TW201930826A - 外觀檢查裝置、外觀檢查方法、程式及工件之製造方法 - Google Patents

外觀檢查裝置、外觀檢查方法、程式及工件之製造方法 Download PDF

Info

Publication number: TW201930826A
Authority: TW; Taiwan
Prior art keywords: scanning; scanning unit; workpiece; unit; linear camera
Prior art date: 2017-12-26

Application number

TW107144269A

Other languages

English (en)

Chinese (zh)

Inventor

小堀雄司

利根川誠

Original Assignee

日商索尼股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-12-26

Filing date

2018-12-10

Publication date

2019-08-01

2018-12-10 Application filed by 日商索尼股份有限公司 filed Critical 日商索尼股份有限公司

2019-08-01 Publication of TW201930826A publication Critical patent/TW201930826A/zh

Links

238000007689 inspection Methods 0.000 title claims abstract description 77
238000000034 method Methods 0.000 title claims description 19
238000004519 manufacturing process Methods 0.000 title claims description 18
238000011179 visual inspection Methods 0.000 claims description 188
238000003384 imaging method Methods 0.000 claims description 156
230000002452 interceptive effect Effects 0.000 claims description 2
230000002159 abnormal effect Effects 0.000 description 114
230000005236 sound signal Effects 0.000 description 22
230000032258 transport Effects 0.000 description 21
210000000707 wrist Anatomy 0.000 description 19
230000008859 change Effects 0.000 description 16
210000000245 forearm Anatomy 0.000 description 15
238000003860 storage Methods 0.000 description 14
230000002950 deficient Effects 0.000 description 12
230000007246 mechanism Effects 0.000 description 12
230000005856 abnormality Effects 0.000 description 11
238000010586 diagram Methods 0.000 description 11
238000005516 engineering process Methods 0.000 description 11
238000005452 bending Methods 0.000 description 8
238000004891 communication Methods 0.000 description 8
230000008569 process Effects 0.000 description 8
230000006870 function Effects 0.000 description 6
239000007787 solid Substances 0.000 description 6
210000004247 hand Anatomy 0.000 description 4
238000005286 illumination Methods 0.000 description 4
230000004044 response Effects 0.000 description 4
230000002411 adverse Effects 0.000 description 3
239000000463 material Substances 0.000 description 3
238000007789 sealing Methods 0.000 description 3
230000009471 action Effects 0.000 description 2
238000001514 detection method Methods 0.000 description 2
238000004806 packaging method and process Methods 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
238000007514 turning Methods 0.000 description 2
230000007547 defect Effects 0.000 description 1
230000000694 effects Effects 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
238000009434 installation Methods 0.000 description 1
238000003754 machining Methods 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000001902 propagating effect Effects 0.000 description 1
238000004904 shortening Methods 0.000 description 1
239000000758 substrate Substances 0.000 description 1
238000011144 upstream manufacturing Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/04—Viewing devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules

Landscapes

Engineering & Computer Science (AREA)
Biochemistry (AREA)
Analytical Chemistry (AREA)
Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
General Health & Medical Sciences (AREA)
Chemical & Material Sciences (AREA)
Pathology (AREA)
Immunology (AREA)
Life Sciences & Earth Sciences (AREA)
General Physics & Mathematics (AREA)
Robotics (AREA)
Mechanical Engineering (AREA)
Textile Engineering (AREA)
Multimedia (AREA)
Signal Processing (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

TW107144269A 2017-12-26 2018-12-10 外觀檢查裝置、外觀檢查方法、程式及工件之製造方法 TW201930826A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2017-248722		2017-12-26
JP2017248722		2017-12-26

Publications (1)

Publication Number	Publication Date
TW201930826A true TW201930826A (zh)	2019-08-01

Family

ID=67067047

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW107144269A TW201930826A (zh)	2017-12-26	2018-12-10	外觀檢查裝置、外觀檢查方法、程式及工件之製造方法

Country Status (4)

