TW201538609A - 含有具有二級胺基之酚醛清漆聚合物的阻劑下層膜形成組成物 - Google Patents
含有具有二級胺基之酚醛清漆聚合物的阻劑下層膜形成組成物 Download PDFInfo
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- 238000012360 testing method Methods 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 description 1
- 229950000329 thiouracil Drugs 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
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Abstract
本發明之課題為提供具有良好的硬遮罩功能,可形成良好的圖型形狀之阻劑下層膜。
其解決手段為一種使用於微影術步驟之阻劑下層膜形成組成物,其含有藉由具有二級胺基之芳香族化合物與醛化合物之反應所得到之酚醛清漆聚合物。
酚醛清漆聚合物為包含以式(1):
□
所示之單位構造者。一種半導體裝置之製造方法,其包含:於半導體基板上藉由本發明之阻劑下層膜形成組成物來形成阻劑下層膜之步驟、於其上形成硬遮罩之步驟、進一步於其上形成阻劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻硬遮罩之步驟、藉由經圖型化之硬遮罩來蝕刻該阻劑下層膜之步驟、及藉由經圖型化之阻劑下層膜來加工半導體基板之步驟。
Description
本發明係關於對半導體基板加工時有效的微影術用阻劑下層膜形成組成物、以及使用該阻劑下層膜形成組成物之阻劑圖型形成法、及半導體裝置之製造方法。
自以往的半導體設備之製造中,係有以使用光阻組成物之微影術來進行微細加工者。前述微細加工,係於矽晶圓等之被加工基板上形成光阻組成物之薄膜,於其上透過描繪有半導體設備之圖型的光罩圖型來照射紫外線等之活性光線,顯影,並以所得之光阻圖型為保護膜來對矽晶圓等之被加工基板進行蝕刻處理的加工法。然而,近年來半導體設備之高積體化係有進展,所使用之活性光線亦有由KrF準分子雷射(248nm)朝向ArF準分子雷射(193nm)之短波長化的傾向。伴隨於此,活性光線之由基板的漫反射或駐波的影響成為大問題。因而,廣泛地探討起於光阻與被加工基板之間設置抗反射膜(BottomAnti-
ReflectiveCoating、BARC)的方法。
今後,進行阻劑圖型之微細化時,會產生解像度之問題或阻劑圖型在顯影後倒塌的問題,期望阻劑之薄膜化。因此,難以得到用於基板加工所充分的阻劑圖型膜厚,不僅阻劑圖型,針對於阻劑與所加工之半導體基板之間所製成之阻劑下層膜亦賦予作為基板加工時之遮罩的功能之製程係成為必須。作為如此製程用的阻劑下層膜,與以往的高蝕刻率性(蝕刻速度快的)阻劑下層膜不同地,變得要求具有接近阻劑之乾蝕刻速度的選擇比之微影術用阻劑下層膜、具有較阻劑小之乾蝕刻速度的選擇比之微影術用阻劑下層膜或具有較半導體基板小之乾蝕刻速度的選擇比之微影術用阻劑下層膜。
作為上述阻劑下層膜用之聚合物,舉例有例如以下者。
舉例有使用了聚乙烯基咔唑之阻劑下層膜形成組成物(參照專利文獻1)。
揭示有使用了具有咔唑酚醛清漆之單位構造與萘酚醛清漆之單位構造的樹脂之阻劑下層膜形成組成物(例如參照專利文獻2)。
揭示有使用了苯基萘基胺酚醛清漆樹脂之阻劑下層膜形成組成物(例如參照專利文獻3)。
揭示有使用了萘酚醛清漆樹脂之阻劑下層膜形成組成物(例如參照專利文獻4)。
揭示有使用了茀萘酚酚醛清漆樹脂之阻劑下
層膜形成組成物(例如參照專利文獻5)。
揭示有含有以茀酚與芳基伸苯基為重複單位之樹脂的阻劑下層膜形成組成物(例如參照專利文獻6、專利文獻7)。
[專利文獻1]日本特開平2-293850號公報
[專利文獻2]國際公開WO2012/077640小冊
[專利文獻3]國際公開WO2013/047516小冊
[專利文獻4]國際公開WO2006/132088小冊
[專利文獻5]日本特開2007-199653
[專利文獻6]日本特開2007-178974
[專利文獻7]美國專利第7378217號
本發明為提供用於半導體裝置製造之微影術製程的阻劑下層膜形成組成物。又,本發明為提供不引起與阻劑層之互混,可得到優良阻劑圖型,具有接近阻劑之乾蝕刻速度的選擇比之微影術用阻劑下層膜、具有較阻劑小之乾蝕刻速度的選擇比之微影術用阻劑下層膜或具有較半導體基板小之乾蝕刻速度的選擇比之微影術用阻劑下層膜。又,本發明亦可賦予在使用248nm、193nm、157nm
等波長之照射光於微細加工時,有效地吸收來自基板之反射光的性能。進一步地,本發明為提供使用了阻劑下層膜形成組成物之阻劑圖型之形成法。此外,提供用以形成亦兼具耐熱性之阻劑下層膜的阻劑下層膜形成組成物。
本發明之第1觀點,係一種使用於微影術步驟之阻劑下層膜形成組成物,其係含有藉由具有二級胺基之芳香族化合物與醛化合物之反應所得到之酚醛清漆聚合物;第2觀點,係如第1觀點之阻劑下層膜形成組成物,其中酚醛清漆聚合物為包含式(1)所示之單位構造者:
(式(1)中,R1為氫原子之取代基,其係鹵基、硝基、胺基、羥基、碳數1至10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可含有醚鍵、酮鍵、或酯鍵之該等
的組合,R2係碳數1至10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可含有醚鍵、酮鍵、或酯鍵之該等的組合,R3為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、羥基取代之碳數6至40之芳基、或雜環基,R4為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、羥基取代之碳數1至10之烷基、碳數6至40之芳基、或雜環基,R3與R4亦可與該等所鍵結之碳原子一起形成環。n為0或1之整數,m在n為0時為0至3之整數、在n為1時為0至5之整數);第3觀點,係如第2觀點之阻劑下層膜形成組成物,其中n及m為0,R2為甲基或苄基;第4觀點,係如第2觀點或第3觀點之阻劑下層膜形成組成物,其中R3為苯基、萘基、蒽基、或芘基,R4為氫原子;第5觀點,係如第1觀點至第4觀點中任一者之阻劑下層膜形成組成物,其中進一步含有交聯劑;第6觀點,係如第1觀點至第5觀點中任一者之阻劑下層膜形成組成物,其中進一步含有酸及/或酸產生劑;第7觀點,係一種阻劑下層膜,其係藉由將如第1觀點至第6觀點中任一者之阻劑下層膜形成組成物塗佈於半導體基板上並燒成而得到;第8觀點,係一種半導體裝置之製造方法,其包含:於半導體基板上藉由如第1觀點至第6觀點中任一者之阻劑下層膜形成組成物來形成下層膜之步驟、於其上形成阻
劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻該下層膜之步驟、及藉由經圖型化之下層膜來加工半導體基板之步驟;及第9觀點,係一種半導體裝置之製造方法,其包含:於半導體基板上藉由如第1觀點至第6觀點中任一者之阻劑下層膜形成組成物來形成阻劑下層膜之步驟、於其上形成硬遮罩之步驟、進一步於其上形成阻劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻硬遮罩之步驟、藉由經圖型化之硬遮罩來蝕刻該阻劑下層膜之步驟、及藉由經圖型化之阻劑下層膜來加工半導體基板之步驟。
藉由本發明之阻劑下層膜形成組成物,可不引起阻劑下層膜之上層部與被覆於其上之層的互混,而形成良好之阻劑的圖型形狀。
可對本發明之阻劑下層膜形成組成物賦予有效率地抑制來自基板之反射的性能,亦可一併具有作為曝光光之抗反射膜的效果。
藉由本發明之阻劑下層膜形成組成物,可提供具有接近阻劑之乾蝕刻速度的選擇比、較阻劑小之乾蝕刻速度的選擇比或較半導體基板小之乾蝕刻速度的選擇比的優良之阻劑下層膜。
伴隨阻劑圖型之微細化,為了防止阻劑圖型在顯影後倒塌,係進行阻劑的薄膜化。如此之薄膜阻劑中,係有將阻劑圖型於蝕刻製程中轉印於其下層膜,以該下層膜為遮罩進行基板加工之製程、或將阻劑圖型於蝕刻製程中轉印於其下層膜,進一步重複將轉印於下層膜之圖型使用不同氣體組成轉印於其下層膜的行程,最終進行基板加工的製程。本發明之阻劑下層膜及其形成組成物係對於該製程有效,使用本發明之阻劑下層膜來加工基板時,係對加工基板(例如基板上之熱氧化矽膜、氮化矽膜、多晶矽膜等)充分具有蝕刻耐性者。
此外,本發明之阻劑下層膜,可使用作為平坦化膜、阻劑下層膜、阻劑層之污染防止膜、具有乾蝕刻選擇性之膜。藉此,可輕易地且精度良好地進行半導體製造之微影術製程中的阻劑圖型形成。
係有如下製程:藉由本發明之阻劑下層膜形成組成物於基板上形成阻劑下層膜,於其上形成硬遮罩,再於其上形成阻劑膜,藉由曝光與顯影來形成阻劑圖型,將阻劑圖型轉印於硬遮罩,將轉印於硬遮罩之阻劑圖型轉印於阻劑下層膜,以該阻劑下層膜來進行半導體基板之加工。於該製程中硬遮罩係有藉由含有有機聚合物或無機聚合物與溶劑之塗佈型組成物來進行的情況、與藉由無機物之真空蒸鍍來進行的情況。無機物(例如氮化氧化矽)之真空蒸鍍中,蒸鍍物會堆積於阻劑下層膜表面,此時阻劑下層膜表面之溫度會上升至400℃左右。本發明中所用之聚
合物因為係含有式(1)所示之單位構造的聚合物,故耐熱性極高,即使因蒸鍍物之堆積亦不產生熱劣化。
[圖1]圖1係將實施例1中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,進行400℃、2分鐘之燒成後,以電子顯微鏡觀察基板之截面的照片。(倍率為10萬倍)。
[圖2]圖2係將實施例2中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,進行400℃、2分鐘之燒成後,以電子顯微鏡觀察基板之截面的照片。(倍率為10萬倍)。
[圖3]圖3係將實施例3中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,進行400℃、2分鐘之燒成後,以電子顯微鏡觀察基板之截面的照片。(倍率為10萬倍)。
[圖4]圖4係將實施例4中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,進行400℃、2分鐘之燒成後,以電子顯微鏡觀察基板之截面的照片。(倍率為10萬倍)。
[圖5]圖5係將比較例2中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,進行400℃、2分鐘之燒成後,以電子顯微鏡觀察基板之截面
的照片。(倍率為10萬倍)。
本發明係使用於微影術步驟之阻劑下層膜形成組成物,其係含有藉由具有二級胺基之芳香族化合物與醛化合物之反應所得到之酚醛清漆樹脂。
又,本發明係使用於微影術步驟之阻劑下層膜形成組成物,其係含有包含式(1)所示之單位構造的酚醛清漆樹脂。
本發明中,上述微影術用阻劑下層膜形成組成物係含有上述聚合物與溶劑。此外,可含有交聯劑與酸,且可依需要含有酸產生劑、界面活性劑等添加劑。該組成物之固體成分為0.1至70質量%、或0.1至60質量%。此處,固體成分係由阻劑下層膜形成組成物中去除溶劑後的全部成分之含有比例。固體成分中可含有1至100質量%、或1至99.9質量%、或50至99.9質量%、或50至95質量%、或50至90質量%之比例的上述聚合物。
本發明中所用之聚合物,係重量平均分子量600至1000000、或600至200000。
式(1)中,R1為氫原子之取代基,其係鹵基、硝基、胺基、羥基、碳數1至10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可含有醚鍵、酮鍵、或酯鍵之該等的組合,R2係碳數1至10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可含有醚鍵、酮鍵、或酯鍵
之該等的組合,R3為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、羥基取代之碳數6至40之芳基、或雜環基,R4為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、羥基取代之碳數1至10之烷基、碳數6至40之芳基、或雜環基,R3與R4亦可與該等所鍵結之碳原子一起形成環。n為0或1之整數,m在n為0時為0至3之整數、在n為1時為0至5之整數。
