TW201622120A - 攝像元件內置基板及其製造方法、及攝像裝置 - Google Patents
攝像元件內置基板及其製造方法、及攝像裝置 Download PDFInfo
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Abstract
本發明提供一種內置彎曲之攝像元件之攝像元件內置基板。
攝像元件內置基板具備芯層、第1配線層、空腔部、第2配線層、樹脂部、及攝像元件。上述芯層具有由金屬形成之芯材。上述第1配線層積層於上述芯層。上述空腔部貫通上述芯材及上述第1配線層。上述第2配線層具有設置於與上述空腔部對向之位置處之接地部,且積層於相對於上述芯層與上述第1配線層相反之側。上述樹脂部具有配置於上述空腔部內且支持於上述第2配線層之底面、由上述芯材所支持之側面、及設置於與上述底面相反之側之彎曲面。
Description
本發明係關於一種攝像元件內置基板及其製造方法、及攝像裝置。
近年來,伴隨著智慧型手機等移動終端機之薄型化,對搭載於移動終端裝置之攝像裝置亦要求薄型化。於專利文獻1~3中揭示有能夠實現攝像裝置之薄型化之技術。於該等技術中,實現了搭載於攝像裝置之攝像元件或透鏡單元之薄型化。
更具體而言,於該等技術中,使用薄型攝像元件,並且根據透鏡單元之像差使攝像元件彎曲。藉由使攝像元件彎曲,例如無需於透鏡單元設置像差修正用透鏡,因此能夠實現透鏡單元之薄型化。
[專利文獻1]日本專利04604307號公報
[專利文獻2]日本專利特開2004-063776號公報
[專利文獻3]日本專利特開2001-284564號公報
上述專利文獻之攝像元件為薄型,但因使攝像元件彎曲而導致攝像裝置之厚度方向上之攝像元件之尺寸變大。亦即,於使攝像元件彎曲之技術中,雖能夠實現透鏡單元之薄型化,但攝像元件本身會使
攝像裝置之厚度增大。
鑒於如上所述之情況,本發明之目的在於提供一種內置彎曲之攝像元件之攝像元件內置基板及其製造方法、及攝像裝置。
為了達成上述目的,本發明之一形態之攝像元件內置基板具備芯層、第1配線層、空腔部、第2配線層、樹脂部、及攝像元件。
上述芯層具有由金屬形成之芯材。
上述第1配線層積層於上述芯層。
上述空腔部貫通上述芯材及上述第1配線層。
上述第2配線層具有設置於與上述空腔部對向之位置處之接地部,且積層於相對於上述芯層與上述第1配線層相反之側。
上述樹脂部具有配置於上述空腔部內且支持於上述第2配線層之底面、由上述芯材所支持之側面、及設置於與上述底面相反之側之彎曲面。
上述攝像元件於上述空腔部內沿上述彎曲面被接著。
於該構成之攝像元件內置基板中,攝像元件被收容於空腔部內,因此厚度不會因攝像元件之彎曲形狀而變化。因此,於該攝像元件內置基板中,能夠不伴有其厚度之增大,而根據攝像元件之彎曲形狀實現搭載於攝像裝置之透鏡單元之薄型化。而且,於該攝像元件內置基板中,獲得較由金屬形成之芯材高之剛性,並且保持攝像元件之樹脂部之側面由芯材所保持,因此於在厚度方向施力之情形時亦不易產生變形。進而,於該攝像元件內置基板中,藉由設置於與攝像元件對向之位置處之接地部,將來自第2配線層之外側之雜訊遮斷,因此能夠利用攝像元件形成良好之圖像。
亦可為,上述彎曲面朝向上述第2配線層凹陷。
根據該構成,能提供與具有特定像差之透鏡單元對應之攝像元
件內置基板。
亦可為,上述攝像元件較上述彎曲面更朝外側延伸。
根據該構成,於將攝像元件接著於樹脂部之彎曲面時,能防止多餘之接著劑附著於攝像元件之表面。
亦可為,上述彎曲面較上述攝像元件更朝外側延伸。
根據該構成,攝像元件之下表面之整個區域被保持於樹脂部之彎曲面,因此能更良好地確保攝像元件之準確之位置及形狀。又,於該構成之攝像元件中,外周部被保持於樹脂部之彎曲面,因此不易因引線接合時對該外周部所施加之衝擊而產生變形。
亦可為,上述空腔部由上述第2配線部封閉。
