TWI572988B - 含有含苯基吲哚之酚醛清漆樹脂的阻劑底層膜形成組成物 - Google Patents
含有含苯基吲哚之酚醛清漆樹脂的阻劑底層膜形成組成物 Download PDFInfo
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- TWI572988B TWI572988B TW102110905A TW102110905A TWI572988B TW I572988 B TWI572988 B TW I572988B TW 102110905 A TW102110905 A TW 102110905A TW 102110905 A TW102110905 A TW 102110905A TW I572988 B TWI572988 B TW I572988B
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- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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Description
本發明係關於半導體基板加工時有效的微影用阻劑底層膜形成組成物,以及使用該阻劑底層膜形成組成物之阻劑圖型形成法,及半導體裝置之製造方法。
過去以來的半導體裝置製造中,藉由使用光阻組成物之微影術進行微細加工。前述微細加工係在矽晶圓等被加工基板上形成光阻組成物之薄膜,且介隔於其上描繪有半導體裝置之圖型的遮罩圖型照射紫外線等之活性光線,經顯像,以所得光阻圖型作為保護膜並蝕刻處理矽晶圓等被加工基板之加工法。不過,近年來,已進展半導體裝置之高積體化,所使用之活性光線亦有自KrF準分子雷射(248nm)短波長化至ArF準分子雷射(193nm)之傾向。伴隨於此,活性光線自基板之散射或駐波之影響為較大問題。因此在光阻與被加工基板間設置抗反射膜(Bottom
Anti-Reflective Coating,BARC)之方法已被廣泛地檢討。
今後,進行光阻圖型之微細化時,會產生解像度問題或阻劑圖型在顯像後崩塌之問題,而期望阻劑之薄膜化。因此,需要有一種在基板加工中難以獲得充分的阻劑圖型膜厚,且不僅是阻劑圖型,在阻劑與經加工之半導體基板之間作成之阻劑底層膜亦具有在基板加工時作為遮罩功能之製程。至於此製程用之阻劑底層膜,與過去之高蝕刻速率性(蝕刻速度快速)阻劑底層膜不同,要求具有乾蝕刻速度之選擇比接近阻劑之微影用阻劑底層膜、具有乾蝕刻速度之選擇比比阻劑小之微影用阻劑底層膜或乾蝕刻速度之選擇比比半導體基板小之微影用阻劑底層膜。
作為上述阻劑底層膜用之聚合物例示以下者。
例示使用聚乙烯基咔唑之阻劑底層膜形成組成物(參照專利文獻1、專利文獻2、及專利文獻3)。
揭示使用茀酚酚醛清漆樹脂之阻劑底層膜形成組成物(參照例如專利文獻4)。
揭示使用茀萘酚酚醛清漆樹脂之阻劑底層膜形成組成物(參照例如專利文獻5)。
揭示包含茀酚及以芳基伸烷基作為重複單位之樹脂之阻劑底層膜形成組成物(參照例如專利文獻6、專利文獻7)。
專利文獻1:特開平2-293850號公報
專利文獻2:特開平1-154050號公報
專利文獻3:特開平2-22657號公報
專利文獻4:特開2005-128509號
專利文獻5:特開2007-199653號
專利文獻6:特開2007-178974號
專利文獻7:美國專利第7378217號
本發明係提供一種半導體裝置製造之微影製程中使用之阻劑底層膜形成組成物。且本發明提供一種不引起與抗蝕層相互混合,獲得優異之阻劑圖型,具有乾蝕刻速度之選擇比接近阻劑之微影用阻劑底層膜、具有乾蝕刻速度之選擇比比阻劑小之微影用阻劑底層膜或乾蝕刻速度之選擇比比半導體基板小之微影用阻劑底層膜。另外,本發明亦可在微細加工中使用248nm、193nm、157nm之波長的照射光時賦予有效吸收來自基板之反射光之性能。另外,本發明提供使用阻劑底層膜形成組成物之阻劑圖型形成法。而且,提供用於形成兼具耐熱性之阻劑底層膜之阻劑底層膜形成組成物。
本發明之第1觀點為一種阻劑底層膜形成組成物,其包含具有以下述式(1)表示之單位構造之聚合物,
(式(1)中,R1、R2及R3為環的氫原子之取代基,各獨立為鹵基、硝基、胺基、羥基、碳數1~10之烷基、碳數2~10之烯基、碳數6~40之芳基、或可包含醚鍵、酮鍵或酯鍵之該等之組合,R4為氫原子、碳數1~10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可包含醚鍵、酮鍵或酯鍵之該等之組合,R5為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、苯基、碳數1至10之烷氧基或羥基取代之碳數6至40之芳基、或雜環基,R6為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基或羥基取代之碳數1至10之烷基、碳數6至40之芳基、或雜環基,或者R5與R6可與其等所鍵結之碳原子一起形成環,環A及環B分別表示苯環、萘環或蒽環,n1、n2及n3分別為0以上至環上可取代之最大數之整數)。
第2觀點為第1觀點所記載之阻劑底層膜形成組成物,其中環A及環B均為苯環,n1、n2及n3為0,R4為氫原子。
第3觀點為第1觀點或第2觀點之阻劑底層膜形成組成物,其中R5為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、苯基、碳數1至10之烷氧基或羥基取代之苯基、萘基、蒽基或芘基,R6為氫原子。
第4觀點為第1觀點至第3觀點中任一項之阻劑底層膜形成組成物,其中進而包含交聯劑。
第5觀點為第1觀點至第4觀點中任一項之阻劑底層膜形成組成物,其中進而包含酸及/或酸產生劑。
第6觀點為一種阻劑底層膜,其係藉由將如第1觀點至第5觀點中任一項之阻劑底層膜形成組成物塗佈於半導體基板上並經燒成而得。
第7觀點為一種半導體裝置之製造方法,其包含下列步驟:以第1觀點至第5觀點中任一項之阻劑底層膜形成組成物,於半導體基板上形成底層膜之步驟,於其上形成阻劑膜之步驟,藉由以光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型蝕刻該底層膜之步驟,以及藉由經圖型化之底層膜加工半導體基板之步驟。
