TW201042664A - Photosensitive conductive paste, method for producing display using the same and display - Google Patents

Abstract

The present invention provides a photosensitive conductive paste and a display, wherein forming a photosensitive conductive paste having low cost and a electrode with high electric conductivity by a photosensitive conductive paste comprising 30 to 45 wt% of Aluminum powder having an average particle size of 1 to 4 μ m, 5 to 15 wt% of glass powder having a softening point of 400 to 500 DEG C, 15 to 30 wt% of photosensitive organic component and 20 to 40 wt% of solvent, as well as a display is obtained by using the photosensitive conductive paste.

Description

.201042664 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種感光性導電糊及顯示器之製造方 • 法，特別是關於一種含鋁粉末的感光性導電糊。 【先前技術】 » 因爲電漿顯示器面板（PDP)與液晶面板相比，能夠以更 高速來顯示，且容易大型化，因此逐漸被應用至Ο A機器及 廣告顯示裝置等領域。另外，還被活用在高品質電視的領 〇 域等。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a photosensitive conductive paste and a display, and more particularly to a photosensitive conductive paste containing an aluminum powder. [Prior Art] Since the plasma display panel (PDP) can be displayed at a higher speed than the liquid crystal panel and is easily enlarged, it is gradually applied to fields such as the A machine and the advertisement display device. In addition, it is also used in the field of high-quality TV.

PDP係被製作於前板與背板這兩枚玻璃基板之間，以微 小的空隙作爲放電空間，在陽極電極及陰極電極之間產生 電漿放電，由放電空間內封入的氣體所產生的紫外線照射 至設置於放電空間內的螢光體而使其發光，而藉此進行顯 示。在此情況中，電極係分別呈條狀配置於前板與背板， 有多數個電極呈平行，而前板之電極與背板之電極，係僅 隔著微小的間隙而呈對向且互相垂直的方式形成。在PDP 〇 之中，適合由螢光體產生的彩色顯示的3電極構造的面放電 型PDP，係具有相互平行而鄰接的顯示電極所構成之多個電 極對、與垂直於各電極對的多個定址電極。另外，在背板 * 之處，防止光線的串擾，確保放電空間所用的間隔壁，係 . 形成於電極之間的空間。進一步，於該放電空間內形成有 螢光體。 前述電極中，形成於背板的定址電極，有必要在廣範圍 均勻地形成厚度或線寬。再者，伴隨PDP之高精細化，定址 201042664 電極之細節距化正在持續發展。另外，PDP由於會經過在空 氣中以500°C以上的溫度燒成的步驟，因此有必要使用即使 經過燒成步驟也不會氧化的材料。由於受到該等限制，而 • 有文獻提出將採用了銀、金這類貴金屬的感光性糊利用作 • 爲電極材料（例如專利文獻1)。在專利文獻1所使用的電極 糊，由於含有貴金屬，因此會有高成本這樣的問題。另一 方面，也考慮使用含有鋁的糊作爲不使用銀或金這類貴金 屬的導電糊，而將含鋁粉末的導電糊加以塗布，使其乾燥 Ο ^ 之後，在空氣中以500°C以上的溫度燒成，則會有鋁粉末表 面氧化，發生燒結不良的現象，或是電阻値變高，甚至變 成無法通電的情況這樣的問題。另外，爲了解決這些問題， . 有文獻提出一種導電糊，係含有鋁及防止鋁氧化的材料（例 如專利文獻2)。在此文獻中所採用的氧化抑制用的金屬或 金屬化合物，在添加感光性糊的情況，會有與具反應性的 有機成分（聚合物、寡聚物、單體等）發生反應、糊的保存 0 安定性差、糊黏度隨時間的變化大、無法均勻地成膜的這 些問題。 [先前技術文獻] [專利文獻] • [專利文獻1]日本特開平5-27 1 576 • [專利文獻2]日本特開平5-2989 1 7 【發明內容】 [發明所欲解決之課題] 201042664 本發明目的係提供一種感光性導電糊，能夠以低成本形 成高精細且厚度或線寬均勻的圖案，而可得到低電阻的導 電圖案。 [用於解決課題之方法] 亦即，本發明係關於一種感光性導電糊，其係含有：（A). 平均粒徑爲1〜4/zm之鋁粉末30〜45重量％、（B)軟化點爲 4 00〜550°C之玻璃粉末5〜15重量％、（C)感光性有機成分15 〜3 0重量％及（D)溶劑20〜40重量％。 前述（A)鋁粉末與前述（B)玻璃粉末之重量比，係以在 75 : 25〜95 : 5之範圍內爲佳。 前述（A)鋁粉末之球形率係以60%以上爲佳。 前述（A)鋁粉末之平均粒徑Da與前述（B)玻璃粉末之平均 粒徑Dg係以滿足以下式子爲佳。 0.3^ Dg^ Da^ \0 β m 前述（A)鋁粉末之比表面積係以0.2〜1.4m2/g爲佳。 另外，本發明還關於一種顯示器之製造方法，係包含： 在基板上塗布上述感光性導電糊並使其乾燥，形成糊塗布 膜的步驟；隔著光罩對糊塗布膜實施曝光的步驟；使曝光 後的糊塗布膜顯像的步驟；及藉由燒成而形成圖案的步驟。 進一步而言，本發明還關於一種顯示器，係藉由前述製 造方法所得到。 [發明之效果] 本發明之感光性導電糊，能夠形成低成本、高精細且厚 201042664 度或幅寬均勻的圖案，可得到低電阻的導電圖案。另外， 藉由使用該感光性導電糊，能夠以低成本製造高性能的顯 示器。 ' 【實施方式】 • 本發明係關於一種感光性導電糊，係包含：鋁粉末、玻 璃粉末、感光性有機成分，以及溶劑。 本發明之感光性導電糊，除了含有鋁粉末作爲導電性粉 末之外，還含有確保與基板的密著性所用的玻璃粉末、及 〇 形成細節距之配線圖案所用的感光性有機成分及確保塗布 安定性所用的有機溶劑。 在以往的導電糊之中，考慮到低電阻化或燒成時之脫黏 . 結劑性，係以盡量富含導電性粉末，使玻璃粉末或感光性 _ 有機成分盡可能少量爲適當。然而，鋁粉末由於在空氣中 燒成時粉末表面容易氧化，因此有燒結不良發生，或者電 阻値變高，甚至變得無法通電的情況。爲了解決這些問題’ Q 在本發明中，藉由使用一種感光性導電糊’係感光性導電 糊中含有較多玻璃粉末及感光性有機成分之量，亦即在感 光性導電糊中含有：鋁粉末30〜45重量％、玻璃粉末5〜15 重量％、感光性有機成分15〜30重量％、溶劑20〜40重量％ ’ ' 能夠防止燒成時鋁粉末的氧化’確保與基板的密著性，並 * 可確保通電。 進一步，藉由使用將感光性導電糊塗布於基板並使其乾 燥，溶劑蒸發後的乾燥膜中含有鋁粉末40〜65重量％、感光 201042664 性有機成分20〜50重量％的感光性導電糊，能夠防止燒成時 鋁粉末的氧化，可確保通電。 首先，關於鋁粉末，其係必須含有30〜45重量％，較佳 ' 爲35〜40重量％。若小於30重量％，則無法確保電極的通 * 電，若超過45重量％，則會有圖案形成性惡化，無法得到細 節距之電極圖案這樣的問題發生。關於鋁粉末之粒徑，係 以藉由粒度分布測定裝置（例如日機裝公司製造的 「MT3300」）測得的重量分布曲線中之50%粒徑（平均粒徑） 爲1〜4;zm爲佳，1.5〜3//m爲較佳。若小於l#m，則有燒 成時鋁粉末表面之氧化受到促進，變得無法通電的情況， 若超過4/zm，則有電極圖案之平滑性變差，使形成在電極 . 上的介電體或間隔壁圖案之形狀惡化之虞。另外，鋁粉末 . 的最大粒徑係以20 // m以下爲佳，10 β m以下爲較佳。最大 粒徑若超過20 ym，則有圖案形成性降低，並存在許多大於 膜厚的粒子，而對於後來層合而形成的電極或介電體層造 Q 成不良影響的傾向。 鋁粉末之比表面積，係以0.2〜1.4m2/g爲佳，0.5〜1.2m2/g 爲較佳。在比表面積小於0.2m2/g之情況，有電極圖案之平 滑性變差，使形成於電極上的介電體或間隔壁圖案之形狀 ' 惡化之虞，超過1.4m2/g之情況，會有燒成時鋁粉末表面之 •氧化受到促進，電極之通電性變差的情形。 