TW201906053A - Rotating reticle unit and substrate processing device - Google Patents

Abstract

A substrate processing apparatus that forms a pattern of a mask held along a cylindrical surface on a photoresponse layer formed on a front surface of a substrate includes: a mask holding portion that includes a mask holding surface, which holds the mask along the cylindrical surface, and is rotatable around a predetermined axis; a revolving holding portion that includes a substrate holding surface, which comes in contact with and holds the substrate, and is revolvable around an axis substantially parallel to the predetermined axis; and a gap forming portion that forms a gap having a predetermined size between the mask holding surface and the substrate holding surface.

Description

旋轉光罩單元及基板處理裝置    Rotating photomask unit and substrate processing device   

本發明係關於一種光罩單元、基板處理裝置及光罩單元製造方法、以及基板處理方法。 The present invention relates to a photomask unit, a substrate processing apparatus, a method for manufacturing a photomask unit, and a substrate processing method.

本申請案係根據2012年3月15日申請之日本特願2012-059070號、2012年4月03日申請之日本特願2012-084820號，及2012年4月05日申請之日本特願2012-086539號而主張優先權，並將其內容引用至本文中。 This application is based on Japanese Patent Application No. 2012-059070 filed on March 15, 2012, Japanese Patent Application No. 2012-084820 filed on April 03, 2012, and Japanese Patent Application No. 2012 filed on April 05, 2012 No.-086539, which claims priority, the contents of which are incorporated herein by reference.

於液晶顯示元件等大畫面顯示元件中，於在平面狀之玻璃基板上堆積ITO(Indium Tin Oxides，氧化銦錫)等透明電極或Si等半導體物質之基礎上蒸鍍金屬材料，且塗布光阻而轉印電路圖案，並於轉印後使光阻顯影，其後進行蝕刻，藉此形成電路圖案等。然而，隨著顯示元件之大畫面化，玻璃基板大型化，故而基板搬送亦變得困難。因此，提出有於具有可撓性之基板(例如，聚醯亞胺、PET、金屬箔等膜構件等)上形成顯示元件之被稱為輥對輥(roll to roll)方式(以下，簡記作「輥方式」)之技術(例如，參照專利文獻1)。 In large-screen display elements such as liquid crystal display elements, metal materials are vapor-deposited on the basis of a transparent electrode such as ITO (Indium Tin Oxides) or a semiconductor substance such as Si deposited on a flat glass substrate, and a photoresist is applied. Then, a circuit pattern is transferred, and a photoresist is developed after the transfer, followed by etching to form a circuit pattern or the like. However, as the display screen becomes larger, the glass substrate becomes larger, and it becomes difficult to carry the substrate. Therefore, a roll-to-roll method (hereinafter, abbreviated as "roll to roll") is proposed in which a display element is formed on a flexible substrate (for example, film members such as polyimide, PET, and metal foil). "Roll method") (for example, refer to Patent Document 1).

又，於專利文獻2中，提出有如下技術：接近於可旋轉之圓筒狀之光罩之外周部，而配置捲繞於傳送輥上而移行之可撓性之長條片材(基板)，從而將光罩之圖案連續地曝光於基板上。 Further, in Patent Document 2, a technique is proposed in which a flexible long sheet (substrate) that is close to the outer periphery of a rotatable cylindrical mask and is wound around a transfer roller and moves is arranged. Thus, the pattern of the photomask is continuously exposed on the substrate.

[先前技術文獻] [Prior technical literature]

[專利文獻] [Patent Literature]

[專利文獻1]國際公開第2008/129819號 [Patent Document 1] International Publication No. 2008/129819

[專利文獻2]日本實開昭60-019037號公報 [Patent Document 2] Japanese Publication No. 60-019037

為了以高精度將光罩之圖案曝光於基板上，必須將光罩與基板之間距量設為適當值，但於間距量偏離適當值之情形時，有可能無法獲得既定之圖案線寬。 In order to expose the pattern of the photomask on the substrate with high accuracy, it is necessary to set the distance between the photomask and the substrate to an appropriate value. However, if the amount of the pitch deviates from the appropriate value, the predetermined pattern line width may not be obtained.

本發明之態樣之目的在於提供一種可將光罩之圖案以高精度曝光於基板上之基板處理裝置。 An aspect of the present invention is to provide a substrate processing apparatus capable of exposing a pattern of a photomask on a substrate with high accuracy.

又，於光罩為圓筒狀之情形時，存在難以於圓筒狀之母材之周面上直接形成精密之圖案之情形，從而成為成本增加之一個原因。尤其是於在圓筒狀光罩之內周面形成圖案之情形時，擔心成本會大幅增加，並且圖案精度下降。 In addition, when the photomask is cylindrical, it may be difficult to form a precise pattern directly on the peripheral surface of the cylindrical base material, which may be a cause of cost increase. In particular, in the case where a pattern is formed on the inner peripheral surface of the cylindrical mask, there is a concern that the cost may increase significantly and the accuracy of the pattern may decrease.

本發明之態樣之目的亦在於提供一種可抑制成本增加且有助於圖案精度之提高之光罩單元、基板處理裝置及光罩單元製造方法、以及基板處理方法。 It is also an object of aspects of the present invention to provide a photomask unit, a substrate processing apparatus, a method for manufacturing a photomask unit, and a substrate processing method that can suppress an increase in cost and contribute to an improvement in pattern accuracy.

又，於保持光罩圖案之保持構件、與相對於基板將保持構件支承於既定位置之支承構件之線膨脹係數不同之情形時，會因伴隨著溫度變化所產生之熱伸縮而對保持構件施加應力，從而有於以玻璃等相對較脆弱之材料形成保持構件之情形時造成不良影響之虞。又，於對保持構件施加有應力之情形時，有可能對光罩圖案亦造成影響，且對向基板之轉印精度亦造成影響。 When the linear expansion coefficient of the holding member that holds the mask pattern and the supporting member that supports the holding member at a predetermined position with respect to the substrate are different, the holding member is applied due to thermal expansion and contraction caused by a temperature change. The stress may cause an adverse effect when the holding member is formed of a relatively fragile material such as glass. When stress is applied to the holding member, the mask pattern may be affected, and the transfer accuracy to the substrate may also be affected.

本發明之態樣之目的亦在於提供一種即使於產生有溫度變動之情形時亦可抑制對保持光罩圖案之保持構件施加應力之光罩單元及基板處理裝置。 It is also an object of aspects of the present invention to provide a photomask unit and a substrate processing apparatus capable of suppressing stress on a holding member that holds a photomask pattern even when a temperature variation occurs.

本發明之一態樣之基板處理裝置，係將沿著圓筒面而保持之光罩之圖案形成於基板之表面所形成之光感應層；具備：光罩保持部，其具備沿著圓筒面保持光罩之光罩保持面，且可繞既定之軸線旋轉；環繞保持部，其具備接觸保持基板之基板保持面，且可繞與既定之軸線大致平行之軸線環繞；及間距形成部，其於光罩保持面與基板保持面之間形成既定量之間距。 A substrate processing apparatus according to one aspect of the present invention is a light-sensing layer formed by forming a pattern of a photomask held along a cylindrical surface on a surface of a substrate; the photomask includes a photomask holding portion provided along the cylinder. The mask holding surface of the surface holding mask is rotatable around a predetermined axis; the surrounding holding portion includes a substrate holding surface contacting the holding substrate and can be wound around an axis substantially parallel to the predetermined axis; and a pitch forming portion, It forms a predetermined distance between the mask holding surface and the substrate holding surface.

本發明之一態樣之光罩單元，具備光罩保持部，該光罩保持部係將由玻璃材料形成之光罩作為保持對象，沿著圓筒面於周面上保持光罩，可繞既定之軸線旋轉，且由玻璃材料形成。 A mask unit according to one aspect of the present invention includes a mask holding portion that holds a mask made of a glass material as a holding object, and holds the mask along a cylindrical surface on a peripheral surface so that The axis of rotation is made of glass material.

本發明之一態樣之基板處理裝置，具備上述態樣之光罩單元、及保持形成光罩之圖案之基板之基板保持部。 A substrate processing apparatus according to an aspect of the present invention includes the above-mentioned mask unit and a substrate holding portion that holds a substrate forming a pattern of the mask.

本發明之一態樣之光罩單元製造方法，包含如下步驟：於具有沿圓筒面之周面、可繞既定之軸線旋轉、且由玻璃材料形成之光罩保持部，使由該玻璃材料形成之光罩保持於該周面。 A manufacturing method of a mask unit according to an aspect of the present invention includes the steps of: forming a mask holding portion formed of a glass material on a peripheral surface of a cylindrical surface that is rotatable about a predetermined axis; The formed mask is held on the peripheral surface.

本發明之一態樣之基板處理方法，包含如下步驟：使用藉由上述態樣之光罩單元製造方法而製造之光罩單元，將光罩之圖案形成於基板。 A method for processing a substrate according to one aspect of the present invention includes the steps of forming a pattern of a photomask on a substrate by using the photomask unit manufactured by the method for manufacturing a photomask unit described above.

本發明之一態樣之光罩單元，係安裝於既定之處理裝置，受到旋轉驅動力而可繞既定之軸線旋轉之圓筒狀或圓柱狀者；且具備：圓筒狀或圓柱狀之圖案保持構件，其沿著距離軸線具有固定之半徑並且於軸線之方向具有既定尺寸之周面保持光罩圖案；支承構件，其與圖案保持構件物理性地結合，且將圖案保持構件支承於處理裝置之既定位置；及伸縮容許部，其於支承構件與圖案保持構件之物理性結合中，以容許圖案保持構件之軸線方向之伸縮之方式連結圖案保持構件與支承構件。 A mask unit according to one aspect of the present invention is a cylindrical or cylindrical shape that is mounted on a predetermined processing device and can be rotated about a predetermined axis by a rotational driving force; and has a cylindrical or cylindrical pattern A holding member that holds the mask pattern on a peripheral surface having a fixed radius along the axis and having a predetermined size in the direction of the axis; a supporting member that is physically combined with the pattern holding member and supports the pattern holding member on a processing device A predetermined position; and an expansion and contraction permitting unit that connects the pattern holding member and the support member in a physical combination of the support member and the pattern holding member so as to allow the pattern holding member to extend in the axial direction.

本發明之一態樣之基板處理裝置，具備上述態樣之光罩單元、及 保持轉印光罩圖案之基板之基板保持單元。 A substrate processing apparatus according to one aspect of the present invention includes the above-mentioned mask unit and a substrate holding unit that holds a substrate for transferring a mask pattern.

本發明之一態樣之基板處理方法，係使圓筒光罩向沿著長邊方向搬送之基板之表面接近而進行掃描曝光者，該圓筒光罩係沿著距離既定之中心線為固定半徑之外周面設置有電子元件用之圖案且可旋轉者；且上述基板處理方法包含如下步驟：使上述基板接觸保持於藉由繞與上述既定之中心線平行地配置之軸線環繞之環繞驅動部進行移動之基板保持部，而沿著上述長邊方向搬送上述基板；及使自上述中心線以既定半徑設置於上述圓筒光罩之上述中心線之方向之兩端側的環狀之設置部與上述環繞驅動部或上述基板保持部之一部分接觸，藉此一面呈既定之近接間距設定上述基板之表面與上述圓筒光罩之外周面，一面使上述圓筒光罩繞上述中心線旋轉。 According to one aspect of the present invention, a substrate processing method is a person who scans and exposes a cylindrical mask to a surface of a substrate that is transported along a long side direction. The cylindrical mask is fixed along a predetermined center line. The outer surface of the radius is provided with a pattern for electronic components and is rotatable; and the substrate processing method includes the steps of keeping the substrate in contact with a surrounding drive portion surrounded by an axis arranged parallel to the predetermined center line A substrate holding portion that moves to carry the substrate along the long side direction; and a ring-shaped installation portion that is provided at a predetermined radius from the center line on both ends of the cylindrical mask in the direction of the center line In contact with the surrounding driving part or a part of the substrate holding part, the surface of the substrate and the outer peripheral surface of the cylindrical mask are set at a predetermined close distance, and the cylindrical mask is rotated around the centerline.

根據本發明之態樣，可將光罩之圖案以高精度曝光於基板。 According to the aspect of the present invention, the pattern of the photomask can be exposed on the substrate with high accuracy.

又，根據本發明之態樣，可不導致成本增加，而使用圓筒狀之光罩圖案於基板上實現高精度之轉印曝光。 In addition, according to the aspect of the present invention, a cylindrical mask pattern can be used to achieve high-precision transfer exposure without causing cost increase.

又，根據本發明之態樣，即使於產生有溫度變動之情形時亦可抑制對保持光罩圖案之保持構件施加應力，從而可進行使用光罩圖案之高精度之處理。 In addition, according to the aspect of the present invention, even when a temperature fluctuation occurs, it is possible to suppress stress on the holding member that holds the mask pattern, so that high-precision processing using the mask pattern can be performed.

10‧‧‧照明部 10‧‧‧Lighting Department

11‧‧‧基板供給部 11‧‧‧ Substrate Supply Department

12‧‧‧基板回收部 12‧‧‧ Substrate Recycling Department

20‧‧‧光罩保持部 20‧‧‧Mask holding section

21‧‧‧內筒 21‧‧‧Inner tube

21a‧‧‧開口部 21a‧‧‧ opening

22‧‧‧保持部本體(圖案保持構件) 22‧‧‧ holding section body (pattern holding member)

22a‧‧‧光罩保持面(外周面、周面) 22a‧‧‧ Mask holding surface (outer peripheral surface, peripheral surface)

23、23A、23B‧‧‧保持具(環狀部) 23, 23A, 23B ‧‧‧ holder (ring part)

23a‧‧‧接著劑(第2伸縮容許部) 23a‧‧‧Adhesive (second telescopic allowance)

23b‧‧‧保持具之外周面 23b‧‧‧ Outer peripheral surface

23c、55‧‧‧槽部 23c, 55‧‧‧ trough

24、28‧‧‧板彈簧(伸縮吸收部、彈性構件) 24, 28‧‧‧ leaf springs (retractable absorption section, elastic member)

24A、24B‧‧‧間隔件 24A, 24B‧‧‧ spacer

25‧‧‧轉動體(間距形成部、支承構件) 25‧‧‧Rotating body (pitch forming section, support member)

25a‧‧‧壓印滾筒設置部 25a‧‧‧Impression cylinder setting section

25b‧‧‧斜面 25b‧‧‧ bevel

26、35、42‧‧‧空氣軸承 26, 35, 42‧‧‧ air bearing

27‧‧‧支承台 27‧‧‧Support

30、DR5‧‧‧壓印滾筒體(基板保持部、環繞保持部、旋轉筒) 30. DR5 ‧‧‧ Imprinting cylinder body (substrate holding part, surrounding holding part, rotating tube)

30a‧‧‧中空部 30a‧‧‧Hollow

31‧‧‧基板保持面 31‧‧‧ substrate holding surface

32‧‧‧旋轉支承部 32‧‧‧rotary bearing

33‧‧‧驅動裝置 33‧‧‧Drive

34、86‧‧‧旋轉軸 34, 86‧‧‧ Rotary axis

36‧‧‧終端筒 36‧‧‧Terminal tube

37‧‧‧固定桿 37‧‧‧Fixed lever

39A‧‧‧供給部 39A‧‧‧Supply Department

39B‧‧‧排出部 39B‧‧‧Exhaust

40‧‧‧測量部 40‧‧‧Measurement Department

41‧‧‧移位部 41‧‧‧Transfer Department

43、46‧‧‧導軌 43, 46‧‧‧ rails

44、47‧‧‧驅動部 44, 47‧‧‧Driver

48‧‧‧位移平台(第2調整部) 48‧‧‧Displacement platform (second adjustment section)

50‧‧‧測量部(檢測部) 50‧‧‧Measurement Department (Detection Department)

51A、51B‧‧‧支承構件 51A, 51B‧‧‧Support members

52A、52B‧‧‧導引部 52A, 52B‧‧‧Guide

53A、53B‧‧‧空氣缸(賦能部) 53A, 53B‧‧‧ Air Cylinder (Energy Department)

54‧‧‧支承壁 54‧‧‧ support wall

56‧‧‧襯墊部 56‧‧‧ Pad Department

61‧‧‧移位環 61‧‧‧shift ring

61a‧‧‧移位環之斜面 61a‧‧‧Slope of shift ring

62‧‧‧調整螺釘部(負載賦予部) 62‧‧‧Adjustment screw section (load application section)

62a‧‧‧軸部 62a‧‧‧Shaft

62b‧‧‧轉動體之頭部 62b‧‧‧Head of the rotating body

70‧‧‧密封部(固定部) 70‧‧‧Sealing section (fixed section)

71、72‧‧‧係合部 71, 72‧‧‧ Department

80‧‧‧基板支承機構 80‧‧‧ substrate support mechanism

81‧‧‧帶部(環形帶) 81‧‧‧Belt section (endless belt)

81a‧‧‧支承面(基板保持面) 81a‧‧‧Support surface (substrate holding surface)

81b‧‧‧背面 81b‧‧‧Back

82‧‧‧帶搬送部 82‧‧‧ with transportation department

82a、82b‧‧‧搬送輥 82a, 82b‧‧‧ transport roller

82e‧‧‧驅動部(環繞驅動部) 82e‧‧‧drive unit (surround drive unit)

83‧‧‧導引平台(流體支承部) 83‧‧‧Guide platform (fluid support)

83a‧‧‧導引面 83a‧‧‧Guide plane

84‧‧‧輪列機構 84‧‧‧Rotary institutions

85‧‧‧光罩驅動輥(旋轉部) 85‧‧‧Photomask driving roller (rotating part)

87‧‧‧軸承 87‧‧‧bearing

88‧‧‧升降裝置(移動部) 88‧‧‧Lifting device (moving section)

89‧‧‧導引平台之供給部 89‧‧‧Guide Platform Supply Department

90‧‧‧基板搬送部 90‧‧‧ Substrate Transfer Department

100、200、300‧‧‧基板處理裝置 100, 200, 300‧‧‧ substrate processing equipment

AX1‧‧‧旋轉軸線(既定之軸線) AX1‧‧‧axis of rotation (predetermined axis)

AX2‧‧‧旋轉軸線(第2軸線) AX2‧‧‧Axis of rotation (2nd axis)

AX3‧‧‧軸線 AX3‧‧‧ axis

M‧‧‧光罩 M‧‧‧Photomask

MT‧‧‧驅動裝置(第1調整部) MT‧‧‧Driver (1st adjustment unit)

Ma‧‧‧光罩分離區域 Ma‧‧‧Mask separation area

S、P‧‧‧基板 S, P‧‧‧ substrate

SM1、SM2、31B‧‧‧填隙片(修正部) SM1, SM2, 31B ‧ ‧ shims (correction section)

B‧‧‧基座部 B‧‧‧ base

R‧‧‧導輥 R‧‧‧Guide roller

FM‧‧‧指標標記(指標部) FM‧‧‧ indicator mark (indicator department)

MM‧‧‧光罩標記 MM‧‧‧Mask mark

MU、MU2‧‧‧光罩單元 MU, MU2‧‧‧Photomask unit

VC‧‧‧抽吸部(固定部) VC‧‧‧Suction section (fixed section)

SU‧‧‧基板保持單元 SU‧‧‧ substrate holding unit

CONT‧‧‧控制部 CONT‧‧‧Control Department

CONT2‧‧‧上位控制裝置 CONT2‧‧‧ host controller

AL1、AL2、AM1、AM2‧‧‧對準顯微鏡 AL1, AL2, AM1, AM2‧‧‧ aiming microscope

X、Y、Z、θY‧‧‧方向 X, Y, Z, θY‧‧‧ directions

DX‧‧‧旋轉軸線AX1與旋轉軸線AX2之軸間距離 DX‧‧‧The distance between the axis of rotation AX1 and the axis of rotation AX2

Cx‧‧‧間隙之大致中間之位置 Cx‧‧‧ the middle of the gap

r1‧‧‧壓印滾筒設置部之半徑 r1‧‧‧Radius of imprint cylinder setting part

r2‧‧‧基板保持面之半徑 r2‧‧‧ Radius of substrate holding surface

r11‧‧‧光罩保持面之半徑 r11‧‧‧ Radius of mask holding surface

G‧‧‧間距 G‧‧‧Pitch

Mt‧‧‧光罩之厚度 Mt‧‧‧Thickness of the mask

St‧‧‧基板之厚度 St‧‧‧ substrate thickness

Ta‧‧‧接觸範圍 Ta‧‧‧contact range

t1‧‧‧SM1之厚度 t1‧‧‧SM1 thickness

t2‧‧‧SM2之厚度 t2‧‧‧SM2 thickness

tf‧‧‧填隙片SM1、SM2之抵接面 tf‧‧‧ abutment surface of gap filler SM1, SM2

FLX‧‧‧撓曲構造體 FLX‧‧‧Flexible Structure

T‧‧‧切線方向 T‧‧‧Tangent direction

SYS‧‧‧元件製造系統 SYS‧‧‧component manufacturing system

U1、U2、U3、U4、U5…Un‧‧‧處理裝置 U1, U2, U3, U4, U5 ... Un‧‧‧processing device

FR1‧‧‧供給輥 FR1‧‧‧Supply roller

FR2‧‧‧回收輥 FR2‧‧‧Recycling roller

DR1、DR3、DR4、DR6、DR7、DR8‧‧‧驅動輥 DR1, DR3, DR4, DR6, DR7, DR8‧‧‧Drive rollers

DR2‧‧‧壓印滾筒輥 DR2‧‧‧imprinted roller

EPC、EPC1、EPC2‧‧‧邊緣位置控制器 EPC, EPC1, EPC2‧‧‧Edge Position Controller

Gp1‧‧‧塗布機構 Gp1‧‧‧coating mechanism

Gp2‧‧‧乾燥機構 Gp2‧‧‧drying mechanism

HA1‧‧‧加熱腔室部 HA1‧‧‧Heating chamber section

HA2‧‧‧冷卻腔室部 HA2‧‧‧Cooling Chamber

DL‧‧‧鬆弛(遊隙) DL‧‧‧Slack (clearance)

IU‧‧‧照明機構 IU‧‧‧Lighting Agency

BT1、BT2、BT3‧‧‧處理槽 BT1, BT2, BT3 ‧‧‧ treatment tank

圖1係第1實施形態之基板處理裝置之主要部分之前視剖面圖。 Fig. 1 is a front sectional view of a main part of a substrate processing apparatus according to a first embodiment.

圖2係該基板處理裝置之剖面立體圖。 FIG. 2 is a sectional perspective view of the substrate processing apparatus.

圖3係光罩保持部之端部之主要部分詳細圖。 FIG. 3 is a detailed view of a main part of an end portion of the mask holding portion.

圖4係表示設置於光罩保持部之板彈簧之立體圖。 Fig. 4 is a perspective view showing a plate spring provided in a mask holding portion.

圖5係第2實施形態之光罩保持部之放大剖面圖。 Fig. 5 is an enlarged sectional view of a mask holding portion of a second embodiment.

圖6係第2實施形態之基板處理裝置之概略剖面圖。 Fig. 6 is a schematic sectional view of a substrate processing apparatus according to a second embodiment.

圖7係第3實施形態之基板處理裝置之外觀立體圖。 FIG. 7 is an external perspective view of a substrate processing apparatus according to a third embodiment.

圖8係該基板處理裝置之局部放大圖。 FIG. 8 is a partially enlarged view of the substrate processing apparatus.

圖9係第4實施形態之基板處理裝置之主要部分之前視剖面圖。 Fig. 9 is a front sectional view of a main part of a substrate processing apparatus according to a fourth embodiment.

圖10A係表示填隙片之端部之局部放大圖。 FIG. 10A is a partially enlarged view showing an end portion of the shims.

圖10B係表示填隙片之端部之局部放大圖。 FIG. 10B is a partially enlarged view showing an end portion of the shim.

圖10C係表示填隙片之端部之局部放大圖。 Fig. 10C is a partially enlarged view showing an end portion of the shims.

圖11係轉動體與壓印滾筒體之抵接部之局部放大圖。 FIG. 11 is a partial enlarged view of the abutting portion of the rotating body and the impression cylinder body.

圖12係第5實施形態之基板處理裝置之主要部分之前視剖面圖。 Fig. 12 is a front sectional view of a main part of a substrate processing apparatus according to a fifth embodiment.

圖13係第6實施形態之基板處理裝置之概略構成圖。 Fig. 13 is a schematic configuration diagram of a substrate processing apparatus according to a sixth embodiment.

圖14係該基板處理裝置之主要部分之前視剖面圖。 FIG. 14 is a front sectional view of a main part of the substrate processing apparatus.

圖15係該基板處理裝置之變形例之概略構成圖。 FIG. 15 is a schematic configuration diagram of a modified example of the substrate processing apparatus.

圖16係第7實施形態之基板處理裝置之主要部分之前視剖面圖。 Fig. 16 is a front sectional view of a main part of a substrate processing apparatus according to a seventh embodiment.

圖17係構成該基板處理裝置之光罩單元之前視圖 FIG. 17 is a front view of a mask unit constituting the substrate processing apparatus

圖18係光罩單元之端部之局部放大圖。 Fig. 18 is a partially enlarged view of an end portion of the photomask unit.

圖19係表示元件製造系統之構成之圖。 FIG. 19 is a diagram showing the configuration of a component manufacturing system.

圖20係該基板處理裝置之變形例之主要部分之前視剖面圖。 FIG. 20 is a front sectional view of a main part of a modification of the substrate processing apparatus.

