與熱管兩者只有熱傳導的方式不同，均溫板的熱傳導方式是二維的，是面的熱傳導方式用以作為均溫，然而熱管的熱傳導方式是一維的熱傳導方式(即遠端散熱)。故現今的電子元件僅配合單一的熱管或均溫板已不敷使用，因此，如何將熱管與均溫板結合在一起使用使其同時具有均溫及遠端導熱或散熱，以期大幅提升熱傳導之效率，而有效解決高功率電子元件之散熱問題，是目前業者所需改進的。 Comparing the method of heat conduction between the temperature equalization plate and the heat pipe is different. The heat conduction mode of the temperature equalization plate is two-dimensional, and the heat conduction mode of the surface is used as the average temperature. However, the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode (ie, far End cooling). Therefore, today's electronic components are not suitable for use with a single heat pipe or a uniform temperature plate. Therefore, how to combine the heat pipe and the temperature equalizing plate to have both uniform temperature and remote heat conduction or heat dissipation, in order to greatly improve heat conduction. Efficiency, and effectively solve the heat dissipation problem of high-power electronic components, is currently required by the industry.
是以，要如何解決上述習用之問題與缺失，即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此，為有效解決上述之問題，本發明之一目的在於提供一管體支撐於第一、二殼體之間，該第一、二殼體與管體是相通結構，藉以使第一、二殼體與管體相結合間沒有介面熱阻的散熱裝置。 Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a tube body supported between the first and second housings, wherein the first and second housings are in communication with the tube body, thereby enabling the first A heat dissipating device having no interface thermal resistance between the two shells and the tube body.
本發明之另一目的在於提供一種透過該管體內的一管體毛細結構連結該第一、二殼體內的一第一、二毛細結構，使冷卻的工作流體可藉由毛細力及重力回流，藉以達到提升熱傳效率及均溫的效果，進而也有效增加汽液循環效率的散熱裝置。 Another object of the present invention is to provide a first and second capillary structure in the first and second housings through a tubular capillary structure in the tube body, so that the cooled working fluid can be recirculated by capillary force and gravity. In order to achieve the effect of improving heat transfer efficiency and uniform temperature, and thus effectively increasing the efficiency of vapor-liquid circulation.
本發明之另一目的在於提供一種透過組裝第一散熱鰭片組及第二散熱鰭片組使第一、二殼體及管體中的熱能得以迅速傳導至空氣中，藉以達到熱交換散熱效果的散熱裝置。 Another object of the present invention is to provide a heat dissipation heat dissipation effect by rapidly dissipating heat energy in the first and second housings and the tube body to the air by assembling the first heat dissipation fin group and the second heat dissipation fin group. Heat sink.
為達上述目的，本發明係提供一散熱裝置，包含一第一殼體，具有一第一腔室及至少一第一開口，該第一腔室內具有一第一毛細結構，該第一開口連通該第一腔室；一第二殼體，具有一第二腔室及至少一第二開口，該第二腔室內具有一第二毛細結構，該第二開口連通該第二腔室；至少一管體，具有一管身及一第一延伸部及一第二延伸部，該第一延伸部形成有一第一開放端及一第一貫穿口，該第二延伸部形成有一第二開放端及一第二貫穿口，該第一延伸部從該第一開口插接該第一腔室，該第二延伸部從該第二開口插接該第二腔室，並該管身內設有一管體腔室及一管體毛細結構；及一工作流體，設置於前述第一、二腔室及該管體腔室之中；藉此，第一、二殼體及管體相結合間沒有接觸的介面熱阻，可提升熱傳效率及均溫的效果。 In order to achieve the above object, the present invention provides a heat dissipating device, comprising a first housing having a first chamber and at least one first opening, the first chamber having a first capillary structure, the first opening being connected The second chamber has a second chamber and at least one second opening, the second chamber has a second capillary structure, and the second opening communicates with the second chamber; at least one The tube body has a first extending portion and a first extending portion, and a second opening portion is formed with a second open end and a second extending portion a second through hole, the first extending portion is inserted into the first chamber from the first opening, the second extending portion is inserted into the second chamber from the second opening, and a tube is disposed in the tube body a body chamber and a tube capillary structure; and a working fluid disposed in the first and second chambers and the tube chamber; thereby, the interface between the first and second shells and the tube body is not in contact Thermal resistance improves heat transfer efficiency and temperature uniformity.