第8觀點為一種半導體裝置之製造方法,其包含下列步驟:以如第1觀點至第5觀點中任一項之阻劑底層膜形成組成物,於半導體基板上形成底層膜之步驟,於其上形成硬遮罩之步驟,進而於其上形成阻劑膜之步驟,藉由以
光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型蝕刻硬遮罩之步驟,藉由經圖型化之硬遮罩蝕刻該底層膜之步驟,以及藉由經圖型化之底層膜加工半導體基板之步驟。
利用本發明之阻劑底層膜,不會引起阻劑底層膜之上層部與被覆於其上之層之相互混合,可形成良好之阻劑圖型形狀。
本發明之阻劑底層膜形成組成物可兼具有可賦予有效的抑制自基板反射之性能的作為曝光之光的抗反射膜效果。
藉由本發明之阻劑底層膜形成組成物,可提供具有乾蝕刻速度之選擇比接近阻劑、乾蝕刻速度之選擇比比阻劑小或乾蝕刻速度之選擇比比半導體基板小之優異的阻劑底層膜。
為了防止隨著阻劑圖型之微細化之阻劑圖型顯像後崩塌而進行阻劑之薄膜化。此薄膜阻劑有將阻劑圖型藉蝕刻製程轉印於其底層膜上,且以該底層膜作為遮罩進行基板加工之製程,或重複進行以蝕刻製程將阻劑圖型轉印於其底層膜上,再使用不同之氣體組成,將轉印於底層膜上之圖型轉印於其底層膜上之過程,且最後進行基板加工之製程。本發明之阻劑底層膜及其形成組成物對於該等製程為有效,於使用本發明之阻劑底層膜加工基板時,
為對於加工基板(例如,於基板上之熱氧化矽膜、氮化矽膜、聚矽氧膜等)具有充分之蝕刻耐性者。
接著,本發明之阻劑底層膜可使用作為平坦化膜、阻劑底層膜、阻劑層之抗污染膜、具有乾蝕刻選擇性之膜。據此,可容易、精度良好地進行半導體製造之微影製程中之阻劑圖型形成。
利用本發明之阻劑底層膜形成組成物於基板上形成阻劑底層膜,於其上形成硬遮罩,於其上形成阻劑膜,利用曝光與顯像而形成阻劑圖型,將阻劑圖型轉印於硬遮罩上,且將轉印於硬遮罩上之阻劑圖型轉印於阻劑底層膜上,且以該阻劑底層膜進行半導體基板之加工之製程。於該製程中,有硬遮罩係以包含有機聚合物或無機聚合物及溶劑之塗佈型組成物進行之情況,與藉由無機物之真空蒸鍍進行之情況。無機物(例如氮化氧化矽)之真空蒸鍍係使蒸鍍物堆積於阻劑底層膜表面上,但此時阻劑底層膜表面之溫度上升至400℃左右。由於本發明中使用之聚合物為具有式(1)之單位構造之聚合物故耐熱性極高,即使利用蒸鍍物之堆積亦不會產生熱劣化。
圖1為以電子顯微鏡觀察使用旋轉塗佈器將實施例1中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,且在400℃進行2分鐘之燒成後之基板上面部之剖
面的照片(倍率為10萬倍)。
圖2為以電子顯微鏡觀察使用旋轉塗佈器將實施例2中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,且在400℃進行2分鐘之燒成後之基板上面部之剖面的照片(倍率為10萬倍)。
圖3為以電子顯微鏡觀察使用旋轉塗佈器將實施例3中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,且在400℃進行2分鐘之燒成後之基板上面部之剖面的照片(倍率為10萬倍)。
圖4為以電子顯微鏡觀察使用旋轉塗佈器將實施例4中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,且在400℃進行2分鐘之燒成後之基板上面部之剖面的照片(倍率為10萬倍)。
圖5為以電子顯微鏡觀察使用旋轉塗佈器將比較例2中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,且在400℃進行2分鐘之燒成後之基板上面部之剖面之照片(倍率為10萬倍)。
本發明為包含具有式(1)之單位構造之聚合物之阻劑底層膜形成組成物。
本發明中上述微影用阻劑底層膜形成組成物包含上述聚合物與溶劑。而且,可包含交聯劑與酸,且可視需要包含酸產生劑、界面活性劑等添加劑。該組成物之固體成分
為0.1至70質量%,或為0.1至60質量%。固體成分為自阻劑底層膜形成組成物去除溶劑之全部成分之含有比例。固體成分中可以1至100質量%,或1至99.9質量%,或50至99.9質量%,或50至95質量%,或50至90質量%之比例含有上述聚合物。
本發明所用之聚合物之重量平均分子量為600~1000000,或600至200000。
式(1)中,R1、R2及R3為環的氫原子之取代基,各獨立為鹵基、硝基、胺基、羥基、碳數1~10之烷基、碳數2~10之烯基、碳數6~40之芳基、或可包含醚鍵、酮鍵或酯鍵之該等之組合,R4為氫原子、碳數1~10之烷基、碳數2至10之烯基、碳數6至40之芳基、或可包含醚鍵、酮鍵或酯鍵之該等之組合,R5為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、苯基、碳數1至10之烷氧基或羥基取代之碳數6至40之芳基、或雜環基,R6為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基或羥基取代之碳數1至10之烷基、碳數6至40之芳基、或雜環基,或者R5與R6可與其等所鍵結之碳原子一起形成環,環A及環B分別表示苯環、萘環或蒽環,n1、n2及n3分別為0以上至環上可取代之最大數之整數。
羧酸烷酯基之烷基列舉為碳數1~10之烷基。
碳數1至10之烷基列舉為甲基、乙基、正丙基、異丙基、環丙基、正丁基、異丁基、第二丁基、第三
