TW201349384A - 製造太陽能電池使用之雙遮罩配置 - Google Patents

製造太陽能電池使用之雙遮罩配置 Download PDF

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TW201349384A
TW201349384A TW102113908A TW102113908A TW201349384A TW 201349384 A TW201349384 A TW 201349384A TW 102113908 A TW102113908 A TW 102113908A TW 102113908 A TW102113908 A TW 102113908A TW 201349384 A TW201349384 A TW 201349384A
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wafer
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Terry Bluck
Ian Latchford
Vinay Shah
Alex Riposan
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Intevac Inc
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Abstract

一配置用以在加工期間支撐基板，具有一晶圓載具。該載具具有一台座，以支撐該基板，並侷限該基板於預定位置。一內部遮罩建置以放置於該基板之上方，該內部遮罩具有一開口圖案，以遮蔽該基板不加工之部分，但暴露該基板之其餘部分，供進行加工。一外部遮罩建置以放置於該內部遮罩之上方，該外部遮罩具有一開口，用以暴露該內部遮罩具有開口圖案之部分，但覆蓋該內部遮罩之周邊。

Description

製造太陽能電池使用之雙遮罩配置
本案主張美國臨時專利申請案(Provisional Application)61/635,804號和61/639,052，申請日2012年4月19日和2012年4月26日之優先權，該案的全部內容併入本案作為參考。
本發明涉及遮罩製造，例如在製造太陽能電池時使用的遮罩。
在太陽能電池各種製造階段期間，必須使用遮罩將太陽能電池的某些部份與特定製程階段阻隔。例如，遮罩可用以形成接點或形成邊緣排除(edge exclusion)，以預防該電池產生分流。也就是，在前側及背側具有接點的太陽能電池，用來形成接點的材料可能會沈積於晶圓的邊緣處，而使前側及背側的接點產生分流。因此，至少在製造前側或背側接點時最好使用遮罩阻隔該電池之邊緣。
換另一種情形，在製造矽太陽能電池時，應在背部表面沈積包覆金屬，以作為反光板及電導體。該金屬普遍為鋁，但該包覆金屬可能為任一金屬，在選擇時須從多方面考慮，例如成本，導電率，可焊性等。所沈積的薄層厚度可能從極薄，例如約10 nm(奈米)到極厚，例如2-3um(微米)。然而，在製程中必須防止該包覆金屬包過該矽晶圓的邊緣，因 為這種現象會在該太陽能電池前側表面與背側表面間，產生電阻連結，亦即分流(shunt)。為預防此種連結，須在該晶圓背側邊緣處製造一排除區。通常該排除區尺寸小於2 mm寬，但最好將排除區製成越薄越好。
一種形成該排除區的方法是使用遮罩；然而，使用遮罩具有許多挑戰。由於在太陽能工業本身的高競爭性，該遮罩需以極廉價來生產。同時，由於太陽能製造配備之高生產率需求(普遍一個小時生產1,500-2,500個)，該遮罩需在高產量製造下，能快速且簡易使用。同時，因為該遮罩是用以預防薄層沈積在該晶圓特定部分上，遮罩必須能吸收且可容納積累之沈積。再者，因為薄層沈積是在升高的溫度下進行，該遮罩需可在升高的溫度下正常運作，例如在高達350℃下，仍能準確地維持該排除區寬度，但同時又能適應基板由於熱應力而產生之翹曲。