圖21係第8實施形態之基板處理裝置之主要部分之前視剖面圖。 Fig. 21 is a front sectional view of a main part of a substrate processing apparatus according to an eighth embodiment.

圖22係該基板處理裝置之剖面立體圖。 FIG. 22 is a sectional perspective view of the substrate processing apparatus.

圖23係光罩單元之端部之主要部分詳細圖。 Fig. 23 is a detailed view of a main part of an end portion of the photomask unit.

圖24係表示設置於光罩單元之板彈簧之立體圖。 Fig. 24 is a perspective view showing a leaf spring provided in a mask unit.

圖25係表示該板彈簧之詳細情況之圖。 Fig. 25 is a view showing the details of the leaf spring.

圖26係表示伸縮容許部之變形例之圖。 FIG. 26 is a diagram showing a modified example of the telescopic allowable portion.

圖27係表示使光罩之外周面之周邊速度與基板之外周面之周邊速度一致為 相同速度之一例之圖。 Fig. 27 is a diagram showing an example in which the peripheral speed of the outer peripheral surface of the photomask and the peripheral speed of the outer peripheral surface of the substrate are made the same.

(第1實施形態) (First Embodiment)

以下，參照圖1至圖4，對本發明之基板處理裝置之第1實施形態進行說明。 Hereinafter, a first embodiment of a substrate processing apparatus according to the present invention will be described with reference to FIGS. 1 to 4.

圖1係基板處理裝置100之主要部分之前視剖面圖，圖2係基板處理裝置之剖面立體圖。 FIG. 1 is a front sectional view of a main part of the substrate processing apparatus 100, and FIG. 2 is a sectional perspective view of the substrate processing apparatus.

基板處理裝置100係將具有可撓性之片狀之光罩M之圖案相對於帶狀之基板(例如，帶狀之膜構件)S進行曝光處理者，且以照明部10、光罩保持部20、壓印滾筒體(基板保持部、環繞保持部)30、及控制部CONT作為主體而構成。再者，於本實施形態中，將鉛垂方向設為Z方向，將與光罩保持部20及基板支承部30之旋轉軸線平行之方向設為Y方向，將與Z方向及Y方向正交之方向設為X方向而進行說明。 The substrate processing apparatus 100 is a person who exposes a pattern of a flexible sheet-shaped mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and uses the illumination portion 10 and the mask holding portion. 20. The imprint cylinder (the substrate holding portion and the surrounding holding portion) 30 and the control portion CONT are mainly constituted. In the present embodiment, the vertical direction is set to the Z direction, and the direction parallel to the rotation axes of the mask holding portion 20 and the substrate support portion 30 is set to the Y direction, which is orthogonal to the Z direction and the Y direction. The direction will be described as the X direction.

照明部10係朝向捲繞於光罩保持部20上之光罩M之照明區域照射照明光者，可使用與螢光燈同樣地以直管型且呈放射狀發出曝光用之照明光者、或自圓筒狀之石英棒之兩端導入照明光且於背面側設置有擴散構件者，並將其收容於支承光罩保持部20之內筒21之內部空間內。 The illuminating unit 10 is a person who irradiates the illuminating light toward the illuminating area of the reticle M wound around the reticle holding portion 20, and can use a straight tube-shaped and radiating illuminating light for exposure similarly to a fluorescent lamp, Alternatively, a person who introduces illumination light from both ends of a cylindrical quartz rod and is provided with a diffusing member on the back side, and accommodates it in the inner space of the inner tube 21 supporting the mask holding portion 20.

光罩保持部20具備：圓筒狀之保持部本體22、分別設置於保持部本體22之長度方向兩端部之保持具23、及透過板彈簧(伸縮吸收部)24而安裝於各保持具23上之轉動體(間距形成部)25。該等保持部本體22、保持具23、板彈簧24、轉動體25係呈一體化之狀態而設置，又，分別形成有於旋轉軸線AX1方向連通而供內筒21插通之貫通孔。 The photomask holding portion 20 includes a cylindrical holding portion body 22, holders 23 provided at both ends in the longitudinal direction of the holding portion body 22, and a plate spring (telescopic absorbing portion) 24 attached to each holder. Rotating body (pitch forming portion) 25 on 23. The holding body 22, the holder 23, the plate spring 24, and the rotating body 25 are provided in an integrated state, and through holes are formed in the rotation axis AX1 to communicate with the inner tube 21, respectively.

內筒21係由可使照明光透過之圓筒狀之石英等、或者具備供來自照明部10之照明光通過之狹縫狀之開口部21a的圓筒狀之陶瓷材料或金屬等形成。保持部本體22於其外周面形成有沿著既定半徑之圓筒面保持光罩M之光罩保 持面22a。保持具23係由金屬材料形成為圓環狀，如圖3所示，藉由硬化後表現彈性接著性能之接著劑23a與保持部本體22之端部外周面接著。作為保持具23之形成材料，較佳為具有與保持部本體22相同之線膨脹係數者，但於線膨脹係數存在差之情形時，設為線膨脹係數較大之保持具23自外周側保持保持部本體22之構成，以便不因保持部本體22與保持具23之熱膨脹之差而對保持部本體22施加較大之負載。 The inner tube 21 is formed of a cylindrical quartz or the like through which illumination light is transmitted, or a cylindrical ceramic material or metal having a slit-shaped opening portion 21a through which the illumination light from the illumination portion 10 passes. The holding portion main body 22 has a mask holding surface 22a formed on the outer peripheral surface thereof to hold the mask M along a cylindrical surface of a predetermined radius. The holder 23 is formed in a ring shape from a metal material, and as shown in FIG. 3, an adhesive 23 a that exhibits elastic adhesive properties after curing is adhered to the outer peripheral surface of the end portion of the holder portion 22. As the forming material of the holder 23, it is preferable to have the same linear expansion coefficient as that of the holding body 22, but when there is a difference in the linear expansion coefficient, it is assumed that the holder 23 having a larger linear expansion coefficient is held from the outer peripheral side. The structure of the holding portion body 22 is such that a large load is not applied to the holding portion body 22 due to the difference in thermal expansion between the holding portion body 22 and the holder 23.

轉動體25於外周側具有繞旋轉軸線AX1突設之壓印滾筒設置部25a，藉由使該壓印滾筒設置部25a與壓印滾筒體30之外周面接觸(摩擦係合)，從而轉動體25繞軸線AX1轉動。 The rotating body 25 has an impression cylinder setting portion 25a projecting around the rotation axis AX1 on the outer peripheral side. The impression cylinder setting portion 25a is brought into contact with the outer peripheral surface of the impression cylinder body 30 (friction engagement) to thereby rotate the body. 25 rotates about the axis AX1.

壓印滾筒設置部25a之外徑形成為較保持於保持部本體22之光罩保持面22a上之光罩M之外側之面所構成之外徑大既定量。具體而言，壓印滾筒設置部25a之外徑係形成為如下之值，即，於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面時，在保持於壓印滾筒體30上之基板S與光罩M之間如圖3所示般形成既定量之間距G。 The outer diameter of the impression cylinder setting portion 25 a is formed to be larger than the outer diameter of the mask M held on the mask holding surface 22 a of the holding portion body 22 by a surface having a larger outer diameter. Specifically, the outer diameter of the impression cylinder setting portion 25 a is formed to have a value such that when the impression cylinder setting portion 25 a abuts the outer peripheral surface of the impression cylinder body 30, it is held on the impression cylinder body 30. A predetermined distance G is formed between the upper substrate S and the photomask M as shown in FIG. 3.

又，轉動體25係於內周側透過空氣軸承(air bearing)26相對於內筒21繞旋轉軸線AX1以非接觸之方式旋轉自如地受到支承。因此，保持部本體22、保持具23、板彈簧24、轉動體25繞旋轉軸線AX1一體地旋轉。 The rotating body 25 is rotatably supported in a non-contact manner around the rotation axis AX1 with respect to the inner cylinder 21 through an air bearing 26 on the inner peripheral side. Therefore, the holding body 22, the holder 23, the plate spring 24, and the rotating body 25 are integrally rotated around the rotation axis AX1.

板彈簧24係吸收保持部本體22之旋轉軸線AX1之伸縮者，如圖4所示，以例如鋼材形成為環狀(圓環狀)。如圖3所示，板彈簧24係透過間隔件(spacer)24A於Y方向留出既定量之間隙而固定於轉動體25上。同樣地，板彈簧24係透過間隔件24B於Y方向留出既定量之間隙而固定於保持具23上。間隔件24A係於距旋轉軸線AX1之距離大致相同之位置上，繞旋轉軸線AX1以等間隔設置有3個。間隔件24B係於距旋轉軸線AX1之距離大於間隔件24A之位置上，以繞旋轉軸線AX1之位置處於間隔件24A之間之方式以等間隔設置有3個。 The leaf spring 24 is a retractor that absorbs the rotation axis AX1 of the holding portion main body 22 and is formed into a ring shape (annular shape) made of steel, for example, as shown in FIG. 4. As shown in FIG. 3, the leaf spring 24 is fixed to the rotating body 25 by leaving a predetermined amount of gap in the Y direction through a spacer 24A. Similarly, the leaf spring 24 is fixed to the holder 23 by leaving a predetermined amount of gap in the Y direction through the spacer 24B. The spacers 24A are located at substantially the same distance from the rotation axis AX1, and three spacers 24A are provided at equal intervals around the rotation axis AX1. The spacers 24B are located at a distance from the rotation axis AX1 larger than the spacer 24A, and three spacers 24B are provided at equal intervals so that the position around the rotation axis AX1 is between the spacers 24A.

因此，透過板彈簧24而連結之保持具23(保持部本體22)與轉動體25成為如下構成：於繞旋轉軸線AX1之方向以較高之剛性結合而一體地旋轉，於旋轉軸線AX1方向，由於板彈簧24容易彈性變形，故而成為較低之剛性之結合而可相對移動(微動)。 Therefore, the holder 23 (holding part body 22) and the rotating body 25 connected through the leaf spring 24 are configured to rotate integrally with a high rigidity in the direction around the rotation axis AX1, and in the direction of the rotation axis AX1, Since the leaf spring 24 is easily deformed elastically, it becomes a combination of relatively low rigidity and can relatively move (move).

內筒21係透過板彈簧28而載置於自於Y方向留出間隔而設置之基座部B向互相接近之方向延伸設置之支承台27上。板彈簧28之彈簧常數係根據光罩保持部20之自重及透過轉動體25對壓印滾筒體30施加之負載、即轉動體25之壓印滾筒設置部25a於壓印滾筒體30之外周面上轉動時之摩擦力而設定。於內筒21之內部空間配設有上述照明部10，於在照明部10之照明光出射方向對向之位置上形成有於Y方向細長之狹縫狀之開口部21a，以便使照明光通過(參照圖1及圖2)。 The inner cylinder 21 is placed on a support base 27 provided in a direction in which the base portion B provided in the Y-direction is spaced apart from each other through a leaf spring 28. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 on the outer peripheral surface of the impression cylinder body 30. Set the friction force when turning up. The above-mentioned lighting section 10 is arranged in the inner space of the inner tube 21, and a slit-shaped opening 21a elongated in the Y direction is formed at a position opposite to the direction in which the lighting light exits from the lighting section 10 so that the lighting light can pass therethrough. (See Figures 1 and 2).

壓印滾筒體30係形成為繞與Y軸平行且設定於旋轉軸線AX1之-Z側之旋轉軸線AX2旋轉(環繞)之圓柱狀，如圖2所示，於內部設置有中空部30a且以慣性力矩變小之方式設定。壓印滾筒體30之外周面設為接觸保持基板S之基板保持面31。該保持面31較佳為經鏡面研磨之金屬表面，但為了提高與基板S之摩擦力而抑制滑動，亦可為使厚度均均之較薄之橡膠片材、樹脂片材等被覆於全周而成者。 The impression cylinder body 30 is formed into a cylindrical shape that rotates (circles) around a rotation axis AX2 that is parallel to the Y axis and set on the -Z side of the rotation axis AX1. As shown in FIG. 2, a hollow portion 30a is provided inside and Set in such a way that the moment of inertia becomes smaller. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. The holding surface 31 is preferably a mirror-polished metal surface, but in order to increase the friction with the substrate S to suppress sliding, it can also be formed by covering the entire circumference with a relatively thin rubber sheet, resin sheet, etc. By.

於壓印滾筒體30之Y方向兩端面上，直徑較壓印滾筒體30小且以同軸突出之旋轉支承部32繞旋轉軸線AX2旋轉自如地支承於基座部B。又，於本實施形態中，設置有藉由旋轉驅動壓印滾筒體30而使壓印滾筒體30與光罩保持部20同步地旋轉之驅動裝置33。 On the both end surfaces in the Y direction of the impression cylinder body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and protruding coaxially is rotatably supported on the base portion B about a rotation axis AX2. Further, in this embodiment, a driving device 33 is provided that rotates the impression cylinder body 30 in synchronization with the mask holding portion 20 by rotationally driving the impression cylinder body 30.

基板S係以具有可撓性之方式形成。此處，所謂可撓性係指即使對基板施加自重程度之力亦不會斷線或破斷，而可使該基板撓曲之性質。又，藉由自重程度之力而彎曲之性質亦包含於可撓性。又，上述可撓性根據該基板 之材質、大小、厚度、或者溫度或濕度等環境等而改變。再者，作為基板S，既可使用1片帶狀之基板，亦可設為將複數片單位基板連接而形成為帶狀之構成。 The substrate S is formed in a flexible manner. Here, the term "flexible" refers to a property that the substrate can be flexed without being disconnected or broken even when a force of a self-weight is applied to the substrate. In addition, the property of bending by the force of the weight is included in the flexibility. The flexibility described above varies depending on the material, size, thickness, or environment such as temperature and humidity of the substrate. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.

作為基板S，例如可使用樹脂膜或不鏽鋼等箔(foil)。例如，樹脂膜可使用聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯共聚物樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、醋酸乙烯酯樹脂等材料。基板S較佳為熱膨脹係數較小者以確保即使受到例如200℃左右之熱尺寸亦不會改變。例如，可將無機填料混合於樹脂膜中而減小熱膨脹係數。作為無機填料之例，可列舉氧化鈦、氧化鋅、氧化鋁、氧化矽等。基板S之寬度方向(短邊方向)之尺寸係形成為例如1m~2m左右，長度方向(長邊方向)之尺寸係形成為例如10m以上。當然，該尺寸僅為一例，並不限定於此。例如基板S之Y方向之尺寸亦可為1m以下或50cm以下，或亦可為2m以上。又，基板S之X方向之尺寸亦可為10m以下。 As the substrate S, for example, a foil such as a resin film or stainless steel can be used. For example, as the resin film, polyethylene resin, polypropylene resin, polyester resin, ethylene-ethylene copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, poly Materials such as styrene resin and vinyl acetate resin. The substrate S is preferably one having a small thermal expansion coefficient to ensure that the size does not change even when subjected to, for example, a temperature of about 200 ° C. For example, the inorganic filler may be mixed in a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. The dimension of the substrate S in the width direction (short side direction) is, for example, about 1 to 2 m, and the dimension in the length direction (long side direction) is, for example, 10 m or more. Of course, this size is only an example, and it is not limited to this. For example, the dimension in the Y direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. The dimension in the X direction of the substrate S may be 10 m or less.

其次，對上述構成之基板處理裝置100之動作進行說明。 Next, the operation of the substrate processing apparatus 100 configured as described above will be described.

透過空氣軸承26而由內筒21支承、且保持光罩M之光罩保持部20於透過轉動體25之壓印滾筒設置部25a對壓印滾筒體30賦予該光罩保持部20之自重與同板彈簧28之彈簧常數相應之朝向+Z側(上方)之賦能力之差量之負載的狀態下抵接。藉此，在光罩保持面22a與基板保持面31之間、即光罩M與基板S之間，形成與壓印滾筒設置部25a之外徑相應之既定量之間距。再者，於調整壓印滾筒設置部25a對壓印滾筒體30賦予之負載時，只要更換為具有對應之彈簧常數之板彈簧28，或於在內筒21與支承台27之間預先***有間隔件之狀態下設置板彈簧28而更換為與壓印滾筒設置部25a對壓印滾筒體30賦予之負載相應之間隔件即可。 The mask holding portion 20 supported by the inner cylinder 21 through the air bearing 26 and holding the mask M, and the impression cylinder setting portion 25 a passing through the rotating body 25 imparts the weight and weight of the mask holding portion 20 to the impression cylinder body 30. It is abutted in a state of a load corresponding to the spring constant of the leaf spring 28 toward the + Z side (upper side) with a difference in the energizing capacity. Thereby, a predetermined distance is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the photomask M and the substrate S, according to the outer diameter of the impression cylinder setting portion 25a. In addition, when adjusting the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a, it is only necessary to replace it with a plate spring 28 having a corresponding spring constant, or insert it between the inner cylinder 21 and the support table 27 in advance. In the state of the spacer, the plate spring 28 may be provided and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

其次，壓印滾筒體30藉由驅動裝置33之驅動而繞旋轉軸線AX2旋轉，並且自照明部10照射照明光，透過開口部21a透過保持部本體22，而自內周側對光罩M進行照明。伴隨著壓印滾筒體30之旋轉，捲繞於壓印滾筒體30之基 板保持面31上而保持之基板S以既定之速度被搬送，並且帶動透過壓印滾筒設置部25a而抵接於壓印滾筒體30之外周面之轉動體25旋轉。藉此，保持於光罩保持部20上之光罩M與基板S以維持為既定量之近接式間距(proximity gap)G之狀態同步地移動。其次，由照明光照明之光罩M之圖案影像被逐次投影至基板S之投影區域。 Next, the impression cylinder body 30 is rotated around the rotation axis AX2 by the drive of the driving device 33, and illuminating light is irradiated from the illuminating section 10, through the opening section 21a, and through the holding section body 22, and the photomask M is performed from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S wound around the substrate holding surface 31 of the impression cylinder body 30 is carried at a predetermined speed, and is driven to pass through the impression cylinder setting portion 25a to abut the pressure. The rotating body 25 on the outer peripheral surface of the drum body 30 rotates. As a result, the mask M held on the mask holding portion 20 and the substrate S are moved in synchronization with the state where the proximity gap G is maintained at a predetermined amount. Second, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

此時，為了使壓印滾筒設置部25a與基板保持面31抵接之位置(直徑)上周邊速度變得相同，且為了儘量使光罩M與基板S之相對移動速度一致，光罩保持部20及壓印滾筒體30係根據光罩M之外周面之位置(直徑)及基板S之外周面之位置(直徑)、光罩M之厚度Mt及基板S之厚度St、保持部本體22之光罩保持面22a上之半徑r11、壓印滾筒體30之基板保持面31上之半徑r2之比等而進行調整。 At this time, in order to make the peripheral speed at the position (diameter) where the impression cylinder setting portion 25a is in contact with the substrate holding surface 31 the same, and to make the relative movement speed of the photomask M and the substrate S as uniform as possible, the photomask holding portion 20 and the impression cylinder body 30 are based on the position (diameter) of the outer peripheral surface of the photomask M and the position (diameter) of the outer peripheral surface of the substrate S, the thickness Mt of the photomask M, the thickness St of the substrate S, and the holding portion body 22 The ratio of the radius r11 on the mask holding surface 22a, the radius r2 on the substrate holding surface 31 of the impression cylinder body 30, and the like are adjusted.

因此，必須不使壓印滾筒體30之基板保持面31中壓印滾筒設置部25a之外周面所抵接之部分之半徑與保持基板S之部分之半徑如圖3所示般相同，而有意地使其等不同。具體而言，將壓印滾筒設置部25a之外周面與壓印滾筒體30之外周面抵接之Z方向之位置(直徑)設定於光罩M之外周面與基板S之外周面之間之間距G之中間周邊。因此，只要使與壓印滾筒設置部25a之外周面抵接之壓印滾筒體30之外周面部分之半徑相對於半徑r2增大St+G/2左右即可。因此，例如，於基板S之厚度St為200μm、間距G為100μm之情形時，與壓印滾筒設置部25a之外周面抵接之壓印滾筒體30之外周面部分之半徑只要相對於半徑r2增大約250μm即可。 Therefore, the radius of the portion abutting the outer peripheral surface of the impression cylinder setting portion 25a of the substrate holding surface 31 of the impression cylinder body 30 and the radius of the portion holding the substrate S must not be the same as shown in FIG. Make it different. Specifically, the position (diameter) in the Z direction where the outer peripheral surface of the impression cylinder setting portion 25a abuts the outer peripheral surface of the impression cylinder body 30 is set between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S. The middle perimeter of the gap G. Therefore, the radius of the outer peripheral surface portion of the impression cylinder body 30 that is in contact with the outer peripheral surface of the impression cylinder installation portion 25 a may be increased by approximately St + G / 2 relative to the radius r2. Therefore, for example, in the case where the thickness St of the substrate S is 200 μm and the pitch G is 100 μm, the radius of the outer peripheral portion of the impression cylinder body 30 that is in contact with the outer peripheral surface of the impression cylinder setting portion 25a is only required to be relative to the radius r2. The increase is about 250 μm.

若連續地進行上述曝光處理，則由照明光照明之保持部本體22中可能產生熱膨脹。關於保持部本體22之直徑方向(周向)之熱膨脹，藉由使自外周側保持保持部本體22之保持具23由金屬材料形成且使線膨脹係數大於保持部本體22之線膨脹係數，而不約束保持部本體22，故而可避免對保持部本體 22賦予過剩之應力。又，此時，雖然保持部本體22與保持具23沿著分離之方向熱膨脹，但由於接著劑23a具備彈性接著性能，故而亦可防止保持具23對保持部本體22之保持鬆弛。 If the above-mentioned exposure processing is performed continuously, thermal expansion may occur in the holding portion body 22 illuminated by the illumination light. Regarding the thermal expansion in the diameter direction (circumferential direction) of the holding portion body 22, the linear expansion coefficient is larger than the linear expansion coefficient of the holding portion body 22 by forming the holder 23 holding the holding portion body 22 from the outer peripheral side with a metal material, and Since the holding portion body 22 is not restricted, it is possible to avoid giving an excessive stress to the holding portion body 22. At this time, although the holding portion main body 22 and the holder 23 are thermally expanded in the direction of separation, the adhesive 23a has elastic bonding performance, so the holding of the holding portion 23 to the holding portion main body 22 can be prevented from being loosened.

再者，於保持具23之線膨脹係數小於保持部本體22之線膨脹係數之情形時，較佳為採用保持具23自內周側保持保持部本體22之構成，但即使為自外周側進行保持之構成，亦可藉由上述接著劑23a產生彈性變形，而緩和於熱膨脹時對保持部本體22施加之應力。 When the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding portion body 22, it is preferable to adopt a configuration in which the holding portion 23 holds the holding portion body 22 from the inner peripheral side. The holding structure can also reduce the stress applied to the holding portion body 22 during thermal expansion by the elastic deformation of the adhesive 23a.

又，對於保持部本體22之旋轉軸線AX1方向之熱膨脹，板彈簧24以藉由間隔件24A而固定之部位為基點，使藉由間隔件24B而固定之部位沿著朝向轉動體25之方向彈性變形。如此，保持部本體22之熱膨脹作為板彈簧24之彈性變形而被吸收，故而可避免於保持部本體22產生旋轉軸線AX1方向之較大之應力。 In addition, for the thermal expansion in the direction of the rotation axis AX1 of the holding body 22, the plate spring 24 uses a portion fixed by the spacer 24A as a base point, so that the portion fixed by the spacer 24B is elastic in a direction toward the rotating body 25. Deformation. In this way, the thermal expansion of the holding part body 22 is absorbed as the elastic deformation of the leaf spring 24, so that a large stress in the direction of the rotation axis AX1 can be avoided in the holding part body 22.

如以上所說明般，於本實施形態中，藉由使於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面之轉動體25與壓印滾筒體30帶動旋轉，而可於光罩M與基板S維持著既定量之間距之狀態下實施曝光處理。因此，於本實施形態中，可防止因光罩M與基板S之間之間距量之變動而導致產生之圖案之像寬變動等。間距G之值可根據應曝光於基板S上之圖案(光罩M上之圖案)之最小尺寸、或來自照明部10之照明光之角度特性(開口數)等，而改變良好之範圍，但為數十μm~數百μm程度之範圍。 As described above, in the present embodiment, the rotating body 25 and the impression cylinder body 30 which are brought into contact with the outer surface of the impression cylinder body 30 by the impression cylinder setting portion 25a are rotated, and the light can be applied to the light. The exposure process is performed while maintaining the predetermined distance between the cover M and the substrate S. Therefore, in this embodiment, it is possible to prevent variations in the image width and the like of the pattern caused by the variation in the distance between the mask M and the substrate S. The value of the pitch G can be changed in a good range according to the minimum size of the pattern (pattern on the mask M) to be exposed on the substrate S, or the angular characteristics (the number of openings) of the illumination light from the illumination section 10, but It is in the range of several tens μm to several hundreds μm.

又，於本實施形態中，於直徑方向，使具備彈性接著性能之接著劑23a介於保持部本體22與保持具23之間，於旋轉軸線AX1方向，藉由板彈簧24產生彈性變形，而緩和伴隨著熱膨脹於保持部本體22中產生之應力，故而可減少該應力所導致之保持部本體22之變形，抑制對向基板S之圖案形成造成不良影響之情況(轉印忠實度之劣化等)。 Further, in this embodiment, the adhesive 23a having elastic adhesive properties is interposed between the holding portion body 22 and the holder 23 in the diameter direction, and is elastically deformed by the leaf spring 24 in the direction of the rotation axis AX1, and Alleviates the stress generated in the holding part body 22 due to thermal expansion, so that the deformation of the holding part body 22 caused by the stress can be reduced, and the situation that adversely affects the pattern formation to the substrate S is suppressed (deterioration of transfer fidelity, etc.) ).