根據該構成,能防止異物自第2配線層側混入至空腔部內,並且能確保在第2配線層中能設置配線等之區域較大。
亦可為,上述接地部電性連接於上述芯材。
於該構成中,芯材作為接地部之一部分發揮功能,因此攝像元件更不易受到來自外部之雜訊之影響。
於本發明之一形態之攝像元件內置基板之製造方法中,將用以於樹脂形成彎曲面之模具構件配置於貫通由金屬形成之芯材之空腔部內。
向上述空腔部內填充上述樹脂。
於配置上述模具構件並填充上述樹脂之後,使上述樹脂硬化。
於使上述樹脂硬化之後,藉由去除上述模具構件而露出上述樹脂之上述彎曲面。
於露出上述彎曲面之後,沿上述彎曲面接著攝像元件。
於該構成中,能藉由使用模具構件而容易地形成具有彎曲面之樹脂部。
本發明之一形態之攝像裝置具備透鏡單元、芯層、第1配線層、
空腔部、第2配線層、樹脂部、及攝像元件。
上述透鏡單元構成為能夠使外部光透過。
上述芯層與上述透鏡單元對向配置,且具有由金屬形成之芯材。
上述第1配線層積層於上述芯層之上述透鏡單元側。
上述空腔部貫通上述芯材及上述第1配線層。
上述第2配線層具有設置於與上述空腔部對向之位置處之接地部,且積層於相對於上述芯層與上述第1配線層相反之側。
上述樹脂部具有配置於上述空腔部內且支持於上述第2配線層之底面、由上述芯材所支持之側面、及設置於與上述底面相反之側且具有與上述透鏡單元之像差相應之形狀的彎曲面。
上述攝像元件於上述空腔部內沿上述彎曲面被接著,受到透過上述透鏡單元之外部光之入射。
本發明能提供一種內置彎曲之攝像元件之攝像元件內置基板及其製造方法、及攝像裝置。
1‧‧‧攝像裝置
10‧‧‧攝像元件內置基板
11‧‧‧攝像元件
11a‧‧‧外緣部
12‧‧‧芯層
13‧‧‧第1配線層
14‧‧‧第2配線層
15‧‧‧接地部
16‧‧‧樹脂部
16a‧‧‧底面
16b‧‧‧側面
16c‧‧‧彎曲面
16x‧‧‧樹脂
16y‧‧‧樹脂構件
16z‧‧‧接著劑
17‧‧‧金屬線
18‧‧‧通孔部
19‧‧‧芯材
20‧‧‧空腔部
21‧‧‧接著劑
22‧‧‧貫通電極
23‧‧‧上表面電極
24‧‧‧絕緣樹脂部
25‧‧‧階差部
100‧‧‧鏡筒部
101‧‧‧透鏡單元
101a~101e‧‧‧透鏡
102‧‧‧透鏡架
102a‧‧‧受光窗
103‧‧‧紅外線截止濾光器
104‧‧‧致動器
105‧‧‧包裝部
110‧‧‧攝像元件內置基板
111‧‧‧攝像元件
116‧‧‧樹脂部
121‧‧‧接著劑
122‧‧‧間隙
F‧‧‧臨時固定膜
M‧‧‧模具構件
P‧‧‧護抗蝕層
S1‧‧‧貫通口
S1-01~S1-12‧‧‧步驟
S2‧‧‧貫通口
S2-01~S2-09‧‧‧步驟
圖1係本發明之一實施形態之攝像裝置之立體圖。
圖2係上述攝像裝置之沿圖1之A-A'線之剖視圖。
圖3係上述攝像裝置之攝像元件內置基板之俯視圖。
圖4係上述攝像元件內置基板之沿圖3之B-B'線之剖視圖。
圖5係圖4之由單點鏈線所包圍之區域之放大圖。
圖6係與上述實施形態相關之攝像元件內置基板之剖視圖。
圖7A係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7B係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7C係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7D係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7E係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7F係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7G係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖7H係上述實施形態之變化例之攝像元件內置基板之剖視圖。