玻璃粉末，係以在感光性導電糊中含有5〜15重量％爲 佳，7〜12重量％爲較佳》在小於5重量％的時候，則與基板 201042664 的密著性差，導致電極圖案的斷線。若超過15重量％，則通 電不良發生的機率會增加。玻璃粉末之軟化點係以400〜 5 50°C爲佳，450〜500°C爲較佳。在小於400°C之情況，由 ' 於在感光性有機成分蒸發之前玻璃軟化，因此燒成後電極 • 形狀有變差的情況。在超過550°C之情況，有玻璃的軟化無 法進行，無法確保與基板的密著性的傾向。 玻璃粉末之平均粒徑，依照目的適宜選擇即可，而係以 平均粒徑爲0.3〜2.0/z m爲佳，0.5〜1.0/z m爲較佳。平均粒 〇 徑若小於0.3 #m，則由於容易發生凝集，因此有圖案形成 性惡化的情況。若超過2.0;/m，則有燒成時之燒結性不足 的傾向。 . 另外，玻璃粉末之平均粒徑Dg及鋁粉末之平均粒徑Da， 係以滿足 OJiamSDgSDaSlO/zm 爲佳，滿足 0.1SDg/Da S 0.9爲較佳。Dg/Da若小於0.1，則鋁之粒徑太小，有變得 非常難以分散的傾向，若大於0.9，則有圖案形成性降低， Q 對燒成時之燒結性產生不良影響的傾向。 另外，玻璃粉末最大粒徑係以20 M m以下爲佳，1 0 # m 以下爲較佳。最大粒徑若超過20 v m，則有圖案形成性降 低，並存在許多大於膜厚的粒子，而對於後來層合所形成 * 的電極或介電體層產生不良影響的傾向。 ‘ 玻璃粉末之比表面積，係以1〜15cm2/g爲佳，2〜10cm2/g 爲較佳。比表面積若小於1 cm2/g，則有圖案形成性降低， 燒成時之燒結性不足的傾向，若超過15cm2/g，則有凝集變 201042664 得容易發生的傾向。 關於鋁粉末與玻璃粉末之含有比率，係以重量比在75 : 25〜95: 5之範圍內爲佳。80: 20〜92: 8爲較佳。若小於 ' 75: 25，則鋁之量變爲過少，有通電不良發生之虞，若超 過95 : 5，則有玻璃粉末之量變爲過少，與基板的密著性惡 化，電極圖案剝離等問題發生之虞。 關於鋁粉末的球形比率，係以所含有鋁粉末的60%以上 爲佳。80%以上爲較佳。若未滿60%，則有燒成後電極中鋁 〇 粉末的充塡程度變差的現象，就其結果而言，會有通電不 良等不適合的情形發生。 就本發明之感光性導電糊所使用的感光性有機成分而 . 言，可列舉含有選自感光性單體、感光性寡聚物、感光性 聚合物之中至少一種感光性有機成分，進一步因應必要加 入光聚合起始劑、紫外線吸收劑、增感劑、增感助劑、聚 合禁止劑、可塑劑、增黏劑、有機溶劑、抗氧化劑、分散 Q 劑、有機或無機的沉澱防止劑等添加劑成分者。在通常的 感光性導電糊之情況，考慮到電阻値或通電性，大多是以 盡量少的有機成分含量而製作糊’而在本發明之感光性 糊，係以糊中15〜30重量％含有感光性有機成分爲佳。這是 ' 因爲藉著含有較多感光性有機成分，以抑制燒成時鋁粉末 • 的氧化的緣故。在感光性有機成分未滿15重量％之情況’銘 的氧化抑制效果小，在超過3 0重量％之情況，燒成後的電極 圖案之中，鋁粒子間有空隙存在，無法確保通電性這樣的 -10- 201042664 問題發生。 以下，相對於本發明之感光性有機成分記述。 就感光性單體而言，含有碳-碳不飽和鍵的化合物，其 • 具體例子可使用單官能及多官能之（甲基）丙烯酸酯類、乙 . 烯基系化合物類、烯丙基系化合物類等，可列舉例如丙烯 酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙 烯酸正丁酯、丙烯酸第二丁酯、丙烯酸異丁酯、丙烯酸第 三丁酯、丙烯酸正戊酯、丙烯酸烯丙酯、丙烯酸苄酯、丙 ® 烯酸丁氧基乙酯、丙烯酸丁氧基三乙二醇酯、丙烯酸環己 酯、丙烯酸二環戊烷酯、丙烯酸二環戊烯酯、丙烯酸2-乙 基己酯、丙烯酸甘油酯、丙烯酸縮水甘油酯、丙烯酸十七 . 氟癸酯、丙烯酸2-羥乙酯、丙烯酸異莰酯、丙烯酸2-羥丙 酯、丙烯酸異癸酯、丙烯酸異辛酯、丙烯酸月桂酯、丙烯 酸2-甲氧基乙酯、丙烯酸甲氧基乙二醇酯、丙烯酸甲氧基 二乙二醇酯、丙烯酸八氟戊酯、丙烯酸苯氧基乙酯、丙烯 Q 酸硬脂醯酯、丙烯酸三氟乙酯、烯丙基化環己基二丙烯酸 酯、1，4-丁二醇二丙烯酸酯、1，3-丁二醇二丙烯酸酯、乙二 醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸 酯、聚乙二醇二丙烯酸酯、二季戊四醇六丙烯酸酯、二季 ' 戊四醇單羥基五丙烯酸酯、二（三羥甲基丙烷）四丙烯酸 •酯、甘油二丙烯酸酯、甲氧基化環己基二丙烯酸酯、新戊 二醇二丙烯酸酯、丙二醇二丙烯酸酯、聚丙二醇二丙烯酸 酯、三甘油二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、丙烯 201042664 醯胺、丙烯酸胺乙酯、丙烯酸苯酯、丙烯酸苯氧基乙酯、 丙烯酸芣酯、丙烯酸1-萘酯、丙烯酸2-萘酯、雙酚A二丙稀 酸酯、雙酚A-環氧乙烷加成物之二丙烯酸酯、雙酚A-環氧 ' 丙烷加成物之二丙烯酸酯、丙烯酸硫酚酯、丙烯酸苄基硫 • 醇酯等丙烯酸酯，另外，在該等芳香環中的1〜5個氫原子 被氯原子或溴原子所取代的單體，或苯乙烯、對-甲基苯乙 烯、鄰-甲基苯乙烯、間-甲基苯乙烯、氯化苯乙烯、溴化 苯乙烯、α -甲基苯乙烯、氯化α -甲基苯乙烯、溴化α -甲 〇 基苯乙烯、氯甲基苯乙烯、羥甲基苯乙烯、羧甲基苯乙烯、 乙烯萘、乙烯蒽、乙烯咔唑，以及將上述化合物之分子中 之丙烯酸酯一部份或全部改變爲甲基丙烯酸酯的物質、r-- 甲基丙烯醯氧基丙基三甲氧基矽烷、1-乙烯基-2-吡咯烷酮 等。在本發明中，可使用該等一種或兩種以上。 除了該等以外再加入不飽和羧酸等不飽和酸，藉此可提 升感光後之顯像性。就不飽和羧酸之具體例子而言，可列 Q 舉丙烯酸、甲基丙烯酸、伊康酸、巴豆酸、馬來酸、富馬 酸、醋酸乙烯酯或該等酸酐等。 該等感光性單體之含有率，係以糊中的7〜15重量％爲 佳。在此以外之範圍，會有圖案之形成性惡化、硬化後硬 度不足的現象發生，故爲不佳。 '另外，就感光性寡聚物、感光性聚合物而言，可採用使 前述含有碳一碳不飽和鍵的化合物之中至少一種聚合所得 到之寡聚物或聚合物。前述含有碳-碳不飽和鍵的化合物 -12- 201042664 之含有率，係以感光性寡聚物及感光性聚合物之合計量中 的10重量％以上爲佳，35重量％以上爲較佳。 再者，感光性寡聚物，係藉由使不飽和羧酸等不飽和酸 ' 與感光性聚合物進行共聚合，能夠提升感光後之顯像性， ' 故爲佳。就不飽和竣酸的具體例子而言，可列舉丙烯酸、 甲基丙烯酸、伊康酸、巴豆酸、馬來酸、富馬酸、醋酸乙 烯酯或該等酸酐等。如此方式所得到在側鏈具有羧基等酸 _ 性基的寡聚物或聚合物之酸價（AV)，係以30〜150爲佳，70 〇 〜120爲較佳。酸價若未滿30，則由於未曝光部對顯像液的 溶解性降低，若使顯像液濃度變濃則甚至連曝光部都會發 生剝離，而有難以得到高精細圖案的傾向。另外，酸價若 • 超過1 50，則顯像容許幅寬有變窄的傾向。 . 對於該等感光性寡聚物、感光性聚合物而言，由於使光 反應性基加成至側鏈或分子末端，故能夠作爲具有感光性 的感光性聚合物或感光性寡聚物而使用。合適的光反應性 Q 基，係具有乙烯性不飽和基。就乙烯性不飽和基而言，可 列舉乙烯基、丙烯基、丙烯酸基、甲基丙烯酸基等。 在這樣的側鏈使寡聚物或聚合物加成的方法，有：對於 聚合物中之锍基、胺基、羥基或羧基，使具有縮水甘油基 或異氰酸酯基的乙烯性不飽和化合物或氯化丙烯酸、氯化 '甲基丙烯酸或氯化烯丙基發生加成反應的方法。 就具有縮水甘油基的乙烯性不飽和化合物而言，可列舉 丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、烯丙基縮水 -13- 201042664 甘油醚、乙基丙烯酸縮水甘油酯、巴豆醯基縮水甘油醚、 巴豆酸縮水甘油醚、異巴豆酸縮水甘油醚等。 就具有異氰酸酯基的乙烯性不飽和化合物而言，有（甲 ' 基）丙烯醯基異氰酸酯、（甲基）丙烯醯基乙基異氰酸酯等。 • 另外，具有縮水甘油基或異氰酸酯基的乙烯性不飽和化 合物或氯化丙烯酸、氯化甲基丙烯酸或氯化烯丙基，係以 對於聚合物中之锍基、胺基、羥基或羧基而言使0.05〜1莫 _ 耳當量進行加成爲佳。 〇 感光性導電糊中之感光性寡聚物及/或感光性聚合物之 含量，從圖案形成性、燒成後之收縮率的觀點看來’係以 糊中的7〜15重量％爲佳。在此範圍以外，由於圖案無法形 • 成，或圖案變粗，故爲不佳。 . 就光聚合起始劑之具體例子而言，可列舉二苯酮、鄰- 苯甲醯基安息香酸甲酯、4,4'-雙（二甲基胺基）二苯酮、4,4·-雙（二乙基胺基）二苯酮、4,4'-二氯二苯酮、4-苯甲醯基-4- Q 甲基二苯酮、二苄基酮、笏酮、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2 -羥基-2-甲基丙醯苯、對-第三丁 基二氯苯乙酮、噻噸酮、2 -甲基唾噸酮、2-氯噻噸酮、2· 異丙基噻噸酮、二乙基噻噸酮、苄基二甲基酮縮醇、苄基 甲氧基乙縮醛、苯偶姻、苯偶姻甲醚、苯偶姻丁酸、葱醌、 ' 2-第三丁基蒽醌、2-戊基蒽醌、/3-氯蒽醌、蒽酮、苯并蒽 酮、二苯并軟木酮、亞甲基蒽酮、4·疊氮苯亞甲基苯乙酮、 2,6-雙（對-疊氮亞苄基）環己酮、2,6-雙（對-疊氮亞节基）-4- -14- 201042664 甲基環己酮、2-苯基-1，2-丁二酮-2-(鄰-甲氧基羰基）肟、ι_ 苯基-丙二酮-2·(鄰-乙氧基羰基）肟、1，3-二苯-丙三酮·2-(鄰 -乙氧基羰基）肟、1-苯基-3-乙氧基-丙三酮-2-(鄰-苯甲醯基） . 