100‧‧‧第一殼體 100‧‧‧ first housing
101‧‧‧第一開口 101‧‧‧ first opening
103‧‧‧第一底板 103‧‧‧first bottom plate
105‧‧‧第一蓋板 105‧‧‧First cover
110‧‧‧第一腔室 110‧‧‧ first chamber
111‧‧‧第一毛細結構 111‧‧‧First capillary structure
112‧‧‧第一殼體的內壁 112‧‧‧The inner wall of the first casing
113‧‧‧第一凸緣 113‧‧‧First flange
200‧‧‧第二殼體 200‧‧‧ second housing
201‧‧‧第二開口 201‧‧‧ second opening
203‧‧‧第二底板 203‧‧‧second bottom plate
205‧‧‧第二蓋板 205‧‧‧second cover
210‧‧‧第二腔室 210‧‧‧Second chamber
211‧‧‧第二毛細結構 211‧‧‧Second capillary structure
212‧‧‧第二殼體的內壁 212‧‧‧The inner wall of the second casing
213‧‧‧第二凸緣 213‧‧‧second flange
300‧‧‧管體 300‧‧‧ tube body
310‧‧‧管身 310‧‧‧ tube body
311‧‧‧管體腔室 311‧‧‧Body chamber
311a‧‧‧管體的內壁 311a‧‧‧The inner wall of the pipe body
311b‧‧‧凸體 311b‧‧‧ convex
311c‧‧‧凹槽 311c‧‧‧ Groove
312‧‧‧管體毛細結構 312‧‧‧ tube body capillary structure
313‧‧‧柱體 313‧‧‧Cylinder
313a‧‧‧第一頂端 313a‧‧‧ first top
313b‧‧‧第二頂端 313b‧‧‧second top
313c‧‧‧第三毛細結構 313c‧‧‧ third capillary structure
320‧‧‧第一延伸部 320‧‧‧First Extension
322‧‧‧第一開放端 322‧‧‧ first open end
324‧‧‧第一貫穿口 324‧‧‧ first through opening
330‧‧‧第二延伸部 330‧‧‧Second extension
332‧‧‧第二開放端 332‧‧‧ second open end
334‧‧‧第二貫穿口 334‧‧‧Second opening
400‧‧‧工作流體 400‧‧‧Working fluid
500‧‧‧第一發熱元件 500‧‧‧First heating element
600‧‧‧第二發熱元件 600‧‧‧second heating element
700‧‧‧裝設空間 700‧‧‧ installation space
800‧‧‧第一散熱鰭片組 800‧‧‧First heat sink fin set
900‧‧‧第二散熱鰭片組 900‧‧‧Second heat sink fin set
下列圖式之目的在於使本發明能更容易被理解，於本文中會詳加描述該些圖式，並使其構成具體實施例的一部份。透過本文中之具體實施例並參考相對應的圖式，俾以詳細解說本發明之具體實施例，並用以闡述創作之作用原理。 The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are explained in detail by the specific embodiments herein, and reference to the accompanying drawings.
第1圖係為本發明散熱裝置之第一實施例之立體組合圖；第2圖係為本發明散熱裝置之第一實施例之立體分解圖；第2a圖係為本發明散熱裝置之第一實施例之立體分解圖另一視角； 第3圖係為本發明散熱裝置之第一實施例之組合剖面圖；第4圖係為本發明散熱裝置之第一實施例之局部放大剖面圖A；第5圖係為本發明散熱裝置之第一實施例之局部放大剖面圖B；第6圖係為本發明散熱裝置之第二實施例之立體分解圖；第7圖係為本發明散熱裝置之第二實施例之組合剖面圖；第8圖係為本發明散熱裝置之第二實施例之局部放大剖面圖C；第9圖係為本發明散熱裝置之第二實施例之局部放大剖面圖D；第10圖係為本發明散熱裝置之第三實施例之立體組合圖；第11圖係為本發明散熱裝置之第四實施例之立體組合圖；第12圖係為本發明散熱裝置之第五實施例之立體組合圖；第13圖係為本發明散熱裝置之第五實施例之組合剖面圖；第14圖係為本發明散熱裝置之第六實施例之俯視剖面圖；第15圖係為本發明散熱裝置之第六實施例之剖面圖；第16圖係為本發明散熱裝置之第七實施例之俯視剖面圖；第17圖係為本發明散熱裝置之第七實施例之剖面圖。 1 is a perspective assembled view of a first embodiment of a heat sink of the present invention; FIG. 2 is an exploded perspective view of a first embodiment of the heat sink of the present invention; and FIG. 2a is the first heat sink of the present invention Another perspective of the exploded view of the embodiment; 3 is a combined cross-sectional view of a first embodiment of a heat sink of the present invention; FIG. 4 is a partially enlarged cross-sectional view A of the first embodiment of the heat sink of the present invention; and FIG. 5 is a heat sink of the present invention. FIG. 6 is a perspective exploded view of a second embodiment of the heat sink of the present invention; FIG. 7 is a sectional view of the second embodiment of the heat sink of the present invention; 8 is a partial enlarged cross-sectional view C of a second embodiment of the heat sink of the present invention; FIG. 9 is a partially enlarged cross-sectional view D of the second embodiment of the heat sink of the present invention; FIG. 10 is a heat sink of the present invention 3 is a three-dimensional combination diagram of a fourth embodiment of the heat dissipation device of the present invention; and FIG. 12 is a three-dimensional combination diagram of a fifth embodiment of the heat dissipation device of the present invention; Figure 14 is a cross-sectional view showing a fifth embodiment of the heat sink of the present invention; Figure 14 is a plan sectional view showing a sixth embodiment of the heat sink of the present invention; and Figure 15 is a sixth embodiment of the heat sink of the present invention. Sectional view; Figure 16 is the present invention A top cross-sectional view of a seventh embodiment of a heat sink; and a seventeenth embodiment of the heat sink of the present invention.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、2、2a、3、4、5圖，係為本發明均溫板結構之第一實施例之立體組合圖及立體分解圖及立體分解圖另一視角及組合剖面圖及局部放大剖面圖A及 局部放大剖面圖B，如圖所示，本發明所述之散熱裝置，係包含一第一殼體100、一第二殼體200、至少一管體300、一工作流體400；上述該第一、二殼體100、200本實施例係以均溫板作為說明，但並不侷限於此，於具體實施時也可以是其他等效物。 Please refer to the figures 1, 2, 2a, 3, 4 and 5, which are the perspective view, the exploded view and the exploded view of the first embodiment of the temperature equalizing plate structure of the present invention. Zoom in on section A and A partially enlarged cross-sectional view B, as shown in the figure, the heat dissipating device of the present invention comprises a first housing 100, a second housing 200, at least one tube 300, a working fluid 400; The two housings 100 and 200 are described as a temperature equalizing plate. However, the present invention is not limited thereto, and other equivalents may be used in the specific implementation.
