TW201838783A - Resin molding device and manufacturing method of a resin molded article to suppress the generation of molding failure caused by the positioning of the resin molded object - Google Patents
Resin molding device and manufacturing method of a resin molded article to suppress the generation of molding failure caused by the positioning of the resin molded object Download PDFInfo
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- TW201838783A TW201838783A TW107105777A TW107105777A TW201838783A TW 201838783 A TW201838783 A TW 201838783A TW 107105777 A TW107105777 A TW 107105777A TW 107105777 A TW107105777 A TW 107105777A TW 201838783 A TW201838783 A TW 201838783A
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- 238000000465 moulding Methods 0.000 title claims abstract description 441
- 229920005989 resin Polymers 0.000 title claims abstract description 255
- 239000011347 resin Substances 0.000 title claims abstract description 255
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 158
- 238000001514 detection method Methods 0.000 claims abstract description 29
- 238000005286 illumination Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 109
- 230000005856 abnormality Effects 0.000 claims description 47
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 289
- 230000007547 defect Effects 0.000 description 37
- 239000013307 optical fiber Substances 0.000 description 34
- 239000007788 liquid Substances 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 17
- 238000005299 abrasion Methods 0.000 description 14
- 238000005452 bending Methods 0.000 description 13
- 238000007689 inspection Methods 0.000 description 13
- 238000003860 storage Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明涉及一種用於對樹脂成型對象進行樹脂成型的樹脂成型裝置及樹脂成型品的製造方法。The present invention relates to a resin molding device and a method for manufacturing a resin molded product for resin molding a resin molding object.
作為現有技術，例如在專利文獻1中公開了如下的樹脂模塑裝置，該裝置具備：被成型品5的供給部8；用於支撐被成型品的板夾具10的供給部20；安裝部30，通過檢測設置於被成型品5上的定位用識別部並將被成型品5安裝在板夾具10的規定位置上；壓制裝置40，設置有將安裝有被成型品5的板夾具10定位到樹脂模塑金屬模50、51的定位裝置，並且安裝有通過與板夾具10一同夾緊被成型品5而進行樹脂模塑的樹脂模塑金屬模50、51；通過樹脂模塑金屬模50、51樹脂成型後的成型品62的收納部60；和給排機構70、72，用於將被成型品5、成型品62及板夾具10給排到被成型品5的供給部8、板夾具10的供給部20、安裝部30、壓制裝置40及成型品62的收納部60中。As a conventional technique, for example, Patent Document 1 discloses a resin molding apparatus including a supply section 8 of a molded article 5, a supply section 20 for supporting a plate clamp 10 of the molded article, and a mounting section 30. The detection unit for positioning provided on the molded product 5 is detected and the molded product 5 is mounted on a predetermined position of the plate clamp 10; the pressing device 40 is provided to position the plate clamp 10 on which the molded product 5 is mounted to Positioning devices for the resin-molded metal molds 50 and 51 are mounted with the resin-molded metal molds 50 and 51 which are resin-molded by clamping the molded article 5 together with the plate holder 10; 51 Resin section 60 of molded product 62 after resin molding; and supply and discharge mechanisms 70 and 72 for supplying and discharging molded product 5, molded product 62, and plate jig 10 to supply portion 8 and plate jig of molded product 5 The supply section 20, the mounting section 30, the pressing device 40, and the storage section 60 of the molded product 62 are provided in 10.
此外，在專利文獻1中，作為定位裝置，例如在專利文獻1的第6圖所示那樣設置在下模44的定位銷45上抵接板夾具10(參照第[0023]段)。In addition, in Patent Document 1, as the positioning device, for example, a positioning pin 45 provided on the lower die 44 as shown in FIG. 6 of Patent Document 1 abuts the plate jig 10 (see paragraph [0023]).
專利文獻1：日本專利公開2008-132730號公報Patent Document 1: Japanese Patent Publication No. 2008-132730
在專利文獻1中未記載如下內容：在使板夾具10與定位銷45抵接的定位中，確認是否適當地進行了定位。於是，通過成型後的成型品判斷起因於定位的成型不良。Patent Document 1 does not describe the following: During positioning in which the plate jig 10 is brought into contact with the positioning pin 45, it is confirmed whether the positioning is properly performed. Then, it is judged from the molded product after molding that the molding failure due to the positioning is caused.
本發明是為了解決上述問題而提出的。其目的在於，提供一種能夠抑制起因於定位的成型不良的產生的樹脂成型裝置及樹脂成型品的製造方法。The present invention has been made to solve the above problems. The object is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can suppress the occurrence of molding defects due to positioning.
為了解決上述問題，本發明所涉及的樹脂成型裝置包括：成型模，具有彼此相對配置的第一模及第二模；供給機構，用於向所述第一模及所述第二模中的任一個模的型面供給樹脂成型對象；定位機構，用於在所述型面上將所述樹脂成型對象定位到導向部件；合模機構，用於對所述成型模進行合模；發光元件，用於發出照射光；第一受光元件，被設置於所述供給機構且能夠接收所述照射光；和判斷部，用於對所述樹脂成型對象的定位進行判斷，在所述一個模中設置有使來自所述發光元件的所述照射光通過的第一出射用通孔，所述判斷部基於所述第一受光元件對通過所述第一出射用通孔的所述照射光的檢測，判斷所述樹脂成型對象是否正常定位到所述導向部件。In order to solve the above problems, a resin molding apparatus according to the present invention includes a molding die having a first die and a second die arranged opposite to each other; and a feeding mechanism for feeding the first die and the second die to the first die and the second die. The molding surface of any one mold supplies the resin molding object; the positioning mechanism is used to position the resin molding object to the guide member on the molding surface; the mold clamping mechanism is used to mold the molding mold; the light-emitting element Is used for emitting irradiation light; a first light receiving element is provided in the supply mechanism and can receive the irradiation light; and a judging unit is used for judging the positioning of the resin molding object in the one mold A first exit through-hole for passing the irradiation light from the light-emitting element is provided, and the determination unit detects the irradiation light passing through the first exit through-hole based on the first light-receiving element. , Determining whether the resin molding object is normally positioned on the guide member.
為了解決上述問題，本發明所涉及的樹脂成型品的製造方法包括：供給製程，通過供給機構向具有彼此相對配置的第一模及第二模的成型模中的任一個模的型面供給樹脂成型對象；定位製程，在所述型面上將所述樹脂成型對象定位到導向部件；照射製程，從發光元件發出照射光，所述照射光通過設置於所述一個模的第一出射用通孔；檢測製程，由設置於所述供給機構的第一受光元件對通過第一出射用通孔的所述照射光進行檢測；判斷製程，基於所述檢測製程中的檢測，判斷所述樹脂成型對象是否正常定位到所述導向部件；和樹脂成型製程，在所述判斷製程中判斷為所述樹脂成型對象正常定位的情況下，對所述成型模進行合模而進行樹脂成型。In order to solve the above-mentioned problems, the method for manufacturing a resin molded article according to the present invention includes a supply process in which a resin is supplied to a molding surface of any one of the molding dies having a first mold and a second mold arranged opposite to each other through a supply mechanism. Molding object; positioning process, positioning the resin molding object to a guide member on the molding surface; irradiation process, emitting irradiation light from a light emitting element, the irradiation light passing through a first exit channel provided in the one mold A detection process in which the first light receiving element provided in the supply mechanism detects the irradiated light passing through the first exit through-hole; the determination process is based on the detection in the detection process to determine the resin molding Whether the object is normally positioned to the guide member; and a resin molding process, in the case where it is determined in the determination process that the resin molding object is normally positioned, the mold is clamped to perform resin molding.
根據本發明，能夠抑制起因於定位的成型不良的產生。According to the present invention, it is possible to suppress the occurrence of molding defects due to positioning.
下面，參照圖式對本發明的實施方式進行說明。本發明中的任一幅圖均為了易於理解而進行了適當省略或誇張來示意性地繪製。對相同的結構要素使用了相同的符號，並適當省略了說明。此外，在本發明中，“樹脂成型”係指利用成型模對樹脂進行成型，係包含利用成型模對封裝樹脂部進行成型的“樹脂封裝”的概念表達。另外，“樹脂成型品”係指至少包含樹脂成型後的樹脂部分的產品，係包含後述的安裝在基板上的半導體晶片通過成型模被樹脂成型而樹脂封裝後的形式的封裝後基板的概念表達。Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any of the figures in the present invention is drawn for ease of understanding and is omitted or exaggerated appropriately. The same symbols are used for the same structural elements, and descriptions are omitted as appropriate. In addition, in the present invention, "resin molding" refers to the molding of a resin using a molding die, and is a concept expression including "resin packaging" in which a sealing resin portion is molded using a molding die. In addition, the "resin molded product" refers to a product including at least a resin portion after resin molding, and a concept expression of a packaged substrate including a semiconductor wafer mounted on a substrate described later and resin-molded by a molding die and resin-encapsulated. .
[實施方式1][Embodiment 1]
(樹脂成型單元的結構)(Structure of resin molding unit)
參照第1圖對本發明所涉及的樹脂成型裝置中使用的樹脂成型單元的機構進行說明。第1圖所示的樹脂成型單元1為例如使用壓縮成型法或傳遞成型法的樹脂成型單元。樹脂成型單元1具有底座2。在底座2的四角固定有作為保持部件的四根連接桿3。在朝向上方延伸的四根連接桿3的上部固定有與底座2相對的固定台板4。在底座2與固定台板4之間，與底座2和固定台板4分別相對的可動台板5被套設於四根連接桿3上。在底座2上設置有用於使可動台板5升降的合模機構6。合模機構6通過使可動台板5升降而進行成型模的開模和合模。合模機構6由驅動源7和傳遞部件8的組合而構造。例如，作為合模機構6，可使用伺服電動機與滾珠絲杠的組合或液壓缸與連桿的組合。作為合模機構，也可以使用肘桿機構。The mechanism of the resin molding unit used in the resin molding apparatus which concerns on this invention is demonstrated with reference to FIG. The resin molding unit 1 shown in FIG. 1 is a resin molding unit using, for example, a compression molding method or a transfer molding method. The resin molding unit 1 has a base 2. Four connecting rods 3 as holding members are fixed to the four corners of the base 2. A fixed platen 4 opposite to the base 2 is fixed to an upper portion of the four connecting rods 3 extending upward. Between the base 2 and the fixed platen 4, a movable platen 5 opposite to the base 2 and the fixed platen 4 is sleeved on the four connecting rods 3. The base 2 is provided with a mold clamping mechanism 6 for raising and lowering the movable platen 5. The mold clamping mechanism 6 opens and closes the mold by lifting the movable platen 5. The mold clamping mechanism 6 is configured by a combination of the drive source 7 and the transmission member 8. For example, as the mold clamping mechanism 6, a combination of a servo motor and a ball screw or a combination of a hydraulic cylinder and a connecting rod can be used. As the mold clamping mechanism, a toggle lever mechanism can also be used.
在固定台板4的下表面上固定有上模9。在上模9的正下方，與上模9相對地設置有下模10。下模10被固定在可動台板5的上表面上。上模9和下模10一併構造成型模11。在上模9及下模10中適當設置有作為加熱裝置的加熱器(未圖示)。An upper die 9 is fixed to the lower surface of the fixed platen 4. Directly below the upper mold 9, a lower mold 10 is provided opposite the upper mold 9. The lower mold 10 is fixed on the upper surface of the movable platen 5. The upper mold 9 and the lower mold 10 together form a molding mold 11. A heater (not shown) as a heating device is appropriately provided in the upper mold 9 and the lower mold 10.
在上模9與下模10之間，例如配置有用於向上模9的型面供給樹脂成型對象12的供給機構13。作為樹脂成型對象12，例如安裝有半導體晶片的基板、安裝有半導體晶片的引線框等被供給到上模9的型面上。在該情況下，雖然示出了向上模9的型面供給樹脂成型對象12的情況，但也可以向下模10的型面供給樹脂成型對象12。Between the upper mold 9 and the lower mold 10, for example, a supply mechanism 13 for supplying a molding surface of the upper mold 9 to the resin molding object 12 is arranged. As the resin molding object 12, for example, a substrate on which a semiconductor wafer is mounted, a lead frame on which a semiconductor wafer is mounted, and the like are supplied to the mold surface of the upper mold 9. In this case, although the case where the resin molding object 12 is supplied to the molding surface of the upper mold 9 is shown, the resin molding object 12 may be supplied to the molding surface of the lower mold 10.
(樹脂成型品的製造方法)(Manufacturing method of resin molded article)
參照第1圖～第2圖，對以下方法的製程進行說明：該方法通過在設置於樹脂成型裝置(參照第14圖)的樹脂成型單元1中，例如對作為樹脂成型對象安裝在基板上的半導體晶片進行樹脂成型而製造樹脂成型品。The process of the following method will be described with reference to FIGS. 1 to 2: This method is performed by, for example, installing a resin molding target on a substrate in a resin molding unit 1 provided in a resin molding apparatus (see FIG. 14). The semiconductor wafer is resin-molded to produce a resin-molded article.
如第2圖的(a)所示，首先，在樹脂成型裝置中，對上模9和下模10進行開模。接著，使用供給機構13，將作為安裝有半導體晶片14的基板的成型前基板15運送到上模9與下模10之間。在該情況下，由於將成型前基板15供給到上模9的型面上，因此以安裝有半導體晶片14的面朝下的方式運送成型前基板15。接著，通過使供給機構13上升，將成型前基板15供給到上模9的型面上。As shown in FIG. 2 (a), first, in the resin molding apparatus, the upper mold 9 and the lower mold 10 are opened. Next, using the supply mechanism 13, the pre-molded substrate 15 as a substrate on which the semiconductor wafer 14 is mounted is transported between the upper mold 9 and the lower mold 10. In this case, since the pre-molding substrate 15 is supplied to the molding surface of the upper mold 9, the pre-molding substrate 15 is transported with the side on which the semiconductor wafer 14 is mounted facing downward. Next, the supply mechanism 13 is raised to supply the pre-molded substrate 15 to the mold surface of the upper mold 9.
接著，如後述，在上模9的型面上，通過定位機構將成型前基板15定位到導向部件(參照第3圖的(a))。使用設置於供給機構13的受光元件(參照第3圖的(b)、(c))，來檢驗成型前基板15是否正常定位在上模9的型面上。至於將成型前基板15定位在上模9的型面上的操作以及判斷成型前基板15是否正常定位在上模9的型面上的操作，將在後面描述(參照第3圖至第6圖)。Next, as will be described later, the pre-molded substrate 15 is positioned to the guide member by the positioning mechanism on the profile surface of the upper mold 9 (see (a) of FIG. 3). A light receiving element (refer to (b) and (c) in FIG. 3) provided in the supply mechanism 13 is used to check whether the substrate 15 before the molding is normally positioned on the molding surface of the upper mold 9. The operation of positioning the substrate 15 before molding on the molding surface of the upper mold 9 and the operation of determining whether the substrate 15 before molding is normally positioned on the molding surface of the upper mold 9 will be described later (refer to FIGS. 3 to 6). ).
接著，在判斷為成型前基板15正常定位在上模9的型面上的情況下，使用離型膜供給機構(參照第14圖)，向設置於下模10的型腔16供給離型膜17。作為離型膜17，可使用從膜供給捲筒連續供給至卷取捲筒的長條狀的離型膜或切斷成長方形狀的離型膜中的任一種。或者，也可以不使用離型膜。Next, when it is determined that the pre-molding substrate 15 is normally positioned on the molding surface of the upper mold 9, a release film supply mechanism (see FIG. 14) is used to supply a release film to the cavity 16 provided in the lower mold 10. 17. As the release film 17, either a long release film continuously supplied from a film supply roll to a take-up roll or a release film cut into a rectangular shape can be used. Alternatively, a release film may not be used.
接著，對以下情況進行說明：即，如第2圖的(b)所示，例如將分送器作為樹脂供給機構使用，並且將作為樹脂材料的液狀樹脂供給到型腔16中。第2圖的(b)所示的分送器18為使用預先混合主劑和硬化劑而成的液狀樹脂的單液型分送器。作為主劑，例如可使用具有熱硬化性的矽酮樹脂或環氧樹脂。在供給液狀樹脂時，也可以使用將混合主劑和硬化劑混合使用的雙液混合型分送器。Next, as shown in FIG. 2 (b), for example, a dispenser is used as a resin supply mechanism, and a liquid resin as a resin material is supplied to the cavity 16. The dispenser 18 shown in FIG. 2 (b) is a single-liquid dispenser using a liquid resin obtained by mixing a base agent and a hardener in advance. As the main agent, for example, a thermosetting silicone resin or an epoxy resin can be used. When supplying a liquid resin, a two-liquid mixing type dispenser in which a mixing main agent and a hardening agent are mixed and used may be used.
接著，利用移動機構19使分送器18在上模9與下模10之間移動。接著，從分送器18的吐出口向型腔16吐出液狀樹脂20。由此，向型腔16供給液狀樹脂20。在該情況下，使用分送器18將液狀樹脂20供給到型腔16中。不限於此，作為樹脂材料可使用粉末狀、顆粒狀、片狀或固體狀的樹脂材料並將其供給到型腔中。Next, the dispenser 18 is moved between the upper mold 9 and the lower mold 10 by the moving mechanism 19. Next, the liquid resin 20 is discharged from the discharge port of the dispenser 18 to the cavity 16. Thereby, the liquid resin 20 is supplied to the cavity 16. In this case, the dispenser 18 is used to supply the liquid resin 20 into the cavity 16. Not limited to this, as the resin material, powdery, granular, flake, or solid resin materials can be used and supplied into the cavity.
