TW201718786A - Solvent composition for electronic device production - Google Patents
Solvent composition for electronic device production Download PDFInfo
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- TW201718786A TW201718786A TW105110452A TW105110452A TW201718786A TW 201718786 A TW201718786 A TW 201718786A TW 105110452 A TW105110452 A TW 105110452A TW 105110452 A TW105110452 A TW 105110452A TW 201718786 A TW201718786 A TW 201718786A
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- TW
- Taiwan
- Prior art keywords
- electronic device
- group
- solvent
- compound
- ink
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- 239000002904 solvent Substances 0.000 title claims abstract description 108
- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 49
- 150000001875 compounds Chemical class 0.000 claims abstract description 79
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 32
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000007639 printing Methods 0.000 claims abstract description 25
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims abstract description 16
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 16
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000012965 benzophenone Substances 0.000 claims abstract description 9
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004305 biphenyl Substances 0.000 claims abstract description 8
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 8
- 239000001273 butane Substances 0.000 claims abstract description 8
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 239000004840 adhesive resin Substances 0.000 claims description 17
- 229920006223 adhesive resin Polymers 0.000 claims description 17
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- RZXAHVCTRLTLNA-UHFFFAOYSA-N 2-(2-methoxypropoxy)-1-propoxypropane Chemical compound CCCOCC(C)OCC(C)OC RZXAHVCTRLTLNA-UHFFFAOYSA-N 0.000 claims description 5
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 claims description 5
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 claims description 5
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229940116411 terpineol Drugs 0.000 claims description 5
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 claims description 4
- AKIIJALHGMKJEJ-UHFFFAOYSA-N (2-methylcyclohexyl) acetate Chemical compound CC1CCCCC1OC(C)=O AKIIJALHGMKJEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000001716 (4-methyl-1-propan-2-yl-1-cyclohex-2-enyl) acetate Substances 0.000 claims description 4
- HBUKXWXYJOMLIP-UHFFFAOYSA-N 1-[2-(2-methoxypropoxy)propoxy]-3-methylbutane Chemical compound C(CC(C)C)OCC(OCC(C)OC)C HBUKXWXYJOMLIP-UHFFFAOYSA-N 0.000 claims description 4
- QPHFJZRSMXHTAW-UHFFFAOYSA-N 1-[2-(2-methoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OC QPHFJZRSMXHTAW-UHFFFAOYSA-N 0.000 claims description 4
- LIYRYVJXMPWPAS-UHFFFAOYSA-N 1-methoxy-2-propoxypropane Chemical compound CCCOC(C)COC LIYRYVJXMPWPAS-UHFFFAOYSA-N 0.000 claims description 4
- YVHDVDHZIITGIX-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]-1-propoxypropane Chemical compound C(CC)OCC(OCC(OCC(C)OC)C)C YVHDVDHZIITGIX-UHFFFAOYSA-N 0.000 claims description 4
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 claims description 4
- XHXUANMFYXWVNG-UHFFFAOYSA-N D-menthyl acetate Natural products CC(C)C1CCC(C)CC1OC(C)=O XHXUANMFYXWVNG-UHFFFAOYSA-N 0.000 claims description 4
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 claims description 4
- XHXUANMFYXWVNG-WCQGTBRESA-N [(1s,2r,5s)-5-methyl-2-propan-2-ylcyclohexyl] acetate Chemical compound CC(C)[C@H]1CC[C@H](C)C[C@@H]1OC(C)=O XHXUANMFYXWVNG-WCQGTBRESA-N 0.000 claims description 4
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 claims description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 4
- 229940041616 menthol Drugs 0.000 claims description 4
- 229940094933 n-dodecane Drugs 0.000 claims description 4
- HGERSUQOJQWENV-UHFFFAOYSA-N 1-pentan-2-yloxypropan-2-ol Chemical compound CCCC(C)OCC(C)O HGERSUQOJQWENV-UHFFFAOYSA-N 0.000 claims description 3
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 claims description 3
- MBZRJSQZCBXRGK-UHFFFAOYSA-N 4-tert-Butylcyclohexyl acetate Chemical compound CC(=O)OC1CCC(C(C)(C)C)CC1 MBZRJSQZCBXRGK-UHFFFAOYSA-N 0.000 claims description 2
- 238000010304 firing Methods 0.000 abstract description 18
- 230000001629 suppression Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 64
- 150000001412 amines Chemical class 0.000 description 56
- 238000006243 chemical reaction Methods 0.000 description 21
- 125000003342 alkenyl group Chemical group 0.000 description 15
- 125000000217 alkyl group Chemical group 0.000 description 13
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 11
- 238000001704 evaporation Methods 0.000 description 11
- 230000008020 evaporation Effects 0.000 description 11
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 10
- -1 etc.) Substances 0.000 description 10
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 10
- 239000001856 Ethyl cellulose Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229920001249 ethyl cellulose Polymers 0.000 description 9
- 235000019325 ethyl cellulose Nutrition 0.000 description 9
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000005070 ripening Effects 0.000 description 6
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 5
- 125000000304 alkynyl group Chemical group 0.000 description 5
- 150000001718 carbodiimides Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 4
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 4
- 239000011354 acetal resin Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920006324 polyoxymethylene Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004474 valine Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 2
- KXHZWUUTWSKONE-UHFFFAOYSA-N 4-[4-(4-carbamimidoylphenoxy)butoxy]benzenecarboximidamide Chemical compound C1=CC(C(=N)N)=CC=C1OCCCCOC1=CC=C(C(N)=N)C=C1 KXHZWUUTWSKONE-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- XESGYQQZWRXARZ-UHFFFAOYSA-L C(=O)(O)[Ru](Cl)Cl Chemical compound C(=O)(O)[Ru](Cl)Cl XESGYQQZWRXARZ-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241001633942 Dais Species 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- PLZVEHJLHYMBBY-UHFFFAOYSA-N Tetradecylamine Chemical compound CCCCCCCCCCCCCCN PLZVEHJLHYMBBY-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000004440 column chromatography Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- QNJSWVQHWIFPGY-UHFFFAOYSA-N hydrazinecarboxylic acid;hydrochloride Chemical compound Cl.NNC(O)=O QNJSWVQHWIFPGY-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- OLQWMCSSZKNOLQ-ZXZARUISSA-N (3s)-3-[(3r)-2,5-dioxooxolan-3-yl]oxolane-2,5-dione Chemical compound O=C1OC(=O)C[C@H]1[C@@H]1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-ZXZARUISSA-N 0.000 description 1
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006040 2-hexenyl group Chemical group 0.000 description 1
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 229920013820 alkyl cellulose Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
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- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005070 decynyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C#C* 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 229940044949 eucalyptus oil Drugs 0.000 description 1
- 239000010642 eucalyptus oil Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005069 octynyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C#C* 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000123 polythiophene Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
本發明係有關於一種在電子裝置的製造中，使用印刷法形成配線或電極用之油墨所使用的溶劑組成物。本案係主張2015年4月2日於日本所申請之日本特願2015-075979號的優先權，將其內容援用於此。 The present invention relates to a solvent composition used for forming a wiring or an ink for an electrode by a printing method in the manufacture of an electronic device. The present application claims the priority of Japanese Patent Application No. 2015-075979, filed on April 2, 2015 in Japan, the content of which is incorporated herein.
使用印刷法製造的電子裝置包含有電容器、電感器、變阻器、熱敏電阻、電晶體、揚聲器、致動器、天線、固態氧化物燃料電池等。 Electronic devices fabricated using printing methods include capacitors, inductors, varistors, thermistors, transistors, speakers, actuators, antennas, solid oxide fuel cells, and the like.
例如積層陶瓷電容器，一般而言係經過如下步驟製成： For example, a multilayer ceramic capacitor is generally produced by the following steps:
1.將包含陶瓷之粉末、聚乙烯縮醛樹脂等之黏著劑樹脂、及溶劑的漿液成形為片狀而得到生坯片。 1. A slurry containing a ceramic powder, an adhesive resin such as a polyvinyl acetal resin, and a solvent is formed into a sheet form to obtain a green sheet.
2.將包含電特性賦予材料(例如，鎳、鈀等)、黏著劑樹脂(例如，乙基纖維素等)、及有機溶劑(例如，萜品醇等)的油墨，藉由印刷法塗布於生坯片上而形成導電迴路之配線或電極等(以下有稱為「配線等」)(塗布步驟)。 2. An ink containing an electrical property imparting material (for example, nickel, palladium, or the like), an adhesive resin (for example, ethyl cellulose, etc.), and an organic solvent (for example, terpineol) is applied by a printing method. A green wire or an electrode or the like (hereinafter referred to as "wiring or the like") is formed on the green sheet (coating step).
3.使塗布之油墨乾燥(乾燥步驟)。 3. Dry the coated ink (drying step).
4.將形成有配線等的生坯片裁切成規定尺寸，疊合複數片並予以壓接。 4. The green sheets on which the wiring or the like is formed are cut into a predetermined size, and a plurality of sheets are laminated and pressure-bonded.
5.使其燒成(燒成步驟)。 5. Let it be calcined (firing step).
油墨所含的黏著劑樹脂係具有將電特性賦予材料固定於生坯片上的作用、及賦予適度的黏度而能夠形成細微之印刷圖案的作用。作為黏著劑樹脂，以往係主要使用乙基纖維素。然而，乙基纖維素存有以下問題：由於其熱分解性低，故需在高溫下進行燒成；因長時間暴露於高溫下，而具有被塗布面的構件(以下有稱為「被塗布面構件」)有發生軟化、變形的情形；又，在燒成後，碳成分會以灰分殘留，由此引起導電性降低。 The adhesive resin contained in the ink has a function of fixing the electrical property imparting material to the green sheet, and an effect of imparting a moderate viscosity to form a fine printed pattern. As the adhesive resin, ethyl cellulose is mainly used in the past. However, ethyl cellulose has a problem in that it is required to be calcined at a high temperature because of its low thermal decomposition property, and a member having a coated surface due to prolonged exposure to a high temperature (hereinafter referred to as "coated" The surface member ") is softened and deformed. Further, after the firing, the carbon component remains as ash, thereby causing a decrease in conductivity.
為解決上述問題，已探討各種黏著劑樹脂的改善方式。例如，專利文獻1中揭示，透過使用聚乙烯縮醛樹脂替代乙基纖維素，可降低灰分的生成量。然而，縱然使用聚乙烯縮醛樹脂，結果仍無法充分解決這些問題。 In order to solve the above problems, various ways of improving the adhesive resin have been explored. For example, Patent Document 1 discloses that by using a polyvinyl acetal resin instead of ethyl cellulose, the amount of ash produced can be reduced. However, even if a polyvinyl acetal resin is used, the results cannot be adequately solved.