該第一殼體100具有一第一腔室110及至少一第一開口101，該第一腔室110係由一第一蓋板105及一第一底板103相互蓋合所界定，並該第一腔室110內具有一第一毛細結構111，該第一毛細結構111係形成於該第一腔室110的一內壁112上，其中該第一毛細結構111較佳為粉末燒結體，但並不侷限於此，於具體實施時也可以選擇為網格體、纖維體、編織體或溝槽或前述之組合。且該第一開口101係設置於該第一殼體100的該第一蓋板105並貫穿連通該第一腔室110，在本實施例中的第一開口101係以一個做說明，但並不侷限於此，於具體實施時，前述第一開口101的數量可為一個或一個以上。 The first housing 100 has a first chamber 110 and at least one first opening 101. The first chamber 110 is defined by a first cover plate 105 and a first bottom plate 103. A first capillary structure 111 is formed in a cavity 110, and the first capillary structure 111 is formed on an inner wall 112 of the first chamber 110. The first capillary structure 111 is preferably a powder sintered body, but It is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or a combination of the foregoing in a specific implementation. The first opening 101 is disposed in the first cover plate 105 of the first housing 100 and penetrates through the first chamber 110. The first opening 101 in this embodiment is illustrated by one, but Not limited to this, in the specific implementation, the number of the foregoing first openings 101 may be one or more.
該第二殼體200具有一第二腔室210及至少一第二開口201，該第二腔室210係由一第二蓋板205及一第二底板203相互蓋合所界定，並該第二腔室210內具有一第二毛細結構211，該第二毛細結構211係形成於該第二腔室210的一內壁212上，其中該第二毛細結構211較佳為粉末燒結體，但並不侷限於此，於具體實施時也可以選擇為網格體、纖維體、編織體或溝槽或前述之組合。且該第二開口201係設置於該第二殼體200的該第二底板203並貫穿連通該第二腔室210，在本實施例中的第二開口201係以一個做說明，但並不侷限於此，於具體實施時，前述第二開口201的數量可為一個或一個以上，並實際數量係配合該第一殼體100的第一開口101的數量。 The second housing 200 has a second chamber 210 and at least one second opening 201. The second chamber 210 is defined by a second cover 205 and a second bottom plate 203. The second capillary structure 211 has a second capillary structure 211 formed on an inner wall 212 of the second chamber 210. The second capillary structure 211 is preferably a powder sintered body, but It is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or a combination of the foregoing in a specific implementation. The second opening 201 is disposed in the second bottom plate 203 of the second housing 200 and penetrates through the second chamber 210. The second opening 201 in this embodiment is described as one, but not To be limited thereto, in the specific implementation, the number of the foregoing second openings 201 may be one or more, and the actual number is matched with the number of the first openings 101 of the first housing 100.
該管體300具有一管身310及一第一延伸部320及一第二延伸部330，該管體300較佳為熱管，但並不侷限於此，於具體實施時也可以是其他等效物。該第一延伸 部320形成有一第一開放端322及一第一貫穿口324，該第一延伸部320從該第一開口101插接該第一腔室110。該第二延伸部330形成有一第二開放端332及一第二貫穿口334，該第二延伸部330從該第二開口201插接該第二腔室210。並該管身310內設有一管體腔室311及一管體毛細結構312，該管體腔室311係設置於該第一、二開放端322、332之間，該管體毛細結構312係形成於該管體腔室311的一內壁311a上。其中該管體毛細結構312較佳為粉末燒結體，但並不侷限於此，於具體實施時也可以選擇為網格體、纖維體、溝槽、編織體或上述的組合。 The tube body 300 has a tube body 310 and a first extension portion 320 and a second extension portion 330. The tube body 300 is preferably a heat pipe, but is not limited thereto, and may be other equivalents in a specific implementation. Things. The first extension The portion 320 is formed with a first open end 322 and a first through opening 324. The first extending portion 320 is inserted into the first chamber 110 from the first opening 101. The second extending portion 330 is formed with a second open end 332 and a second through opening 334 . The second extending portion 330 is inserted into the second chamber 210 from the second opening 201 . A tubular body chamber 311 and a tubular capillary structure 312 are disposed in the tubular body 310. The tubular body chamber 311 is disposed between the first and second open ends 322 and 332. The tubular capillary structure 312 is formed on the tubular body. The inner wall 311a of the tubular body chamber 311 is on the inner wall 311a. The tube capillary structure 312 is preferably a powder sintered body, but is not limited thereto, and may be selected as a mesh body, a fiber body, a groove, a braid, or a combination thereof in a specific embodiment.