接著，如第2圖的(c)所示，使用合模機構6(參照第1圖)提升可動台板5。由此，對上模9和下模10進行合模。通過合模，將安裝在成型前基板15上的半導體晶片14浸漬在供給到型腔16的液狀樹脂20中。此時，可以使用設置於下模10的型腔底面部件(未圖示)，來對型腔16內的液狀樹脂20施加規定的樹脂壓力。Next, as shown in FIG. 2 (c), the movable platen 5 is lifted using the mold clamping mechanism 6 (see FIG. 1). Thereby, the upper mold 9 and the lower mold 10 are clamped. The semiconductor wafer 14 mounted on the pre-molding substrate 15 is dipped in the liquid resin 20 supplied to the cavity 16 by mold clamping. At this time, a cavity bottom member (not shown) provided in the lower mold 10 may be used to apply a predetermined resin pressure to the liquid resin 20 in the cavity 16.
此外，在合模製程中，也可以使用抽真空機構(未圖示)對型腔16內進行抽吸。由此，殘留在型腔16內的空氣和包含在液狀樹脂20中的氣泡等被排出到成型模11的外部。此外，型腔16內被設定為規定的真空度。In addition, during the mold-clamping process, the inside of the cavity 16 may be suctioned by using a vacuum mechanism (not shown). As a result, air remaining in the cavity 16 and air bubbles and the like contained in the liquid resin 20 are discharged to the outside of the molding die 11. The inside of the cavity 16 is set to a predetermined degree of vacuum.
接著，使用設置於下模10的加熱器(未圖示)對液狀樹脂20進行加熱，加熱時間為液狀樹脂20的硬化所需的時間。通過使液狀樹脂20硬化而成型硬化樹脂21。由此，通過成型為與型腔16的形狀對應的硬化樹脂21，對安裝在成型前基板15上的半導體晶片14進行樹脂成型(樹脂封裝)。Next, the liquid resin 20 is heated using a heater (not shown) provided in the lower mold 10, and the heating time is the time required for the liquid resin 20 to harden. The liquid resin 20 is hardened to form a hardened resin 21. Thereby, the semiconductor wafer 14 mounted on the pre-molding substrate 15 is resin-molded (resin-encapsulated) by molding the hardened resin 21 corresponding to the shape of the cavity 16.
接著，如第2圖的(d)所示，在成型硬化樹脂21之後，使用合模機構6降低可動台板5。由此，對上模9和下模10進行開模。在上模9的型面上固定有作為經樹脂成型的成型後基板的樹脂成型品22。接著，使樹脂成型品22從上模9脫模。在該步驟中完成樹脂成型(樹脂封裝)。Next, as shown in FIG. 2D, after the hardened resin 21 is molded, the movable platen 5 is lowered using the mold clamping mechanism 6. Thereby, the upper mold 9 and the lower mold 10 are opened. A resin molded product 22 that is a resin-molded substrate is fixed to the surface of the upper mold 9. Next, the resin molded product 22 is released from the upper mold 9. In this step, resin molding (resin encapsulation) is completed.
(基板定位檢驗機構)(Substrate positioning inspection mechanism)
參照第3圖，對用於檢驗供給到成型模11中的成型前基板15的定位的定位檢驗機構進行說明。定位檢驗機構具備發光元件和受光元件，並且根據受光元件是否檢測到發光元件所發出的發射光來檢驗成型前基板15的定位。在本實施方式中，對在固定台板4上設置有發光元件並在供給機構13上設置有受光元件的情況進行說明。Referring to FIG. 3, a positioning inspection mechanism for inspecting the positioning of the pre-mold substrate 15 supplied to the molding die 11 will be described. The positioning inspection mechanism includes a light-emitting element and a light-receiving element, and checks the positioning of the substrate 15 before molding based on whether the light-receiving element detects the emitted light from the light-emitting element. In this embodiment, a case where a light emitting element is provided on the fixed platen 4 and a light receiving element is provided on the supply mechanism 13 will be described.
如第3圖的(a)所示，在上模9的型面(下表面)上設置有導向部件23，該導向部件23例如為用於在X方向上定位成型前基板15的定位部件。作為導向部件23，例如可使用導銷等的具有銷狀形狀的部件。同樣，用於在Y方向上定位成型前基板15的導向部件24被設置在上模9的型面上。較佳例如沿Y方向及X方向分別設置有至少兩個導向部件23、24。在該情況下，將具有銷狀形狀的部件用作導向部件。作為導向部件，也可以使用具有沿X方向及Y方向延伸的長方體形狀的部件。As shown in FIG. 3 (a), a guide member 23 is provided on the profile (lower surface) of the upper mold 9, and the guide member 23 is, for example, a positioning member for positioning the front substrate 15 in the X direction for molding. As the guide member 23, for example, a member having a pin-like shape such as a guide pin can be used. Similarly, a guide member 24 for positioning the pre-molded substrate 15 in the Y direction is provided on the profile of the upper mold 9. Preferably, for example, at least two guide members 23 and 24 are respectively provided in the Y direction and the X direction. In this case, a member having a pin-like shape is used as the guide member. As the guide member, a member having a rectangular parallelepiped shape extending in the X direction and the Y direction may be used.
在上模9或固定台板4上例如設置有定位機構25、26，該定位機構25、26通過將成型前基板15的端面按壓到導向部件23、24而進行定位。通過定位機構25，在X方向上對成型前基板15進行定位。同樣，通過定位機構26，在Y方向上對成型前基板15進行定位。通過定位機構25、26，成型前基板被配置在上模9的型面上。在該情況下，設為將定位機構25、26設置在上模9或固定台板4上的結構。不限於此，也可以設為將定位機構設置在供給機構13上的結構。The upper mold 9 or the fixed platen 4 is provided with, for example, positioning mechanisms 25 and 26. The positioning mechanisms 25 and 26 perform positioning by pressing the end faces of the substrate 15 before molding against the guide members 23 and 24. The positioning mechanism 25 positions the pre-molded substrate 15 in the X direction. Similarly, the pre-molding substrate 15 is positioned by the positioning mechanism 26 in the Y direction. By the positioning mechanisms 25 and 26, the substrate before molding is placed on the profile of the upper mold 9. In this case, a structure is provided in which the positioning mechanisms 25 and 26 are provided on the upper mold 9 or the fixed platen 4. The configuration is not limited to this, and a configuration in which the positioning mechanism is provided on the supply mechanism 13 may be adopted.
在本發明中，如第3圖的(a)所示，表示如下情況：即，成型前基板15的長邊方向沿X方向配置，並且成型前基板15的短邊方向沿Y方向配置。以下，將成型前基板15的沿長邊方向的端面稱作成型前基板15的沿X方向的端面。同樣，將成型前基板15的沿短邊方向的端面稱作成型前基板15的沿Y方向的端面。In the present invention, as shown in (a) of FIG. 3, the following shows a case where the long-side direction of the pre-molded substrate 15 is arranged in the X direction and the short-side direction of the pre-molded substrate 15 is arranged in the Y direction. Hereinafter, the end surface of the pre-mold substrate 15 in the longitudinal direction is referred to as the end surface of the pre-mold substrate 15 in the X direction. Similarly, an end surface of the pre-mold substrate 15 in the short-side direction is referred to as an end surface of the pre-mold substrate 15 in the Y direction.
如第3圖的(a)、(b)所示，例如作為用於檢驗成型前基板15的X方向及Y方向的定位的結構要素，在固定台板4的內部設置有發光元件27、28。作為發光元件27、28，例如可使用發光二極體(LED)或鐳射二極體(LD)等。較佳發光元件27、28具有耐熱性。在上模9上分別設置有使發光元件27、28所發出的照射光通過的第一出射用通孔29、30。此外，“出射用”的含義為從上模9側向外部的受光元件側發射照射光。As shown in (a) and (b) of FIG. 3, for example, as a structural element for inspecting the X-direction and Y-direction positioning of the substrate 15 before molding, light-emitting elements 27 and 28 are provided inside the fixed platen 4. . As the light emitting elements 27 and 28, for example, a light emitting diode (LED) or a laser diode (LD) can be used. The light emitting elements 27 and 28 are preferably heat resistant. The upper mold 9 is provided with first emission through holes 29 and 30 through which the irradiation light emitted from the light emitting elements 27 and 28 passes. In addition, "exposure" means that the irradiation light is emitted from the upper mold 9 side to the external light receiving element side.
如第3圖的(a)所示，第一出射用通孔29、30分別被設置於在成型前基板15與導向部件23、24接觸的狀態下成型前基板15配置在上模9的型面的區域上。更詳細而言，第一出射用通孔29以如下方式設置在上模9上：在成型前基板15與導向部件23接觸的狀態下，第一出射用通孔29從成型前基板15的沿Y方向的端面對應於內側區域。同樣，第一出射用通孔30以如下方式設置在上模9上：在成型前基板15與導向部件24接觸的狀態下，第一出射用通孔30從成型前基板15的沿X方向的端面對應於內側區域。As shown in FIG. 3 (a), the first emission through holes 29 and 30 are respectively provided in a shape in which the molding front substrate 15 is disposed on the upper mold 9 in a state where the molding front substrate 15 is in contact with the guide members 23 and 24. Area. More specifically, the first exit through-hole 29 is provided on the upper mold 9 in such a manner that the first exit through-hole 29 extends from the edge of the pre-mold substrate 15 in a state where the pre-mold substrate 15 is in contact with the guide member 23. The end face in the Y direction corresponds to the inner region. Similarly, the first exiting through-hole 30 is provided on the upper mold 9 in such a manner that the first exiting through-hole 30 extends from the front side of the pre-molding substrate 15 in the X direction in a state where the pre-forming substrate 15 is in contact with the guide member 24. The end face corresponds to the inside area.
如第3圖的(b)、(c)所示，在供給機構13上分別設置有用於檢測發光元件27、28所發出的照射光的第一受光元件31、32。第一受光元件31、32為用於檢驗成型前基板15的X方向及Y方向的定位的受光元件。作為第一受光元件31、32，例如可使用光電二極體(PD)等。在成型前基板15定位到導向部件23、24的狀態下，第一受光元件31被設置為俯視觀察時與發光元件27及第一出射用通孔29重疊，第一受光元件32被設置為俯視觀察時與發光元件28及第一出射用通孔30重疊。可以與第一受光元件31、32所接收的光強度相應地任意設定第一出射用通孔29、30的直徑。在成型前基板15定位到導向部件23、24的狀態下，根據第一受光元件31、32是否檢測到發光元件27、28所發出的照射光，來檢驗成型前基板15是否正常定位在上模9的型面上。例如，可通過將第一出射用通孔29、30的直徑設為0.01～0.1mm左右的大小，來提高對成型前基板15定位的檢驗精度。As shown in (b) and (c) of FIG. 3, the supply mechanism 13 is provided with first light-receiving elements 31 and 32 for detecting irradiation light emitted from the light-emitting elements 27 and 28, respectively. The first light-receiving elements 31 and 32 are light-receiving elements for checking the positioning in the X and Y directions of the pre-molded substrate 15. As the first light receiving elements 31 and 32, for example, a photodiode (PD) can be used. In a state where the pre-molded substrate 15 is positioned on the guide members 23 and 24, the first light receiving element 31 is arranged to overlap the light emitting element 27 and the first exit through hole 29 in a plan view, and the first light receiving element 32 is arranged in a plan view. It overlaps with the light emitting element 28 and the first emitting through hole 30 during observation. The diameter of the first exit through holes 29 and 30 can be arbitrarily set according to the light intensity received by the first light receiving elements 31 and 32. In a state where the pre-molding substrate 15 is positioned on the guide members 23 and 24, it is checked whether the pre-molding substrate 15 is normally positioned on the upper mold according to whether the first light receiving elements 31 and 32 detect the irradiation light emitted from the light emitting elements 27 and 28. 9's profile. For example, by setting the diameters of the first emission through holes 29 and 30 to be about 0.01 to 0.1 mm, the inspection accuracy of the positioning of the substrate 15 before molding can be improved.
此外，在成型模11開模的狀態下，導向部件23、24從上模9的型面突出。導向部件23、24被構造為，在成型模11合模的狀態下被下模10的型面向上推頂而收納在上模9的內部。該結構例如可通過將導向部件23、24設為通過彈簧等彈性部件來支撐的結構實現。另外，也可以將導向部件23、24設為不可動，並使導向部件23、24退避到設置於下模10的開口孔(未圖示)中。In addition, in a state where the molding die 11 is opened, the guide members 23 and 24 protrude from the profile of the upper die 9. The guide members 23 and 24 are configured to be pushed up by the molding surface of the lower mold 10 in a state in which the molding mold 11 is closed, and housed in the upper mold 9. This structure can be realized by, for example, a structure in which the guide members 23 and 24 are supported by an elastic member such as a spring. In addition, the guide members 23 and 24 may be made immovable, and the guide members 23 and 24 may be retracted into an opening hole (not shown) provided in the lower mold 10.
(基板定位操作及定位檢驗操作(樹脂成型品的製造方法))(Substrate positioning operation and positioning inspection operation (manufacturing method of resin molded products))
參照第3圖～第4圖，對供給到成型模11中的成型前基板15的定位操作及用於檢驗供給到成型模11中的成型前基板15是否正常定位的操作進行說明。在本實施方式中示出向成型模11的上模9供給成型前基板15並進行定位的情況。此外，此處的說明還兼作樹脂成型品的製造方法的說明。Referring to FIGS. 3 to 4, a positioning operation of the pre-molding substrate 15 supplied to the molding die 11 and an operation for checking whether the pre-molding substrate 15 supplied to the molding die 11 is properly positioned are described. This embodiment shows a case where the pre-molding substrate 15 is supplied to the upper mold 9 of the molding mold 11 and positioned. The description herein also serves as a description of a method for manufacturing a resin molded article.
(基板定位操作)(Substrate positioning operation)
參照第3圖，對將成型前基板15定位在上模9的型面上的操作進行說明。首先，如第3圖的(b)所示，使保持有成型前基板15的供給機構13在上模9與下模10之間移動。接著，提升供給機構13，並從供給機構13向上模9的型面移交成型前基板15。The operation of positioning the pre-molding substrate 15 on the profile of the upper mold 9 will be described with reference to FIG. 3. First, as shown in FIG. 3 (b), the supply mechanism 13 holding the pre-molded substrate 15 is moved between the upper mold 9 and the lower mold 10. Next, the supply mechanism 13 is lifted, and the pre-molded substrate 15 is transferred from the supply mechanism 13 to the molding surface of the upper mold 9.
接著，例如使用設置於上模9或固定台板4的定位機構25、26，將成型前基板15的端面分別推壓到導向部件23、24。首先，如第3圖的(a)所示，使用定位機構25，將成型前基板15的沿Y方向的端面推壓到兩個導向部件23。由此，成型前基板15的沿Y方向的端面被定位在上模9的型面上。接著，使用定位機構26，將成型前基板15的沿X方向的端面推壓到兩個導向部件24。由此，成型前基板15的沿X方向的端面被定位在上模9的型面上。Next, for example, the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 are used to push the end faces of the pre-molded substrate 15 to the guide members 23 and 24, respectively. First, as shown in FIG. 3 (a), using the positioning mechanism 25, the end faces in the Y direction of the pre-molded substrate 15 are pressed against the two guide members 23. Thereby, the end surface of the front substrate 15 in the Y direction is positioned on the profile of the upper mold 9. Next, using the positioning mechanism 26, the X-direction end faces of the pre-molded substrate 15 are pressed against the two guide members 24. Thereby, the end surface of the front substrate 15 in the X direction is positioned on the profile of the upper mold 9.
通過使用定位機構25、26將成型前基板15推壓到導向部件23、24，將成型前基板15定位在上模9的型面上。在定位成型前基板15之後，利用抽吸機構(未圖示)對成型前基板15進行抽吸並將其固定在上模9的型面上。在該狀態下，完成成型前基板15在上模9上的定位。By using the positioning mechanisms 25 and 26 to press the pre-molded substrate 15 against the guide members 23 and 24, the pre-molded substrate 15 is positioned on the profile of the upper mold 9. After positioning the pre-molded substrate 15, the pre-molded substrate 15 is sucked by a suction mechanism (not shown) and fixed on the surface of the upper mold 9. In this state, the positioning of the substrate 15 on the upper mold 9 before molding is completed.
在該情況下，使用設置於上模9或固定台板4的定位機構25、26，分別獨立地進行成型基板15在X方向及Y方向上的定位。不限於此，可以設為使定位機構25、26聯動的結構。由此，能夠同時進行成型前基板15在X方向及Y方向上的定位。In this case, the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 are used to independently position the molding substrate 15 in the X direction and the Y direction, respectively. It is not limited to this, and it can be set as the structure which linked the positioning mechanisms 25 and 26. Thereby, the positioning of the pre-molding substrate 15 in the X direction and the Y direction can be performed simultaneously.
(基板定位檢驗操作)(Substrate positioning inspection operation)
參照第3圖～第4圖，對用於檢驗供給到上模9的成型前基板15是否正常定位的操作進行說明。首先，如第4圖的(a)所示，通過供給機構13將成型前基板15供給到上模9的型面上。接著，使用定位機構25、26將成型前基板15定位在上模9的型面上。在該狀態下，發光元件27、第一出射用通孔29及第一受光元件31被配置為俯視觀察時重疊。同樣，發光元件28、第一出射用通孔30及第一受光元件32被配置為俯視觀察時重疊。An operation for checking whether the pre-mold substrate 15 supplied to the upper mold 9 is normally positioned will be described with reference to FIGS. 3 to 4. First, as shown in (a) of FIG. 4, the pre-molding substrate 15 is supplied onto the mold surface of the upper mold 9 by the supply mechanism 13. Next, the pre-molding substrate 15 is positioned on the profile of the upper mold 9 using the positioning mechanisms 25 and 26. In this state, the light-emitting element 27, the first emission through-hole 29, and the first light-receiving element 31 are arranged so as to overlap in a plan view. Similarly, the light emitting element 28, the first emission through-hole 30, and the first light receiving element 32 are arranged so as to overlap each other in a plan view.