肟、米其勒酮、2-甲基-[4-(甲基硫代）苯基]-2-嗎啉-1-丙酮、 、 2-苄基-2-二甲基胺基-1-(4-嗎啉苯基）丁酮-1、氯化萘磺醯 基、氯化喹啉磺醯基、N -苯基硫代吖啶酮、4,4'-偶氮雙異 丁腈、二苯二硫醚、苯并噻唑二硫醚、三苯膦、樟腦醌、 四溴化碳、三溴苯砸、過氧化苯偶姻及曙紅、亞甲基藍等The PDP is formed between the two glass substrates of the front plate and the back plate, and uses a minute gap as a discharge space to generate a plasma discharge between the anode electrode and the cathode electrode, and ultraviolet rays generated by the gas enclosed in the discharge space. The phosphor is irradiated to the phosphor provided in the discharge space to emit light, thereby performing display. In this case, the electrodes are arranged in strips on the front plate and the back plate, respectively, and a plurality of electrodes are parallel, and the electrodes of the front plate and the electrodes of the back plate are opposed to each other with only a slight gap therebetween. Formed in a vertical manner. Among the PDPs, a surface discharge type PDP having a three-electrode structure suitable for color display by a phosphor has a plurality of electrode pairs composed of display electrodes adjacent to each other in parallel, and is perpendicular to each electrode pair. Addressing electrodes. In addition, at the back panel *, the crosstalk of light is prevented, and the partition walls used for the discharge space are formed in the space between the electrodes. Further, a phosphor is formed in the discharge space. Among the above electrodes, the address electrodes formed on the back sheet need to have a uniform thickness or line width formed over a wide range. Furthermore, with the high refinement of the PDP, the addressing of the 201042664 electrode is continuing to evolve. Further, since the PDP is subjected to a step of firing at a temperature of 500 ° C or higher in air, it is necessary to use a material which does not oxidize even after the firing step. Due to such restrictions, it has been proposed to use a photosensitive paste using a noble metal such as silver or gold as an electrode material (for example, Patent Document 1). The electrode paste used in Patent Document 1 has a problem of high cost because it contains a precious metal. On the other hand, it is also considered to use a paste containing aluminum as a conductive paste which does not use a noble metal such as silver or gold, and apply a conductive paste containing an aluminum powder to dry it, and then, in air, at 500 ° C or higher. When the temperature is fired, the surface of the aluminum powder is oxidized, and sintering failure occurs, or the resistance enthalpy becomes high, and even the case where electricity cannot be supplied is caused. Further, in order to solve these problems, there has been proposed a conductive paste which contains aluminum and a material which prevents oxidation of aluminum (e.g., Patent Document 2). The metal or metal compound for oxidation inhibition used in this document may be reacted with a reactive organic component (polymer, oligomer, monomer, etc.) in the case where a photosensitive paste is added. Preservation 0 These problems are poor in stability, large change in paste viscosity with time, and inability to form a film uniformly. [Prior Art Document] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open No. Hei 5-27 1 576 • [Patent Document 2] Japanese Patent Laid-Open No. Hei 5-2989 1 7 [Description of the Invention] [Problems to be Solved by the Invention] 201042664 SUMMARY OF THE INVENTION An object of the present invention is to provide a photosensitive conductive paste capable of forming a high-definition pattern having a uniform thickness or a line width at a low cost, and a low-resistance conductive pattern can be obtained. [Means for Solving the Problem] That is, the present invention relates to a photosensitive conductive paste comprising: (A) 30 to 45 wt% of aluminum powder having an average particle diameter of 1 to 4/zm, (B) The softening point is 5 to 15% by weight of the glass powder of 00 to 550 ° C, (C) the photosensitive organic component is 15 to 30% by weight, and (D) the solvent is 20 to 40% by weight. The weight ratio of the above (A) aluminum powder to the above (B) glass powder is preferably in the range of 75:25 to 95:5. The spherical ratio of the aluminum powder (A) is preferably 60% or more. The average particle diameter Da of the aluminum powder (A) and the average particle diameter Dg of the glass powder (B) described above are preferably in the following formula. 