於本實施形態之情形時，轉動體25係由金屬材料構成，但若其自身之材料之熱膨脹亦較大，則壓印滾筒設置部25a之直徑(全周長)會產生變化，故而較佳為設定為低熱膨脹金屬(鎳鋼等)、或設定為低熱膨脹率之陶瓷材料。 In the case of this embodiment, the rotating body 25 is made of a metal material, but if the thermal expansion of its own material is also large, the diameter (full perimeter) of the impression cylinder setting portion 25a will change, so it is preferable It is a ceramic material that is set to a low thermal expansion metal (such as nickel steel) or a low thermal expansion rate.

(第2實施形態) (Second Embodiment)

其次，參照圖5及圖6，對基板處理裝置100之第2實施形態進行說明。於上述第1實施形態中，作為於光罩保持面22a與基板保持面31之間形成間距之間距形成部，例示有具備壓印滾筒設置部25a之轉動體25，但於本實施形態中，對設置調整光罩保持部20相對於壓印滾筒體30之位置之驅動裝置之情形進行說明。又，於本實施形態中，設為將旋轉軸線AX1、AX2配置於同一XY平面上(光罩保持部20與壓印滾筒體30沿水平方向排列而配置)而進行說明。 Next, a second embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 5 and 6. In the first embodiment described above, as the gap forming portion that forms a gap between the mask holding surface 22a and the substrate holding surface 31, the rotating body 25 including the impression cylinder setting portion 25a is exemplified. However, in this embodiment, A case where a driving device for adjusting the position of the mask holding portion 20 relative to the impression cylinder body 30 is provided will be described. In the present embodiment, the rotation axes AX1 and AX2 are arranged on the same XY plane (the photomask holding portion 20 and the impression cylinder body 30 are arranged in a horizontal direction) and described.

於該等圖中，對與圖1至圖4所示之第1實施形態之構成要素相同之要素標註相同符號，而省略其說明。 In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and descriptions thereof are omitted.

圖5係光罩保持部20之放大剖面圖。 FIG. 5 is an enlarged sectional view of the mask holding portion 20.

光罩保持部20具備：保持部本體22；保持具23A，其具有以旋轉軸線AX1為軸線之貫通孔且透過接著劑23a自+Y側之端部內周側保持保持部本體22；保持具23B，其具有以旋轉軸線AX1為軸線之旋轉軸34且透過接著劑23a自-Y側之端部內周側保持保持部本體22；及終端筒36，其具有以旋轉軸線AX1為軸線之貫通孔，且透過空氣軸承35自外周側繞旋轉軸線AX1旋轉自如地支承保持具23A。光罩保持部20係藉由連接於旋轉軸34之驅動裝置MT而與壓印滾筒體30獨立地旋轉驅動。 The mask holding portion 20 includes a holding portion body 22 and a holder 23A having a through hole with the rotation axis AX1 as an axis and holding the holding portion body 22 from the inner peripheral side of the end portion from the + Y side through the adhesive 23a; the holder 23B It has a rotating shaft 34 with the rotation axis AX1 as the axis and holds the holding body body 22 at the inner peripheral side of the end from the -Y side through the adhesive 23a; and a terminal tube 36 having a through hole with the rotation axis AX1 as the axis, The air bearing 35 supports the holder 23A rotatably around the rotation axis AX1 from the outer peripheral side. The photomask holding portion 20 is rotationally driven independently of the impression cylinder body 30 by a driving device MT connected to a rotation shaft 34.

於保持部本體22之內部空間內，透過終端筒36及保持具23A之貫通孔而***有沿Y方向延伸之固定桿37，且一端部藉由固定板38而固定於終端筒36上。成為如下構成：於固定桿37上支承上述照明部10，並且自構成溫度調整裝置之供給部39A供給溫度調整用介質，且自排出部39B排出，藉此使溫度調整 用介質循環，從而有效率地抑制照明部10之溫度上升，並且調整保持部本體22之內部空間之溫度。 A fixing rod 37 extending in the Y direction is inserted into the inner space of the holding portion body 22 through the through hole of the terminal tube 36 and the holder 23A, and one end portion is fixed to the terminal tube 36 by a fixing plate 38. It has a structure in which the lighting unit 10 is supported on the fixed rod 37, and the temperature adjustment medium is supplied from the supply unit 39A constituting the temperature adjustment device, and is discharged from the discharge unit 39B, thereby circulating the temperature adjustment medium, thereby being efficient. The temperature of the lighting unit 10 is suppressed to be increased, and the temperature of the internal space of the holding unit body 22 is adjusted.

又，於本實施形態之基板處理裝置100中，作為間距形成部而設置有：測量部40，其測量光罩保持面22a與基板保持面31之間之間距量；及移位部41，其根據測量部40之測量結果使光罩保持部20向保持部本體22與壓印滾筒體30分離、接近之方向移位。 Moreover, in the substrate processing apparatus 100 of this embodiment, a measuring section 40 is provided as a pitch forming section, which measures a distance between the mask holding surface 22a and the substrate holding surface 31, and a displacement section 41, which According to the measurement result of the measurement section 40, the mask holding section 20 is displaced in a direction in which the holding section body 22 and the impression cylinder body 30 are separated and approached.

測量部40係由支承於固定桿37上之帶顯微鏡之CCD相機或光學焦距(高度測量)感測器等構成，藉由對壓印滾筒體30之基板保持面31上之與保持部本體22對向之位置(此處為X方向之位置)進行測距，而測量光罩保持面22a與基板保持面31之間之間距量，所測量出之間距量係輸出至控制部CONT。 The measurement section 40 is composed of a CCD camera with a microscope or an optical focal length (height measurement) sensor and the like, which is supported on a fixed rod 37. The distance measurement is performed on the facing position (here, the position in the X direction), and the distance between the mask holding surface 22a and the substrate holding surface 31 is measured. The measured distance is output to the control unit CONT.

移位部41係由驅動部44、驅動部47、及獨立地驅動驅動部44、47之上述控制部CONT構成，其中驅動部44透過空氣軸承42保持旋轉軸34，並且沿著於X方向延伸設置之導軌43於X方向驅動保持具23A；驅動部47保持終端筒36，並且沿著於X方向延伸設置之導軌46於X方向驅動終端筒36。 The displacement portion 41 is composed of a driving portion 44, a driving portion 47, and the above-mentioned control portion CONT that independently drives the driving portions 44, 47. The driving portion 44 holds the rotation shaft 34 through the air bearing 42 and extends along the X direction. The provided guide rail 43 drives the holder 23A in the X direction; the drive unit 47 holds the terminal barrel 36, and drives the terminal barrel 36 in the X direction along the guide rail 46 extending in the X direction.

如圖6所示，於較曝光區域更靠基板S之搬送方向之上游側，設置有複數個測量部50，該等測量部50具有與測量部40相同之構成，測量基板S之對準標記(alignment mark)(未圖示)。本實施形態中之測量部50係於基板S之搬送方向留出間隔而配設於3個部位，且於各部位於基板S之寬度方向留出間隔而配設有3個(參照圖7)，並將測量結果輸出至控制部CONT。 As shown in FIG. 6, a plurality of measurement sections 50 are provided on the upstream side of the substrate S in the conveying direction than the exposure area. These measurement sections 50 have the same configuration as the measurement section 40 and measure the alignment marks of the substrate S. (alignment mark) (not shown). In the present embodiment, the measurement sections 50 are arranged at three positions with a gap in the conveying direction of the substrate S, and three sections are arranged with a gap in the width direction of the substrate S (see FIG. 7). The measurement results are output to the control unit CONT.

於上述構成之基板處理裝置100中，根據測量部40所測量出之光罩保持面22a與基板保持面31之間之間距量，控制部CONT控制驅動部44、47之驅動而設為相同驅動量，藉此使光罩保持部20向相對於壓印滾筒體30分離、接近之方向移動而調整上述間距量。又，控制部CONT亦可藉由使驅動部44、47之驅動量不同，而對旋轉軸線AX1與旋轉軸線AX2之相對之傾斜進行微調。 In the substrate processing apparatus 100 configured as described above, based on the distance between the mask holding surface 22 a and the substrate holding surface 31 measured by the measurement section 40, the control section CONT controls the driving of the driving sections 44 and 47 to be the same driving. As a result, the mask holding portion 20 is moved in a direction away from and approaching the impression cylinder body 30 to adjust the above-mentioned pitch amount. In addition, the control unit CONT may finely adjust the relative inclination of the rotation axis AX1 and the rotation axis AX2 by making the driving amounts of the driving units 44 and 47 different.

又，根據利用測量部50所測量出之基板S之對準標記位置，控制部CONT預先測量曝光處理前之基板S上之曝光區域之面變形等，並將其反映於上述間距量調整、或旋轉軸線AX1與旋轉軸線AX2之相對傾斜調整上。 In addition, based on the alignment mark position of the substrate S measured by the measuring section 50, the control section CONT measures the surface deformation of the exposed area on the substrate S before the exposure process in advance, and reflects it on the above-mentioned pitch adjustment, or The relative tilt of the rotation axis AX1 and the rotation axis AX2 is adjusted.

如此，於本實施形態中，除了可獲得與上述第1實施形態相同之作用、效果以外，藉由使光罩保持部20移動，還可將光罩保持面22a與基板保持面31之間之間距量調整為任意之值。因此，於本實施形態中，即使於因溫度變化等環境變化而導致旋轉軸線AX1與旋轉軸線AX2之軸間距離產生變化、或者保持部本體22或壓印滾筒體30之直徑產生變動之情形時，抑或於光罩M、基板S之厚度因製造批次等而產生變動之情形等時，亦可容易地將光罩保持面22a與基板保持面31之間之間距量調整為既定量，從而可將光罩M之圖案以高精度曝光於基板S。 In this way, in this embodiment, in addition to obtaining the same functions and effects as in the first embodiment described above, by moving the mask holding portion 20, the distance between the mask holding surface 22a and the substrate holding surface 31 can be increased. The pitch amount is adjusted to an arbitrary value. Therefore, in this embodiment, even when the distance between the axis of rotation AX1 and the axis of rotation AX2 changes due to environmental changes such as temperature changes, or when the diameter of the holding portion body 22 or the impression cylinder body 30 changes, When the thicknesses of the mask M and the substrate S are changed due to manufacturing batches, etc., the distance between the mask holding surface 22a and the substrate holding surface 31 can be easily adjusted to a predetermined amount, thereby The pattern of the photomask M can be exposed on the substrate S with high accuracy.

(第3實施形態) (Third Embodiment)

其次，參照圖7及圖8，對基板處理裝置100之第3實施形態進行說明。於上述第2實施形態中，設為如下構成：控制驅動部44、47之驅動而使光罩保持部20移動，藉此調整光罩保持面22a與基板保持面31之間之間距量、即光罩M之外周面與基板S之外周面之間距G，但於本實施形態中，對在光罩保持部20與壓印滾筒體30之間設置襯墊部，藉由調整襯墊部之位置，而調整光罩保持面22a與基板保持面31之間之間距量之例進行說明。 Next, a third embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 7 and 8. In the second embodiment described above, it is configured to control the driving of the driving sections 44 and 47 to move the mask holding section 20, thereby adjusting the distance between the mask holding surface 22a and the substrate holding surface 31, that is, The distance G between the outer peripheral surface of the photomask M and the outer peripheral surface of the substrate S, but in this embodiment, a spacer portion is provided between the mask holding portion 20 and the impression cylinder body 30, and the distance between the spacer portion is adjusted by An example of adjusting the distance between the mask holding surface 22a and the substrate holding surface 31 will be described below.

於該等圖中，對與圖5及圖6所示之第2實施形態之構成要素相同之要素標註相同符號，而省略其說明。 In these drawings, the same components as those of the second embodiment shown in FIG. 5 and FIG. 6 are denoted by the same symbols, and descriptions thereof are omitted.

圖7所示之保持部本體22之設置於+Y側之端部之終端筒36支承於支承構件51A上。支承構件51A係以非接觸之方式移動自如地支承於在X方向延伸而設置於基座部B上之導引部52A上。又，支承構件51A藉由設置於+X側之空氣缸(air cylinder)(賦能部)53A以既定之賦能力向-X側賦能而被加壓。同樣 地，保持部本體22之-Y側之旋轉軸34透過空氣軸承42而支承於支承構件51B上。支承構件51B以非接觸之方式移動自如地支承於在X方向延伸而設置於基座部B上之導引部52B上。又，支承構件51B藉由設置於+X側之空氣缸(賦能部)53B以既定之賦能力向-X側賦能而被加壓。 A terminal tube 36 of an end portion of the holding portion body 22 shown in FIG. 7 provided on the + Y side is supported on the support member 51A. The support member 51A is movably supported in a non-contact manner on a guide portion 52A provided on the base portion B and extending in the X direction. In addition, the support member 51A is pressurized by an air cylinder (energizing section) 53A provided on the + X side with a predetermined energizing power to the -X side. Similarly, the rotation shaft 34 on the -Y side of the holding portion body 22 is supported by the support member 51B through the air bearing 42. The support member 51B is movably supported in a non-contact manner on a guide portion 52B provided in the base portion B and extending in the X direction. In addition, the support member 51B is pressurized by an air cylinder (energizing section) 53B provided on the + X side with a predetermined energizing power to the -X side.

基座部B係於Y方向留出間隔而設置，於較支承導引部52A、52B之區域更靠-X側具備較導引部52A、52B更向+Z側突出且支承壓印滾筒體30之支承壁54。於各支承構件51A、51B與支承壁54之間形成有於Z方向延伸之槽部55。 The base portion B is provided with a gap in the Y direction, and is located closer to the -X side than the area supporting the guide portions 52A and 52B. The base portion B protrudes to the + Z side than the guide portions 52A and 52B and supports the impression cylinder. 30 的 轴承 墙 54。 30 of the support wall 54. A groove portion 55 extending in the Z direction is formed between each of the support members 51A and 51B and the support wall 54.

如圖8所示，槽部55之X方向之寬度係以隨著朝向+Z方向而逐漸變大之方式，且以相對於YZ面具有略微之錐度之方式形成。更詳細而言，支承壁54之+X側之側面(形成槽部55之-X側之側面)係與YZ平面平行地形成，支承構件51A、51B之-X側之側面(形成槽部55之+X側之側面)係以隨著朝向+Z方向距支承壁54之+X側之側面之距離逐漸變大之方式相對於與YZ平面平行之面傾斜而形成。於該槽部55中，沿著Z方向移動自如地***有襯墊部56。 As shown in FIG. 8, the width in the X direction of the groove portion 55 is gradually increased as it goes toward the + Z direction, and is formed so as to have a slight taper with respect to the YZ plane. More specifically, the side surface on the + X side of the support wall 54 (the side surface on the −X side forming the groove portion 55) is formed parallel to the YZ plane, and the side surface on the −X side of the support members 51A and 51B (the groove portion 55 is formed) The side surface on the + X side) is formed to be inclined with respect to a plane parallel to the YZ plane as the distance from the side surface on the + X side of the support wall 54 in the + Z direction gradually increases. A pad portion 56 is inserted into the groove portion 55 so as to be movable along the Z direction.

如圖7所示，連接於旋轉軸34、且透過該旋轉軸34使光罩保持部20(即光罩M)旋轉之驅動裝置(第1調整部)MT係設置於可於Y方向移動之位移平台(第2調整部)48上。控制部CONT可藉由控制位移平台48之移動，而使光罩保持部20、光罩M及驅動裝置MT一體地沿Y方向移動。 As shown in FIG. 7, a driving device (first adjusting portion) MT connected to the rotation shaft 34 and rotating the mask holding portion 20 (that is, the mask M) through the rotation shaft 34 is provided in the Y-movable direction. Displacement platform (second adjustment section) 48. The control unit CONT controls the movement of the displacement platform 48 to move the mask holding unit 20, the mask M, and the driving device MT in the Y direction as a whole.

於上述構成之基板處理裝置100中，藉由空氣缸53A、53B向-X方向被加壓之支承構件51A、51B之傾斜(錐形)面抵接於***至槽部55中之襯墊部56而使移動受到限制，藉此規定支承構件51A、51B之X方向之位置。支承構件51A、51B之傾斜面抵接於襯墊部56之位置因襯墊部56之Z方向之位置而變動。因此，藉由調整襯墊部56之Z方向之位置，而可規定限制支承構件51A、51B之移動而定位之X方向之位置。 In the substrate processing apparatus 100 configured as described above, the inclined (tapered) surfaces of the support members 51A, 51B that are pressurized in the -X direction by the air cylinders 53A, 53B abut against the pad portion inserted into the groove portion 55. The movement of the support members 51A and 51B is regulated by restricting the movement thereof. The position where the inclined surfaces of the support members 51A and 51B abut the pad portion 56 varies depending on the position in the Z direction of the pad portion 56. Therefore, by adjusting the position in the Z direction of the pad portion 56, the position in the X direction that restricts the positioning of the support members 51A and 51B can be specified.

即，於本實施形態中，藉由調整襯墊部56之Z方向之位置，而可 調整支承於支承構件51A、51B上之光罩保持部20及光罩M之X方向之位置，結果可調整光罩保持面22a與基板保持面31之間之間距量(光罩M與基板S之間距G)。又，亦可藉由使限制支承構件51A、51B之移動之襯墊部56之Z方向之位置在支承構件51A與支承構件51B之間不同，而於與XY平面平行之面內微小地調整光罩保持部20之旋轉軸線AX1相對於Y軸之傾斜。 That is, in this embodiment, by adjusting the position in the Z direction of the pad portion 56, the positions in the X direction of the mask holding portion 20 and the mask M supported on the support members 51A and 51B can be adjusted. As a result, The distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask M and the substrate S) is adjusted. In addition, the position in the Z direction of the pad portion 56 that restricts the movement of the support members 51A and 51B may be different between the support member 51A and the support member 51B, and the light may be finely adjusted in a plane parallel to the XY plane. The rotation axis AX1 of the cover holding portion 20 is inclined with respect to the Y axis.

再者，亦可設為如下構成：本實施形態中之襯墊部56向Z方向之移動係例如於控制部CONT之控制下，根據測量部50之測量結果，利用馬達等驅動裝置而進行。 It is also possible to adopt a configuration in which the movement of the pad portion 56 in the Z direction in the present embodiment is performed, for example, under the control of the control unit CONT, based on the measurement result of the measurement unit 50, using a driving device such as a motor.

另一方面，根據利用測量部(檢測部)50測量出之基板S之對準標記位置，控制部CONT根據光罩M與基板S之繞旋轉軸線AX1之方向(周向)之相對位置關係控制驅動裝置MT之旋轉動作，而進行光罩M與基板S之繞旋轉軸線AX之方向(周向)之位置對準。又，控制部CONT根據所測量出之光罩M與基板S之旋轉軸線AX1方向(Y方向)之相對位置關係，透過位移平台48使光罩保持部20、光罩M及驅動裝置MT一體地沿Y方向(旋轉軸線AX1方向)移動，藉此進行光罩M與基板S之旋轉軸線AX1方向之位置對準。 On the other hand, based on the alignment mark position of the substrate S measured by the measurement section (detection section) 50, the control section CONT controls the relative positional relationship between the mask M and the substrate S in the direction (circumferential direction) about the rotation axis AX1 The rotation of the driving device MT aligns the positions of the mask M and the substrate S in the direction (circumferential direction) about the rotation axis AX. In addition, the control unit CONT integrates the mask holding unit 20, the mask M, and the driving device MT through the displacement stage 48 according to the relative positional relationship between the measured mask M and the rotation axis AX1 direction (Y direction) of the substrate S. By moving in the Y direction (direction of the rotation axis AX1), the position alignment of the mask M and the direction of the rotation axis AX1 of the substrate S is performed.

如此，於本實施形態中，除了上述光罩M與基板S之間距量以外，亦可容易地調整繞旋轉軸線AX1之方向之相對位置、及旋轉軸線AX1方向之相對位置。 As described above, in this embodiment, in addition to the distance between the mask M and the substrate S, the relative position in the direction about the rotation axis AX1 and the relative position in the direction of the rotation axis AX1 can be easily adjusted.

再者，於調整光罩M與基板S之繞旋轉軸線AX1、AX2之方向(周向)之相對位置時，除了控制驅動裝置MT之驅動之方法以外，例如，亦可設為如下構成：於構成光罩保持部20之保持部本體22或旋轉軸34等旋轉部分與支承構件51A、51B等固定部分之間設置電磁制動器(發電制動器)等，藉由電磁制動器之作動、作動停止對保持部本體22之旋轉力暫時賦予負載，而使旋轉力矩降低，藉此相對於基板S調整光罩M之繞旋轉軸線AX1之方向之相對位置(角度位置)。 In addition, when adjusting the relative position of the mask M and the substrate S in the directions (circumferential directions) about the rotation axes AX1 and AX2, in addition to the method of controlling the driving of the driving device MT, for example, it may be configured as follows: An electromagnetic brake (generator brake) or the like is provided between the rotating portion such as the holding portion body 22 or the rotating shaft 34 constituting the mask holding portion 20 and the fixed portions such as the support members 51A and 51B, and the holding portion is stopped by the operation and stop of the electromagnetic brake. The rotational force of the body 22 temporarily imparts a load to reduce the rotational torque, thereby adjusting the relative position (angular position) of the photomask M about the rotation axis AX1 with respect to the substrate S.

(第4實施形態) (Fourth Embodiment)

其次，參照圖9至圖11，對基板處理裝置100之第4實施形態進行說明。於上述第1實施形態中，設為如下構成：藉由轉動體25之壓印滾筒設置部25a抵接於壓印滾筒體30，而在光罩保持面22a與基板保持面31之間、即光罩M與基板S之間形成既定量之間距，但於本實施形態中，對根據基板S之厚度St適當地維持間距量G並且使光罩M與基板S之周邊速度一致之構成進行說明。 Next, a fourth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 9 to 11. In the above-mentioned first embodiment, it is configured as follows: the impression cylinder setting portion 25a of the rotating body 25 is in contact with the impression cylinder body 30, and between the mask holding surface 22a and the substrate holding surface 31, that is, A predetermined distance is formed between the photomask M and the substrate S, but in this embodiment, a configuration in which the distance G is appropriately maintained in accordance with the thickness St of the substrate S and the peripheral speed of the photomask M and the substrate S are consistent will be described. .

於該等圖中，對與圖1至圖4所示之第1實施形態之構成要素相同之要素標註相同符號，而省略其說明。 In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and descriptions thereof are omitted.

如圖9所示，本實施形態之整體構成與上文之圖1相同，但於本實施形態中，於在壓印滾筒體30之Y方向之兩側之外周面、或轉動體25之壓印滾筒設置部25a之外周面上呈環狀設置有既定厚度之填隙片(修正部)SM1、SM2之方面不同。 As shown in FIG. 9, the overall configuration of this embodiment is the same as that of FIG. 1 above, but in this embodiment, the outer peripheral surface on both sides in the Y direction of the impression cylinder body 30 or the pressure of the rotating body 25 The impression cylinder setting portion 25a is different in that the shim pieces (correction portions) SM1 and SM2 having a predetermined thickness are annularly provided on the outer peripheral surface.

如上文之圖3所示，若將轉動體25之壓印滾筒設置部25a之半徑設為r1，將壓印滾筒體30之基板保持面31之半徑設為r2，將光罩保持面22a之半徑設為r11，將光罩M之厚度設為Mt，將基板S之厚度設為St，將光罩M與基板S之既定之間距量設為G，則旋轉軸線AX1與旋轉軸線AX2之軸間距離DX由以下式(1)表示。 As shown in FIG. 3 above, if the radius of the impression cylinder setting portion 25a of the rotating body 25 is set to r1, the radius of the substrate holding surface 31 of the impression cylinder body 30 is set to r2, and the mask holding surface 22a The radius is set to r11, the thickness of the mask M is set to Mt, the thickness of the substrate S is set to St, and the predetermined distance between the mask M and the substrate S is set to G, then the axis of the rotation axis AX1 and the rotation axis AX2 The distance DX is expressed by the following formula (1).

DX=r11+Mt+G+St+r2…(1) DX = r11 + Mt + G + St + r2 ... (1)

因此，於壓印滾筒設置部25a在壓印滾筒體30之基板保持面31上轉動之情形時，壓印滾筒設置部25a之半徑r1可由下式(2)求出。 Therefore, when the impression cylinder setting portion 25a rotates on the substrate holding surface 31 of the impression cylinder body 30, the radius r1 of the impression cylinder setting portion 25a can be obtained from the following formula (2).

r1=DX-r2…(2) r1 = DX-r2 ... (2)

因此，若決定光罩M、基板S及間距G之值，則壓印滾筒設置部25a之半徑r1可使用具有根據上述式(1)、(2)所求出之值者。 Therefore, if the values of the photomask M, the substrate S, and the pitch G are determined, the radius r1 of the impression cylinder setting portion 25a can be the one having the values obtained by the above formulas (1) and (2).

然而，例如關於基板S，存在因批次不同等而導致使用不同厚度者之情形。該情況不僅存在於基板S，對於光罩M亦同樣可能發生。 However, regarding the substrate S, for example, there are cases where different thicknesses are used due to different batches. This situation may occur not only in the substrate S, but also in the mask M.

