TW201634581A - 樹脂組成物、預浸物、覆金屬積層板及配線基板 - Google Patents
樹脂組成物、預浸物、覆金屬積層板及配線基板 Download PDFInfo
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- TW201634581A TW201634581A TW105104446A TW105104446A TW201634581A TW 201634581 A TW201634581 A TW 201634581A TW 105104446 A TW105104446 A TW 105104446A TW 105104446 A TW105104446 A TW 105104446A TW 201634581 A TW201634581 A TW 201634581A
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- resin composition
- prepreg
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- 239000011342 resin composition Substances 0.000 title claims abstract description 61
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- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 7
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 72
- 239000011888 foil Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 18
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- 229910000420 cerium oxide Inorganic materials 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000004793 Polystyrene Substances 0.000 claims description 11
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- 239000011258 core-shell material Substances 0.000 claims description 10
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- 229920002857 polybutadiene Polymers 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 34
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
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- 239000010949 copper Substances 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 15
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- 239000000654 additive Substances 0.000 description 10
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- -1 polysiloxane Polymers 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 4
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 229920000388 Polyphosphate Polymers 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 239000001205 polyphosphate Substances 0.000 description 4
- 235000011176 polyphosphates Nutrition 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004817 gas chromatography Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
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- 238000010030 laminating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
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- 229910000679 solder Inorganic materials 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 2
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- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 238000004566 IR spectroscopy Methods 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000011095 metalized laminate Substances 0.000 description 2
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000002813 thiocarbonyl group Chemical group *C(*)=S 0.000 description 2
- POBUJEBYLIZDCQ-UHFFFAOYSA-N 1,2,3-tributyl-4-propan-2-ylbenzene Chemical compound C(CCC)C1=C(C(=C(C=C1)C(C)C)CCCC)CCCC POBUJEBYLIZDCQ-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- GXGJIOMUZAGVEH-UHFFFAOYSA-N Chamazulene Chemical group CCC1=CC=C(C)C2=CC=C(C)C2=C1 GXGJIOMUZAGVEH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 239000002216 antistatic agent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- JOHLXIVQQFXEEV-UHFFFAOYSA-N cyanic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC#N.NC1=NC(N)=NC(N)=N1 JOHLXIVQQFXEEV-UHFFFAOYSA-N 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
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- 238000007429 general method Methods 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
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- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- 238000004611 spectroscopical analysis Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
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- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
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Abstract
