TW201612917A - Method for producing conductive coating film, and conductive coating film - Google Patents

Method for producing conductive coating film, and conductive coating film

Info

Publication number
TW201612917A
TW201612917A TW104122325A TW104122325A TW201612917A TW 201612917 A TW201612917 A TW 201612917A TW 104122325 A TW104122325 A TW 104122325A TW 104122325 A TW104122325 A TW 104122325A TW 201612917 A TW201612917 A TW 201612917A
Authority
TW
Taiwan
Prior art keywords
coating film
conductive coating
insulating substrate
resin layer
present
Prior art date
Application number
TW104122325A
Other languages
Chinese (zh)
Inventor
Takeshi Yatsuka
Chiho Ito
Original Assignee
Toda Kogyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toda Kogyo Corp filed Critical Toda Kogyo Corp
Publication of TW201612917A publication Critical patent/TW201612917A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

The purpose of the present invention is to provide a conductive coating film which is provided on an insulating substrate using a copper paste and which exhibits not only excellent electrical conductivity but also improved adhesion to the insulating substrate. A conductive coating film according to the present invention is produced by: arranging, on an insulating substrate, a resin layer that contains a heterocyclic compound containing nitrogen in a heterocyclic ring and/or a hydrazide compound; forming a copper powder-containing coating film on the resin layer using a copper paste; and subsequently subjecting the coating film to a heat treatment in a non-oxidizing gas atmosphere.
TW104122325A 2014-07-14 2015-07-09 Method for producing conductive coating film, and conductive coating film TW201612917A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014144244 2014-07-14
JP2015090636 2015-04-27

Publications (1)

Publication Number Publication Date
TW201612917A true TW201612917A (en) 2016-04-01

Family

ID=55078371

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122325A TW201612917A (en) 2014-07-14 2015-07-09 Method for producing conductive coating film, and conductive coating film

Country Status (5)

Country Link
JP (1) JP6547748B2 (en)
KR (1) KR20170032275A (en)
CN (1) CN106663504A (en)
TW (1) TW201612917A (en)
WO (1) WO2016009873A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795879B (en) 2021-08-20 2023-03-11 柏群科技有限公司 Surface binding agent and method of treating substrate surface

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5053495A (en) 1973-09-12 1975-05-12
JPS61266241A (en) 1985-05-21 1986-11-25 株式会社日立製作所 Surface treating method of copper
JP2561537B2 (en) 1989-03-30 1996-12-11 真空冶金株式会社 Metal paste and manufacturing method thereof
JPH08311658A (en) 1995-05-17 1996-11-26 Nippon Parkerizing Co Ltd Composition for surface treatment of copper based metallic material
TW200626358A (en) * 2004-11-30 2006-08-01 Nippon Steel Chemical Co Copper-clad laminate
JP5329960B2 (en) 2006-08-10 2013-10-30 新日鉄住金化学株式会社 Method for modifying surface of polyimide resin layer and method for producing metal-clad laminate
US20120168075A1 (en) * 2008-03-21 2012-07-05 Enthone Inc. Adhesion promotion of metal to laminate with multi-functional molecular system
JP5453789B2 (en) 2008-12-04 2014-03-26 東洋紡株式会社 Metal fine particle dispersion, method for producing metal thin film, and metal thin film
JP4853590B2 (en) 2009-02-18 2012-01-11 東洋紡績株式会社 Metal thin film manufacturing method and metal thin film
JP5564866B2 (en) 2009-09-11 2014-08-06 東洋紡株式会社 Metal thin film manufacturing method and metal thin film
CN102102000A (en) * 2010-12-30 2011-06-22 上海南亚覆铜箔板有限公司 Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process
CN102634167B (en) * 2011-02-10 2014-05-07 台光电子材料股份有限公司 Resin composition
CN107622833A (en) * 2011-05-18 2018-01-23 户田工业株式会社 The manufacture method and conductive coating of conductive coating
JP6047713B2 (en) * 2012-05-11 2016-12-21 石原ケミカル株式会社 Electroless copper plating method

Also Published As

Publication number Publication date
CN106663504A (en) 2017-05-10
JP6547748B2 (en) 2019-07-24
WO2016009873A1 (en) 2016-01-21
KR20170032275A (en) 2017-03-22
JPWO2016009873A1 (en) 2017-05-25

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