因此，於本實施形態中，成為如下構成：於轉動體25之壓印滾筒設置部25a與壓印滾筒體30之抵接部設置填隙片作為修正基板S或光罩M等之厚度之變化的修正部。 Therefore, in this embodiment, it has a structure in which a gap piece is provided in the abutting portion of the impression cylinder setting portion 25a of the rotating body 25 and the impression cylinder body 30 as a correction for changes in the thickness of the substrate S, the mask M, and the like Correction department.

即，如圖9所示，於壓印滾筒設置部25a之外周面上裝卸自如地設置有填隙片(修正部)SM1。又，於壓印滾筒體30之外周面上之與壓印滾筒設置部25a對向之位置上，裝卸自如地設置有填隙片(修正部)SM2。作為將填隙片SM1設為相對於壓印滾筒設置部25a之外周面裝卸自如之方法，可採用使填隙片SM1具備磁性部、使光罩保持部20(壓印滾筒設置部25a)具備激磁部之構成。 That is, as shown in FIG. 9, a shim (correction portion) SM1 is detachably provided on the outer peripheral surface of the impression cylinder setting portion 25 a. A gap filler (correction portion) SM2 is detachably provided at a position on the outer peripheral surface of the impression cylinder body 30 facing the impression cylinder installation portion 25a. As a method for detachably attaching the shim sheet SM1 to the outer peripheral surface of the impression cylinder setting portion 25a, the shim sheet SM1 may be provided with a magnetic portion and the reticle holding portion 20 (embossing cylinder setting portion 25a). Structure of the excitation section.

具體而言，可採用由磁性材料形成填隙片SM1之構成、於填隙片SM1之整個面或一部分形成包含磁性粉體等磁性材料之層之構成，且可採用由磁鐵形成壓印滾筒設置部25a之外周面之構成、於壓印滾筒設置部25a之外周面埋設磁鐵之構成。作為磁鐵，可配設永久磁鐵或電磁鐵。 Specifically, a structure in which the shim SM1 is formed of a magnetic material, a layer including a magnetic material such as a magnetic powder may be formed on the entire surface or a part of the shim SM1, and an embossing cylinder formed of a magnet may be used. The structure of the outer peripheral surface of the part 25a, and the structure of a magnet buried in the outer peripheral surface of the impression cylinder installation part 25a. As the magnet, a permanent magnet or an electromagnet can be provided.

作為將填隙片SM2設為相對於壓印滾筒體30之外周面裝卸自如之方法，可與填隙片SM1同樣地採用使填隙片SM2具備磁性部、使壓印滾筒體30具備激磁部之構成。 As a method for detachably attaching the shim sheet SM2 to the outer peripheral surface of the impression cylinder body 30, the shim sheet SM2 may be provided with a magnetic portion and the imprint cylinder body 30 may be provided with an excitation portion in the same manner as the shim piece SM1. Of the composition.

填隙片SM1係遍及壓印滾筒設置部25a之外周面之大致全周而設置。同樣地，填隙片SM2係遍及壓印滾筒體30(基板保持面31)之外周面之大致全周而設置。更詳細而言，填隙片SM1於捲繞在壓印滾筒設置部25a之外周面上時，具有於連接部形成間隙之長度，以便不使繞旋轉軸線AX1之方向之端部彼此重合而於直徑方向形成突部。而且，如圖10A所示，填隙片SM1之周長方向之兩端部係以沿相對於旋轉軸線AX1傾斜地交叉之方向延伸之間隙以固定寬度形成之方式，分別沿相同角度之傾斜方向形成。 The shim SM1 is provided over substantially the entire periphery of the outer peripheral surface of the impression cylinder setting portion 25a. Similarly, the shim SM2 is provided over substantially the entire periphery of the outer peripheral surface of the impression cylinder body 30 (the substrate holding surface 31). In more detail, when the shim SM1 is wound around the outer peripheral surface of the impression cylinder setting portion 25a, it has a length forming a gap at the connecting portion so that the ends in the direction around the rotation axis AX1 do not overlap with each other. A protrusion is formed in the diameter direction. Moreover, as shown in FIG. 10A, both end portions of the shim SM1 in the circumferential direction are formed in a fixed width so that the gaps extend in a direction obliquely intersecting with the rotation axis AX1, and are formed in inclined directions at the same angle, respectively. .

藉由該構成，即使於光罩保持部20及壓印滾筒體30旋轉而與壓印滾筒體30之接觸範圍Ta移動之情形時，填隙片SM1之一部分亦始終存在於接觸範圍Ta內， 從而防止因間隙之階差而導致於光罩保持部20與壓印滾筒體30之帶動旋轉時產生間距量之變動或振動等。再者，形成該間隙之端部之構成對於填隙片SM2亦相同。 With this configuration, even when the mask holding portion 20 and the impression cylinder body 30 rotate and the contact range Ta of the impression cylinder body 30 moves, a part of the interstitial sheet SM1 always exists in the contact range Ta. As a result, variations in the amount of pitch, vibration, or the like caused by the step rotation of the mask holding portion 20 and the impression cylinder body 30 due to the step difference are prevented. The configuration of the end portion forming the gap is the same for the shim SM2.

如上所述，為了保持圖11所示之光罩M與基板S之間距量G，填隙片SM1、SM2之厚度係根據基板S或光罩M之厚度而分別設定。於該情形時，壓印滾筒設置部25a之半徑r1係以可設置填隙片SM1、SM2之方式，設定得較距壓印滾筒體30之外周面之距離小。 As described above, in order to maintain the distance G between the mask M and the substrate S shown in FIG. 11, the thicknesses of the shims SM1 and SM2 are set according to the thickness of the substrate S or the mask M, respectively. In this case, the radius r1 of the impression cylinder setting portion 25a is set to be smaller than the distance from the outer peripheral surface of the impression cylinder body 30 so that the shim SM1 and SM2 can be provided.

因此，若將填隙片SM1、SM2之厚度分別設為t1、t2，則旋轉軸線AX1與旋轉軸線AX2之軸間距離DX由以下式(3)表示。 Therefore, if the thicknesses of the shims SM1 and SM2 are respectively t1 and t2, the distance DX between the rotation axis AX1 and the rotation axis AX2 is expressed by the following formula (3).

DX=r1+r2+t1+t2=r11+Mt+G+St+r2…(3) DX = r1 + r2 + t1 + t2 = r11 + Mt + G + St + r2 ... (3)

根據式(3)，填隙片SM1、SM2之厚度之合計由以下式(4)表示。 According to the formula (3), the total thickness of the shims SM1 and SM2 is expressed by the following formula (4).

t1+t2=r11+Mt+G+St-r1…(4) t1 + t2 = r11 + Mt + G + St-r1 ... (4)

而且，例如，於基板S之厚度St變為(St+α)之情形時，藉由將填隙片SM1、SM2之厚度之合計設為t1+t2+α，則即使於基板S之厚度產生變化之情形時亦可使間距量G保持固定。 Furthermore, for example, when the thickness St of the substrate S becomes (St + α), by setting the total thickness of the interstitial sheets SM1 and SM2 to t1 + t2 + α, even if the thickness of the substrate S is generated, It is also possible to keep the gap amount G constant in changing circumstances.

然而，光罩保持部20及壓印滾筒體30之周邊速度於填隙片SM1、SM2之抵接面tf上之位置(距旋轉軸線AX1、AX2之距離)相同，位於自該位置分離之位置上之光罩M之表面(以下稱為光罩面)之周邊速度、基板S之表面(以下稱為基板面)之周邊速度係根據各面距旋轉軸線AX1、AX2之距離而變化。因此，各填隙片SM1、SM2之厚度必須以光罩面及基板面之相對周邊速度相同之方式分別設定。 However, the peripheral speeds of the mask holding portion 20 and the impression cylinder body 30 are the same at the positions (distances from the rotation axes AX1 and AX2) on the abutment surface tf of the shim SM1, SM2, and are located apart from the positions. The peripheral speed of the upper surface of the mask M (hereinafter referred to as the mask surface) and the peripheral speed of the surface of the substrate S (hereinafter referred to as the substrate surface) are changed according to the distances of the surfaces from the rotation axes AX1 and AX2. Therefore, the thicknesses of each of the shims SM1 and SM2 must be separately set in such a manner that the relative peripheral speeds of the mask surface and the substrate surface are the same.

例如，將產生有變化之基板S之厚度設為St'(=St+α)，將與基板S之厚度St'相對應之填隙片SM1、SM2之厚度分別設為T1、T2，將光罩保持部20之角速度設為ω1，將壓印滾筒體30之角速度設為ω2，如上文中參考圖3所說明 般，於設為抵接面tf之位置位於光罩M之外周面與基板S之外周面之間、即間距G之大致中間之情形時，抵接面tf上之周邊速度相同，故而以下之式(5)成立。 For example, set the thickness of the substrate S that has changed to St '(= St + α), set the thickness of the interstitial sheets SM1 and SM2 corresponding to the thickness St' of the substrate S as T1, T2, and set the light The angular velocity of the mask holding portion 20 is set to ω1, and the angular velocity of the impression cylinder body 30 is set to ω2. As described above with reference to FIG. 3, the position set as the abutting surface tf is located on the outer peripheral surface of the mask M and the substrate S. In the case where the outer peripheral surfaces are substantially in the middle of the pitch G, the peripheral speeds on the abutting surface tf are the same, so the following formula (5) holds.

(r1+T1)．ω1=(r2+T2)．ω2…(5) (r1 + T1). ω1 = (r2 + T2). ω2 ... (5)

又，由於將光罩面之周邊速度與基板面之周邊速度設為相同，故而以下之式(6)成立。 In addition, since the peripheral speed of the mask surface and the peripheral speed of the substrate surface are the same, the following formula (6) holds.

(r11+Mt)．ω1=(r2+St')．ω2…(6) (r11 + Mt). ω1 = (r2 + St '). ω2 ... (6)

若對上述式(5)、(6)進行整理，則導出以下之式(7)。 When the expressions (5) and (6) are sorted, the following expression (7) is derived.

(r2+T2)/(r1+T1)=(r2+St')/(r11+Mt)…(7) (r2 + T2) / (r1 + T1) = (r2 + St ') / (r11 + Mt) ... (7)

進而，根據式(4)，以下之式(8)成立。 Furthermore, from the formula (4), the following formula (8) holds.

T1+T2=r11+Mt+G+St'-r1…(8) T1 + T2 = r11 + Mt + G + St'-r1 ... (8)

因此，於本實施形態中，藉由使用滿足式(7)、(8)之厚度T1、T2之填隙片SM1、SM2，即使於基板S之厚度產生變化之情形時，亦可一面保持光罩M之外周面與基板S之外周面之間距量，一面以光罩M之外周面與基板S之外周面之周邊速度相同之方式進行修正。又，於本實施形態中，由於填隙片SM1、SM2分別磁附於壓印滾筒設置部25a、壓印滾筒體30上，故而可結合基板S、或光罩M等之厚度變化而容易地進行更換，從而可謀求作業效率之提高。進而，於本實施形態中，由於填隙片SM1、SM2之端部間之間隙於與旋轉軸線AX1、AX2方向交叉之方向延伸，故而可防止於轉動時產生因階差而導致之間距變動或振動，從而可實施高精度之曝光處理。 Therefore, in this embodiment, by using the interstitial sheets SM1 and SM2 that satisfy the thicknesses T1 and T2 of the equations (7) and (8), even when the thickness of the substrate S changes, the light can be kept on one side The distance between the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S is corrected on one side so that the peripheral speed of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S are the same. In this embodiment, since the shims SM1 and SM2 are magnetically attached to the impression cylinder setting portion 25a and the impression cylinder body 30, respectively, the thickness can be easily combined with changes in the thickness of the substrate S, the photomask M, and the like. By performing replacement, the work efficiency can be improved. Furthermore, in this embodiment, since the gap between the end portions of the shims SM1 and SM2 extends in a direction intersecting with the directions of the rotation axes AX1 and AX2, it is possible to prevent the variation in the distance or the gap caused by the step difference during rotation. Vibration enables high-precision exposure processing.

再者，例示了沿傾斜方向形成上述第4實施形態中之填隙片SM1、SM2之端部之構成，但並不限定於此，只要端部間之間隙之至少一部分係沿著與旋轉軸線AX1、AX2方向交叉之方向形成即可，例如，如圖10B所示，亦可形成為如沿旋轉軸線AX1、AX2方向之間隙、及沿與旋轉軸線AX1、AX2方向正交之方向之間隙交替重複之階梯狀。 Furthermore, the configuration in which the end portions of the shims SM1 and SM2 in the above-mentioned fourth embodiment are formed along the oblique direction is exemplified, but it is not limited to this, as long as at least a part of the gap between the end portions is along the axis of rotation The directions in which the AX1 and AX2 directions intersect may be formed. For example, as shown in FIG. 10B, the clearances along the rotation axis AX1, AX2 direction, and the clearances in the direction orthogonal to the rotation axis AX1, AX2 direction may alternate. Repeating staircase.

又，即使於端部間之間隙係沿著旋轉軸線AX1、AX2方向而形成之情形時，如圖10C所示，亦可為如下構成：以間隙之位置於繞旋轉軸線AX1、AX2之方向不同之方式，於旋轉軸線AX1、AX2方向配置複數個填隙片。 In addition, even when the gap between the end portions is formed along the directions of the rotation axes AX1 and AX2, as shown in FIG. 10C, the configuration may be such that the position of the gap is different in the directions around the rotation axes AX1 and AX2. In this way, a plurality of shims are arranged in the directions of the rotation axes AX1 and AX2.

又，於上述實施形態中，使用以光罩面與基板面之相對周邊速度相同之方式設定填隙片SM1、SM2之厚度之例進行了說明，但例如，只要基板S之厚度變化為容許範圍內，則亦可設為使填隙片SM1、SM2之任一者之厚度固定，僅另一填隙片之厚度於填隙片更換時對應之構成。又，於基板S或光罩M之厚度未產生較大之變化之情形時，亦可設為於初始調整時之間距調整中藉由接著劑固定所需厚度之填隙片之構成。 Also, in the above embodiment, an example has been described in which the thicknesses of the shims SM1 and SM2 are set so that the relative peripheral speeds of the mask surface and the substrate surface are the same, but for example, as long as the thickness of the substrate S changes within an allowable range In addition, the thickness of any one of the shims SM1 and SM2 may be fixed, and only the thickness of the other shims is corresponding to the structure when the shims are replaced. In addition, when the thickness of the substrate S or the photomask M does not change greatly, it can also be set to have a gap filler sheet having a desired thickness fixed by an adhesive during the initial adjustment.

又，例如，於在前步驟中基板S於搬送方向伸縮之情形時，亦可調整填隙片SM1、SM2之厚度分配而有意地對光罩M之外周面與基板S之外周面之相對之周邊速度賦予差，以便修正基板S之伸縮。 In addition, for example, when the substrate S is expanded and contracted in the conveying direction in the previous step, the thickness distribution of the shims SM1 and SM2 may be adjusted to intentionally compare the outer peripheral surface of the mask M with the outer peripheral surface of the substrate S. The peripheral speed is given a difference so as to correct the expansion and contraction of the substrate S.

此處，於將圖11中之基板S之厚度St設為100μm，將間距G設為100μm，將包含填隙片SM1之厚度t1之壓印滾筒設置部25a之半徑(r1+t1)與包含填隙片SM2之厚度t2之壓印滾筒體30之半徑(r2+t2)均設為150mm，而且將抵接面tf上之周邊速度V0設為50mm/S之情形時，在抵接面tf位於間距G之中間(1/2)之條件下，光罩M之外周面與基板S之外周面一面保持間距G，一面均變為49.983mm/S之周邊速度，從而相對速度差為零。 Here, the thickness St of the substrate S in FIG. 11 is set to 100 μm, the pitch G is set to 100 μm, and the radius (r1 + t1) of the impression cylinder setting portion 25a including the thickness t1 of the interstitial sheet SM1 and the When the radius (r2 + t2) of the impression cylinder body 30 with the thickness t2 of the interstitial sheet SM2 is set to 150 mm, and the peripheral speed V0 on the contact surface tf is set to 50 mm / S, the contact surface tf Located at the middle (1/2) of the gap G, the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S are kept at a gap G, and both sides become peripheral speeds of 49.983 mm / S, so that the relative speed difference is zero.

根據將抵接面tf之位置(Z方向)設定於間距G內之何處，會產生周邊速度之略微之相對差，故而可使曝光於基板S上之圖案之周向之尺寸相對於光罩M上之圖案之周向之尺寸於某個範圍內擴展、收縮。於上述數值例之情形時，若將光罩M上之圖案之周長方向之尺寸設為750mm，則曝光於基板S上之圖案之搬送方向之尺寸最大可伸縮±500μm左右。 According to where the position (Z direction) of the contact surface tf is set within the gap G, there will be a slight relative difference in peripheral speed, so the size of the pattern exposed on the substrate S in the circumferential direction may be relative to the mask M. The size of the pattern in the circumferential direction expands and contracts within a certain range. In the case of the above numerical example, if the size of the pattern in the circumferential direction of the mask M is set to 750 mm, the size of the pattern in the transport direction of the pattern exposed on the substrate S can be extended up to ± 500 μm.

此種曝光圖案之伸縮修正亦被稱為掃描曝光方向(基板S之搬送方向)上之 相對倍率修正，於對形成於物理性之伸縮較大之樹脂性之基板S上之基底圖案進行準確之重合曝光之情形時，可藉由積極地活用該相對倍率修正，而進行與基底圖案一致之忠實之圖案轉印。 This kind of stretch pattern stretching correction is also called relative magnification correction in the scanning exposure direction (conveying direction of the substrate S). It accurately corrects the base pattern formed on the resinous substrate S which has a large physical stretch. In the case of overlapping exposures, faithful pattern transfer consistent with the base pattern can be performed by actively utilizing the relative magnification correction.

(第5實施形態) (Fifth Embodiment)

其次，參照圖12，對基板處理裝置100之第5實施形態進行說明。 Next, a fifth embodiment of the substrate processing apparatus 100 will be described with reference to FIG. 12.

於上述第4實施形態中，為藉由調整填隙片SM1、SM2之厚度而應對基板S等之厚度變化之構成，但於本實施形態中，對藉由使轉動體25於直徑方向彈性變形而應對基板S等之厚度變化之構成進行說明。 In the fourth embodiment described above, the thickness of the substrate S is changed by adjusting the thickness of the shims SM1 and SM2. However, in this embodiment, the rotating body 25 is elastically deformed in the diameter direction. The configuration of the thickness change of the substrate S and the like will be described.

於該圖中，對與圖9至圖11所示之第4實施形態之構成要素相同之要素標註相同符號，而省略其說明。 In this figure, the same components as those of the fourth embodiment shown in FIGS. 9 to 11 are denoted by the same reference numerals, and descriptions thereof will be omitted.

如圖12所示，於本實施形態之基板處理裝置100中，於保持保持部本體22之端部之保持具23與轉動體25之間設置有使轉動體25之壓印滾筒設置部25a之外周面移位之移位環61。移位環61設置有突部，該突部係繞旋轉軸線AX1而形成於與轉動體25對向之側，且具備隨著與轉動體25分離直徑逐漸擴大之斜面61a。而且，於轉動體25上設置有自外側嵌合於斜面61a之斜面25b。又，具備於旋轉軸線AX1方向自與移位環61為相反側係合於轉動體25之頭部62b、及繞與旋轉軸線AX1平行之軸與移位環61螺合之軸部62a的調整螺釘部(負載賦予部)62沿著與以軸線AX1為中心之XZ面平行之圓，以等角度間隔設置於複數個部位。於本實施形態中，為如下構成：藉由壓印滾筒設置部25a抵接於壓印滾筒體30之基板保持面31而使光罩保持部20與壓印滾筒體30帶動旋轉。 As shown in FIG. 12, in the substrate processing apparatus 100 according to this embodiment, between the holder 23 holding the end of the holding portion body 22 and the rotating body 25, one of the embossing cylinder setting portions 25 a for the rotating body 25 is provided. Displacement ring 61 for outer peripheral surface displacement. The displacement ring 61 is provided with a protrusion which is formed on the side opposite to the rotating body 25 around the rotation axis AX1 and includes a slope 61 a which gradually increases in diameter as it is separated from the rotating body 25. Furthermore, the rotating body 25 is provided with an inclined surface 25b fitted to the inclined surface 61a from the outside. In addition, adjustment is provided for the head portion 62b coupled to the rotating body 25 from the side opposite to the displacement ring 61 in the direction of the rotation axis AX1, and the shaft portion 62a screwed to the displacement ring 61 about an axis parallel to the rotation axis AX1. The screw portion (load applying portion) 62 is provided at a plurality of locations at equal angular intervals along a circle parallel to the XZ plane centered on the axis AX1. In this embodiment, the configuration is such that the mask holding portion 20 and the impression cylinder body 30 are rotated by the impression cylinder setting portion 25 a abutting the substrate holding surface 31 of the impression cylinder body 30.

於該圖12中，於調整光罩保持面22a與基板保持面31之間距量(光罩面與基板面之間距量G)時，例如，使調整螺釘62向軸部62a螺入至移位環61中之方向旋轉。由於調整螺釘62之頭部62b係合於移位環61，故而軸部62a以藉由向移位環61之螺入而沿與旋轉軸線AX1平行之軸向擴展之方式彈性變形。軸 部62a之彈性恢復力係作為向接近於移位環61之方向之負載透過頭部62b作用於轉動體25。 In FIG. 12, when adjusting the distance between the mask holding surface 22 a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface), for example, the adjustment screw 62 is screwed into the shaft portion 62 a to be displaced. The direction in the ring 61 rotates. Since the head portion 62b of the adjustment screw 62 is coupled to the displacement ring 61, the shaft portion 62a is elastically deformed so as to expand in the axial direction parallel to the rotation axis AX1 by screwing into the displacement ring 61. The elastic restoring force of the shaft portion 62a acts on the rotating body 25 through the head portion 62b as a load in a direction close to the displacement ring 61.

由於被施加有向接近於移位環61之方向之負載的轉動體25向斜面25b沿著移位環61之斜面61a而擴徑之方向移動，故而向接近於移位環61之方向之負載轉換為擴徑方向從而使壓印滾筒設置部25a彈性變形而擴徑。藉由壓印滾筒設置部25a擴徑，而可與擴徑之量相對應地擴大光罩保持面22a與基板保持面31之間距量(光罩面與基板面之間距量G)。此處，於擴徑之量過大之情形時，藉由使上述調整螺釘62向相反方向旋轉，從而軸部62a之彈性變形量變少，對轉動體25賦予之向接近於移位環61之方向之負載減少，藉此壓印滾筒設置部25a之擴徑量變小。 Since the rotating body 25 to which a load in the direction close to the displacement ring 61 is applied moves toward the inclined surface 25 b in the direction of the diameter expansion along the inclined surface 61 a of the displacement ring 61, the load is applied in the direction close to the displacement ring 61. By changing to the diameter expansion direction, the impression cylinder setting portion 25a is elastically deformed to expand the diameter. By increasing the diameter of the impression cylinder setting portion 25a, the distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface) can be increased in accordance with the amount of diameter expansion. Here, when the amount of diameter expansion is too large, by rotating the adjustment screw 62 in the opposite direction, the amount of elastic deformation of the shaft portion 62 a is reduced, and the direction given to the rotating body 25 is close to the direction of the displacement ring 61. The load is reduced, thereby reducing the diameter expansion amount of the impression cylinder setting portion 25a.

如此，於本實施形態中，藉由使調整螺釘62旋轉，而可根據向接近於移位環61之方向之負載、斜面61a、25b之角度調整壓印滾筒設置部25a擴徑之量，從而可容易地將光罩保持面22a與基板保持面31之間距量(光罩面與基板面之間距量G)調整為所需之值而形成。 Thus, in this embodiment, by rotating the adjusting screw 62, the amount of expansion of the impression cylinder setting portion 25a can be adjusted according to the load in the direction close to the displacement ring 61 and the angle of the inclined surfaces 61a and 25b, so that The distance between the mask holding surface 22a and the substrate holding surface 31 (the distance G between the mask surface and the substrate surface) can be easily adjusted to a desired value.

再者，於藉由調整螺釘62之旋轉而擴大壓印滾筒設置部25a之直徑之情形時，如上文之圖11所示，抵接面tf與光罩M之外周面之Z方向(直徑方向)之間隔產生變化，故而光罩M之外周面與基板S之外周面之相對周邊速度會產生差，因此較理想的是將此情況亦考慮在內而決定壓印滾筒設置部25a之直徑之擴大量。 Furthermore, when the diameter of the impression cylinder setting portion 25a is enlarged by the rotation of the adjustment screw 62, as shown in FIG. 11 above, the Z direction (diameter direction) of the abutment surface tf and the outer peripheral surface of the mask M ), The relative peripheral speed of the outer peripheral surface of the mask M and the outer peripheral surface of the substrate S will be different. Therefore, it is desirable to take this into consideration to determine the diameter of the impression cylinder setting portion 25a. Expand the amount.