該工作流體400設置於前述第一、二腔室110、210及該管體腔室311之中，該工作流體400較佳為純水或甲醇，但並不侷限於此，於具體實施時也可以是其他等效物。因此，藉由本發明的第一、二殼體100、200及管體300結合為一體且第一、二腔室110、210及管體腔室311是相通的結構，令第一、二殼體100、200及管體300相結合間沒有接觸的介面熱阻。 The working fluid 400 is disposed in the first and second chambers 110 and 210 and the tube chamber 311. The working fluid 400 is preferably pure water or methanol, but is not limited thereto, and may be embodied in a specific implementation. Is the other equivalent. Therefore, the first and second housings 100 and 200 and the tubular body 300 of the present invention are integrated into one body, and the first and second chambers 110 and 210 and the tubular body chamber 311 are in a communicating structure, so that the first and second housings 100 are There is no interface thermal resistance between the 200 and the tube 300.
另者，前述第一延伸部320從第一開口101插接入第一腔室110，該第一開放端322是直接抵接該第一殼體100的該第一底板103上的第一毛細結構111，並前述第二延伸部330從第二開口201插接入第二腔室210，該第二開放端332是直接抵接該第二殼體200的該第二蓋板205上的第二毛細結構211，也就是所述第一、二延伸部310、320是分別於該第一、二開口101、201內分別向第一底板103、第二蓋板205延伸，使該第一開放端322與該第一殼體100的第一底板103上的第一毛細結構111相連接一起，且該第二開放端332與該第二殼體200的第二蓋板205上的第二毛細結構211相連接一起，同時該管身310的外側對接相對該第一、二開口101、201內壁且彼此相緊貼結合，並該第一、二延伸部320、330係為該管身310的一部分，相對該一、二延伸部320、330的內壁311a即為該管身310的內壁311a。其中所述第一、二貫穿口324、334分別貫 穿該管身310的內、外側，並該第一貫穿口324係相對該第一腔室110，該第二貫穿口334係相對該第二腔室210，令該管體腔室311透過該第一、二貫穿口324、334連通該第一、二腔室311，在本實施例中該第一、二貫穿口324、334係以五個做說明，於具體實施時也可以是各一個第一、二貫穿口324、334，或其他數量且具有相等效果的第一、二貫穿口324、334。 In addition, the first extending portion 320 is inserted into the first chamber 110 from the first opening 101, and the first open end 322 is directly abutting the first capillary on the first bottom plate 103 of the first housing 100. The second opening portion 332 is inserted into the second chamber 210 from the second opening 201, and the second open end 332 is directly abutted on the second cover 205 of the second housing 200. The second capillary structure 211, that is, the first and second extensions 310 and 320 respectively extend into the first bottom plate 103 and the second cover plate 205 in the first and second openings 101 and 201 respectively, so that the first opening is performed. The end 322 is coupled to the first capillary structure 111 on the first bottom plate 103 of the first housing 100, and the second open end 332 and the second capillary on the second cover 205 of the second housing 200 The first and second extensions 320, 330 are the body 310. A part of the inner wall 311a of the first and second extensions 320, 330 is the inner wall 311a of the tubular body 310. Wherein the first and second through openings 324, 334 are respectively The first through hole 324 is opposite to the first chamber 110, and the second through hole 334 is opposite to the second chamber 210, so that the tube chamber 311 passes through the first portion The first and second through openings 324 and 334 are connected to the first and second chambers 311. In the embodiment, the first and second through openings 324 and 334 are illustrated by five, and may be one for each implementation. One or two through ports 324, 334, or other numbers and first and second through openings 324, 334 having equal effects.
另者，前述管體毛細結構312是毛細連結第一、二毛細結構111、211，如第4、5圖所示，該管身310的內壁311a其上的管體毛細結構312係於該第一、二延伸部320、330的該第一、二開放端322、332位置處毛細連結(或連接接觸)該第一、二殼體100、200的第一底板103、第二蓋板205其上的第一、二毛細結構111、211。其中，前述所稱的「毛細連結」係指該第一、二毛細結構111、211的多孔隙連通該管體毛細結構312的多孔隙，使得毛細力能從該管體毛細結構312傳遞或延伸到該第一、二毛細結構111、211，因此冷卻的工作流體400可以藉由該毛細力及重力從該第二毛細結構211回流到該管體毛細結構312再回流該第一毛細結構111，進而回到第一腔室內110。 In addition, the tubular capillary structure 312 is capillaryly coupled to the first and second capillary structures 111 and 211. As shown in FIGS. 4 and 5, the tubular capillary structure 312 on the inner wall 311a of the tubular body 310 is attached thereto. The first bottom plate and the second cover plate 205 of the first and second housings 100 and 200 are capillaryly connected (or connected to each other) at the first and second open ends 322 and 332 of the first and second extending portions 320 and 330. First and second capillary structures 111, 211 thereon. Here, the term "capillary connection" as used herein means that the pores of the first and second capillary structures 111, 211 are in communication with the pores of the tube capillary structure 312, so that capillary forces can be transmitted or extended from the tube capillary structure 312. To the first and second capillary structures 111, 211, the cooled working fluid 400 can be returned from the second capillary structure 211 to the tubular capillary structure 312 by the capillary force and gravity, and then the first capillary structure 111 is reflowed. In turn, it returns to the first chamber 110.