以下發明簡述提供作為對本發明數種面向及技術特徵之基本理解。發明簡述並非對本發明之廣泛介紹，也因此並非用來特別指出本發明之關鍵性或是重要元件，也非用來界定本發明之範圍。其唯一目的僅在以簡單之方式展示本發明之數種概念，並作為以下發明詳細說明之前言。
本發明之實施例使用遮罩解決上述問題，該遮罩為一雙遮罩配置。該二元遮罩系統建置以遮蔽半導體晶圓，並包含一內部遮罩及一外部遮罩。內部遮罩由一平坦金屬片構成，具有孔洞可暴露該晶圓需加工之部分；外部遮罩則建置以覆蓋並遮蔽該內部遮罩。該外部遮罩具有一開放切口，其尺寸及形狀與該晶圓尺寸及形狀相似。該外部遮罩厚度比該內 部遮罩厚度更厚。一遮罩邊框建置以支撐該內部遮罩及外部遮罩，以使該外部遮罩夾在該遮罩邊框及該內部遮罩間。在一實施例中，該雙遮罩配置是用以提供邊緣隔絕，此時該內部遮罩的開放切口尺寸比該晶圓略小，故當該內部遮罩置於該晶圓上時能遮蓋該晶圓周圍邊緣，且該外部晶圓的開放切口略小於該內部遮罩的開放切口。一上方邊框載具用以保持該內部遮罩及外部遮罩，並固定該內部遮罩及外部遮罩至該晶圓台座。
一上方遮罩或外部遮罩可由例如約0.03”厚的鋁，鐵或其他相似材料製成，且建置以與一基板載具配對。一內部遮罩由一極薄，例如約0.001至0.003”厚的平坦鐵片或其他磁性材料製成，並建置以套在於該外部遮罩內。
根據其他實施例，用以在加工期間支撐晶圓之配置包括：一晶圓載具或台座，具有一提升之邊框，該提升邊框具有一凹部，以環繞並支撐一晶圓並侷限該晶圓置於預定之位置；一內部遮罩，建置以放置於該提升邊框之上方，該內部遮罩具有一開口配置，建置以遮蔽該晶圓之部分並暴露其餘之部分；及一外部遮罩，建置以覆蓋該提升邊框，並放置於該內部遮罩之上方，該外部遮罩具有一單一開口，建置以部分覆蓋該內部遮罩。一上方邊框載具，可用以保持該內部遮罩及外部遮罩，並固定該內部遮罩及外部遮罩至該晶圓台座。
磁鐵位於該台座內，並以替換極性N-S-N-S-N圍繞該邊框全部，或在該台座整個表面下方全域，並直接在該晶圓下方。該外部遮罩及內部遮罩設計成只藉由磁力支撐在該邊框上，以能簡易並快速裝載及卸載基板。
該遮罩組件可從該晶圓載具及支撐邊框卸除，以裝載基板至該載具內。外部及內部遮罩兩者拉升之後，成為該遮罩組件之部分。但當該晶圓置於該晶圓儲存盒內之載具上後，該遮罩組件即下降回到該載具上。該內部遮罩與該晶圓之上方表面重疊。在該載具邊框內的磁鐵拉下該內部遮罩，以與該基板緊密接觸。如此即在該晶圓邊緣上形成一緊密依從的密封。該外部遮罩設計成可防止沈積形成於該薄的依從性內部遮罩上。如上所述，該沈積過程可能造成該內部遮罩升溫，導致該遮罩翹曲並鬆弛其與該晶圓之接觸。若該遮罩與該晶圓之接觸鬆弛，金屬薄層將沈積於該基板晶圓表面之排除區。但藉由該磁鐵所形成的囊狀包容及摩擦力，可在傳送及沈積期間維持該基板與遮罩，不會相對移動，而該外部遮罩則可防止薄層沈積於該內部遮罩上，並防止該內部遮罩發生翹曲。
該遮罩組件可定期從該具有載具之系統移除，其方式是使用真空載具替換器。該載具替換器為一可攜式真空包覆，附有載具傳輸裝置。使該載具交換能如「空中加油」般，不需停止該系統之連續操作即可進行。
100‧‧‧載具
105、230、405、1005‧‧‧台座
110‧‧‧陶瓷桿架棒、陶瓷邊框
115‧‧‧升降板
120‧‧‧晶圓、基板
125、225‧‧‧傳輸軌道
200‧‧‧載具支撐
205、605‧‧‧晶圓載具
210、232、430‧‧‧邊框
215‧‧‧升降桿
230、405‧‧‧基底
235、432、632、762‧‧‧凹部
240、440、866‧‧‧包囊
245、445‧‧‧外部遮罩
252‧‧‧升降板
420‧‧‧晶圓
434、634、1034‧‧‧磁鐵
436‧‧‧遮罩邊框
450‧‧‧內部遮罩
452‧‧‧邊緣處
660、1082‧‧‧對位銷
836‧‧‧上方邊框
862‧‧‧長形桿
868‧‧‧對位孔
1080‧‧‧靜電載盤