丁基、環丁基、1-甲基-環丙基、2-甲基-環丙基、正戊基、1-甲基-正丁基、2-甲基-正丁基、3-甲基-正丁基、1,1-二甲基-正丙基、1,2-二甲基-正丙基、2,2-二甲基-正丙基、1-乙基-正丙基、環戊基、1-甲基-環丁基、2-甲基-環丁基、3-甲基-環丁基、1,2-二甲基-環丙基、2,3-二甲基-環丙基、1-乙基-環丙基、2-乙基-環丙基、正己基、1-甲基-正戊基、2-甲基-正戊基、3-甲基-正戊基、4-甲基-正戊基、1,1-二甲基-正丁基、1,2-二甲基-正丁基、1,3-二甲基-正丁基、2,2-二甲基-正丁基、2,3-二甲基-正丁基、3,3-二甲基-正丁基、1-乙基-正丁基、2-乙基-正丁基、1,1,2-三甲基-正丙基、1,2,2-三甲基-正丙基、1-乙基-1-甲基-正丙基、1-乙基-2-甲基-正丙基、環己基、1-甲基-環戊基、2-甲基-環戊基、3-甲基-環戊基、1-乙基-環丁基、2-乙基-環丁基、3-乙基-環丁基、1,2-二甲基-環丁基、1,3-二甲基-環丁基、2,2-二甲基-環丁基、2,3-二甲基-環丁基、2,4-二甲基-環丁基、3,3-二甲基-環丁基、1-正丙基-環丙基、2-正丙基-環丙基、1-異丙基-環丙基、2-異丙基-環丙基、1,2,2-三甲基-環丙基、1,2,3-三甲基-環丙基、2,2,3-三甲基-環丙基、1-乙基-2-甲基-環丙基、2-乙基-1-甲基-環丙基、2-乙基-2-甲基-環丙基及2-乙基-3-甲基-環丙基等。
碳數2至10之烯基列舉為乙烯基、1-丙烯基、2-丙烯基、1-甲基-1-乙烯基、1-丁烯基、2-丁烯基、3-丁烯基、2-甲基-1-丙烯基、2-甲基-2-丙烯基、1-乙基乙烯基、1-甲基-1-丙烯基、1-甲基-2-丙烯基、1-戊烯基、2-
戊烯基、3-戊烯基、4-戊烯基、1-正丙基乙烯基、1-甲基-1-丁烯基、1-甲基-2-丁烯基、1-甲基-3-丁烯基、2-乙烯-2-丙烯基、2-甲基-1-丁烯基、2-甲基-2-丁烯基、2-甲基-3-丁烯基、3-甲基-1-丁烯基、3-甲基-2-丁烯基、3-甲基-3-丁烯基、1,1-二甲基-2-丙烯基、1-異丙基乙烯基、1,2-二甲基-1-丙烯基、1,2-二甲基-2-丙烯基、1-環戊烯基、2-環戊烯基、3-環戊烯基、1-己烯基、2-己烯基、3-己烯基、4-己烯基、5-己烯基、1-甲基-1-戊烯基、1-甲基-2-戊烯基、1-甲基-3-戊烯基、1-甲基-4-戊烯基、1-正丁基乙烯基、2-甲基-1-戊烯基、2-甲基-2-戊烯基、2-甲基-3-戊烯基、2-甲基-4-戊烯基、2-正丙基-2-丙烯基、3-甲基-1-戊烯基、3-甲基-2-戊烯基、3-甲基-3-戊烯基、3-甲基-4-戊烯基、3-乙基-3-丁烯基、4-甲基-1-戊烯基、4-甲基-2-戊烯基、4-甲基-3-戊烯基、4-甲基-4-戊烯基、1,1-二甲基-2-丁烯基、1,1-二甲基-3-丁烯基、1,2-二甲基-1-丁烯基、1,2-二甲基-2-丁烯基、1,2-二甲基-3-丁烯基、1-甲基-2-乙基-2-丙烯基、1-第二丁基乙烯基、1,3-二甲基-1-丁烯基、1,3-二甲基-2-丁烯基、1,3-二甲基-3-丁烯基、1-異丁基乙烯基、2,2-二甲基-3-丁烯基、2,3-二甲基-1-丁烯基、2,3-二甲基-2-丁烯基、2,3-二甲基-3-丁烯基、2-異丙基-2-丙烯基、3,3-二甲基-1-丁烯基、1-乙基-1-丁烯基、1-乙基-2-丁烯基、1-乙基-3-丁烯基、1-正丙基-1-丙烯基、1-正丙基-2-丙烯基、2-乙基-1-丁烯基、2-乙基-2-丁烯基、2-乙基-3-丁烯基、1,1,2-三甲基-2-丙烯基、1-第三丁基乙烯
基、1-甲基-1-乙基-2-丙烯基、1-乙基-2-甲基-1-丙烯基、1-乙基-2-甲基-2-丙烯基、1-異丙基-1-丙烯基、1-異丙基-2-丙烯基、1-甲基-2-環戊烯基、1-甲基-3-環戊烯基、2-甲基-1-環戊烯基、2-甲基-2-環戊烯基、2-甲基-3-環戊烯基、2-甲基-4-環戊烯基、2-甲基-5-環戊烯基、2-亞甲基-環戊基、3-甲基-1-環戊烯基、3-甲基-2-環戊烯基、3-甲基-3-環戊烯基、3-甲基-4-環戊烯基、3-甲基-5-環戊烯基、3-亞甲基-環戊基、1-環己烯基、2-環己烯基及3-環己烯基等。
碳數1至10之烷氧基列舉為甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第二丁氧基、第三丁氧基、正戊氧基、1-甲基-正丁氧基、2-甲基-正丁氧基、3-甲基-正丁氧基、1,1-二甲基-正丙氧基、1,2-二甲基-正丙氧基、2,2-二甲基-正丙氧基、1-乙基-正丙氧基、正己氧基、1-甲基-正戊氧基、2-甲基-正戊氧基、3-甲基-正戊氧基、4-甲基-正戊氧基、1,1-二甲基-正丁氧基、1,2-二甲基-正丁氧基、1,3-二甲基-正丁氧基、2,2-二甲基-正丁氧基、2,3-二甲基-正丁氧基、3,3-二甲基-正丁氧基、1-乙基-正丁氧基、2-乙基-正丁氧基、1,1,2-三甲基-正丙氧基、1,2,2-三甲基-正丙氧基、1-乙基-1-甲基-正丙氧基及1-乙基-2-甲基-正丙氧基等。
上述碳數6至40之芳基列舉為苯基、鄰-甲基苯基、間-甲基苯基、對-甲基苯基、鄰-氯苯基、間-氯苯基、對-氯苯基、鄰-氟苯基、對-氟苯基、鄰-甲氧基苯
基、對-甲氧基苯基、對-硝基苯基、對-氰基苯基、α-萘基、β-萘基、鄰-聯苯基、間-聯苯基、對-聯苯基、1-蒽基、2-蒽基、9-蒽基、1-菲基、2-菲基、3-菲基、4-菲基及9-菲基、1-芘基等。
上述雜環基較好為由包含氮、硫、氧之5至6員環之雜環所成之基,列舉為例如吡咯基、呋喃基、噻吩基、咪唑基、噁唑基、噻唑基、吡唑基、異噁唑基、異噻唑基、吡啶基等。
以羥基取代之碳數6至40之芳基列舉為例如自酚、二羥基苯、三羥基苯、萘酚、二羥基萘、三羥基萘、羥基蒽、二羥基蒽、三羥基蒽等衍生之基。
環A及環B各表示苯環、萘環、或蒽環。
環A為苯環時n1為0至4之整數。環A為萘環時n1為0至6之整數。環A為蒽環時n1為0至8之整數。
n2為0至1之整數。
而且,環B為苯環時n3為0至3之整數。環B為萘環時n3為0至5之整數,環B為蒽環時為0至7之整數。
式(1)之單位構造可使用例如環A及環B均為苯環,n1、n2及n3為0,R4為氫原子時之單位構造。
而且,式(1)之單位構造可使用R5為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、苯基、碳數1至10之烷氧基或羥基取代之苯基、萘基、蒽基或芘基,且R6為氫原子之單位構造。
本發明中,係在式(1)之單位構造包含環A及環B之雜環化合物(含雜環基之芳香族化合物)與醛類或酮類之間形成酚醛清漆樹脂。