0.3^ Dg^ Da^ \0 β m The specific surface area of the (A) aluminum powder is preferably 0.2 to 1.4 m 2 /g. Further, the present invention relates to a method of manufacturing a display comprising the steps of: applying a photosensitive conductive paste on a substrate and drying it to form a paste coating film; and exposing the paste coating film through a photomask; a step of developing a paste coating film after exposure; and a step of forming a pattern by firing. Further, the present invention relates to a display obtained by the aforementioned manufacturing method. [Effects of the Invention] The photosensitive conductive paste of the present invention can form a low-cost, high-definition, and thick pattern of 201042664 degrees or a uniform width, and a low-resistance conductive pattern can be obtained. Further, by using the photosensitive conductive paste, a high-performance display can be manufactured at low cost. [Embodiment] The present invention relates to a photosensitive conductive paste comprising: aluminum powder, glass powder, a photosensitive organic component, and a solvent. In addition to the aluminum powder as the conductive powder, the photosensitive conductive paste of the present invention further contains a photosensitive organic component for ensuring adhesion to the substrate, and a photosensitive organic component for forming a wiring pattern having a fine pitch and ensuring coating. The organic solvent used for stability. Among the conventional conductive pastes, it is considered to have low resistance or debonding at the time of firing. The binding property is such that the conductive powder is contained as much as possible, and the glass powder or the photosensitive organic component is preferably as small as possible. However, since the surface of the powder is easily oxidized when the aluminum powder is fired in the air, there is a case where sintering failure occurs, or the electric resistance enthalpy becomes high, and even the electric power cannot be supplied. In order to solve these problems, in the present invention, the photosensitive conductive paste is used in a photosensitive conductive paste containing a large amount of glass powder and a photosensitive organic component, that is, in the photosensitive conductive paste: aluminum 30 to 45 wt% of powder, 5 to 15 wt% of glass powder, 15 to 30 wt% of photosensitive organic component, and 20 to 40 wt% of solvent '' can prevent oxidation of aluminum powder during firing' to ensure adhesion to the substrate , and * can ensure power. Further, by applying a photosensitive conductive paste to a substrate and drying it, the dried film after evaporation of the solvent contains a photosensitive conductive paste of 40 to 65 wt% of aluminum powder and 20 to 50 wt% of photosensitive organic component of 201042664. It is possible to prevent oxidation of aluminum powder during firing and to ensure energization. First, regarding the aluminum powder, it must contain 30 to 45% by weight, preferably '35 to 40% by weight. When the amount is less than 30% by weight, the electric conduction of the electrode cannot be ensured. When the amount is more than 45% by weight, the pattern formation property is deteriorated, and the problem of the electrode pattern having a fine pitch cannot be obtained. The particle size of the aluminum powder is 50% (average particle diameter) in the weight distribution curve measured by a particle size distribution measuring device (for example, "MT3300" manufactured by Nikkiso Co., Ltd.) is 1 to 