接著，如第4圖的(b)所示，從發光元件27、28發出照射光33。從發光元件27、28發出的照射光33通過形成於上模9的第一出射用通孔29、30後到達成型前基板15的基板側的面。Next, as shown in FIG. 4 (b), the irradiation light 33 is emitted from the light emitting elements 27 and 28. The irradiation light 33 emitted from the light emitting elements 27 and 28 passes through the first exit through holes 29 and 30 formed in the upper mold 9 and reaches the substrate-side surface of the pre-mold substrate 15.
在成型前基板15正常定位到設置於上模9的導向部件23、24的情況下，例如如第4圖的(b)所示，在成型前基板15的沿Y方向的端面與導向部件23接觸的情況下，在導向部件23與成型前基板15的沿Y方向的端面之間不會產生間隙。因此，發光元件27所發出的照射光33被成型前基板15遮斷。於是，照射光33不會到達設置於供給機構13的第一受光元件31。因此，第一受光元件31檢測不到照射光33。When the pre-molding substrate 15 is normally positioned on the guide members 23 and 24 provided on the upper mold 9, for example, as shown in FIG. 4 (b), the end surface of the pre-molding substrate 15 in the Y direction and the guide member 23 In the case of contact, no gap is generated between the guide member 23 and the end surface of the pre-molded substrate 15 in the Y direction. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the pre-molded substrate 15. Therefore, the irradiated light 33 does not reach the first light receiving element 31 provided in the supply mechanism 13. Therefore, the first light receiving element 31 cannot detect the irradiation light 33.
同樣，在成型前基板15的沿X方向的端面與導向部件24(參照第3圖的(a))接觸的情況下，在導向部件24與成型前基板15的沿X方向的端面之間不會產生間隙。因此，發光元件28(參照第3圖的(a))所發出的照射光33被成型前基板15遮斷。於是，照射光33不會到達設置於供給機構13的第一受光元件32(參照第3圖的(c))。因此，第一受光元件32檢測不到照射光33。Similarly, when the end surface in the X direction of the pre-molded substrate 15 is in contact with the guide member 24 (see (a) in FIG. 3), the end of the guide member 24 and the end surface in the X direction of the pre-molded substrate 15 is not in contact with each other. There will be gaps. Therefore, the irradiation light 33 emitted from the light emitting element 28 (see (a) in FIG. 3) is blocked by the pre-mold substrate 15. Therefore, the irradiation light 33 does not reach the first light receiving element 32 provided in the supply mechanism 13 (see (c) of FIG. 3). Therefore, the first light receiving element 32 cannot detect the irradiation light 33.
在第一受光元件31、32這兩個受光元件未檢測到照射光33的情況下，設置於樹脂成型裝置的控制部的判斷部(參照第14圖)判斷為成型前基板15正常定位在X方向及Y方向上。在第一受光元件31、32這兩個受光元件未檢測到照射光33的情況下，判斷為成型前基板15正常定位到導向部件23、24，並進入下一製程即樹脂成型製程。When the two light receiving elements 31 and 32 do not detect the irradiated light 33, the determination unit (refer to FIG. 14) provided in the control unit of the resin molding apparatus determines that the substrate 15 before molding is normally positioned at X Direction and Y direction. When the two light receiving elements 31 and 32 do not detect the irradiation light 33, it is determined that the pre-molding substrate 15 is normally positioned on the guide members 23 and 24, and enters the next process, that is, the resin molding process.
在成型前基板15未正常定位到導向部件23、24的情況下，例如如第4圖的(c)所示，在成型前基板15的沿Y方向的端面未與導向部件23接觸的情況下，導向部件23與成型前基板15的沿Y方向的端面之間產生間隙34。如果在導向部件23與成型前基板15的沿Y方向的端面之間產生間隙34，則從發光元件27發出的照射光33會通過該間隙34。通過該間隙34的照射光33到達第一受光元件31。由此，第一受光元件31檢測到照射光33。在第一受光元件31檢測到照射光33的情況下，判斷部(參照第14圖)判斷為成型前基板15未正常定位在X方向上。因此，判斷部停止進入下一製程。並且，重新進行成型前基板15的定位。When the substrate 15 before molding is not positioned on the guide members 23 and 24 normally, for example, as shown in FIG. 4 (c), when the end surface of the substrate 15 in the Y direction is not in contact with the guide member 23 A gap 34 is generated between the guide member 23 and the end surface of the pre-molded substrate 15 in the Y direction. When a gap 34 is generated between the guide member 23 and the end surface in the Y direction of the pre-molded substrate 15, the irradiation light 33 emitted from the light emitting element 27 passes through the gap 34. The irradiation light 33 passing through the gap 34 reaches the first light receiving element 31. Thereby, the first light receiving element 31 detects the irradiation light 33. When the first light-receiving element 31 detects the irradiation light 33, the determination unit (see FIG. 14) determines that the substrate 15 before molding is not positioned in the X direction normally. Therefore, the judging section stops entering the next process. Then, the positioning of the substrate 15 before molding is performed again.
同樣，在成型前基板15的沿X方向的端面未與導向部件24接觸的情況下，在導向部件24與成型前基板15的沿X方向的端面之間產生間隙。從發光元件28發出的照射光33通過該間隙後到達第一受光元件32。由此，第一受光元件32檢測到照射光33。在第一受光元件32檢測到照射光33的情況下，判斷部判斷為成型前基板15未正常定位在Y方向上。在該情況下，判斷部也判斷為成型前基板15未正常定位，並停止進入下一製程。並且，重新進行成型前基板15的定位。Similarly, when the end surface of the pre-mold substrate 15 in the X direction is not in contact with the guide member 24, a gap is generated between the guide member 24 and the end surface of the pre-mold substrate 15 in the X direction. The irradiation light 33 emitted from the light emitting element 28 passes through the gap and reaches the first light receiving element 32. Thereby, the first light receiving element 32 detects the irradiation light 33. When the first light-receiving element 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is not normally positioned in the Y direction. In this case, the judging unit also judges that the substrate 15 before molding is not positioned normally, and stops moving to the next process. Then, the positioning of the substrate 15 before molding is performed again.
在成型前基板15被定位在上模9的型面上的狀態下，當第一受光元件31、32中的任一受光元件檢測到照射光33時，判斷部判斷為成型前基板15未正常定位在X方向或Y方向中的任一方向上。在該情況下，停止進入下一製程，並重新進行成型前基板15的定位。在第一受光元件31、32這兩個受光元件未檢測到照射光33的情況下，判斷部判斷為成型前基板15正常定位，並進入下一製程。因此，可根據第一受光元件31、32是否檢測到照射光33來抑制由成型前基板15的定位引起的成型不良的產生。In a state where the pre-molding substrate 15 is positioned on the profile of the upper mold 9, when any one of the first light-receiving elements 31 and 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is abnormal. Position in either the X or Y direction. In this case, the process is stopped and the positioning of the substrate 15 before molding is resumed. In a case where the two light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the substrate 15 before the molding is normally positioned and proceeds to the next process. Therefore, it is possible to suppress the occurrence of molding defects due to the positioning of the substrate 15 before molding, based on whether the first light receiving elements 31 and 32 detect the irradiation light 33.
此外，關於成型前基板15的定位，理想的是，當照射光33完全被成型前基板15遮斷時第一受光元件31、32不會檢測到照射光33。然而，有時照射光33的一部分作為衍射光而繞過成型前基板15並到達第一受光元件31、32，或者有時外部的雜訊光到達第一受光元件31、32。因此，在還考慮第一受光元件31、32檢測衍射光或雜訊光的情況而檢測到超過已設定的閾值(例如，某一大小的光強度)的照射光的情況下，判斷部判斷為第一受光元件31、32檢測到照射光33。在檢測到閾值以下的照射光的情況下，判斷部判斷為第一受光元件31、32未檢測到照射光33。如此，判斷部判斷成型前基板15是否正常定位在上模9的型面上。作為一例，在通過測量受光元件的電流值並利用由光照射產生光電流這一現象而進行光檢測的情況下，針對待測量的電流值設定閾值即可。該設定在其他實施方式中也同樣，並且在使用其他受光元件的檢測中也同樣。Regarding the positioning of the pre-molded substrate 15, it is desirable that the first light-receiving elements 31 and 32 do not detect the irradiated light 33 when the irradiation light 33 is completely blocked by the pre-molded substrate 15. However, a part of the irradiated light 33 may bypass the pre-molded substrate 15 and reach the first light receiving elements 31 and 32 as diffracted light, or the external noise light may reach the first light receiving elements 31 and 32 in some cases. Therefore, in a case where the first light receiving elements 31 and 32 detect the diffracted light or the noise light and detect the irradiation light exceeding a set threshold (for example, a certain light intensity), the determination unit determines that The first light receiving elements 31 and 32 detect the irradiation light 33. When the irradiation light below the threshold is detected, the determination unit determines that the irradiation light 33 is not detected by the first light receiving elements 31 and 32. In this way, the judging unit judges whether the pre-molding substrate 15 is normally positioned on the profile of the upper mold 9. As an example, in a case where light detection is performed by measuring a current value of a light receiving element and utilizing a phenomenon that a photocurrent is generated by light irradiation, a threshold value may be set for a current value to be measured. This setting is also the same in other embodiments, and is the same in detection using other light receiving elements.
(用於檢驗導向部件的異常或基板變形的機構及操作(包括樹脂成型品的製造方法))(Mechanisms and operations for inspecting abnormality of the guide member or deformation of the substrate (including a method for manufacturing a resin molded product))
參照第5圖～第6圖，對用於檢驗導向部件23、24是否產生了磨損或缺損等異常以及成型前基板15是否產生了翹曲或彎曲等變形中的至少一種的機構及操作進行說明。關於成型前基板的變形，在此作為一例主要對翹曲進行說明，但除此以外如產生褶皺或折痕那樣基板彎曲的情況下，也能夠使用同樣的機構進行同樣的操作。對於成型前基板的變形而言，作為在至少一部分包含樹脂的樹脂性基板中易於產生的變形，還包含如因熱影響而導致基板的一部分翹曲的變形。此外，此處的說明還兼作樹脂成型品的製造方法的說明。With reference to FIGS. 5 to 6, a mechanism and an operation for inspecting at least one of abnormality such as wear or defect of the guide members 23 and 24 and deformation or warpage or bending of the substrate 15 before molding will be described. . Deformation of the substrate before molding is mainly described here as an example. However, if the substrate is bent such as wrinkles or creases, the same operation can be performed using the same mechanism. The deformation of the substrate before molding includes deformation that is liable to occur in a resinous substrate including at least a part of the resin, and also includes deformation such as warping of a part of the substrate due to thermal influence. The description herein also serves as a description of a method for manufacturing a resin molded article.
如第5圖所示，用於檢驗導向部件23、24的異常或成型前基板15變形的機構在成型前基板15的端面與導向部件23、24接觸的狀態下與配置有成型前基板15的區域對應地，在與設置有發光元件27、28、第一出射用通孔29、30及第一受光元件31、32的位置相反一側的位置上分別設置有發光元件35、36、第二出射用通孔37、38及第二受光元件39、40。因此，第二受光元件39、40以如下方式分別設置在供給機構13上：即，在成型前基板15被定位到導向部件23、24的狀態下，俯視觀察時，第二受光元件39與發光元件35及第二出射用通孔37重疊，第二受光元件40與發光元件36及第二出射用通孔38重疊。As shown in FIG. 5, the mechanism for inspecting the abnormality of the guide members 23 and 24 or the deformation of the pre-molded substrate 15 is in contact with the guide members 23 and 24 with the end faces of the pre-molded substrate 15 in contact with the guide members 23 and 24. Correspondingly to the area, light-emitting elements 35, 36, and a second one are provided at positions opposite to the positions where the light-emitting elements 27, 28, the first emission through holes 29, 30, and the first light-receiving elements 31, 32 are provided. The exit through holes 37 and 38 and the second light receiving elements 39 and 40. Therefore, the second light-receiving elements 39 and 40 are respectively provided on the supply mechanism 13 in such a manner that the second light-receiving element 39 and the light-emitting element are in a plan view in a state where the pre-molded substrate 15 is positioned on the guide members 23 and 24. The element 35 and the second emission through hole 37 overlap, and the second light receiving element 40 overlaps the light emitting element 36 and the second emission through hole 38.
參照第6圖，對用於檢驗導向部件23、24上是否產生了磨損或缺損等異常、或者成型前基板15上是否產生了翹曲或彎曲等變形的操作進行說明。Referring to FIG. 6, an operation for inspecting whether or not abnormality such as abrasion or defect is generated on the guide members 23 and 24 or whether deformation such as warping or bending occurs on the substrate 15 before molding will be described.
第6圖的(a)表示在不存在導向部件23、24的磨損或缺損等異常以及成型前基板15的翹曲或彎曲等變形的情況下成型前基板15正常定位在上模9的型面上的狀態。如第6圖的(a)所示，在成型前基板15正常定位在上模9的型面上的情況下，從四個發光元件27、28、35、36發出的照射光33全部被成型前基板15遮斷。因此，四個受光元件(第一受光元件31、32及第二受光元件39、40)均不會檢測到照射光33。(A) of FIG. 6 shows that the molding front substrate 15 is normally positioned on the profile of the upper mold 9 without abnormalities such as abrasion or defect of the guide members 23 and 24 and warpage or bending of the molding substrate 15 before the molding. On the status. As shown in (a) of FIG. 6, when the pre-molding substrate 15 is normally positioned on the profile of the upper mold 9, all the irradiation light 33 emitted from the four light-emitting elements 27, 28, 35, and 36 are molded. The front substrate 15 is interrupted. Therefore, none of the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) can detect the irradiation light 33.
由於第一受光元件31、32未檢測到照射光33，判斷部判斷為成型前基板15與導向部件23、24正常接觸。由於第二受光元件39、40未檢測到照射光33，判斷部判斷為導向部件23、24未產生磨損或缺損等異常且成型前基板15上未產生翹曲或彎曲等變形。如此，在四個受光元件(第一受光元件31、32及第二受光元件39、40)均未檢測到照射光33的情況下，判斷部判斷為沒有任何異常且成型前基板15正常定位在上模9的型面上，並進入下一製程。Since the first light-receiving elements 31 and 32 did not detect the irradiation light 33, the judging unit judged that the pre-molding substrate 15 was in normal contact with the guide members 23 and 24. Since the irradiated light 33 is not detected by the second light receiving elements 39 and 40, the judging unit judges that the guide members 23 and 24 have no abnormality such as abrasion or defect and no deformation such as warping or bending on the substrate 15 before molding. In this way, when none of the four light-receiving elements (the first light-receiving elements 31 and 32 and the second light-receiving elements 39 and 40) detects the irradiation light 33, the determination unit determines that there is no abnormality and the pre-molded substrate 15 is normally positioned at The mold surface of the upper mold 9 is entered into the next process.
在第一受光元件31、32檢測到照射光33的情況下，判斷部判斷為成型前基板15未與導向部件23或24正常接觸，並停止進入下一製程。並且，重新進行成型前基板15的定位。When the first light-receiving elements 31 and 32 detect the irradiation light 33, the determination unit determines that the substrate 15 before molding is not in normal contact with the guide member 23 or 24, and stops entering the next process. Then, the positioning of the substrate 15 before molding is performed again.
第6圖的(b)表示導向部件23、24上產生磨損或缺損等異常的狀態。例如表示被配置在Y方向上的導向部件產生磨損或缺損的狀態。(B) of FIG. 6 shows a state in which abnormalities such as abrasion or chipping have occurred in the guide members 23 and 24. For example, it shows the state where the guide member arrange | positioned in the Y direction is abraded or damaged.
如第6圖的(b)所示，通過定位機構25(參照第3圖的(b))將成型前基板15的端部推壓到產生磨損或缺損的導向部件23X。由於導向部件23X上產生了磨損或缺損而變得比通常的大小小，因此成型前基板15被推出到比正常位置更靠+X方向側。由此，雖然第一出射用通孔29被成型前基板15遮斷，但第二出射用通孔37的一部分未被成型前基板15遮斷。因此，雖然從發光元件27發出的照射光33被成型前基板15遮斷，但從發光元件35發出的照射光33通過成型前基板15後到達第二受光元件39。由此，第二受光元件39檢測到照射光33。在第二受光元件39檢測到照射光33的情況下，判斷部判斷為有可能在導向部件23X上產生了磨損或缺損等異常。於是，判斷部停止進入下一製程，並對導向部件的異常進行調查。As shown in FIG. 6 (b), the end portion of the pre-molded substrate 15 is pushed by the positioning mechanism 25 (refer to FIG. 3 (b)) to the guide member 23X that is worn or damaged. Since the guide member 23X is abraded or damaged and becomes smaller than the normal size, the pre-molded substrate 15 is pushed out to the + X direction side than the normal position. Thereby, although the first exit through-hole 29 is blocked by the molded front substrate 15, a part of the second exit through-hole 37 is not blocked by the molded front substrate 15. Therefore, although the irradiation light 33 emitted from the light-emitting element 27 is blocked by the molding front substrate 15, the irradiation light 33 emitted from the light-emitting element 35 passes through the molding front substrate 15 and reaches the second light-receiving element 39. Thereby, the second light receiving element 39 detects the irradiation light 33. When the second light-receiving element 39 detects the irradiation light 33, the determination unit determines that there may be an abnormality such as abrasion or defect in the guide member 23X. Then, the judging section stops proceeding to the next process and investigates the abnormality of the guide member.