本發明之聚合物之製造所用之醛類列舉為甲醛、仲甲醛、乙醛、丙醛、丁醛、異丁醛、戊醛、己醛、2-甲基丁基醛、己基醛、十一烷醛、7-甲氧基-3,7-二甲基辛基醛、環己烷醛、3-甲基-2-丁基醛、乙二醛、丙二醛、丁二醛、戊二醛、己二醛等飽和脂肪族醛類,丙烯醛、甲基丙烯醛等不飽和脂肪族醛類,糠醛、吡啶醛等雜環式醛類,苯甲醛、萘醛、蒽醛、菲醛、水楊醛、苯基乙醛、3-苯基丙醛、甲苯醛、(N,N-二甲基胺基)苯甲醛、乙醯氧基苯甲醛、1-芘羧基醛、茴香醛、對苯二甲醛等芳香族醛類等。最好使用芳香族醛。
另外,本發明之聚合物製造所用之酮類為二芳基酮,列舉為例如二苯基酮、苯基萘基酮、二萘基酮、苯基甲苯基酮、二甲苯基酮、9-茀酮等。
本發明所用之聚合物為包含使環A及環B之雜環化合物(含雜環基之芳香族化合物)與醛類或酮類縮合獲得之酚醛清漆樹脂。該縮合反應相對於含雜環基之芳香族化合物所含之參與反應之苯基1當量,可使用0.1至10當量之比例之醛類或酮類。
上述縮合反應中使用之酸觸媒係使用例如硫酸、磷酸、過氯酸等無機酸類,對-甲苯磺酸、對-甲苯磺酸單水合物等有機磺酸類、甲酸、草酸等羧酸類。
酸觸媒之使用量係依據使用之酸類種類而有各種選擇。通常,對於含雜環基之芳香族化合物100質量份為0.001至10000質量份,較好為0.01至1000質量份,更好為0.1至100質量份。
上述縮合反應亦可在無溶劑下進行,但通常係使用溶劑進行。至於溶劑只要不妨礙反應者則全部可使用。列舉為例如四氫呋喃、二噁烷等環狀醚類。又,使用之酸觸媒若為例如甲酸之液狀者則亦可兼顧作為溶劑之角色。
縮合時之反應溫度通常為40℃至200℃。反應時間係依據反應溫度而有各種選擇,但通常為30分鐘至50小時左右。
如上述所得之聚合物之重量平均分子量Mw通常為500至1000000,或600至200000。
具有式(1)之單位構造之聚合物可例示如下。
上述聚合物在全部聚合物中可以30質量%以內混合其他聚合物使用。
該等聚合物列舉為聚丙烯酸酯化合物、聚甲基丙烯酸酯化合物、聚丙烯醯胺化合物、聚甲基丙烯醯胺化合物、聚乙烯基化合物、聚苯乙烯化合物、聚馬來醯亞胺化合物、聚馬來酸酐、及聚丙烯腈化合物。
聚丙烯酸酯化合物之原料單體列舉為丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸苄酯、丙烯酸萘酯、丙烯酸蒽酯、丙烯酸蒽基甲酯、丙烯酸苯酯、丙烯酸 2-羥基乙酯、丙烯酸 2-羥基丙酯、丙烯酸 2,2,2-三氟乙酯、丙烯酸 4-羥基丁酯、丙烯酸異丁酯、丙烯酸第三丁酯、丙烯酸環己酯、丙烯酸異冰片酯、丙烯酸 2-甲氧基乙酯、丙烯酸
甲氧基三乙二醇酯、丙烯酸 2-乙氧基乙酯、丙烯酸四氫糠酯、丙烯酸 3-甲氧基丁酯、丙烯酸 2-甲基-2-金剛烷酯、丙烯酸 2-乙基-2-金剛烷酯、丙烯酸 2-丙基-2-金剛烷酯、丙烯酸 2-甲氧基丁基-2-金剛烷酯、丙烯酸 8-甲基-8-三環癸酯、丙烯酸 8-乙基-8-三環癸酯、及5-丙烯醯氧基-6-羥基降冰片烯-2-羧酸-6-內酯等。
聚甲基丙烯酸酯化合物之原料單體列舉為甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸正戊酯、甲基丙烯酸環己酯、甲基丙烯酸苄酯、甲基丙烯酸萘酯、甲基丙烯酸蒽酯、甲基丙烯酸蒽基甲酯、甲基丙烯酸苯酯、甲基丙烯酸 2-苯基乙酯、甲基丙烯酸 2-羥基乙酯、甲基丙烯酸 2-羥基丙酯、甲基丙烯酸 2,2,2-三氟乙酯、甲基丙烯酸 2,2,2-三氯乙酯、丙烯酸甲酯、甲基丙烯酸異丁酯、甲基丙烯酸 2-乙基己酯、甲基丙烯酸異癸酯、甲基丙烯酸正月桂酯、甲基丙烯酸正硬脂酯、甲基丙烯酸甲氧基二乙二醇酯、甲基丙烯酸甲氧基聚乙二醇酯、甲基丙烯酸四氫糠酯、甲基丙烯酸異冰片酯、甲基丙烯酸第三丁酯、甲基丙烯酸異硬脂酯、甲基丙烯酸正丁氧基乙酯、甲基丙烯酸 3-氯-2-羥基丙酯、甲基丙烯酸 2-甲基-2-金剛烷酯、甲基丙烯酸 2-乙基-2-金剛烷酯、甲基丙烯酸 2-丙基-2-金剛烷酯、甲基丙烯酸 2-甲氧基丁基-2-金剛烷酯、甲基丙烯酸8-甲基-8-三環癸酯、甲基丙烯酸 8-乙基-8-三環癸酯、5-甲基丙烯醯氧基-6-羥基降冰片烯-2-羧酸-6-內酯、及甲基丙烯酸 2,2,3,3,4,4,4-七氟丁酯等。
丙烯醯胺化合物列舉為丙烯醯胺、N-甲基丙烯醯胺、N-乙基丙烯醯胺、N-苄基丙烯醯胺、N-苯基丙烯醯胺及N,N-二甲基丙烯醯胺等。
聚甲基丙烯醯胺化合物之原料單體列舉為甲基丙烯醯胺、N-甲基甲基丙烯醯胺、N-乙基甲基丙烯醯胺、N-苄基甲基丙烯醯胺、N-苯基甲基丙烯醯胺、及N,N-二甲基甲基丙烯醯胺等。
聚乙烯基化合物之原料單體列舉為乙烯基醚、甲基乙烯基醚、苄基乙烯基醚、2-羥基乙基乙烯基醚、苯基乙烯基醚及丙基乙烯基醚等。
聚苯乙烯化合物之原料單體列舉為苯乙烯、甲基苯乙烯、氯苯乙稀、溴苯乙烯及羥基苯乙烯等。
聚馬來醯亞胺化合物之原料單體列舉為馬來醯亞胺、N-甲基馬來醯亞胺、N-苯基馬來醯亞胺及N-環己基馬來醯亞胺等。
該等聚合物之製造可藉由將加成聚合性單體及視需要添加之鏈轉移劑(相對於單體為質量10%以下)溶解於有機溶劑後,添加聚合起始劑進行聚合反應,隨後,添加聚合終止劑而製造。至於聚合起始劑之添加量相對於單體質量為1至10%,聚合終止劑之添加量為0.01至0.2質量%。使用之有機溶劑列舉為丙二醇單甲基醚、丙二醇單丙基醚、乳酸乙酯、環己酮、甲基乙基酮及二甲基甲醯胺等,鏈轉移劑列舉為十二烷硫醇及十二烷基硫醇等,至於聚合起始劑列舉為偶氮雙異丁腈及偶氮雙環己烷甲腈
等,而且聚合終止劑列舉為4-甲氧基酚等。反應溫度係在30至100℃,反應時間在1至48小時適當選擇。
本發明之阻劑底層膜形成組成物可包含交聯劑成分。該交聯劑成分列舉為三聚氰胺系、取代之脲系、或該等之聚合物系等。較好,為具有至少2個交聯形成取代基之交聯劑,且為甲氧基甲基化甘醇脲、丁氧基甲基化甘醇脲、甲氧基甲基化三聚氰胺、丁氧基甲基化三聚氰胺、甲氧基甲基化苯胍、丁氧基甲基化苯胍、甲氧基甲基化脲、丁氧基甲基化脲、甲氧基甲基化硫脲、或甲氧基甲基化硫脲等之化合物。另外,亦可使用該等化合物之縮合物。
又,上述交聯劑可使用耐熱性高之交聯劑。至於耐熱性高之交聯劑可適當地使用分子內含有具有芳香族環(例如苯環、萘環)之交聯形成取代基之化合物。
該化合物列舉為具有下述式(3)之部分構造之化合物,或具有下述式(4)之重複單位之聚合物或寡聚物。