此處,上述碳數1至10之烷基可列舉甲基、乙基、n-丙基、i-丙基、環丙基、n-丁基、i-丁基、s-丁基、t-丁基、環丁基、1-甲基-環丙基、2-甲基-環丙基、n-戊基、1-甲基-n-丁基、2-甲基-n-丁基、3-甲基-n-丁基、1,1-二甲基-n-丙基、1,2-二甲基-n-丙基、2,2-二甲基-n-丙基、1-乙基-n-丙基、環戊基、1-甲基-環丁基、2-甲基-環丁基、3-甲基-環丁基、1,2-二甲基-環丙基、2,3-二甲基-環丙基、1-乙基-環丙基、2-乙基-環丙基、n-己基、1-甲基-n-戊基、2-甲基-n-戊基、3-甲基-n-戊基、4-甲基-n-戊基、1,1-二甲基-n-丁基、1,2-二甲基-n-丁基、1,3-二甲基-n-丁基、2,2-二甲基-n-丁基、2,3-二甲基-n-丁基、3,3-二甲基-n-丁基、1-乙基-n-丁基、2-乙基-n-丁基、1,1,2-三甲基-n-丙基、1,2,2-三甲基-n-丙基、1-乙基-1-甲基-n-丙基、1-乙基-2-甲基-n-丙基、環己基、1-甲基-環戊基、2-甲基-環戊基、3-甲基-環戊基、1-乙基-環丁基、2-乙基-環丁基、3-乙基-環丁基、1,2-二甲基-環丁基、1,3-二甲基-
環丁基、2,2-二甲基-環丁基、2,3-二甲基-環丁基、2,4-二甲基-環丁基、3,3-二甲基-環丁基、1-n-丙基-環丙基、2-n-丙基-環丙基、1-i-丙基-環丙基、2-i-丙基-環丙基、1,2,2-三甲基-環丙基、1,2,3-三甲基-環丙基、2,2,3-三甲基-環丙基、1-乙基-2-甲基-環丙基、2-乙基-1-甲基-環丙基、2-乙基-2-甲基-環丙基及2-乙基-3-甲基-環丙基等。
上述碳數2至10之烯基可列舉乙烯基、1-丙烯基、2-丙烯基、1-甲基-1-乙烯基、1-丁烯基、2-丁烯基、3-丁烯基、2-甲基-1-丙烯基、2-甲基-2-丙烯基、1-乙基乙烯基、1-甲基-1-丙烯基、1-甲基-2-丙烯基、1-戊烯基、2-戊烯基、3-戊烯基、4-戊烯基、1-n-丙基乙烯基、1-甲基-1-丁烯基、1-甲基-2-丁烯基、1-甲基-3-丁烯基、2-乙基-2-丙烯基、2-甲基-1-丁烯基、2-甲基-2-丁烯基、2-甲基-3-丁烯基、3-甲基-1-丁烯基、3-甲基-2-丁烯基、3-甲基-3-丁烯基、1,1-二甲基-2-丙烯基、1-i-丙基乙烯基、1,2-二甲基-1-丙烯基、1,2-二甲基-2-丙烯基、1-環戊烯基、2-環戊烯基、3-環戊烯基、1-己烯基、2-己烯基、3-己烯基、4-己烯基、5-己烯基、1-甲基-1-戊烯基、1-甲基-2-戊烯基、1-甲基-3-戊烯基、1-甲基-4-戊烯基、1-n-丁基乙烯基、2-甲基-1-戊烯基、2-甲基-2-戊烯基、2-甲基-3-戊烯基、2-甲基-4-戊烯基、2-n-丙基-2-丙烯基、3-甲基-1-戊烯基、3-甲基-2-戊烯基、3-甲基-3-戊烯基、3-甲基-4-戊烯基、3-乙基-3-丁烯基、4-甲基-1-戊烯基、4-甲基-2-戊烯基、4-甲基-3-戊烯基、4-甲基-4-戊烯基、1,1-二
甲基-2-丁烯基、1,1-二甲基-3-丁烯基、1,2-二甲基-1-丁烯基、1,2-二甲基-2-丁烯基、1,2-二甲基-3-丁烯基、1-甲基-2-乙基-2-丙烯基、1-s-丁基乙烯基、1,3-二甲基-1-丁烯基、1,3-二甲基-2-丁烯基、1,3-二甲基-3-丁烯基、1-i-丁基乙烯基、2,2-二甲基-3-丁烯基、2,3-二甲基-1-丁烯基、2,3-二甲基-2-丁烯基、2,3-二甲基-3-丁烯基、2-i-丙基-2-丙烯基、3,3-二甲基-1-丁烯基、1-乙基-1-丁烯基、1-乙基-2-丁烯基、1-乙基-3-丁烯基、1-n-丙基-1-丙烯基、1-n-丙基-2-丙烯基、2-乙基-1-丁烯基、2-乙基-2-丁烯基、2-乙基-3-丁烯基、1,1,2-三甲基-2-丙烯基、1-t-丁基乙烯基、1-甲基-1-乙基-2-丙烯基、1-乙基-2-甲基-1-丙烯基、1-乙基-2-甲基-2-丙烯基、1-i-丙基-1-丙烯基、1-i-丙基-2-丙烯基、1-甲基-2-環戊烯基、1-甲基-3-環戊烯基、2-甲基-1-環戊烯基、2-甲基-2-環戊烯基、2-甲基-3-環戊烯基、2-甲基-4-環戊烯基、2-甲基-5-環戊烯基、2-亞甲基-環戊基、3-甲基-1-環戊烯基、3-甲基-2-環戊烯基、3-甲基-3-環戊烯基、3-甲基-4-環戊烯基、3-甲基-5-環戊烯基、3-亞甲基-環戊基、1-環己烯基、2-環己烯基及3-環己烯基等。
上述碳數6至40之芳基可列舉苯基、o-甲基苯基、m-甲基苯基、p-甲基苯基、o-氯苯基、m-氯苯基、p-氯苯基、o-氟苯基、p-氟苯基、o-甲氧基苯基、p-甲氧基苯基、p-硝基苯基、p-氰基苯基、α-萘基、β-萘基、o-聯苯基、m-聯苯基、p-聯苯基、1-蒽基、2-蒽基、9-蒽基、1-菲基、2-菲基、3-菲基、4-菲基、9-菲基、及芘
基。
上述雜環基較佳為由含有氮、硫、氧之5至6員環之雜環所構成之有機基,可列舉例如吡咯基、呋喃基、噻吩基、咪唑基、噁唑基、噻唑基、吡唑基、異噁唑基、異噻唑基、吡啶基等。
上述可經羥基取代之碳數6至40之芳基,可列舉例如酚、二羥基苯、三羥基苯、萘酚、二羥基萘、三羥基萘、羥基蒽、二羥基蒽、三羥基蒽等。
上述羧酸烷酯基之烷基可列舉上述碳數1至10之烷基。
可使用式(1)中,n及m為0,R2為甲基或苄基時的單位構造。又,式(1)中,由於R2為上述烷基與芳基之組合,而可選擇芳烷基。芳烷基可列舉苄基、苯乙基等。
此外可使用R3為苯基、萘基、蒽基、或芘基,R4為氫原子時的單位構造。進一步地,R3與R4中,與該等所鍵結之碳原子一起形成之環,可列舉例如茀環。
本發明中之酚醛清漆樹脂,係藉由具有二級胺基之芳香族化合物與醛類或酮類之間的縮合反應,形成式(1)所示之單位構造而得到。
具有二級胺基之芳香族化合物,為苯衍生物、萘衍生物,可具有上述所舉例之取代基。
本發明之聚合物製造所用的醛類可列舉甲醛、多聚甲醛、乙醛、丙醛、丁醛、異丁醛、戊醛、己
醛、2-甲基丁醛、己醛、十一醛、7-甲氧基-3,7-二甲基辛醛、環己醛、3-甲基-2-丁醛、乙二醛、丙二醛、丁二醛、戊二醛、戊二醛、己二醛等之飽和脂肪族醛類;丙烯醛、甲基丙烯醛等之不飽和脂肪族醛類;糠醛、吡啶醛等之雜環式醛類;苄醛、萘醛、蒽醛、菲醛、柳醛、苯基乙醛、3-苯基丙醛、甲苯醛(tolyl aldehyde)、(N,N-二甲基胺基)苄醛、乙醯氧基苄醛、1-芘羧醛、大茴香醛、對苯二甲醛等之芳香族醛類等。特佳可使用芳香族醛。