專利文獻1 日本特開2006-299030號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2006-299030
從而，本發明目的在於提供一種溶劑組成物，其係藉由印刷法形成電子裝置之配線或電極用之油墨所使用的溶劑組成物，其可提升油墨的列印精度，可在低溫下進行燒成，且可極力壓低燒成後所生成的灰分量。 Accordingly, an object of the present invention is to provide a solvent composition which is a solvent composition used for forming a wiring for an electronic device or an ink for an electrode by a printing method, which can improve the printing accuracy of the ink and can be fired at a low temperature. It is possible to suppress the ash content generated after firing.
本發明其他目的在於提供一種油墨、及其製造方法，該油墨係藉由印刷法形成電子裝置之配線或電極用之油墨，其列印精度優良，可在低溫下進行燒成，且燒成後所生成的灰分量極少。 Another object of the present invention is to provide an ink which is formed by wiring or an ink for an electrode by a printing method, which has excellent printing precision and can be fired at a low temperature and after firing. The generated ash component is extremely small.
本案發明人等為解決上述課題而致力進行研究的結果發現：下述化合物(A)，在溶劑中進行加熱溶解時，會進行自組織化，形成線狀會聚體，而產生如高分子化合物般的黏性；比起乙基纖維素等之黏著劑樹脂，可在較低溫下進行燒成；燒成後之灰分的殘留量極少。 As a result of intensive studies to solve the above problems, the inventors of the present invention found that the following compound (A) is self-organized when it is heated and dissolved in a solvent to form a linear aggregate, which is produced as a polymer compound. Viscosity; it can be fired at a lower temperature than an adhesive resin such as ethyl cellulose; the residual amount of ash after firing is extremely small.
而且，亦發現：經過將前述化合物(A)與溶劑進行加熱溶解的步驟所得到的油墨，由於具有適於採用印刷法之配線等的形成的黏性，故可抑制液體滴垂，可形成高精度的配線圖案；在燒成步驟中，比起將包含乙基纖維素等之黏著劑樹脂的油墨進行燒成的情形，可在更低溫下迅速進行燒成，可防止被塗布面構件因長時間暴露於高溫下而發生軟化、變形；可顯著減少燒成後之灰分的殘留量，可抑制灰分所引起之電特性的降低。本發明係基於此等見解而完成者。 Further, it has been found that the ink obtained by the step of heating and dissolving the compound (A) and the solvent has a viscosity suitable for formation by wiring or the like by a printing method, so that liquid dripping can be suppressed and high formation can be achieved. In the firing step, when the ink containing the adhesive resin such as ethyl cellulose is fired, the baking can be performed at a lower temperature, and the coated surface member can be prevented from being elongated. The time is softened and deformed when exposed to high temperature; the residual amount of ash after firing can be remarkably reduced, and the decrease in electrical characteristics caused by ash can be suppressed. The present invention has been completed based on these findings.
亦即，本發明係提供一種電子裝置製造用溶劑組成物，其係藉由印刷法製造電子裝置用之油墨所使用的溶劑組成物，其包含溶劑與下述化合物(A)；化合物(A)：下述式(1)(R2-HNOC)4-n-R1-(CONH-R3)n (1) That is, the present invention provides a solvent composition for producing an electronic device, which is a solvent composition for producing an ink for an electronic device by a printing method, which comprises a solvent and the following compound (A); and a compound (A) : the following formula (1) (R 2 -HNOC) 4-n -R 1 -(CONH-R 3 ) n (1)
(式中，R1為從苯、二苯甲酮、聯苯、或萘的結構式移除4個氫原子之基，R2為碳數1~5之脂肪族烴基，R3為碳數6以上之脂肪族烴基。n表示1~3之整數) (wherein R 1 is a group from which four hydrogen atoms are removed from a structural formula of benzene, benzophenone, biphenyl or naphthalene, R 2 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 is a carbon number 6 or more aliphatic hydrocarbon groups. n represents an integer of 1 to 3)
所示之化合物及/或下述式(2)R4-(CONH-R5)4 (2) The compound shown and/or the following formula (2) R 4 -(CONH-R 5 ) 4 (2)
(式中，R4為從丁烷的結構式移除4個氫原子之基，4個R5係相同或相異，為碳數1以上之脂肪族烴基) (wherein R 4 is a group in which four hydrogen atoms are removed from the structural formula of butane, and four R 5 groups are the same or different and are an aliphatic hydrocarbon group having a carbon number of 1 or more)
所示之化合物。 The compound shown.
本發明又提供一種前述之電子裝置製造用溶劑組成物，其中溶劑之25℃下的SP值[(cal/cm3)0.5]為7.0~11.0。 The present invention further provides a solvent composition for producing an electronic device as described above, wherein the SP value [(cal/cm 3 ) 0.5 ] at 25 ° C of the solvent is 7.0 to 11.0.
本發明又提供一種前述之電子裝置製造用溶劑組成物，其中溶劑為選自正癸烷、正十二烷、丙二醇甲基正丙基醚、丙二醇甲基正丁基醚、二丙二醇二甲基醚、二丙二醇甲基正丙基醚、二丙二醇甲基正丁基醚、二丙二醇甲基異戊基醚、三丙二醇甲基正丙基醚、乙酸3-甲氧基丁酯、3-甲氧基丁醇、薄荷腦乙酸酯、薄荷腦、萜品醇乙酸酯、萜品醇、乙酸環己酯、乙酸2-甲基環己酯、及乙酸4-三級丁基環己酯的至少一者。 The present invention further provides a solvent composition for the manufacture of an electronic device, wherein the solvent is selected from the group consisting of n-decane, n-dodecane, propylene glycol methyl n-propyl ether, propylene glycol methyl n-butyl ether, and dipropylene glycol dimethyl. Ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol methyl n-butyl ether, dipropylene glycol methyl isoamyl ether, tripropylene glycol methyl n-propyl ether, 3-methoxybutyl acetate, 3-methyl Oxybutanol, menthol acetate, menthol, terpineol acetate, terpineol, cyclohexyl acetate, 2-methylcyclohexyl acetate, and 4-tert-butylcyclohexyl acetate At least one of them.
本發明又提供一種前述之電子裝置製造用溶劑組成物，其中前述化合物(A)的含量，相對於溶劑100重量份為0.1~50重量份。 Further, the present invention provides a solvent composition for producing an electronic device according to the above aspect, wherein the content of the compound (A) is 0.1 to 50 parts by weight based on 100 parts by weight of the solvent.
本發明又提供一種電子裝置製造用油墨的製造方法，其具有將前述之電子裝置製造用溶劑組成物在30~90℃加熱溶解的步驟。 Further, the present invention provides a method for producing an ink for producing an electronic device, which comprises the step of heating and dissolving the solvent composition for producing an electronic device described above at 30 to 90 °C.
本發明又提供一種電子裝置製造用油墨，其包含溶劑與下述化合物(A)；化合物(A)：下述式(1)(R2-HNOC)4-n-R1-(CONH-R3)n (1) The present invention further provides an ink for manufacturing an electronic device comprising a solvent and the following compound (A); and the compound (A): the following formula (1) (R 2 -HNOC) 4-n -R 1 -(CONH-R 3 ) n (1)
(式中，R1為從苯、二苯甲酮、聯苯、或萘的結構式移除4個氫原子之基，R2為碳數1~5之脂肪族烴基，R3為碳數6以上之脂肪族烴基。n表示1~3之整數) (wherein R 1 is a group from which four hydrogen atoms are removed from a structural formula of benzene, benzophenone, biphenyl or naphthalene, R 2 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 is a carbon number 6 or more aliphatic hydrocarbon groups. n represents an integer of 1 to 3)
所示之化合物及/或下述式(2)R4-(CONH-R5)4 (2) The compound shown and/or the following formula (2) R 4 -(CONH-R 5 ) 4 (2)
(式中，R4為從丁烷的結構式移除4個氫原子之基，4個R5係相同或相異，為碳數1以上之脂肪族烴基) (wherein R 4 is a group in which four hydrogen atoms are removed from the structural formula of butane, and four R 5 groups are the same or different and are an aliphatic hydrocarbon group having a carbon number of 1 or more)
所示之化合物。 The compound shown.
本發明又提供一種前述之電子裝置製造用油墨，其進一步包含導電性金屬材料、半導體材料、磁性材料、介電材料、或絕緣材料。 The present invention further provides an ink for manufacturing an electronic device as described above, which further comprises a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material.
本發明又提供一種前述之電子裝置製造用油墨，其中黏著劑樹脂含量為10重量%以下。 The present invention further provides an ink for manufacturing an electronic device as described above, wherein the adhesive resin content is 10% by weight or less.
亦即，本發明係有關於以下者。 That is, the present invention relates to the following.
[1]一種電子裝置製造用溶劑組成物，其係藉由印刷法製造電子裝置用之油墨所使用的溶劑組成物，其包含溶劑與下述化合物(A)；化合物(A)：下述式(1)(R2-HNOC)4-n-R1-(CONH-R3)n (1) [1] A solvent composition for producing an electronic device, which is a solvent composition for producing an ink for an electronic device by a printing method, comprising a solvent and the following compound (A); and a compound (A): (1)(R 2 -HNOC) 4-n -R 1 -(CONH-R 3 ) n (1)
(式中，R1為從苯、二苯甲酮、聯苯、或萘的結構式移除4個氫原子之基，R2為碳數1~5之脂肪族烴基，R3為碳數6以上之脂肪族烴基。n表示1~3之整數) (wherein R 1 is a group from which four hydrogen atoms are removed from a structural formula of benzene, benzophenone, biphenyl or naphthalene, R 2 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 is a carbon number 6 or more aliphatic hydrocarbon groups. n represents an integer of 1 to 3)
所示之化合物及/或下述式(2)R4-(CONH-R5)4 (2) The compound shown and/or the following formula (2) R 4 -(CONH-R 5 ) 4 (2)
(式中，R4為從丁烷的結構式移除4個氫原子之基，4個R5係相同或相異，為碳數1以上之脂肪族烴基) (wherein R 4 is a group in which four hydrogen atoms are removed from the structural formula of butane, and four R 5 groups are the same or different and are an aliphatic hydrocarbon group having a carbon number of 1 or more)
所示之化合物。 The compound shown.
[2]如[1]之電子裝置製造用溶劑組成物，其中式(1)中的R2為碳數1~5之直鏈狀或支鏈狀烷基(較佳為碳數1~5之直鏈狀烷基)。 [2] The solvent composition for producing an electronic device according to [1], wherein R 2 in the formula (1) is a linear or branched alkyl group having 1 to 5 carbon atoms (preferably, a carbon number of 1 to 5) Linear alkyl group).