再者，關於上述第5實施形態中所說明之調整螺釘62之旋轉，亦可採用如下構成：另外設置旋轉驅動裝置，根據應調整之間距量透過旋轉驅動裝置來控制調整螺釘62之旋轉量。又，作為使壓印滾筒設置部25a擴徑之方法，除了上述調整螺釘62以外，亦可設為使用壓電式(piezo)元件等壓電元件對轉動體25賦予旋轉軸線AX1方向之負載之構成。進而，除了上述將旋轉軸線AX1 方向之負載轉換為直徑方向之負載之構成以外，亦可設為以沿直徑方向移位之方式設置壓電元件，根據壓電元件之移位量使壓印滾筒設置部25a擴徑或縮徑之構成。 In addition, regarding the rotation of the adjustment screw 62 described in the fifth embodiment, a configuration may also be adopted in which a rotation drive device is additionally provided, and the rotation amount of the adjustment screw 62 is controlled by the rotation drive device according to the amount of adjustment to be adjusted. In addition, as a method of expanding the diameter of the impression cylinder setting portion 25a, in addition to the adjustment screw 62 described above, it is also possible to use a piezoelectric element such as a piezo element to apply a load in the direction of the rotation axis AX1 to the rotating body 25. Make up. Furthermore, in addition to the above-mentioned configuration in which the load in the direction of the rotation axis AX1 is converted into the load in the diameter direction, a piezoelectric element may be provided so as to be displaced in the diameter direction, and the impression cylinder may be made according to the displacement amount of the piezoelectric element. The installation portion 25a has a configuration in which the diameter is increased or decreased.

(第6實施形態) (Sixth embodiment)

其次，參照圖13及圖14，對基板處理裝置100之第6實施形態進行說明。 Next, a sixth embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 13 and 14.

於上述第1~第5實施形態中，設為曝光區域內之基板S係保持於壓印滾筒體30之外周面31上之構成進行了說明，但於本實施形態中，對使用以環形帶狀環繞之帶將基板S保持為平面狀之構成進行說明。 In the first to fifth embodiments described above, the structure in which the substrate S in the exposure area is held on the outer peripheral surface 31 of the impression cylinder 30 has been described. However, in this embodiment, the use of an endless belt is described. A configuration in which the substrate S is held in a flat shape by a belt surrounded by a shape will be described.

於該等圖中，對與圖1至圖12所示之上述實施形態之構成要素相同之要素標註相同符號，而省略其說明。 In these drawings, the same components as those in the above-described embodiment shown in FIG. 1 to FIG. 12 are denoted by the same symbols, and descriptions thereof are omitted.

本實施形態之基板處理裝置100具備供給基板S之基板供給部11、回收基板S之基板回收部12、及搬送基板S之基板搬送部90。基板供給部11將捲成例如輥狀之基板S送出而供給。於該情形時，於基板供給部11設置有捲繞基板S之軸部或使該軸部旋轉之旋轉驅動裝置等。此外，亦可為設置有覆蓋捲成例如輥狀之狀態之基板S之蓋部等之構成。再者，基板供給部11並不限定於將捲成輥狀之基板S送出之機構，只要為包含將帶狀之基板S沿其長度方向依序送出之機構者即可。 The substrate processing apparatus 100 according to this embodiment includes a substrate supply unit 11 that supplies a substrate S, a substrate recovery unit 12 that recovers the substrate S, and a substrate transfer unit 90 that transports the substrate S. The substrate supply unit 11 sends out and supplies the substrate S rolled into a roll shape, for example. In this case, the substrate supply portion 11 is provided with a shaft portion that winds the substrate S or a rotation driving device that rotates the shaft portion. In addition, a configuration may be provided in which a cover portion or the like covering the substrate S in a roll-shaped state is provided. In addition, the substrate supply unit 11 is not limited to a mechanism for sending out the substrate S rolled into a roll shape, and may include a mechanism for sequentially sending out the strip-shaped substrate S along its longitudinal direction.

基板回收部12將進行過曝光處理之基板S捲繞成例如輥狀而回收。與基板供給部11同樣地，於基板回收部12設置有用以捲繞基板S之軸部或使該軸部旋轉之旋轉驅動源、覆蓋所回收之基板S之蓋部等。再者，於在基板回收部12中將基板S切割成面板狀之情形等時，亦可為例如將基板S以重疊之狀態回收等以與捲成輥狀之狀態不同之狀態回收基板S之構成。 The substrate recovery unit 12 winds up the substrate S subjected to the exposure processing into, for example, a roll shape and recovers it. Similar to the substrate supply unit 11, the substrate recovery unit 12 is provided with a rotation driving source for winding or rotating the shaft portion of the substrate S, a cover portion that covers the recovered substrate S, and the like. In addition, when the substrate S is cut into a panel shape in the substrate recovery unit 12, for example, the substrate S may be recovered in an overlapped state, and the substrate S may be recovered in a state different from the state of being rolled into a roll. Make up.

基板搬送部90具有：複數個導輥R(於圖13中為2個)，其等導引自基板供給部11供給之基板S；及基板支承機構80，其支承基板S。基板支承機 構80係配置於導輥R之間。 The substrate transfer unit 90 includes a plurality of guide rollers R (two in FIG. 13) that guide the substrate S supplied from the substrate supply unit 11 and a substrate support mechanism 80 that supports the substrate S. The substrate supporting mechanism 80 is arranged between the guide rollers R.

基板支承機構80具有帶部(環形帶)81、帶搬送部82及導引平台(流體支承部)83。又，於基板支承機構80中，雖省略了圖示，但設置有清洗帶部81之帶清洗部、及去除帶部81之靜電之靜電去除部等。 The substrate support mechanism 80 includes a belt portion (an endless belt) 81, a belt transfer portion 82, and a guide platform (fluid support portion) 83. In addition, although the illustration is omitted in the substrate supporting mechanism 80, a belt cleaning section of the cleaning belt section 81, a static electricity removing section for removing static electricity from the belt section 81, and the like are provided.

帶部81係例如使用不鏽鋼等金屬材料而形成為環狀。 The belt portion 81 is formed in a ring shape using, for example, a metal material such as stainless steel.

帶部81藉由設置於外側之支承面(基板保持面)81a自背面側支承基板S。於帶部81上遍及一周設置有沿周向排列而配置之複數個貫通孔(未圖示)。各貫通孔係貫通帶部81之支承面81a與設置於該支承面81a之背面側之背面81b之間而形成。該複數個貫通孔於Y方向形成有複數行。帶部81之一部分係與基板S之背面對向而配置。 The belt portion 81 supports the substrate S from the rear surface through a support surface (substrate holding surface) 81a provided on the outside. A plurality of through-holes (not shown) arranged in the circumferential direction are provided on the belt portion 81 throughout the entire circumference. Each through-hole is formed between a support surface 81a of the belt portion 81 and a back surface 81b provided on the back surface side of the support surface 81a. The plurality of through holes are formed in a plurality of rows in the Y direction. A part of the band portion 81 is disposed to face the back surface of the substrate S.

帶搬送部82具有2個搬送輥82a~82b。於搬送輥82a~82b上捲繞有帶部81。搬送輥82b係配置於較曝光區域更靠基板S之搬送方向之上游側(+X側)。搬送輥82a係配置於較曝光區域更靠基板S之搬送方向之下游側。因此，帶部81成為以沿X方向橫穿曝光區域之方式移動之構成。 The belt transfer section 82 includes two transfer rollers 82a to 82b. A belt portion 81 is wound around the transfer rollers 82a to 82b. The conveyance roller 82b is arrange | positioned on the upstream side (+ X side) of the conveyance direction of the board | substrate S further than an exposure area. The conveyance roller 82a is arrange | positioned on the downstream side of the conveyance direction of the board | substrate S more than an exposure area. Therefore, the belt portion 81 is configured to move so as to cross the exposure area in the X direction.

搬送輥82a及搬送輥82b係於Y方向延伸而配置，並且以於X方向排列之方式互相留出間隔而配置。 The transfer roller 82a and the transfer roller 82b are arranged so as to extend in the Y direction, and are arranged to be spaced from each other so as to be aligned in the X direction.

搬送輥82a、82b於帶部81具有張力之狀態下，以繞與Y方向平行之軸線AX3(參照圖14)環繞移動之方式調整位置。 The conveyance rollers 82a and 82b adjust the position so that it may move around the axis AX3 (refer FIG. 14) parallel to the Y direction in the state where the belt part 81 has tension.

搬送輥82a成為驅動帶部81之驅動輥。於搬送輥82a上設置有驅動部(環繞驅動部)82e。於本實施形態中，例如搬送輥82a為驅動輥，剩餘之搬送輥82b為從動輥。作為驅動輥之搬送輥82a係例如由多孔質材料形成，且與未圖示之抽吸裝置連接。藉由該構成，可使帶部81吸附於外周面，故而可將動力傳達至該帶部81。 The conveyance roller 82 a becomes a driving roller that drives the belt portion 81. A drive section (surround drive section) 82e is provided on the transfer roller 82a. In this embodiment, for example, the conveyance roller 82a is a driving roller, and the remaining conveyance roller 82b is a driven roller. The conveying roller 82a as a driving roller is formed of, for example, a porous material and is connected to a suction device (not shown). With this configuration, since the belt portion 81 can be attracted to the outer peripheral surface, power can be transmitted to the belt portion 81.

導引平台83係使用例如可使氣體通過之多孔質材料而形成為矩 形之板狀。導引平台83之+Z側之面(導引面)83a係平行於XY平面而形成，藉由朝向基板S噴出氣體(流體)，而發揮作為藉由氣壓(流體壓力)自-Z側以非接觸之方式支承基板S之平面襯墊之功能。導引平台83對基板S及帶部81以沿著導引面83a向X方向移動之方式進行導引。 The guide platform 83 is formed in a rectangular plate shape using, for example, a porous material through which gas can pass. The surface (guide surface) 83a on the + Z side of the guide platform 83 is formed parallel to the XY plane, and the gas (fluid) is ejected toward the substrate S, and it functions as the air pressure (fluid pressure) from the -Z side. The non-contact method supports the function of the flat gasket of the substrate S. The guide platform 83 guides the substrate S and the belt portion 81 so as to move in the X direction along the guide surface 83a.

導引平台83於X方向係配置於搬送輥82a與搬送輥82b之間。又，如圖14所示，導引平台83於Y方向係配置於與帶部81重疊之位置。導引平台83之導引面83a係與帶部81之背面對向而設置。導引平台83係藉由未圖示之固定機構固定位置。 The guide platform 83 is arranged between the transfer roller 82a and the transfer roller 82b in the X direction. As shown in FIG. 14, the guide platform 83 is disposed at a position overlapping the belt portion 81 in the Y direction. The guide surface 83 a of the guide platform 83 is provided to face the back surface of the belt portion 81. The guide platform 83 is fixed in position by a fixing mechanism (not shown).

又，於本實施形態中，驅動部82e之動力係藉由輪列機構84透過一體地旋轉之旋轉軸86而傳達至光罩驅動輥(旋轉部)85。作為輪列機構84，可使用包含能以非接觸之方式傳達動力之磁性齒輪者。 In the present embodiment, the power of the drive unit 82e is transmitted to the mask drive roller (rotation unit) 85 via the rotation mechanism 86 which is integrally rotated by the wheel train mechanism 84. As the wheel train mechanism 84, a magnetic gear that can transmit power in a non-contact manner can be used.

圖14係將圖13所示之基板處理裝置100沿與ZY平面平行之平面破斷之剖面圖。 14 is a cross-sectional view of the substrate processing apparatus 100 shown in FIG. 13 broken along a plane parallel to the ZY plane.

如圖14所示，光罩驅動輥85根據轉動體25之配置，於Y方向留出間隔而設置有2個。於光罩驅動輥85之間，旋轉軸86支承於留出間隔而配置之一對軸承87上。該等軸承87利用由壓電式元件等構成之升降裝置(移動部)88沿Z方向受到微小驅動。 As shown in FIG. 14, two photomask driving rollers 85 are provided at intervals in the Y direction according to the arrangement of the rotating body 25. Between the photomask driving rollers 85, the rotating shaft 86 is supported by a pair of bearings 87 arranged at a gap. These bearings 87 are micro-driven in the Z direction by a lifting device (moving section) 88 composed of a piezoelectric element or the like.

於上述構成之基板處理裝置100中，藉由升降裝置88透過軸承87使旋轉軸86沿Z方向移動，藉此透過光罩驅動輥85及轉動體25使保持部本體22沿Z方向一體地移動，且相對於導引平台83於Z方向相對移動。 In the substrate processing apparatus 100 configured as described above, the rotary shaft 86 is moved in the Z direction through the bearing 87 by the lifting device 88, so that the holding unit body 22 is integrally moved in the Z direction through the mask driving roller 85 and the rotating body 25 And relative to the guide platform 83 in the Z direction.

藉此，可調整保持部本體22之光罩保持面22a與帶部81之支承面81a之間距量G。因此，保持於光罩保持面22a上之光罩M與保持於支承面81a上之基板S之間之間距量G亦被調整為既定量。 Thereby, the distance G between the mask holding surface 22a of the holding part main body 22 and the support surface 81a of the belt part 81 can be adjusted. Therefore, the distance G between the mask M held on the mask holding surface 22a and the substrate S held on the support surface 81a is also adjusted to a predetermined amount.

若調整光罩M與基板S之間距量，則基板處理裝置100藉由輥方式 而製造有機EL(Electro-Luminescence，電致發光)元件、液晶顯示元件等顯示元件(電子元件)。以下，對使用上述構成之基板處理裝置100製造顯示元件之步驟進行說明。 When the distance between the mask M and the substrate S is adjusted, the substrate processing apparatus 100 manufactures display elements (electronic elements) such as organic EL (Electro-Luminescence) elements and liquid crystal display elements by a roll method. Hereinafter, a procedure for manufacturing a display element using the substrate processing apparatus 100 having the above-described configuration will be described.

首先，將捲繞於未圖示之輥上之帶狀之基板S安裝於基板供給部1。以自該狀態從基板供給部11送出該基板S之方式，使驅動部82e作動而使搬送輥82a旋轉。另一方面，驅動部82e之動力透過輪列機構84而傳達至旋轉軸86。藉由旋轉軸86之旋轉而使光罩驅動輥85旋轉，從而帶動抵接於光罩驅動輥85之轉動體25旋轉，藉此保持於保持部本體22a上之光罩M繞旋轉軸線AX1旋轉。因此，光罩M與伴隨著帶部81之環繞動作之基板S之搬送同步(連動)地旋轉。於該狀態下由來自照明部10之照明光照明之光罩M之圖案影像被逐次曝光於基板S上。 First, a strip-shaped substrate S wound on a roller (not shown) is mounted on the substrate supply unit 1. The driving unit 82e is operated to rotate the conveying roller 82a so that the substrate S is sent out from the substrate supply unit 11 from this state. On the other hand, the power of the drive unit 82e is transmitted to the rotation shaft 86 through the wheel train mechanism 84. The photomask driving roller 85 is rotated by the rotation of the rotation shaft 86, so that the rotating body 25 abutting the photomask driving roller 85 is rotated, thereby the photomask M held on the holding portion body 22a is rotated about the rotation axis AX1 . Therefore, the photomask M rotates synchronously (interlocked) with the conveyance of the board | substrate S accompanying the surrounding motion of the belt part 81. In this state, the pattern image of the mask M illuminated by the illumination light from the illumination section 10 is sequentially exposed on the substrate S.

如此，於本實施形態中，亦可應對基板S之厚度變化，而容易地調整保持部本體22之光罩保持面22a與帶部81之支承面81a之間距量。又，於本實施形態中，亦可設為如下構成：於間距之調整量微小，又，例如在帶部81與導引平台83之導引面83a之間形成真空加壓型之空氣軸承層之情形時，藉由使構成平面襯墊之導引面83a沿Z方向微動而調整間距量。 As described above, in this embodiment, it is possible to easily adjust the distance between the mask holding surface 22 a of the holding portion body 22 and the support surface 81 a of the band portion 81 in response to a change in the thickness of the substrate S. Further, in this embodiment, a configuration may be adopted in which the pitch adjustment amount is small, and for example, a vacuum pressure type air bearing layer is formed between the belt portion 81 and the guide surface 83a of the guide platform 83. In this case, the pitch amount is adjusted by finely moving the guide surface 83a constituting the planar spacer in the Z direction.

再者，於上述第6實施形態中，例示如下構成而進行了說明，即，藉由轉動體25抵接於光罩驅動輥85而被帶動旋轉，從而使光罩M繞旋轉軸線AX旋轉，但並不限定於此，例如，如圖15所示，亦可為如下構成：藉由在與基板S分離之位置上使轉動體25抵接於帶部81而被帶動旋轉，從而使光罩M旋轉。 Furthermore, in the above-mentioned sixth embodiment, the configuration has been described as an example, in which the rotating body 25 is brought into contact with the mask driving roller 85 to be rotated, so that the mask M is rotated around the rotation axis AX. However, the present invention is not limited to this. For example, as shown in FIG. 15, a configuration may also be adopted in which the rotating body 25 is brought into contact with the belt portion 81 at a position separated from the substrate S to be driven to rotate, thereby making the photomask. M rotation.

於該構成之基板處理裝置100中，藉由將第4實施形態中所說明之填隙片SM1以與基板S之厚度相應之厚度設置於壓印滾筒設置部25a之外周面上，而可調整光罩保持面22a與導引平台83之導引面83a之間(光罩面與基板面之間)之間距量。 In the substrate processing apparatus 100 having this configuration, the gap filler sheet SM1 described in the fourth embodiment is provided on the outer peripheral surface of the impression cylinder setting portion 25a at a thickness corresponding to the thickness of the substrate S, and can be adjusted. The distance between the mask holding surface 22a and the guide surface 83a of the guide platform 83 (between the mask surface and the substrate surface).

又，於間距調整量微小之情形時，亦可藉由調整上述空氣軸承層之厚度而 調整間距量。具體而言，如圖15所示，作為流體壓力調整部之控制部CONT控制對導引平台83供給空氣之供給部89，而調整氣墊部中之轉動體25(壓印滾筒設置部25a)所抵接之區域之空氣供給量，藉此可調整空氣軸承層之厚度而使轉動體25向相對於帶部81分離、接近之方向移動。藉此，可容易地變更帶部81與轉動體25之距離、即光罩保持面22a與導引面83a之間(光罩面與基板面之間)之間距量。 When the pitch adjustment amount is small, the pitch amount can be adjusted by adjusting the thickness of the air bearing layer. Specifically, as shown in FIG. 15, the control unit CONT, which is a fluid pressure adjustment unit, controls the supply unit 89 that supplies air to the guide platform 83, and adjusts the position of the rotating body 25 (the impression cylinder setting unit 25 a) in the air cushion unit. The air supply amount in the abutting area can adjust the thickness of the air bearing layer and move the rotor 25 in a direction separated from and approached to the belt portion 81. Thereby, the distance between the belt portion 81 and the rotating body 25, that is, the distance between the mask holding surface 22a and the guide surface 83a (between the mask surface and the substrate surface) can be easily changed.

以上，一面參照隨附圖式一面對本發明之較佳之實施形態進行了說明，但當然本發明並不限定於上述例。上述例中所示之各構成構件之諸形狀或組合等為一例，可於不脫離本發明之主旨之範圍內根據設計要求等進行各種變更。 The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shapes, combinations, and the like of the constituent members shown in the above examples are examples, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

例如，於上述實施形態中，設為於保持部本體22之外周面保持光罩M之構成，但並不限定於此，亦可設為使光罩M保持於保持部本體22之內周面之構成。 For example, in the above-mentioned embodiment, the configuration in which the photomask M is held on the outer peripheral surface of the holding portion body 22 is not limited to this, and the photomask M may be held on the inner peripheral surface of the holding portion body 22. Of the composition.

又，於上述實施形態中，關於設置測量光罩M與基板S之相對位置之測量部之構成，僅於第2、第3實施形態中進行了說明，但當然對於其他實施形態亦可應用。 In addition, in the above-mentioned embodiment, the configuration of the measurement unit for providing the relative position of the measurement mask M and the substrate S has been described only in the second and third embodiments, but it is naturally applicable to other embodiments.

又，作為下述元件製造系統SYS中之處理裝置U3，可使用上述實施形態之基板處理裝置100。 In addition, as the processing device U3 in the below-mentioned component manufacturing system SYS, the substrate processing device 100 of the above embodiment can be used.

(第7實施形態) (Seventh embodiment)

以下，參照圖16至圖20，對本發明之第7實施形態之基板處理裝置進行說明。 Hereinafter, a substrate processing apparatus according to a seventh embodiment of the present invention will be described with reference to FIGS. 16 to 20.

於以下之說明中，存在對相同之構成要素標註相同符號而簡化或省略其說明之情況。又，只要無特別說明，則關於構成要素或其等之說明，設為與上述實施形態相同。 In the following description, the same components are denoted by the same symbols, and the descriptions thereof may be simplified or omitted. Unless otherwise stated, the description of the constituent elements or the like is the same as that of the embodiment described above.

再者，於本實施形態中，例示光罩保持部與基板保持部藉由摩擦而同步旋 轉(帶動旋轉)之構成之情形而進行說明。 In addition, in this embodiment, the case where the mask holding | maintenance part and board | substrate holding | maintenance part rotate synchronously (driving rotation) by friction is demonstrated and demonstrated.

圖16係基板處理裝置200之主要部分之前視剖面圖，圖17係構成基板處理裝置200之光罩單元MU之前視圖，圖18係光罩單元MU之端部之局部放大圖。 16 is a front sectional view of a main part of the substrate processing apparatus 200, FIG. 17 is a front view of a mask unit MU constituting the substrate processing apparatus 200, and FIG. 18 is a partially enlarged view of an end portion of the mask unit MU.

基板處理裝置200係將具有可撓性之片狀之光罩M之圖案相對於帶狀之基板(例如，帶狀之膜構件)S進行曝光處理者，且以照明部10、光罩單元MU、基板保持單元SU、對準顯微鏡AL1、AL2、及控制部(未圖示)作為主體而構成。光罩M係由具有可撓性之片狀之玻璃材料形成為例如200~500μm左右之厚度。 The substrate processing apparatus 200 is a person who exposes a pattern of a flexible sheet-shaped mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and uses the lighting unit 10 and the mask unit MU. The substrate holding unit SU, the alignment microscopes AL1, AL2, and a control unit (not shown) are mainly constituted. The photomask M is formed of a flexible sheet-like glass material to a thickness of about 200 to 500 μm, for example.

再者，於本實施形態中，將鉛垂方向設為Z方向，將與光罩單元MU及基板保持單元SU之旋轉軸線AX1、AX2平行之方向設為Y方向，將與Z方向及Y方向正交之方向設為X方向而進行說明。 In the present embodiment, the vertical direction is set to the Z direction, the direction parallel to the rotation axes AX1 and AX2 of the mask unit MU and the substrate holding unit SU is set to the Y direction, and the Z direction and the Y direction are set to The orthogonal direction will be described as the X direction.

照明部10係朝向捲繞於光罩單元MU中之光罩保持部20(下述)上之光罩M之照明區域照射照明光者，且將與螢光燈同樣地以直管型呈放射狀發出曝光用之照明光者、或自圓筒狀之石英棒之兩端導入照明光且於背面側設置有擴散構件者、或者將多個發射高亮度之紫外線區域之光之半導體雷射或LED等排列成一行而成者收容於支承光罩保持部20之內筒21之內部空間內。 The illuminating unit 10 is a person who irradiates the illuminating light toward the illuminating area of the reticle M wrapped on the reticle holding unit 20 (described below) in the reticle unit MU, and emits a straight tube type like a fluorescent lamp Those who emit illumination light for exposure, those who introduce illumination light from both ends of a cylindrical quartz rod, and a diffusing member on the back side, or semiconductor lasers that emit a plurality of high-brightness ultraviolet light rays LEDs and the like are arranged in a row and accommodated in the inner space of the inner tube 21 supporting the mask holding portion 20.

光罩單元MU具備光罩保持部20、及轉動體25。光罩保持部20具備保持部本體22與保持具23。該等保持部本體22、保持具23、轉動體25係以一體化之狀態進行設置，又，分別形成有於旋轉軸線(既定之軸線)AX1方向連通而供內筒21插通之貫通孔。 The mask unit MU includes a mask holding section 20 and a rotating body 25. The mask holding section 20 includes a holding section body 22 and a holder 23. The holding body 22, the holder 23, and the rotating body 25 are installed in an integrated state, and through holes are formed in the rotation axis (predetermined axis) AX1 to communicate with the inner cylinder 21, respectively.

保持部本體22係由以旋轉軸線(既定之軸線)AX1為軸線之圓筒狀之玻璃材料形成，且具備沿著既定半徑之圓筒面保持光罩M之外周面(周面)22a。如圖17所示，於捲繞有光罩M時，外周面22a之周長係設定為繞旋轉軸線 AX1之方向之兩端分離之長度(於以下之說明中，將保持部本體22及保持具23中於繞旋轉軸線AX1之方向(掃描曝光之方向)上光罩M之兩端部分離之區域稱為光罩分離區域Ma)。 The holding unit body 22 is formed of a cylindrical glass material having a rotation axis (predetermined axis) AX1 as an axis, and includes a peripheral surface (peripheral surface) 22a that holds the mask M along a cylindrical surface of a predetermined radius. As shown in FIG. 17, when the mask M is wound, the circumference of the outer peripheral surface 22 a is set to a length separated from both ends in the direction of the rotation axis AX1 (in the following description, the holding portion body 22 and the holding portion A region in which both ends of the mask M are separated in a direction around the rotation axis AX1 (direction of scanning exposure) in the tool 23 is referred to as a mask separation region Ma).