同樣，在第二受光元件40(參照第5圖的(a))檢測到照射光33的情況下，判斷部判斷為有可能在導向部件24上產生了磨損或缺損等異常。於是，判斷部停止進入下一製程。如此，在第二受光元件39、40中的任一受光元件檢測到照射光33的情況下，判斷為有可能在導向部件23、24上產生了磨損或缺損等異常並停止進入下一製程。由此，能抑制由導向部件23、24的異常引起的成型不良的產生。Similarly, when the second light receiving element 40 (see (a) in FIG. 5) detects the irradiation light 33, the determination unit determines that abnormalities such as abrasion or defect may have occurred in the guide member 24. Then, the judging section stops entering the next process. In this way, when any one of the second light receiving elements 39 and 40 detects the irradiation light 33, it is determined that abnormalities such as abrasion or defect may have occurred on the guide members 23 and 24 and the process is stopped in the next process. Accordingly, it is possible to suppress the occurrence of molding defects due to abnormalities in the guide members 23 and 24.
第6圖的(c)表示成型前基板15上產生作為變形之一的翹曲的狀態。例如，表示成型前基板15向安裝有半導體晶片14的一側翹曲後的狀態。(C) of FIG. 6 shows a state where warpage occurs as one of the deformations on the substrate 15 before molding. For example, it shows a state where the substrate 15 before molding is warped to the side on which the semiconductor wafer 14 is mounted.
如第6圖的(c)所示，通過定位機構25(參照第3圖的(b))將例如產生了翹曲的成型前基板15的端部推壓到導向部件23。由於成型前基板15上產生了翹曲，因此成型前基板15在成型前基板15的沿Y方向的兩端部從上模9的型面翹起的狀態下被配置在上模9上。由此，雖然第一出射用通孔29被成型前基板15遮斷，但第二出射用通孔37的一部分未被成型前基板15遮斷。因此，雖然從發光元件27發出的照射光33被成型前基板15遮斷，但從發光元件35發出的照射光33通過成型前基板15後到達第二受光元件39。由此，第二受光元件39檢測到照射光33。在第二受光元件39檢測到照射光33的情況下，判斷部判斷為有可能在成型前基板15上產生了翹曲。於是，判斷部停止進入下一製程，並對成型前基板15的狀態進行調查。As shown in FIG. 6 (c), for example, the end portion of the pre-molded substrate 15 that has warped is pressed against the guide member 23 by the positioning mechanism 25 (see FIG. 3 (b)). Since warpage occurs in the pre-molding substrate 15, the pre-molding substrate 15 is placed on the upper mold 9 in a state where both ends of the pre-molding substrate 15 in the Y direction are lifted from the profile of the upper mold 9. Thereby, although the first exit through-hole 29 is blocked by the molded front substrate 15, a part of the second exit through-hole 37 is not blocked by the molded front substrate 15. Therefore, although the irradiation light 33 emitted from the light-emitting element 27 is blocked by the molding front substrate 15, the irradiation light 33 emitted from the light-emitting element 35 passes through the molding front substrate 15 and reaches the second light-receiving element 39. Thereby, the second light receiving element 39 detects the irradiation light 33. When the second light-receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that warpage has occurred on the substrate 15 before molding. Then, the judging section stops proceeding to the next process and investigates the state of the substrate 15 before molding.
同樣，在第二受光元件40(參照第5圖的(a))檢測到照射光33的情況下，判斷部判斷為有可能在成型前基板15上產生了翹曲。於是，判斷部停止進入下一製程。如此，在第二受光元件39、40中的任一受光元件檢測到照射光33的情況下，判斷為有可能在成型前基板15上產生了翹曲並停止進入下一製程。由此，能抑制由成型前基板15上產生的翹曲引起的成型不良的產生。Similarly, when the second light-receiving element 40 (see (a) in FIG. 5) detects the irradiation light 33, the determination unit determines that there is a possibility that warpage has occurred on the substrate 15 before molding. Then, the judging section stops entering the next process. As described above, when any one of the second light receiving elements 39 and 40 detects the irradiation light 33, it is determined that there is a possibility that warpage has occurred on the substrate 15 before molding, and the process proceeds to the next process. As a result, it is possible to suppress the occurrence of molding defects due to warpage occurring on the substrate 15 before molding.
在第二受光元件39、40中的任一受光元件檢測到照射光33的情況下，有可能在導向部件23、24上產生了磨損或缺損等異常，或者有可能在成型前基板15上產生了翹曲。雖然有必要對這些異常確認原因，但在任何情況下，判斷部也都判斷為有可能產生了某種異常並停止進入下一製程。由此，能抑制由成型前基板15的定位引起的成型不良的產生。When any of the second light-receiving elements 39 and 40 detects the irradiation light 33, abnormalities such as abrasion or defect may be generated on the guide members 23 and 24, or may be generated on the substrate 15 before molding. Warped. Although it is necessary to confirm the cause of these abnormalities, in any case, the judging unit also judges that some abnormality may occur and stops entering the next process. Accordingly, it is possible to suppress the occurrence of molding defects due to the positioning of the substrate 15 before molding.
如上述，在設置於供給機構13的四個受光元件(第一受光元件31、32及第二受光元件39、40)中的任一受光元件檢測到照射光33的情況下，可判斷為在成型前基板15的定位上產生了異常。在第一受光元件31、32檢測到照射光33的情況下，判斷為成型前基板15未與導向部件23、24正常接觸。在第二受光元件39、40檢測到照射光33的情況下，判斷為有可能在導向部件23、24上產生了磨損或缺損等異常，或者有可能在成型前基板15上產生了翹曲或彎曲等變形。在此，在第二受光元件39、40檢測到照射光33的情況下，判斷為有可能在導向部件23、24上產生了磨損或缺損等異常，或者判斷為有可能在成型前基板15上產生了翹曲或彎曲等變形，或者判斷為這些導向部件23、24的異常和成型前基板15的變形這兩者有可能同時發生。在這些情況下，停止進入下一製程。As described above, when any one of the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) provided in the supply mechanism 13 detects the irradiation light 33, it can be determined that An abnormality occurred in the positioning of the substrate 15 before molding. When the first light receiving elements 31 and 32 detect the irradiation light 33, it is determined that the substrate 15 before molding is not in normal contact with the guide members 23 and 24. When the second light-receiving elements 39 and 40 detect the irradiation light 33, it is determined that abnormalities such as abrasion or defect may have occurred on the guide members 23 and 24, or warpage or warpage may have occurred on the substrate 15 before molding. Deformation such as bending. Here, when the second light receiving elements 39 and 40 detect the irradiation light 33, it is determined that abnormalities such as abrasion or defect may have occurred on the guide members 23 and 24, or it is determined that it may be on the substrate 15 before molding. Deformation such as warping or bending occurs, or it is determined that both of the abnormality of these guide members 23 and 24 and deformation of the substrate 15 before molding may occur simultaneously. In these cases, stop entering the next process.
在四個受光元件(第一受光元件31、32及第二受光元件39、40)均未檢測到照射光33的情況下，判斷為在不存在導向部件23、24的磨損或缺損等異常以及成型前基板15的翹曲或彎曲等變形的情況下成型前基板15正常定位在上模9的型面上。在該情況下，進入下一製程。因此，能夠在檢驗成型前基板15正常定位後的狀態下進行樹脂成型，並能抑制起因於定位的成型不良的產生。When none of the four light-receiving elements (the first light-receiving elements 31, 32 and the second light-receiving elements 39, 40) detects the irradiation light 33, it is determined that there is no abnormality such as wear or defect of the guide members 23, 24, and When warping or bending of the pre-molded substrate 15 is deformed, the pre-molded substrate 15 is normally positioned on the profile of the upper mold 9. In this case, proceed to the next process. Therefore, it is possible to perform resin molding in a state where the normal positioning of the substrate 15 before molding is checked, and it is possible to suppress the occurrence of molding defects due to the positioning.
可以根據四個受光元件(第一受光元件31、32及第二受光元件39、40)所接收的光強度，來任意設定設置於上模9的四個出射用通孔(第一出射用通孔29、30及第二出射用通孔37、38)的直徑。在這些出射用通孔的直徑較小的情況下，出射用通孔有時會被樹脂材料或異物等堵塞。因此，較佳定期檢驗四個出射用通孔上是否產生了樹脂堵塞等異常。例如，在未將成型前基板15供給到上模9的狀態下，從四個發光元件27、28、35、36分別發出照射光33。在四個受光元件(第一受光元件31、32及第二受光元件39、40)中的每一個受光元件檢測到照射光33的情況下，可判斷為四個出射用通孔(第一出射用通孔29、30及第二出射用通孔37、38)上均未產生樹脂堵塞等異常。在四個受光元件(第一受光元件31、32及第二受光元件39、40)中的任一個受光元件未檢測到照射光33的情況下，可判斷為與未檢測到照射光33的受光元件對應的出射用通孔上產生了異常。如此，也能檢驗設置於上模9的四個出射用通孔(第一出射用通孔29、30及第二出射用通孔37、38)的異常。The four exit holes (the first exit channels) provided in the upper mold 9 can be arbitrarily set according to the light intensity received by the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40). The diameters of the holes 29, 30 and the second exit through holes 37, 38). When the diameter of these exit holes is small, the exit holes may be blocked by a resin material, a foreign object, or the like. Therefore, it is preferable to periodically check whether abnormalities such as resin clogging have occurred in the four exit holes. For example, in a state where the pre-mold substrate 15 is not supplied to the upper mold 9, the irradiation light 33 is emitted from the four light-emitting elements 27, 28, 35, and 36, respectively. When each of the four light-receiving elements (the first light-receiving elements 31 and 32 and the second light-receiving elements 39 and 40) detects the irradiated light 33, it can be determined that there are four through-holes for emitting light (the first light-emitting element). Neither the through-holes 29, 30, nor the second exit through-holes 37, 38) caused abnormalities such as resin clogging. When any one of the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) does not detect the irradiation light 33, it can be determined that the received light is the same as that in which the irradiation light 33 is not detected. An abnormality occurred in the through-hole for emission corresponding to the element. In this way, the abnormality of the four exit through holes (the first exit through holes 29 and 30 and the second exit through holes 37 and 38) provided in the upper mold 9 can also be checked.
此外，也可以在其他實施方式中應用用於檢驗導向部件23、24上是否產生了磨損或缺損等異常或者成型前基板15上是否產生了翹曲或彎曲等變形的機構。In addition, in other embodiments, a mechanism for inspecting whether or not abnormality such as abrasion or defect has occurred on the guide members 23 and 24 or whether deformation such as warping or bending has occurred on the substrate 15 before molding can be applied.
(作用效果)(Effect)
在本實施方式中，樹脂成型裝置為如下結構。即，該樹脂成型裝置包括：成型模11，具有彼此相對配置的作為第一模的上模9及作為第二模的下模10；供給機構13，用於向作為上模9及下模10中的任一個模的上模9或下模10的型面供給作為樹脂成型對象的成型前基板15；定位機構25、26，用於在型面上將成型前基板15定位到導向部件23、24；合模機構6，用於對成型模11進行合模；發光元件27、28，用於發出照射光33；第一受光元件31、32，被設置於供給機構13且能接收照射光33；和判斷部，用於對成型前基板15的定位進行判斷。其中，在上模9中設置有使來自發光元件27、28的照射光33通過的第一出射用通孔29、30，判斷部基於第一受光元件31、32對通過第一出射用通孔29、30的照射光的檢測，判斷成型前基板15是否正常定位到導向部件23、24。In this embodiment, the resin molding apparatus has the following structure. That is, the resin molding apparatus includes: a molding die 11 having an upper die 9 as a first die and a lower die 10 as a second die arranged opposite to each other; and a supply mechanism 13 for feeding the upper die 9 and the lower die 10 The molding surface of the upper mold 9 or the lower mold 10 of any one of the molds supplies the pre-molding substrate 15 as a resin molding object; the positioning mechanisms 25 and 26 are used to position the pre-molding substrate 15 on the molding surface to the guide member 23, 24; a mold clamping mechanism 6 for clamping the molding mold 11; light emitting elements 27 and 28 for emitting irradiation light 33; first light receiving elements 31 and 32 provided in the supply mechanism 13 and capable of receiving the irradiation light 33 And a judging unit for judging the positioning of the substrate 15 before molding. Among them, the upper mold 9 is provided with first through-holes 29 and 30 for passing the irradiated light 33 from the light-emitting elements 27 and 28, and the determination unit passes the first through-holes for passing through the first light-receiving elements 31 and 32. The detection of the irradiated light at 29 and 30 determines whether the substrate 15 before the molding is normally positioned to the guide members 23 and 24.
本實施方式的樹脂成型品的製造方法包括：供給製程，向作為成型模11中的任一個模的上模9或下模10的型面供給作為樹脂成型對象的成型前基板15，其中，該成型模11具有彼此相對配置的作為第一模的所述上模9及作為第二模的所述下模10；定位製程，在型面上將成型前基板15定位到導向部件23、24；照射製程，從發光元件27、28發出照射光33，該照射光33通過設置於上模9的第一出射用通孔29、30；檢測製程，由設置於供給機構13的第一受光元件31、32來檢測通過第一出射用通孔29、30的照射光33；判斷製程，基於檢測製程中的檢測，判斷成型前基板15是否正常定位到導向部件23、24；和樹脂成型製程，在判斷製程中判斷為成型前基板15正常定位的情況下，在所述樹脂成型製程中對成型模11進行合模而進行樹脂成型。The method for manufacturing a resin molded article according to this embodiment includes a supply process of supplying a pre-molded substrate 15 as a resin molding target to a profile of an upper mold 9 or a lower mold 10 that is any one of the molding dies 11. The molding die 11 has the upper die 9 as a first die and the lower die 10 as a second die arranged opposite to each other; a positioning process, positioning the pre-molded substrate 15 to the guide members 23, 24 on a molding surface; In the irradiation process, irradiation light 33 is emitted from the light emitting elements 27 and 28, and the irradiation light 33 passes through the first exit through holes 29 and 30 provided in the upper mold 9; the detection process is performed by the first light receiving element 31 provided in the supply mechanism 13. And 32 to detect the irradiation light 33 passing through the first through-holes 29 and 30; the determination process is based on the detection in the detection process to determine whether the substrate 15 before the molding is normally positioned to the guide members 23 and 24; and the resin molding process, in When it is determined in the determination process that the substrate 15 before the molding is normally positioned, the molding die 11 is clamped during the resin molding process to perform resin molding.
根據該結構，能夠在檢驗供給到成型模11中的作為樹脂成型對象的成型前基板15正常定位到導向部件23、24的狀態下進行樹脂成型，並且能抑制起因於定位的成型不良的產生。因此，在判斷為成型前基板15正常定位的情況下進行樹脂成型。在判斷為成型前基板15未正常定位的情況下停止樹脂成型。According to this configuration, resin molding can be performed in a state where the pre-molding substrate 15 supplied to the molding die 11 as a resin molding target is normally positioned on the guide members 23 and 24, and generation of molding defects due to positioning can be suppressed. Therefore, when it is determined that the substrate 15 before the molding is normally positioned, resin molding is performed. When it is determined that the substrate 15 before the molding is not positioned normally, the resin molding is stopped.
更詳細而言，根據本實施方式，為了檢驗作為樹脂成型對象的成型前基板15是否正常定位到設置於成型模的上模9上的導向部件23、24，設置發光元件27、28和第一受光元件31、32。通過使成型前基板15與導向部件23、24接觸，將成型前基板15定位在上模9上。在成型前基板15正常定位到導向部件23、24的情況下，在成型前基板15的端面與導向部件23、24之間不會產生間隙。由此，成型前基板15遮斷從發光元件27、28發出的照射光33。因此，第一受光元件31、32檢測不到照射光33。在第一受光元件31、32這兩個受光元件未檢測到照射光33的情況下，判斷部判斷為成型前基板15正常定位到導向部件23、24。在判斷為成型前基板15正常定位的情況下進行樹脂成型。In more detail, according to this embodiment, in order to check whether or not the pre-molding substrate 15 that is the object of resin molding is normally positioned on the guide members 23 and 24 provided on the upper mold 9 of the molding die, the light-emitting elements 27 and 28 and the first Light receiving elements 31 and 32. The pre-molding substrate 15 is brought into contact with the guide members 23 and 24 to position the pre-molding substrate 15 on the upper mold 9. When the pre-molding substrate 15 is normally positioned on the guide members 23 and 24, no gap is generated between the end faces of the pre-molding substrate 15 and the guide members 23 and 24. Thereby, the pre-molding substrate 15 blocks the irradiation light 33 emitted from the light emitting elements 27 and 28. Therefore, the first light receiving elements 31 and 32 cannot detect the irradiation light 33. When the two light-receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is normally positioned on the guide members 23 and 24. When it is determined that the pre-molding substrate 15 is normally positioned, resin molding is performed.
在成型前基板15未正常定位到導向部件23或24的情況下，在成型前基板15的端面與導向部件23或24之間產生間隙。在產生間隙的情況下，從發光元件27、28發出的照射光33通過該間隙後到達第一受光元件31、32。在第一受光元件31、32中的任一受光元件檢測到照射光33的情況下，判斷部判斷為成型前基板15未正常定位到導向部件23或24。在判斷為成型前基板15未正常定位的情況下停止樹脂成型。因此，能抑制由成型前基板15的定位引起的成型不良的產生。In a case where the pre-molding substrate 15 is not positioned to the guide member 23 or 24 normally, a gap is generated between the end surface of the pre-molding substrate 15 and the guide member 23 or 24. When a gap is generated, the irradiation light 33 emitted from the light emitting elements 27 and 28 passes through the gap and reaches the first light receiving elements 31 and 32. When any one of the first light-receiving elements 31 and 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is not normally positioned on the guide member 23 or 24. When it is determined that the substrate 15 before the molding is not positioned normally, the resin molding is stopped. Therefore, it is possible to suppress the occurrence of molding defects caused by the positioning of the substrate 15 before molding.