本發明之樹脂組成物,係含有:存在於主鏈的末端之羥基已藉由乙烯性不飽和化合物改質過之聚苯醚(A)、選自異三聚氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種(B)、以及不含苯環之有機過氧化物(C);當成分(A)、成分(B)及成分(C)之合計量((A)+(B)+(C))為100質量%時,成分(C)之含有比率為0.1至7質量%。
Description
本揭示係關於預浸物、覆金屬積層板及配線基板。
近年來,LSI的高速化和高積體化、記憶體的大容量化等進展迅速,伴隨於此,各種電子零件的小型化、輕量化、薄型化等亦急速地進行。因此,對於材料方面來看,亦要求優異的耐熱性、尺寸穩定性、電特性等。當中,聚苯醚乃受到矚目,而被嘗試應用在覆銅積層板(專利文獻1)。
[專利文獻1]日本特開2005-8829號公報
本揭示之樹脂組成物,係含有:存在於主鏈的末端之羥基已藉由乙烯性不飽和化合物改質過之聚苯醚(A)、選自異三聚氰酸三烯丙酯及三聚氰酸三烯丙酯之至
少1種(B)、以及不含苯環之有機過氧化物(C)。當成分(A)、成分(B)及成分(C)之合計量((A)+(B)+(C))為100質量%時,成分(C)之含有比率為0.1至7質量%。
本揭示之預浸物,係包含上述樹脂組成物與基材。
本揭示之覆金屬積層板,係於上述預浸物的表面具備導電性金屬箔。
本揭示之配線基板,係具備複數層之絕緣層與配置在該絕緣層間之導體層,而絕緣層係由上述樹脂組成物與基材所構成。
本揭示之樹脂組成物,係含有:存在於主鏈的末端之羥基已藉由乙烯性不飽和化合物改質過之聚苯醚(成分(A))、選自異三聚氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種(成分(B))、以及不含苯環之有機過氧化物(成分(C));當成分(A)、成分(B)及成分(C)之合計量((A)+(B)+(C))為100質量%時,成分(C)之含有比率為0.1至7質量%。
本揭示之樹脂組成物所使用之成分(A)並無特別限定,例如可列舉出以下述式(I)所示之化合物等。以式(I)所示之化合物,例如記載於日本特許第4913970號。
式(I)中,R1至R11分別獨立地為氫原子、可具有取代基之碳數1至8個的直鏈或分枝烷基、可具有取代基之碳數2至8個的直鏈或分枝烯基、可具有取代基之碳數2至8個的直鏈或分枝炔基、或是可具有取代基之碳數6至10個的芳基。取代基,例如可列舉出羧基、醛基、羥基、胺基等。Z表示羰基(>C=O)、硫羰基(>C=S)、亞甲基(-CH2-)、伸乙基(二亞甲基)(-CH2-CH2-)、三亞甲基(-CH2-CH2-CH2-)基或四亞甲基(-CH2-CH2-CH2-CH2-)。n為1至200的整數。
本揭示之樹脂組成物所使用之成分(A),可列舉出上述式(I)中R1至R11分別獨立地為氫原子、甲基、乙基、或可具有取代基之苯基之化合物。
成分(A)的含量並無特別限定,當成分(A)與後述成分(B)與後述成分(C)之合計量為100質量%時,成分(A)之含有比率可為29.9至90質量%,藉由以此比率含有成分(A),可進一步降低介電常數及介電損耗角正切。成分(A)之含有比率亦可為40至75質量%。
本揭示之樹脂組成物所使用之成分(B),係用作為交聯劑,可使用異三聚氰酸三烯丙酯及三聚氰酸三
烯丙酯中的一方或兩者。藉由使用異三聚氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種,可發揮優異的介電特性及耐熱性。
成分(B)的含量並無特別限定,當成分(A)與成分(B)與後述成分(C)之合計量為100質量%時,成分(B)之含有比率可為9.9至70質量%,藉由以此比率含有成分(B),可發揮更高的耐熱性。成分(B)之含有比率亦可為20至50質量%。
本揭示之樹脂組成物所使用之成分(C),係用作為自由基起始劑。亦即,成分(C)係用以使成分(A)與成分(B)進行自由基反應以得到成分(A)與成分(B)之交聯物而使用。成分(C)為不含苯環之有機過氧化物,惟藉由使用不含苯環之有機過氧化物,可更有效地降低介電損耗角正切。成分(C),例如可列舉出過氧化二(三級丁基)、2,5-二甲基-2,5-二(過氧化三級丁基)己烷、2,5-二甲基-2,5-二(過氧化三級丁基)己炔-3等,惟並無特別限定。此等化合物,市面上販售有例如「Perbutyl D」、「Perhexa 25B」、「Perhexin 25B」(均為日油股份有限公司製)等。
本揭示之樹脂組成物中,當成分(A)與成分(B)與成分(C)之合計量為100質量%時,成分(C)之含有比率為0.1至7質量%。成分(C)的含量未達0.1質量%時,無法發揮耐熱性。另一方面,成分(C)的含量超過7質量%時,耐熱性惡化。
成分(C)的含量比率可為1至6質量%,藉由