式(3)中,R10及R11分別為氫原子、碳數1至10之烷基、或碳數6至20之芳基,n10表示1至4之整數,n11表示1至(5-n10)之整數,(n10+n11)表示2至5之整數。
式(4)中,R12為氫原子或碳數1至10之烷基,R13為碳數1至10之烷基,n12為1至4之整數,n13為0至(4-n12),(n12+n13)表示1至4之整數。寡聚物及聚合物可在重複單位構造之數目為2至100,或2至
50之範圍內使用。
該等烷基及芳基可例示上述之烷基及芳基。
式(3)、式(4)之化合物、聚合物、寡聚物例示如下。
上述化合物可由旭有機材工業(股)、本州化學
工業(股)之製品取得。例如上述交聯劑中之式(3-21)之化合物可以旭有機材工業(股)以商品名TM-BIP-A取得。且,式(3-22)之化合物可由本州化學工業(股)以商品名TMOM-BP取得。
交聯劑之添加量隨著使用之塗佈溶劑、使用之底層基板、所要求之溶液黏度、所要求之膜形狀等而變動,但相對於總固體成分為0.001至80質量%,較好為0.01至50質量%,更好為0.05至40質量%。該等交聯劑係利用自身縮合而引起交聯反應,但本發明之上述聚合物中存在交聯性取代基時,可與該等交聯性取代基引起交聯反應。
本發明中可調配對-甲苯磺酸、三氟甲烷磺酸、吡啶鎓對-甲苯磺酸、水楊酸、磺基水楊酸、檸檬酸、苯甲酸、羥基苯甲酸、萘羧酸等酸性化合物或/及2,4,4,6-四溴環己二烯酮、苯偶因甲苯磺酸酯、2-硝基苄基甲苯磺酸酯、其他有機磺酸烷酯、三氟甲烷磺酸之四級銨鹽等熱酸產生劑作為用於促進上述交聯反應之觸媒。調配量相對於總固體成分為0.0001至20質量%,較好為0.0005至10質量%,更好為0.01至3質量%。
本發明之微影用阻劑底層膜形成組成物為了使微影步驟中與被覆於上層之光阻之酸性度一致,可添加光酸產生劑。較佳之光酸產生劑列舉為例如雙(4-第三丁基苯基)錪三氟甲烷磺酸鹽、三苯基鋶三氟甲烷磺酸鹽等鎓鹽系光酸產生劑類,苯基-雙(三氯甲基)-s-三嗪等含鹵素之化合物系光酸產生劑類,苯偶因甲苯磺酸酯、N-羥基
琥珀醯亞胺三氟甲烷磺酸酯等磺酸系光酸產生劑類等。上述光酸產生劑相對於總固體成分為0.2至10質量%,較好為0.4至5質量%。
本發明之微影用阻劑底層膜材料中,除上述以外,亦可視需要添加其他吸光劑、流變調整劑、接著輔助劑、界面活性劑等。
其他吸光劑列舉為例如「工業用色素之技術與市場」(CMC出版)或「染料便覽」(有機合成化學協會編)所記載之市售吸光劑,可適當的使用例如C.I.分散黃1、3、4、5、7、8、13、23、31、49、50、51、54、60、64、66、68、79、82、88、90、93、102、114及124;C.I.分散橙1、5、13、25、29、30、31、44、57、72及73;C.I.分散紅1、5、7、13、17、19、43、50、54、58、65、72、73、88、117、137、143、199及210;C.I.分散紫43;C.I.分散藍96;C.I.螢光亮光劑112、135及163;C.I.溶劑橙2及45;C.I.溶劑紅1、3、8、23、24、25、27及49;C.I.溶劑綠10;C.I.溶劑棕2等。上述吸光劑通常以相對於微影用阻劑底層膜材料之總固體成分為10質量%以下,較好為5質量%以下之比例調配。
流變調整劑添加之主要目的係為提高阻劑底層膜形成組成物之流動性,尤其是在烘烤步驟中,提高阻劑底層膜之膜厚均勻性或提高阻劑底層膜形成組成物對通孔內部之填充性。
具體而言可列舉為苯二甲酸二甲酯、苯二甲酸二乙
酯、苯二甲酸二異丁酯、苯二甲酸二己酯、苯二甲酸丁酯異癸酯等苯二甲酸衍生物,己二酸二正丁酯、己二酸二異丁酯、己二酸二異辛酯、己二酸辛酯癸酯等己二酸衍生物,馬來酸二正丁酯、馬來酸二乙酯、馬來酸二壬酯等馬來酸衍生物,油酸甲酯、油酸丁酯、油酸四氫糠酯等油酸衍生物、或硬脂酸正丁酯、硬脂酸丙三醇酯等硬脂酸衍生物。該等流變調整劑相對於微影用阻劑底層膜材料之總固體成分,通常以未達30質量%之比例調配。
接著輔助劑添加之目的主要為提高基板或阻劑與阻劑底層膜形成組成物之密著性,尤其用以在顯像中不使阻劑剝離。具體而言,可列舉為三甲基氯矽烷、二甲基乙烯基氯矽烷、甲基二苯基氯矽烷、氯甲基二甲基氯矽烷等氯矽烷類,三甲基甲氧基矽烷、二甲基二乙氧基矽烷、甲基二甲氧基矽烷、二甲基乙烯基乙氧基矽烷、二苯基二甲氧基矽烷、苯基三乙氧基矽烷等烷氧基矽烷類,六甲基二矽氮烷、N,N’-雙(三甲基矽烷基)脲、二甲基三甲基矽烷基胺、三甲基矽烷基咪唑等矽氮烷類,乙烯基三氯矽烷、γ-氯丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷等矽烷類,苯并***、苯并咪唑、吲唑、咪唑、2-巰基苯并咪唑、2-巰基苯噻唑、2-巰基苯并噁唑、脲唑(urazole)、硫脲嘧啶(thiouracil)、巰基咪唑、巰基嘧啶等雜環式化合物,或1,1-二甲基脲、1,3-二甲基脲等脲,或硫脲化合物。該等接著輔助劑相對於微影用阻劑底層膜材料之總固體成分通
常以未達5質量%,較好未達2質量%之比例調配。
本發明之微影用阻劑底層膜材料為了不發生針孔或條紋,且進一步提高對表面不均之塗佈性,而可調配界面活性劑。界面活性劑可列舉為例如聚氧伸乙基月桂基醚、聚氧伸乙基硬脂基醚、聚氧伸乙基晶蠟基醚、聚氧伸乙基油基醚等聚氧伸乙基烷基醚類,聚氧伸乙基辛基酚醚、聚氧伸乙基壬基酚醚等聚氧伸乙基烷基烯丙基醚類,聚氧伸乙基.聚氧伸丙基嵌段共聚物類、山梨糖醇酐單月桂酸酯、山梨糖醇酐單棕櫚酸酯、山梨糖醇酐單硬脂酸酯、山梨糖醇酐單油酸酯、山梨糖醇酐三油酸酯、山梨糖醇酐三硬脂酸酯等山梨糖醇酐脂肪酸酯類,聚氧伸乙基山梨糖醇酐單月桂酸酯、聚氧伸乙基山梨糖醇酐單棕櫚酸酯、聚氧伸乙基山梨糖醇酐單硬脂酸酯、聚氧伸乙基山梨糖醇酐三油酸酯、聚氧伸乙基山梨糖醇酐三硬脂酸酯等聚氧伸乙基山梨糖醇酐脂肪酸酯類等之非離子系界面活性劑,F TOP EF301、EF303、EF352(以上為TOHCHEM PRODUCTS(股)製,商品名)、MEGAFAC F171、F173、R-30(以上為大日本油墨(股)製,商品名)、FLORARD FC430、FC431(以上為住友3M(股)製,商品名)、ASAHI GUARD AG710、SURFLON S-382、SC101、SC102、SC103、SC104、SC105、SC106(以上為旭硝子(股)製,商品名)等氟系界面活性劑,有機矽氧烷聚合物KP341(信越化學工業(股)製)等。該等界面活性劑之調配量相對於本發明之微影用阻劑底層膜材料之總固體成分通常為2.0質量