4; zm Preferably, 1.5 to 3//m is preferred. When it is less than l#m, the oxidation of the surface of the aluminum powder is promoted at the time of firing, and it is impossible to supply electricity. When the thickness exceeds 4/zm, the smoothness of the electrode pattern is deteriorated, and the electrode formed on the electrode is formed. The shape of the electric body or the partition pattern deteriorates. Further, the maximum particle diameter of the aluminum powder is preferably 20 // m or less, and preferably 10 β m or less. When the maximum particle diameter exceeds 20 μm, the pattern formability is lowered, and a large number of particles larger than the film thickness are present, which tends to adversely affect the electrode or the dielectric layer formed by lamination. The specific surface area of the aluminum powder is preferably 0.2 to 1.4 m 2 /g, and more preferably 0.5 to 1.2 m 2 /g. When the specific surface area is less than 0.2 m 2 /g, the smoothness of the electrode pattern is deteriorated, and the shape of the dielectric or the partition pattern formed on the electrode is deteriorated, and if it exceeds 1.4 m 2 /g, there may be In the case of firing, the oxidation of the surface of the aluminum powder is promoted, and the conductivity of the electrode is deteriorated. The glass powder is preferably contained in the photosensitive conductive paste in an amount of 5 to 15% by weight, preferably 7 to 12% by weight. When the amount is less than 5% by weight, the adhesion to the substrate 201042664 is poor, resulting in an electrode pattern. Broken line. If it exceeds 15% by weight, the probability of occurrence of a failure of power supply increases. The softening point of the glass powder is preferably 400 to 5 50 ° C, and more preferably 450 to 500 ° C. In the case of less than 400 ° C, the glass is softened by evaporation before the photosensitive organic component evaporates, so that the shape of the electrode after firing is deteriorated. When the temperature exceeds 550 °C, the softening of the glass may not proceed, and the adhesion to the substrate may not be secured. The average particle diameter of the glass powder may be appropriately selected according to the purpose, and it is preferably an average particle diameter of 0.3 to 2.0 / z m, more preferably 0.5 to 1.0 / z m. When the average particle diameter is less than 0.3 #m, aggregation tends to occur, so that pattern formation property is deteriorated. When it exceeds 2.0; / m, the sinterability at the time of baking tends to be insufficient. Further, the average particle diameter Dg of the glass powder and the average particle diameter Da of the aluminum powder are preferably OJiamSDgSDaSlO/zm, and preferably 0.1 SDg/Da S 0.9 is preferable. When Dg/Da is less than 0.1, the particle diameter of aluminum tends to be too small, and it tends to be very difficult to disperse. When it is more than 0.9, the pattern formability is lowered, and Q tends to adversely affect the sinterability at the time of firing. Further, the maximum particle diameter of the glass powder is preferably 20 M or less, and preferably 10 or less. When the maximum particle diameter exceeds 20 v m, the pattern formability is lowered, and many particles larger than the film thickness are present, which tends to adversely affect the electrode or dielectric layer formed by lamination. The specific surface area of the glass powder is preferably 1 to 15 cm 2 /g, and more preferably 2 to 10 cm 2 /g. When the specific surface area is less than 1 cm 2 /g, the pattern formability is lowered, and the sinterability at the time of firing tends to be insufficient. When the specific surface area is more than 15 cm 2 /g, the aggregation change 201042664 tends to occur. The content ratio of the aluminum powder to the glass powder is preferably in the range of 75:25 to 95:5 by weight. 