圖8係表示上述攝像元件內置基板之製造方法1之流程圖。
圖9(a)~(f)係表示上述攝像元件內置基板之製造方法1之製造過程之剖視圖。
圖10(g)~(l)係表示上述攝像元件內置基板之製造方法1之製造過程之剖視圖。
圖11係表示上述攝像元件內置基板之製造方法2之流程圖。
圖12(a)~(d)係表示上述攝像元件內置基板之製造方法2之製造過程之剖視圖。
圖13(e)~(h)係表示上述攝像元件內置基板之製造方法2之製造過程之剖視圖。
圖14係表示利用上述製造方法2所製造之攝像元件內置基板之變化例之剖視圖。
以下,一面參照圖式,一面說明本發明之實施形態。
圖1係本發明之一實施形態之攝像裝置1之立體圖。圖2係攝像裝置1之沿圖1所示之A-A'線之剖視圖。攝像裝置1能夠用於多種多樣之用途,尤其適於作為智慧型手機等移動終端機之類的要求薄型化之電子機器之用途。
攝像裝置1具備鏡筒部100、及攝像元件內置基板10。攝像元件內置基板10設置於鏡筒部100之底部,且具有朝向鏡筒部100內配置之
攝像元件11。
於攝像元件內置基板10中,使用薄型且具有可撓性之平板狀之攝像元件11。攝像元件11之厚度較佳為100μm以下,進而較佳為50μm以下。使攝像元件11彎曲,攝像元件11之檢測面即上表面成為凹狀。攝像元件11例如構成為CMOS(complementary metal oxide semiconductor,互補金氧半導體)影像感測器或CCD(charge-coupled device,電荷耦合元件)影像感測器。
鏡筒部100具有包含五片透鏡101a~101e之透鏡單元101、及保持透鏡單元101之透鏡架102。透鏡單元101係與攝像元件11之上方對向地配置,且以透鏡101a~101e之光軸通過攝像元件11之中央部之方式構成。
又,鏡筒部100具有配置於透鏡單元101與攝像元件11之間之紅外線截止濾光器103、自動調焦用之致動器104、及作為殼體設置之包裝部105。
於透鏡架102,在最上部之透鏡101a之位置,設置有用以接受外部光之受光窗102a。入射至受光窗102a之外部光依次透過透鏡101a~101e及紅外線截止濾光器103,併入射至攝像元件11之凹狀之檢測面。攝像裝置1能夠藉由利用攝像元件11檢測外部光而形成圖像。
透鏡單元101之構成、及攝像元件11之彎曲形狀係以能夠利用攝像元件11形成良好之圖像之方式決定。亦即,攝像元件之彎曲形狀係與透鏡單元101之構成對應地適當決定。再者,透鏡單元101並不限定於特定之構成,透鏡之形狀或片數能夠適當決定。
例如,攝像元件11能設為如抵消透鏡單元101之像差之彎曲形狀。藉此,透鏡單元101能減少像差修正用透鏡等,故而薄型化。又,於此種透鏡單元101中,無需考慮其像差,因此能夠容易地進行設計,並且能夠實現更簡單之構成。
本實施形態之攝像元件內置基板10具有將彎曲之攝像元件11之整體收容於內部之構成。因此,於攝像元件內置基板10中,厚度不會因攝像元件11之彎曲形狀而增大,薄型形狀得以保持。以下,對攝像元件內置基板10之詳細構成進行說明。
圖3係本實施形態之攝像元件內置基板10之俯視圖。圖4係攝像元件內置基板10之沿圖3所示之B-B'線之剖視圖。攝像元件內置基板10具備芯層12、第1配線層13、及第2配線層14。第1配線層13及第2配線層14包含導體部(各圖中之斜線區域)與絕緣體部(各圖中之點區域)。
芯層12具有由銅等金屬形成之芯材19。芯材19構成為芯層12之基材,且為連續之1片平板。於攝像元件內置基板10中,藉由金屬製之芯材19之作用獲得較高之剛性。第1配線層13積層於芯層12之上表面,第2配線層14積層於芯層12之下表面。