Country	Link
JP (1)	JP7415560B2 (ja)
CN (1)	CN111492231B (ja)
TW (1)	TW201930826A (ja)
WO (1)	WO2019131155A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7278186B2 (ja) *	2019-09-20	2023-05-19	株式会社Ｓｃｒｅｅｎホールディングス	撮像装置
WO2021054059A1 (ja) *	2019-09-20	2021-03-25	株式会社Ｓｃｒｅｅｎホールディングス	撮像装置
JP7436781B2 (ja)	2019-09-25	2024-02-22	キョーラク株式会社	検査システム
CN112729251A (zh) *	2020-12-23	2021-04-30	上海微电机研究所(中国电子科技集团公司第二十一研究所)	一种柔性扫描机械臂***及柔性扫描方法
JP7316332B2 (ja) *	2021-09-02	2023-07-27	株式会社ジーテクト	外観検査装置
JP7486715B1 (ja)	2023-01-27	2024-05-20	ダイトロン株式会社	外観検査装置及び外観検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3846621B2 (ja) *	2001-03-05	2006-11-15	関東自動車工業株式会社	マーキング方法及びマーキング機能付塗面検査装置
JP4157037B2 (ja)	2001-09-21	2008-09-24	オリンパス株式会社	欠陥検査装置
JP2003254714A (ja)	2002-02-28	2003-09-10	Uht Corp	位置検出方法及び位置検出装置並びにプリント基板の位置決め方法
JP2007170955A (ja)	2005-12-21	2007-07-05	Nagasaki Univ	変位／ひずみ計測方法及び変位／ひずみ計測装置
JP5323320B2 (ja) *	2006-07-19	2013-10-23	有限会社シマテック	表面検査装置
JP2008168372A (ja)	2007-01-10	2008-07-24	Toyota Motor Corp	ロボット装置及び形状認識方法
JP2009168581A (ja) *	2008-01-15	2009-07-30	Saki Corp:Kk	被検査体の検査装置
JP4856672B2 (ja) *	2008-04-25	2012-01-18	株式会社リコー	画像処理装置、画像処理方法、および画像処理プログラム
WO2015011782A1 (ja)	2013-07-23	2015-01-29	株式会社安川電機	検査装置

2018
- 2018-12-10 TW TW107144269A patent/TW201930826A/zh unknown
- 2018-12-13 WO PCT/JP2018/045789 patent/WO2019131155A1/ja active Application Filing
- 2018-12-13 CN CN201880082194.0A patent/CN111492231B/zh active Active
- 2018-12-13 JP JP2019562965A patent/JP7415560B2/ja active Active

Also Published As

Publication number	Publication date
JP7415560B2 (ja)	2024-01-17
JPWO2019131155A1 (ja)	2020-12-10
CN111492231B (zh)	2024-04-16
CN111492231A (zh)	2020-08-04
WO2019131155A1 (ja)	2019-07-04

Publication	Publication Date	Title
TW201930826A (zh)	2019-08-01	外觀檢查裝置、外觀檢查方法、程式及工件之製造方法
TWI784100B (zh)	2022-11-21	異常音檢查裝置、異常音檢查方法、程式及工件之製造方法
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JP2008203280A (ja)	2008-09-04	欠陥検査装置
US7535560B2 (en)	2009-05-19	Method and system for the inspection of integrated circuit devices having leads
US20230187244A1 (en)	2023-06-15	Method for inspecting a container and inspection system
US7747343B2 (en)	2010-06-29	Substrate processing apparatus and substrate housing method
JP6122310B2 (ja)	2017-04-26	検査装置
TW202016532A (zh)	2020-05-01	切晶晶片檢查裝置
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JP2011134822A (ja)	2011-07-07	基板収納状態検出装置及び基板収納状態検出方法
JP7363100B2 (ja)	2023-10-18	ピックアップ装置及びワークの搬送方法
JP6124405B2 (ja)	2017-05-10	ウェーハ収納カセットの検査装置及び検査方法
JP2008066472A (ja)	2008-03-21	ワーク複合処理装置
WO2021054059A1 (ja)	2021-03-25	撮像装置
JP5954757B2 (ja)	2016-07-20	外観検査装置
JP2021050940A (ja)	2021-04-01	撮像装置
KR20100137066A (ko)	2010-12-30	작업성이 향상된 전자기기용 표면 검사장치
JPH07120530A (ja)	1995-05-12	半導体検査装置
JP2024015678A (ja)	2024-02-06	検査方法、検査装置および搬送装置
TW202236456A (zh)	2022-09-16	晶圓盒底側面檢測機構及其方法
JP2021052247A (ja)	2021-04-01	撮像装置
JP2022178212A (ja)	2022-12-02	微小物体の検査方法
JP2023163012A (ja)	2023-11-09	半導体製造装置システム
JP2005083959A (ja)	2005-03-31	搬送基板不良検出装置及びこの搬送基板不良検出装置を備えたレーザトリミングマシン