80: 20 to 92: 8 is preferred. If it is less than '75:25, the amount of aluminum is too small, and if the power failure occurs, if the amount exceeds 95:5, the amount of the glass powder is too small, the adhesion to the substrate is deteriorated, and the electrode pattern is peeled off. After that. The spherical ratio of the aluminum powder is preferably 60% or more of the aluminum powder contained. More than 80% is preferred. If it is less than 60%, the degree of filling of the aluminum bismuth powder in the electrode after firing may be deteriorated, and as a result, unsuitable conditions such as poor electric current may occur. In the photosensitive organic component used in the photosensitive conductive paste of the present invention, at least one photosensitive organic component selected from the group consisting of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer is further included. It is necessary to add a photopolymerization initiator, a UV absorber, a sensitizer, a sensitizer, a polymerization inhibitor, a plasticizer, a tackifier, an organic solvent, an antioxidant, a dispersion Q agent, an organic or inorganic precipitation inhibitor, etc. Additive ingredients. In the case of a normal photosensitive conductive paste, in view of resistance or electrical conductivity, a paste is often produced with as little organic component content as possible, and the photosensitive paste of the present invention contains 15 to 30% by weight of the paste. Photosensitive organic components are preferred. This is because it suppresses the oxidation of aluminum powder during firing by containing a large amount of photosensitive organic components. In the case where the photosensitive organic component is less than 15% by weight, the effect of the oxidation suppression is small. When the amount is more than 30% by weight, there is a gap between the aluminum particles in the electrode pattern after the firing, and the electrical conductivity cannot be ensured. The -10-201042664 problem occurred. Hereinafter, it is described with respect to the photosensitive organic component of this invention. In the case of a photosensitive monomer, a compound containing a carbon-carbon unsaturated bond, and specific examples thereof may be a monofunctional or polyfunctional (meth) acrylate, an ethylenic compound, or an allyl group. Examples of the compound and the like include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, dibutyl acrylate, isobutyl acrylate, t-butyl acrylate, and n-butyl acrylate. Ester, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butylene triethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glyceryl acrylate, glycidyl acrylate, acrylic acid 17. fluorodecyl ester, 2-hydroxyethyl acrylate, isodecyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, acrylic acid Isooctyl ester, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxy diethylene glycol acrylate, octafluoropentyl acrylate, phenoxyethyl acrylate, propylene Q acid Lipid ester, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, two Ethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, diquat 'pentaerythritol monohydroxypentaacrylate, bis(trimethylolpropane) tetraacrylate • Ester, glycerin diacrylate, methoxycyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, triglyceride diacrylate, trimethylolpropane triacrylate Ester, propylene 201042664 decylamine, urethane acrylate, phenyl acrylate, phenoxyethyl acrylate, decyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, bisphenol Acrylate such as diacrylate of A-ethylene oxide adduct, diacrylate of bisphenol A-epoxy 'propane adduct, thiophenolate acrylate, benzyl thiol alcohol ester, etc. 1 to 5 hydrogenogens in an aromatic ring a monomer substituted with a chlorine atom or a bromine atom, or styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, styrene chloride, styrene bromide, α-甲Styrene, α-methylstyrene chloride, α-methylstilbene bromide, chloromethylstyrene, hydroxymethylstyrene, carboxymethylstyrene, vinylnaphthalene, vinyl anthracene, vinylcarbazole And a substance which changes part or all of the acrylate in the molecule