[3]如[1]或[2]之電子裝置製造用溶劑組成物，其中式(1)中的R3為碳數6~20(較佳為8~18，特佳為12~18)之直鏈狀或支鏈狀烯基(較佳為直鏈狀烯基)。 [3] The solvent composition for manufacturing an electronic device according to [1] or [2], wherein R 3 in the formula (1) is a carbon number of 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18). A linear or branched alkenyl group (preferably a linear alkenyl group).
[4]如[1]至[3]中任一項之電子裝置製造用溶劑組成物，其中式(2)中的4個R5為彼此相異的R51、R52，前述R51與R52為碳數6~20(較佳為8~18，特佳為12~18)之直鏈狀或支鏈狀烯基(較佳為直鏈狀烯基)、與碳數1~20(較佳為4~10，特佳為4~8)之直鏈狀或支鏈狀烷基的組合。 [4] The solvent composition for producing an electronic device according to any one of [1] to [3] wherein, in the formula (2), four R 5 are mutually different R 51 and R 52 , and the aforementioned R 51 is R 52 is a linear or branched alkenyl group (preferably a linear alkenyl group) having a carbon number of 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18), and a carbon number of 1 to 20 A combination of a linear or branched alkyl group (preferably 4 to 10, particularly preferably 4 to 8).
[5]如[1]至[4]中任一項之電子裝置製造用溶劑組成物，其中化合物(A)為選自包含式(1-1)~(1-18)、及式(2-1)~(2-6)所示之化合物之群組中的至少1種的化合物。 [5] The solvent composition for producing an electronic device according to any one of [1] to [4] wherein the compound (A) is selected from the group consisting of the formula (1-1) to (1-18), and the formula (2). A compound of at least one of the group of compounds represented by -1) to (2-6).
[6]如[1]至[5]中任一項之電子裝置製造用溶劑組成物，其中化合物(A)的蒸發溫度為120~380℃。 [6] The solvent composition for producing an electronic device according to any one of [1] to [5] wherein the compound (A) has an evaporation temperature of 120 to 380 °C.
[7]如[1]至[6]中任一項之電子裝置製造用溶劑組成物，其中化合物(A)的分子量為400~3000。 [7] The solvent composition for producing an electronic device according to any one of [1] to [6] wherein the compound (A) has a molecular weight of from 400 to 3,000.
[8]如[1]至[7]中任一項之電子裝置製造用溶劑組成物，其中溶劑之25℃下的SP值[(cal/cm3)0.5]為7.0~11.0。 [8] The solvent composition for producing an electronic device according to any one of [1] to [7] wherein the SP value [(cal/cm 3 ) 0.5 ] at 25 ° C of the solvent is 7.0 to 11.0.
[9]如[1]至[8]中任一項之電子裝置製造用溶劑組成物，其中溶劑為選自包含正癸烷、正十二烷、丙二醇甲基正丙基醚、丙二醇甲基正丁基醚、二丙二醇二甲基醚、二丙二醇甲基正丙基醚、二丙二醇甲基正丁基醚、二丙二醇甲基異戊基醚、三丙二醇甲基正丙基醚、乙酸3-甲氧基丁酯、3-甲氧基丁醇、薄荷腦乙酸酯、薄荷腦、萜品醇乙酸酯、萜品醇、乙酸環己酯、乙酸2-甲基環己酯、及乙酸4-三級丁基環己酯之群組中的至少一者。 [9] The solvent composition for producing an electronic device according to any one of [1] to [8] wherein the solvent is selected from the group consisting of n-decane, n-dodecane, propylene glycol methyl n-propyl ether, and propylene glycol methyl group. n-Butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol methyl n-butyl ether, dipropylene glycol methyl isoamyl ether, tripropylene glycol methyl n-propyl ether, acetic acid 3 - methoxybutyl ester, 3-methoxybutanol, menthol acetate, menthol, terpineol acetate, terpineol, cyclohexyl acetate, 2-methylcyclohexyl acetate, and At least one of the group of 4-tris-butylcyclohexyl acetate.
[10]如[1]至[9]中任一項之電子裝置製造用溶劑組成物，其中前述化合物(A)的含量，相對於溶劑100重量份為0.1~50重量份。 [10] The solvent composition for producing an electronic device according to any one of [1] to [9] wherein the content of the compound (A) is 0.1 to 50 parts by weight based on 100 parts by weight of the solvent.
[11]一種電子裝置製造用油墨的製造方法，其具有將如[1]至[10]中任一項之電子裝置製造用溶劑組成物在30~90℃加熱溶解的步驟。 [11] A method for producing an ink for producing an electronic device, comprising the step of heating and dissolving the solvent composition for producing an electronic device according to any one of [1] to [10] at 30 to 90 °C.
[12]一種電子裝置製造用油墨，其係藉由如[11]之製造方法而得。 [12] An ink for manufacturing an electronic device, which is obtained by the production method of [11].
[13]一種電子裝置製造用油墨，其包含溶劑與下述化合物(A)；化合物(A)：下述式(1)(R2-HNOC)4-n-R1-(CONH-R3)n (1) [13] An ink for producing an electronic device comprising a solvent and the following compound (A); and a compound (A): the following formula (1) (R 2 -HNOC) 4-n -R 1 -(CONH-R 3 ) n (1)
(式中，R1為從苯、二苯甲酮、聯苯、或萘的結構式移除4個氫原子之基，R2為碳數1~5之脂肪族烴基，R3為碳數6以上之脂肪族烴基。n表示1~3之整數) (wherein R 1 is a group from which four hydrogen atoms are removed from a structural formula of benzene, benzophenone, biphenyl or naphthalene, R 2 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 is a carbon number 6 or more aliphatic hydrocarbon groups. n represents an integer of 1 to 3)
所示之化合物及/或下述式(2)R4-(CONH-R5)4 (2) The compound shown and/or the following formula (2) R 4 -(CONH-R 5 ) 4 (2)
(式中，R4為從丁烷的結構式移除4個氫原子之基，4個R5係相同或相異，為碳數1以上之脂肪族烴基) (wherein R 4 is a group in which four hydrogen atoms are removed from the structural formula of butane, and four R 5 groups are the same or different and are an aliphatic hydrocarbon group having a carbon number of 1 or more)
所示之化合物。 The compound shown.
[14]如[12]或[13]之電子裝置製造用油墨，其進一步包含電特性賦予材料。 [14] The ink for manufacturing an electronic device according to [12] or [13], which further comprises an electrical property imparting material.
[15]如[14]之電子裝置製造用油墨，其中電特性賦予材料為選自包含導電性金屬材料、半導體材料、磁性材料、介電材料、及絕緣材料之群組中的至少1種的材料。 [15] The ink for manufacturing an electronic device according to [14], wherein the electrical property imparting material is at least one selected from the group consisting of a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, and an insulating material. material.
[16]如[14]或[15]之電子裝置製造用油墨，其中電特性賦予材料的含量為電子裝置製造用油墨總量的0.1~90重量%。 [16] The ink for manufacturing an electronic device according to [14] or [15] wherein the content of the electrical property imparting material is 0.1 to 90% by weight based on the total amount of the ink for manufacturing the electronic device.
[17]如[12]至[16]中任一項之電子裝置製造用油墨，其中黏著劑樹脂含量為10重量%以下。 [17] The ink for manufacturing an electronic device according to any one of [12] to [16] wherein the adhesive resin content is 10% by weight or less.
[18]如[12]至[16]中任一項之電子裝置製造用油墨，其中黏著劑樹脂含量係小於5重量%。 [18] The ink for manufacturing an electronic device according to any one of [12] to [16] wherein the adhesive resin content is less than 5% by weight.
[19]如[12]至[18]中任一項之電子裝置製造用油墨，其25℃下的黏度[在剪切速度0.5s-1下]為0.01~1000Pa‧s。 [19] The ink for manufacturing an electronic device according to any one of [12] to [18] wherein the viscosity at 25 ° C [at a shear rate of 0.5 s -1 ] is from 0.01 to 1000 Pa s.
本發明之電子裝置製造用溶劑組成物，由於含有上述化合物(A)作為增黏劑，因此，經過進行加熱溶解的步驟，可製造具有適於採用印刷法之配線等的形成之黏性的油墨。 Since the solvent composition for producing an electronic device of the present invention contains the compound (A) as a tackifier, the step of heating and dissolving can produce a viscous ink having a formation suitable for wiring or the like by a printing method. .
又，使用本發明之電子裝置製造用溶劑組成物所得之油墨不易發生液體滴垂，可藉由印刷法形成高精度的配線圖案。又，在燒成步驟中，可在更低溫下進行燒成，可防止被塗布面構件因長時間暴露於高溫下而軟化、變形。再者，可顯著減少燒成後之灰分的殘留量，可抑制由此所引起之電特性的降低。 Further, the ink obtained by using the solvent composition for producing an electronic device of the present invention is less likely to cause liquid dripping, and a high-precision wiring pattern can be formed by a printing method. Further, in the firing step, the firing can be performed at a lower temperature, and the coated surface member can be prevented from being softened and deformed by being exposed to a high temperature for a long period of time. Further, the residual amount of ash after firing can be remarkably reduced, and the decrease in electrical characteristics caused thereby can be suppressed.
從而，只要使用本發明之電子裝置製造用溶劑組成物，即可藉由印刷法形成電特性優良的配線等，而能夠有效率地製造具有電特性優良之配線等的電子裝置。 Therefore, by using the solvent composition for producing an electronic device of the present invention, it is possible to efficiently form an electronic device having wiring or the like having excellent electrical characteristics by forming a wiring having excellent electrical characteristics by a printing method.
本發明之電子裝置製造用溶劑組成物(以下有稱為「溶劑組成物」)係使用印刷法製造電子裝置用之油墨所使用的溶劑組成物，其包含溶劑與化合物(A)。 The solvent composition for producing an electronic device of the present invention (hereinafter referred to as "solvent composition") is a solvent composition used for producing an ink for an electronic device by a printing method, and comprises a solvent and a compound (A).
本發明中的化合物(A)為選自下述式(1)(R2-HNOC)4-n-R1-(CONH-R3)n (1) The compound (A) in the present invention is selected from the following formula (1) (R 2 -HNOC) 4-n -R 1 -(CONH-R 3 ) n (1)
(式中，R1為從苯、二苯甲酮、聯苯、或萘的結構式移除4個氫原子之基，R2為碳數1~5之脂肪族烴基，R3為碳數6以上之脂肪族烴基。n表示1~3之整數) (wherein R 1 is a group from which four hydrogen atoms are removed from a structural formula of benzene, benzophenone, biphenyl or naphthalene, R 2 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 is a carbon number 6 or more aliphatic hydrocarbon groups. n represents an integer of 1 to 3)
所示之化合物、及下述式(2)R4-(CONH-R5)4 (2) The compound shown, and the following formula (2) R 4 -(CONH-R 5 ) 4 (2)
(式中，R4為從丁烷的結構式移除4個氫原子之基，4個R5係相同或相異，為碳數1以上之脂肪族烴基) (wherein R 4 is a group in which four hydrogen atoms are removed from the structural formula of butane, and four R 5 groups are the same or different and are an aliphatic hydrocarbon group having a carbon number of 1 or more)
所示之化合物的至少1種的化合物。 A compound of at least one of the compounds shown.