此外，根據本實施方式，為了檢驗導向部件23、24的異常或成型前基板15的變形，分別設置發光元件35、36、第二出射用通孔37、38及第二受光元件39、40。在第二受光元件39或40中的任一受光元件檢測到照射光33的情況下，判斷為有可能在導向部件23、24上產生了磨損或缺損等異常，或者有可能在成型前基板15上產生了翹曲或彎曲等變形。在這些情況下，停止進入下一製程，並對導向部件23、24的異常或成型前基板15的變形進行調查。由此，能抑制由導向部件23、24的異常或成型前基板15的變形引起的成型不良的產生。In addition, according to this embodiment, in order to check for abnormalities in the guide members 23 and 24 or deformation of the pre-molded substrate 15, light-emitting elements 35 and 36, second emission through holes 37 and 38, and second light-receiving elements 39 and 40 are provided, respectively. When any of the second light receiving elements 39 or 40 detects the irradiated light 33, it is determined that abnormalities such as abrasion or defect may have occurred on the guide members 23 and 24, or that the substrate 15 may be formed before molding. Deformation such as warping or bending occurs. In these cases, the process is stopped and the abnormality of the guide members 23 and 24 or the deformation of the substrate 15 before molding is investigated. Accordingly, it is possible to suppress the occurrence of molding defects due to abnormalities in the guide members 23 and 24 and deformation of the substrate 15 before molding.
此外，根據本實施方式，在未將成型前基板15供給到上模9的狀態下，從四個發光元件27、28、35、36分別發出照射光33。在四個受光元件(第一受光元件31、32及第二受光元件39、40)中的每一個受光元件檢測到照射光33的情況下，判斷為四個出射用通孔(第一出射用通孔29、30及第二出射用通孔37、38)上均未產生樹脂堵塞等異常。在受光元件(第一受光元件31、32及第二受光元件39、40)中的任一受光元件未檢測到照射光33的情況下，判斷為與未檢測到照射光33的受光元件對應的出射用通孔上產生了異常。在該情況下，調查與未檢測到照射光33的受光元件對應的出射用通孔的堵塞等並進行清理。由此，能抑制由出射用通孔(第一出射用通孔29、30及第二出射用通孔37、38)的異常引起的成型不良的產生。In addition, according to this embodiment, in a state where the pre-molding substrate 15 is not supplied to the upper mold 9, the irradiation light 33 is emitted from the four light-emitting elements 27, 28, 35, and 36, respectively. When each of the four light-receiving elements (the first light-receiving elements 31 and 32 and the second light-receiving elements 39 and 40) detects the irradiated light 33, it is determined that there are four exit through-holes (first emission None of the through holes 29 and 30 and the second exit through holes 37 and 38) caused abnormalities such as resin clogging. When any of the light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) does not detect the irradiation light 33, it is determined that the light receiving element corresponds to a light receiving element that does not detect the irradiation light 33. An abnormality occurred in the exit hole. In this case, the clogging and the like of the exit through hole corresponding to the light receiving element in which the irradiation light 33 is not detected is investigated and cleaned. Accordingly, it is possible to suppress the occurrence of molding defects due to abnormalities in the exit through holes (the first exit through holes 29 and 30 and the second exit through holes 37 and 38).
如上述，根據本實施方式，在如作為樹脂成型對象的成型前基板15未與導向部件23、24正常接觸的情況、導向部件23、24上產生磨損或缺損等異常的情況、成型前基板15上產生翹曲或彎曲等變形的情況、以及第一出射用通孔29、30、第二出射用通孔37、38上產生樹脂堵塞的情況等的、產生起因於定位的異常的情況下，停止進入下一製程。由此，能抑制起因於定位的成型不良的產生。因此，能夠在檢驗成型前基板15正常定位後的狀態下進行樹脂成型。As described above, according to the present embodiment, when the pre-molded substrate 15 that is the object of resin molding is not in normal contact with the guide members 23 and 24, when abnormalities such as abrasion or defect occur on the guide members 23 and 24, the pre-molded substrate 15 When deformation such as warping or bending occurs, and when resin clogging occurs in the first exit through holes 29, 30, and the second exit through holes 37, 38, etc., and an abnormality due to positioning occurs, Stop entering the next process. Accordingly, it is possible to suppress the occurrence of molding defects due to positioning. Therefore, it is possible to perform resin molding in a state where the normal positioning of the substrate 15 before molding is checked.
在本實施方式中，作為對成型前基板15進行定位的裝置，使用了設置於上模9或固定台板4的定位機構25、26。不限於此，也可以在供給機構13上設置定位機構。在由供給機構13將成型前基板15移交於上模9的型面之後，使用設置於供給機構13的定位機構來將成型前基板15分別推壓到導向部件23、24。由此，能夠將成型前基板15定位在上模9的型面上。通過在供給機構13上設置定位機構，能夠簡化樹脂成型裝置的結構。In this embodiment, as a means for positioning the substrate 15 before molding, positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 are used. Not limited to this, a positioning mechanism may be provided on the supply mechanism 13. After the pre-molding substrate 15 is transferred to the profile of the upper mold 9 by the supply mechanism 13, the positioning mechanism provided in the supply mechanism 13 is used to push the pre-molding substrate 15 to the guide members 23 and 24, respectively. Thereby, the pre-molding substrate 15 can be positioned on the profile of the upper mold 9. By providing the positioning mechanism in the supply mechanism 13, the structure of a resin molding apparatus can be simplified.
此外，可以將供給機構13自身用作定位機構。在將供給機構13自身用作定位機構的情況下，在將成型前基板15移交於上模9的型面的同時，使用供給機構13使成型前基板15在X方向及Y方向上移動，從而將成型前基板15的端面分別推壓到導向部件23、24。由此，能夠將成型前基板15定位在上模9的型面上。通過將供給機構13自身用作定位機構，能夠進一步簡化樹脂成型裝置的結構。Further, the supply mechanism 13 itself may be used as a positioning mechanism. When the supply mechanism 13 is used as a positioning mechanism, the pre-molding substrate 15 is transferred to the profile of the upper mold 9 while the pre-molding substrate 15 is moved in the X direction and the Y direction by using the supply mechanism 13. The end faces of the pre-molded substrate 15 are pressed against the guide members 23 and 24, respectively. Thereby, the pre-molding substrate 15 can be positioned on the profile of the upper mold 9. By using the supply mechanism 13 itself as a positioning mechanism, the structure of a resin molding apparatus can be further simplified.
[實施方式2][Embodiment 2]
參照第7圖，對在實施方式2中用於檢驗供給到上模9的成型前基板15是否正常定位的機構進行說明。實施方式2與實施方式1的不同點在於，發光元件27設置在固定台板4的外部，並且在設置於固定台板4的導光部上設置有用於反射照射光33的光學部件。除此以外的結構及操作與實施方式1相同，因此省略說明。此外，在以下的實施方式中，對導向部件23、24不存在磨損或缺損等異常且成型前基板15未產生翹曲或彎曲等變形的情況進行描述。Referring to FIG. 7, a mechanism for checking whether the pre-mold substrate 15 supplied to the upper mold 9 is properly positioned in the second embodiment will be described. The second embodiment differs from the first embodiment in that the light-emitting element 27 is provided outside the fixed platen 4, and an optical member for reflecting the irradiation light 33 is provided on a light guide portion provided on the fixed platen 4. The other configurations and operations are the same as those of the first embodiment, and therefore descriptions thereof are omitted. In addition, in the following embodiments, a case where the guide members 23 and 24 are free from abnormalities such as wear and tear and the substrate 15 is not deformed such as warpage or bending before molding will be described.
如第7圖的(a)、(b)所示，在固定台板4上分別設置有：導光部41，與第一出射用通孔29相連且沿X方向延伸；以及導光部42，與第一出射用通孔30相連且沿Y方向延伸。在沿X方向延伸的導光部41的延伸方向上配置有發光元件27。同樣，在沿Y方向延伸的導光部42的延伸方向上配置有發光元件28。As shown in (a) and (b) of FIG. 7, the fixed platen 4 is provided with a light guide portion 41 connected to the first exit through hole 29 and extending in the X direction, and a light guide portion 42. Is connected to the first exit through hole 30 and extends in the Y direction. A light emitting element 27 is arranged in an extending direction of the light guide portion 41 extending in the X direction. Similarly, a light emitting element 28 is arranged in the extending direction of the light guide portion 42 extending in the Y direction.
如第7圖的(b)所示，反射鏡43被設置於導光部41，該反射鏡43用於將從發光元件27朝向-X方向發出的照射光33的行進方向變更90度。借助反射鏡43將行進方向變更為-Z方向後的照射光33通過第一出射用通孔29後到達成型前基板15。同樣，反射鏡44被設置於導光部42，該反射鏡44用於將從發光元件朝向-Y方向發出的照射光33的行進方向變更90度。借助反射鏡44將行進方向變更為-Z方向後的照射光33通過第一出射用通孔30後到達成型前基板15。As shown in FIG. 7 (b), a reflecting mirror 43 is provided in the light guide section 41, and the reflecting mirror 43 is used to change the traveling direction of the irradiation light 33 emitted from the light emitting element 27 in the −X direction by 90 degrees. The irradiation light 33 after the traveling direction is changed to the -Z direction by the reflector 43 passes through the first exit through-hole 29 and reaches the pre-molded substrate 15. Similarly, a reflecting mirror 44 is provided in the light guide section 42, and the reflecting mirror 44 is used to change the traveling direction of the irradiation light 33 emitted from the light-emitting element toward the −Y direction by 90 degrees. The irradiation light 33 after the traveling direction is changed to the -Z direction by the mirror 44 passes through the first exit through-hole 30 and reaches the pre-molded substrate 15.
如第7圖的(c)所示，設置於供給機構13的第一受光元件31、32的配置與實施方式1相同。用於檢驗成型前基板15的定位的操作與實施方式1同樣。因此，本實施方式也取得與實施方式1同樣的效果。As shown in FIG. 7 (c), the arrangement of the first light receiving elements 31 and 32 provided in the supply mechanism 13 is the same as that of the first embodiment. The operation for checking the positioning of the substrate 15 before molding is the same as that of the first embodiment. Therefore, this embodiment also achieves the same effects as those of the first embodiment.
[實施方式3][Embodiment 3]
參照第8圖，對在實施方式3中用於檢驗供給到上模的成型前基板15是否正常定位的機構及操作進行說明。實施方式3與實施方式1的不同點在於，將發光元件27、28設置於供給機構，並且在設置於固定台板的導光部上設置有作為光學部件的兩片反射鏡。伴隨該變更，上模、下模及固定台板的結構與實施方式1～2不同。Referring to FIG. 8, a mechanism and an operation for checking whether the pre-molded substrate 15 supplied to the upper mold is properly positioned in the third embodiment will be described. The third embodiment differs from the first embodiment in that the light-emitting elements 27 and 28 are provided in a supply mechanism, and two light reflectors as optical components are provided on a light guide portion provided on a fixed platen. With this change, the structures of the upper mold, the lower mold, and the fixed platen are different from those of the first to second embodiments.
(基板定位檢驗機構)(Substrate positioning inspection mechanism)
參照第8圖，對用於檢驗供給到上模的成型前基板15是否正常定位的機構進行說明，如第8圖的(b)、(c)所示，在供給機構45上設置有作為用於檢驗成型前基板15在X方向上的定位的結構要素的發光元件27及第一受光元件31。同樣，在供給機構45上設置有作為用於檢驗成型前基板15在Y方向上的定位的結構要素的發光元件28及第一受光元件32。Referring to FIG. 8, a mechanism for checking whether the pre-molded substrate 15 supplied to the upper mold is properly positioned will be described. As shown in (b) and (c) of FIG. 8, a function is provided on the supply mechanism 45. The light-emitting element 27 and the first light-receiving element 31 are components for inspecting the positioning of the pre-molded substrate 15 in the X direction. Similarly, a light-emitting element 28 and a first light-receiving element 32 are provided on the supply mechanism 45 as constituent elements for checking the positioning of the pre-molded substrate 15 in the Y direction.
如第8圖的(a)、(b)、(c)所示，在上模48上分別設置有用於使從設置於供給機構45的發光元件27、28發出的照射光33通過的入射用通孔46及47。發光元件27和入射用通孔46被配置為俯視觀察時重疊。同樣，發光元件28和入射用通孔47被配置為俯視觀察時重疊。此外，“入射用”的含義為從外部的發光元件27、28將照射光33射入上模48側的導光部50、51(後述)。As shown in (a), (b), and (c) of FIG. 8, the upper die 48 is provided with an entrance for passing the irradiation light 33 emitted from the light emitting elements 27 and 28 provided in the supply mechanism 45, respectively.通 孔 46 和 47。 Through holes 46 and 47. The light emitting element 27 and the incident through-hole 46 are arranged so as to overlap each other in a plan view. Similarly, the light emitting element 28 and the incident through-hole 47 are arranged so as to overlap each other in a plan view. In addition, “for incident” means that the light emitting elements 27 and 28 from the outside emit the irradiation light 33 into the light guide sections 50 and 51 (described later) on the upper mold 48 side.
在固定台板49上沿X方向設置有與第一出射用通孔及入射用通孔46相連的導光部50。同樣，在固定台板49上沿Y方向設置有與第一出射用通孔30及入射用通孔47相連的導光部51。在導光部50中，作為光學部件分別設置有用於將照射光33的行進方向變更90度的反射鏡43a、43b。同樣，在導光部51中，作為光學部件分別設置有用於將照射光33的行進方向變更90度的反射鏡44a、44b。The fixed platen 49 is provided along the X direction with a light guide 50 connected to the first exit through hole and the incident through hole 46. Similarly, the fixed platen 49 is provided along the Y direction with a light guide portion 51 connected to the first exit through-hole 30 and the incident through-hole 47. In the light guide section 50, reflectors 43 a and 43 b for changing the traveling direction of the irradiation light 33 by 90 degrees are provided as optical components, respectively. Similarly, in the light guide 51, mirrors 44a and 44b for changing the traveling direction of the irradiation light 33 by 90 degrees are provided as optical components, respectively.
(基板定位檢驗操作(樹脂成型品的製造方法))(Substrate positioning inspection operation (manufacturing method of resin molded product))
參照第8圖，對用於檢驗供給到上模的成型前基板15是否正常定位的操作進行說明。此外，該說明還兼作樹脂成型品的製造方法的說明。An operation for checking whether the pre-molding substrate 15 supplied to the upper mold is normally positioned will be described with reference to FIG. 8. This description also doubles as a description of a method for manufacturing a resin molded article.
如第8圖的(b)所示，從發光元件27朝向+Z方向發出的照射光33通過入射用通孔46後射入反射鏡43a。射入反射鏡43a的照射光33通過反射鏡43a將行進方向變更90度後在導光部50內沿-X方向行進而射入反射鏡43b。射入反射鏡43b的照射光33通過反射鏡43b將行進方向變更90度後沿-Z方向行進並通過第一出射用通孔29。通過第一出射用通孔29的照射光33到達成型前基板15。As shown in FIG. 8 (b), the irradiation light 33 emitted from the light-emitting element 27 in the + Z direction passes through the incident through-hole 46 and enters the reflecting mirror 43 a. The irradiated light 33 that has entered the reflecting mirror 43a changes the traveling direction by 90 degrees through the reflecting mirror 43a, and then travels in the -X direction in the light guide section 50 and enters the reflecting mirror 43b. The irradiated light 33 that has entered the reflecting mirror 43 b changes the traveling direction by 90 degrees through the reflecting mirror 43 b and then travels in the −Z direction and passes through the first exit through-hole 29. The irradiation light 33 passing through the first exit through-hole 29 reaches the pre-mold substrate 15.
根據設置於供給機構45的第一受光元件31是否檢測到從發光元件27發出且依次通過入射用通孔46、導光部50及第一出射用通孔29的照射光33，來判斷成型前基板15是否正常定位在X方向上。同樣，根據第二受光元件32是否檢測到從發光元件28發出且依次通過入射用通孔47、導光部51及第一出射用通孔30的照射光33，來判斷成型前基板15是否正常定位在Y方向上。如此，能夠檢驗成型前基板15的定位。在該情況下，由於發光元件27、28及第一受光元件31、32均設置於供給機構45，因此易於將其訊號線佈線於樹脂成型裝置的控制部及判斷部。由於取得與實施方式1同樣的效果，因此省略關於作用效果的說明。Before the molding is judged based on whether the first light receiving element 31 provided in the supply mechanism 45 detects the irradiation light 33 emitted from the light emitting element 27 and sequentially passes through the incident through-hole 46, the light guide 50, and the first outgoing through-hole 29. Whether the substrate 15 is normally positioned in the X direction. Similarly, it is determined whether the pre-molded substrate 15 is normal based on whether the second light receiving element 32 detects the irradiation light 33 emitted from the light emitting element 28 and sequentially passes through the incident through-hole 47, the light guide 51, and the first outgoing through-hole 30. Position in the Y direction. In this way, the positioning of the substrate 15 before molding can be checked. In this case, since the light-emitting elements 27 and 28 and the first light-receiving elements 31 and 32 are all provided in the supply mechanism 45, it is easy to route the signal lines to the control section and the determination section of the resin molding apparatus. Since the same effects as those of the first embodiment are obtained, the description of the operational effects is omitted.
[實施方式4][Embodiment 4]
參照第9圖，對在實施方式4中用於檢驗供給到上模48的成型前基板15是否正常定位的機構進行說明。實施方式4與實施方式3的不同點在於，作為光學部件使用光纖而不是反射鏡。除此以外的結構及操作與實施方式3相同，因此省略說明。A mechanism for checking whether the pre-mold substrate 15 supplied to the upper mold 48 in the fourth embodiment is properly positioned will be described with reference to FIG. 9. The fourth embodiment differs from the third embodiment in that an optical fiber is used as an optical component instead of a reflector. The other configurations and operations are the same as those of the third embodiment, and therefore descriptions thereof are omitted.