所附的圖式納入本件專利說明書中，並成為其一部份，是用來例示數種實施例，並與本案的說明內容共同用來說明及展示本發明的原理。圖式的目的只在以圖形方式例示本發明實施例的主要特徵。圖式並不是用來顯示實際上的範例的全部特徵，也不是用來表示其中各元件之相對尺寸，或其比例。
圖1顯示根據本發明一實施例之多晶圓載具，但並非用以供遮罩加工 使用。
圖2A-2E表示根據本發明數個實施例中的多晶圓載具數種形式之示意圖，該載具具有一雙遮罩配置。
圖3表示本發明一實施例之外部遮罩外觀圖，顯示該內部遮罩套裝於其中。
圖4表示本發明一實施例的邊框，外部遮罩及內部遮罩之部分放大截面圖。
圖4A顯示本發明另一實施例，可用以例如在一晶圓背側形成接點圖形。
圖5表示本發明一實施例之內部遮罩示意圖，該遮罩用於形成邊緣隔離。
圖6表示本發明一實施例之單一晶圓載具。
圖7表示本發明一實施例之外部遮罩底面圖。
圖8表示本發明一實施例之上方邊框外觀圖，該邊框用以支撐該內部遮罩及外部遮罩。
圖9表示本發明一實施例之內部遮罩形狀示意圖，該遮罩用以在該晶圓製造多數孔洞。
圖10表示本發明一實施例之台座外觀圖，該台座用以與圖9之遮罩配合使用。
圖10A表示本發明一實施例之台座側視圖，其形式為一靜電載盤，具有彈性裝載對位銷於其中。
在傳統半導體晶圓製造中普遍為個別加工，而在太陽能電池製造中，則是數個晶圓同時製造。為簡化說明起見，以下描述將以同時加工3個晶圓為例；然而，必須說明的是，該實施例可延伸至同時加工任意數量之晶圓。
圖1顯示根據本發明一實施例之多晶圓(multi-wafer)載具，但並非用以做遮罩加工。也就是，在製造太陽能電池時，某些加工該晶圓之步驟並不需遮蔽。在此狀況下，可利用圖1之載具。下面將參考其餘圖式，解說使用本發明雙遮罩配置之載具。因此，在數個實施例，不需遮蔽之加工步驟可利用圖1之載具，而需要遮蔽之加工步驟可利用其餘圖式之載具。如圖1所示，此實施例之多晶圓載具結構相當簡單且便宜。雖然圖1之載具顯示成建置以傳輸3個晶圓，須說明的是，該載具可建置用於不同數量之晶圓。同時，亦須說明的是，每個加工腔也可建置以同時容納數個載具，因而使用數個載具同時加工數個晶圓。
圖1之載具100由一簡單的板狀台座105構成，其材質可例如為鋁氮化物，並藉由一陶瓷邊框或陶瓷桿架110支撐。該陶瓷邊框110提供該台座105與腔室中其他元件間提升的隔熱。一升降板115位於每一晶圓120所在之側面，以使晶圓可提升，以離開該台座105。傳輸軌道125位於該邊框110之兩側，以使該載具可於該系統內傳輸。
當加工該晶圓需要使用遮罩時，可將多數遮罩各自置放於每一晶圓之上方，或僅以一遮罩同時覆蓋3個晶圓。該遮罩可利用例如磁鐵保持其位置。然而，為準確加工，該遮罩需製成極薄，並因此常時會因加工時的熱應力變形。此外，薄的遮罩導致快速累積沈積物，而該沈積物 會影響該遮罩的準確放置及準確遮蔽。因此，根據下述本發明之實施例，使用該雙遮罩配置可以改善以上缺點。
圖2A-2E顯示根據本發明數種實施例之多晶圓載具之不同面向。該載具具有一雙遮罩配置。圖2A顯示一多晶圓載具，具有雙遮罩配置，其中該遮罩配置位於下方位置，以使其內部遮罩與晶圓做緊密的物理接觸；圖2B顯示一多晶圓載具，具有雙遮罩配置，其中該遮罩配置位於抬升的位置，用以替換該晶圓；圖2C顯示一多晶圓載具，具有雙遮罩配置，其中包括遮罩升降板，用以裝載/卸載晶圓；圖2D顯示一多晶圓載具之部份截面圖，該載具具有雙遮罩配置，其中該遮罩配置及該晶圓升降板位於一提升位置；而圖2E顯示一多晶圓載具之部份截面圖，該載具具有雙遮罩配置，其中該遮罩配置及該晶圓升降機位於下方位置。