前述n係表示1~3之整數，較佳為2。 The above n-form represents an integer of 1 to 3, preferably 2.
作為前述R2中之碳數1~5的脂肪族烴基，可舉出例如甲基、乙基、丁基、異丁基、三級丁基、戊基等之碳數1~5的直鏈狀或支鏈狀烷基；乙烯基、烯丙基、1-丁烯基等之碳數2~5的直鏈狀或支鏈狀烯基；乙炔基、丙炔基等之碳數2~5的直鏈狀或支鏈狀炔基等。 The aliphatic hydrocarbon group having 1 to 5 carbon atoms in the above R 2 may, for example, be a linear chain having 1 to 5 carbon atoms such as a methyl group, an ethyl group, a butyl group, an isobutyl group, a tertiary butyl group or a pentyl group. a linear or branched alkenyl group having 2 to 5 carbon atoms such as a vinyl group, an allyl group or a 1-butenyl group; a carbon number of an ethynyl group or a propynyl group; A linear or branched alkynyl group of 5 or the like.
作為R2，其中，較佳為丁基等之碳數1~5的直鏈狀或支鏈狀烷基(尤為直鏈狀烷基)。 R 2 is preferably a linear or branched alkyl group (particularly a linear alkyl group) having 1 to 5 carbon atoms such as a butyl group.
作為前述R3中之碳數6以上的脂肪族烴基，可舉出例如己基、辛基、2-乙基己基、癸基、月桂基、十四基、十八基等之碳數6~20(較佳為6~18，特佳為8~18)的直鏈狀或支鏈狀烷基；2-己烯基、7-辛烯基、9-癸烯基、油基等之碳數6~20(較佳為8~18，特佳為12~18)的直鏈狀或支鏈狀烯基；己炔基、辛炔基、癸炔基、十五炔基、十八炔基等之碳數6~20(較佳為6~18，特佳為12~18)的直鏈狀或支鏈狀炔基等。 The aliphatic hydrocarbon group having 6 or more carbon atoms in the above R 3 may, for example, be a carbon number of 6 to 20 such as a hexyl group, an octyl group, a 2-ethylhexyl group, a decyl group, a lauryl group, a tetradecyl group or an octadecyl group. a linear or branched alkyl group (preferably 6 to 18, particularly preferably 8 to 18); a carbon number of 2-hexenyl, 7-octenyl, 9-nonenyl, and oleyl a linear or branched alkenyl group of 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18); hexynyl, octynyl, decynyl, pentadecynyl, octadecynyl A linear or branched alkynyl group having a carbon number of 6 to 20 (preferably 6 to 18, particularly preferably 12 to 18).
作為R3，其中，較佳為油基等之碳數6~20(較佳為8~18，特佳為12~18)的直鏈狀或支鏈狀烯基(尤為直鏈狀烯基)。 R 3 is preferably a linear or branched alkenyl group having 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18) carbon atoms or the like (especially a linear alkenyl group). ).
作為前述R5中之碳數1以上的脂肪族烴基，可一併舉出上述碳數1~5的脂肪族烴基與碳數6以上的脂肪族烴基的實例。 Examples of the aliphatic hydrocarbon group having 1 or more carbon atoms in the above R 5 include an aliphatic hydrocarbon group having 1 to 5 carbon atoms and an aliphatic hydrocarbon group having 6 or more carbon atoms.
作為4個R5，其中，較佳為彼此相異的基(R51、R52；R51、R52係表示彼此相異且碳數為1以上的脂肪族烴基，可舉出與上述R5相同的例子)，較佳為油基等之碳數6~20(較佳為8~18，特佳為12~18)的直鏈狀或支鏈狀烯基(尤為直鏈狀烯基)、與丁基、2-乙基己基等之碳數1~20(較佳為4~10，特佳為4~8)的直鏈狀或支鏈狀烷基的組合。 The four R 5 groups are preferably different from each other (R 51 and R 52 ; R 51 and R 52 each represent an aliphatic hydrocarbon group different from each other and having a carbon number of 1 or more, and the above R may be mentioned. 5, the same example), preferably a linear or branched alkenyl group having 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18) carbon atoms, etc. (especially a linear alkenyl group) And a combination of a linear or branched alkyl group having a carbon number of 1 to 20 (preferably 4 to 10, particularly preferably 4 to 8) such as a butyl group or a 2-ethylhexyl group.
作為化合物(A)的具體例，可舉出下述式(1-1)~(1-18)、及式(2-1)~(2-6)所示之化合物等。下述式中，R2、R3、R51、R52係與前述相同。此外，當一分子中存在有複數個R2時，彼等為同一種基。對於R3、R51、R52亦同。 Specific examples of the compound (A) include compounds represented by the following formulae (1-1) to (1-18) and formulas (2-1) to (2-6). In the following formula, R 2 , R 3 , R 51 and R 52 are the same as described above. Further, when a plurality of R 2 are present in one molecule, they are the same group. The same applies to R 3 , R 51 and R 52 .
作為化合物(A)，其中，較佳為蒸發溫度為120~380℃(較佳為150~330℃，更佳為150~320℃，特佳為150~315℃，最佳為170~315℃，尤佳為200~300℃)者，蒸發溫度可根據側鏈的種類來控制。蒸發溫度若高於上述範圍，則變得不易在低溫條件下迅速使其氣化，而有塗布面構件因長時間暴露於高溫下而發生軟化、變形的情形。另一方面，蒸發溫度若低於上述範圍，則在油墨調製時或者印刷時會發生氣化而有組成發生變動之虞，從而有變得不易穩定形成配線‧塗膜的傾向。此外，化合物(A)的蒸發溫度，係在使用微差熱-熱重同步測定裝置(TG/DTA)由20℃以10℃/分鐘昇溫至400℃時，化合物(A)的95重量%蒸發，重量減少至原本重量的5%之時間點的溫度。 As the compound (A), it is preferred that the evaporation temperature is 120 to 380 ° C (preferably 150 to 330 ° C, more preferably 150 to 320 ° C, particularly preferably 150 to 315 ° C, and most preferably 170 to 315 ° C). , especially for 200~300 °C), the evaporation temperature can be controlled according to the type of side chain. When the evaporation temperature is higher than the above range, it becomes difficult to rapidly vaporize under low temperature conditions, and the coated surface member may be softened or deformed by exposure to a high temperature for a long period of time. On the other hand, when the evaporation temperature is lower than the above range, vaporization occurs during ink preparation or printing, and the composition tends to fluctuate, which tends to make it difficult to form a wiring and a coating film stably. Further, the evaporation temperature of the compound (A) is 95% by weight of the compound (A) when it is heated from 20 ° C to 10 ° C / min to 400 ° C using a differential thermal-thermal resynchronization measuring device (TG/DTA). The temperature is reduced to a temperature at a time point of 5% of the original weight.
化合物(A)的分子量為例如400~3000，較佳為800~2000，特佳為800~1200，最佳為800~1000。 化合物(A)的分子量若高於上述範圍，則有變得不易溶解於油劑的傾向。另一方面，化合物(A)的分子量若低於上述範圍，則有黏性賦予效果降低的傾向。 The molecular weight of the compound (A) is, for example, 400 to 3,000, preferably 800 to 2,000, particularly preferably 800 to 1200, most preferably 800 to 1,000. When the molecular weight of the compound (A) is more than the above range, it tends to be less likely to be dissolved in the oil agent. On the other hand, when the molecular weight of the compound (A) is less than the above range, the viscosity-imparting effect tends to be lowered.
化合物(A)可藉由下述(a)或(b)之方法等製造：(a)使羧酸與亞硫醯氯反應得到羧醯氯(carboxylic acid chlorides)，再使胺與所得之羧醯氯反應的方法；(b)使胺(1)與前述羧酸對應的羧酸酐反應而得到醯胺酸，進一步使用縮合劑使胺(2)進行縮合的方法。 The compound (A) can be produced by the following method (a) or (b): (a) reacting a carboxylic acid with sulfinium chloride to obtain carboxylic acid chlorides, and then reacting the amine with the obtained carboxylic acid. A method of reacting a chlorine reaction; (b) a method of reacting an amine (1) with a carboxylic acid anhydride corresponding to the above-mentioned carboxylic acid to obtain a valine acid, and further condensing the amine (2) with a condensing agent.
作為藉由上述(a)之製造方法製造式(1)所示之化合物時所使用的羧酸[R1-(COOH)4：R1係與前述相同]，可舉出例如1,2,4,5-苯四羧酸、3,3’,4,4’-二苯甲酮四羧酸、1,1’-聯苯-2,3,3’,4’-四羧酸、1,4,5,8-萘四羧酸。 The carboxylic acid [R 1 -(COOH) 4 :R 1 is the same as the above] used in the production of the compound represented by the formula (1) by the production method of the above (a), for example, 1, 2, 4,5-benzenetetracarboxylic acid, 3,3',4,4'-benzophenone tetracarboxylic acid, 1,1'-biphenyl-2,3,3',4'-tetracarboxylic acid, 1 , 4,5,8-naphthalenetetracarboxylic acid.
作為藉由上述(a)之製造方法製造式(2)所示之化合物時所使用的羧酸[R4-(COOH)4：R4係與前述相同]，可舉出例如1,2,3,4-丁烷四羧酸。 The carboxylic acid [R 4 —(COOH) 4 :R 4 is the same as the above] used in the production of the compound represented by the formula (2) by the production method of the above (a), for example, 1, 2, 3,4-butane tetracarboxylic acid.
藉由上述(a)之製造方法製造式(1)所示之化合物時所使用的胺，係胺(R2-NH2)與胺(R3-NH2)(R2、R3係與前述相同)。 The amine used in the production of the compound of the formula (1) by the production method of the above (a), an amine (R 2 -NH 2 ) and an amine (R 3 -NH 2 ) (R 2 , R 3 The same as before).
作為前述胺(R2-NH2)，可舉出例如丁胺等之為前述R2為碳數1~5的脂肪族烴基(較佳為直鏈狀或者支鏈狀的烷基、烯基、或炔基)的胺等。 The above-mentioned amine (R 2 -NH 2 ) may, for example, be an aliphatic hydrocarbon group in which R 2 is a carbon number of 1 to 5, such as butylamine (preferably a linear or branched alkyl group or an alkenyl group). Or an alkynyl group of amines, and the like.