所以藉由本發明之管體毛細結構312毛細連結該第一、二毛細結構111、211的設計，讓於第一腔室110其內冷卻的工作流體可藉由該管體300的管體毛細結構312的毛細力及重力迅速將工作流體回流到第二腔室210內的第二毛細結構211上，或者讓於第二腔室210其內冷卻的工作流體可藉由該管體300的管體毛細結構312的毛細力及重力迅速將工作流體回流到第一腔室110內的第一毛細結構111上，藉以達到提升熱傳效率及均溫的效果，進而也有效增加汽液循環效率。 Therefore, the design of the first and second capillary structures 111, 211 is capillaryly coupled by the tubular capillary structure 312 of the present invention, so that the working fluid cooled in the first chamber 110 can be passed through the tubular capillary structure of the tubular body 300. The capillary force and gravity of 312 rapidly return the working fluid to the second capillary structure 211 in the second chamber 210, or the working fluid cooled in the second chamber 210 can be passed through the tube body of the tube 300. The capillary force and gravity of the capillary structure 312 quickly return the working fluid to the first capillary structure 111 in the first chamber 110, thereby achieving the effect of improving the heat transfer efficiency and the uniform temperature, thereby effectively increasing the vapor-liquid circulation efficiency.
所以當該第一殼體100的該第一底板103外貼設在相對一第一發熱元件500(如中央處理器或MCU或其他電子元件)上時，該第一殼體100的第一底 板103會吸收該第一發熱元件500產生的一熱量，令該第一殼體100的第一底板103上的內壁112其上第一毛細結構111的工作流體400受熱蒸發後而轉換為蒸發的工作流體(或稱為汽態工作流體)，使蒸發的工作流體會朝該第一腔室110內的第一蓋板105方向流動，同時一部分蒸發的工作流體也會透過該管體300的第一開放端322流動到該管體腔室311內，另一部分蒸發的工作流體透過該管體腔室311流動到該第二殼體200的第二腔室210內，直到該蒸發的工作流體於該第一殼體100的第一蓋板105上及管身310內及第二蓋板205與第二底板203上冷凝後而轉換為冷卻的工作流體(或稱為液態工作流體)，此時該第二蓋板205及該第二底板203內及該管身310內的冷卻的工作流體藉由第二毛細結構211及管體毛細結構312的毛細力及重力迅速回流到該第一腔室100內的該第一底板103其上該第一毛細結構111，因此使該工作流體400於該第一腔室110與管體腔室311與第二腔室210內不斷汽液循環，來達到較佳的散熱效果。 Therefore, when the first bottom plate 103 of the first housing 100 is externally attached to a first heat generating component 500 (such as a central processing unit or an MCU or other electronic component), the first bottom of the first housing 100 The plate 103 absorbs a heat generated by the first heating element 500, so that the inner wall 112 of the first bottom plate 103 of the first casing 100 is heated by the evaporation of the working fluid 400 of the first capillary structure 111 to be evaporated. Working fluid (or vapor working fluid) causes the vaporized working fluid to flow toward the first cover 105 in the first chamber 110, while a portion of the evaporated working fluid also passes through the tubular body 300. The first open end 322 flows into the tube chamber 311, and another portion of the evaporated working fluid flows through the tube chamber 311 into the second chamber 210 of the second housing 200 until the evaporated working fluid is in the The first cover plate 105 of the first casing 100 and the inside of the pipe body 310 and the second cover plate 205 and the second bottom plate 203 are condensed and converted into a cooled working fluid (or liquid working fluid). The cooled working fluid in the second cover 205 and the second bottom plate 203 and in the tubular body 310 is quickly returned to the first chamber 100 by the capillary force and gravity of the second capillary structure 211 and the tubular capillary structure 312. The first bottom plate 103 therein has the first capillary structure 111 thereon This allows the working fluid 400 to continuously vaporize and circulate in the first chamber 110 and the tubular chamber 311 and the second chamber 210 to achieve a better heat dissipation effect.