於攝像元件內置基板10之中央區域,設置有貫通芯層12及第1配線層13之空腔部20。亦即,空腔部20具有以第2配線層14之上表面為底面之凹形狀。空腔部20形成用以收容攝像元件11之空間。
空腔部20並不限定於特定之形狀,只要能夠收容攝像元件11,便能夠設為任意形狀。但,為了攝像元件內置基板10之小型化,較佳為沿攝像元件11之輪廓形成空腔部20,使空腔部20與攝像元件11之間之間隙較窄。於圖3及圖4所示之例中,空腔部20係沿攝像元件11之矩形之輪廓形成為大致矩形。
空腔部20內之攝像元件11係藉由使用由金等形成之金屬線17之引線接合而連接於位於第1配線層13之上表面的上表面電極23。又,第1配線層13與第2配線層14由貫通電極22連接。貫通電極22插通形成於
芯層12之通孔部18內,且利用絕緣樹脂部24而與芯材19絕緣。
第2配線層14自下側無間隙地封閉空腔部20。於本實施形態中,可不於第2配線層14設置開口部等,而於空腔部20內設置彎曲之攝像元件11,詳細情況於下文敍述。藉此,能防止異物自第2配線層14之下方混入至空腔部20內,並且能確保第2配線層14中能設置配線等之區域足夠寬廣。
第2配線層14於與空腔部20之間具有隔著絕緣層形成之接地部15。接地部15係沿空腔部20之底面由金屬形成,且能夠將來自第2配線層14下方之雜訊與空腔部20遮斷。接地部15並不限定於特定之構成,例如可構成為配線狀、平板狀、網狀。
又,芯材19電性連接於接地部15,構成為攝像元件內置基板10中之接地部之一部分。藉此,將來自外部之雜訊更良好地與空腔部20遮斷。如此,於攝像元件內置基板10中,來自外部之雜訊之影響不易及於空腔部20內之攝像元件11,因此能夠利用攝像元件11良好地形成圖像。
再者,並非必須為芯材19連接於接地部15之構成。例如,芯材19亦可構成為攝像元件內置基板10之配線之一部分,亦可不具有攝像元件內置基板10中之電性功能。
攝像元件內置基板10具備於空腔部20內保持攝像元件11之樹脂部16。樹脂部16具有支持於第2配線層14之上表面之底面16a、由芯材19所支持之側面16b、及設置於與第2配線層14相反之側之彎曲面16c。
樹脂部16之底面16a與第2配線層14之上表面之位於空腔部20內之整個區域密接。又,樹脂部16之側面16b遍及其全周地與芯材19密接。根據此種構成,樹脂部16中,底面16a被第2配線層14之上表面所約束,且側面16b被芯材19所約束,因此樹脂部16之形狀不易受損。
又,樹脂部16之側面16b被保持於芯材19,藉此,攝像元件內置基板10之剛性提高。亦即,於不存在芯層12及第1配線層13之空腔部20中,第2配線層14因於攝像元件內置基板10之厚度方向施加之力而容易變形,但於芯層12中,與芯材19成為一體之樹脂部16將發揮作用以抑制第2配線層14之變形。
如此,於攝像元件內置基板10中,不易因於厚度方向施加之力而產生變形,因此能防止損傷之發生,並且確保攝像元件11之準確之位置及形狀。
於樹脂部16之彎曲面16c上,利用接著劑21而接著有攝像元件11。使攝像元件11與樹脂部16之間之接著劑21之厚度均勻。藉此,攝像元件11沿彎曲面16c呈凹狀地彎曲。亦即,樹脂部16之彎曲面16c保持攝像元件11,並且界定攝像元件11之形狀。
如上所述,攝像元件11之彎曲形狀係與透鏡單元101之構成對應地決定為特定形狀,因此樹脂部16之彎曲面16c係以將攝像元件11界定為該特定形狀之方式構成。典型而言,樹脂部16之彎曲面16c係與攝像元件11之彎曲形狀同樣地形成。
接著於樹脂部16之彎曲面16c之攝像元件11收於空腔部20內之芯層12。如此,於攝像元件內置基板10中,藉由設置能夠收容攝像元件11之空腔部20,即便使攝像元件11彎曲,厚度亦不會增大。