%以下,較好為1.0質量%以下。該等界面活性劑可單獨添加,且亦可以2種以上之組合添加。
本發明中,使上述聚合物及交聯成分、交聯觸媒等溶解之溶劑可使用乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丁基醚、乙二醇單異丙基醚、乙二醇甲基醚乙酸酯、乙二醇乙基醚乙酸酯、甲基溶纖素乙酸酯、乙基溶纖素乙酸酯、二乙二醇、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇單乙基醚乙酸酯、丙二醇、丙二醇單甲基醚、丙二醇單丁基醚、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚、丙二醇單乙基醚乙酸酯、丙二醇丙基醚乙酸酯、二丙二醇單甲基醚、二丙二醇單乙基醚、三乙二醇二甲基醚、甲苯、二甲苯、苯乙烯、甲基乙基酮、環戊酮、環己酮、2-羥基丙酸乙酯、2-羥基-2-甲基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、3-乙氧基丙酸甲酯、特戊酸甲酯、特戊酸乙酯、乙酸乙酯、乙酸丁酯、乳酸乙酯、乳酸丁酯、1-辛醇、乙二醇、己二醇、三亞甲基二醇、1-甲氧基-2-丁醇、環己醇、二丙酮醇、糠醇、四氫糠醇、丙二醇、苄基醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁內酯、丙酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基正丁基酮、乙酸異丙基酮、乙酸正丙酯、乙酸異丁酯、甲醇、乙醇、異丙醇、第三丁醇、烯丙基醇、正丙醇、2-甲基-2-丁醇、異丁醇、正丁
醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、1-辛醇、乙二醇、己二醇、三亞甲基二醇、1-甲氧基-2-丁醇、二丙酮醇、糠醇、四氫糠醇、丙二醇、苄基醇、異丙基醚、1,4-二噁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、1,3-二甲基-2-咪唑啶酮、二甲基亞碸、N-環己基-2-吡咯烷酮等。該等有機溶劑可單獨使用,或以2種以上之組合使用。
再者,可混合丙二醇單丁基醚、丙二醇單丁基醚乙酸酯等高沸點溶劑而使用。該等溶劑中,以丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、丙二醇單丁基醚、乳酸乙酯、乳酸丁酯及環己酮等對於提高平流性較佳。
本發明所使用之阻劑為光阻劑或電子束阻劑。
塗佈於本發明之微影用阻劑底層膜之上部之光阻,負型、正型均可使用,有由酚醛清漆樹脂與1,2-萘醌疊氮磺酸酯所組成之正型光阻、由具有利用酸分解而提升鹼溶解速度之基之黏結劑與光酸產生劑所成之化學增幅型光阻劑、由鹼可溶性黏結劑與利用酸分解而提升光阻劑之鹼溶解速度之低分子化合物與光酸產生劑所成之化學增幅型光阻劑,由具有利用酸分解而提升鹼溶解速度之基之黏結劑與利用酸分解而提升光阻之鹼溶解速度之低分子化合物及光酸產生劑所成之化學增幅型光阻劑,骨架中具有Si原子之光阻劑等,列舉為例如羅門哈斯公司製造之商品名APEX-E。
另外,塗佈於本發明之微影用阻劑底層膜之上部之電子束阻劑列舉為例如由主鏈中含Si-Si鍵且末端含芳香族環之樹脂與藉由電子束之照射產生酸之酸產生劑所成之組成物,或由以含N-羧基胺之有機基取代羥基而成之聚(對-羥基苯乙烯)與藉由電子束之照射產生酸之酸產生劑所成之組成物等。後者之電子束阻劑組成物係使藉由電子束照射而自酸產生劑產生之酸與聚合物側鏈之N-羧基胺氧基反應,使聚合物側鏈分解成羥基且顯示鹼可溶性而溶解於鹼顯像液中,形成阻劑圖型者。藉由該電子束之照射產生酸之酸產生劑列舉為1,1-雙[對-氯苯基]-2,2,2-三氯乙烷、1,1-雙[對-甲氧基苯基]-2,2,2-三氯乙烷、1,1-雙[對-氯苯基]-2,2-二氯乙烷、2-氯-6-(三氯甲基)吡啶等鹵化有機化合物,三苯基鏻鹽、二苯基錪鹽等鎓鹽,硝基苄基甲苯磺酸酯、二硝基苄基甲苯磺酸酯等磺酸酯。
至於具有使用本發明之微影用阻劑底層膜材料形成之阻劑底層膜之阻劑的顯像液可使用氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨水等無機鹼類,乙胺、正丙基胺等之一級胺類,二乙胺、二正丁基胺等之二級胺類,三乙胺、甲基二乙胺等之三級胺類,二甲基乙醇胺、三乙醇胺等之醇胺類,氫氧化四甲基銨、氫氧化四乙基銨、膽鹼等之四級銨鹽,吡咯、哌啶等之環狀胺類等鹼類之水溶液。另外,亦可於上述鹼類之水溶液中適量添加異丙醇等醇類、非離子系等之界面活性劑而使用。該等中較佳之顯像液為四級銨鹽,更好為氫氧化四甲基銨及膽
鹼。
接著,針對本發明之阻劑圖型形成法加以說明時,以旋轉器、塗佈器等之適當塗佈方法,將阻劑底層膜形成組成物塗佈於精密積體電路元件之製造中使用之基板(例如矽/二氧化矽被覆、玻璃基板、ITO基板等透明基板)上後,經烘烤硬化作成塗佈型底層膜。此處,阻劑底層膜之膜厚較好為0.01至3.0μm。且塗佈後烘烤之條件為在80至350℃歷時0.5至120分鐘。隨後於阻劑底層膜上直接塗佈阻劑、或視需要使1層至數層之塗膜材料成膜於塗佈型底層膜上後塗佈阻劑,且通過特定之遮罩進行光或電子束之照射,經顯像、洗淨、乾燥,可獲得良好之阻劑圖型。視需要亦可在光或電子束之照射後進行加熱(PEB:曝光後烘烤(Post Exposure Bake))。接著,可藉乾蝕刻去除以前述步驟顯像去除阻劑之部分之阻劑底層膜,於基板上形成期望之圖型。
上述光阻劑之曝光光係使用近紫外線、遠紫外線或極紫外線(例如,EUV,波長13.5nm)等之化學線,例如248nm(KrF雷射光)、193nm(ArF雷射光)、157nm(F2雷射光)等波長之光。光照射只要是可自光酸產生劑產生酸之方法即可無特別限制地使用,曝光量為1至2000mJ/cm2,或為10至1500mJ/cm2,或為50至1000mJ/cm2。
且電子束阻劑之電子束照射可例如使用電子束照射裝置照射。