另外，該第一殼體100更具有至少一第一凸緣113，該第一凸緣113係相鄰該第一開口101周緣，並從該第一殼體100的一第一蓋板105向上延伸所構成，且該第一開口101內壁與該第一凸緣113的內側對接相對該第一延伸部320外側。並該第二殼體200更具有至少一第二凸緣213，該第二凸緣213係相鄰該第二開口201周緣，並從該第二殼體200的該第二底板203向下延伸所構成，且該第二開口201內壁與該第二凸緣213的內側對接相對該第二延伸部330外側。透過該第一、二凸緣113、213可有效增加與管體300的結合面積，藉以讓管體300可穩固緊密結合於該第一、二殼體100、200上。 In addition, the first housing 100 further has at least one first flange 113 adjacent to the circumference of the first opening 101 and upward from a first cover 105 of the first housing 100. The inner wall of the first opening 101 is butted against the inner side of the first flange 113 opposite to the outer side of the first extending portion 320. The second housing 200 further has at least one second flange 213 adjacent to the circumference of the second opening 201 and extending downward from the second bottom plate 203 of the second housing 200. The inner wall of the second opening 201 is butted against the inner side of the second flange 213 opposite to the outer side of the second extending portion 330. The first and second flanges 113 and 213 can effectively increase the bonding area with the pipe body 300, so that the pipe body 300 can be firmly and tightly coupled to the first and second casings 100 and 200.
請參閱第6、7、8、9圖，係為本發明散熱裝置之第二實施例之立體分解圖及組合剖面圖及局部放大剖面圖C及局部放大剖面圖D，並輔以參閱第1圖，如圖所 示，本實施例部分結構及功能係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為，該第一、二貫穿口324、334係以各一個做說明，該第一、二貫穿口324、334可令該第一、二腔室110、210與該管體腔室311相互連通，藉此，同樣可達與前述第一實施例相同之功效。 Please refer to Figures 6, 7, 8, and 9 for a perspective view, a combined cross-sectional view, a partially enlarged cross-sectional view C, and a partially enlarged cross-sectional view D of the second embodiment of the heat sink of the present invention, supplemented by reference to the first Figure, as shown It is to be noted that some of the structures and functions of the present embodiment are the same as those of the foregoing first embodiment, and therefore will not be described herein again. However, the difference between the present embodiment and the foregoing first embodiment is that the first and second through openings 324 The first and second through openings 324, 334 allow the first and second chambers 110, 210 to communicate with the tubular body chamber 311, thereby achieving the same as the first The same effect as the examples.
請參閱第10圖，係為本發明散熱裝置之第三實施例之立體組合圖，並輔以參閱第2、3、4、5、6、7、8、9圖，如圖所示，本實施例部分結構及功能係與前述第一、二實施例相同，故在此將不再贅述，惟本實施例與前述第一、二實施例之不同處係為，以該第二殼體200的該第二蓋板205貼設相對的第二發熱元件600，而以該第一腔室110作為蒸發的工作流體的冷凝腔室，藉此，同樣可達與前述第一、二實施例相同之功效。此外，同時將該第一殼體100的第一底板103及該第二殼體200的第二蓋板205分別貼設該第一、二發熱元件500、600(未繪示)，也可達到相同的散熱效果。 Please refer to FIG. 10 , which is a perspective combination diagram of a third embodiment of the heat dissipation device of the present invention, and is supplemented with reference to the figures 2, 3, 4, 5, 6, 7, 8, and 9, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing first and second embodiments, and therefore will not be described herein again. However, the difference between the embodiment and the first and second embodiments is that the second housing 200 is The second cover plate 205 is disposed opposite to the second heat generating component 600, and the first chamber 110 serves as a condensation chamber for the vaporized working fluid, thereby achieving the same as the first and second embodiments described above. The effect. In addition, the first bottom plate 103 of the first casing 100 and the second cover plate 205 of the second casing 200 are respectively attached to the first and second heating elements 500 and 600 (not shown). The same cooling effect.
請參閱第11圖，係為本發明散熱裝置之第四實施例之立體組合圖，並輔以參閱第2、3、4、5、6、7、8、9圖，如圖所示，本實施例部分結構及功能係與前述第一、二、三實施例相同，故在此將不再贅述，惟本實施例與前述第一、二、三實施例之不同處係為，該第一殼體100及該第二殼體200及該管體300之間界定有一裝設空間700，並一第一散熱鰭片組800係設置於該裝設空間700，該第一散熱鰭片組800與該第一殼體100的該第一蓋板105的外側及該管體300的該管身310的外側及該第二殼體200的該第二底板203的外側相連接，藉由與空氣接觸面積較大的該第一散熱鰭片組800，使於該第一蓋板105及該第二底板203及該管身311的熱能得以迅速傳導至空氣中，藉以提升第一、二殼體100、200之冷凝效率者。 Please refer to FIG. 11 , which is a perspective assembled view of a fourth embodiment of the heat sink of the present invention, and is supplemented with reference to the figures 2, 3, 4, 5, 6, 7, 8, and 9, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing first, second and third embodiments, and therefore will not be described again here, but the difference between the embodiment and the first, second and third embodiments is that the first A mounting space 700 is defined between the housing 100 and the second housing 200 and the tube 300, and a first heat dissipation fin set 800 is disposed in the installation space 700. The first heat dissipation fin set 800 The outer side of the first cover plate 105 of the first housing 100 and the outer side of the tubular body 310 of the tubular body 300 and the outer side of the second bottom plate 203 of the second housing 200 are connected by air The first heat dissipation fin set 800 having a large contact area allows the thermal energy of the first cover plate 105 and the second bottom plate 203 and the tubular body 311 to be quickly transmitted to the air, thereby lifting the first and second housings. 100,200 condensation efficiency.