於普通基板中,若設置能夠收容攝像元件11之空腔部,則剛性便會減弱,容易產生變形或損傷。就此點而言,於本實施形態之攝像元件內置基板10中,即便設置空腔部20,亦因芯層12之芯材19而獲得充分之剛性,因此不易產生變形或損傷。
圖5係圖4之由單點鏈線包圍之區域之放大圖。樹脂部16之彎曲面16c形成得較攝像元件11之下表面稍小,攝像元件11之周緣部較樹脂部16之彎曲面16c更朝外側延伸。亦即,於攝像元件11之下表面具
有自彎曲面16c延出之外緣部11a。
藉此,於將攝像元件11接著於樹脂部16之彎曲面16c時,多餘之接著劑21被排出至外緣部11a之外側。因此,能防止如下情況:於攝像元件內置基板10中,多餘之接著劑21附著於攝像元件11之檢測面,阻礙攝像元件11對外部光之檢測。
圖6係與上述實施形態相關之攝像元件內置基板110之剖視圖。關於攝像元件內置基板110,對與上述實施形態之攝像元件內置基板10相同之構成標註相同符號,並適當省略其說明。
攝像元件內置基板110具有普通之平板狀之攝像元件111。攝像元件111利用接著劑121接著於空腔部20之底面。於空腔部20內,設置有將攝像元件111與芯材19隔開之樹脂部116。樹脂部116與攝像元件111隔開,於攝像元件111與樹脂部116之間形成有間隙122。
於攝像元件內置基板110中,與上述實施形態之攝像元件內置基板10不同,攝像元件111並非彎曲形狀。因此,於攝像元件內置基板110中,未獲得上述實施形態之透鏡單元之薄型化之效果。
又,於攝像元件內置基板110中,與上述實施形態之攝像元件內置基板10不同,於攝像元件111與樹脂部116之間形成有間隙122。因此,攝像元件內置基板110中,於與間隙122對應之部分,第2配線層14容易變形。亦即,攝像元件內置基板110之剛性較上述實施形態之攝像元件內置基板10變弱。
圖7A~圖7H係上述實施形態之變化例之攝像元件內置基板10之剖視圖。以下,一面適當參照圖式,一面對攝像元件內置基板10之變化例進行說明。
於攝像元件內置基板10中,只要攝像元件11收於空腔部20內,則無論芯層12之厚度如何,均能獲得與上述實施形態相同之效果。
例如,亦可如圖7A所示,芯層12相對於攝像元件11之尺寸較厚地形成。又,亦可如圖7B所示,較薄地形成芯層12,攝像元件11之外周部進入至第1配線層13內。
攝像元件內置基板10只要以樹脂部16之彎曲面16c能夠保持攝像元件11並且界定攝像元件11之形狀之方式構成即可。
例如,亦可如圖7C所示,樹脂部16之彎曲面16c形成為與攝像元件11之下表面同等之大小。又,亦可如圖7D所示,樹脂部16之彎曲面16c形成得較攝像元件11之下表面大,例如,可延伸至芯層12之上表面。
於該等構成中,與上述實施形態相比,不易獲得參照圖5所說明之防止多餘之接著劑21附著於攝像元件11之檢測面之效果。但,藉由接著劑21之量之最佳化而減少多餘之接著劑21等,藉此能夠抑制多餘之接著劑21造成之不良影響。
另一方面,於該等構成中,攝像元件11之下表面之整個區域被樹脂部16之彎曲面16c所約束,因此較上述實施形態進而良好地獲得確保攝像元件11之準確之位置及形狀之效果。又,攝像元件11之外周部被保持於樹脂部16之彎曲面16c,因此即便於引線接合時對攝像元件11外周部施加衝擊,亦不易產生攝像元件11之變形。
於攝像元件內置基板10中,只要攝像元件11收於空腔部20內,則無論攝像元件11之位置如何,均能獲得與上述實施形態相同之效果。
例如,亦可如圖7E所示,將攝像元件11配置於空腔部20之較深之位置,攝像元件11之下表面之中央部與第2配線層14之上表面(空腔
部20之底面)相接。又,亦可如圖7F所示,攝像元件11之中央部進入至第2配線層14內。
於該等構成中,攝像元件11之中央部未被保持於樹脂部16之彎曲面16c,因此用以保持攝像元件11之彎曲形狀之力較上述實施形態變弱。但,藉由使用可撓性高之攝像元件11,即便為該等構成,亦能充分地保持攝像元件11之彎曲形狀。