如第9圖的(a)、(b)所示，在設置於固定台板49的導光部50、51上分別設置有光纖52、53。較佳光纖52、53為具有耐熱性的光纖。光纖52、53具有中心部的芯線和包圍該芯線周圍的金屬包層這雙重結構。為了保持耐熱性，優先使用如下光纖：即，該光纖的芯線及金屬包層由石英玻璃構成，並且利用耐熱性聚醯亞胺來包覆該光纖。As shown in (a) and (b) of FIG. 9, optical fibers 52 and 53 are respectively provided on the light guide portions 50 and 51 provided on the fixed platen 49. The optical fibers 52 and 53 are preferably optical fibers having heat resistance. The optical fibers 52 and 53 have a dual structure of a core wire at the center and a metal cladding surrounding the core wire. In order to maintain heat resistance, it is preferable to use an optical fiber whose core wire and metal cladding are made of quartz glass, and the optical fiber is covered with a heat-resistant polyfluorene.
與第一出射用通孔29、30及入射用通孔46、47的直徑對應地，可使用光纖為一根的單芯光纖，或者可使用通過捆紮多根單芯光纖並包覆而成的光纖束。此外，可以在光纖的兩端嵌入光纖用透鏡。作為透鏡，可適當使用准直透鏡、聚光透鏡或非球面透鏡等。在第9圖中示出在接收從發光元件27、28發出的照射光33的一側分別設置有光纖用透鏡54的情況。光纖52、53具有傳送損失小且佈線自由度高的特徵。此外，作為光纖，較佳使用耐熱性光纖，例如可使用由聚醯亞胺包覆的石英製光纖。Corresponding to the diameters of the first exit through-holes 29 and 30 and the entrance through-holes 46 and 47, a single-core optical fiber may be used, or a plurality of single-core optical fibers may be bundled and covered. Fiber optic bundle. In addition, an optical fiber lens may be embedded at both ends of the optical fiber. As the lens, a collimator lens, a condenser lens, an aspheric lens, or the like can be suitably used. FIG. 9 illustrates a case where the optical fiber lens 54 is provided on each side that receives the irradiation light 33 emitted from the light emitting elements 27 and 28. The optical fibers 52 and 53 are characterized by small transmission loss and high degree of freedom in wiring. In addition, as the optical fiber, a heat-resistant optical fiber is preferably used, and for example, a quartz optical fiber covered with polyfluorene can be used.
用於檢驗成型前基板15的定位的操作與實施方式1相同，因此不再重複說明。本實施方式也取得與實施方式1同樣的效果。The operation for inspecting the positioning of the substrate 15 before molding is the same as that of the first embodiment, and therefore the description will not be repeated. This embodiment also achieves the same effects as those of the first embodiment.
[實施方式5][Embodiment 5]
參照第10圖，對在實施方式5中用於檢驗供給到上模48的成型前基板15是否正常定位的機構進行說明。實施方式5與實施方式4的不同點在於將光纖設置在設置於上模48的導光部。除此以外的結構及操作與實施方式4相同，因此省略說明。Referring to Fig. 10, a mechanism for checking whether the pre-mold substrate 15 supplied to the upper mold 48 in the fifth embodiment is properly positioned will be described. The fifth embodiment differs from the fourth embodiment in that an optical fiber is provided in a light guide portion provided in the upper mold 48. The other configurations and operations are the same as those of the fourth embodiment, and therefore descriptions thereof are omitted.
如第10圖的(a)、(b)所示，在設置於上模48的導光部55、56分別設置有實施方式4所示的光纖52、53。光纖52、53為具有耐熱性的光纖。As shown in FIGS. 10 (a) and (b), the light guides 55 and 56 provided in the upper mold 48 are provided with the optical fibers 52 and 53 shown in the fourth embodiment, respectively. The optical fibers 52 and 53 are heat-resistant optical fibers.
用於檢驗成型前基板15的定位的操作與實施方式1相同。本實施方式也取得與實施方式1同樣的效果。The operation for checking the positioning of the substrate 15 before molding is the same as that of the first embodiment. This embodiment also achieves the same effects as those of the first embodiment.
[實施方式6][Embodiment 6]
參照第11圖，對在實施方式6中用於同時檢驗被供給到上模9的成型前基板15是否正常定位到導向部件23、24、導向部件23、24上是否產生了磨損或缺損等異常、或者成型前基板15上是否了產生翹曲或彎曲等變形的機構進行說明。實施方式6與在此之前說明的實施方式的不同點在於第一出射用通孔29、30的設置位置不同。Referring to FIG. 11, in the sixth embodiment, it is checked whether the pre-molded substrate 15 supplied to the upper mold 9 is normally positioned on the guide members 23 and 24 and whether there is any abnormality such as abrasion or defect on the guide members 23 and 24. It will be described whether or not a mechanism causing deformation such as warping or bending is formed on the substrate 15 before molding. The sixth embodiment differs from the previously described embodiments in that the installation positions of the first emission through holes 29 and 30 are different.
如第11圖的(a)所示，在成型前基板15與導向部件23、24接觸的狀態下，例如在上模9的型面的配置成型前基板15的區域中的對角線上的角部(第11圖中的右上和右下)中分別設置有第一出射用通孔29、30。在第一出射用通孔29、30設置於該位置的狀態下，發光元件27及第一受光元件31被設置為俯視觀察時與第一出射用通孔29重疊，發光元件28及第一受光元件32被設置為俯視觀察時與第一出射用通孔30重疊。As shown in FIG. 11 (a), in a state where the pre-molding substrate 15 is in contact with the guide members 23 and 24, for example, the angle on the diagonal line in the area where the pre-molding substrate 15 is arranged on the profile of the upper mold 9. Parts (upper right and lower right in Fig. 11) are provided with first exit holes 29, 30, respectively. In a state where the first emitting through holes 29 and 30 are provided at this position, the light emitting element 27 and the first light receiving element 31 are arranged to overlap the first emitting through hole 29 in a plan view, and the light emitting element 28 and the first light receiving The element 32 is provided so as to overlap the first emitting through hole 30 in a plan view.
在第一受光元件31、32這兩個受光元件未檢測到從發光元件27、28發出的照射光33的情況下，可判斷為未產生成型前基板15的定位不良、導向部件23、24的異常及成型前基板15的變形。在第一受光元件31、32中的任一受光元件檢測到照射光33的情況下，可判斷為產生了成型前基板15的定位不良、導向部件23、24的異常及成型前基板15的變形中的任一種而成型前基板15未正常定位。When the first light receiving elements 31 and 32 do not detect the irradiation light 33 emitted from the light emitting elements 27 and 28, it can be determined that the positioning failure of the pre-molded substrate 15 and the failure of the guide members 23 and 24 have not occurred. Abnormality and deformation of the substrate 15 before molding. When any one of the first light receiving elements 31 and 32 detects the irradiation light 33, it can be determined that a poor positioning of the substrate 15 before molding, an abnormality of the guide members 23 and 24, and a deformation of the substrate 15 before molding are generated. Either of them is not properly positioned before the molding of the substrate 15.
通過設為這種結構，在不增加發光元件及受光元件的數量的情況下，能夠同時檢驗成型前基板15的定位不良、導向部件23、24的異常及成型前基板15的變形。因此，在樹脂成型裝置中，能抑制定位機構的成本。With this configuration, without increasing the number of light-emitting elements and light-receiving elements, it is possible to simultaneously inspect a poor positioning of the substrate 15 before molding, an abnormality of the guide members 23 and 24, and a deformation of the substrate 15 before molding. Therefore, the cost of the positioning mechanism can be suppressed in the resin molding apparatus.
[實施方式7][Embodiment 7]
參照第12圖，對在實施方式7中用於檢驗供給到上模9的成型前基板15是否正常定位的機構進行說明。實施方式7與實施方式1的不同點在於，在成型前基板15的沿Y方向及X方向的端部分別設置兩個發光元件和兩個受光元件並檢驗成型前基板15的定位。由此，不僅在X方向及Y方向上，還在θ方向上能夠檢驗成型前基板15是否正常定位。除此以外的結構與實施方式1相同，因此省略說明。A mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold 9 in the seventh embodiment is described with reference to FIG. 12 will be described. The seventh embodiment differs from the first embodiment in that two light-emitting elements and two light-receiving elements are respectively provided at the ends in the Y direction and the X direction of the pre-molded substrate 15 and the positioning of the pre-molded substrate 15 is checked. Thereby, it is possible to check whether the pre-molded substrate 15 is normally positioned not only in the X and Y directions but also in the θ direction. The other configurations are the same as those of the first embodiment, and therefore descriptions thereof are omitted.
(基板定位檢驗機構)(Substrate positioning inspection mechanism)
參照第12圖，對在實施方式7中用於檢驗供給到上模9的成型前基板15的定位的機構進行說明。如第12圖的(a)所示，實施方式7與實施方式1同樣地在上模9的型面上分別設置有：導向部件23，用於將成型前基板15定位在X方向上；以及導向部件24，用於將成型前基板15定位在Y方向上。A mechanism for checking the positioning of the pre-mold substrate 15 supplied to the upper mold 9 in the seventh embodiment will be described with reference to FIG. 12. As shown in (a) of FIG. 12, Embodiment 7 is provided with a guide member 23 for positioning the pre-mold substrate 15 in the X direction on the profile of the upper mold 9 in the same manner as in Embodiment 1. The guide member 24 is used to position the front substrate 15 in the Y direction.
如第12圖的(a)、(b)所示，為了檢驗成型前基板15在X方向上的定位，在固定台板4的內部設置有兩個發光元件27a、27b。同樣，為了檢驗成型前基板15在Y方向上的定位，在固定台板4的內部設置有兩個發光元件28a、28b。As shown in (a) and (b) of FIG. 12, in order to check the positioning of the substrate 15 in the X direction before molding, two light emitting elements 27 a and 27 b are provided inside the fixed platen 4. Similarly, in order to check the positioning of the pre-molded substrate 15 in the Y direction, two light-emitting elements 28 a and 28 b are provided inside the fixed platen 4.
在上模9上分別設置有使發光元件27a及27b所發出的照射光通過的第一出射用通孔29a及29b。如第12圖的(a)所示，第一出射用通孔29a、29b分別設置於在成型前基板15與導向部件23接觸的狀態下成型前基板15配置在上模9的型面的區域上。第一出射用通孔30a、30b分別設置於在成型前基板15與導向部件24接觸的狀態下成型前基板15配置在上模9的型面的區域上。The upper mold 9 is provided with first exit through holes 29a and 29b through which the irradiation light emitted from the light emitting elements 27a and 27b passes, respectively. As shown in FIG. 12 (a), the first exit through holes 29 a and 29 b are respectively provided in a region where the molding front substrate 15 is disposed on the molding surface of the upper mold 9 while the molding front substrate 15 is in contact with the guide member 23. on. The first emitting through holes 30 a and 30 b are respectively provided in the regions of the molding surface of the upper mold 9 in a state where the molding front substrate 15 is in contact with the guide member 24.
如第12圖的(c)所示，在供給機構13上分別設置有用於檢測發光元件27a、27b所發出的照射光33的第一受光元件31a、31b。第一受光元件31a、31b為用於檢驗成型前基板15在X方向上的定位的受光元件。同樣，在供給機構13上分別設置有用於檢驗發光元件28a、28b所發出的照射光33的第一受光元件32a、32b。第一受光元件32a、32b為用於檢驗成型前基板15在Y方向上的定位的受光元件。As shown in FIG. 12 (c), the supply mechanism 13 is provided with first light receiving elements 31 a and 31 b for detecting the irradiation light 33 emitted from the light emitting elements 27 a and 27 b, respectively. The first light-receiving elements 31 a and 31 b are light-receiving elements for checking the positioning of the pre-molded substrate 15 in the X direction. Similarly, the supply mechanism 13 is provided with first light receiving elements 32a and 32b for inspecting the irradiation light 33 emitted from the light emitting elements 28a and 28b, respectively. The first light-receiving elements 32 a and 32 b are light-receiving elements for checking the positioning of the pre-molded substrate 15 in the Y direction.
由於沿Y方向設置有兩個第一受光元件31a、31b，並且沿X方向設置有兩個第一受光元件32a、32b，因此不僅在X方向及Y方向上，還在θ方向上能夠檢驗成型前基板15是否正常定位。由此，能夠進一步高精度地檢驗成型前基板15的定位。Since two first light receiving elements 31a and 31b are provided along the Y direction and two first light receiving elements 32a and 32b are provided along the X direction, the molding can be inspected not only in the X and Y directions but also in the θ direction. Whether the front substrate 15 is normally positioned. Thereby, the positioning of the substrate 15 before molding can be checked with higher accuracy.
在本實施方式中，沿Y方向設置有兩個第一受光元件31a、31b，沿X方向設置有兩個第一受光元件32a、32b。不限於此，也可以設為沿Y方向設置有兩個第一受光元件且沿X方向設置有一個第一受光元件的結構。或者，也可以設為沿X方向設置有兩個第一受光元件且沿Y方向設置有一個第一受光元件的結構。在這些情況下也不僅在X方向及Y方向上，還在θ方向上能夠檢驗成型前基板15是否正常定位。In this embodiment, two first light receiving elements 31a and 31b are provided along the Y direction, and two first light receiving elements 32a and 32b are provided along the X direction. It is not limited to this, and a structure in which two first light receiving elements are provided in the Y direction and one first light receiving element is provided in the X direction may be adopted. Alternatively, a configuration may be adopted in which two first light receiving elements are provided in the X direction and one first light receiving element is provided in the Y direction. In these cases, it is possible to check whether the pre-molded substrate 15 is positioned normally not only in the X and Y directions but also in the θ direction.
由於本實施方式中的成型前基板15的定位檢驗操作基本上與實施方式1相同，因此不再重複說明。關於作用效果，也取得與實施方式1同樣的效果。另外，用於檢驗導向部件的異常或成型前基板15的變形的機構也可以與實施方式1同樣的方式進行檢驗。Since the positioning inspection operation of the pre-molded substrate 15 in this embodiment is basically the same as that in Embodiment 1, the description will not be repeated. Regarding the operational effects, the same effects as those of the first embodiment are obtained. The mechanism for inspecting the abnormality of the guide member or the deformation of the substrate 15 before molding may be inspected in the same manner as in the first embodiment.
[實施方式8][Embodiment 8]
參照第13圖，對在實施方式8中用於檢驗供給到上模9的成型前基板15的定位的機構進行說明。實施方式8與實施方式7的不同點在於，為了檢驗X方向及Y方向的定位而分別設置一個發光元件和兩個第一受光元件。兩個第一受光元件經由設置於固定台板4內的導光部的光纖而接收發光元件所發出的照射光33。除此以外的結構及操作與實施方式7相同，因此省略說明。A mechanism for inspecting the positioning of the pre-mold substrate 15 supplied to the upper mold 9 in the eighth embodiment will be described with reference to FIG. 13. The eighth embodiment differs from the seventh embodiment in that one light-emitting element and two first light-receiving elements are provided for checking the positioning in the X direction and the Y direction, respectively. The two first light receiving elements receive the irradiation light 33 emitted from the light emitting element through an optical fiber provided in the light guide portion in the fixed platen 4. The other configurations and operations are the same as those of the seventh embodiment, and therefore descriptions thereof are omitted.
如第13圖的(a)、(b)所示，為了檢驗成型前基板15在X方向上的定位，在固定台板4的內部設置有具有T字型形狀的導光部57。在T字型的導光部57設置有光纖58、用於分支在光纖58內行進的光的分支部件59和分支後的光纖58a、58b。發光元件27所發出的照射光33經由光纖58和分支部件59依次通過光纖58a、58b及第一出射用通孔29a、29b後，分別被第一受光元件31a、31b檢測。As shown in (a) and (b) of FIG. 13, in order to check the positioning of the pre-molded substrate 15 in the X direction, a light guide portion 57 having a T-shape is provided inside the fixed platen 4. The T-shaped light guide 57 is provided with an optical fiber 58, a branching member 59 for branching light traveling in the optical fiber 58, and branched optical fibers 58 a and 58 b. The irradiation light 33 emitted from the light emitting element 27 passes through the optical fibers 58a and 58b and the first exit through holes 29a and 29b in this order through the optical fiber 58 and the branch member 59, and is detected by the first light receiving elements 31a and 31b, respectively.
同樣，為了檢驗成型前基板15在Y方向上的定位，在固定台板4的內部設置有具有T字型形狀的導光部60。在T字型的導光部60設置有光纖61、用於分支在光纖61內行進的光的分支部件62和分支後的光纖61a、61b。發光元件28所發出的照射光33經由光纖61和分支部件62依次通過光纖61a、61b及第一出射用通孔30a、30b後，分別被第一受光元件32a、32b檢測。Similarly, in order to check the positioning of the pre-molded substrate 15 in the Y direction, a light guide 60 having a T-shape is provided inside the fixed platen 4. The T-shaped light guide 60 is provided with an optical fiber 61, a branching member 62 for branching light traveling in the optical fiber 61, and branched optical fibers 61a and 61b. The irradiation light 33 emitted from the light emitting element 28 passes through the optical fibers 61 a and 61 b and the first exit through holes 30 a and 30 b through the optical fiber 61 and the branch member 62 in order, and is detected by the first light receiving elements 32 a and 32 b, respectively.
通過設為這種結構，能夠削減發光元件的數量，並且不僅在X方向及Y方向上，還在θ方向上能夠檢驗成型前基板15是否正常定位。因此，能夠進一步高精度地檢驗成型前基板15的定位，並且能抑制定位機構的成本。With such a configuration, the number of light-emitting elements can be reduced, and not only the X-direction and Y-direction but also the θ-direction can be used to check whether or not the pre-molded substrate 15 is properly positioned. Therefore, the positioning of the substrate 15 before molding can be checked with higher accuracy, and the cost of the positioning mechanism can be suppressed.