以此比率含有成分(C),可有效地進行成分(A)與成分(B)之交聯反應,進一步降低介電損耗角正切。成分(C)之含有比率亦可為2至4質量%。
如以上所述,本揭示之樹脂組成物,係含有成分(A)與成分(B)與成分(C),當成分(A)與成分(B)與成分(C)之合計量為100質量%時,成分(C)之含有比率為0.1至7質量%。因此,根據本揭示之樹脂組成物,可降低介電常數及介電損耗角正切。
本揭示之樹脂組成物中,在不阻礙本發明之一實施形態的效果之範圍內,可因應必要含有聚丁二烯與聚苯乙烯之混合物或丁二烯-苯乙烯共聚物(成分(D))、具有核殼構造之聚矽氧系聚合物(成分(E))、二氧化矽、阻燃劑、應力緩和劑等之添加劑。使用該添加劑時,添加劑的含量係因應添加劑的種類來適當地設定。可在使樹脂組成物中之成分(A)與成分(B)與成分(C)之合計量至少成為25質量%之方式下添加添加劑。可在使樹脂組成物中之成分(A)與成分(B)與成分(C)之合計量成為35至85質量%之方式下添加添加劑。
成分(D),係與成分(A)及成分(B)反應而形成聚合物(交聯物)。亦即,係使存在於此等混合物或共聚物之雙鍵,與存在於成分(A)及成分(B)的分子中之雙鍵反應。
當使用聚丁二烯與聚苯乙烯之混合物作為成分(D)時,聚丁二烯與聚苯乙烯之質量比並無特別限定。
混合物中,可以5:95至95:5之質量比含有聚丁二烯與聚苯乙烯。藉由以該質量比含有聚丁二烯與聚苯乙烯,可提高與金屬箔之密合性,更進一步提高配線基板的耐熱性。
另一方面,當使用丁二烯-苯乙烯共聚物作為成分(D)時,構成共聚物之丁二烯與苯乙烯之比率並無特別限定。例如,可為以5:95至95:5之質量比使丁二烯與苯乙烯聚合之共聚物。藉由使用以5:95至95:5之質量比使丁二烯與苯乙烯聚合之共聚物,可提高與金屬箔之密合性,更進一步提高配線基板的耐熱性。再者,共聚物的重量平均分子量或數量平均分子量並無特別限定,例如,於共聚物中亦可包含聚合度相對較低(分子量較小)之低聚物。可使用具有1,000至100,000左右的數量平均分子量之共聚物。
使用成分(D)時,當成分(A)與成分(B)與成分(C)與成分(D)之合計量為100質量%時,成分(D)之含有比率可為0.5至20質量%。藉由以該比率含有此等混合物或共聚物,可在將介電常數及介電損耗角正切維持較低之狀態下,進一步提升密合性。此等混合物或共聚物之含有比率亦可為3至15質量%。
所謂具有核殼構造之聚矽氧系聚合物(成分(E)),意指具有中核部與外殼部之聚矽氧系聚合物。具體而言,意指具有粒子狀之中核部、與形成在該中核部的外側之外殼部的至少一方由聚矽氧系聚合物所形成之聚合物。
成分(E)的製造方法,只要是使構成外殼部之聚合物形成於具有粒子狀之中核部的外側之方法即可,並無特別限定。例如,成分(E)係可藉由在由聚矽氧系聚合物所形成之粒子(中核部)的存在下,使形成外殼部之單體成分聚合而得到。該單體成分並無特別限定,通常係使用與構成形成中核部之聚矽氧系聚合物之單體成分為不同的單體成分。
形成外殼部之單體成分,例如可列舉出與形成中核部之聚矽氧系聚合物具有反應性之單體成分。藉由使用該單體成分,可使單體成分於中核部的外側接枝,而得到:以由聚矽氧系聚合物所形成之中核部、與由接枝聚合物形成於中核部的外側之外殼部來構成之核殼聚矽氧。
使用成分(E)時,可使用具有0.1至5μm的平均粒徑之核殼聚矽氧,亦可使用具有0.5至2.0μm的平均粒徑之核殼聚矽氧。再者,核殼聚矽氧可使用市售品,例如市面上販售有KMP-600(Shin-Etsu Silicone股份有限公司製)等。
使用成分(E)時,當成分(A)與成分(B)與成分(C)與成分(E)之合計量為100質量%時,成分(E)之含有比率可為0.1至5質量%。藉由以該比率含有成分(E),可在將介電常數及介電損耗角正切維持較低之狀態下,進一步賦予彈性。成分(E)之含有比率亦可為1.0至3.0質量%。
二氧化矽,例如可列舉出粉碎二氧化矽、
熔融二氧化矽等,可單獨使用或混合2種以上使用。具體上可列舉出經甲基丙烯酸矽烷處理之熔融二氧化矽:SFP-130MC(電氣化學工業股份有限公司製)、FUSELEX E-2、Adma Fine SO-C5、PLV-3(均為龍森股份有限公司製)等。二氧化矽,可使用具有10μm以下的平均粒徑之二氧化矽粒子。藉由使用具有該平均粒徑之二氧化矽粒子,樹脂組成物,例如當使用在覆金屬積層板等時,可進一步提升與金屬箔之密合性。當成分(A)與成分(B)與成分(C)之合計量為100質量份時,二氧化矽之含有比率可為5至40質量份。藉由以該比率含有二氧化矽,可進一步提升樹脂組成物的熔融流動性。再者,樹脂組成物,例如當使用在覆金屬積層板等時,可進一步提升與金屬箔之密合性,亦可進一步提升通孔連接可靠度。