另一方面,於該等構成中,能將攝像元件11收容於空腔部20內較低之位置,因此能夠使芯層12更薄。藉此,能實現攝像元件內置基板10之進一步薄型化。
於攝像元件內置基板10之樹脂部16中,只要彎曲面16c能夠保持攝像元件11並且界定攝像元件11之形狀即可,關於彎曲面16c以外之構成,能夠根據上述實施形態適當變更。
例如,亦可如圖7G所示,於樹脂部16,於較彎曲面16c更靠外側設置有階差部25。但,階差部25必須構成為不與攝像元件11接觸,以免阻礙攝像元件11與樹脂部16之彎曲面16c之密接。
如上所述,於攝像元件內置基板10中,與透鏡單元101之構成對應地決定樹脂部16之彎曲面16c及攝像元件11之彎曲形狀。因此,樹脂部16之彎曲面16c及攝像元件11之彎曲形狀根據透鏡單元101構成之不同而發生各種變化。
例如,如圖7H所示,攝像元件內置基板10中之樹脂部16之彎曲面16c及攝像元件11之彎曲形狀有時亦會視透鏡單元101之構成而成為凸形狀。
圖8係表示攝像元件內置基板10之製造方法1之流程圖。圖9及圖10係表示攝像元件內置基板10之製造方法1之製造過程之剖視圖。以下,一面參照圖9及圖10,一面按照圖8對攝像元件內置基板10之製造方法1進行說明。
‧步驟S1-01
如圖9(a)所示,準備形成有與空腔部20對應之貫通口S1之包含芯材19之芯層12。
‧步驟S1-02
如圖9(b)所示,於芯層12之下表面貼附臨時固定膜F。
‧步驟S1-03
如圖9(c)所示,將用以形成樹脂部16之彎曲面16c之模具構件M以使凸狀之彎曲面朝向上側之方式***至貫通口S1內,並貼附至臨時固定膜F。
‧步驟S1-04
如圖9(d)所示,將樹脂部16填充至貫通口S1內並使其硬化。再者,步驟S1-03之模具構件M之配置亦可於將樹脂16於貫通口S1填充樹脂部16之後、使樹脂部16硬化之前進行。
‧步驟S1-05
如圖9(e)所示,使臨時固定膜F自芯層12剝離。
‧步驟S1-06
如圖9(f)所示,使芯層12上下翻轉,並於芯層12之上表面形成第1配線層13,於芯層12之下表面形成第2配線層14。
‧步驟S1-07
如圖10(g)所示,於第1配線層13之上表面及第2配線層14之下表面分別貼附保護抗蝕層P。
‧步驟S1-08
如圖10(h)所示,於第1配線層13及芯層12形成空腔部20。
‧步驟S1-09
如圖10(i)所示,藉由蝕刻將模具構件M自空腔部20去除,使樹脂部16之彎曲面16c露出。
‧步驟S1-10
如圖10(j)所示,使保護抗蝕層P自第1配線層13及第2配線層14剝離。
‧步驟S1-11
如圖10(k)所示,利用接著劑21將攝像元件11接著於樹脂部16之彎曲面16c。
‧步驟S1-12
如圖10(l)所示,藉由引線接合將攝像元件11與第1配線層13連接,完成攝像元件內置基板10。
於以上所說明之製造方法1中,藉由使用模具構件M,能簡單且準確地形成樹脂部16之彎曲面16c。模具構件M只要具有用以形成樹脂部16之彎曲面16c之彎曲面即可,並不限於圖中所示之形狀。模具構件M例如亦可具有設置於彎曲面之外側之平坦面。
圖11係表示攝像元件內置基板10之製造方法2之流程圖。圖12及圖13係表示攝像元件內置基板10之製造方法2之製造過程之剖視圖。以下,一面參照圖12及圖13,一面按照圖11對攝像元件內置基板10之製造方法2進行說明。
‧步驟S2-01
如圖12(a)所示,準備形成有與空腔部20之外周部對應之貫通口S2之包含芯材19之芯層12。
‧步驟S2-02
如圖12(b)所示,將樹脂16x填充至貫通口S2並使其硬化。
‧步驟S2-03、S2-04
如圖12(c)所示,於芯層12之上表面形成第1配線層13,於芯層12之下表面形成第2配線層14。而且,於第1配線層13之上表面及第2配線層14之下表面分別貼附保護抗蝕層P。