作為前述胺(R3-NH2)，可舉出例如己胺、辛胺、2-乙基己胺、癸胺、月桂胺、十四胺、十八胺、油胺等之為前述R3為碳數6以上(較佳為碳數6~20，特佳 為碳數10~20，最佳為碳數15~20)的脂肪族烴基(較佳為直鏈狀或者支鏈狀的烷基、烯基、或炔基)的胺等。 Examples of the amine (R 3 -NH 2 ) include hexylamine, octylamine, 2-ethylhexylamine, decylamine, laurylamine, tetradecylamine, octadecylamine, oleylamine and the like as the aforementioned R 3 . An aliphatic hydrocarbon group (preferably a linear or branched alkane) having a carbon number of 6 or more (preferably a carbon number of 6 to 20, particularly preferably a carbon number of 10 to 20, and most preferably a carbon number of 15 to 20) Alkyl, alkenyl, or alkynyl) amines, and the like.
藉由上述(a)之製造方法製造式(2)所示之化合物時所使用的胺，係胺(R5-NH2)(R5係與前述相同)。作為胺(R5-NH2)，其中，較佳為彼此相異的2種之胺(R51-NH2)(R51係與前述相同)與胺(R52-NH2)(R52係與前述相同)。 The amine used in the production of the compound represented by the formula (2) by the production method of the above (a) is an amine (R 5 -NH 2 ) (the R 5 system is the same as defined above). As the amine (R 5 -NH 2 ), preferred are two kinds of amines (R 51 -NH 2 ) (R 51 is the same as defined above) and amine (R 52 -NH 2 ) (R 52 ) which are different from each other. Same as above).
作為前述胺(R5-NH2)，可舉出例如丁胺、己胺、辛胺、2-乙基己胺、癸胺、月桂胺、十四胺、十八胺、油胺等之為前述R5為碳數1以上(較佳為碳數6~20)的脂肪族烴基(較佳為直鏈狀或者支鏈狀之烷基、烯基、或炔基)的胺等。於本發明中，其中，較佳組合使用具有油基等之碳數6~20(較佳為8~18，特佳為12~18)的直鏈狀或支鏈狀烯基(尤為直鏈狀烯基)的胺、與具有丁基、2-乙基己基等之碳數1~20(較佳為4~10，特佳為4~8)的直鏈狀或支鏈狀烷基的胺作為胺(R51-NH2)、胺(R52-NH2)。 Examples of the amine (R 5 -NH 2 ) include butylamine, hexylamine, octylamine, 2-ethylhexylamine, decylamine, laurylamine, tetradecylamine, octadecylamine, and oleylamine. R 5 is an amine of an aliphatic hydrocarbon group (preferably a linear or branched alkyl group, an alkenyl group or an alkynyl group) having 1 or more carbon atoms (preferably a carbon number of 6 to 20). In the present invention, a linear or branched alkenyl group having a carbon number of 6 to 20 (preferably 8 to 18, particularly preferably 12 to 18) having an oil group or the like is preferably used in combination (especially a linear chain). An amine of an alkenyl group, and a linear or branched alkyl group having a carbon number of 1 to 20 (preferably 4 to 10, particularly preferably 4 to 8) having a butyl group, a 2-ethylhexyl group or the like. The amine acts as an amine (R 51 -NH 2 ), an amine (R 52 -NH 2 ).
在上述(a)之製造方法中，羧醯氯與胺的反應可例如藉由對裝入有胺的系統內滴下羧醯氯來進行。 In the production method of the above (a), the reaction of carboxy ruthenium chloride with an amine can be carried out, for example, by dropping carboxy ruthenium chloride into a system charged with an amine.
羧醯氯與胺的反應可在溶媒的存在下或不存在下進行。作為前述溶媒，可舉出例如戊烷、己烷、庚烷、辛烷、石油醚等之飽和或不飽和烴系溶媒；苯、甲苯、二甲苯等之芳香族烴系溶媒；二氯甲烷、氯仿、1,2-二氯乙烷、氯苯、溴苯等之鹵化烴系溶媒；二乙基醚、二異丙基醚、二丁基醚、四氫呋喃、二烷、1,2-二甲 氧基乙烷、環戊基甲基醚等之醚系溶媒；乙腈、苯甲腈等之腈系溶媒；二甲基亞碸等之亞碸系溶媒；環丁碸等之環丁碸系溶媒；二甲基甲醯胺等之醯胺系溶媒；矽油等之高沸點溶媒等。此等可單獨使用1種，或混合2種以上使用。於本發明中，其中，以反應成分(羧醯氯與胺)的溶解性優良觀點而言，係以使用鹵化烴系溶媒為佳。 The reaction of the carboxylic acid chloride with the amine can be carried out in the presence or absence of a solvent. Examples of the solvent include a saturated or unsaturated hydrocarbon solvent such as pentane, hexane, heptane, octane or petroleum ether; an aromatic hydrocarbon solvent such as benzene, toluene or xylene; and dichloromethane; a halogenated hydrocarbon solvent such as chloroform, 1,2-dichloroethane, chlorobenzene or bromobenzene; diethyl ether, diisopropyl ether, dibutyl ether, tetrahydrofuran, An ether-based solvent such as an alkane, 1,2-dimethoxyethane or cyclopentylmethyl ether; a nitrile-based solvent such as acetonitrile or benzonitrile; an anthracene-based solvent such as dimethyl hydrazine; A solvent such as hydrazine or the like; a guanamine-based solvent such as dimethylformamide; a high-boiling solvent such as eucalyptus oil. These may be used alone or in combination of two or more. In the present invention, it is preferred to use a halogenated hydrocarbon-based solvent from the viewpoint of excellent solubility of the reaction component (carboxy hydrazine chloride and amine).
作為前述溶媒的使用量，相對於羧醯氯與胺的總量，為例如50~300重量%，較佳為100~250重量%。溶媒的使用量若高於上述範圍，則反應成分的濃度變低，而有反應速度降低的傾向。 The amount of the solvent to be used is, for example, 50 to 300% by weight, preferably 100 to 250% by weight based on the total amount of the carboxyhydrazine chloride and the amine. When the amount of the solvent used is more than the above range, the concentration of the reaction component becomes low, and the reaction rate tends to decrease.
羧醯氯與胺的反應(=滴下)係通常在常壓下進行。又，作為上述反應(=滴下時)的環境，只要不妨害反應則不特別限定，可為例如空氣環境、氮氣環境、氬氣環境等的任一種。反應溫度(=滴下時溫度)為例如30~60℃。反應時間(=滴下時間)為例如0.5~20小時。反應(=滴下)結束後，亦可設置熟成步驟。設置熟成步驟時，熟成溫度為例如30~60℃，熟成時間為例如1~5小時。又，反應能以批次式、半批次式、連續式等的任一種方法進行。 The reaction of carboxymethyl chloride with an amine (= dropping) is usually carried out under normal pressure. In addition, the environment of the above reaction (= at the time of dropping) is not particularly limited as long as it does not impair the reaction, and may be, for example, any of an air atmosphere, a nitrogen atmosphere, and an argon atmosphere. The reaction temperature (=temperature at the time of dropping) is, for example, 30 to 60 °C. The reaction time (= dripping time) is, for example, 0.5 to 20 hours. After the reaction (= dripping) is completed, a ripening step can also be set. When the ripening step is set, the ripening temperature is, for example, 30 to 60 ° C, and the ripening time is, for example, 1 to 5 hours. Further, the reaction can be carried out by any one of a batch type, a semi-batch type, and a continuous type.
反應結束後，所得之反應生成物可藉由例如過濾、濃縮、蒸餾、萃取、結晶、吸附、再結晶、管柱層析等之分離手段、或此等組合而成的分離手段進行分離精製。 After completion of the reaction, the obtained reaction product can be isolated and purified by a separation means such as filtration, concentration, distillation, extraction, crystallization, adsorption, recrystallization, column chromatography or the like, or a combination thereof.
在上述(b)之製造方法中，可藉由例如將羧酸酐與胺(1)及下述溶媒饋入於系統內，使其熟成而形成 醯胺酸，其後，進一步饋入胺(2)與縮合劑(例如，碳二醯亞胺或其鹽)，使其熟成而製造化合物(A)。 In the production method of the above (b), for example, the carboxylic anhydride and the amine (1) and the following solvent are fed into the system to be matured. The valine acid is then further fed with an amine (2) and a condensing agent (for example, carbodiimide or a salt thereof) to obtain a compound (A).
作為藉由上述(b)之製造方法製造式(1)所示之化合物時所使用的羧酸酐，可舉出例如1,2,4,5-苯四羧酸-1,2：4,5-二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、1,1’-聯苯-2,3,3’,4’-四羧酸-2,3：3’,4’-二酐、萘-1,4,5,8-四羧酸-1,8：4,5-二酐等。 The carboxylic acid anhydride used in the production of the compound represented by the formula (1) by the production method of the above (b) may, for example, be 1,2,4,5-benzenetetracarboxylic acid-1, 2:4, 5 - dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 1,1'-biphenyl-2,3,3',4'-tetracarboxylic acid-2,3: 3', 4'-dianhydride, naphthalene-1,4,5,8-tetracarboxylic acid-1,8:4,5-dianhydride, and the like.
作為藉由上述(b)之製造方法製造式(2)所示之化合物時所使用的羧酸酐，可舉出例如meso-丁烷-1,2,3,4-四羧酸二酐等。 The carboxylic acid anhydride used in the production of the compound represented by the formula (2) by the production method of the above (b) may, for example, be meso-butane-1,2,3,4-tetracarboxylic dianhydride.
作為藉由上述(b)之製造方法製造式(1)所示之化合物時所使用的胺(1)、(2)，係與藉由上述(a)之製造方法製造式(1)所示之化合物的情況同樣地可使用胺(R2-NH2)與胺(R3-NH2)。 The amines (1) and (2) used in the production of the compound represented by the formula (1) by the production method of the above (b) are produced by the production method of the above (a). In the case of the compound, an amine (R 2 -NH 2 ) and an amine (R 3 -NH 2 ) can be used similarly.
作為藉由上述(b)之製造方法製造式(2)所示之化合物時所使用的胺(1)、(2)，係與藉由上述(a)之製造方法製造式(2)所示之化合物的情況同樣地可使用胺(R5-NH2)[較佳為胺(R51-NH2)與胺(R52-NH2)]。 The amines (1) and (2) used in the production of the compound represented by the formula (2) by the production method of the above (b) are produced by the production method of the above (a). In the case of the compound, an amine (R 5 -NH 2 ) [preferably an amine (R 51 -NH 2 ) and an amine (R 52 -NH 2 )] can be used.