阻燃劑並無特別限定,例如可列舉出三聚氰胺磷酸鹽、多磷酸蜜白胺、多磷酸蜜勒胺、三聚氰胺焦磷酸鹽、多磷酸銨、紅磷、芳香族磷酸酯、膦酸酯、亞膦酸酯、膦氧化物、膦氮烯(Phosphazene)、三聚氰胺氰酸酯、伸乙基雙五溴苯、伸乙基雙四溴鄰苯二甲醯亞胺等。此等阻燃劑可單獨使用或併用2種以上。從介電特性及耐燃性、耐熱性、密合性、耐濕性、耐藥性、可靠度等觀點來看,可使用三聚氰胺焦磷酸鹽、三聚氰胺多磷酸鹽、多磷酸蜜白胺或多磷酸銨。
當成分(A)與成分(B)與成分(C)之合計量為100質量份時,阻燃劑之含有比率可為15至45質量份。
藉由以該比率含有阻燃劑,可在幾乎不對介電特性、密合性、耐濕性造成影響下,進一步提升耐燃性及耐熱性。
應力緩和劑並無特別限定,例如可列舉出上述核殼聚矽氧以外的聚矽氧樹脂粒子等。聚矽氧樹脂粒子,例如,矽橡膠粉末可列舉出KMP-597(信越化學工業股份有限公司製)、X-52-875(信越化學工業股份有限公司製),矽樹脂粉末可列舉出KMP-590(信越化學工業股份有限公司製)、X-52-1621(信越化學工業股份有限公司製)等。此等應力緩和劑可單獨使用或併用2種以上。
應力緩和劑,可使用具有10μm以下的平均粒徑者。藉由使用具有該平均粒徑之應力緩和劑,樹脂組成物,例如當使用在覆金屬積層板等時,可進一步提升與金屬箔之密合性。當成分(A)與成分(B)與成分(C)之合計量為100質量份時,應力緩和劑之含有比率可為1至10質量份。藉由以該比率含有應力緩和劑,樹脂組成物,例如當使用在覆金屬積層板等時,可進一步提升與金屬箔之密合性以及耐吸濕性,亦可進一步提升通孔連接可靠度。
本揭示之樹脂組成物,除了上述成分之外,可因應該用途適當地添加二氧化矽以外的填充劑、添加劑等。二氧化矽以外的填充劑,例如可列舉出碳黑、氧化鈦、鈦酸鋇、玻璃珠、玻璃中空球等。添加劑,例如可列舉出抗氧化劑、熱穩定劑、抗靜電劑、塑化劑、顏料、染料、著色劑等。添加劑的具體物,例如可列舉出R-42(堺化學股份有限公司製)、IRGANOX1010(BASF公司製)等。
填充劑或添加劑,可單獨使用或併用2種以上。
再者,本揭示之樹脂組成物中,可添加上述聚丁二烯與聚苯乙烯之混合物及丁二烯-苯乙烯共聚物以外之熱塑性樹脂及熱硬化性樹脂之至少1種。熱塑性樹脂,例如可列舉出GPPS(泛用聚苯乙烯)、HIPS(耐衝擊性聚苯乙烯)等。熱硬化性樹脂,例如可列舉出環氧樹脂等。此等樹脂,可單獨使用或併用2種以上。
本揭示之樹脂組成物,例如可混合上述成分(A)至(C)及因應必要之其他成分而得到,該混合方法並無特別限定。混合方法,例如可列舉出將全部成分均一地溶解或分散於溶劑中之溶液混合法、或是藉由擠壓機等予以加熱而進行之熔融摻合法等。
溶液混合法中所使用之溶劑,例如可列舉出甲苯。固體成分(樹脂)與溶劑之質量比並無特別限定,可為60:40至40:60。除了甲苯以外,亦可使用苯、二甲苯等之芳香族系溶劑,丙酮等之酮系溶劑、四氫呋喃、三氯甲烷等之其他溶劑,亦可併用甲苯與其他溶劑。於後述本揭示之預浸物中,通常不會殘存甲苯以外的溶劑。因此,在併用其他溶劑時,甲苯以外的溶劑,例如使用具有較甲苯更低的沸點之溶劑。
接著說明本揭示之預浸物。本揭示之預浸物,係含有本揭示之樹脂組成物(樹脂)、與用以含有此樹脂組成物之基材。例如可依循一般方法將本揭示之樹脂組成物塗布或浸滲基材後,進行乾燥而得到。基材,例如可
列舉出玻璃、聚醯亞胺等之纖維的織布及不織布、紙等。玻璃的材質,除了一般的E玻璃之外,可列舉出D玻璃、S玻璃、石英玻璃等。
於預浸物中基材所佔有之比率,可為預浸物全體之約20至80質量%。若基材為此比率,則預浸物在硬化後的尺寸穩定性及強度更容易發揮。再者,亦可得到更優異的介電特性。本揭示之預浸物中,可因應必要使用矽烷系偶合劑、鈦酸酯系偶合劑等之偶合劑。
預浸物中的樹脂是否為本揭示之樹脂組成物者,可藉由紅外線分光法(IR:Infrared Spectroscopy)及氣相層析(GC:Gas Chromatography)進行分析來確認成分,然後藉由核磁共振分光法(NMR:Nuclear Magnetic Resonance)及質譜分析氣相層析(GC-MS)進行分析,而確認組成。預浸物中的樹脂,為未硬化或半硬化狀態。
製造本揭示之預浸物之方法並無特別限定,例如可列舉出將本揭示之樹脂組成物,因應必要均一地溶解或分散於甲苯或其他溶劑,並塗布或浸滲基材後進行乾燥之方法。此外,可使樹脂組成物熔融並浸滲基材中。塗布方法及含浸方法並無特別限定,例如可列舉出:使用噴霧器、毛刷、棒塗布機等來塗布樹脂組成物的溶解液或分散液之方法;以及將基材浸漬於樹脂組成物的溶解液或分散液之方法(浸泡法)等。塗布或含浸,可因應必要重複進行複數次。或是使用樹脂濃度不同之複數種溶解液或分散液,重複進行塗布或含浸。