保持具23係由金屬材料形成為圓環狀，分別設置於保持部本體22之長度方向兩端部，且具有自內周側保持保持部本體22之保持部23a。作為保持具23之形成材料，較佳為具有與保持部本體22相同之線膨脹係數者。保持具23之外周面23b形成為直徑較保持部本體22之外周面22a之直徑小。 The holder 23 is formed in a ring shape from a metal material, and is provided at both ends in the longitudinal direction of the holding portion body 22, and has holding portions 23 a that hold the holding portion body 22 from the inner peripheral side. As the forming material of the holder 23, it is preferable to have a coefficient of linear expansion similar to that of the holding portion body 22. The outer peripheral surface 23 b of the holder 23 is formed to have a smaller diameter than the outer peripheral surface 22 a of the holding portion body 22.

又，於各保持具23之外周面23b上，除了光罩分離區域Ma以外以於Y方向留出間隔而並列之方式成對地形成沿繞旋轉軸線AX1之方向延伸之槽部23c，並且形成為如下配置：形成於與光罩分離區域Ma分離之位置上周向之端部彼此連接且周圍由槽部23c包圍而成之島部，而成為0字狀。 Further, grooves 23c extending in the direction around the rotation axis AX1 are formed in pairs on the peripheral surface 23b of each of the holders 23, except for the mask separation area Ma, in parallel with a space in the Y direction. The arrangement is such that an island portion formed in a circumferential direction at the position separated from the mask separation region Ma is connected to each other and is surrounded by a groove portion 23c to form an island-shaped portion.

於各槽部23c中，如圖18所示，以與光罩保持部20之外周面22a成為大致同一平面之突出量裝填有密封保持具23與光罩M之間之間隙之密封部70。作為密封部70，例如可使用O形環。由密封部70密封而成之空間、即由保持具23、光罩M、密封部70所圍成之密閉空間係藉由抽吸部VC進行負壓抽吸。由該等密封部70及抽吸部VC構成將光罩M裝卸自如地固定於光罩保持部20之固定部。 In each groove portion 23c, as shown in FIG. 18, a sealing portion 70 that seals the gap between the holder 23 and the mask M is protruded by an amount substantially equal to the plane of the outer peripheral surface 22a of the mask holding portion 20. As the sealing portion 70, for example, an O-ring can be used. The space sealed by the sealing portion 70, that is, the closed space surrounded by the holder 23, the mask M, and the sealing portion 70 is sucked by the suction portion VC under negative pressure. The sealing portion 70 and the suction portion VC constitute a fixing portion that detachably fixes the mask M to the mask holding portion 20.

又，如圖17所示，於各保持具23上分別設置有位於光罩分離區域Ma之軸狀之係合部(定位銷)71、及位於較光罩M更靠-Y側之軸狀之係合部(定位銷)72。係合部71係於將光罩M之周向之一端緣抵壓至外周面時，決定該光罩M相對於光罩保持部20之周向之相對位置者，且以與光罩M之外周面成為大致同一平面之高度突設。於係合部71之頂面形成有成為與光罩M之相對位置關係之指標之指標標記(指標部)FM。 As shown in FIG. 17, each holder 23 is provided with a shaft-shaped coupling portion (locating pin) 71 located on the axis of the mask separation region Ma, and a shaft shape positioned on the -Y side from the mask M. Of the joint (positioning pin) 72. The coupling portion 71 determines the relative position of the mask M with respect to the circumferential direction of the mask holding portion 20 when one of the circumferential edges of the mask M is pressed against the outer circumferential surface. The height of the same plane is suddenly set. An index mark (indicator portion) FM is formed on the top surface of the engaging portion 71 as an index of the relative positional relationship with the mask M.

係合部72係於將光罩M之-Y側之一端緣抵壓至外周面時，決定該 光罩M相對於光罩保持部20之Y方向(寬度方向)之相對位置者，且以與光罩M之外周面成為大致同一平面之高度突設。光罩M藉由將端緣抵壓至係合部71、72之兩者，而定位相對於光罩保持部20之相對位置。而且，於光罩M上形成有光罩標記MM，該光罩標記MM例如於抵壓至係合部71之端緣附近形成有一個，於與該端緣為相反側之端緣附近形成有兩個，且分別於在設計上與係合部71相同之Y位置上與圖案呈既定之位置關係。 The engaging portion 72 determines the relative position of the photomask M with respect to the Y direction (width direction) of the photomask holding portion 20 when an end edge of the -Y side of the photomask M is pressed against the outer peripheral surface, and the The height of the outer peripheral surface of the mask M is substantially the same as that of the flat surface. The photomask M is positioned relative to the photomask holding portion 20 by pressing the end edges to both of the engaging portions 71 and 72. Further, a mask mark MM is formed on the mask M, and the mask mark MM is formed, for example, near an end edge pressed against the engaging portion 71, and is formed near an end edge opposite to the end edge. Two, and they have a predetermined positional relationship with the pattern at the Y position which is the same as the engaging portion 71 in design.

內筒21係由可使照明光透過之圓筒狀之石英等、或者具備供來自照明部10之照明光通過之狹縫狀之開口部21a的圓筒狀之陶瓷材料或金屬等形成。 The inner tube 21 is formed of a cylindrical quartz or the like through which illumination light is transmitted, or a cylindrical ceramic material or metal having a slit-shaped opening portion 21a through which the illumination light from the illumination portion 10 passes.

返回至圖16，轉動體25透過保持具23與保持部本體22物理性地結合(連結)，且具有繞旋轉軸線AX1突設於外周側並於壓印滾筒體30之外周面上轉動之壓印滾筒設置部25a。壓印滾筒設置部25a之外徑形成為較保持於保持部本體22之光罩保持面22a上之光罩M之外側之面所構成之外徑大既定量。具體而言，於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面而將保持部本體22支承於既定位置時，壓印滾筒設置部25a之外徑形成為在保持於壓印滾筒體30上之基板S與光罩M之間形成既定量之間距之值。 Returning to FIG. 16, the rotating body 25 is physically combined (connected) with the holding portion body 22 through the holder 23, and has a pressure protruding from the outer peripheral side about the rotation axis AX1 and rotating on the outer peripheral surface of the impression cylinder body 30. Drum setting section 25a. The outer diameter of the impression cylinder setting portion 25 a is formed to be larger than the outer diameter of the mask M held on the mask holding surface 22 a of the holding portion body 22 by a surface having a larger outer diameter. Specifically, when the impression cylinder setting portion 25a abuts against the outer peripheral surface of the impression cylinder body 30 to support the holding portion body 22 at a predetermined position, the outer diameter of the impression cylinder setting portion 25a is formed to be held at the impression The substrate S and the photomask M on the drum body 30 form a predetermined distance.

又，轉動體25於內周側透過空氣軸承26相對於內筒21繞旋轉軸線AX1以非接觸之方式旋轉自如地受到支承。因此，保持部本體22、保持具23、轉動體25繞旋轉軸線AX1一體地旋轉。 In addition, the rotor 25 is rotatably supported in a non-contact manner around the rotation axis AX1 with respect to the inner cylinder 21 through an air bearing 26 on the inner peripheral side. Therefore, the holding body 22, the holder 23, and the rotating body 25 are integrally rotated around the rotation axis AX1.

內筒21係透過板彈簧28而載置於自於Y方向留出間隔而設置之基座部B向互相接近之方向延伸設置之支承台27上。板彈簧28之彈簧常數係根據光罩保持部20之自重及透過轉動體25對壓印滾筒體30施加之負載、即轉動體25之壓印滾筒設置部25a於壓印滾筒體30之外周面上轉動時之摩擦力而設定。於內筒21之內部空間配設有上述照明部10，於在照明部10之照明光出射方向對向之 位置上形成有供照明光通過之開口部21a(參照圖16)。 The inner cylinder 21 is placed on a support base 27 provided in a direction in which the base portion B provided in the Y-direction is spaced apart from each other through a leaf spring 28. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 on the outer peripheral surface of the impression cylinder body 30. Set the friction force when turning up. The above-mentioned lighting section 10 is arranged in the inner space of the inner tube 21, and an opening 21a (see FIG. 16) through which the lighting light passes is formed at a position opposite to the direction in which the lighting light emission direction of the lighting section 10 exits.

對準顯微鏡AL1、AL2係檢測光罩M與光罩保持部20之相對位置關係者，以可觀察光罩M之光罩標記MM及係合部71之指標標記FM之方式，配置於與各標記MM、FM相同之Y位置上。 The alignment microscopes AL1 and AL2 are used to detect the relative positional relationship between the photomask M and the photomask holding portion 20, and the photomask mark MM of the photomask M and the index mark FM of the coupling portion 71 can be observed. Mark the same Y position as MM and FM.

基板保持單元SU具備壓印滾筒體(基板保持部)30。 The substrate holding unit SU includes an impression cylinder (substrate holding portion) 30.

壓印滾筒體30係形成為繞與Y軸平行且設定於旋轉軸線AX1之-Z側之旋轉軸線(第2軸線)AX2旋轉之圓柱狀，於內部設置有中空部且以慣性力矩變小之方式設定。壓印滾筒體30之外周面設為接觸保持基板S之基板保持面31。於壓印滾筒體30之Y方向兩端面上，直徑較壓印滾筒體30小且以同軸突出之旋轉支承部32繞旋轉軸線AX2旋轉自如地支承於基座部B上。又，於本實施形態中，設置有藉由旋轉驅動壓印滾筒體30而使壓印滾筒體30與光罩保持部20同步地旋轉之驅動裝置33。 The impression cylinder body 30 is formed in a cylindrical shape that rotates around a rotation axis (second axis) AX2 that is parallel to the Y axis and set on the -Z side of the rotation axis AX1. A hollow portion is provided inside and the moment of inertia becomes smaller. Mode setting. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. On the both end surfaces in the Y direction of the impression cylinder body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and protruding coaxially is rotatably supported on the base portion B about a rotation axis AX2. Further, in this embodiment, a driving device 33 is provided that rotates the impression cylinder body 30 in synchronization with the mask holding portion 20 by rotationally driving the impression cylinder body 30.

其次，對上述構成之基板處理裝置200中光罩單元MU之組裝順序進行說明。 Next, an assembling procedure of the mask unit MU in the substrate processing apparatus 200 configured as described above will be described.

首先，關於光罩M，製成為例如於平坦性良好之短條狀之超薄玻璃板(例如厚度為200~500μm)之一面上利用鉻等遮光層形成有包含線寬20μm以下之微細圖案之顯示元件用之電路圖案等的透過型之平面狀片材光罩。光罩M於基板處理時係具有與保持部本體22之外周面22a之半徑相應之曲率而安裝，故而於周向上在安裝時根據光罩M之厚度及外周面22a之半徑而擴展(外周面側)、或壓縮(內周面側)。因此，關於周向，光罩M之圖案成為安裝時之大小根據上述厚度及曲率而相對於形成時之大小放大或縮小後之圖案。因此，於圖案形成時，以將該放大或縮小估算在內之大小形成圖案。 First, the photomask M is made, for example, by forming a fine pattern including a fine pattern with a line width of 20 μm or less using a light-shielding layer such as chromium on one side of a short strip-shaped ultra-thin glass plate (for example, a thickness of 200 to 500 μm) with good flatness. Transmissive planar sheet masks such as circuit patterns for display elements. The photomask M is mounted with a curvature corresponding to the radius of the outer peripheral surface 22a of the holding portion body 22 during substrate processing. Therefore, the photomask M is expanded in the circumferential direction according to the thickness of the photomask M and the radius of the outer peripheral surface 22a (outer peripheral surface). Side), or compression (inner peripheral surface side). Therefore, regarding the circumferential direction, the pattern of the mask M becomes a pattern in which the size at the time of mounting is enlarged or reduced with respect to the size at the time of formation according to the thickness and curvature described above. Therefore, when the pattern is formed, the pattern is formed to a size that is estimated by the enlargement or reduction.

以上述方式製成之光罩M係以仿照保持部本體22之外周面22a而彎曲，且捲繞(貼附)於該外周面上之狀態使用。於將光罩M捲繞於外周面22a 上時，將光罩M之周向之一端緣抵壓至係合部71之外周面上，且將光罩M之寬度方向之一端緣抵壓至係合部72，而於相對於光罩保持部20(保持部本體22)定位光罩M之狀態下進行捲繞。於捲繞光罩M之後，使抽吸部VC進行動作而對由密封部70密封之密閉空間進行負壓抽吸，藉此使光罩M於Y方向之兩端部被吸附保持。再者，若於光罩M與保持部本體22之間形成空氣層而產生折射率差較大之界面，則有時會因干擾現象或多重反射等之影響，而使曝光於基板S上之圖案之像質惡化，故而較佳為於光罩M與保持部本體22之間介裝具有與玻璃材料相同程度之折射率之純水、或油浸顯微鏡等中所使用之油等液體，以抑制此種較大之折射率差之產生。 The photomask M manufactured in the above-mentioned manner is used in a state that it is curved following the outer peripheral surface 22 a of the holding portion body 22 and is wound (attached) on the outer peripheral surface. When the photomask M is wound around the outer peripheral surface 22a, one end edge in the circumferential direction of the photomask M is pressed against the outer peripheral surface of the engaging portion 71, and one end edge in the width direction of the photomask M is pressed into engagement. The portion 72 is wound in a state where the photomask M is positioned with respect to the photomask holding portion 20 (the holding portion body 22). After the mask M is wound, the suction portion VC is operated to suction-suction the closed space sealed by the sealing portion 70 by a negative pressure, so that both ends of the mask M in the Y direction are sucked and held. Furthermore, if an air layer is formed between the photomask M and the holding portion body 22 and an interface having a large refractive index difference is generated, it may be exposed to the substrate S due to interference or multiple reflections. The image quality of the pattern is deteriorated. Therefore, it is preferable to interpose pure water having the same refractive index as that of the glass material between the mask M and the holding portion body 22, or liquid such as oil used in oil-immersed microscopes. The occurrence of such a large refractive index difference is suppressed.

該情形時之液體較理想的是於曝光用之照明光之波段中具有充分之透過率(例如90%以上)者。 The liquid in this case is preferably one having sufficient transmittance (for example, 90% or more) in the wavelength band of the illumination light for exposure.

又，由於此種液體會自光罩M之周緣部逐漸蒸發，故而較佳為於保持部本體22之外周面22a中之光罩M之周緣所處之附近、或設置有係合部71、72之附近，例如，在外周面22a之一部分刻設複數條數μm~數十μm程度之深度之親液性之槽(寬度為1μm左右)，並預先設置自保持部本體22之外周面22a之上方透過滴管狀或針狀之噴嘴朝向該槽偶爾滴下液體之液體供給機構。 In addition, since this liquid gradually evaporates from the peripheral edge portion of the mask M, it is preferable that the liquid is located near the peripheral edge of the mask M in the outer peripheral surface 22 a of the holding portion body 22 or is provided with an engaging portion 71, Around 72, for example, a part of the outer peripheral surface 22a is engraved with a plurality of lyophilic grooves (with a width of about 1 μm) having a depth of about μm to several tens of μm, and the outer peripheral surface 22a of the holding portion body 22 is provided in advance. A liquid supply mechanism that occasionally drips liquid through a nozzle or needle-shaped nozzle above the groove toward the groove.

若設定因此種構成，則向複數個槽中滴下之液體於保持部本體22以實用上之角速度(例如作為光罩M之圖案面之周速為50~200mm/S左右)旋轉期間被捕捉至槽內，故而可藉由毛細管現象滲入至保持部本體22之外周面22a與光罩M之間。 If such a configuration is set, the liquid dripped into the plurality of grooves will be captured during the rotation of the holding portion body 22 at a practical angular speed (for example, the peripheral speed of the pattern surface of the mask M is about 50 to 200 mm / S). In the groove, it can penetrate between the outer peripheral surface 22 a of the holding portion body 22 and the photomask M by a capillary phenomenon.

當然，此種複數條槽係設置於光罩M上之圖案形成區域之外側且如不擾亂曝光用照明光之位置。 Of course, such a plurality of grooves are provided on the outside of the pattern forming area on the photomask M and do not disturb the position of the illumination light for exposure.

關於吸附保持有光罩M之光罩單元MU，於曝光處理前，預先檢測圖案之位置資訊。具體而言，一面使光罩保持部20繞旋轉軸線AX1旋轉，一 面藉由對準顯微鏡AL1、AL2分別檢測光罩標記MM及指標標記FM。藉此，測量以指標標記FM為基準之光罩M之相對位置關係、即圖案之相對位置關係。藉由使用該相對位置關係進行既定之運算，而對於形成於光罩M上之圖案，可獲得繞旋轉軸線AX1之方向之位置、Y方向之位置、沿著外周面22a之方向之旋轉、及倍率等圖案相對於光罩保持部20之誤差資訊。 Regarding the mask unit MU that holds and holds the mask M, the position information of the pattern is detected in advance before the exposure process. Specifically, the mask mark MM and the index mark FM are detected by the alignment microscopes AL1 and AL2 while the mask holding portion 20 is rotated around the rotation axis AX1. Thereby, the relative positional relationship of the mask M with the index mark FM as a reference, that is, the relative positional relationship of the pattern is measured. By using the relative positional relationship to perform a predetermined operation, for the pattern formed on the mask M, a position in the direction of the rotation axis AX1, a position in the Y direction, a rotation along the outer peripheral surface 22a, and Error information of the pattern such as magnification with respect to the mask holding portion 20.

其次，對基板處理裝置200之動作進行說明。 Next, the operation of the substrate processing apparatus 200 will be described.

透過空氣軸承26而由內筒21支承且保持光罩M之光罩保持部20於轉動體25之壓印滾筒設置部25a對壓印滾筒體30賦予有該光罩保持部20之自重與同板彈簧28之彈簧常數相應之向+Z側之賦能力之差量之負載的狀態下抵接。藉此，於光罩保持面22a與基板保持面31之間、即光罩M與基板S之間形成與壓印滾筒設置部25a之外徑相應之既定量之間距。再者，於調整壓印滾筒設置部25a對壓印滾筒體30賦予之負載時，只要更換為具有對應之彈簧常數之板彈簧28，或於在內筒21與支承台27之間預先***有間隔件之狀態下設置板彈簧28而更換為與壓印滾筒設置部25a對壓印滾筒體30賦予之負載相應之間隔件即可。 The mask holding portion 20 supported by the inner cylinder 21 and holding the mask M through the air bearing 26 and the impression cylinder setting portion 25 a of the rotating body 25 imparts the same weight to the impression cylinder body 30 as the mask retaining portion 20. The spring constant of the leaf spring 28 abuts in a state of a load corresponding to a difference in the energizing capacity to the + Z side. Thereby, a predetermined distance is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the photomask M and the substrate S, corresponding to the outer diameter of the impression cylinder setting portion 25a. In addition, when adjusting the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a, it is only necessary to replace it with a plate spring 28 having a corresponding spring constant, or insert it between the inner cylinder 21 and the support table 27 in advance. In the state of the spacer, the plate spring 28 may be provided and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

其次，壓印滾筒體30藉由驅動裝置33之驅動而繞旋轉軸線AX2旋轉，並且自照明部10照射照明光，透過開口部21a透過保持部本體22，而自內周側對光罩M進行照明。伴隨著壓印滾筒體30之旋轉，而搬送捲繞於壓印滾筒體30之基板保持面31上而保持之基板S，並且於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面之轉動體25被帶動旋轉，藉此透過保持具23將旋轉驅動力傳達至保持部本體22，從而使保持於保持部本體22之光罩M之圖案於將與基板S之既定量之間距維持為固定之狀態下同步地移動。其次，由照明光照明之光罩M之圖案影像被逐次投影至基板S之投影區域。 Next, the impression cylinder body 30 is rotated around the rotation axis AX2 by the drive of the driving device 33, and illuminating light is irradiated from the illuminating section 10, through the opening section 21a, and through the holding section body 22, and the photomask M is performed from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S that is wound and held on the substrate holding surface 31 of the impression cylinder body 30 is conveyed, and abuts against the outer periphery of the impression cylinder body 30 at the impression cylinder setting portion 25a. The rotating body 25 on the surface is driven to rotate, thereby transmitting the rotational driving force to the holding part body 22 through the holder 23, so that the pattern of the photomask M held on the holding part body 22 is spaced from the predetermined amount of the substrate S. Move in sync while maintaining a fixed state. Second, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

再者，於將光罩M之圖案投影至基板S時，較佳為根據預先求出之圖案之誤差資訊，調整基板S之繞旋轉軸線AX2之方向之位置、Y方向之位置、 壓印滾筒體30相對於光罩保持部20之相對旋轉速度、旋轉軸線AX1、AX2之相對位置關係、光罩M與基板S之間距量。 Furthermore, when the pattern of the mask M is projected onto the substrate S, it is preferable to adjust the position of the substrate S in the direction of the rotation axis AX2, the position in the Y direction, and the impression cylinder according to the error information of the pattern obtained in advance. The relative rotational speed of the body 30 with respect to the mask holding portion 20, the relative positional relationship between the rotation axes AX1, AX2, and the distance between the mask M and the substrate S.

如此，於本實施形態之光罩單元MU中，利用由玻璃材料形成之保持部本體22保持由玻璃材料形成之光罩M，故而可容易地形成圖案，且可抑制耗費如將圖案直接形成於保持部本體22之情形時之時間而造成成本增加之情況。又，於本實施形態中，由於相對於並非圓筒面而係平面之光罩M形成圖案，故而即使為更微細寬度之圖案、例如20μm以下之線寬之圖案，亦能夠以高精度形成。 As described above, in the mask unit MU of the present embodiment, the mask M formed of glass material is held by the holding portion body 22 formed of glass material, so that the pattern can be easily formed, and the cost can be suppressed. In the case of the holding part body 22, the time may increase the cost. Furthermore, in this embodiment, a pattern is formed with respect to the mask M which is not a cylindrical surface but is a plane. Therefore, even a pattern with a finer width, for example, a pattern with a line width of 20 μm or less, can be formed with high accuracy.

進而，於本實施形態中，在將光罩M安裝於光罩保持部20時，藉由使光罩M係合於係合部71、72，而可容易地定位於光罩保持部20上。而且，於本實施形態中，由於在係合部71設置有指標標記FM，故而無需另外設置指標標記用之構件，從而可謀求裝置之小型化及低價格化。又，於本實施形態中，藉由對利用抽吸部VC之抽吸/抽吸停止進行操作，亦可容易且迅速地更換光罩M。 Furthermore, in the present embodiment, when the photomask M is mounted on the photomask holding portion 20, the photomask M can be easily positioned on the photomask holding portion 20 by attaching the photomask M to the engaging portions 71 and 72. . Further, in the present embodiment, since the index mark FM is provided in the coupling portion 71, there is no need to separately provide a member for the index mark, so that the device can be miniaturized and reduced in price. Further, in this embodiment, the mask M can be easily and quickly replaced by operating the suction / suction stop by the suction section VC.

(元件製造系統) (Component Manufacturing System)

其次，參照圖19，對具備上述基板處理裝置200之元件製造系統進行說明。 Next, a component manufacturing system including the substrate processing apparatus 200 will be described with reference to FIG. 19.

圖19係表示元件製造系統(撓性顯示器生產線)SYS之一部分之構成之圖。此處，表示自供給輥FR1抽出之可撓性之基板P(片材、膜等)依序經過n台處理裝置U1、U2、U3、U4、U5…Un後上捲於回收輥FR2上為止之例。上位控制裝置CONT2統一控制構成生產線之各處理裝置U1~Un。 FIG. 19 is a diagram showing a configuration of a part of a component manufacturing system (flexible display production line) SYS. Here, it means that the flexible substrate P (sheet, film, etc.) drawn from the supply roller FR1 passes through the n processing units U1, U2, U3, U4, U5, ... in sequence and is wound up on the recovery roller FR2. Example. The upper-level control device CONT2 controls the processing devices U1 to Un constituting the production line in a unified manner.

本實施形態之元件製造系統SYS係對基板P連續地實施用以製造1個元件之各種處理之所謂輥對輥(Roll to Roll)方式之系統，實施過各種處理之基板P以元件(例如有機EL顯示器之顯示面板)為單位被分割(切割)，而變為複數個元件。基板P之尺寸係例如寬度方向(成為短邊之Y方向)之尺寸為10cm~2m左右，長度方向(成為長邊之X方向)之尺寸為10m以上。 The component manufacturing system SYS of this embodiment is a so-called roll-to-roll system that continuously performs various processes for manufacturing one component on the substrate P. The substrate P that has been subjected to various processes is processed by components (for example, organic The display panel of the EL display is divided (cut) as a unit, and becomes a plurality of elements. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (the Y direction that becomes the short side), and more than 10 m in the length direction (the X direction that becomes the long side).

於圖19中，正交座標系統XYZ係設為如下者：基板P之表面(或背面)以與XZ面垂直之方式設定，基板P之與搬送方向(長邊方向)正交之寬度方向係設定為Y方向。再者，該基板P亦可為預先藉由既定之預處理對其表面進行改質而活化者，或者於表面形成有用於精密圖案化之微細之間隔壁構造(凹凸構造)者。 In FIG. 19, the orthogonal coordinate system XYZ is set as follows: The surface (or back) of the substrate P is set to be perpendicular to the XZ plane, and the width direction of the substrate P is orthogonal to the conveying direction (long-side direction). Set to the Y direction. Furthermore, the substrate P may be activated by modifying its surface by a predetermined pretreatment, or by forming a fine partition wall structure (concave-convex structure) on the surface for precise patterning.