請參照圖2A。該多晶圓載具，也稱為載具支撐200具有3個分別的單一晶圓載具或台座105，藉由一台座邊框或台座桿架110支撐，該台座邊框由例如陶瓷製成。每一單一晶圓載具105建置以保持單一晶圓與一雙遮罩配置。在圖2A，該雙遮罩配置位於一下方位置，但無晶圓位於任一載具內，故可顯示該載具之結構。在圖2B中，該雙遮罩配置位於一提升位置。同樣也無晶圓位於任一載具內。在圖2A-2E之實施例中，使用一升降桿215以提升或下降該雙遮罩配置；然而，為降低成本及減少複雜度，升降桿215可不需配置，並以手動抬升該雙遮罩配置。與圖1所示相同，傳輸軌道225位於該邊框210之兩側上，以使該載具200可於該系統內傳輸。
每一單一晶圓載具205具有一基底230(可見於圖2B)， 具有一提升之邊框232，邊框232內具有一凹部235，以藉由一晶圓之邊緣處支撐晶圓，成懸空狀態。該基底230與該邊框232形成一包囊240，位在該懸空的晶圓下方。這種方式有利於捕捉破損晶圓的碎片。在某些實施例，該邊框232可從該台座230分開。外部遮罩245建置以跨置於該邊框232上，以覆蓋該邊框232並覆蓋該內部遮罩之周邊處，但暴露該內部遮罩之中心部分，該暴露部分與該晶圓相對應。此可藉由圖4實施例之截面圖例示。
在圖4中，台座或基底405具有提升的邊框430，其上具有凹部432，用來支撐晶圓420周邊處。該具有邊框430之台座405形成包囊440，且該晶圓懸於該包囊上方。一系列之磁鐵434位於該提升的邊框430內，以圍繞該晶圓420周邊。在某些實施例，特別是用於高溫操作之實例，該磁鐵434可由釤鈷合金(SmCo)製成。內部遮罩450位於該提升之邊框430及該晶圓420上方，並藉由磁鐵434保持其位置，以使其實際接觸該晶圓。外部遮罩445置於該內部遮罩450上方，並與其實際接觸，以使其覆蓋該內部遮罩450之周邊處，但該內部遮罩用以傳送加工至晶圓之區域，則不為該外部遮罩445所遮蔽。圖3顯示一外部遮罩245之實例。在此例子，該外部遮罩245由對折的鋁片製成，其中該內部遮罩藉由該外部遮罩覆蓋，但不覆蓋到邊緣處452的狹窄範圍。這是因為該例子是用以做邊緣分流排除區加工。圖5顯示該內部遮罩用以做邊緣分流排除區加工的另一實例。其中，該內部遮罩為一平坦金屬片，具有一開口，其尺寸及形狀與晶圓尺寸及形狀相同，但比晶圓尺寸略小例如1-2 mm。在圖4之實施例，遮罩邊框436用以支撐並提升該內部遮罩及外部遮罩離開該載具。 在此一結構下，該外部遮罩夾在該遮罩邊框436及該內部遮罩450間。
圖4顯示另一實施例，其可利用於例如在一晶圓背側形成接點圖形。在此實施例中，該台座形成一上方平台，以從整個表面支撐該晶圓。磁鐵434嵌於該台座整個區域中，並位於該台座上方表面下方。該內部遮罩450覆蓋該晶圓420整個表面，並具有多數孔洞，以配合所需的接點設計。
現回到圖2A-2E。在圖中，升降桿215可用以同時抬升該外部遮罩與該內部遮罩。同時，晶圓升降板252可用於抬升該晶圓離開該邊框230，以使其可利用一機械手臂替換新的晶圓進行加工。然而，升降桿215及升降板252可不需使用，此時抬升該遮罩及替換晶圓之操作可用手動取代。
上述參考圖4之實施例中，該載具支撐該晶圓之邊緣處，使該晶圓處於懸空狀態。該包囊形成於該晶圓下方，以捕捉破損晶圓的碎片，並防止沈積材料形成在晶圓邊緣。反之，在圖4A之實施例中，載具是支撐該晶圓整個表面。在濺鍍或其他形式之加工時，該遮罩組件下降至適當位置，並手動或自動抬升，以裝載及卸載晶圓。載具上一系列磁鐵協助固定該內部遮罩於適當位置，並使該內部遮罩與該晶圓緊密接觸。重複使用後，該外部遮罩及內部遮罩即可替換，而其餘載具組件則可重複使用。該邊框210，也可稱為遮罩組件側桿，是由低熱膨脹係數材料製成，如氧化鋁或鈦。
根據上述實施例，該內部遮罩與該基板之間建立一無縫隙之緊密接觸。該外部遮罩保護該內部遮罩，該載具及該邊框，防止其上沈 積材料。在此描繪之實施例中，該外部遮罩及內部遮罩之開口為準正方形(pseudo-square shape)，適於應用在製作單晶太陽能電池時，進行邊緣分流隔離加工。在應用於其他加工時，該內部遮罩具有一特定開口配置，而外部遮罩具有該準正方形開口。所稱之準正方形是指正方形，但4角形成倒角，其形狀與切割晶圓由來的圓錠形狀相同。當然，若使用多晶正方形晶圓，該外部及內部遮罩開口都可以是正方形。