of the above compound to a methacrylate, r--methacryloxypropyltrimethoxydecane, 1-vinyl-2-pyrrolidone, etc. . In the present invention, one type or two or more types may be used. In addition to these, an unsaturated acid such as an unsaturated carboxylic acid is further added, whereby the development after light exposure can be improved. As a specific example of the unsaturated carboxylic acid, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetate or the like may be mentioned. The content of the photosensitive monomers is preferably 7 to 15% by weight in the paste. In other cases, the formation of the pattern is deteriorated, and the phenomenon of insufficient hardness after hardening occurs, which is not preferable. In addition, as the photosensitive oligomer or the photosensitive polymer, an oligomer or a polymer obtained by polymerizing at least one of the above compounds containing a carbon-carbon unsaturated bond can be used. The content of the compound containing a carbon-carbon unsaturated bond -12-201042664 is preferably 10% by weight or more based on the total amount of the photosensitive oligomer and the photosensitive polymer, and preferably 35% by weight or more. In addition, the photosensitive oligomer is preferably obtained by copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a photosensitive polymer to improve the developability after light exposure. Specific examples of the unsaturated citric acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetate or the like. The acid value (AV) of the oligomer or polymer having an acid group such as a carboxyl group in the side chain obtained in this manner is preferably 30 to 150, and more preferably 70 to 120. When the acid value is less than 30, the solubility of the unexposed portion in the developing solution is lowered, and if the concentration of the developing liquid is made thick, even the exposed portion may be peeled off, and it may be difficult to obtain a high-definition pattern. In addition, if the acid value exceeds 1,500, the image display tends to have a narrower width. In these photosensitive oligomers and photosensitive polymers, since a photoreactive group is added to a side chain or a molecular terminal, it can be used as a photosensitive photosensitive polymer or a photosensitive oligomer. use. A suitable photoreactive Q group having an ethylenically unsaturated group. The ethylenically unsaturated group may, for example, be a vinyl group, a propenyl group, an acrylic group or a methacryl group. A method of adding an oligomer or a polymer to such a side chain: an ethylenically unsaturated compound having a glycidyl group or an isocyanate group or chlorine for a mercapto group, an amine group, a hydroxyl group or a carboxyl group in the polymer A method of adding an acrylic acid, a chlorinated 'methacrylic acid or an allyl chloride. Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl shrinkage-13-201042664 glyceryl ether, glycidyl ethacrylate, and crotonyl shrinkage. Glycerol ether, glycidyl crotonate, glycidyl isocyanate, and the like. Examples of the ethylenically unsaturated compound having an isocyanate group include (methionyl)acrylenyl isocyanate, (meth)acryloyl ethyl isocyanate, and the like. • In addition, an ethylenically unsaturated compound having a glycidyl group or an isocyanate group or a chlorinated acrylic acid, a chlorinated methacrylic acid or an allyl chloride is used for a mercapto group, an amine group, a hydroxyl group or a carboxyl group in the polymer. It is preferable to add 0.05 to 1 _ 当量 equivalent. The content of the photosensitive oligomer and/or the photosensitive polymer in the photosensitive conductive paste is preferably from 7 to 15% by weight in terms of pattern formation property and shrinkage ratio after firing. . Outside of this range, it is not good because the pattern cannot be formed, or the pattern becomes thick. Specific examples of the photopolymerization initiator include benzophenone, methyl o-benzhydryl