捲在供給輥FR1上之基板P係藉由夾持之驅動輥DR1而被抽出並搬送至處理裝置U1，基板P之Y方向(寬度方向)之中心係藉由邊緣位置控制器EPC1，以相對於目標位置控制在±十數μm~數十μm程度之範圍內之方式被伺服控制。 The substrate P wound on the supply roller FR1 is pulled out by the nip driving roller DR1 and transferred to the processing device U1. The center of the substrate P in the Y direction (width direction) is controlled by the edge position controller EPC1. Servo control is performed so that the target position is controlled within the range of ± tens of μm to several tens of μm.

處理裝置U1係以印刷方式於基板P之表面沿基板P之搬送方向(長邊方向)連續地或選擇性地塗布感光性功能液(光阻、感光性矽烷偶合材料、UV硬化樹脂液等)之塗布裝置。於處理裝置U1內，設置有：壓印滾筒輥DR2，其捲繞基板P；塗布機構Gp1，其設置於該壓印滾筒輥DR2上，且包含用以於基板P之表面均勻地塗布感光性功能液之塗布用輥等；及乾燥機構Gp2，其用以將塗布於基板P上之感光性功能液中所含之溶劑或水分快速地去除；等。 The processing device U1 is a method for continuously or selectively applying a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV-curing resin liquid, etc.) on the surface of the substrate P along the conveying direction (long side direction) of the substrate P by printing. Of coating device. In the processing device U1, an imprint cylinder roller DR2 is provided, which winds the substrate P; a coating mechanism Gp1 is disposed on the imprint cylinder roller DR2, and includes a method for uniformly coating the surface of the substrate P with photosensitivity. A functional liquid coating roller, etc .; and a drying mechanism Gp2 for quickly removing a solvent or moisture contained in the photosensitive functional liquid coated on the substrate P; and the like.

處理裝置U2係用以將自處理裝置U1搬送而來之基板P加熱至既定溫度(例如，數10~120℃左右)，而使塗布於表面之感光性功能層穩定之加熱裝置。於處理裝置U2內，設置有：複數個輥與氣動式折返桿，其等用以折返搬送基板P；加熱腔室部HA1，其用以對搬入來之基板P進行加熱；冷卻腔室部HA2，其用以使經加熱之基板P之溫度以與後續步驟(處理裝置U3)之環境溫度一致之方式下降；及驅動輥DR3，其被夾持；等。 The processing device U2 is a heating device for heating the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about 10 to 120 ° C.), so as to stabilize the photosensitive functional layer applied on the surface. In the processing device U2, a plurality of rollers and a pneumatic folding bar are provided, which are used to fold back the substrate P; a heating chamber portion HA1, which is used to heat the substrate P carried in; a cooling chamber portion HA2 , Which is used to reduce the temperature of the heated substrate P in a manner consistent with the ambient temperature of the subsequent step (processing device U3); and the driving roller DR3, which is held; and so on.

作為基板處理裝置200之處理裝置U3係上文之圖16~圖18所示之曝光裝置，對自處理裝置U2搬送而來之基板P(基板S)之感光性功能層照射與顯示器用之電路圖案或配線圖案相對應之紫外線之圖案化光。於處理裝置U3 內，設置有：邊緣位置控制器EPC，其將基板P之Y方向(寬度方向)之中心控制於固定位置；驅動輥DR4，其被夾持；旋轉筒DR5(壓印滾筒體30)，其以既定之張力部分地捲繞基板P，且呈一致之圓筒面狀支承基板P上之被圖案曝光之部分；及2組驅動輥DR6、DR7，其等用以對基板P賦予既定之鬆弛(遊隙)DL；等。 The processing device U3 as the substrate processing device 200 is the exposure device shown in FIG. 16 to FIG. 18 described above. The photosensitive functional layer of the substrate P (substrate S) transported from the processing device U2 is irradiated with a circuit for display The patterned light of ultraviolet rays corresponding to the pattern or wiring pattern. In the processing device U3, an edge position controller EPC is provided, which controls the center of the substrate P in the Y direction (width direction) to a fixed position; a driving roller DR4, which is clamped; a rotating drum DR5 (imprinting drum body 30), which partially winds the substrate P with a predetermined tension, and supports the pattern-exposed portion of the substrate P in a uniform cylindrical surface shape; and 2 sets of driving rollers DR6 and DR7, which are used for the substrate P Give a given relaxation (clearance) DL; etc.

進而，於處理裝置U3內設置有：透過型圓筒光罩M(光罩單元MU)；照明機構IU(照明部10)，其設置於該圓筒光罩M內，對形成於圓筒光罩M之外周面上之光罩圖案進行照明；及對準顯微鏡AM1、AM2，其等針對藉由旋轉筒DR5呈圓筒面狀得到支承之基板P之一部分，為了使圓筒光罩M之光罩圖案之一部分之圖像與基板P相對地位置對準(對準)，而檢測預先形成於基板P上之對準標記等。 Further, a transmissive cylindrical photomask M (photomask unit MU) and an illumination unit IU (lighting unit 10) are provided in the processing device U3. The mask pattern on the outer peripheral surface of the mask M is illuminated; and the alignment microscopes AM1 and AM2 are aimed at a part of the substrate P which is supported by the rotating cylinder DR5 in a cylindrical shape, in order to make the cylindrical mask M An image of a part of the mask pattern is aligned (aligned) with respect to the substrate P, and an alignment mark or the like formed in advance on the substrate P is detected.

處理裝置U4係對自處理裝置U3搬送而來之基板P之感光性功能層進行藉由濕式之顯影處理、無電解鍍敷處理等之濕式處理裝置。於處理裝置U4內，設置有：3個處理槽BT1、BT2、BT3，其等於Z方向階層化；複數個輥，其等使基板P彎折而搬送；及驅動輥DR8，其被夾持；等。 The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P transferred from the processing device U3. Inside the processing device U4, there are provided: three processing tanks BT1, BT2, and BT3, which are equal to the Z-direction hierarchy; a plurality of rollers, which bend and transport the substrate P; and a driving roller DR8, which is clamped; Wait.

處理裝置U5係將自處理裝置U4搬送而來之基板P暖化，而將於濕式製程中濕潤之基板P之水分含量調整為既定值之加熱乾燥裝置，省略詳細情況。其後，經過若干個處理裝置並通過一系列製程之最後之處理裝置Un後之基板P透過被夾持之驅動輥DR1而上捲於回收輥FR2上。於其上捲時，亦藉由邊緣位置控制器EPC2逐次修正控制驅動輥DR1與回收輥FR2之Y方向之相對位置，以便使基板P之Y方向(寬度方向)之中心、或Y方向之基板端不於Y方向產生偏差。 The processing device U5 is a heating and drying device that warms the substrate P transferred from the processing device U4, and adjusts the moisture content of the substrate P wetted in the wet process to a predetermined value, and details are omitted. Thereafter, the substrate P after passing through several processing devices and passing through the last processing device Un of the series of processes passes through the clamped driving roller DR1 and is wound on the recovery roller FR2. When it is rolled up, the relative position of the drive roller DR1 and the recovery roller FR2 in the Y direction is also corrected by the edge position controller EPC2 successively, so as to make the center of the Y direction (width direction) of the substrate P, or the substrate in the Y direction The end does not deviate from the Y direction.

於上述元件製造系統SYS中，由於使用上述基板處理裝置200作為處理裝置U3，故而可容易地形成圖案，且可抑制耗費如於保持部本體22形成圖案之情形時之時間而造成成本增加之情況，從而能以低成本製造高精度之元 件。 In the above-mentioned element manufacturing system SYS, since the substrate processing apparatus 200 is used as the processing apparatus U3, a pattern can be easily formed, and the cost increase due to the time when the pattern is formed on the holding portion body 22 can be suppressed, thereby increasing the cost. So that high-precision components can be manufactured at low cost.

再者，圖19所示之處理裝置U3亦可為上文之圖1~圖15之各實施形態中所說明之基板處理裝置100。 In addition, the processing apparatus U3 shown in FIG. 19 may also be the substrate processing apparatus 100 described in the embodiments of FIGS. 1 to 15 described above.

以上，一面參照隨附圖式一面對本發明之較佳之實施形態進行了說明，但當然本發明並不限定於上述例。上述例中所示之各構成構件之諸形狀或組合等為一例，可於不脫離本發明之主旨之範圍內根據設計要求等進行各種變更。 The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shapes, combinations, and the like of the constituent members shown in the above examples are examples, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

例如，於上述實施形態中，設為將光罩M捲繞(貼付)於保持部本體22之外周面22a上之構成，但並不限定於此，如圖20所示，亦可設為貼付於保持部本體22之內周面之構成。於該情形時，可採用如下構成等：將照明部10配置於光罩單元MU之外側，並且將光罩M之周向之長度設為未達保持部本體22之內周面之周長之一半，且使來自由照明部10之照明光照明之光罩圖案之光自與保持部本體22之照明光之入射位置相反之側出射；或利用設置在內筒21上之反射鏡部使來自光罩圖案之光向旋轉軸線AX1延伸之方向反射而導向光罩單元MU之外側。 For example, in the above-mentioned embodiment, the configuration in which the photomask M is wound (applied) around the outer peripheral surface 22a of the holding body 22 is not limited to this. As shown in FIG. 20, it may also be applied. The structure on the inner peripheral surface of the holding part body 22. In this case, a configuration may be adopted in which the lighting unit 10 is arranged outside the mask unit MU, and the length of the mask M in the circumferential direction is set to less than half of the circumference of the inner peripheral surface of the holding unit body 22, and The light from the mask pattern illuminated by the illumination light of the illuminating portion 10 is emitted from the side opposite to the incident position of the illumination light of the holding portion body 22; or the mirror portion provided on the inner cylinder 21 is used to make the light from the mask pattern The light is reflected in a direction in which the rotation axis AX1 extends and is guided to the outside of the mask unit MU.

又，於上述實施形態中，設為使用密封部70及抽吸部VC作為用以將光罩M固定於光罩保持部20之固定部的構成，但並不限定於此，例如，亦可設為使用接著劑將光罩M固定於光罩保持部20之構成、或使用藉由機械夾具機構將光罩M夾持固定於光罩保持部20上之夾持部進行固定之構成。 Moreover, in the said embodiment, although the structure which used the sealing part 70 and the suction part VC as the fixing part for fixing the mask M to the mask holding part 20 was set, it is not limited to this, For example, you may make it The photomask M is fixed to the photomask holding portion 20 using an adhesive, or the photomask M is fixed to the photomask holding portion 20 by a mechanical clamp mechanism.

又，亦可為藉由靜電吸附方式(庫侖力(Coulomb force))將光罩M吸附於光罩保持部20上之構成。 It is also possible to adopt a configuration in which the photomask M is adsorbed on the photomask holding portion 20 by an electrostatic adsorption method (Coulomb force).

即使於如上所述般將光罩M貼付於保持部本體22之內周面之情形時，若於保持部本體22之內周面與光罩M之間出現空氣層，則曝光於基板S上之圖案之像質劣化之可能性亦較高，故而較理想的是以與上文之實施形態相同 之方式，於保持部本體22之內周面與光罩M之間，以成為既定厚度之層之方式填充具有與光罩M之母材(玻璃等透明薄板)相同程度之折射率之液體。 Even when the photomask M is attached to the inner peripheral surface of the holding portion main body 22 as described above, if an air layer appears between the inner peripheral surface of the holding portion main body 22 and the photomask M, it is exposed on the substrate S. There is also a high possibility that the image quality of the pattern is degraded. Therefore, it is preferable to use the same manner as in the above embodiment, between the inner peripheral surface of the holding portion body 22 and the mask M, to become a predetermined thickness. The layer method is filled with a liquid having a refractive index similar to that of the base material (transparent thin plate such as glass) of the photomask M.

(第8實施形態) (Eighth embodiment)

以下，參照圖21至圖24，對本發明之第8實施形態之基板處理裝置進行說明。 Hereinafter, a substrate processing apparatus according to an eighth embodiment of the present invention will be described with reference to FIGS. 21 to 24.

於以下之說明中，存在對相同之構成要素標註相同符號而簡化或省略其說明之情況。又，只要無特別說明，則關於構成要素或其等之說明，設為與上述實施形態相同。 In the following description, the same components are denoted by the same symbols, and the descriptions thereof may be simplified or omitted. Unless otherwise stated, the description of the constituent elements or the like is the same as that of the embodiment described above.

圖21係基板處理裝置300之主要部分之前視剖面圖，圖22係基板處理裝置之剖面立體圖。 FIG. 21 is a front sectional view of a main part of the substrate processing apparatus 300, and FIG. 22 is a sectional perspective view of the substrate processing apparatus.

基板處理裝置300係將具有可撓性之片狀之光罩M之圖案相對於帶狀之基板(例如，帶狀之膜構件)S進行曝光處理者，且以照明部10、光罩單元MU2、基板保持單元SU、及控制部CONT作為主體而構成。 The substrate processing apparatus 300 is a person who exposes a pattern of a flexible sheet-shaped mask M to a strip-shaped substrate (for example, a strip-shaped film member) S, and uses the illumination section 10 and the mask unit MU2 The substrate holding unit SU and the control unit CONT are mainly constituted.

再者，於本實施形態中，將鉛垂方向設為Z方向，將與光罩單元MU2及基板保持單元SU之旋轉軸線平行之方向設為Y方向，將與Z方向及Y方向正交之方向設為X方向而進行說明。 Furthermore, in this embodiment, the vertical direction is set to the Z direction, the direction parallel to the rotation axes of the mask unit MU2 and the substrate holding unit SU is set to the Y direction, and the direction orthogonal to the Z direction and the Y direction is set to The direction is described as the X direction.

照明部10係朝向捲繞於光罩單元MU2中之光罩保持部20(下述)上之光罩M之照明區域照射照明光者，可使用與螢光燈同樣地以直管型且呈放射狀發出曝光用之照明光者、或自圓筒狀之石英棒之兩端導入照明光且於背面側設置有擴散構件者，並將其收容於支承光罩保持部20之內筒21之內部空間內。 The illuminating unit 10 is for illuminating the illuminating light toward the illuminating area of the reticle M wrapped around the reticle holding unit 20 (described below) in the reticle unit MU2, and it can be used in a straight tube type similar to a fluorescent lamp. Those who emit illumination light for exposure radially, or those who introduce illumination light from both ends of a cylindrical quartz rod and are provided with a diffusing member on the back side, and store it in the inner tube 21 supporting the mask holding portion 20 Inside the space.

光罩單元MU2具備光罩保持部20、板彈簧(彈性構件)24、及轉動體(支承構件)25。光罩保持部20具備圓筒狀之保持部本體(圖案保持構件)22、及分別設置於保持部本體22之長度方向兩端部之保持具(環狀部)23。該等保持部本體22、保持具23、板彈簧24、轉動體25係以一體化之狀態進行設置，又，分別形成有於旋轉軸線(既定之軸線)AX1方向連通而供內筒21插通 之貫通孔。 The mask unit MU2 includes a mask holding portion 20, a leaf spring (elastic member) 24, and a rotating body (support member) 25. The photomask holding portion 20 includes a cylindrical holding portion body (pattern holding member) 22 and holders (annular portions) 23 provided at both ends in the longitudinal direction of the holding portion body 22, respectively. The holding body 22, the holder 23, the plate spring 24, and the rotating body 25 are installed in an integrated state, and are formed in the rotation axis (predetermined axis) in the direction of AX1, and the inner tube 21 is inserted through. Of through holes.

內筒21係由可使照明光透過之圓筒狀之石英等、或者具備供來自照明部10之照明光通過之狹縫狀之開口部21a的圓筒狀之陶瓷材料或金屬等形成。保持部本體22於其外周面形成有沿著既定半徑之圓筒面保持光罩M之光罩保持面22a。保持具23係由金屬材料形成為圓環狀，如圖23所示，藉由硬化後表現彈性接著性能之接著劑23a而與保持部本體22之端部外周面接著。作為保持具23之形成材料，較佳為具有與保持部本體22相同之線膨脹係數者，但於線膨脹係數存在差之情形時，設為線膨脹係數較大之保持具23自外周側保持保持部本體22之構成，以便不因保持部本體22與保持具23之熱膨脹之差而對保持部本體22施加較大之負載。 The inner tube 21 is formed of a cylindrical quartz or the like through which illumination light is transmitted, or a cylindrical ceramic material or metal having a slit-shaped opening portion 21a through which the illumination light from the illumination portion 10 passes. The holding portion body 22 has a mask holding surface 22 a formed on the outer peripheral surface thereof to hold the mask M along a cylindrical surface of a predetermined radius. The holder 23 is formed in a ring shape from a metal material, and as shown in FIG. 23, it is adhered to the outer peripheral surface of the end portion of the holder main body 22 by an adhesive 23 a that exhibits elastic adhesive properties after curing. As the forming material of the holder 23, it is preferable to have the same linear expansion coefficient as that of the holding body 22, but when there is a difference in the linear expansion coefficient, it is assumed that the holder 23 having a larger linear expansion coefficient is held from the outer peripheral side. The structure of the holding portion body 22 is such that a large load is not applied to the holding portion body 22 due to the difference in thermal expansion between the holding portion body 22 and the holder 23.

轉動體25透過板彈簧24、間隔件24A、24B(參照圖23及圖24)與保持部本體22物理性地結合(連結)，且具有繞旋轉軸線AX1突設於外周側並於壓印滾筒體30之外周面上轉動之壓印滾筒設置部25a。壓印滾筒設置部25a之外徑係形成為較保持於保持部本體22之光罩保持面22a上之光罩M之外側之面所構成之外徑大既定量。具體而言，於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面而將保持部本體22支承於既定位置時，壓印滾筒設置部25a之外徑係形成為在保持於壓印滾筒體30上之基板S與光罩M之間形成既定量之間距之值。 The rotating body 25 is physically coupled (connected) to the holding portion body 22 through the leaf spring 24, the spacers 24A and 24B (see FIGS. 23 and 24), and has a protrusion protruding around the rotation axis AX1 on the outer peripheral side and on the impression cylinder. The impression cylinder setting portion 25a that rotates on the outer peripheral surface of the body 30. The outer diameter of the impression cylinder setting portion 25 a is larger than the outer diameter of the mask M held on the mask holding surface 22 a of the holding portion main body 22 by an outer diameter that is larger than the outer diameter. Specifically, when the impression cylinder setting portion 25a abuts against the outer peripheral surface of the impression cylinder body 30 to support the holding portion body 22 at a predetermined position, the outer diameter of the impression cylinder setting portion 25a is formed to be maintained at the pressure A predetermined distance is formed between the substrate S and the photomask M on the platen body 30.

又，轉動體25於內周側透過空氣軸承26而相對於內筒21繞旋轉軸線AX1以非接觸之方式旋轉自如地受到支承。因此，保持部本體22、保持具23、板彈簧24、轉動體25繞旋轉軸線AX1一體地旋轉。 In addition, the rotating body 25 is rotatably supported in a non-contact manner about the rotation axis AX1 with respect to the inner cylinder 21 through the air bearing 26 on the inner peripheral side. Therefore, the holding body 22, the holder 23, the plate spring 24, and the rotating body 25 are integrally rotated around the rotation axis AX1.

板彈簧24係容許保持部本體22之旋轉軸線AX1之伸縮者，如圖24所示，由例如鋼材形成為環狀(圓環狀)。如圖23所示，板彈簧24透過間隔件24A於Y方向留出既定量之間隙而固定於轉動體25上。同樣地，板彈簧24透過間隔件24B於Y方向留出既定量之間隙而固定於保持具23上。間隔件24A係於距旋轉軸 線AX1之距離大致相同之位置上繞旋轉軸線AX1以等間隔設置有3個。間隔件24B係於距旋轉軸線AX1之距離大於間隔件24A之位置上，以繞旋轉軸線AX1之位置處於間隔件24A之間之方式以等間隔設置有3個。 The leaf spring 24 is a retractor that allows the rotation axis AX1 of the holding body 22 to be formed. The leaf spring 24 is, for example, formed in a ring shape (ring shape) from a steel material, as shown in FIG. 24. As shown in FIG. 23, the leaf spring 24 is fixed to the rotating body 25 by leaving a predetermined amount of gap in the Y direction through the spacer 24A. Similarly, the leaf spring 24 is fixed to the holder 23 by leaving a predetermined amount of gap in the Y direction through the spacer 24B. Three spacers 24A are provided at approximately equal distances from the rotation axis line AX1 around the rotation axis AX1 at equal intervals. The spacers 24B are located at a distance from the rotation axis AX1 larger than the spacer 24A, and three spacers 24B are provided at equal intervals so that the position around the rotation axis AX1 is between the spacers 24A.

該等板彈簧24、間隔件24A、24B作為傳達部，於連結之保持具23、保持部本體22與轉動體25之間傳達旋轉驅動力，藉此使透過板彈簧24、間隔件24A、24B而連結之保持具23、保持部本體22及轉動體25成為如下構成：於繞旋轉軸線AX1之方向一體地旋轉，於旋轉軸線AX1方向，藉由作為伸縮容許部之板彈簧24產生彈性變形，而可實現保持具23、保持部本體22與轉動體25之相對之微小移動。 The leaf springs 24 and the spacers 24A and 24B serve as transmitting portions and transmit rotational driving force between the connected holder 23, the retaining body 22 and the rotating body 25, thereby allowing the leaf springs 24 and the spacers 24A and 24B to pass through. The connected holder 23, the holding unit body 22, and the rotating body 25 are configured to rotate integrally in the direction around the rotation axis AX1, and in the direction of the rotation axis AX1, the plate spring 24 as an expansion and contraction permitting portion is elastically deformed. The relative movement of the holder 23, the holding portion body 22, and the rotating body 25 can be realized.

圖24所示之環狀之板彈簧24詳細而言成為如圖25所示之構成，於板彈簧24之一面上，以旋轉軸線AX1作為中心以約120度之配置固定3個間隔件24A，於板彈簧24之另一面上，以旋轉軸線AX1作為中心以約120度之配置且相對於表側之間隔件24A以±60度之配置固定3個間隔件24B。而且，間隔件24A、24B之各厚度設為相同，周向之尺寸設定得儘可能小。 The ring-shaped leaf spring 24 shown in FIG. 24 has the structure shown in FIG. 25 in detail. On one surface of the leaf spring 24, the three spacers 24A are fixed at a position of about 120 degrees with the rotation axis AX1 as the center. On the other surface of the plate spring 24, three spacers 24B are fixed at a position of about 120 degrees with the rotation axis AX1 as a center and at a position of ± 60 degrees with respect to the spacer 24A on the front side. The thicknesses of the spacers 24A and 24B are set to be the same, and the dimensions in the circumferential direction are set to be as small as possible.

3個間隔件24A藉由螺釘緊固環狀之轉動體25之端面與板彈簧24，3個間隔件24B藉由螺釘緊固環狀之保持具23之端面與板彈簧24。 The three spacers 24A fasten the end surface of the ring-shaped rotating body 25 and the leaf spring 24 by screws, and the three spacers 24B fasten the end surface of the ring-shaped holder 23 and the leaf spring 24 by screws.

於本實施形態中，以此種構造構成伸縮容許部，此外，如圖26所示，亦可準備於Y方向(軸線AX1延伸之方向)與環狀之保持具23之直徑方向R上可彈性變形、且於保持具23之切線方向T上剛性極高之金屬性之撓曲構造體FLX，藉由該撓曲構造體FLX，於3處(以旋轉軸線AX1作為中心呈120度配置)緊固保持具23與轉動體25。 In this embodiment, the expansion and contraction permitting portion is configured with such a structure. In addition, as shown in FIG. 26, it is also possible to prepare elasticity in the Y direction (the direction in which the axis AX1 extends) and the diameter direction R of the ring-shaped holder 23. The flexible flexible structure FLX that deforms and is extremely rigid in the tangential direction T of the holder 23, and the flexible structure FLX is tightened at three places (arranged at 120 degrees with the rotation axis AX1 as the center). Securing holder 23 and rotating body 25.

如圖26所示之撓曲構造體FLX若為1個則直徑方向R之剛性極低，但若自軸線AX1等距離地繞軸線AX1以120度配置於3處，則各撓曲構造體FLX之直徑方向R之變形自如度互相約束，從而保持具23與轉動體25於與旋轉軸線AX1正交之 XZ面內方向以較高之剛性被緊固，於旋轉軸線AX1延伸之Y方向可彈性移位地被緊固。 If there is one flexural structure FLX as shown in FIG. 26, the rigidity in the diameter direction R is extremely low. However, if the flexural structures FLX are arranged at equal positions from the axis AX1 around the axis AX1 at three places at 120 degrees, each flexural structure FLX is provided. The freedom of deformation of the diameter direction R is restricted to each other, so that the holder 23 and the rotating body 25 are fastened in the XZ plane orthogonal to the rotation axis AX1 with high rigidity, and the Y direction extending in the rotation axis AX1 is elastic. Displaceably fastened.

內筒21係透過板彈簧28而載置於自於Y方向留出間隔而設置之基座部B向互相接近之方向延伸設置之支承台27上。板彈簧28之彈簧常數係根據光罩保持部20之自重及透過轉動體25對壓印滾筒體30施加之負載、即轉動體25之壓印滾筒設置部25a於壓印滾筒體30之外周面上轉動時之摩擦力而設定。於內筒21之內部空間內配設有上述照明部10，於在照明部10之照明光出射方向對向之位置上形成有供照明光通過之開口部21a(參照圖21及圖22)。 The inner cylinder 21 is placed on a support base 27 provided in a direction in which the base portion B provided in the Y-direction is spaced apart from each other through a leaf spring 28. The spring constant of the plate spring 28 is based on the weight of the mask holding portion 20 and the load applied to the impression cylinder body 30 through the rotating body 25, that is, the impression cylinder setting portion 25a of the rotating body 25 on the outer peripheral surface of the impression cylinder body 30. Set the friction force when turning up. The above-mentioned lighting section 10 is arranged in the inner space of the inner tube 21, and an opening 21a (see FIGS. 21 and 22) through which the illumination light passes is formed at a position opposite to the direction in which the illumination light exits from the illumination section 10.

