TW201607767A - 載件剝離裝置 - Google Patents

載件剝離裝置 Download PDF

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Publication number
TW201607767A
TW201607767A TW104125598A TW104125598A TW201607767A TW 201607767 A TW201607767 A TW 201607767A TW 104125598 A TW104125598 A TW 104125598A TW 104125598 A TW104125598 A TW 104125598A TW 201607767 A TW201607767 A TW 201607767A
Authority
TW
Taiwan
Prior art keywords
peeling
adhesive
carrier
unit
composite panel
Prior art date
Application number
TW104125598A
Other languages
English (en)
Chinese (zh)
Inventor
Toshiharu Kishimura
Takeshi Ishida
Yukinori Nakayama
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW201607767A publication Critical patent/TW201607767A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B13/00—Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
    • B28B13/04—Discharging the shaped articles
    • B28B13/06—Removing the shaped articles from moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
TW104125598A 2014-08-21 2015-08-06 載件剝離裝置 TW201607767A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014168048A JP2016044015A (ja) 2014-08-21 2014-08-21 キャリア剥離装置

Publications (1)

Publication Number Publication Date
TW201607767A true TW201607767A (zh) 2016-03-01

Family

ID=55416027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125598A TW201607767A (zh) 2014-08-21 2015-08-06 載件剝離裝置

Country Status (4)

Country Link
JP (1) JP2016044015A (ko)
KR (1) KR20160023565A (ko)
CN (1) CN105382925A (ko)
TW (1) TW201607767A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016108880A1 (de) * 2016-05-13 2017-11-16 Joachim Jakob Hybridsetter
CN107644950B (zh) * 2017-09-22 2019-06-25 武汉华星光电技术有限公司 一种对柔性面板和玻璃基板进行分离的装置及方法
CN111627845B (zh) * 2020-07-30 2020-11-13 中芯集成电路制造(绍兴)有限公司 拆键合装置及其拆键合的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004017623A (ja) 2002-06-20 2004-01-22 Murata Mfg Co Ltd キャリアフィルム剥離方法およびキャリアフィルム剥離装置
CN100579333C (zh) * 2003-01-23 2010-01-06 东丽株式会社 电路基板用部件、电路基板的制造方法及电路基板的制造装置
JP4482757B2 (ja) * 2005-01-19 2010-06-16 Ｊｐテック株式会社 シート材貼付装置
KR100983605B1 (ko) * 2008-09-24 2010-09-24 에이피시스템 주식회사 기판 안착 유닛 및 이를 구비하는 기판 접합 장치
TWI492203B (zh) * 2012-12-04 2015-07-11 Au Optronics Corp 顯示面板之製造方法及疊層體
KR101970566B1 (ko) * 2012-12-11 2019-04-22 엘지디스플레이 주식회사 디스플레이패널 제조용 캐리어기판 분리장치 및 디스플레이패널 제조방법
KR101950845B1 (ko) * 2012-12-18 2019-02-22 엘지디스플레이 주식회사 평판 표시패널의 제조장치

Also Published As

Publication number Publication date
JP2016044015A (ja) 2016-04-04
CN105382925A (zh) 2016-03-09
KR20160023565A (ko) 2016-03-03

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