作為胺(1)的使用量，相對於羧酸酐1莫耳，為例如2~4莫耳，較佳為2~3莫耳。又，作為胺(2)的使用量，相對於羧酸酐1莫耳，為例如2~4莫耳，較佳為2~3莫耳。 The amount of the amine (1) to be used is, for example, 2 to 4 moles, preferably 2 to 3 moles, per mole of the carboxylic anhydride. Further, the amount of the amine (2) to be used is, for example, 2 to 4 moles, preferably 2 to 3 moles per mole of the carboxylic anhydride.
前述碳二醯亞胺係以下述式表示：R-N=C=N-R’ 上述式中，作為R、R’，可舉出例如可具有含有雜原子之取代基的碳數3~8之直鏈狀或者支鏈狀的烷基、或3~8員之環烷基等。R、R’可相同或相異。又，R與R’可相互鍵結而與-N=C=N-基共同形成環。 The above carbodiimide is represented by the following formula: R-N = C = N - R' In the above formula, examples of R and R' include a linear or branched alkyl group having 3 to 8 carbon atoms or a cycloalkyl group having 3 to 8 members, which may have a substituent containing a hetero atom. . R, R' may be the same or different. Further, R and R' may be bonded to each other to form a ring together with -N=C=N- group.
作為前述碳數3~8之直鏈狀或者支鏈狀的烷基，可舉出例如正丙基、異丙基、正丁基、異丁基、二級丁基、三級丁基、正戊基、異戊基、二級戊基、三級戊基、正己基、異己基、二級己基、三級己基等。 Examples of the linear or branched alkyl group having 3 to 8 carbon atoms include n-propyl group, isopropyl group, n-butyl group, isobutyl group, secondary butyl group, and tertiary butyl group. A pentyl group, an isopentyl group, a second pentyl group, a tertiary pentyl group, a n-hexyl group, an isohexyl group, a secondary hexyl group, a tertiary hexyl group and the like.
作為前述3~8員之環烷基，可舉出例如環丙基、環丁基、環戊基、環己基、環辛基等。 Examples of the cycloalkyl group having 3 to 8 members include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.
作為前述含有雜原子之取代基，可舉出胺基、二甲基胺基等之二(C1-3)烷基胺基等之含有氮原子的取代基。 Examples of the substituent containing a hetero atom include a nitrogen atom-containing substituent such as an amino group or a dimethylamino group (C 1-3 ) alkylamino group.
作為碳二醯亞胺，可舉出例如二異丙基碳二醯亞胺、二環己基碳二醯亞胺、N-(3-二甲基胺基丙基)-N’-乙基碳二醯亞胺等。又，作為碳二醯亞胺的鹽，可舉出例如鹽酸鹽(具體而言，為N-(3-二甲基胺基丙基)-N’-乙基碳二醯亞胺鹽酸鹽等)等。 Examples of the carbodiimide include diisopropylcarbodiimide, dicyclohexylcarbodiimide, and N-(3-dimethylaminopropyl)-N'-ethyl carbon. Diimine and the like. Further, examples of the salt of carbodiimide include a hydrochloride (specifically, N-(3-dimethylaminopropyl)-N'-ethylcarbodiimide hydrochloride Salt, etc.).
作為碳二醯亞胺或其鹽的使用量，相對於羧酸酐1莫耳，為例如2~6莫耳，較佳為2~4莫耳。 The amount of the carbodiimide or a salt thereof to be used is, for example, 2 to 6 moles, preferably 2 to 4 moles, per mole of the carboxylic anhydride.
作為前述溶媒，較佳為使用例如吡啶、三乙胺、三丁胺等之醯胺酸之溶解性優良的親質子性溶媒。此等可單獨使用1種，或混合2種以上使用。 As the solvent, a protonic solvent having excellent solubility in lysine such as pyridine, triethylamine or tributylamine is preferably used. These may be used alone or in combination of two or more.
作為前述溶媒的使用量，相對於醯胺酸的總量，為例如50~300重量%，較佳為100~250重量%。 溶媒的使用量若高於上述範圍，則反應成分的濃度變低，而有反應速度降低的傾向。 The amount of the solvent to be used is, for example, 50 to 300% by weight, preferably 100 to 250% by weight based on the total amount of the valine acid. When the amount of the solvent used is more than the above range, the concentration of the reaction component becomes low, and the reaction rate tends to decrease.
上述反應係通常在常壓下進行。又，作為上述反應的環境，只要不妨害反應則不特別限定，可為例如空氣環境、氮氣環境、氬氣環境等的任一種。熟成溫度(反應溫度)為例如30~70℃。羧酸酐與胺的熟成時間為例如0.5~5小時；醯胺酸與胺的熟成時間為例如0.5~20小時。又，反應能以批次式、半批次式、連續式等的任一種方法進行。 The above reaction is usually carried out under normal pressure. In addition, the environment of the above reaction is not particularly limited as long as it does not impair the reaction, and may be, for example, any of an air atmosphere, a nitrogen atmosphere, and an argon atmosphere. The ripening temperature (reaction temperature) is, for example, 30 to 70 °C. The aging time of the carboxylic anhydride and the amine is, for example, 0.5 to 5 hours; the ripening time of the valine acid and the amine is, for example, 0.5 to 20 hours. Further, the reaction can be carried out by any one of a batch type, a semi-batch type, and a continuous type.
反應結束後，所得之反應生成物可藉由例如過濾、濃縮、蒸餾、萃取、結晶、吸附、再結晶、管柱層析等之分離手段、或此等組合而成之分離手段進行分離精製。 After completion of the reaction, the obtained reaction product can be isolated and purified by a separation means such as filtration, concentration, distillation, extraction, crystallization, adsorption, recrystallization, column chromatography or the like, or a combination thereof.
本發明之溶劑組成物中的化合物(A)的含量(含有2種以上時為合計含量)，相對於後述之溶劑100重量份，為例如0.1~50重量份。化合物(A)的含量的上限較佳為30重量份，特佳為20重量份，最佳為10重量份，尤佳為5重量份。藉由以上述範圍含有化合物(A)，可賦予形成高精度之配線圖案所需的適度的黏性。 The content of the compound (A) in the solvent composition of the present invention (the total content when two or more kinds are contained) is, for example, 0.1 to 50 parts by weight based on 100 parts by weight of the solvent to be described later. The upper limit of the content of the compound (A) is preferably 30 parts by weight, particularly preferably 20 parts by weight, most preferably 10 parts by weight, and particularly preferably 5 parts by weight. By containing the compound (A) in the above range, it is possible to impart an appropriate viscosity which is required to form a wiring pattern with high precision.
作為本發明之溶劑組成物所含的溶劑，較佳為使用上述化合物(A)之溶解性優良的溶劑。 The solvent contained in the solvent composition of the present invention is preferably a solvent excellent in solubility of the above compound (A).
作為前述溶劑，其中，使用1種或2種以上之25℃下的SP值[(cal/cm3)0.5：Fedors計算值]處於7.0 ~11.0(較佳為7.5~11.0，更佳為7.5~10.0，特佳為7.5~9.0，最佳為8.0~9.0)的範圍的溶劑，以上述化合物(A)之溶解性優良，且可將溶解上述化合物(A)時的加熱溫度壓低至例如50~90℃左右之觀點而言係較佳者。SP值處於上述範圍外的溶劑，由於上述化合物(A)的溶解性低，在溶解前述化合物時，有需要在更高的溫度下加熱的傾向。 As the solvent, one or two or more kinds of SP values at 25 ° C [(cal/cm 3 ) 0.5 : Fedors calculated value] are in the range of 7.0 to 11.0 (preferably 7.5 to 11.0, more preferably 7.5 to 7.5). The solvent of the range of 10.0, particularly preferably 7.5 to 9.0, and most preferably 8.0 to 9.0), is excellent in solubility in the above compound (A), and can lower the heating temperature in the case of dissolving the above compound (A) to, for example, 50~. It is preferred from the viewpoint of about 90 °C. The solvent having an SP value outside the above range tends to have a low solubility in the compound (A), and it tends to be heated at a higher temperature when the compound is dissolved.
作為前述溶劑，較佳為使用選自例如正癸烷(SP值：7.7)、正十二烷(SP值：7.7)、丙二醇甲基正丙基醚(SP值：8.1)、丙二醇甲基正丁基醚(SP值：8.1)、二丙二醇二甲基醚(SP值：8.4)、二丙二醇甲基正丙基醚(SP值：8.2)、二丙二醇甲基正丁基醚(SP值：8.2)、二丙二醇甲基異戊基醚(SP值：8.0)、三丙二醇甲基正丙基醚(SP值：8.2)、乙酸3-甲氧基丁酯(SP值：8.8)、3-甲氧基丁醇(SP值：10.6)、薄荷腦乙酸酯(SP值：8.3)、薄荷腦(SP值：9.0)、萜品醇乙酸酯(SP值：8.5)、萜品醇(SP值：9.3)、乙酸環己酯(SP值：8.9)、乙酸2-甲基環己酯(SP值：8.5)、及乙酸4-三級丁基環己酯(SP值：8.2)的至少1種。 As the solvent, it is preferred to use, for example, n-decane (SP value: 7.7), n-dodecane (SP value: 7.7), propylene glycol methyl n-propyl ether (SP value: 8.1), and propylene glycol methyl group. Butyl ether (SP value: 8.1), dipropylene glycol dimethyl ether (SP value: 8.4), dipropylene glycol methyl n-propyl ether (SP value: 8.2), dipropylene glycol methyl n-butyl ether (SP value: 8.2), dipropylene glycol methyl isoamyl ether (SP value: 8.0), tripropylene glycol methyl n-propyl ether (SP value: 8.2), 3-methoxybutyl acetate (SP value: 8.8), 3- Methoxybutanol (SP value: 10.6), menthol acetate (SP value: 8.3), menthol (SP value: 9.0), terpineol acetate (SP value: 8.5), terpineol ( SP value: 9.3), cyclohexyl acetate (SP value: 8.9), 2-methylcyclohexyl acetate (SP value: 8.5), and 4-tris-butylcyclohexyl acetate (SP value: 8.2) At least one.