請參閱第12、13圖，係為本發明之散熱裝置第五實施例之立體組合圖及組合剖面圖，並輔以參閱第2、3、4、5、6、7、8、9圖，如圖所示，本實施例部分結構係與前述第四實施例相同，故在此將不再贅述，惟本實施例與前述實施例之不同處係為，當所述第二殼體200的該第二蓋板205沒有貼設第二發熱元件600時，該第二殼體200的該第二蓋板205上更設置有一第二散熱鰭片組900，該第二散熱鰭片組900與該第二殼體200的該第二蓋板205的外側相連接，藉由與空氣接觸面積較大的該第二散熱鰭片組900，使於該第二蓋板205的熱能得以迅速傳導至空氣中，提升第一、二殼體100、200之冷凝效率者。 Please refer to Figures 12 and 13 for a perspective view and a combined sectional view of a fifth embodiment of the heat sink according to the present invention, and with reference to Figures 2, 3, 4, 5, 6, 7, 8, and 9, As shown in the figure, the structure of the embodiment is the same as that of the foregoing fourth embodiment, and therefore will not be described herein again. However, the difference between the embodiment and the foregoing embodiment is that when the second housing 200 is When the second cover 205 is not attached to the second heat generating component 600, the second cover 205 of the second housing 200 is further provided with a second heat dissipation fin set 900, and the second heat dissipation fin set 900 is The outer side of the second cover plate 205 of the second housing 200 is connected, and the thermal energy of the second cover plate 205 is quickly transmitted to the second heat dissipation fin set 900 with a large contact area with air. In the air, the condensation efficiency of the first and second housings 100, 200 is increased.
請參閱第14、15圖，係為本發明之散熱裝置第六實施例之俯視剖面圖及剖面圖，並輔以參閱第2、3、4、5、6、7、8、9、12、13圖，如圖所示，本實施例部分結構係與前述第一、二、三、四、五實施例相同，故在此將不再贅述，惟本實施例與前述之不同處係為，該管體300的內壁311a形成有複數凸體311b，該等凸體311b環形陣列並軸向延伸設置於該內壁311a，該等凸體311b間具有至少一凹槽311c，如第14圖中該管體300之橫截面觀察該等凸體311b相互環形間隔排列，形成類似齒輪狀，但並不侷限於此，所述相鄰設置的凸體311b亦可非等距排列，並該等凹槽311c也可形成其他形狀，並該毛細結構312係形成在該等凸體311b及該等凹槽311c表面上，由於所述凸體311b及凹槽311c增加了該內壁311a的表面積，因此該內壁311a表面上的毛細結構312的孔隙數量也增加，使該工作流體400於該第一腔室110與管體腔室311與第二腔室210內的汽液循環加快，達到較佳的散熱效果。 Please refer to Figures 14 and 15 for a top cross-sectional view and a cross-sectional view of a sixth embodiment of the heat sink of the present invention, supplemented by reference to Figures 2, 3, 4, 5, 6, 7, 8, 9, and 12. 13, as shown in the figure, the structure of the embodiment is the same as the first, second, third, fourth and fifth embodiments, and therefore will not be described again here, but the difference between the embodiment and the foregoing is that The inner wall 311a of the tubular body 300 is formed with a plurality of convex bodies 311b. The convex bodies 311b are annularly arranged and axially extended on the inner wall 311a. The convex bodies 311b have at least one groove 311c therebetween, as shown in FIG. The cross-section of the tube 300 is observed to be annularly spaced from each other to form a gear-like shape, but is not limited thereto, and the adjacent protrusions 311b may be arranged non-equally, and the same The groove 311c can also be formed into other shapes, and the capillary structure 312 is formed on the surfaces of the protrusions 311b and the grooves 311c. Since the protrusions 311b and 311c increase the surface area of the inner wall 311a, Therefore, the number of pores of the capillary structure 312 on the surface of the inner wall 311a is also increased, so that the working fluid 400 is at the first Chamber 110 and the tubular body and the chamber 311 to accelerate vapor-liquid circulating within the second chamber 210, to achieve a better heat dissipation effect.