本揭示之預浸物中,使用甲苯作為溶劑時,甲苯的殘存量可設為0.5質量%以下,亦可設為0.3質量%以下。甲苯的殘存量,例如可使用氣相層析儀來測定,但並不限定於此測定方法。甲苯於預浸物中之含量,係以下述方法來求取。例如將預浸物中的樹脂溶解於乙基苯,並將該溶液導入氣相層析儀。測定該溶液中的甲苯量,並算出預浸物全體中之甲苯的質量而求得。
本揭示之預浸物,例如可提供於加熱成形而加工為積層板。積層板,例如可因應期望的厚度重疊複數片預浸物,積層金屬箔等之薄片,並進行加熱(硬化)加壓成形,然後去除金屬箔等之薄片而得到。再者,亦可將所得之積層板與另外的預浸物組合,而得到更厚的積層板。積層成形及硬化,通常是使用熱壓機同時進行,但兩者亦可分開進行。亦即,首先進行積層成形而得到半硬化的積層板,接著藉由熱處理機進行處理以完全硬化。加熱加壓成形,可在80至300℃、0.1至50MPa的加壓下進行1分鐘至10小時,亦可在150至250℃、0.5至10MPa的加壓下進行10分鐘至5小時左右。
接著說明本揭示之覆金屬積層板。本揭示之覆金屬積層板,係於本揭示之預浸物的表面具備金屬箔。例如,本揭示之覆金屬積層板,係重疊本揭示之預浸物與金屬箔,並進行加熱(硬化)加壓成形而得到。金屬箔並無特別限定,例如可列舉出電解銅箔、軋壓銅箔等之銅箔、鋁箔、重疊此等金屬箔而成之複合箔等。此等金屬箔
中,例如使用銅箔。金屬箔的厚度並無特別限定,例如約為5至105μm。本揭示之覆金屬積層板,亦可分別重疊期望片數之本揭示之預浸物與金屬箔,並進行加熱加壓成形而得到。本揭示之覆金屬積層板,例如使用在印刷基板等。
接著說明本揭示之配線基板。本揭示之配線基板,係具備複數層之絕緣層與配置在該絕緣層間之導體層,絕緣層由本揭示之樹脂組成物與基材所構成。本揭示之配線基板,例如可將形成有電路及通孔之內層板與預浸物重疊於本揭示之覆金屬積層板,並將金屬箔積層於預浸物的表面後,進行加熱(硬化)加壓成形而得到。再者,亦可於表面的金屬箔形成電路及通孔,而構成多層印刷配線基板。
如以上所述,本揭示之預浸物及覆金屬積層板,藉由使用本揭示之樹脂組成物,可降低介電常數及介電損耗角正切。此外,本揭示之配線基板,藉由使用本揭示之樹脂組成物,可具有優異的高頻特性。
以下係列舉實施例來具體說明本揭示之實施形態,惟本揭示之實施形態並不限定於此等實施例。
實施例及比較例所使用之成分如下所示。
SA9000:經甲基丙烯酸改質之聚苯醚(Sabic公司製、數量平均分子量Mn:2,000至3,000)
SA6000:經甲基丙烯酸改質之聚苯醚(Sabic公司製、數量平均分子量Mn:3,000至5,000)
SA90:聚苯醚(Sabic公司製、數量平均分子量Mn:2,000至3,000)
TAIC:異三聚氰酸三烯丙酯(日本化成股份有限公司製)
TAC:三聚氰酸三烯丙酯(日本化成股份有限公司製)
Perbutyl D:過氧化二(三級丁基)(日油股份有限公司製)
Perhexin 25B:2,5-二甲基-2,5-二(過氧化三級丁基)己炔-3(日油股份有限公司製)
Perhexa 25B:2,5-二甲基-2,5-二(過氧化三級丁基)己烷(日油股份有限公司製)
Perbutyl C:過氧化三級丁基異丙苯(日油股份有限公司製)
Perbutyl P:α,α'-二-(三級丁基過氧基)二異丙基苯(日油股份有限公司製)
Perbutyl Z:三級丁基過氧基苄酸酯(日油股份有限公司製)
丁二烯:B-1000(日本曹達股份有限公司製)
聚苯乙烯:PS685(Japan PS股份有限公司製)
丁二烯-苯乙烯共聚物:RIKON184(CRAY VALLEY公司製)
核殼聚矽氧:KMP-600(Shin-Etsu Silicone股份有限公司製)
二氧化矽粒子:SFP-130MC(電氣化學工業股份有限公
司製)
以表1所示之比率混合表1所示之成分,且相對於成分(A)與成分(B)與成分(C)之合計量100質量份,添加30質量份之「SAYTEX8010」(Albemarle Asano股份有限公司製)作為阻燃劑,於室溫(25℃)下攪拌而得到樹脂組成物。所得之樹脂組成物之硬化物的玻璃轉移點(Tg)如表1所示。將所得之樹脂組成物溶解於甲苯而得到樹脂清漆。樹脂組成物與甲苯之質量比為50:50。
將具有100μm的厚度之玻璃織布浸漬於所得之樹脂清漆,使樹脂清漆浸滲玻璃織布。然後於130℃將玻璃織布乾燥7分鐘,而得到具有100μm的厚度之預浸物(樹脂含量:50質量%)。
接著重疊8片所得之預浸物並積層,並將具有18μm的厚度之銅箔積層於該雙面。於4MPa的加壓下加熱90分鐘(195℃),而得到具有0.8mm的厚度之覆銅積層板。