圖6顯示本發明一實施例之單一晶圓載具605。該晶圓以其邊緣停留在凹部632上。磁鐵634以虛線顯示，位於該載具內，並環繞整個晶圓。對位銷660用以將該外部遮罩對準該載具605。圖7顯示本發明一實施例之外部遮罩之底面圖。圖中顯示該外部遮罩745具有對位孔或凹部762，而與該載具605之對位銷660相對準。
圖8顯示本發明一實施例之上方邊框836，用以保持該外部遮罩及內部遮罩，並固定該2遮罩於該台座。該上方邊框836由例如兩2條長形桿862製成，並藉由兩個橫向桿連結。該外部遮罩保持在包囊866內。對位孔868用以將該上方邊框對準該台座。
圖9顯示本發明一實例的內部遮罩，具有一孔洞圖形設計。該內部遮罩用以例如在晶圓上形成多數接點。此一內部遮罩可與圖10之台座共同使用。其中，多數磁鐵1034以交替極化方向配置，分布於整個區域，並位於該晶圓表面下方。在此實施例中無須在該台座內配備具提升的邊框，而可形成一平坦平台，如圖10A所示。
圖10A顯示本發明一實例的台座1005，其形式為一靜電載盤(ESC)1080。在此實施例中，該ESC 1080上方為一平坦平面，且無具 提升的邊框，也無包囊可供接收破損基板的碎片。此外，在此實施例中，使用彈性裝載對位銷1082，以提供該基板120的準確對準。當該遮罩置於該基板上方時，會壓迫該對位銷1082，使其回縮而不突出於該基板。該對位銷只位於兩側：1支對位銷位於一側，另有2支對位銷位於與第一側呈90°角方向之側面。因此該基板可向此對位銷推壓，以提供該基板之對準。
從上述實施例可瞭解，該內部磁化遮罩應為極薄，以使其具彈性，且可與該基板表面形成平整。該基板支架可為一邊框，一靜電載盤，一平坦板等，只要能使磁鐵嵌於該基板下方，以保持該內部遮罩與該基板之接觸狀態即可。當該遮罩為一開放區域遮罩，只遮蔽晶圓之外側邊緣，例如用以作邊緣隔離之應用時，該磁鐵可沿該遮罩之開口邊緣配置。但如該遮罩是在該基板表面上形成孔洞之遮罩時，該磁鐵可配置於該遮罩下方，分布於該遮罩整個區域。本發明的雙遮罩配置可用於數種加工，例如沈積，植入，反應式離子蝕刻加工等。例如一觸控面板可由ITO之平面沈積製成，再經由一RIE製程，以透過遮罩使該ITO層產生圖案。
本發明既已根據特定實例說明如上，但本發明並不限於上述實施例。特別是，習於斯藝之人士均可在不脫離本發明之精神與範圍之下，作出各種不同之變化及修改。本發明之範圍應由以下所附的申請專利範圍界定。
200‧‧‧載具支撐
210‧‧‧邊框
215‧‧‧升降桿
225、232‧‧‧傳輸軌道
230‧‧‧基底、台座
235‧‧‧凹部
240‧‧‧包囊
245‧‧‧外部遮罩

Claims (28)

  1. 一二元遮罩系統，用以遮蔽半導體晶圓，包括：一內部遮罩，由一平坦金屬片構成，其內具有至少一開口，其形狀與要傳送至該晶圓之圖案相同，以使該內部遮罩置於該晶圓上時，可覆蓋該晶圓之部分；及一外部遮罩，建置以放置在該內部遮罩上方，並遮蔽該內部遮罩，該外部遮罩具有一開放切口，其尺寸設計成可覆蓋該內部遮罩之邊緣，該外部遮罩厚度厚於該內部遮罩厚度。
  2. 如申請專利範圍第1項的二元遮罩系統，其中該內部遮罩之開口設計成只覆蓋該晶圓邊緣。
  3. 如申請專利範圍第1項的二元遮罩系統，其中該內部遮罩包括多數開口，設計以在該晶圓一表面上方產生一重複設計。
  4. 如申請專利範圍第1項的二元遮罩系統，其中該內部遮罩由一磁性材料製成。
  5. 如申請專利範圍第1項的二元遮罩系統，其中內部遮罩具有0.001至0.003英吋之厚度。
  6. 如申請專利範圍第1項的二元遮罩系統，其中該外部遮罩由一磁性材料製成。
  7. 如申請專利範圍第1項的二元遮罩系統，其中該外部遮罩由鋁製成。
  8. 如申請專利範圍第1項的二元遮罩系統，其中該內部遮罩由鋼製成。
  9. 如申請專利範圍第1項的二元遮罩系統，更包括一遮罩邊框，建置以支撐該內部及外部遮罩，以使該外部遮罩夾在該遮罩邊框與該內部遮 罩間。