在此，雖然使從共同的發光元件28發出的照射光33分支到兩個第一出射用通孔30a、30b，但也可以使該照射光33分支到第一出射用通孔和第二出射用通孔。Here, although the irradiation light 33 emitted from the common light-emitting element 28 is branched to the two first exit through holes 30a, 30b, the irradiation light 33 may be branched to the first exit through hole and the second exit. With through holes.
在本實施方式中，為了分支發光元件所發出的照射光33，使用了光纖及分支部件。不限於此，只要採用用於分支從發光元件發出的照射光的光學部件則並不特別限定。In the present embodiment, an optical fiber and a branching member are used in order to branch the irradiation light 33 emitted from the light emitting element. It is not limited to this, and is not particularly limited as long as an optical member for branching the irradiated light emitted from the light emitting element is used.
[實施方式9][Embodiment 9]
(樹脂成型裝置的結構)(Structure of resin molding device)
參照第14圖對本發明所涉及的樹脂成型裝置的結構進行說明。第14圖所示的樹脂成型裝置為例如使用壓縮成型法的樹脂成型裝置。如實施方式1所示，示出將成型前基板15作為樹脂成型對象使用並且將液狀樹脂作為樹脂材料使用的例。The structure of the resin molding apparatus concerning this invention is demonstrated with reference to FIG. The resin molding apparatus shown in FIG. 14 is a resin molding apparatus using a compression molding method, for example. As shown in Embodiment 1, an example in which the pre-molding substrate 15 is used as a resin molding target and a liquid resin is used as a resin material is shown.
樹脂成型裝置63包括分別作為結構要素的基板供給收納模組64、三個成型模組65A、65B、65C和樹脂供給模組66。作為結構要素的基板供給收納模組64、成型模組65A、65B、65C和樹脂供給模組66分別相對於其他結構要素能夠彼此裝卸，並且能夠交換。The resin molding apparatus 63 includes a substrate supply storage module 64, three molding modules 65A, 65B, 65C, and a resin supply module 66 as structural elements, respectively. The substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66, which are structural elements, can be attached to and detached from each other and exchanged.
在基板供給收納模組64中設置有：成型前基板供給部67，用於供給成型前基板15；成型後基板收納部68，用於收納作為成型後基板的樹脂成型品22；基板載置部69，用於移交成型前基板15及樹脂成型品22；和供給機構13，用於將成型前基板15供給到成型模11中。在該情況下，例如設置有實施方式1所示的供給機構13(參照第3圖的(b)、(c))。在供給機構13上設置有用於檢驗成型前基板15的定位的第一受光元件31、32。在本實施方式中示出實施方式1中說明的定位檢驗機構，但也可以採用其他實施方式中說明的定位檢驗機構。The substrate supply and storage module 64 is provided with a pre-mold substrate supply unit 67 for supplying the pre-mold substrate 15; a post-mold substrate storage unit 68 for receiving a resin-molded product 22 as a post-mold substrate; and a substrate mounting portion 69, for transferring the pre-molded substrate 15 and the resin molded product 22; and a supply mechanism 13 for supplying the pre-molded substrate 15 to the molding die 11. In this case, for example, the supply mechanism 13 shown in Embodiment 1 is provided (refer to (b) and (c) of FIG. 3). The supply mechanism 13 is provided with first light receiving elements 31 and 32 for checking the positioning of the substrate 15 before molding. Although the positioning inspection mechanism described in the first embodiment is shown in this embodiment, the positioning inspection mechanism described in the other embodiments may be adopted.
在各成型模組65A、65B、65C中分別設置有第1圖所示的樹脂成型單元1。在樹脂成型單元1中設置有能夠升降的下模10和與下模10相對配置的上模9(參照第3圖的(a)、(b))。上模9和下模10一併構造成型模11(參照第2圖)。各成型模組65A、65B、65C具有對上模9和下模10進行合模及開模的合模機構6(第14圖中的用雙點劃線表示的部分)。在下模10中設置有型腔16，型腔16為液狀樹脂20(參照第2圖的(b))所被供給且進行硬化的空間。在下模10中設置有用於供給長條狀的離型膜(參照第2圖的(a))的離型膜供給機構70。此外，在此對在下模10上設置有型腔16的結構進行說明，但型腔也可以設置於上模，並且還可以設置於上模和下模這兩個模上。A resin molding unit 1 shown in FIG. 1 is provided in each of the molding modules 65A, 65B, and 65C. The resin molding unit 1 is provided with a lower mold 10 capable of lifting and lowering, and an upper mold 9 disposed opposite to the lower mold 10 (see (a) and (b) of FIG. 3). The upper mold 9 and the lower mold 10 together form a molding mold 11 (see FIG. 2). Each of the molding modules 65A, 65B, and 65C includes a mold clamping mechanism 6 (a portion indicated by a two-dot chain line in FIG. 14) for clamping and opening the upper mold 9 and the lower mold 10. A cavity 16 is provided in the lower mold 10, and the cavity 16 is a space where the liquid resin 20 (see (b) in FIG. 2) is supplied and hardened. The lower mold 10 is provided with a release film supply mechanism 70 for supplying a long release film (see (a) in FIG. 2). In addition, the structure in which the cavity 16 is provided in the lower mold 10 is described here, but the cavity may be provided in the upper mold, and may also be provided in two molds, the upper mold and the lower mold.
在樹脂供給模組66中設置有：分送器18，用於向成型模11供給液狀樹脂20；和移動機構19，用於使分送器18移動。在分送器18的前端部具有用於吐出液狀樹脂的樹脂吐出部。The resin supply module 66 is provided with a dispenser 18 for supplying the liquid resin 20 to the molding die 11 and a moving mechanism 19 for moving the dispenser 18. A resin ejection portion for ejecting the liquid resin is provided at a front end portion of the dispenser 18.
在樹脂供給模組66中設置有具有判斷部71的控制部72。判斷部71基於設置於供給機構13的第一受光元件31、32是否檢測到照射光33，判斷成型前基板15在成型模11中是否正常定位。此外，判斷部71還判斷導向部件上是否產生了異常或成型前基板15上是否了產生變形。控制部72控制成型前基板15及樹脂成型品22的運送、成型前基板15的定位、液狀樹脂20的供給、成型模11的加熱和成型模11的開閉等。換言之，控制部72控制基板供給收納模組64、成型模組65A、65B、65C及樹脂供給模組66中的各種操作。The resin supply module 66 is provided with a control unit 72 having a determination unit 71. The determination unit 71 determines whether the pre-mold substrate 15 is normally positioned in the molding die 11 based on whether the first light receiving elements 31 and 32 provided in the supply mechanism 13 detect the irradiation light 33. In addition, the determination unit 71 determines whether an abnormality has occurred on the guide member or whether a deformation has occurred on the substrate 15 before molding. The control unit 72 controls the conveyance of the pre-molded substrate 15 and the resin molded product 22, the positioning of the pre-molded substrate 15, the supply of the liquid resin 20, the heating of the molding die 11, the opening and closing of the molding die 11, and the like. In other words, the control unit 72 controls various operations in the substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66.
配置控制部72的位置也可以是任何位置，控制部72也可以配置在基板供給收納模組64、成型模組65A、65B、65C和樹脂供給模組66中的至少一個模組上，還可以配置在各模組的外部。另外，也可以將控制部72構造為根據作為控制對象的操作而分離至少一部分而成的多個控制部。也可以與控制部的結構對應地設置判斷部71。The position where the control unit 72 is disposed may be any position, and the control unit 72 may be disposed on at least one of the substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66, and Placed outside each module. In addition, the control unit 72 may be configured as a plurality of control units that are separated by at least a part according to an operation as a control target. The determination unit 71 may be provided in accordance with the configuration of the control unit.
由於在第2圖所示的樹脂成型品的製造方法中對樹脂成型裝置63的操作概要進行了說明，因此在此不再重複說明。Since the outline of the operation of the resin molding apparatus 63 has been described in the method for manufacturing a resin molded product shown in FIG. 2, the description will not be repeated here.
在本實施方式中，在基板供給收納模組64與樹脂供給模組66之間沿X方向排列安裝有三個成型模組65A、65B、65C。也可以將基板供給收納模組64和樹脂供給模組66設為一個模組，並且在該模組上沿X方向排列安裝一個成型模組65A。此外，也可以在該成型模組65A上安裝其他成型模組65B。由此，能夠與生產方式或生產量對應地增減成型模組65A、65B、…。因此，能夠優化樹脂成型裝置63的結構，故能提高生產率。In the present embodiment, three molding modules 65A, 65B, and 65C are installed in a row between the substrate supply storage module 64 and the resin supply module 66 in the X direction. The substrate supply storage module 64 and the resin supply module 66 may be set as a single module, and a molding module 65A may be arranged and arranged in the X direction on the module. In addition, another molding module 65B may be mounted on the molding module 65A. Accordingly, the molding modules 65A, 65B,... Can be increased or decreased according to the production method or the production amount. Therefore, since the structure of the resin molding apparatus 63 can be optimized, productivity can be improved.
在各實施方式中，通過向成型模的上模供給成型前基板15，並且由設置於供給機構的受光元件檢測照射光33，從而檢驗供給到上模的成型前基板15是否正常定位。不限於此，在向成型模的下模供給成型前基板15並將其定位在下模的型面上的情況下，也可以應用本發明。在該情況下，也取得與各實施方式同樣的效果。In each embodiment, the pre-molding substrate 15 is supplied to the upper mold of the molding die, and the irradiation light 33 is detected by a light receiving element provided in the supply mechanism, thereby checking whether the pre-molding substrate 15 supplied to the upper mold is normally positioned. The present invention is not limited to this. When the pre-molding substrate 15 is supplied to the lower mold of the molding mold and positioned on the molding surface of the lower mold, the present invention can also be applied. In this case, the same effects as those of the respective embodiments are obtained.
在各實施方式中，示出在使用壓縮成型法的樹脂成型裝置的成型模中檢驗供給到上模的成型前基板15是否正常定位的情況。不限於此，在使用傳遞成型法的樹脂成型裝置的成型模中也可以應用本發明。In each of the embodiments, a case where the pre-molding substrate 15 supplied to the upper mold is inspected in a molding die of a resin molding apparatus using a compression molding method is shown as being normally positioned. The invention is not limited to this, and the present invention can also be applied to a molding die of a resin molding apparatus using a transfer molding method.
在各實施方式中，示出將安裝有半導體晶片14的成型前基板15作為樹脂成型對象使用的例。作為成型前基板，可使用玻璃環氧基板、陶瓷基板、樹脂基板或金屬基板等的普通基板及引線框等。此外，樹脂成型對象也可以是如專利文獻1所記載的安裝在板夾具上的結構。In each embodiment, an example is shown in which the pre-molded substrate 15 on which the semiconductor wafer 14 is mounted is used as a resin molding target. As the substrate before molding, a general substrate such as a glass epoxy substrate, a ceramic substrate, a resin substrate, or a metal substrate, a lead frame, and the like can be used. In addition, the resin molding object may be a structure mounted on a plate jig as described in Patent Document 1.
在各實施方式中，對樹脂成型裝置及樹脂成型品的製造方法進行了說明。其中，該樹脂成型裝置在對半導體晶片進行樹脂成型時使用。樹脂成型的對象可以是IC或電晶體等的半導體晶片，也可以是未使用半導體的非半導體晶片，還可以是半導體晶片和非半導體晶片混合在一起的晶片組。在利用硬化樹脂對安裝在玻璃環氧基板、陶瓷基板或引線框等基板上的一個或多個晶片進行樹脂成型時可應用本發明。In each embodiment, the resin molding apparatus and the manufacturing method of a resin molded article were demonstrated. Among them, this resin molding apparatus is used when resin molding a semiconductor wafer. The object of resin molding may be a semiconductor wafer such as an IC or a transistor, or a non-semiconductor wafer without using a semiconductor, or a wafer group in which a semiconductor wafer and a non-semiconductor wafer are mixed together. The present invention is applicable when resin-molding one or more wafers mounted on a substrate such as a glass epoxy substrate, a ceramic substrate, or a lead frame with a hardened resin.
如上述，上述實施方式的樹脂成型裝置包括：成型模，具有彼此相對配置的第一模及第二模；供給機構，用於向第一模及第二模中的任一個模供給樹脂成型對象；定位機構，用於在型面上將樹脂成型對象定位到導向部件；合模機構，用於對成型模進行合模；發光元件，用於發出照射光；第一受光元件，被設置於供給機構且能夠接收照射光；和判斷部，用於對樹脂成型對象的定位進行判斷，在一個模上設置有使來自發光元件的照射光通過的第一出射用通孔，判斷部基於第一受光元件對通過第一出射用通孔的照射光的檢測，判斷樹脂成型對象是否正常定位到導向部件。As described above, the resin molding apparatus according to the above-mentioned embodiment includes: a molding die having a first mold and a second mold arranged opposite to each other; and a supply mechanism for supplying a resin molding object to any one of the first mold and the second mold. Positioning mechanism for positioning the resin molding object to the guide member on the molding surface; mold clamping mechanism for clamping the molding mold; light emitting element for emitting light; a first light receiving element provided in the supply A mechanism capable of receiving irradiation light; and a judging unit for judging the positioning of a resin molding object, a first exit through hole for passing irradiation light from the light emitting element is provided on one mold, and the judging unit is based on the first light receiving The element detects whether the resin molding object is normally positioned on the guide member by detecting the irradiation light passing through the first exit through-hole.
根據該結構，能夠在檢驗樹脂成型對象正常定位到導向部件後的狀態下進行樹脂成型。因此，能抑制起因於定位的成型不良的產生。According to this structure, resin molding can be performed in a state where it is checked that the resin molding object is normally positioned on the guide member. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，在上述實施方式的樹脂成型裝置中，判斷部為如下結構：在第一受光元件未檢測到照射光的情況下判斷為樹脂成型對象正常定位到導向部件；在第一受光元件檢測到照射光的情況下判斷為樹脂成型對象未正常定位到導向部件。In addition, in the resin molding apparatus of the above-mentioned embodiment, the determination unit has the following structure: when the first light receiving element does not detect the irradiation light, it is determined that the resin molding object is normally positioned on the guide member; and when the first light receiving element detects the irradiation, In the case of light, it is determined that the resin molding object is not positioned properly on the guide member.
根據該結構，基於第一受光元件是否檢測到照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this configuration, it is determined whether or not the resin molding object is normally positioned on the guide member based on whether the first light receiving element detects the irradiation light. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，上述實施方式的樹脂成型裝置為如下結構：在樹脂成型對象與導向部件接觸的狀態下導向部件側的樹脂成型對象所配置的區域上設置有第一出射用通孔。In addition, the resin molding apparatus of the above embodiment has a structure in which a first exit through hole is provided in a region where the resin molding object on the guide member side is disposed in a state where the resin molding object is in contact with the guide member.
根據該結構，基於第一受光元件是否檢測到通過第一出射用通孔的照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this configuration, it is determined whether or not the resin molding target is normally positioned on the guide member based on whether the first light receiving element detects the irradiation light through the first exit through hole. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，上述實施方式的樹脂成型裝置為如下結構：在一個模或安裝有一個模的台板上設置有導光部，該導光部用於將從發光元件發出的照射光引導到第一出射用通孔，在導光部設置有使照射光通過的光學部件。In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which a light guide portion is provided on one mold or a platen on which one mold is mounted, and the light guide portion is configured to guide the irradiation light emitted from the light emitting element to the first emission. An optical member is provided in the light guide section through the through hole to allow the irradiated light to pass through.
根據該結構，通過在導光部上設置光學部件，能夠將從發光元件發出的照射光引導到第一出射用通孔。According to this configuration, by providing the optical member in the light guide portion, the irradiation light emitted from the light emitting element can be guided to the first exit through-hole.
此外，上述實施方式的樹脂成型裝置為如下結構：光學部件包含光纖、反射鏡及棱鏡中的任一種。In addition, the resin molding apparatus of the above-mentioned embodiment has a configuration in which the optical component includes any one of an optical fiber, a mirror, and a prism.
根據該結構，通過使用光纖、反射鏡及棱鏡中的任一種，能夠將照射光引導到第一出射用通孔。According to this configuration, by using any of an optical fiber, a mirror, and a prism, it is possible to guide the irradiation light to the first exit through-hole.
此外，上述實施方式的樹脂成型裝置為如下結構：發光元件被設置於供給機構，在一個模上設置有入射用通孔，該入射用通孔用於使從發光元件發出的照射光通過並將其引導到導光部。In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which a light-emitting element is provided in a supply mechanism, and an incident through-hole is provided in one mold, and the incident through-hole is used to pass irradiation light emitted from the light-emitting element and It is guided to the light guide.
根據該結構，能夠將從設置於供給機構的發光元件發出的照射光經由入射用通孔及光學部件引導到第一出射用通孔。According to this configuration, the irradiation light emitted from the light-emitting element provided in the supply mechanism can be guided to the first exit through-hole through the entrance through-hole and the optical member.
此外，上述實施方式的樹脂成型裝置為如下結構：在樹脂成型對象與導向部件接觸的狀態下導向部件的相反側中的樹脂成型對象所配置的區域上設置有使從發光元件或其他發光元件發出的照射光通過的第二出射用通孔，在供給機構上設置有能夠接收照射光的第二受光元件。In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which a region where the resin molding object is arranged on the opposite side of the guide member in a state where the resin molding object is in contact with the guide member is provided with a light emitting element or other light emitting element. The second exit through-hole through which the irradiation light passes is provided with a second light receiving element capable of receiving the irradiation light in the supply mechanism.