又,本發明之聚合物之製造所使用的酮類,係二芳基酮類,可列舉例如二苯基酮、苯基萘基酮、二萘基酮、苯基甲苯基酮、二甲苯基酮、9-茀酮等。
該縮合反應中,相對於具有1莫耳之二級胺基的芳香族化合物而言,能夠以0.1至10莫耳之比例來使用醛類或酮類。
上述縮合反應中所用之酸觸媒,係使用例如硫酸、磷酸、過氯酸等之礦酸類;p-甲苯磺酸、p-甲苯磺酸一水合物等之有機磺酸類;甲酸、草酸等之羧酸類。酸觸媒之使用量,係依照所使用酸類的種類而有各種選擇。
通常,相對於具有二級胺基之芳香族化合物100質量份而言,能夠以0.001至10000質量份、較佳為0.01至1000質量份、更佳為0.1至100質量份之比例來添加酸觸媒。
上述縮合反應雖在無溶劑下亦可進行,但通常係使用溶劑來進行。作為溶劑,只要係不阻礙反應者,
均可使用。可列舉例如四氫呋喃、二噁烷等之環狀醚類。又,所使用之酸觸媒若為例如像甲酸之液狀者,則亦可兼具作為溶劑的角色。
縮合時之反應溫度通常為40℃至200℃。反應時間雖依反應溫度而有各種選擇,但通常為30分至50小時左右。
如以上方式所得之聚合物的重量平均分子量Mw,通常為500至1000000、或600至200000。
含有式(1)所示之單位構造的聚合物,例如可如以下所舉例的式(2-1)至式(2-12)、及式(3-1)至式(3-12)所示。
上述聚合物,可將其他聚合物於全部聚合物中混合30質量%以內來使用。
該等聚合物,可列舉聚丙烯酸酯化合物、聚甲基丙烯酸酯化合物、聚丙烯醯胺化合物、聚甲基丙烯醯胺化合物、聚乙烯基化合物、聚苯乙烯化合物、聚馬來醯亞胺化合物、聚馬來酸酐、及聚丙烯腈化合物。
聚丙烯酸酯化合物之原料單體,可列舉丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸苄酯、丙烯酸萘酯、丙烯酸蒽酯、丙烯酸蒽基甲酯、丙烯酸苯酯、丙
烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸2,2,2-三氟乙酯、丙烯酸4-羥基丁酯、丙烯酸異丁酯、丙烯酸tert-丁酯、丙烯酸環己酯、丙烯酸異莰酯、丙烯酸2-甲氧基乙酯、甲氧基三乙二醇丙烯酸酯、丙烯酸2-乙氧基乙酯、丙烯酸四氫呋喃甲酯、丙烯酸3-甲氧基丁酯、丙烯酸2-甲基-2-金剛烷酯、丙烯酸2-乙基-2-金剛烷酯、丙烯酸2-丙基-2-金剛烷酯、丙烯酸2-甲氧基丁基-2-金剛烷酯、丙烯酸8-甲基-8-三環癸酯、丙烯酸8-乙基-8-三環癸酯、及5-丙烯醯氧基-6-羥基降莰烯-2-羧酸-6-內酯等。
聚甲基丙烯酸酯化合物之原料單體,可列舉甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸正戊酯、甲基丙烯酸環己酯、甲基丙烯酸苄酯、甲基丙烯酸萘酯、甲基丙烯酸蒽酯、甲基丙烯酸蒽基甲酯、甲基丙烯酸苯酯、甲基丙烯酸2-苯基乙酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、甲基丙烯酸2,2,2-三氟乙酯、甲基丙烯酸2,2,2-三氯乙酯、丙烯酸甲酯、甲基丙烯酸異丁酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸異癸酯、甲基丙烯酸正月桂酯、甲基丙烯酸正硬脂酯、甲氧基二乙二醇甲基丙烯酸酯、甲氧基聚乙二醇甲基丙烯酸酯、甲基丙烯酸四氫呋喃甲酯、甲基丙烯酸異莰酯、甲基丙烯酸tert-丁酯、甲基丙烯酸異硬脂酯、甲基丙烯酸正丁氧基乙酯、甲基丙烯酸3-氯-2-羥基丙酯、甲基丙烯酸2-甲基-2-金剛烷酯、甲基丙烯酸2-乙基-2-金剛烷酯、甲基丙烯酸2-丙基-2-金剛烷酯、甲基丙烯酸2-甲氧基丁基-2-金剛烷
酯、甲基丙烯酸8-甲基-8-三環癸酯、甲基丙烯酸8-乙基-8-三環癸酯、5-甲基丙烯醯氧基-6-羥基降莰烯-2-羧酸-6-內酯、及甲基丙烯酸2,2,3,3,4,4,4-七氟丁酯等。
聚丙烯醯胺化合物之原料單體,可列舉丙烯醯胺、N-甲基丙烯醯胺、N-乙基丙烯醯胺、N-苄基丙烯醯胺、N-苯基丙烯醯胺、及N,N-二甲基丙烯醯胺等。
聚甲基丙烯醯胺化合物之原料單體,可列舉甲基丙烯醯胺、N-甲基甲基丙烯醯胺、N-乙基甲基丙烯醯胺、N-苄基甲基丙烯醯胺、N-苯基甲基丙烯醯胺、及N,N-二甲基甲基丙烯醯胺等。
聚乙烯基化合物之原料單體,可列舉乙烯基醚、甲基乙烯基醚、苄基乙烯基醚、2-羥基乙基乙烯基醚、苯基乙烯基醚、及丙基乙烯基醚等。
聚苯乙烯化合物之原料單體,可列舉苯乙烯、甲基苯乙烯、氯苯乙烯、溴苯乙烯、及羥基苯乙烯等。
聚馬來醯亞胺化合物之原料單體,可列舉馬來醯亞胺、N-甲基馬來醯亞胺、N-苯基馬來醯亞胺、及N-環己基馬來醯亞胺等。
此等聚合物之製造,可藉由於有機溶劑中溶解加成聚合性單體及依需要所添加之鏈轉移劑(相對於單體質量而言,為10%以下)後,添加聚合起始劑進行聚合反應,之後,添加聚合停止劑藉以製造。聚合起始劑之添加量,相對於單體質量而言,為1至10%,聚合停止劑之
添加量,為0.01至0.2質量%。所使用之有機溶劑可列舉丙二醇單甲基醚、丙二醇單丙基醚、乳酸乙酯、環己酮、甲基乙基酮、及二甲基甲醯胺等;鏈轉移劑可列舉十二烷硫醇及十二烷基硫醇等;聚合起始劑可列舉偶氮雙異丁腈及偶氮雙環己烷碳腈等;而聚合停止劑可列舉4-甲氧基酚等。反應溫度係由30至100℃、反應時間係由1至48小時中適當選擇。
本發明之阻劑下層膜形成組成物可含有交聯劑成分。該交聯劑可列舉三聚氰胺系、取代脲系、或該等之聚合物系等。較佳為具有至少2個交聯形成取代基之交聯劑,其係甲氧基甲基化乙炔脲、丁氧基甲基化乙炔脲、甲氧基甲基化三聚氰胺、丁氧基甲基化三聚氰胺、甲氧基甲基化苯并胍胺、丁氧基甲基化苯并胍胺、甲氧基甲基化脲、丁氧基甲基化脲、甲氧基甲基化硫脲、或甲氧基甲基化硫脲等之化合物。又,亦可使用此等化合物之縮合物。
又,上述交聯劑可使用耐熱性高的交聯劑。耐熱性高的交聯劑,較佳可使用含有於分子內具有芳香族環(例如苯環、萘環)之交聯形成取代基的化合物。
該化合物可列舉具有下述式(4)所示之部分構造的化合物、或具有下述式(5)所示之重複單位的聚合物或寡聚物。
式(5)中,R12為氫原子或碳數1至10之烷基,R13為碳數1至10之烷基,n12為1至4之整數,n13為0至(4-n12),(n12+n13)表示1至4之整數。寡聚物及聚合物可於重複單位構造之數目為2至100、或2至50之範圍使用。
此等烷基及芳基,可舉例上述烷基及芳基。
式(4)、式(5)所示之化合物、聚合物、寡聚物舉例如以下。
