TW201730230A - 密封用液狀組成物、密封材以及電子零件裝置 - Google Patents

密封用液狀組成物、密封材以及電子零件裝置 Download PDF

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Publication number
TW201730230A
TW201730230A TW105131240A TW105131240A TW201730230A TW 201730230 A TW201730230 A TW 201730230A TW 105131240 A TW105131240 A TW 105131240A TW 105131240 A TW105131240 A TW 105131240A TW 201730230 A TW201730230 A TW 201730230A
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TW
Taiwan
Prior art keywords
sealing
liquid composition
group
compound
acid
Prior art date
Application number
TW105131240A
Other languages
English (en)
Chinese (zh)
Inventor
竹内勇磨
小坂正彦
高橋寿登
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW201730230A publication Critical patent/TW201730230A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW105131240A 2015-09-29 2016-09-29 密封用液狀組成物、密封材以及電子零件裝置 TW201730230A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015191837A JP6657716B2 (ja) 2015-09-29 2015-09-29 封止用液状組成物、封止材、及び電子部品装置

Publications (1)

Publication Number Publication Date
TW201730230A true TW201730230A (zh) 2017-09-01

Family

ID=58427530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131240A TW201730230A (zh) 2015-09-29 2016-09-29 密封用液狀組成物、密封材以及電子零件裝置

Country Status (3)

Country Link
JP (1) JP6657716B2 (ja)
TW (1) TW201730230A (ja)
WO (1) WO2017057637A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112218931A (zh) * 2018-06-12 2021-01-12 株式会社Lg化学 封装组合物
TWI834774B (zh) * 2018-11-30 2024-03-11 日商力森諾科股份有限公司 底部填充材料、半導體封裝以及半導體封裝的製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6709943B2 (ja) * 2017-12-13 2020-06-17 ナミックス株式会社 導電性ペースト

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117074A (ja) * 1997-06-26 1999-01-22 Jsr Corp 半導体封止用組成物および半導体装置
JP4392096B2 (ja) * 1999-01-12 2009-12-24 ナミックス株式会社 カチオン重合性樹脂組成物
JP4575601B2 (ja) * 2001-01-09 2010-11-04 ナミックス株式会社 中空構造の電子デバイスの製造方法
US20060223978A1 (en) * 2005-04-04 2006-10-05 Shengqian Kong Radiation- or thermally-curable oxetane barrier sealants
JP2009046565A (ja) * 2007-08-18 2009-03-05 Konica Minolta Medical & Graphic Inc 硬化性組成物
CN102318132B (zh) * 2009-02-20 2014-08-27 积水化学工业株式会社 色素敏化型太阳能电池用密封剂和色素敏化型太阳能电池
WO2014171141A1 (ja) * 2013-04-18 2014-10-23 三井化学株式会社 組成物、硬化物、表示デバイスおよびその製造方法
TW201502192A (zh) * 2013-06-03 2015-01-16 Daicel Corp 硬化性環氧樹脂組成物
JPWO2015068454A1 (ja) * 2013-11-07 2017-03-09 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112218931A (zh) * 2018-06-12 2021-01-12 株式会社Lg化学 封装组合物
CN112218931B (zh) * 2018-06-12 2024-02-13 株式会社Lg化学 封装组合物
TWI834774B (zh) * 2018-11-30 2024-03-11 日商力森諾科股份有限公司 底部填充材料、半導體封裝以及半導體封裝的製造方法

Also Published As

Publication number Publication date
JP6657716B2 (ja) 2020-03-04
JP2017066242A (ja) 2017-04-06
WO2017057637A1 (ja) 2017-04-06

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