將所得之覆銅積層板的銅箔剝離,並藉由空腔共振器法來測定10GHz下的介電常數及介電損耗角正切。結果如表1所示。再者,將覆銅積層板浸漬於焊料中(288℃)5分鐘後,以覆銅積層板的銅箔是否產生膨脹者,來判斷耐熱性。對3片覆銅積層板進行評估,以3片均未產生膨脹者為「○」,即使有1片產生膨脹者亦為「×」。結
果如表1所示。
如表1所示,可知以0.1至7質量%的範圍含有不含苯環之有機過氧化物之實施例1至8所示之樹脂組成物,該介電損耗角正切低,且耐熱性優異。
以表2所示之比率混合表2所示之成分,且相對於成分(A)與成分(B)與成分(C)之合計量100質量份,添加30質量份之上述阻燃劑(SAYTEX8010),於室溫(25℃)下攪拌而得到樹脂組成物。所得之樹脂組成物之硬化物的玻璃轉移點(Tg)如表2所示。將所得之樹脂組成物溶解於甲苯而得到樹脂清漆。樹脂組成物與甲苯之質量比為50:50。
將具有100μm的厚度之玻璃織布浸漬於所得之樹脂清漆,使樹脂清漆浸滲玻璃織布。然後於130℃將玻璃織布乾燥7分鐘,而得到具有130μm的厚度之預浸物(樹脂含量:50質量%)。
接著重疊8片所得之預浸物並積層,並將具有18μm的厚度之銅箔積層於該雙面。於4MPa的加壓下加熱90分鐘(195℃),使預浸物中的樹脂硬化,而得到具有0.8mm的厚度之覆銅積層板。
將所得之覆銅積層板的銅箔剝離,並藉由空腔共振器法來測定10GHz下的介電常數及介電損耗角正切。結果如表2所示。再者,將覆銅積層板分別浸漬於焊料中(288℃及300℃)5分鐘後,以在覆銅積層板的銅箔上是否產生膨脹者,來判斷耐熱性。對3片覆銅積層板進行
評估,以於288℃及300℃時3片均未產生膨脹者為「○」。此外,關於銅撕離,係藉由進行90度剝離試驗來測定。結果如表2所示。
如表2所示,可知使用以0.5至20質量%的比率含有聚丁二烯與聚苯乙烯之混合物或丁二烯-苯乙烯共聚物(成分(D))之實施例9至18所示之樹脂組成物而得到之覆銅積層板,該介電損耗角正切低,且耐熱性及密合性優異。
以表3所示之比率混合表3所示之成分,且相對於成分(A)與成分(B)與成分(C)之合計量100質量份,添加30質量份之上述阻燃劑(SAYTEX8010),於室溫(25℃)下攪拌而得到樹脂組成物。所得之樹脂組成物之硬化物的玻璃轉移點(Tg)如表3所示。將所得之樹脂組成物溶解於甲苯而得到樹脂清漆。樹脂組成物與甲苯之質量比為50:50。
將具有100μm的厚度之玻璃織布浸漬於所得之樹脂清漆,使樹脂清漆浸滲玻璃織布。然後於130℃將玻璃織布乾燥7分鐘,而得到具有130μm的厚度之預浸物(樹脂含量:50質量%)。
接著重疊8片所得之預浸物並積層,並將具有18μm的厚度之銅箔積層於該雙面。於4MPa的加壓下加熱90分鐘(195℃),使預浸物中的樹脂硬化,而得到具有0.8mm的厚度之覆銅積層板。
將所得之覆銅積層板的銅箔剝離,並藉由空腔共振器法來測定10GHz下的介電常數及介電損耗角正切。結果如表3所示。再者,將覆銅積層板分別浸漬於焊
料中(288℃及300℃)5分鐘後,以在覆銅積層板的銅箔上是否產生膨脹者,來判斷耐熱性。對3片覆銅積層板進行評估,以於288℃及300℃時3片均未產生膨脹者為「○」。結果如表3所示。
接著於所得之覆銅積層板上形成通孔後,形成電路(配線層)及通孔導體而得到內層板。重疊該內層板與預浸物,於4MPa的加壓下加熱90分鐘(195℃),而得到配線基板。通孔導體與配線層之連接性,係以掃描型電子顯微鏡觀察配線基板的剖面來確認。當通孔導體與配線層未產生問題而能夠連接時,該連接性設為「○」。結果如表3所示。
如表3所示,可知以0.1至5質量%的比率含有具有核殼構造之聚矽氧系聚合物(成分(E))之實施例19至24所示之樹脂組成物,該介電損耗角正切低,且耐熱性優異。此外,可知使用該樹脂組成物製造配線基板時,能夠得到通孔導體與配線層之連接可靠度高之配線基板。
以表4所示之比率混合表4所示之成分,且相對於成分(A)與成分(B)與成分(C)之合計量100質量份,添加30質量份之上述阻燃劑(SAYTEX8010),接著以使樹脂組成物:甲苯之質量比成為表4所示之比率之方式添加甲苯,於室溫(25℃)下攪拌而得到樹脂組成物(樹脂清漆)。
將具有100μm的厚度之玻璃織布浸漬於所得之樹脂清漆,使樹脂清漆浸滲玻璃織布。然後以表4所示之風量,於130℃將玻璃織布乾燥7分鐘,而得到具有100μm的厚度之預浸物(樹脂含量:50質量%、玻璃織布:50質量%)。然後使用氣相層析儀,測定預浸物中之甲苯的含量(殘存量)。結果如表4所示。
接著重疊8片所得之預浸物而調製出積層體。將具有18μm的厚度之銅箔積層於所得之積層體的雙面。於4MPa的加壓下加熱90分鐘(195℃),使預浸物中的樹脂硬化,而得到具有0.8mm的厚度之覆銅積層板。硬化後之預浸物的玻璃轉移點(Tg)如表4所示。