上述化合物可由旭有機材工業(股)、本州化學工業(股)之產品來獲得。例如上述交聯劑中,式(4-21)所示之化合物可由旭有機材工業(股)、商品名TM-BIP-A獲得。又,式(4-22)所示之化合物可由本州化學工業(股)、商品名TMOM-BP獲得。
交聯劑之添加量,雖依所使用之塗佈溶劑、所使用之基底基板、所要求之溶液黏度、所要求之膜形狀等而變動,但相對於全部固體成分而言,係0.001至80質量%、較佳為0.01至50質量%、更佳為0.05至40質量%。此等交聯劑亦有因自我縮合而引起交聯反應的情況,但本發明之上述聚合物中存在有交聯性取代基時,可與該等交聯性取代基引起交聯反應。
本發明中,可摻合p-甲苯磺酸、三氟甲磺
酸、吡啶鎓p-甲苯磺酸、水楊酸、磺水楊酸、檸檬酸、安息香酸、羥基安息香酸、萘羧酸等之酸性化合物或/及2,4,4,6-四溴環己二烯酮、苯偶姻甲苯磺酸酯、甲苯磺酸2-硝基苄酯、其他有機磺酸烷酯、三氟甲磺酸之4級銨鹽等之熱酸產生劑,作為用以促進上述交聯反應之觸媒。摻合量,相對於全部固體成分而言,係0.0001至20質量%、較佳為0.0005至10質量%、更佳為0.01至3質量%。
本發明之微影術用阻劑下層膜形成組成物,為了使與微影術步驟中被覆於上層的光阻之酸性度一致,可添加光酸產生劑。較佳之光酸產生劑,可列舉例如雙(4-t-丁基苯基)錪三氟甲磺酸鹽、三苯基鋶三氟甲磺酸鹽等之鎓鹽系光酸產生劑類;苯基-雙(三氯甲基)-s-三嗪等之含鹵素化合物系光酸產生劑類;苯偶姻甲苯磺酸酯、N-羥基琥珀醯亞胺三氟甲磺酸酯等之磺酸系光酸產生劑類等。上述光酸產生劑,相對於全部固體成分而言,係0.2至10質量%、較佳為0.4至5質量%。
本發明之微影術用阻劑下層膜材料中,於上述以外,可依需要進一步添加吸光劑、流變性調整劑、接著輔助劑、界面活性劑等。
進一步的吸光劑例如可適合使用「工業用色素之技術與市場」(CMC出版)或「染料便覽」(有機合成化學協會編)記載之市售吸光劑,例如C.I.Disperse Yellow 1、3、4、5、7、8、13、23、31、49、50、51、54、60、
64、66、68、79、82、88、90、93、102、114及124;C.I.Disperse Orange 1、5、13、25、29、30、31、44、57、72及73;C.I.Disperse Red 1、5、7、13、17、19、43、50、54、58、65、72、73、88、117、137、143、199及210;C.I.Disperse Violet 43;C.I.Disperse Blue 96;C.I.Fluorescent Brightening Agent 112、135及163;C.I.Solvent Orange 2及45;C.I.Solvent Red 1、3、8、23、24、25、27及49;C.I.Pigment Green 10;C.I.Pigment Brown 2等。上述吸光劑通常,相對於微影術用阻劑下層膜材料之全部固體成分而言,以10質量%以下、較佳為以5質量%以下之比例摻合。
流變性調整劑,主要係以提高阻劑下層膜形成組成物之流動性,特別是於烘烤步驟中,提高阻劑下層膜之膜厚均一性或提高阻劑下層膜形成組成物對孔洞內部之填充性為目的而添加。具體例子可列舉,鄰苯二甲酸二甲酯、鄰苯二甲酸二乙酯、鄰苯二甲酸二異丁酯、鄰苯二甲酸二己酯、鄰苯二甲酸丁基異癸酯等之鄰苯二甲酸衍生物;己二酸二正丁酯、己二酸二異丁酯、己二酸二異辛酯、己二酸辛基癸酯等之己二酸衍生物、馬來酸二正丁酯、馬來酸二乙酯、馬來酸二壬酯等之馬來酸衍生物;油酸甲酯、油酸丁酯、油酸四氫呋喃甲酯等之油酸衍生物;或硬脂酸正丁酯、硬脂酸甘油酯等之硬脂酸衍生物。此等流變性調整劑,相對於微影術用阻劑下層膜材料之全部固體成分而言,通常以未達30質量%之比例摻合。
接著輔助劑,主要係以提高與基板或阻劑與阻劑下層膜形成組成物之密著性,特別是於顯影中使阻劑不剝離的目的來添加。具體例子可列舉三甲基氯矽烷、二甲基乙烯基氯矽烷、甲基二苯基氯矽烷、氯甲基二甲基氯矽烷等之氯矽烷類;三甲基甲氧基矽烷、二甲基二乙氧基矽烷、甲基二甲氧基矽烷、二甲基乙烯基乙氧基矽烷、二苯基二甲氧基矽烷、苯基三乙氧基矽烷等之烷氧基矽烷類;六甲基二矽氮烷、N,N’-雙(三甲基矽烷基)脲、二甲基三甲基矽烷基胺、三甲基矽烷基咪唑等之矽氮烷類;乙烯基三氯矽烷、γ-氯丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷等之矽烷類;苯并***、苯并咪唑、吲唑、咪唑、2-巰基苯并咪唑、2-巰基苯并噻唑、2-巰基苯并噁唑、脲唑、硫脲嘧啶、巰基咪唑、巰基嘧啶等之雜環式化合物;或1,1-二甲基脲、1,3-二甲基脲等之脲、或硫脲化合物。此等接著輔助劑,相對於微影術用阻劑下層膜材料之全部固體成分而言,通常以未達5質量%、較佳為未達2質量%之比例來摻合。
本發明之微影術用阻劑下層膜材料中,為了使無針孔或條紋等之產生,進一步提高對表面不均的塗佈性,可摻合界面活性劑。界面活性劑,可列舉例如聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯鯨蠟基醚、聚氧乙烯油醯基醚等之聚氧乙烯烷基醚類;聚氧乙烯辛基酚醚、聚氧乙烯壬基酚醚等之聚氧乙烯烷基烯丙基醚類;聚氧乙烯/聚氧丙烯嵌段共聚物類;山梨醇酐單月桂酸酯、
山梨醇酐單棕櫚酸酯、山梨醇酐單硬脂酸酯、山梨醇酐單油酸酯、山梨醇酐三油酸酯、山梨醇酐三硬脂酸酯等之山梨醇酐脂肪酸酯類;聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單棕櫚酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐三油酸酯、聚氧乙烯山梨醇酐三硬脂酸酯等之聚氧乙烯山梨醇酐脂肪酸酯類等之非離子系界面活性劑;Eftop EF301、EF303、EF352((股)Tokem Products製、商品名)、Megafac F171、F173、R-30、R-30N、R-40LM(大日本油墨(股)製、商品名)、Fluorad FC430、FC431(住友3M(股)製、商品名)、Asahiguard AG710、Surflon S-382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子(股)製、商品名)等之氟系界面活性劑;有機矽氧烷聚合物KP341(信越化學工業(股)製)等。此等界面活性劑之摻合量,相對於本發明之微影術用阻劑下層膜材料之全部固體成分而言,通常為2.0質量%以下、較佳為1.0質量%以下。此等界面活性劑可單獨添加、又亦可組合2種以上添加。