本發明可經由下列步驟製造半導體裝置:以阻劑底層膜形成組成物於半導體基板上形成阻劑底層膜之步驟,於其上形成阻劑膜之步驟,藉由以光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型蝕刻該阻劑底層膜之步驟,以及藉由經圖型化之阻劑底層膜加工半導體基板之步驟。
今後,進行光阻圖型之微細化時,會產生解像度問題或阻劑圖型在顯像後崩塌之問題,而期望阻劑之薄膜化。因此,需要有一種在基板加工中難以獲得充分的阻劑圖型膜厚,且不僅是阻劑圖型,在阻劑與經加工之半導體基板之間作成之阻劑底層膜亦具有在基板加工時作為遮罩功能之製程。至於此製程用之阻劑底層膜,與過去之高蝕刻速率性阻劑底層膜不同,要求具有乾蝕刻速度之選擇比接近阻劑之微影用阻劑底層膜、具有乾蝕刻速度之選擇比比阻劑小之微影用阻劑底層膜或乾蝕刻速度之選擇比比半導體基板小之微影用阻劑底層膜。又,此阻劑底層膜亦兼具有可賦予抗反射能之過去之抗反射膜功能。
另一方面,為獲得微細之阻劑圖型,亦已開始使用在乾蝕刻阻劑底層膜時,使阻劑圖型與阻劑底層膜變得比阻劑顯像時之圖型寬度更細微之製程。此種製程用之阻劑底層膜與過去之高蝕刻速率性抗反射膜不同,要求具有乾蝕刻速度之選擇比接近阻劑之阻劑底層膜。且,該阻劑底層膜亦可兼具有可賦予抗反射能之過去之抗反射膜之功能。
本發明可在使本發明之阻劑底層膜成膜於基板上後,直接於阻劑底層膜上塗佈阻劑,或視需要於阻劑底層膜上成膜1層至數層之塗膜材料後,塗佈阻劑。藉此,可使阻劑之圖型寬度變狹窄,即使為了防止圖形崩塌而薄薄地被覆阻劑時,仍可藉由選擇適當之蝕刻氣體而加工基板。
亦即,可經過以下步驟製造半導體裝置:以阻劑底層膜形成組成物,於半導體基板上形成阻劑底層膜之步驟,以含有矽成分等之塗膜材料於其上形成硬遮罩或藉由蒸鍍形成硬遮罩(例如氮化氧化矽)之步驟,進而於其上形成阻劑膜之步驟,藉由以光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型以鹵系氣體蝕刻硬遮罩之步驟,藉由經圖型化之硬遮罩,以氧系氣體或氫系氣體蝕刻該阻劑底層膜之步驟,以及藉由經圖型化之阻劑底層膜,以鹵系氣體加工半導體基板之步驟。
本發明之微影用阻劑底層膜形成組成物在考慮作為抗反射膜之效果時,由於光吸收部位納入於骨架中,故加熱乾燥時不會有擴散物擴散到光阻中,且,光吸收部位具有充分大的吸光性能,故抗反射光效果高。
本發明之微影用阻劑底層膜形成組成物係熱安定性高,而防止因燒成時之分解物對上層膜造成污染,且對燒成步驟之溫度裕度具有餘裕者。
再者,本發明之微影用阻劑底層膜材料係依據製程條件,可使用作為具有防止光反射之功能,進而防
止基板與光阻之相互作用,或防止光阻劑中所用材料或光阻劑曝光時生成之物質對基板造成不良作用之功能之膜。
於100mL之四頸燒瓶中添加2-苯基吲哚(4.00g,0.021mol,東京化成工業(股)製)、1-萘醛(3.23g,0.021mol,東京化成工業(股)製)、對甲苯磺酸單水合物(0.619g,0.0031mol,關東化學(股)製),饋入甲苯(14.58g,關東化學(股)製)且攪拌,升溫至110℃溶解且開始聚合。50分鐘後放冷至室溫後,於甲醇(300g,關東化學(股)製)中再沉澱。過濾所得沉澱物,以減壓乾燥機在50℃乾燥10小時,獲得目的之聚合物(式(2-2),以下簡稱為PId-NA)4.5g。
PId-NA之以GPC測量以聚苯乙烯換算測定之重量平均分子量Mw為2400,多分散度Mw/Mn為1.35。
於100mL之四頸燒瓶中添加2-苯基吲哚(3.50g,0.018mol,東京化成工業(股)製)、1-芘羧醛(4.17g,0.018mol,東京化成工業(股)製)、對甲苯磺酸單水合物(0.541g,0.0027mol,關東化學(股)製),饋入1,4-二噁烷(15.25g,關東化學(股)製)且攪拌,升溫至110℃溶解且開
始聚合。24小時後放冷至室溫後,於甲醇(250g,關東化學(股)製)中再沉澱。過濾所得沉澱物,以減壓乾燥機在50℃乾燥10小時,再於120℃乾燥24小時,獲得目的之聚合物(式(2-7),以下簡稱為PId-Py)3.7g。
PId-Py之以GPC測量之聚苯乙烯換算所測定之重量平均分子量Mw為1600,多分散度Mw/Mn為1.61。
在氮氣中,於100mL之四頸燒瓶中添加咔唑(6.69g,0.040mol,東京化成工業(股)製)、9-茀酮(7.28g,0.040mol,東京化成工業(股)製)、對甲苯磺酸單水合物(0.76g,0.0040mol,東京化成工業(股)製),饋入1,4-二噁烷(6.69g,關東化學(股)製)且攪拌,升溫至110℃溶解且開始聚合。24小時後放冷至60℃後,添加氯仿(34g,關東化學(股)製)稀釋,於甲醇(168g,關東化學(股)製)中再沉澱。過濾所得沉澱物,以減壓乾燥機在80℃乾燥24小時,獲得目的聚合物(式(5-1),以下簡稱為PCzFL)9.37g。
PCzFL之以GPC測量之聚苯乙烯換算所測定之重量平均分子量Mw為2800,多分散度Mw/Mn為1.77。
於合成例1所得之樹脂20g中,混合作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯80g中作成溶液。隨後,使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。
於合成例1所得之樹脂20g中,混合作為交聯劑之TMOM-BP(本州化學工業(股)製,商品名。成分為3,3’,5,5’-四甲氧基甲基-4,4’-二羥基聯苯)2.0g、作為觸媒之熱酸產生劑TAG-2689(美國,King(股)製,商品名。成分為三氟甲烷磺酸之四級銨鹽)0.10g、作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯88g中作成溶液。隨後,
使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。
於合成例2所得之樹脂20g中,混合作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯80g中作成溶液。隨後,使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。
