PH12017550098A1 - Solvent composition for electronic device production - Google Patents
Solvent composition for electronic device productionInfo
- Publication number
- PH12017550098A1 PH12017550098A1 PH12017550098A PH12017550098A PH12017550098A1 PH 12017550098 A1 PH12017550098 A1 PH 12017550098A1 PH 12017550098 A PH12017550098 A PH 12017550098A PH 12017550098 A PH12017550098 A PH 12017550098A PH 12017550098 A1 PH12017550098 A1 PH 12017550098A1
- Authority
- PH
- Philippines
- Prior art keywords
- formula
- solvent composition
- electronic device
- aliphatic hydrocarbon
- carbon atoms
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract 3
- 125000001931 aliphatic group Chemical group 0.000 abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 abstract 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 abstract 1
- 239000012965 benzophenone Substances 0.000 abstract 1
- 235000010290 biphenyl Nutrition 0.000 abstract 1
- 239000004305 biphenyl Substances 0.000 abstract 1
- 239000001273 butane Substances 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 abstract 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Provided is a solvent composition which is used in an ink for forming an electronic device by a printing method, and which enables improvement of printing accuracy, low-temperature firing and suppression of residual ash content. A solvent composition according to the present invention contains a solvent and the compound (A) described below. Compound (A): a compound represented by formula (1) and/or a compound represented by formula (2) (R2-HNOC)4n-R1-(CONH-R3)n (1) (In the formula, R1 represents a group obtained by removing four hydrogen atoms from the structural formula of benzene, benzophenone, biphenyl or naphthalene; R2 represents an aliphatic hydrocarbon group having 1-5 carbon atoms; R3 represents an aliphatic hydrocarbon group having six or more carbon atoms; and n represents an integer of 1-3.) R4-(CONH-R5)4 (2) (In the formula, R4 represents a group obtained by removing four hydrogen atoms from the structural formula of butane; and R5 represents an aliphatic hydrocarbon group having one or more carbon atoms.)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015075979A JP2018095661A (en) | 2015-04-02 | 2015-04-02 | Solvent composition for manufacturing electric device |
| PCT/JP2016/060165 WO2016158969A1 (en) | 2015-04-02 | 2016-03-29 | Solvent composition for electronic device production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12017550098A1 true PH12017550098A1 (en) | 2018-02-26 |
Family
ID=57007183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12017550098A PH12017550098A1 (en) | 2015-04-02 | 2017-09-07 | Solvent composition for electronic device production |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018095661A (en) |
| PH (1) | PH12017550098A1 (en) |
| TW (1) | TW201718786A (en) |
| WO (1) | WO2016158969A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477766B (en) * | 2015-06-12 | 2023-04-07 | 默克专利有限公司 | Esters containing non-aromatic rings as solvents for OLED formulations |
| CN110546214B (en) * | 2017-04-28 | 2022-10-28 | 株式会社大赛璐 | Solvent composition for electronic device manufacture |
| CN111936584A (en) * | 2018-03-30 | 2020-11-13 | 株式会社大赛璐 | Ink for electronic device production |
| EP3778564A4 (en) * | 2018-03-30 | 2022-03-09 | Daicel Corporation | Thickening stabilizer and solvent composition using same for production of electronic device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284814A (en) * | 1997-03-31 | 1998-10-23 | Kawaguchiko Seimitsu Kk | Circuit pattern and its formation |
| JP5401644B2 (en) * | 2007-12-28 | 2014-01-29 | 新日本理化株式会社 | Novel organogelator |
| US8178192B2 (en) * | 2008-03-06 | 2012-05-15 | Ngk Insulators, Ltd. | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate |
| JP2012077195A (en) * | 2010-10-01 | 2012-04-19 | National Institute Of Advanced Industrial Science & Technology | Method for adjusting viscosity of fluid organic substance, and viscosity adjusting agent for the same |
| WO2014057846A1 (en) * | 2012-10-11 | 2014-04-17 | 株式会社ダイセル | Solvent composition for manufacturing electric device |
| JP6246138B2 (en) * | 2013-02-08 | 2017-12-13 | 株式会社ダイセル | Thickening stabilizer and thickening and stabilizing composition using the same |
| JP6312669B2 (en) * | 2013-06-25 | 2018-04-18 | 株式会社ダイセル | Thickening stabilizer and thickening and stabilizing composition using the same |
| KR102202848B1 (en) * | 2013-12-09 | 2021-01-14 | 주식회사 다이셀 | Solvent composition for electric device production |
-
2015
- 2015-04-02 JP JP2015075979A patent/JP2018095661A/en active Pending
-
2016
- 2016-03-29 WO PCT/JP2016/060165 patent/WO2016158969A1/en active Application Filing
- 2016-04-01 TW TW105110452A patent/TW201718786A/en unknown
-
2017
- 2017-09-07 PH PH12017550098A patent/PH12017550098A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201718786A (en) | 2017-06-01 |
| JP2018095661A (en) | 2018-06-21 |
| WO2016158969A1 (en) | 2016-10-06 |
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