‧步驟S2-05
如圖12(d)所示,於第1配線層13及芯層12形成空腔部20。
‧步驟S2-06
如圖13(e)所示,使保護抗蝕層P自第1配線層13及第2配線層14剝離。
‧步驟S2-07
如圖13(f)所示,將具有彎曲面16c之樹脂構件16y***至空腔部20內,並利用接著劑16z接著於第2配線層14及樹脂16x。藉此,形成包含樹脂16x、樹脂構件16y、及接著劑16z之樹脂部16。
‧步驟S2-08
如圖13(g)所示,利用接著劑21將攝像元件11接著於樹脂構件16y之彎曲面16c。
‧步驟S2-09
如圖13(h)所示,藉由引線接合將攝像元件11與第1配線層13連接,完成攝像元件內置基板10。
於以上所說明之製造方法2中,藉由預先準備具有彎曲面16c之樹脂構件16y,能利用簡單之製程來製造攝像元件內置基板10。
製造方法2所使用之樹脂構件16y之形狀能夠適當決定。例如,亦可如圖14所示之攝像元件內置基板10般於樹脂構件16y之彎曲面16c之外側形成有平坦面。
以上,對本發明之實施形態進行了說明,但本發明當然並不僅
限定於上述實施形態,能於不脫離本發明之主旨之範圍內添加各種變更。
10‧‧‧攝像元件內置基板
11‧‧‧攝像元件
12‧‧‧芯層
13‧‧‧第1配線層
14‧‧‧第2配線層
15‧‧‧接地部
16‧‧‧樹脂部
16a‧‧‧底面
16b‧‧‧側面
16c‧‧‧彎曲面
17‧‧‧金屬線
18‧‧‧通孔部
19‧‧‧芯材
20‧‧‧空腔部
21‧‧‧接著劑
22‧‧‧貫通電極
23‧‧‧上表面電極
24‧‧‧絕緣樹脂部
Claims (8)
- 一種攝像元件內置基板,其具備:芯層,其具有由金屬形成之芯材;第1配線層,其積層於上述芯層;空腔部,其貫通上述芯材及上述第1配線層;第2配線層,其具有設置於與上述空腔部對向之位置處之接地部,且積層於相對於上述芯層與上述第1配線層相反之側;樹脂部,其具有配置於上述空腔部內且支持於上述第2配線層之底面、由上述芯材所支持之側面、及設置於與上述底面相反之側之彎曲面;及攝像元件,其於上述空腔部內沿上述彎曲面被接著。
- 如請求項1之攝像元件內置基板,其中上述彎曲面朝向上述第2配線層凹陷。
- 如請求項1或2之攝像元件內置基板,其中上述攝像元件較上述彎曲面更朝外側延伸。
- 如請求項1或2之攝像元件內置基板,其中上述彎曲面較上述攝像元件更朝外側延伸。
- 如請求項1至4中任一項之攝像元件內置基板,其中上述空腔部由上述第2配線層封閉。
- 如請求項1至5中任一項之攝像元件內置基板,其中上述接地部電性連接於上述芯材。
- 一種攝像元件內置基板之製造方法,其係將用以於樹脂形成彎曲面之模具構件配置於貫通由金屬形成之芯材之空腔部內,將上述樹脂填充至上述空腔部內, 於配置上述模具構件並填充上述樹脂之後,使上述樹脂硬化,於使上述樹脂硬化之後,藉由將上述模具構件去除,而使上述樹脂之上述彎曲面露出,且於使上述彎曲面露出之後,沿上述彎曲面接著攝像元件。
- 一種攝像裝置,其具備:透鏡單元,其構成為能夠使外部光透過;芯層,其與上述透鏡單元對向配置,且具有由金屬形成之芯材;第1配線層,其積層於上述芯層之上述透鏡單元側;空腔部,其貫通上述芯材及上述第1配線層;第2配線層,其具有設置於與上述空腔部對向之位置處之接地部,且積層於相對於上述芯層與上述第1配線層相反之側;樹脂部,其具有配置於上述空腔部內且支持於上述第2配線層之底面、由上述芯材所支持之側面、及設置於與上述底面相反之側且具有與上述透鏡單元之構成對應之形狀的彎曲面;及攝像元件,其於上述空腔部內沿上述彎曲面被接著,受到透過上述透鏡單元之外部光之入射。
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