於合成例2所得之樹脂20g中,混合作為交聯劑之TMOM-BP(本州化學工業(股)製,商品名。成分為3,3’,5,5’-四甲氧基甲基-4,4’-二羥基聯苯)2.0g、作為觸媒之熱酸產生劑TAG-2689(美國,King(股)製,商品名。成分為三氟甲烷磺酸之四級銨鹽)0.10g、作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯88g中作成溶液。隨後,使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。
於市售之甲酚酚醛清漆樹脂(使用甲酚與甲醛獲得之酚醛清漆樹脂)20g中,混合作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯80g中作成溶液。隨後,使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。以GPC測量之聚苯乙烯換算所測定之重量平均分子量Mw為4000,多分散度Mw/Mn為2.1。
於比較合成例1所得之樹脂20g中,混合作為界面活性劑之MEGAFAC R-30(大日本油墨化學(股)製,商品名)0.06g,且溶解於丙二醇單甲基醚乙酸酯80g中作成溶液。隨後,使用孔徑0.10μm之聚乙烯製微過濾器過濾,再使用孔徑0.05μm之聚乙烯製微過濾器過濾,調製以多層膜進行之微影製程中使用之阻劑底層膜形成組成物之溶液。
(光學參數之測定)
使用旋轉塗佈器將實施例1至4中調製之阻劑底層膜溶液塗佈於矽晶圓上。在加熱板上於240℃燒成1分鐘,
或於400℃燒成2分鐘,形成阻劑底層膜(膜厚0.25μm)。使用分光橢圓分光儀測定該等阻劑底層膜在波長248nm及波長193nm下之折射率(n值)及光學吸光係數(k值,亦稱為衰減係數)。結果示於表1。
(對光阻劑溶劑之溶出試驗)
使用旋轉塗佈器將實施例1至4及比較例1中調製之阻劑底層膜形成組成物之溶液塗佈於矽晶圓上。在加熱板上於400℃燒成2分鐘,形成阻劑底層膜(膜厚0.25μm)。將該阻劑底層膜浸漬於阻劑中使用之溶劑,例如乳酸乙酯、以及丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、環己酮中,且確認於該溶劑中不溶。
(乾蝕刻速度之測定)
乾蝕刻速度之測定中所用之蝕刻機及蝕刻氣體係使用以下者。
ES401(日本Scientific製):CF4
使用旋轉塗佈器分別將實施例1至4及比較例1中調製之阻劑底層膜形成組成物之溶液塗佈於矽晶圓上。在加熱板上於240℃燒成1分鐘,或於400℃燒成2分鐘,形成阻劑底層膜(膜厚0.25μm)。使用CF4氣體作為蝕刻氣體測定乾蝕刻速度。
另外,同樣使用旋轉塗佈器,將酚酚醛清漆樹脂(市售品,以GPC測量之聚苯乙烯換算所測定之重量平均分子量Mw為2000,多分散度Mw/Mn為2.5)塗佈於矽晶圓上,且在205℃燒成1分鐘,形成塗膜。使用CF4氣體作為蝕刻氣體測定乾蝕刻速度。進行以在205℃燒成1分鐘所得之酚酚醛清漆樹脂膜(膜厚0.25μm)之蝕刻速度作為1.00時之實施例1至4及比較例1之阻劑底層膜之乾蝕刻速度之比較。結果示於表2。速度比為(阻劑底層膜)/(酚酚醛清漆樹脂膜)之乾蝕刻速度比。
(對通孔晶圓基板之埋入性試驗)
使用旋轉塗佈器分別將實施例1至4及比較例2中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上。在加熱板上於400℃燒成2分鐘,形成阻劑底層膜(膜厚0.25μm)。使用直徑100nm,高度400nm之通孔圖型作為通孔晶圓基板。
使用旋轉塗佈器將實施例1至4中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,切斷在400℃進行2分鐘燒成後之基板,由以電子顯微鏡觀察之圖1至4之照片,可知充分填充至通孔內部。
另一方面,使用旋轉塗佈器將比較例2中調製之阻劑底層膜形成組成物之溶液塗佈於通孔晶圓基板上,切斷在400℃進行2分鐘燒成後之基板,由以電子顯微鏡觀察之圖5之照片,可知通孔內部有少許部分存在空洞。
本發明之以多層膜進行之微影製程中所用之阻劑底層膜材料與過去之高蝕刻速率性抗反射膜不同,可提供具有乾蝕刻速度之選擇比接近光阻劑或比光阻劑小、乾蝕刻速度之選擇比比半導體基板小,而且兼具有作為抗反射膜效果之阻劑底層膜。且,判知本發明之底層膜材料具有可藉蒸鍍而於上層上形成硬遮罩之耐熱性。
Claims (8)
- 一種阻劑底層膜形成組成物,其包含具有以下述式(1)表示之單位構造之聚合物,
- 如請求項1之阻劑底層膜形成組成物,其中環A及環B均為苯環,n1、n2及n3為0,R4為氫原子。
- 如請求項1之阻劑底層膜形成組成物,其中R5為氫原子、或可經鹵基、硝基、胺基、甲醯基、羧基、羧酸烷酯基、苯基、碳數1至10之烷氧基或羥基取代之苯基、萘基、蒽基或芘基,R6為氫原子。
- 如請求項1之阻劑底層膜形成組成物,其中進而包含交聯劑。
- 如請求項1之阻劑底層膜形成組成物,其中進而包含酸及/或酸產生劑。
- 一種阻劑底層膜,其係藉由將如請求項1至5中任一項之阻劑底層膜形成組成物塗佈於半導體基板上並經燒成而得。
- 一種半導體裝置之製造方法,其包含下列步驟:以如請求項1至5中任一項之阻劑底層膜形成組成物,於半導體基板上形成底層膜之步驟,於其上形成阻劑膜之步驟,藉由以光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型蝕刻該底層膜之步驟,以及藉由經圖型化之底層膜加工半導體基板之步驟。
- 一種半導體裝置之製造方法,其包含下列步驟:以如請求項1至5中任一項之阻劑底層膜形成組成物,於半導體基板上形成底層膜之步驟,於其上形成硬遮罩之步驟,進而於其上形成阻劑膜之步驟,藉由以光或電子束之照射及顯像而形成阻劑圖型之步驟,藉由阻劑圖型蝕刻硬 遮罩之步驟,藉由經圖型化之硬遮罩蝕刻該底層膜之步驟,以及藉由經圖型化之底層膜加工半導體基板之步驟。
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