本發明中,溶解上述聚合物及交聯劑成分、交聯觸媒等的溶劑,可使用乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丁基醚、乙二醇單異丙基醚、乙二醇甲基醚乙酸酯、乙二醇乙基醚乙酸酯、甲基賽璐索芙乙酸酯、乙基賽璐索芙乙酸酯、二乙二醇、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇單乙基醚乙酸酯、丙二醇、丙二醇單甲基
醚、丙二醇單丁基醚、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚、丙二醇單乙基醚乙酸酯、丙二醇丙基醚乙酸酯、二丙二醇單甲基醚、二丙二醇單乙基醚、三乙二醇二甲基醚、甲苯、二甲苯、苯乙烯、甲基乙基酮、環戊酮、環己酮、2-羥基丙酸乙酯、2-羥基-2-甲基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、3-乙氧基丙酸甲酯、丙酮酸甲酯、丙酮酸乙酯、乙酸乙酯、乙酸丁酯、乳酸乙酯、乳酸丁酯、1-辛醇、乙二醇、己二醇、1,3-丙二醇、1-甲氧基-2-丁醇、環己醇、二丙酮醇、呋喃甲醇、四氫呋喃甲醇、丙二醇、苄醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁基內酯、丙酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基正丁基酮、乙酸異丙基酮、乙酸正丙酯、乙酸異丁酯、甲醇、乙醇、異丙醇、tert-丁醇、烯丙醇、正丙醇、2-甲基-2-丁醇、異丁醇、正丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、1-辛醇、乙二醇、己二醇、1,3-丙二醇、1-甲氧基-2-丁醇、二丙酮醇、呋喃甲醇、四氫呋喃甲醇、丙二醇、苄醇、異丙基醚、1,4-二噁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、1,3-二甲基-2-咪唑啉酮、二甲基亞碸、N-環己基-2-吡咯啉酮等。此等有機溶劑係單獨、或組合2種以上使用。
進一步地,可混合丙二醇單丁基醚、丙二醇單丁基醚乙酸酯等之高沸點溶劑來使用。此等溶劑之中,以丙二醇
單甲基醚、丙二醇單甲基醚乙酸酯、丙二醇單丁基醚、乳酸乙酯、乳酸丁酯、及環己酮等,對調平性之提高而言較佳。
本發明所用之阻劑,係指光阻或電子束阻劑(electron beam resist)。
塗佈於本發明中之微影術用阻劑下層膜的上部之光阻,係負型、正型均可使用,其係有由酚醛清漆樹脂與1,2-萘醌二疊氮磺酸酯所構成之正型光阻;由具有因酸而分解使得鹼溶解速度上昇之基的黏結劑與光酸產生劑所構成之化學增幅型光阻;由鹼可溶性黏結劑、因酸而分解使得光阻之鹼溶解速度上昇的低分子化合物與光酸產生劑所構成之化學增幅型光阻;由具有因酸而分解使得鹼溶解速度上昇之基的黏結劑、因酸而分解使得光阻之鹼溶解速度上昇的低分子化合物與光酸產生劑所構成之化學增幅型光阻;骨架具有Si原子之光阻等,可列舉例如Rohm and Haas公司製、商品名APEX-E。
又,塗佈於本發明中之微影術用阻劑下層膜的上部之電子束阻劑,可列舉例如由主鏈包含Si-Si鍵且末端含有芳香族環之樹脂與因電子束之照射而產生酸之酸產生劑所構成之組成物;或由羥基被含N-羧基胺之有機基取代的聚(p-羥基苯乙烯)與因電子束之照射而產生酸之酸產生劑所構成之組成物等。後者之電子束阻劑組成物中,係因電子束照射而由酸產生劑所產生之酸會與聚合物側鏈之N-羧基胺氧基反應,聚合物側鏈分解為羥基,顯
示鹼可溶性,溶解於鹼顯影液,而形成阻劑圖型者。藉由該電子束照射而產生酸之酸產生劑,可列舉1,1-雙[p-氯苯基]-2,2,2-三氯乙烷、1,1-雙[p-甲氧基苯基]-2,2,2-三氯乙烷、1,1-雙[p-氯苯基]-2,2-二氯乙烷、2-氯-6-(三氯甲基)吡啶等之鹵素化有機化合物;三苯基鋶鹽、二苯基錪鹽等之鎓鹽;甲苯磺酸硝基苄酯、甲苯磺酸二硝基苄酯等之磺酸酯。
具有使用本發明之微影術用阻劑下層膜材料所形成之阻劑下層膜的阻劑之顯影液,可使用氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨水等之無機鹼類;乙基胺、n-丙基胺等之一級胺類;二乙基胺、二-n-丁基胺等之二級胺類;三乙基胺、甲基二乙基胺等之三級胺類;二甲基乙醇胺、三乙醇胺等之醇胺類;氫氧化四甲基銨、氫氧化四乙基銨、膽鹼等之四級銨鹽;吡咯、哌啶等之環狀胺類等之鹼類之水溶液。進一步地,亦可於上述鹼類之水溶液中,添加適當量的異丙醇等之醇類、非離子系等之界面活性劑來使用。此等之中較佳的顯影液為四級銨鹽、更佳為氫氧化四甲基銨及膽鹼。
接著說明本發明之阻劑圖型形成法,係於精密積體電路元件之製造所使用的基板(例如矽/二氧化矽被覆、玻璃基板、ITO基板等之透明基板)上,藉由旋轉器、塗佈器等之適當的塗佈方法塗佈阻劑下層膜形成組成物後,烘烤使其硬化,製成塗佈型下層膜。此處,阻劑下層膜之膜厚,較佳為0.01至3.0μm。又塗佈後烘烤之條
件,係80至350℃、0.5至120分鐘。之後於阻劑下層膜上直接、或依需要使1層至數層之塗膜材料於塗佈型下層膜上成膜後,塗佈阻劑,通過特定之遮罩進行光或電子束之照射,藉由顯影、潤洗、乾燥,可得到良好的阻劑圖型。亦可依需要進行光或電子束之照射後加熱(PEB:Post Exposure Bake)。然後,藉由乾蝕刻,將以前述步驟將阻劑顯影去除後之部分的阻劑下層膜去除,可於基板上形成所期望之圖型。
上述光阻中的曝光光,係近紫外線、遠紫外線、或極紫外線(例如EUV、波長13.5nm)等之化學線,可使用例如248nm(KrF雷射光)、193nm(ArF雷射光)、157nm(F2雷射光)等之波長的光。對光照射而言,只要係可由光酸產生劑產生酸的方法,則可無特殊限制地使用,曝光量係以1至2000mJ/cm2、或10至1500mJ/cm2、或50至1000mJ/cm2進行。
又,電子束阻劑之電子束照射,例如可使用電子束照射裝置來照射。