根據該結構，能夠基於第二受光元件是否檢測到通過設置於導向部件的相反側的第二出射用通孔的照射光，來判斷導向部件的異常及樹脂成型對象是否產生變形中的至少一種。因此，能抑制起因於定位的成型不良的產生。According to this configuration, at least one of the abnormality of the guide member and the deformation of the resin molding object can be determined based on whether or not the second light receiving element detects the irradiation light through the second exit through hole provided on the opposite side of the guide member. Therefore, the occurrence of molding defects due to positioning can be suppressed.
上述實施方式的樹脂成型品的製造方法包括：供給製程，通過供給機構向具有彼此相對配置的第一模及第二模的成型模中的任一個模的型面供給樹脂成型對象；定位製程，在型面上將樹脂成型對象定位到導向部件；照射製程，從發光元件發出通過設置於一個模的第一出射用通孔的照射光；檢測製程，設置於供給機構的第一受光元件對通過第一出射用通孔的照射光進行檢測；判斷製程，基於檢測製程中的檢測，判斷樹脂成型對象是否正常定位到導向部件；和樹脂成型製程，在判斷製程中判斷為樹脂成型對象正常定位的情況下，在樹脂成型製程中對成型模進行合模而進行樹脂成型。The method for manufacturing a resin molded product according to the above-mentioned embodiment includes a supply process of supplying a resin molding object to a molding surface of any one of a molding mold having a first mold and a second mold arranged opposite to each other through a supply mechanism; a positioning process, Position the resin molding object on the profile on the guide member; the irradiation process emits light from the light-emitting element through the first exit through-hole provided in a mold; the detection process passes through the first light-receiving element pair provided in the supply mechanism. The first emission is detected by the irradiation light of the through hole; the judgment process is based on the detection in the inspection process to determine whether the resin molding object is normally positioned to the guide member; and the resin molding process is judged to be the normal positioning of the resin molding object in the judgment process. In this case, in the resin molding process, the mold is clamped to perform resin molding.
根據該方法，能夠在檢驗樹脂成型對象正常定位到導向部件後的狀態下進行樹脂成型。因此，能抑制起因於定位的成型不良的產生。According to this method, resin molding can be performed in a state where it is checked that the resin molding object is normally positioned on the guide member. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，上述實施方式的樹脂成型品的製造方法在檢測製程中第一受光元件未檢測到照射光的情況下，在判斷製程中判斷為樹脂成型對象正常定位到導向部件；在檢測製程中第一受光元件檢測到照射光的情況下，在判斷製程中判斷為樹脂成型裝置未正常定位到導向部件。In addition, in the method of manufacturing a resin molded product according to the above embodiment, when the first light receiving element does not detect the irradiation light during the detection process, it is determined in the determination process that the resin molding object is normally positioned to the guide member; in the detection process, the first When the light receiving element detects the irradiated light, it is determined in the determination process that the resin molding device is not positioned properly on the guide member.
根據該方法，基於第一受光元件是否檢測到照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this method, it is determined whether or not the resin molding object is normally positioned on the guide member based on whether the first light receiving element detects the irradiation light. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，上述實施方式的樹脂成型品的製造方法在檢測製程中對通過第一出射用通孔的照射光進行檢測，其中，所述第一出射用通孔被設置於在樹脂成型對象與導向部件接觸的狀態下導向部件側的樹脂成型對象所配置的區域上。In the method for manufacturing a resin molded product according to the above embodiment, the irradiation light passing through the first exit through-hole is detected during a detection process, wherein the first exit through-hole is provided between the resin molding object and the guide member. On the area where the resin molding object on the guide member side is arranged in the contact state.
根據該方法，基於第一受光元件是否檢測到通過第一出射用通孔的照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this method, it is determined whether or not the resin molding object is normally positioned on the guide member based on whether the first light receiving element detects the irradiation light through the first exit through-hole. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，上述實施方式的樹脂成型品的製造方法在照射製程中朝向導光部發出照射光，其中所述導光部被設置於一個模上或者設置於安裝有一個模的台板上，在檢測製程中對經由導光部而通過第一出射用通孔的照射光進行檢測。In addition, in the method for manufacturing a resin molded product according to the above embodiment, irradiation light is emitted toward a light guide portion during an irradiation process, wherein the light guide portion is provided on a mold or a platen on which a mold is installed, and is detected during In the manufacturing process, the irradiation light passing through the first exit through-hole through the light guide section is detected.
根據該方法，基於第一受光元件是否檢測到經由導光部而通過第一出射用通孔的照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this method, it is determined whether the resin molding object is normally positioned on the guide member based on whether or not the first light receiving element detects the irradiation light that has passed through the first exit through-hole through the light guide portion. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，在上述實施方式的樹脂成型品的製造方法中，發光元件被設置於供給機構，照射光從發光元件依次經由設置於一個模的入射用通孔、導光部及第一出射用通孔後被第一受光元件檢測。In the method for manufacturing a resin molded product according to the above embodiment, the light-emitting element is provided in the supply mechanism, and the irradiation light is sequentially passed from the light-emitting element through the incident through-hole, the light guide portion, and the first outgoing through-hole provided in one mold. It is then detected by the first light receiving element.
根據該方法，基於第一受光元件是否檢測到由設置於供給機構的發光元件發出且依次通過入射用通孔、導光部及第一出射用通孔的照射光，來判斷樹脂成型對象是否正常定位到導向部件。因此，能抑制起因於定位的成型不良的產生。According to this method, it is determined whether the resin molding object is normal based on whether the first light receiving element detects the light emitted from the light emitting element provided in the supply mechanism and sequentially passes through the incident through-hole, the light guide, and the first outgoing through-hole. Position to the guide. Therefore, the occurrence of molding defects due to positioning can be suppressed.
此外，在上述實施方式的樹脂成型品的製造方法中，檢測製程包括以下製程：第二受光元件對通過第二出射用通孔的從發光元件或其他發光元件發出的照射光進行檢測，其中，在樹脂成型對象與導向部件接觸的狀態下進一步在導向部件的相反側中的樹脂成型對象所配置的區域上設置有所述第二出射用通孔，在判斷製程中基於檢測製程中的由第二受光元件進行的檢測，判斷導向部件的異常及樹脂成型對象的變形中的至少一種。In addition, in the method for manufacturing a resin molded product according to the above embodiment, the detection process includes the following process: the second light receiving element detects the irradiation light emitted from the light emitting element or another light emitting element through the second exit through hole, wherein: The second injection through-hole is further provided in a region where the resin molding object is disposed on the opposite side of the guide member in a state where the resin molding object is in contact with the guide member. The detection by the two light receiving elements determines at least one of an abnormality of the guide member and a deformation of the resin molding object.
根據該方法，能夠基於第二受光元件是否檢測到通過設置於導向部件的相反側的第二出射用通孔的照射光，來判斷導向部件的異常及樹脂成型對象是否產生變形中的至少一種。According to this method, it is possible to determine at least one of an abnormality of the guide member and a deformation of the resin molding object based on whether the second light receiving element detects the irradiation light through the second exit through hole provided on the opposite side of the guide member.
因此，能抑制起因於定位的成型不良的產生。Therefore, the occurrence of molding defects due to positioning can be suppressed.
本發明並不限定於上述的各實施方式，在不脫離本發明精神的範圍內，可根據需要，任意且適當地組合、變更或選擇性地採用。The present invention is not limited to the above-mentioned embodiments, and may be arbitrarily and appropriately combined, changed, or selectively adopted as needed without departing from the spirit of the present invention.
1‧‧‧樹脂成型單元1‧‧‧resin molding unit
10‧‧‧下模10‧‧‧ lower mold
11‧‧‧成型模11‧‧‧forming mold
12‧‧‧樹脂成型對象12‧‧‧ resin molding object
13‧‧‧供給機構13‧‧‧Supply agency
14‧‧‧半導體晶片14‧‧‧Semiconductor wafer
15‧‧‧成型前基板15‧‧‧Former substrate
16‧‧‧型腔16‧‧‧ Cavity
17‧‧‧離型膜17‧‧‧ release film
18‧‧‧分送器18‧‧‧ Distributor
19‧‧‧移動機構19‧‧‧ Mobile agency
2‧‧‧底座2‧‧‧ base
20‧‧‧液狀樹脂20‧‧‧Liquid resin
21‧‧‧硬化樹脂21‧‧‧hardened resin
22‧‧‧樹脂成型品22‧‧‧Resin molding
23、23X、24‧‧‧導向部件23, 23X, 24‧‧‧Guide parts
25、26‧‧‧定位機構25, 26‧‧‧ Positioning agencies
27、27a、27b、28、28a、28b、35、36‧‧‧發光元件27, 27a, 27b, 28, 28a, 28b, 35, 36‧‧‧ light-emitting elements
29、29a、29b、30、30a、30b‧‧‧第一出射用通孔29, 29a, 29b, 30, 30a, 30b ‧‧‧ the first exit through hole
3‧‧‧連接桿3‧‧‧ connecting rod
31、31a、31b、32、32a、32b‧‧‧第一受光元件31, 31a, 31b, 32, 32a, 32b ‧‧‧ the first light receiving element
33‧‧‧照射光33‧‧‧light
34‧‧‧間隙34‧‧‧ Clearance
37、38‧‧‧第二出射用通孔37, 38‧‧‧Second exit through hole
39、40‧‧‧第二受光元件39, 40‧‧‧Second light receiving element
4、49‧‧‧固定台板4, 49‧‧‧ fixed platen
41、42、50、51、55、56、57、60‧‧‧導光部41, 42, 50, 51, 55, 56, 57, 60, ‧‧‧ light guide
43、43a、43b、44、44a、44b‧‧‧反射鏡43, 43a, 43b, 44, 44a, 44b ‧‧‧ mirrors
45‧‧‧供給機構45‧‧‧Supply Agency
46、47‧‧‧入射用通孔46, 47‧‧‧ incident through holes
48、9‧‧‧上模48, 9‧‧‧ Upper mold
5‧‧‧可動台板5‧‧‧ movable table
52、53、58、58a、58b、61、61a、61b‧‧‧光纖52, 53, 58, 58a, 58b, 61, 61a, 61b ‧‧‧ fiber
54‧‧‧光纖用透鏡54‧‧‧Fiber optic lens
59、62‧‧‧分支部件59, 62‧‧‧ branch parts
6‧‧‧合模機構6‧‧‧ clamping mechanism
63‧‧‧樹脂成型裝置63‧‧‧resin molding device
64‧‧‧基板供給收納模組64‧‧‧ substrate supply storage module
65A、65B、65C‧‧‧成型模組65A, 65B, 65C‧‧‧forming module
66‧‧‧樹脂供給模組66‧‧‧Resin supply module
67‧‧‧成型前基板供給部67‧‧‧Substrate supply department before molding
68‧‧‧樹脂成型品收納部68‧‧‧Resin molded product storage section
69‧‧‧基板載置部69‧‧‧ Substrate mounting section
7‧‧‧啟動源7‧‧‧ start source
70‧‧‧離型膜供給機構70‧‧‧ release film supply mechanism
71‧‧‧判斷部71‧‧‧Judgment Department
72‧‧‧控制部72‧‧‧ Control Department
8‧‧‧傳遞部件8‧‧‧ transfer parts
第1圖係表示在本發明所涉及的樹脂成型裝置中樹脂成型單元的大致結構的主視圖。 第2圖的(a)～(d)係表示對樹脂成型對象進行樹脂成型的製程的示意性剖視圖。 第3圖係表示在實施方式1中用於檢驗樹脂成型對象係否正常定位在上模的型面上的機構的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的大致剖視圖，(c)係供給機構的俯視圖。 第4圖係在實施方式1中用於檢驗定位在上模的型面上的樹脂成型對象是否正常定位的示意圖，(a)係表示對樹脂成型對象進行定位的狀態的示意性剖視圖，(b)係表示正常定位的狀態的示意性剖視圖，(c)係表示產生定位不良的狀態的示意性剖視圖。 第5圖係表示在實施方式1中用於檢驗是否產生導向部件的異常或樹脂成型對象的翹曲或彎曲等變形的機構的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第6圖係在實施方式1中用於檢驗是否產生導向部件的異常或樹脂成型對象的翹曲的示意圖，(a)係表示樹脂成型對象正常定位的狀態的示意性剖視圖，(b)係表示導向部件產生異常的狀態的示意性剖視圖，(c)係表示樹脂成型對象產生翹曲的狀態的示意性剖視圖。 第7圖係表示在實施方式2中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第8圖係表示在實施方式3中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第9圖係表示在實施方式4中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第10圖係表示在實施方式5中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第11圖係表示在實施方式6中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第12圖係表示在實施方式7中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第13圖係表示在實施方式8中將樹脂成型對象定位在上模的型面上的狀態的示意圖，(a)係上模的仰視圖，(b)係成型模及供給機構的示意性剖視圖，(c)係供給機構的俯視圖。 第14圖係表示在本發明所涉及的樹脂成型裝置中裝置的大致結構的俯視圖。FIG. 1 is a front view showing a schematic configuration of a resin molding unit in a resin molding apparatus according to the present invention. (A)-(d) of FIG. 2 is a schematic sectional view which shows the process of resin-molding a resin-molded object. FIG. 3 is a schematic diagram showing a mechanism for checking whether the resin molding object is normally positioned on the molding surface of the upper mold in Embodiment 1, (a) is a bottom view of the upper mold, and (b) is a molding mold and a supply. A schematic cross-sectional view of the mechanism, (c) is a plan view of the supply mechanism. FIG. 4 is a schematic diagram for checking whether the resin molding object positioned on the molding surface of the upper mold is properly positioned in Embodiment 1. (a) is a schematic cross-sectional view showing a state where the resin molding object is positioned, (b ) Is a schematic cross-sectional view showing a state of normal positioning, and (c) is a schematic cross-sectional view showing a state of poor positioning. FIG. 5 is a schematic diagram showing a mechanism for inspecting whether a guide member is abnormal or a deformation such as warping or bending of a resin molding object in the first embodiment, (a) is a bottom view of an upper mold, and (b) is a molding A schematic cross-sectional view of the mold and the supply mechanism, (c) is a plan view of the supply mechanism. FIG. 6 is a schematic diagram for inspecting whether or not an abnormality of a guide member or warping of a resin molding object occurs in Embodiment 1. (a) is a schematic cross-sectional view showing a state where a resin molding object is normally positioned, and (b) is a schematic view (C) is a schematic cross-sectional view showing a state in which a guide member is abnormally warped. FIG. 7 is a schematic view showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 2. (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and a supply mechanism. (C) is a top view of the supply mechanism. Fig. 8 is a schematic view showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 3, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and the supply mechanism. (C) is a top view of the supply mechanism. FIG. 9 is a schematic diagram showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 4, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and a supply mechanism. (C) is a top view of the supply mechanism. Fig. 10 is a schematic view showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 5, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and the supply mechanism. (C) is a top view of the supply mechanism. FIG. 11 is a schematic diagram showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 6, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and the supply mechanism. (C) is a top view of the supply mechanism. FIG. 12 is a schematic view showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 7, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and a supply mechanism. (C) is a top view of the supply mechanism. FIG. 13 is a schematic view showing a state where a resin molding object is positioned on a molding surface of an upper mold in Embodiment 8, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and a supply mechanism. (C) is a top view of the supply mechanism. Fig. 14 is a plan view showing a schematic configuration of a device in a resin molding device according to the present invention.
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| JP2017-087132 | 2017-04-26 | ||
| JP2017087132A JP6894285B2 (en) | 2017-04-26 | 2017-04-26 | Resin molding equipment and manufacturing method of resin molded products |
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| TWI704043B TWI704043B (en) | 2020-09-11 |
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| JP2022037315A (en) | 2020-08-25 | 2022-03-09 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded product |
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| JPH084267Y2 (en) * | 1989-05-31 | 1996-02-07 | 三菱マテリアル株式会社 | Mold for element package molding |
| JPH05109797A (en) * | 1991-10-14 | 1993-04-30 | Mitsubishi Electric Corp | Semiconductor resin sealing device |
| JPH1086188A (en) * | 1996-09-18 | 1998-04-07 | Sony Corp | Mold assembly for ic package |
| JP3398032B2 (en) * | 1997-12-10 | 2003-04-21 | 河西工業株式会社 | Sheet material positioning method and positioning device |
| JP4362296B2 (en) * | 2003-02-25 | 2009-11-11 | アピックヤマダ株式会社 | Work carry-in device and resin sealing device |
| JP2005154201A (en) * | 2003-11-26 | 2005-06-16 | Sumitomo Heavy Ind Ltd | Mold assembly, press apparatus, handling apparatus and method, and positioning method |
| JP4290177B2 (en) * | 2005-06-08 | 2009-07-01 | キヤノン株式会社 | Mold, alignment method, pattern forming apparatus, pattern transfer apparatus, and chip manufacturing method |
| CN100503265C (en) * | 2005-06-08 | 2009-06-24 | 佳能株式会社 | Mold, pattern forming method, and pattern forming apparatus |
| CN101037013A (en) * | 2006-03-15 | 2007-09-19 | 鸿富锦精密工业（深圳）有限公司 | Mould device |
| JP4965933B2 (en) * | 2006-08-11 | 2012-07-04 | アピックヤマダ株式会社 | Mold equipment |
| JP4848255B2 (en) * | 2006-11-29 | 2011-12-28 | アピックヤマダ株式会社 | Resin molding method and resin molding apparatus |
| TW201040009A (en) * | 2009-05-08 | 2010-11-16 | Hon Hai Prec Ind Co Ltd | Method for making optical element and imprinting mold |
| JP6294680B2 (en) * | 2014-01-24 | 2018-03-14 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
| JP2015154201A (en) * | 2014-02-13 | 2015-08-24 | キヤノン株式会社 | Image processing system, control method for the same, and program |
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