基板保持單元SU具備壓印滾筒體(旋轉筒)30。 The substrate holding unit SU includes an impression cylinder (rotary cylinder) 30.

壓印滾筒體30係形成為繞與Y軸平行且設定於旋轉軸線AX1之-Z側之旋轉軸線(第2軸線)AX2旋轉之圓柱狀，如圖22所示，於內部設置有中空部30a且以慣性力矩變小之方式設定。壓印滾筒體30之外周面係設為接觸保持基板S之基板保持面31。於壓印滾筒體30之Y方向兩端面上，直徑較壓印滾筒體30小且以同軸突出之旋轉支承部32繞旋轉軸線AX2旋轉自如地支承於基座部B上。又，於本實施形態中，設置有藉由旋轉驅動壓印滾筒體30而使壓印滾筒體30與光罩保持部20同步地旋轉之驅動裝置33。 The impression cylinder body 30 is formed in a cylindrical shape that rotates around a rotation axis (second axis) AX2 that is parallel to the Y axis and set on the -Z side of the rotation axis AX1. As shown in FIG. 22, a hollow portion 30a is provided inside It is set so that the moment of inertia becomes smaller. The outer peripheral surface of the impression cylinder body 30 is a substrate holding surface 31 that contacts and holds the substrate S. On the both end surfaces in the Y direction of the impression cylinder body 30, a rotation support portion 32 having a smaller diameter than the impression cylinder body 30 and protruding coaxially is rotatably supported on the base portion B about a rotation axis AX2. Further, in this embodiment, a driving device 33 is provided that rotates the impression cylinder body 30 in synchronization with the mask holding portion 20 by rotationally driving the impression cylinder body 30.

其次，對上述構成之基板處理裝置300之動作進行說明。 Next, the operation of the substrate processing apparatus 300 having the above-described configuration will be described.

透過空氣軸承26而由內筒21支承且保持光罩M之光罩保持部20於轉動體25之壓印滾筒設置部25a對壓印滾筒體30賦予該光罩保持部20之自重與通板彈簧28之彈簧常數相應之向+Z側之賦能力之差量之負載的狀態下抵接。藉此，於光罩保持面22a與基板保持面31之間、即光罩M與基板S之間形成與壓印滾筒設置部25a之外徑相應之既定量之間距。再者，於調整壓印滾筒設置部25a對壓印滾筒體30賦予之負載時，只要更換為具有對應之彈簧常數之板彈簧28，或於在內筒21與支承台27之間預先***有間隔件之狀態下設置板彈簧28而更換為與壓印滾筒 設置部25a對壓印滾筒體30賦予之負載相應之間隔件即可。 The mask holding portion 20 supporting the mask M supported by the inner cylinder 21 through the air bearing 26 and the impression cylinder setting portion 25 a of the rotating body 25 gives the impression cylinder body 30 with its own weight and through plate of the mask retaining portion 20 The spring constant of the spring 28 abuts in a state of a load corresponding to a difference in the energizing capacity to the + Z side. Thereby, a predetermined distance is formed between the mask holding surface 22a and the substrate holding surface 31, that is, between the photomask M and the substrate S, corresponding to the outer diameter of the impression cylinder setting portion 25a. In addition, when adjusting the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a, it is only necessary to replace it with a plate spring 28 having a corresponding spring constant, or insert it between the inner cylinder 21 and the support table 27 in advance. In the state of the spacer, the plate spring 28 may be provided and replaced with a spacer corresponding to the load applied to the impression cylinder body 30 by the impression cylinder setting portion 25a.

其次，壓印滾筒體30藉由驅動裝置33之驅動而繞旋轉軸線AX2旋轉，並且自照明部10照射照明光，透過開口部21a透過保持部本體22，而自內周側對光罩M進行照明。伴隨著壓印滾筒體30之旋轉，而搬送捲繞於壓印滾筒體30之基板保持面31上而保持之基板S，並且於壓印滾筒設置部25a抵接於壓印滾筒體30之外周面之轉動體25被帶動旋轉，藉此透過板彈簧24、間隔件24A、24B將旋轉驅動力傳達至保持具23及保持部本體22，從而保持於保持部本體22上之光罩M之圖案於將與基板S之既定量之間距維持為固定之狀態下同步地移動。其次，由照明光照明之光罩M之圖案影像被逐次投影至基板S之投影區域。 Next, the impression cylinder body 30 is rotated around the rotation axis AX2 by the drive of the driving device 33, and illuminating light is irradiated from the illuminating section 10, through the opening section 21a, and through the holding section body 22, and the photomask M is performed from the inner peripheral side. illumination. Along with the rotation of the impression cylinder body 30, the substrate S that is wound and held on the substrate holding surface 31 of the impression cylinder body 30 is conveyed, and abuts against the outer periphery of the impression cylinder body 30 at the impression cylinder setting portion 25a. The rotating body 25 on the surface is driven to rotate, whereby the rotational driving force is transmitted to the holder 23 and the holder main body 22 through the plate spring 24, the spacers 24A, 24B, and the pattern of the photomask M held on the holder main body 22 is retained. It moves synchronously while maintaining a fixed distance from the predetermined amount of the substrate S. Second, the pattern image of the mask M illuminated by the illumination light is successively projected onto the projection area of the substrate S.

此時，光罩保持部20及壓印滾筒體30中，為了於壓印滾筒設置部25a與基板保持面31抵接之位置(直徑)上使周邊速度變為相同，且為了使光罩M與基板S之相對移動速度相同，光罩M之外周面之位置(直徑)及基板S之外周面之位置(直徑)係預先根據光罩M及基板S之厚度、保持部本體22之光罩保持面22a之直徑、壓印滾筒體30之基板保持面31之直徑之比而調整。例如，於光罩M及基板S之厚度相同，且光罩保持面22a之直徑、壓印滾筒體30之基板保持面31之直徑相同，保持部本體22及壓印滾筒體30以相同之角速度旋轉之情形時，只要使壓印滾筒設置部25a與基板保持面31抵接之位置至光罩M之外周面之位置之距離、與壓印滾筒設置部25a與基板保持面31抵接之位置至基板S之外周面之位置之距離相同即可。又，於除此以外之情形時，較佳為以光罩M之外周面之周邊速度與基板S之外周面之周邊速度相同之方式，對保持部本體22及壓印滾筒體30之各者設定壓印滾筒設置部25a及基板保持面31之抵接位置之直徑。 At this time, in the mask holding portion 20 and the impression cylinder body 30, in order to make the peripheral speeds the same at the position (diameter) where the impression cylinder setting portion 25a abuts the substrate holding surface 31, and to make the mask M The position (diameter) of the outer peripheral surface of the mask M and the position (diameter) of the outer peripheral surface of the substrate S are the same as the relative moving speed of the substrate S. The mask of the holding unit body 22 is previously determined according to the thickness of the mask M and the substrate S. The ratio of the diameter of the holding surface 22a and the diameter of the substrate holding surface 31 of the impression cylinder body 30 is adjusted. For example, when the thickness of the mask M and the substrate S are the same, and the diameter of the mask holding surface 22a and the diameter of the substrate holding surface 31 of the impression cylinder body 30 are the same, the holding portion body 22 and the impression cylinder body 30 have the same angular velocity In the case of rotation, the distance from the position where the impression cylinder setting portion 25a abuts the substrate holding surface 31 to the position on the outer peripheral surface of the mask M and the position where the impression cylinder setting portion 25a abuts the substrate holding surface 31 The distances to the positions on the outer peripheral surface of the substrate S may be the same. In other cases, it is preferable that the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S be the same as those of the holding portion body 22 and the impression cylinder body 30. The diameters of the contact positions of the impression cylinder setting portion 25 a and the substrate holding surface 31 are set.

因此，參照圖27，對使光罩M之外周面之周邊速度與基板S之外周面之周邊速度一致為相同之一例進行說明。圖27係對藉由上文之圖11中所說明之填隙片之直徑調節方法進行變形而成者，對與圖23中之構件相同之構件標 註相同之符號。其變形部分為如下方面：如圖27所示，於基板保持面31中之與壓印滾筒設置部25a抵接之部分捲繞有環狀之填隙片(既定厚度之金屬性之帶)31B，於在該圖之YZ面內觀察時，將壓印滾筒設置部25a之外周面與填隙片(既定厚度之金屬性之帶)31B之外周面之抵接位置設定為光罩M與基板S之間之間距G之大致中間之位置Cx。 Therefore, an example in which the peripheral speed of the outer peripheral surface of the mask M and the peripheral speed of the outer peripheral surface of the substrate S are made the same will be described with reference to FIG. 27. FIG. 27 is a modification obtained by modifying the diameter adjustment method of the shim as described in FIG. 11 above, and the same components as those in FIG. 23 are marked with the same symbols. The deformed part is as follows: As shown in FIG. 27, a ring-shaped interstitial sheet (metallic band of a predetermined thickness) 31B is wound on a portion of the substrate holding surface 31 that abuts the impression cylinder setting portion 25a. When viewed in the YZ plane of the figure, the contact position between the outer peripheral surface of the impression cylinder setting portion 25a and the outer peripheral surface of the interstitial sheet (metallic belt of a predetermined thickness) 31B is set as the mask M and the substrate The distance C between the S and G is approximately the middle.

位置Cx係設定為r11+Mt+G/2作為光罩M之自旋轉軸線AX1之半徑之位置，亦為設定為r2+St+G/2作為壓印滾筒體30之自旋轉軸線AX2之半徑之位置。 Position Cx is set to r11 + Mt + G / 2 as the radius of the self-rotation axis AX1 of the mask M, and also set to r2 + St + G / 2 as the radius of the self-rotation axis AX2 of the impression cylinder 30 Its location.

填隙片31B係選擇(準備)如滿足此種條件之厚度者，而捲繞於基板保持面31之外周面上，但於其厚度可固定之情形時，只要將基板保持面31之與壓印滾筒設置部25a抵接之部分之直徑加工成r2+St+G/2即可。又，於能夠可更換地捲繞填隙片31B之情形時，可根據基板S之厚度St或間距G之尺寸之變更，而換貼上最佳厚度之填隙片31B。 The interstitial sheet 31B is selected (prepared) if the thickness satisfying such conditions is wound on the outer peripheral surface of the substrate holding surface 31, but when the thickness can be fixed, the substrate holding surface 31 and the The diameter of the abutting portion of the cylinder setting portion 25a may be processed to r2 + St + G / 2. When the interstitial sheet 31B can be wound around, the interstitial sheet 31B of the optimal thickness can be replaced according to the change in the thickness St of the substrate S or the size of the pitch G.

且說，若連續地進行上述曝光處理，則會於由照明光照明之保持部本體22中產生熱膨脹。關於保持部本體22之直徑方向之熱膨脹，由於自外周側保持保持部本體22之保持具23係由金屬材料形成且線膨脹係數大於保持部本體22之線膨脹係數，容許熱膨脹而不會約束保持部本體22，故而可避免對保持部本體22施加較大之負載。又，此時，雖然保持部本體22與保持具23沿著分離之方向熱膨脹，但由於接著劑23a具備彈性接著性能，故而亦可防止保持具23對保持部本體22之保持鬆弛。 In addition, if the above-mentioned exposure processing is performed continuously, thermal expansion occurs in the holding portion body 22 illuminated by the illumination light. Regarding the thermal expansion in the diameter direction of the holding portion body 22, since the holder 23 holding the holding portion body 22 from the outer peripheral side is formed of a metal material and the coefficient of linear expansion is larger than the linear expansion coefficient of the holding portion body 22, thermal expansion is allowed without restraining the retention The main body 22 can avoid a large load on the holding main body 22. At this time, although the holding portion main body 22 and the holder 23 are thermally expanded in the direction of separation, the adhesive 23a has elastic bonding performance, so the holding of the holding portion 23 to the holding portion main body 22 can be prevented from being loosened.

再者，於保持具23之線膨脹係數小於保持部本體22之線膨脹係數之情形時，較佳為選擇保持具23自內周側保持保持部本體22之構成，但即使為自外周側進行保持之構成，亦可藉由上述接著劑23a進行彈性變形，而緩和於熱膨脹時對保持部本體22施加之負載。 Furthermore, when the linear expansion coefficient of the holder 23 is smaller than the linear expansion coefficient of the holding portion body 22, it is preferable to select a configuration in which the holding portion 23 holds the holding portion body 22 from the inner peripheral side, but even if it is performed from the outer peripheral side The structure of the holding can also reduce the load applied to the holding portion body 22 during thermal expansion by the elastic deformation of the adhesive 23a.

又，於保持部本體22沿著旋轉軸線AX1方向發生熱膨脹時，板彈簧24以藉由間隔件24A而固定之部位為基點，使藉由間隔件24B而固定之部位沿著朝向轉動體25之方向彈性變形。如此，藉由板彈簧24之彈性變形而容許保持部本體22之熱膨脹，故而避免對保持部本體22施加旋轉軸線AX1方向之較大之負載。 When the holding portion body 22 is thermally expanded in the direction of the rotation axis AX1, the plate spring 24 uses the portion fixed by the spacer 24A as a base point, and makes the portion fixed by the spacer 24B along the direction of the rotating body 25. Elastic deformation in direction. In this way, the thermal expansion of the holding portion body 22 is allowed by the elastic deformation of the leaf spring 24, so that a large load in the direction of the rotation axis AX1 is not applied to the holding portion body 22.

如以上所說明般，於本實施形態中，於直徑方向，使具備彈性接著性能之接著劑23a介於保持部本體22與保持具23之間，於旋轉軸線AX1方向，板彈簧24進行彈性變形，藉此容許因溫度變化而產生之熱膨脹。因此，於本實施形態中，伴隨著熱膨脹而對保持部本體22施加之負載得到緩和，故而可抑制因所施加之負載而導致於保持部本體22產生變形等，從而對向基板S之圖案形成造成不良影響之情況。 As described above, in this embodiment, the adhesive 23a having elastic adhesive properties is interposed between the holding portion body 22 and the holder 23 in the diameter direction, and the leaf spring 24 is elastically deformed in the direction of the rotation axis AX1. This allows thermal expansion due to temperature changes. Therefore, in this embodiment, the load applied to the holding portion main body 22 is relieved along with thermal expansion, so that deformation of the holding portion main body 22 due to the applied load can be suppressed, and the pattern of the opposing substrate S can be formed. Causes adverse effects.

於圖19所示之元件製造系統SYS中，可使用上述基板處理裝置300作為處理裝置U3，故而可降低因溫度變化而導致對向基板S之圖案形成造成之不良影響，因此可製造以高精度形成圖案之元件。 In the component manufacturing system SYS shown in FIG. 19, the above-mentioned substrate processing apparatus 300 can be used as the processing apparatus U3, so that the adverse effect caused by the temperature change on the pattern formation of the opposing substrate S can be reduced, so it can be manufactured with high accuracy Patterned elements.

以上，一面參照隨附圖式一面對本發明之較佳之實施形態進行了說明，但當然本發明並不限定於上述例。上述例中所示之各構成構件之諸形狀或組合等為一例，可於不脫離本發明之主旨之範圍內根據設計要求等進行各種變更。 The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above examples. The shapes, combinations, and the like of the constituent members shown in the above examples are examples, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

例如，於上述實施形態中，設為於保持部本體22之外周面保持具有圖案之片材之光罩M之構成，但並不限定於此，亦可為於保持部本體22(透明圓筒材料)之外周面直接形成光罩圖案之構成。 For example, in the above embodiment, the configuration of the photomask M holding the sheet material having a pattern on the outer peripheral surface of the holding portion main body 22 is not limited to this, and the holding portion main body 22 (transparent cylinder) may be used. Material) A structure in which a mask pattern is directly formed on the outer peripheral surface.

又，亦可設為使光罩M並非保持於保持部本體22之外周面而係保持於保持部本體22之內周面之構成。進而，亦可為將保持部本體22並非設為圓筒狀而係設為圓柱狀，且照明部10自外周側對保持於外周面上之光罩M照射照明光之構成。 The photomask M may be configured not to be held on the outer peripheral surface of the holding portion body 22 but to be held on the inner peripheral surface of the holding portion body 22. Furthermore, a configuration may be adopted in which the holding portion main body 22 is not cylindrical but in a cylindrical shape, and the illuminating portion 10 radiates illumination light to the mask M held on the outer peripheral surface from the outer peripheral side.

又，於上述實施形態中，設為藉由轉動體25與壓印滾筒體30帶動旋轉(藉由摩擦接觸而旋轉)而使保持部本體22(光罩M)旋轉之構成，但並不限定於此，即使為保持部本體22(光罩M)藉由馬達等驅動裝置而獨立地旋轉之構成亦可應用本發明。 Moreover, in the said embodiment, although it is set as the structure which rotates the holding | maintenance part main body 22 (photomask M) by rotation (rotation by frictional contact) by the rotation body 25 and the impression cylinder body 30, it is not limited to this. Here, the present invention can be applied to a configuration in which the holding unit body 22 (the mask M) is independently rotated by a driving device such as a motor.

於該情形時，省略轉動體25之壓印滾筒設置部25a，兩側之轉動體25透過空氣軸承26可旋轉地樞轉支承於設置在曝光裝置之本體之內筒21上，並且與馬達之轉子等結合。馬達之旋轉驅動力係透過轉動體25、板彈簧24、保持具23而傳遞給保持部本體22(光罩M)。 In this case, the embossing cylinder setting portion 25a of the rotating body 25 is omitted, and the rotating bodies 25 on both sides are rotatably pivotally supported on the inner tube 21 provided on the main body of the exposure device through an air bearing 26, and the Rotor, etc. combined. The rotational driving force of the motor is transmitted to the holding portion body 22 (photomask M) through the rotating body 25, the plate spring 24, and the holder 23.

即使於此種構成之情形時，於旋轉軸線AX1方向，亦可藉由板彈簧24進行彈性變形，而容許因溫度變化所產生之保持部本體22(光罩M)之熱膨脹，從而緩和於保持部本體22產生無需之應力之情況，且可抑制於保持部本體22產生變形等。 Even in such a configuration, in the direction of the rotation axis AX1, the plate spring 24 can be elastically deformed to allow thermal expansion of the holding portion body 22 (photomask M) due to temperature changes, thereby relaxing the holding In the case where unnecessary stress is generated in the main body 22, deformation of the holding main body 22 and the like can be suppressed.

Claims (11)

一種旋轉光罩單元，其係安裝於既定之處理裝置，受到旋轉驅動力而可繞既定之軸線旋轉之圓筒狀或圓柱狀者；且具備：圓筒狀或圓柱狀之圖案保持構件，其沿著距離該軸線具有固定之半徑並且於該軸線之方向具有既定尺寸之周面保持光罩圖案；支承構件，其與該圖案保持構件物理性地結合，且將該圖案保持構件支承於處理裝置之既定位置；及伸縮容許部，其於該支承構件與該圖案保持構件之物理性結合中，以容許該圖案保持構件之軸線方向之伸縮之方式連結該圖案保持構件與該支承構件。     A rotary photomask unit is a cylindrical or cylindrical shape that is mounted on a predetermined processing device and can be rotated about a predetermined axis by a rotational driving force; and includes a cylindrical or cylindrical pattern holding member, The mask pattern is held along a peripheral surface having a fixed radius from the axis and having a predetermined size in the direction of the axis; a support member that is physically combined with the pattern holding member and supports the pattern holding member on a processing device A predetermined position; and an expansion and contraction permitting unit that connects the pattern holding member and the support member in a physical combination of the support member and the pattern holding member so as to allow expansion and contraction in the axial direction of the pattern holding member.     如申請專利範圍第1項之旋轉光罩單元，其中該支承構件具備傳達部，該傳達部透過該伸縮容許部向該圖案保持構件傳遞該旋轉驅動力，該伸縮容許部包含可彈性變形之彈性構件，該彈性構件於該旋轉驅動力之方向剛性較高，於該軸線之方向剛性較低。     For example, the rotating photomask unit of the scope of application for a patent, wherein the supporting member is provided with a transmitting portion, and the transmitting portion transmits the rotational driving force to the pattern holding member through the telescopic permitting portion, and the telescopic permitting portion includes elastically deformable elasticity The rigidity of the elastic member is higher in the direction of the rotational driving force and lower in rigidity in the direction of the axis.     如申請專利範圍第1或2項之旋轉光罩單元，其中該伸縮容許部具備支承該圖案保持構件之周面之環狀部；在該環狀部與該圖案保持構件之周面之間設置有容許該圖案保持構件之直徑方向之伸縮的第2伸縮容許部。     For example, the rotating photomask unit of the scope of patent application No. 1 or 2, wherein the expansion and contraction permitting portion includes a ring-shaped portion supporting the peripheral surface of the pattern holding member; provided between the ring-shaped portion and the peripheral surface of the pattern holding member There is a second expansion and contraction permitting portion that allows expansion and contraction in the radial direction of the pattern holding member.     如申請專利範圍第1項之旋轉光罩單元，其中該第2伸縮容許部包含以既定之厚度裝填於該環狀部與該圖案保持構件之周面之間之接著劑。     For example, the rotating photomask unit of the first scope of the patent application, wherein the second telescopic allowable portion includes an adhesive filled between the annular portion and the peripheral surface of the pattern holding member with a predetermined thickness.     如申請專利範圍第1項之旋轉光罩單元，其中該圖案保持構件具有既定半徑之外周面與既定半徑之內周面，且由該軸線方向之尺寸為既定長度之圓筒狀之透光性材料構成，作為該伸縮容許部之該環狀部保持該圖案保持構件之周面，根據該環狀部之線膨脹係數與該圖案保持構件之線膨脹係數之差而選擇該圖案保持構件之該外周面與該內周面中之任一者。     For example, the rotating photomask unit of the scope of application for a patent, wherein the pattern holding member has a peripheral surface with a predetermined radius and a peripheral surface with a predetermined radius, and the size of the axis direction is a cylindrical light transmission of a predetermined length. Material configuration, as the ring-shaped portion of the telescopic allowable portion holds the peripheral surface of the pattern holding member, the pattern holding member is selected based on the difference between the linear expansion coefficient of the ring portion and the linear expansion coefficient of the pattern holding member. Either the outer peripheral surface or the inner peripheral surface.     如申請專利範圍第1項之旋轉光罩單元，其中該圖案保持構件沿著該周面保持形成有該光罩之圖案之片材。     For example, the rotating photomask unit of the scope of application for a patent, wherein the pattern holding member holds a sheet on which a pattern of the photomask is formed along the peripheral surface.     一種基板處理裝置，其具備申請專利範圍第1項至第6項中任一項之旋轉光罩單元、及保持轉印該光罩圖案之基板之基板保持單元。     A substrate processing apparatus includes a rotating photomask unit according to any one of claims 1 to 6, and a substrate holding unit that holds a substrate on which the photomask pattern is transferred.     如申請專利範圍第7項之基板處理裝置，其中該基板保持單元包含可繞與該光罩單元之軸線大致平行之第2軸線旋轉之旋轉筒，且藉由該旋轉筒之旋轉使由該旋轉筒之外周面支承之該基板沿與該第2軸線大致正交之方向移動。     For example, the substrate processing apparatus of claim 7 in which the substrate holding unit includes a rotating cylinder rotatable about a second axis substantially parallel to the axis of the photomask unit, and the rotation is caused by the rotation of the rotating cylinder. The substrate supported on the outer peripheral surface of the cylinder moves in a direction substantially orthogonal to the second axis.     如申請專利範圍第8項之基板處理裝置，其中該光罩單元之該支承構件之該傳達部具備以該圖案保持構件之軸線為中心之既定半徑之外周面，且藉由使該傳達部之該外周面抵接於該旋轉筒之該外周面，而使該光罩單元旋轉。     For example, the substrate processing apparatus of the eighth patent application range, wherein the transmitting portion of the supporting member of the photomask unit has an outer peripheral surface with a predetermined radius centered on the axis of the pattern holding member, and The outer peripheral surface is abutted against the outer peripheral surface of the rotating cylinder, and the photomask unit is rotated.     如申請專利範圍第9項之基板處理裝置，其中於使該傳達部之該外周面與該旋轉筒之該外周面抵接之狀態下，該圖案保持構件之該外周面與該旋轉筒之該外周面具有既定量之間距而配置。     For example, in the substrate processing apparatus of claim 9 in which the outer peripheral surface of the conveying portion is in contact with the outer peripheral surface of the rotary cylinder, the outer peripheral surface of the pattern holding member and the rotary cylinder The outer peripheral surface is arranged with a predetermined distance.     如申請專利範圍第10項之基板處理裝置，其中以使藉由該光罩單元之旋轉之該光罩圖案之周邊速度與藉由該旋轉筒之旋轉之該基板之移動速度大致一致之方式，設定該傳達部之該外周面之直徑與該旋轉筒之該外周面之抵接部分之直徑。     For example, the substrate processing device of the scope of application for patent No. 10, wherein the peripheral speed of the mask pattern by the rotation of the mask unit is substantially consistent with the moving speed of the substrate by the rotation of the rotary cylinder, The diameter of the outer peripheral surface of the transmitting portion and the diameter of the abutting portion of the outer peripheral surface of the rotating cylinder are set.