本發明中,可經下述步驟來製造半導體裝置:於半導體基板上藉由本發明之阻劑下層膜形成組成物來形成該阻劑下層膜之步驟、於其上形成阻劑膜之步驟、藉由光或電子束照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻該阻劑下層膜之步驟、及藉由經圖型化之阻劑下層膜來加工半導體基板之步驟。
今後,當阻劑圖型之微細化進展時,會產生
解像度之問題或阻劑圖型在顯影後倒塌的問題,期望阻劑之薄膜化。因此,難以得到對基板加工而言充分的阻劑圖型膜厚,不僅阻劑圖型,使阻劑與所加工之半導體基板之間所製成之阻劑下層膜亦具有作為基板加工時之遮罩的功能之製程亦變得必要。就如此之製程用的阻劑下層膜而言,與以往的高蝕刻率性阻劑下層膜不同地,係變得要求具有接近阻劑之乾蝕刻速度的選擇比之微影術用阻劑下層膜、具有較阻劑小之乾蝕刻速度的選擇比之微影術用阻劑下層膜或具有較半導體基板小之乾蝕刻速度的選擇比之微影術用阻劑下層膜。又,亦可對如此之阻劑下層膜賦予抗反射能力,可兼具以往的抗反射膜之功能。
另一方面,為了得到微細的阻劑圖型,亦開始使用於阻劑下層膜之乾蝕刻時使阻劑圖型與阻劑下層膜變得比阻劑顯影時之圖型寬度更細的製程。就如此製程用之阻劑下層膜而言,與以往的高蝕刻率性抗反射膜不同地,係變得要求具有接近阻劑之乾蝕刻速度的選擇比之阻劑下層膜。又,亦可對如此之阻劑下層膜賦予抗反射能力,可兼具以往的抗反射膜之功能。
本發明中,可於基板上使本發明之阻劑下層膜成膜後,於阻劑下層膜上直接、或依需要使1層至數層之塗膜材料於阻劑下層膜上成膜後,塗佈阻劑。藉此即使阻劑之圖型寬度變窄,為了防止圖型倒塌而薄薄地被覆阻劑時,亦可藉由選擇適切的蝕刻氣體來加工基板。
亦即,可經下述步驟來製造半導體裝置:於
半導體基板上藉由本發明之阻劑下層膜形成組成物來形成該阻劑下層膜之步驟、於其上形成以含有矽成分等的塗膜材料所得之硬遮罩或以蒸鍍所得之硬遮罩(例如氮化氧化矽)的步驟、進一步於其上形成阻劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型,以鹵素系氣體蝕刻硬遮罩之步驟、藉由經圖型化之硬遮罩,以氧系氣體或氫系氣體來蝕刻該阻劑下層膜之步驟、及藉由經圖型化之阻劑下層膜,以鹵素系氣體來加工半導體基板之步驟。
本發明之微影術用阻劑下層膜形成組成物,當考慮到作為抗反射膜之效果時,因為光吸收部位係被導入骨架,故加熱乾燥時並無對光阻中的擴散物,又,光吸收部位具有充分大的吸光性能,因此反射光防止效果高。
本發明之微影術用阻劑下層膜形成組成物,係熱安定性高、可防止燒成時之分解物所致對上層膜之污染,又,可使燒成步驟之溫度裕度具有餘裕者。
進一步地,本發明之微影術用阻劑下層膜材料,依製程條件不同,可使用作為具有防止光反射之功能、進而防止基板與光阻之相互作用或者用於光阻之材料或對光阻曝光時所生成之物質對基板的不良作用之功能的膜。
於100mL四口燒瓶中,添加N-甲基苯胺(4.50g、0.042mol、東京化成工業(股)製)、1-萘醛(6.56g、0.042mol、東京化成工業(股)製)、甲磺酸(1.21g、0.0126mol、關東化學(股)製),饋入丙二醇單甲基醚(18.41g、關東化學(股)製)並攪拌,昇溫至120℃使其溶解,開始聚合。30小時後,放冷至室溫後,使其對甲醇(800g、關東化學(股)製)再沈澱。過濾所得之沈澱物,以減壓乾燥機於80℃乾燥10小時,得到目標之聚合物(式(2-2),以下略稱為PMA-NA)4.2g。
PMA-NA之以GPC進行的以聚苯乙烯換算所測定之重量平均分子量Mw為1800、多分散度Mw/Mn為1.48。
於100mL四口燒瓶中,添加N-甲基苯胺(3.50g、0.033mol、東京化成工業(股)製)、1-芘羧醛(7.52g、0.033mol、東京化成工業(股)製)、甲磺酸(0.94g、0.0098mol、關東化學(股)製),饋入丙二醇單甲基醚(17.95g、關東化學(股)製)並攪拌,昇溫至120℃使其溶解,開始聚合。30小時後,放冷至室溫後,使其對甲醇(800g、關東化學(股)製)再沈澱。過濾所得之沈澱物,以減壓乾燥機於80℃乾燥10小時,得到目標之聚合物(式(2-7),以下略稱為PMA-PcA)7.6g。
PMA-PcA之以GPC進行的以聚苯乙烯換算所測定之
重量平均分子量Mw為1100、多分散度Mw/Mn為1.43。
於100mL四口燒瓶中,添加N-苄基苯胺(8.00g、0.044mol、東京化成工業(股)製)、1-萘醛(6.82g、0.044mol、東京化成工業(股)製)、甲磺酸(1.26g、0.0131mol、關東化學(股)製),饋入丙二醇單甲基醚乙酸酯(24.12g、關東化學(股)製)並攪拌,昇溫至120℃使其溶解,開始聚合。30小時後,放冷至室溫後,使其對甲醇(800g、關東化學(股)製)再沈澱。過濾所得之沈澱物,以減壓乾燥機於80℃乾燥10小時,得到目標之聚合物(式(3-2),以下略稱為PPBA-NA)6.8g。
PPBA-NA之以GPC進行的以聚苯乙烯換算所測定之重量平均分子量Mw為1400、多分散度Mw/Mn為1.25。
於100mL四口燒瓶中,添加N-苄基苯胺(8.00g、0.044mol、東京化成工業(股)製)、1-芘羧醛(10.05g、0.044mol、東京化成工業(股)製)、甲磺酸(1.26g、0.0131mol、關東化學(股)製),饋入丙二醇單甲基醚乙酸酯(28.97g、關東化學(股)製)並攪拌,昇溫至120℃使其溶解,開始聚合。30小時後,放冷至室溫後,使其對甲醇(800g、關東化學(股)製)再沈澱。過濾所得之沈澱物,以減壓乾燥機於80℃乾燥10小時,得到目標之聚合物(式
(3-7),以下略稱為PPBA-PcA)10.8g。
PPBA-PcA之以GPC進行的以聚苯乙烯換算所測定之重量平均分子量Mw為1300、多分散度Mw/Mn為1.25。
於氮下,於100mL四口燒瓶中,添加咔唑(6.69g、0.040mol、東京化成工業(股)製)、9-茀酮(7.28g、0.040mol、東京化成工業(股)製)、對甲苯磺酸一水合物(0.76g、0.0040mol、東京化成工業(股)製),饋入1,4-二噁烷(6.69g、關東化學(股)製)並攪拌,昇溫至100℃使其溶解,開始聚合。24小時後,放冷至60℃後,添加氯仿(34g、關東化學(股))稀釋,使其對甲醇(168g、關東化學(股)製)再沈澱。過濾所得之沈澱物,以減壓乾燥機於80℃乾燥24小時,得到目標之聚合物(式(6-1),以下略稱為PCzFL)9.37g。