本發明之溶劑組成物中的溶劑的含量(含有2種以上時為合計含量)為例如20.0~99.9重量%，較佳為30.0~99.5重量%，特佳為40.0~99.5重量%，最佳為50.0~99.5重量%，尤佳為70.0~99.5重量%。溶劑的含量若低於上述範圍，則油墨的黏度變得過高，而有變得不易藉由印刷法形成配線等之情形。另一方面，溶劑的 含量若高於上述範圍，則會因溫度變化而引起低黏度化等，變得不易穩定地維持油墨的黏度，而因液體滴垂等而有變得不易形成高精度的配線圖案之情形。 The content of the solvent in the solvent composition of the present invention (the total content in the case of containing two or more kinds) is, for example, 20.0 to 99.9% by weight, preferably 30.0 to 99.5% by weight, particularly preferably 40.0 to 99.5% by weight, most preferably 50.0 to 99.5 wt%, particularly preferably 70.0 to 99.5% by weight. When the content of the solvent is less than the above range, the viscosity of the ink becomes too high, and it may become difficult to form wiring or the like by a printing method. On the other hand, solvent When the content is more than the above range, the viscosity is low due to a change in temperature, and it is difficult to stably maintain the viscosity of the ink, and it is difficult to form a highly precise wiring pattern due to liquid dripping or the like.
又，本發明之溶劑組成物中，只要為不損及其效果的範圍，則亦可視需求添加上述溶劑以外的溶劑(以下有稱為「其他的溶劑」；其他的溶劑包含用於電子裝置製造用途的周知慣用之溶劑)。作為其他的溶劑的添加量，為本發明之溶劑組成物所含之全部溶劑(100重量%)的例如小於50重量%，較佳為30重量%以下，特佳為20重量%以下，最佳為10重量%以下。 Further, in the solvent composition of the present invention, a solvent other than the above solvent may be added as needed (hereinafter referred to as "other solvent" as long as it does not impair the effect of the effect); other solvents include electronic device manufacturing. A well-known solvent for use). The amount of the other solvent to be added is, for example, less than 50% by weight, preferably 30% by weight or less, particularly preferably 20% by weight or less, based on the total amount of the solvent (100% by weight) contained in the solvent composition of the present invention. It is 10% by weight or less.
本發明之電子裝置製造用油墨(以下有稱為「油墨」)為一種藉由利用印刷法進行塗布而形成電子裝置之配線或電極用之油墨。本發明之油墨係經過將上述溶劑組成物在30~90℃(上限較佳為80℃，下限較佳為40℃，特佳為50℃，最佳為70℃)進行加熱溶解的步驟而製造。 The ink for manufacturing an electronic device of the present invention (hereinafter referred to as "ink") is an ink for forming a wiring or an electrode of an electronic device by coating by a printing method. The ink of the present invention is produced by subjecting the solvent composition to a step of heating and dissolving at 30 to 90 ° C (the upper limit is preferably 80 ° C, the lower limit is preferably 40 ° C, particularly preferably 50 ° C, and most preferably 70 ° C). .
本發明之油墨的製造方法，具有將電子裝置製造用溶劑組成物在30~90℃(上限較佳為80℃，下限較佳為40℃，特佳為50℃，最佳為70℃)進行加熱溶解的步驟。 The method for producing an ink according to the present invention has a solvent composition for producing an electronic device at 30 to 90 ° C (the upper limit is preferably 80 ° C, the lower limit is preferably 40 ° C, particularly preferably 50 ° C, and most preferably 70 ° C). The step of heating to dissolve.
加熱溶解所需的時間為例如3~60分鐘左右(較佳為10~30分鐘)。 The time required for heating to dissolve is, for example, about 3 to 60 minutes (preferably 10 to 30 minutes).
加熱溶解後，較佳為具有冷卻至室溫(例如1~30℃)以下的步驟。冷卻可在室溫下緩緩地冷卻，也可藉由冷藏等急速地冷卻。 After heating and dissolving, it is preferred to have a step of cooling to room temperature (for example, 1 to 30 ° C) or less. The cooling can be gradually cooled at room temperature, or it can be rapidly cooled by refrigerating or the like.
本發明之油墨中，較佳為進一步添加有選自導電性金屬材料、半導體材料、磁性材料、介電材料、及絕緣材料的至少1種的電特性賦予材料。電特性賦予材料的含量(含有2種以上時為其總量)為油墨總量(100重量%)的例如0.1~90重量%左右。 In the ink of the present invention, at least one electrical property imparting material selected from the group consisting of a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, and an insulating material is preferably further added. The content of the electrical property imparting material (the total amount when it is contained in two or more kinds) is, for example, about 0.1 to 90% by weight based on the total amount of the ink (100% by weight).
作為前述導電性金屬材料、磁性材料，可使用周知慣用者，可舉出例如金、銀、銅、鎳、鈀、鋁、鐵、鉑、鉬、鎢、鋅、鉛、鈷、氧化鐵‧氧化鉻、鐵氧體、及此等的合金等。作為半導體材料，可使用周知慣用者，可舉出例如稠五苯、富勒烯衍生物、聚噻吩衍生物、金屬(銅、銦、鎵、硒、砷、鎘、碲、及此等的合金)、矽微粒等。作為介電材料、絕緣材料，可使用周知慣用者，可舉出例如環烯烴聚合物、氟樹脂、縮丁醛樹脂、玻璃、紙、Teflon(註冊商標)等。 As the conductive metal material or magnetic material, those conventionally used can be used, and examples thereof include gold, silver, copper, nickel, palladium, aluminum, iron, platinum, molybdenum, tungsten, zinc, lead, cobalt, and iron oxide. Chromium, ferrite, and the like. As the semiconductor material, a well-known person can be used, and examples thereof include condensed pentabenzene, fullerene derivatives, polythiophene derivatives, and metals (copper, indium, gallium, selenium, arsenic, cadmium, tellurium, and the like). ), 矽 particles, etc. As a dielectric material and an insulating material, a conventionally used one can be used, and examples thereof include a cycloolefin polymer, a fluororesin, a butyral resin, glass, paper, and Teflon (registered trademark).
在經過上述步驟所得到的本發明之油墨中，由於上述化合物(A)會進行自組織化形成線狀會聚體，而產生如高分子化合物般的黏性，因此，即使不摻合黏著劑樹脂，也可具有藉由印刷法精度良好地形成電子裝置之配線或電極所需之適度的黏度。 In the ink of the present invention obtained by the above steps, since the above compound (A) undergoes self-organization to form a linear aggregate, which produces a viscosity like a polymer compound, even if the adhesive resin is not blended It is also possible to have an appropriate viscosity required for accurately forming a wiring or an electrode of an electronic device by a printing method.
本發明之油墨在25℃下的黏度[在剪切速度0.5s-1下]為例如0.01~1000Pa‧s左右，較佳為0.1~500Pa‧s，特佳為1~200Pa‧s。 The viscosity of the ink of the present invention at 25 ° C [at a shear rate of 0.5 s -1 ] is, for example, about 0.01 to 1000 Pa s, preferably 0.1 to 500 Pa s, and particularly preferably 1 to 200 Pa ‧ .
因此，本發明之油墨無需添加黏著劑樹脂(例如，乙基纖維素樹脂、烷基纖維素樹脂、聚乙烯縮醛樹脂、丙烯酸樹脂等之分子量10000以上的高分子化合 物)，即使添加時，黏著劑樹脂的添加量亦為油墨總量(100重量)的例如10重量%以下，較佳為5重量%以下，更佳為小於5重量%，特佳為1重量%以下。黏著劑樹脂的添加量若高於上述範圍，則會因燒成後所殘留之來自黏著劑樹脂的灰分而引起電特性的降低，因而不佳。 Therefore, the ink of the present invention does not require the addition of an adhesive resin (for example, a polymer compound having a molecular weight of 10,000 or more such as an ethyl cellulose resin, an alkyl cellulose resin, a polyvinyl acetal resin, or an acrylic resin). When added, the amount of the adhesive resin added is, for example, 10% by weight or less, preferably 5% by weight or less, more preferably 5% by weight or less, particularly preferably 1% by weight based on the total amount of the ink (100% by weight). %the following. When the amount of the adhesive resin added is more than the above range, electrical properties due to ash from the adhesive resin remaining after firing are lowered, which is not preferable.
又，由本發明之油墨所含之化合物(A)所構成的線狀會聚體，其熱分解性優良，容易低分子量化。因此，本發明之油墨，比起藉由乙基纖維素等之黏著劑樹脂而賦予黏度的油墨，可在低溫(例如為100~350℃，較佳為120~300℃，特佳為150~280℃)下進行燒成，並可防止燒成步驟中之被塗布面構件的軟化、變形。更且，可極力壓低燒成後之灰分的殘留量，而能夠抑制灰分所引起之電特性的降低。 Further, the linear polymer composed of the compound (A) contained in the ink of the present invention is excellent in thermal decomposition property and easily has a low molecular weight. Therefore, the ink of the present invention can be used at a low temperature (for example, 100 to 350 ° C, preferably 120 to 300 ° C, particularly preferably 150 °), compared to an ink which is imparted with viscosity by an adhesive resin such as ethyl cellulose. The firing is performed at 280 ° C), and the softening and deformation of the coated surface member in the firing step can be prevented. Further, the residual amount of ash after firing can be suppressed as much as possible, and the decrease in electrical characteristics caused by ash can be suppressed.
根據本發明之油墨，可藉由經過印刷法對被塗布面構件(例如，陶瓷基板、生坯片等)進行塗布、乾燥、燒成的步驟而精度良好地形成電特性(例如，導電性或絕緣性)優良的配線等。從而，本發明之油墨係特別有用於作為例如電容器、電感器、變阻器、熱敏電阻、揚聲器、致動器、天線、固態氧化物燃料電池(SOFC)等(尤為積層陶瓷電容器)的製造用油墨。 According to the ink of the present invention, the coating surface member (for example, a ceramic substrate or a green sheet) can be coated, dried, and fired by a printing method to accurately form electrical characteristics (for example, conductivity or Insulation) Excellent wiring and the like. Therefore, the ink of the present invention is particularly useful as a manufacturing ink for, for example, a capacitor, an inductor, a varistor, a thermistor, a speaker, an actuator, an antenna, a solid oxide fuel cell (SOFC), or the like (especially a multilayer ceramic capacitor). .
以下，基於實施例對本發明更詳細地加以說明，惟本發明不受此等實施例任何限定。 Hereinafter, the present invention will be described in more detail based on the examples, but the present invention is not limited to these examples.
對具備戴氏冷凝管、氮氣導入口、滴液漏斗、熱電偶的100mL四口分離式燒瓶饋入20mL吡啶、3.0g(0.014mol)1,2,4,5-苯四羧酸-1,2：4,5-二酐、7.4g(0.028mol)油胺。將系統內溫度設定為50℃，進行3小時熟成。 A 100 mL four-piece split flask equipped with a Dais condenser, a nitrogen inlet, a dropping funnel, and a thermocouple was fed with 20 mL of pyridine and 3.0 g (0.014 mol) of 1,2,4,5-benzenetetracarboxylic acid-1. 2: 4,5-dianhydride, 7.4 g (0.028 mol) oleylamine. The temperature in the system was set to 50 ° C, and the mixture was aged for 3 hours.