將所得之覆銅積層板的銅箔剝離,並藉由
空腔共振器法來測定10GHz下的介電常數及介電損耗角正切。結果如表4所示。再者,將覆銅積層板浸漬於焊料中(288℃)5分鐘後,以在覆銅積層板的銅箔上是否產生膨脹者,來判斷耐熱性。對3片覆銅積層板進行評估,以3片均未產生膨脹者為「○」。此外,關於銅撕離,係藉由進行90度剝離試驗來測定。結果如表4所示。
如表4所示,可知於甲苯含量為0.5質量%
以下之實施例25至30的預浸物中,可得到介電常數及介電損耗角正切低,且高的玻璃轉移點及耐熱性者。此外,從90度剝離試驗的結果中,可知銅箔不易剝離。
Claims (10)
- 一種樹脂組成物,其含有:存在於主鏈的末端之羥基已藉由乙烯性不飽和化合物改質過之聚苯醚(A)、選自異三聚氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種(B)、以及不含苯環之有機過氧化物(C);當前述成分(A)、前述成分(B)及前述成分(C)之合計量((A)+(B)+(C))為100質量%時,前述成分(C)之含有比率為0.1至7質量%。
- 如申請專利範圍第1項所述之樹脂組成物,其中當前述成分(A)、前述成分(B)及前述成分(C)之合計量((A)+(B)+(C))為100質量%時,前述成分(A)之含有比率為29.9至90質量%,前述成分(B)之含有比率為9.9至70質量%。
- 如申請專利範圍第1或2項所述之樹脂組成物,更含有:聚丁二烯與聚苯乙烯之混合物或丁二烯-苯乙烯共聚物(D),且當前述成分(A)、前述成分(B)、前述成分(C)及前述成分(D)之合計量為100質量%時,前述成分(D)之含有比率為0.5至20質量%。
- 如申請專利範圍第1至3項中任一項所述之樹脂組成物,更含有:具有核殼構造之聚矽氧系聚合物(E),且當前述成分(A)、前述成分(B)、前述成分(C)及前述成分(E)之合計量為100質量%時,前述成分(E)之含有比率 為0.1至5質量%。
- 如申請專利範圍第1至4項中任一項所述之樹脂組成物,更含有二氧化矽。
- 一種預浸物,其包含如申請專利範圍第1至5項中任一項所述之樹脂組成物與基材。
- 如申請專利範圍第6項所述之預浸物,其中甲苯含量為0.5質量%以下。
- 一種覆金屬積層板,係於如申請專利範圍第6或7項所述之預浸物的表面具備金屬箔。
- 如申請專利範圍第8項所述之覆金屬積層板,其中前述預浸物中的樹脂組成物含有前述成分(A)與前述成分(B)之交聯物。
- 一種配線基板,其具備複數層之絕緣層與配置在該絕緣層間之導體層,前述絕緣層係由如申請專利範圍第1至5項中任一項所述之樹脂組成物與基材所構成。
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TWI688607B (zh) * | 2018-10-04 | 2020-03-21 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成之物品 |
TWI704049B (zh) * | 2018-02-27 | 2020-09-11 | 日商京瓷股份有限公司 | 預浸體及電路基板用積層板 |
TWI735163B (zh) * | 2019-02-20 | 2021-08-01 | 日商旭化成股份有限公司 | 含聚苯醚之樹脂組合物 |
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WO2020027189A1 (ja) | 2018-07-31 | 2020-02-06 | 株式会社カネカ | 金属張積層板、プリント配線板およびその製造方法 |
WO2021106931A1 (ja) * | 2019-11-29 | 2021-06-03 | 日本曹達株式会社 | 末端変性ポリブタジエン、金属張積層板用樹脂組成物、プリプレグ、及び金属張積層板 |
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TWI688607B (zh) * | 2018-10-04 | 2020-03-21 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成之物品 |
TWI735163B (zh) * | 2019-02-20 | 2021-08-01 | 日商旭化成股份有限公司 | 含聚苯醚之樹脂組合物 |
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