PCzFL之以GPC進行的以聚苯乙烯換算所測定之重量平均分子量Mw為2800、多分散度Mw/Mn為1.77。
於合成例1中得到之樹脂2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於環己酮8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
於合成例2中得到之樹脂2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於環己酮8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
於合成例3中得到之樹脂2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於丙二醇單甲基醚乙酸酯8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
於合成例4中得到之樹脂2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於環己酮8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
於市售之甲酚酚醛清漆樹脂(使用甲酚與甲醛所得到之酚醛清漆樹脂)2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於丙二醇單甲基醚乙酸酯8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
於比較合成例1中得到之樹脂2g中,混合作為界面活性劑之Megafac R-30(大日本油墨化學(股)製、商品名)0.006g,使其溶解於丙二醇單甲基醚乙酸酯8g,成為溶液。之後,使用孔徑0.10μm之聚乙烯製微濾器過濾,進一步地,使用孔徑0.05μm之聚乙烯製微濾器過濾,配
製多層膜之微影術製程所用的阻劑下層膜形成組成物之溶液。
將於實施例1至4及比較例1中配製之阻劑下層膜形成組成物之溶液,分別使用旋轉塗佈器塗佈於矽晶圓上。於加熱板上於400℃燒成2分鐘,形成阻劑下層膜(膜厚0.30μm)。將該阻劑下層膜浸漬於阻劑所使用的溶劑,例如乳酸乙酯、以及丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、環己酮,確認了不溶於該等溶劑。
乾蝕刻速度之測定所使用的蝕刻器及蝕刻氣體係使用以下者。
ES401(日本Scientific製):CF4
將於實施例1至4及比較例1中配製之阻劑下層膜形成組成物之溶液,分別使用旋轉塗佈器塗佈於矽晶圓上。
於加熱板上於240℃燒成1分鐘、或於400℃燒成2分鐘,形成阻劑下層膜(膜厚0.30μm)。使用CF4氣體作為蝕刻氣體來測定乾蝕刻速度。
又,同樣地將酚酚醛清漆樹脂(市售品、以GPC進行的以聚苯乙烯換算所測定之重量平均分子量Mw為2000、多分散度Mw/Mn為2.5)溶液,使用旋轉塗佈器塗佈於矽晶圓上,於205℃燒成1分鐘形成塗膜。使用CF4
氣體作為蝕刻氣體來測定乾蝕刻速度。以於205℃燒成1分鐘所得之酚酚醛清漆樹脂膜(膜厚0.2μm)的蝕刻速度為1.00時,進行與實施例1至4及比較例1之阻劑下層膜的乾蝕刻速度之比較。結果示於表1。速度比係(阻劑下層膜)/(酚酚醛清漆樹脂膜)之乾蝕刻速度比。
將於實施例1至4及比較例2中配製之阻劑下層膜形成組成物之溶液,分別使用旋轉塗佈器塗佈於孔洞晶圓上。於加熱板上於400℃燒成2分鐘,形成阻劑下層膜(膜厚0.25μm)。使用直徑100nm、高度400nm之孔洞圖型作為孔洞晶圓。
將實施例1至4中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,於400℃進行2分鐘燒成後,切斷基板,由以電子顯微鏡觀察的圖1至4之照片,可知充分地填充至孔洞內部。
另一方面,將比較例2中配製之阻劑下層膜形成組成物之溶液,使用旋轉塗佈器塗佈於孔洞晶圓上,於400℃進行2分鐘燒成後,切斷基板,由以電子顯微鏡觀察的圖5之照片,可知於孔洞內部少許地存在有部分的空洞。
本發明之多層膜之微影術製程所使用的阻劑下層膜材料,與以往的高蝕刻率性抗反射膜不同地,可提供具有接近光阻或較光阻小之乾蝕刻速度的選擇比、較半導體基板小之乾蝕刻速度的選擇比,且亦可兼具作為抗反射膜之效果的阻劑下層膜。又,本發明之下層膜材料,具有可於上層以蒸鍍來形成硬遮罩的耐熱性。
Claims (9)
- 一種使用於微影術步驟之阻劑下層膜形成組成物,其係含有藉由具有二級胺基之芳香族化合物與醛化合物之反應所得到之酚醛清漆聚合物。
- 如請求項1之阻劑下層膜形成組成物,其中酚醛清漆聚合物為包含式(1)所示之單位構造者:
- 如請求項2之阻劑下層膜形成組成物,其中n及m為0,R2為甲基或苄基。
- 如請求項2或請求項3之阻劑下層膜形成組成物,其中R3為苯基、萘基、蒽基、或芘基,R4為氫原子。
- 如請求項1至請求項4中任一項之阻劑下層膜形成組成物,其係進一步含有交聯劑。
- 如請求項1至請求項5中任一項之阻劑下層膜形成組成物,其係進一步含有酸及/或酸產生劑。
- 一種阻劑下層膜,其係藉由將如請求項1至請求項6中任一項之阻劑下層膜形成組成物塗佈於半導體基板上並燒成而得到。
- 一種半導體裝置之製造方法,其係包含:於半導體基板上藉由如請求項1至請求項6中任一項之阻劑下層膜形成組成物來形成下層膜之步驟、於其上形成阻劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻該下層膜之步驟、及藉由經圖型化之下層膜來加工半導體基板之步驟。
- 一種半導體裝置之製造方法,其係包含:於半導體基板上藉由如請求項1至請求項6中任一項之阻劑下層膜形成組成物來形成阻劑下層膜之步驟、於其上形成硬遮 罩之步驟、進一步於其上形成阻劑膜之步驟、藉由光或電子束之照射與顯影來形成阻劑圖型之步驟、藉由所形成之阻劑圖型來蝕刻硬遮罩之步驟、藉由經圖型化之硬遮罩來蝕刻該阻劑下層膜之步驟、及藉由經圖型化之阻劑下層膜來加工半導體基板之步驟。
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