請參閱第16、17圖，係為本發明之散熱裝置第七實施例之俯視剖面圖及剖面圖，並輔以參閱第2、3、4、5、6、7、8、9、12、13、14、15圖，如圖所示，本實 施例部分結構係與前述第一、二、三、四、五、六實施例相同，故在此將不再贅述，惟本實施例與前述之不同處係為，該管體300的該管體腔室311內設置有一柱體313，該柱體313具有一第一頂端313a及一第二頂端313b，該柱體313之第一頂端313a及第二頂端313b分別延伸進入該第一、二腔室110、210且連接該第一、二殼體100、200的該第一底板103及該第二蓋板205，並該柱體313表面設有一第三毛細結構313c，其中該第三毛細結構313c較佳為粉末燒結體，但並不侷限於此，於具體實施時也可以選擇為網格體、纖維體、編織體或溝槽或前述之組合，且該第三毛細結構313c毛細連結該第一、二毛細結構111、211。藉此位於第一、二毛細結構111、211的該工作流體400除了從該管體毛細結構312回流，也可從該第三毛細結構313c回流，使該工作流體400於該第一腔室110與管體腔室311與第二腔室210內的汽液循環加快，達到較佳的散熱效果。 Please refer to FIGS. 16 and 17 for a top cross-sectional view and a cross-sectional view of a seventh embodiment of the heat sink according to the present invention, supplemented by reference to the second, third, fourth, fifth, sixth, seventh, eighth, ninth, and fourth, 13, 14, 15 map, as shown in the figure, this real The structure of the embodiment is the same as the first, second, third, fourth, fifth and sixth embodiments, and therefore will not be described again here, but the difference between the embodiment and the foregoing is that the tube of the tube 300 A cylinder 313 is disposed in the body chamber 311. The cylinder 313 has a first top end 313a and a second top end 313b. The first top end 313a and the second top end 313b of the main body 313 extend into the first and second chambers, respectively. The first bottom plate 103 and the second cover plate 205 of the first and second housings 100 and 200 are connected to the chambers 110 and 210, and a third capillary structure 313c is disposed on the surface of the column body 313, wherein the third capillary structure 313c is preferably a powder sintered body, but is not limited thereto, and may be selected as a mesh body, a fiber body, a braid or a groove or a combination thereof in a specific embodiment, and the third capillary structure 313c is capillaryly coupled. First and second capillary structures 111, 211. The working fluid 400 located in the first and second capillary structures 111, 211 can be recirculated from the third capillary structure 313c in addition to being recirculated from the tubular capillary structure 312, so that the working fluid 400 is in the first chamber 110. The vapor-liquid circulation in the tubular chamber 311 and the second chamber 210 is accelerated to achieve a better heat dissipation effect.
以上所述，本發明相較於習知具有下列優點：1.第一、二殼體與管體相結合間沒有介面熱阻；2.節省生產成本；3.提升熱傳效率及均溫的效果；4.增加汽液循環效率；5.迅速將熱能傳導致空氣中。 As described above, the present invention has the following advantages compared with the prior art: 1. There is no interface thermal resistance between the first and second shells and the tube body; 2. saving production cost; 3. improving heat transfer efficiency and temperature uniformity Effect; 4. Increase the efficiency of vapor-liquid circulation; 5. Rapidly transfer heat energy into the air.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之較佳實施例而已，當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
100‧‧‧第一殼體 100‧‧‧ first housing
200‧‧‧第二殼體 200‧‧‧ second housing
300‧‧‧管體 300‧‧‧ tube body
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105112500A TWI609164B (en) | 2016-04-21 | 2016-04-21 | Heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105112500A TWI609164B (en) | 2016-04-21 | 2016-04-21 | Heat dissipation device |
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| TW201738522A TW201738522A (en) | 2017-11-01 |
| TWI609164B true TWI609164B (en) | 2017-12-21 |
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| TW105112500A TWI609164B (en) | 2016-04-21 | 2016-04-21 | Heat dissipation device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI804863B (en) * | 2021-05-07 | 2023-06-11 | 建準電機工業股份有限公司 | Heat dissipation module |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072370A (en) * | 2019-04-26 | 2019-07-30 | 深圳兴奇宏科技有限公司 | Combined type equalizing plate structure |
| CN116156846A (en) * | 2020-05-21 | 2023-05-23 | 上海巽科节能科技有限公司 | Heat dissipation device |
| CN113710053B (en) * | 2020-05-22 | 2024-02-13 | 苏州圣荣元电子科技有限公司 | Heat dissipation device |
| CN113347856B (en) * | 2021-06-04 | 2022-12-13 | 深圳市纵鑫热传科技有限公司 | Heat radiator for electronic equipment |
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| US5275232A (en) * | 1993-03-15 | 1994-01-04 | Sandia National Laboratories | Dual manifold heat pipe evaporator |
| US6390185B1 (en) * | 2001-03-06 | 2002-05-21 | Richard A. Proeschel | Annular flow concentric tube recuperator |
| TWM517314U (en) * | 2015-11-17 | 2016-02-11 | Asia Vital Components Co Ltd | Heat dissipation apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275232A (en) * | 1993-03-15 | 1994-01-04 | Sandia National Laboratories | Dual manifold heat pipe evaporator |
| US6390185B1 (en) * | 2001-03-06 | 2002-05-21 | Richard A. Proeschel | Annular flow concentric tube recuperator |
| TWM517314U (en) * | 2015-11-17 | 2016-02-11 | Asia Vital Components Co Ltd | Heat dissipation apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI804863B (en) * | 2021-05-07 | 2023-06-11 | 建準電機工業股份有限公司 | Heat dissipation module |
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