其後，饋入2.1g(0.028mol)丁胺、7.0g(0.056mol)二異丙基碳二醯亞胺，進一步進行8小時熟成。 Thereafter, 2.1 g (0.028 mol) of butylamine and 7.0 g (0.056 mol) of diisopropylcarbodiimide were fed, and further aging was carried out for 8 hours.
其後，以蒸發器去除所得粗液的低沸點成分，以甲醇加以洗淨，得到淡黃色的濕粉。進而對所得之濕粉以CHCl3/CH3OH(70/30(v/v))進行再結晶，得到7.3g的1,2,4,5-苯四羧酸二(丁醯胺)二(油醯胺)(分子量：863)[1,2,4,5-苯四羧酸-1,4-二(丁醯胺)-2,5-二(油醯胺)與1,2,4,5-苯四羧酸-1,5-二(丁醯胺)-2,4-二(油醯胺)的混合物](產率：61%)。生成物的蒸發溫度為291℃。 Thereafter, the low boiling component of the obtained crude liquid was removed by an evaporator, and washed with methanol to obtain a pale yellow wet powder. Further, the obtained wet powder was recrystallized with CHCl 3 /CH 3 OH (70/30 (v/v)) to obtain 7.3 g of 1,2,4,5-benzenetetracarboxylic acid bis(butamidine) II. (oleic acid amine) (molecular weight: 863) [1,2,4,5-benzenetetracarboxylic acid-1,4-bis(butyrylamine)-2,5-di(oleoamine) and 1,2, a mixture of 4,5-benzenetetracarboxylic acid-1,5-bis(butyridinium)-2,4-di(oleoamine)] (yield: 61%). The evaporation temperature of the product was 291 °C.
對具備戴氏冷凝管、氮氣導入口、滴液漏斗、熱電偶的100mL四口分離式燒瓶饋入20mL吡啶、3.0g(0.012mol)3,3’,4,4’-二苯甲酮四羧酸二酐、6.47g(0.024mol)油胺。將系統內溫度設定為50℃，進行3小時熟成。 A 100 mL four-piece split flask equipped with a Dais condenser, a nitrogen inlet, a dropping funnel, and a thermocouple was fed with 20 mL of pyridine, 3.0 g (0.012 mol) of 3,3',4,4'-benzophenone. Carboxylic dianhydride, 6.47 g (0.024 mol) of oleylamine. The temperature in the system was set to 50 ° C, and the mixture was aged for 3 hours.
其後，饋入1.8g(0.024mol)丁胺、6.1g(0.048mol)二異丙基碳二醯亞胺，進一步進行8小時熟成。 Thereafter, 1.8 g (0.024 mol) of butylamine and 6.1 g (0.048 mol) of diisopropylcarbodiimide were fed, and further aging was carried out for 8 hours.
其後，以蒸發器去除所得粗液的低沸點成分，以甲醇加以洗淨，得到淡黃色的濕粉。進而對所得之濕粉以CHCl3/CH3OH(70/30(v/v))進行再結晶，得到4.8g的3,3',4,4'-二苯甲酮四羧酸二(丁醯胺)二(油醯胺)(分子量：967)(產率：41%)。生成物的蒸發溫度為214℃。 Thereafter, the low boiling component of the obtained crude liquid was removed by an evaporator, and washed with methanol to obtain a pale yellow wet powder. Further, the obtained wet powder was recrystallized with CHCl 3 /CH 3 OH (70/30 (v/v)) to obtain 4.8 g of 3,3',4,4'-benzophenonetetracarboxylic acid II ( Butanamine) bis(oleic acid amine) (molecular weight: 967) (yield: 41%). The evaporation temperature of the product was 214 °C.
以增黏劑濃度成為1重量%之方式，將合成例1中所得之增黏劑(1)添加於作為溶劑的正癸烷(和光純藥工業(股)製)，而得到溶劑組成物(1)。 The tackifier (1) obtained in Synthesis Example 1 was added to n-decane (manufactured by Wako Pure Chemical Industries, Ltd.) as a solvent to obtain a solvent composition (the amount of the tackifier was 1% by weight). 1).
將所得溶劑組成物(1)在液溫80℃下進行0.5小時加熱溶解，放置冷卻至室溫(25℃)，得到糊狀的油墨(1)(25℃下的黏度[在剪切速度0.5s-1下]：1.7Pa‧s)。 The obtained solvent composition (1) was heated and dissolved at a liquid temperature of 80 ° C for 0.5 hour, and left to cool to room temperature (25 ° C) to obtain a paste-like ink (1) (viscosity at 25 ° C [at a shear rate of 0.5] s -1 under]: 1.7Pa‧s).
除變更為下述表1所記載之組成(單位：重量%)以外，係與實施例1同樣進行，得到溶劑組成物，而製得油墨。此外，在比較例1中係以樹脂濃度達5重量%的方式添加樹脂來替代增黏劑，並在液溫80℃下進行3小時加熱溶解，在室溫(25℃)下放置冷卻而得到糊狀的油墨。 The solvent was obtained in the same manner as in Example 1 except that the composition (unit: % by weight) described in the following Table 1 was changed to obtain an ink. Further, in Comparative Example 1, a resin was added in place of the tackifier so as to have a resin concentration of 5% by weight, and the mixture was heated and dissolved at a liquid temperature of 80 ° C for 3 hours, and left to stand at room temperature (25 ° C) to be cooled. Paste ink.
針對實施例及比較例中所得之油墨，依下述方法針對蒸發溫度、殘留灰分量、及塗布性加以評定。 The inks obtained in the examples and the comparative examples were evaluated for the evaporation temperature, the residual ash content, and the coatability by the following methods.
蒸發溫度及殘留灰分量：對油墨各20mg，以TG-DTA由20℃以10℃/分鐘昇溫至400℃，測定每一溫度下的重量，評定蒸發溫度(重量減少至原本重量的5.0%之時間點的溫度)與350℃下的殘留灰分量(殘留灰分相對於油墨總量的比例(重量%))。 Evaporation temperature and residual ash content: 20 mg of each ink, TG-DTA was heated from 20 ° C at 10 ° C / min to 400 ° C, the weight at each temperature was measured, and the evaporation temperature was evaluated (the weight was reduced to 5.0% of the original weight) Temperature at time point) and residual ash content at 350 ° C (ratio of residual ash to total ink (% by weight)).
其結果，比起比較例中所得之油墨，實施例中所得之油墨均在更低溫下氣化。再者，比較例中所得之油墨，即使進行過350℃的加熱，油墨總量的3.0重量%仍會以灰分殘留，相對於此，實施例中所得之油墨的殘留灰分為油墨總量的1.6重量%以下。 As a result, the inks obtained in the examples were vaporized at a lower temperature than the inks obtained in the comparative examples. Further, in the ink obtained in the comparative example, even if heated at 350 ° C, 3.0% by weight of the total amount of the ink remained as ash, whereas the residual ash of the ink obtained in the examples was 1.6 in the total amount of the ink. Below weight%.
使用網版印刷機(商品名「LS-150型TV網版印刷機」，NEWLONG精密工業(股)製)，將完成塗布者設為「○」、無法完成塗布者設為「×」。 The screen printing machine (trade name "LS-150 TV screen printing machine", NEWLONG Precision Industrial Co., Ltd.) was used, and the finisher was set to "○", and the coating was not set to "X".
將結果彙整表示於下表中。 The results are summarized in the table below.
表1中的縮寫如下： The abbreviations in Table 1 are as follows:
1：1,2,4,5-苯四羧酸二(丁醯胺)二(油醯胺) 1:1,2,4,5-benzenetetracarboxylic acid bis(butamidine) bis (oleylamine)
2：3,3’,4,4’-二苯甲酮四羧酸二(丁醯胺)二(油醯胺)樹脂 2:3,3',4,4'-benzophenone tetracarboxylic acid bis(butylamine) bis(oleoamine) resin
EC200：乙基纖維素，商品名「ETHOCEL STD200」，日新化成(股)製 EC200: ethyl cellulose, trade name "ETHOCEL STD200", Nisshin Chemical Co., Ltd.
decane：正癸烷(和光純藥工業(股)製，SP值：7.7) Decane: n-decane (Wako Pure Chemical Industries, Ltd., SP value: 7.7)
PMNB：丙二醇甲基正丁基醚(Daicel(股)製，SP值：8.1) PMNB: propylene glycol methyl n-butyl ether (made by Daicel), SP value: 8.1
DPMNP：二丙二醇甲基正丙基醚(Daicel(股)製，SP值：8.2) DPMNP: dipropylene glycol methyl n-propyl ether (made by Daicel), SP value: 8.2)
MBA：乙酸3-甲氧基丁酯(Daicel(股)製，SP值：8.8) MBA: 3-methoxybutyl acetate (made by Daicel), SP value: 8.8)
MB：3-甲氧基丁醇(Daicel製(股)，SP值：10.6) MB: 3-methoxybutanol (made by Daicel, SP value: 10.6)
本發明之電子裝置製造用溶劑組成物，經過進行加熱溶解的步驟，可製造具有適於採用印刷法之配線等的形成之黏性的油墨。 In the solvent composition for producing an electronic device of the present invention, by performing a step of heating and dissolving, it is possible to produce an ink having a viscosity suitable for formation by wiring or the like using a printing method.
又，使用本發明之電子裝置製造用溶劑組成物所得之油墨不易發生液體滴垂，可藉由印刷法形成高精度的配線圖案。又，在燒成步驟中，可在更低溫下進行燒成，可防止被塗布面構件因長時間暴露於高溫下而軟化、變形。再者，可顯著減少燒成後之灰分的殘留量，可抑制由此所引起之電特性的降低。 Further, the ink obtained by using the solvent composition for producing an electronic device of the present invention is less likely to cause liquid dripping, and a high-precision wiring pattern can be formed by a printing method. Further, in the firing step, the firing can be performed at a lower temperature, and the coated surface member can be prevented from being softened and deformed by being exposed to a high temperature for a long period of time. Further, the residual amount of ash after firing can be remarkably reduced, and the decrease in electrical characteristics caused thereby can be suppressed.
從而，只要使用本發明之電子裝置製造用溶劑組成物，即可藉由印刷法形成電特性優良的配線等，而能夠有效率地製造具有電特性優良之配線等的電子裝置。 Therefore, by using the solvent composition for producing an electronic device of the present invention, it is possible to efficiently form an electronic device having wiring or the like having excellent electrical characteristics by forming a wiring having excellent electrical characteristics by a printing method.
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