  10. 一種用於在加工期間支撐晶圓之裝置，包括：一晶圓載具，具有一平台，用以支撐一晶圓；一內部遮罩，建置以放置於該晶圓之上方，該內部遮罩具有一開口圖案，用以遮蔽該晶圓之部分並暴露該晶圓其餘部分；一外部遮罩，建置以放置於該載具上方，並位於該內部遮罩上方，該外部遮罩具有一開口，建置以部分覆蓋該內部遮罩。
  11. 如申請專利範圍第10項的裝置，其中該內部遮罩由一平坦金屬片構成，具有開放切口，其尺寸比該晶圓略小，以在該內部遮罩置於該晶圓上時能覆蓋該晶圓之邊緣。
  12. 如申請專利範圍第10項的裝置，其中該內部遮罩由鋼製成。
  13. 如申請專利範圍第10項的裝置，其中內部遮罩具有一0.001至0.003吋之厚度。
  14. 如申請專利範圍第10項的裝置，更包括數個磁鐵，嵌入該載具內，並建置以將該內部遮罩拉至與該晶圓接觸。
  15. 如申請專利範圍第14項的裝置，其中該外部遮罩由磁性材料製成，用以分流該磁鐵之磁場，並用以保持該外部遮罩與該內部遮罩之接觸。
  16. 如申請專利範圍第10項的裝置，其中該外部遮罩由鋁製成，並停留與該內部遮罩之上方實際接觸。
  17. 如申請專利範圍第10項的裝置，更包括載具支撐，建置以同時支撐數個晶圓載具，每個晶圓載具具有相對應之內部及外部遮罩組件。
  18. 如申請專利範圍第17項的裝置，其中該載具支撐包括陶瓷桿，以支撐 該數個晶圓載具。
  19. 如申請專利範圍第17項的裝置，其中該載具支撐更包括軌道，建置以在一加工系統中傳輸該晶圓載具。
  20. 如申請專利範圍第17項的裝置，其中該載具支撐更包括遮罩升降器，建置以提升該外部及內部遮罩離開該晶圓載具。
  21. 如申請專利範圍第17項的裝置，其中該載具支撐更包括晶圓提升桿，建置以提升該晶圓離開該晶圓載具。
  22. 如申請專利範圍第10項的裝置，其中該外部及內部遮罩建置成只藉由磁力保持於該載具，以能夠簡易且快速裝載及卸載晶圓。
  23. 如申請專利範圍第10項的裝置，其中該載具包括一台座，具有一提升之邊框，該邊框具有一凹部，以定義出位於該晶圓下方之包囊，使該晶圓藉由該晶圓周邊停留在該凹部上方而懸在在該包囊上方。
  24. 如申請專利範圍第10項的裝置，其中該載具包括對位銷，且該外部遮罩具有與其相對應之對準凹槽。
  25. 如申請專利範圍第10項的裝置，其中該外部遮罩包括一對折之鋁片。
  26. 如申請專利範圍第14項的裝置，其中數個磁鐵由釤鈷合金製成。
  27. 如申請專利範圍第10項的裝置，更包括一遮罩邊框，建置以支撐該內部遮罩及外部遮罩，以使該內部遮罩夾在該遮罩邊框及該外部遮罩間。
  28. 如申請專利範圍第12項的裝置，其中該磁鐵環繞該邊框全部，並以轉換極性N-S-N-S-N方式配置。
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MY167662A (en) 2018-09-21
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US20130276978A1 (en) 2013-10-24
WO2013159050A1 (en) 2013-10-24
JP6243898B2 (ja) 2017-12-06
US9525099B2 (en) 2016-12-20
TWI518839B (zh) 2016-01-21
KR20150053733A (ko) 2015-05-18
SG10201608512QA (en) 2016-12-29
KR102104688B1 (ko) 2020-05-29
EP2839052A4 (en) 2015-06-10
SG11201406746RA (en) 2015-03-30

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