benzoate, 4,4'-bis(dimethylamino)benzophenone, 4, 4 ·-Bis(diethylamino)benzophenone, 4,4'-dichlorobenzophenone, 4-benzylidene-4- Q-methylbenzophenone, dibenzyl ketone, anthrone, 2 ,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methylpropionylbenzene, p-t-butyldichlorobenzene Ketone, thioxanthone, 2-methyl stilbone, 2-chlorothioxanthone, 2·isopropyl thioxanthone, diethyl thioxanthone, benzyl dimethyl ketal, benzyl methoxy Acetal, benzoin, benzoin methyl ether, benzoin butyric acid, onion, '2-tert-butyl fluorene, 2-pentyl hydrazine, /3-chloroindole, fluorenone , benzoxanthone, dibenzoxanone, methylene fluorenone, 4·azidobenzylidene acetophenone, 2,6-bis(p-azidobenzylidene)cyclohexanone, 2, 6-bis(p-azide subunit)-4- -14- 201042664 methylcyclohexanone, 2-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)anthracene, Im_phenyl-propanedione-2·(o-ethoxycarbonyl)anthracene, 1,3-two - glycerin, 2-(o-ethoxycarbonyl)anthracene, 1-phenyl-3-ethoxy-propanetrione-2-(o-benzylidene). Anthracene, mazinone, 2-methyl-[4-(methylthio)phenyl]-2-morpholin-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl) ) butanone-1, chlorinated naphthalenesulfonyl, quinolinolsulfonyl chloride, N-phenylthioacridone, 4,4'-azobisisobutyronitrile, diphenyl disulfide, benzene And thiazolyl disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenylhydrazine, benzoin peroxide and eosin, methylene blue, etc.

G 光還原性色素與抗壞血酸、三乙醇胺等還原劑等。在本發 明中，可使用該等一種或兩種以上。 光聚合起始劑，係以在相對於感光性有機成分而言0.05 〜20重量％之範圍添加爲佳，較佳爲0.1〜15重量％。光聚合 . 起始劑若小於0.0 5重量％，則對光線靈敏度有變差的傾向， 光聚合起始劑若超過20重量％，則曝光部之殘留率有變爲過 小的傾向。 Q 增感劑，係爲了提升靈敏度而添加。就增感劑之具體例 而言，可列舉2,4·二乙基噻噸酮、異丙基噻噸酮、2,3-雙（4-二乙基胺基苯亞甲基）環戊酮、2，6-雙（4-二甲基胺基苯亞甲 基）環己酮、2,6-雙（4-二甲基胺基苯亞甲基）-4-甲基環己 酮、米其勒酮、4,4|-雙（二乙基胺基）-二苯酮、4,4_-雙（二甲 ' 基胺基）查酮（chalcone)、4,4'-雙（二乙基胺基）查酮、對-二 甲基胺基亞肉桂基茚酮、對-二甲基胺基亞苄基茚酮、2-(對 -二甲基胺基苯基伸乙烯基）-異萘并噻唑、1,3-雙（4·二甲基 -15- 201042664 胺基苯亞甲基）丙酮、1,3-羰基-雙（4-二乙基胺基苯亞甲基） 丙酮、3,3、羰基-雙（7-二乙基胺基香豆素）、N-苯基-N-乙基 乙醇胺、N-苯基乙醇胺、N-甲苯基二乙醇胺、N-苯基乙醇 * 胺、二甲基胺基安息香酸異戊酯、二乙基胺基安息香酸異 • 戊酯、3-苯基-5-苯甲醯基硫代四唑、1-苯基-5-乙氧基羰基 硫代四唑等。在本發明中，可使用該等一種或兩種以上。 另外，在增感劑之中，也有可使用作爲光聚合起始劑的物 質。將增感劑添加至本發明玻璃糊之情況，其添加量，相 〇 對於感光性有機成分而言，通常係以0.05〜30.重量％爲佳， 較佳爲0.1〜20重量％。在小於0.05重量％的時候，對光線靈 敏度的提升效果有難以發揮的傾向，若超過30重量％，則曝 - 光部之殘留率有變爲過小的傾向。 . 聚合禁止劑，係爲了提升保存時之熱安定性之目的而添 加。就聚合禁止劑之具體例子而言，可列舉氫醌、氫醌的 單酯化物、N-亞硝基二苯胺、酚噻畊、對-第三丁基兒茶酚、 Q N-苯基萘基胺、2,6-二（第三丁基）-對-甲酚、氯冉、五倍子 酚、對-甲氧基酚等^另外，藉由添加此物，光硬化反應之 閾値上升、圖案線寬的縮小化、相對於間隙的圖案上部粗 的部份消失。 聚合禁止劑之添加量，係以感光性導電糊中的0.01〜1 ' 重量％爲佳。若小於0.01重量％，則有難以顯現添加效果的 傾向，若超過1重量％，則由於靈敏度降低，因此有圖案形 成所需的曝光量必須增加的傾向。 -16- 201042664 可塑劑之具體例子而言，可列舉二丁基酞酸酯'二辛基 酞酸酯、聚乙二醇、甘油等。 抗氧化劑，係爲了防止在保存時丙烯酸系共聚物之氧化 ' 而添加。就抗氧化劑之具體例子而言，可列舉2,6-二（第三 - 丁基）-對-甲酚、丁基化羥基苯甲醚、2,6-二第三丁基-4-乙 酚、2,2'-亞甲基-雙（4-甲基-6-第三丁基酚）、2,2'-亞甲基· 雙（4-乙基-6-第三丁基酚）、4,4’-雙（3-甲基-6-第三丁基酚）、 1,1,3-參（2-甲基-4-羥基-6-第三丁基苯基）丁烷、雙[3,3-雙 〇 -(4-羥基-3-第三丁基苯基）丁酸]乙二醇酯、二月桂基硫代二 丙酸酯、亞磷酸三苯酯等。添加抗氧化劑之情況，其添加 量係以在玻璃糊中0.01〜1重量％爲佳。 在本發明之感光性導電糊中，在欲調整溶液黏度的情 況，係以加入有機溶劑爲佳。此有機溶劑之含量，係以在 糊中的2 0〜4 0重量％爲佳。在此範圍以外，糊無法順利塗 布，無法得到厚度均勻的膜。另外，就此時所使用的有機 Q 溶劑而言，可使用甲基溶纖素（cellosolve)、乙基溶纖素、 丁基溶纖劑、甲基乙基酮、二噁烷、丙酮、環己酮、環戊 酮、異丁醇、異丙醇、四氫呋喃、二甲亞颯、T-丁內酯、 溴苯、氯苯、二溴苯、二氯苯、溴安息香酸、氯安息香酸、 ' 萜品醇、二乙二醇單丁醚醋酸酯等或含有該等中一種以上 • 的有機溶劑混合物。 本發明之感光性導電糊，通常將前述感光性單體、感光 性寡聚物、感光性聚合物之中至少一種，進一步因應必要 -17- 201042664 加上光聚合起始劑、紫外線吸收劑、增感劑、增感助 聚合禁止劑、可塑劑、增黏劑、有機溶劑、抗氧化劑 散劑、有機或無機的沉澱防止劑等添加劑成分，調合 定組成之後，以三輥輪機或混練機使其均質地混合分 製作。 感光性導電糊的黏度，係經過適宜調整，而其範圍 〜200Pa . s爲佳。例如以旋轉塗布法塗布至玻璃基板 況，係以0.2〜5Pa · s爲較佳，以絲網印刷法塗布1次， 得到10〜20 μ m的膜厚，係以10〜lOOPa . s爲較佳。 另外，本發明還關於一種顯示器之製造方法，係由 上述感光性導電糊並使其乾燥而形成糊塗布膜的步驟 著光罩對糊塗布膜實施曝光的步驟；使曝光後的糊塗 顯像的步驟；及藉由燒成形成圖案的步驟所構成者。 接下來，對於使用感光性糊法進行糊塗布膜之形成 個例子作說明，而本發明並不受此限定。 在玻璃基板或陶瓷的基板，或聚合物製的膜上，整 布或部分地塗布感光性導電糊。就塗布方法而言，可 絲網印刷法、棒式塗布機、輥式塗布機、模具塗布機 刀式塗布機等一般的方法。塗布厚度可藉由選擇塗 數、絲網之網目、糊的黏度而調整。另外，亦可採用 出在聚酯膜等膜上塗布有感光性玻璃糊的感光性薄片 用層壓機等裝置，在基板上轉寫感光性導電糊的方法 在塗布感光性導電糊之後，使用曝光裝置進行曝为 劑、 、分 成既 散而 以0.2 的情 爲了 塗布 ;隔 布膜 的一 面塗 使用 、刮 布次 製作 .，使 〇 ί。曝 -18- 201042664 光一般而言係如通常的光蝕刻法進行的方式，使用光罩進 行遮罩曝光的方法。所使用的遮罩，係依照感光性有機成 分的種類’而選定爲負型或正型其中一者。另外，亦可採 用不使用光罩而以紅色或藍色之雷射光等直接描繪的方 法。 就曝光裝置而言，可使用步進器曝光機、接近式曝光機 等。另外’進行大面積曝光的情況，在玻璃基板等基板上 塗布感光性玻璃糊之後，一邊輸送一邊進行曝光，藉此能 夠以小曝光面積之曝光機進行大面積的曝光。就所使用的 活性光源而言，可列舉例如可見光、近紫外線、紫外線、 電子束、X射線、雷射光等。該等之中，係以紫外線爲最佳， 就其光源而言，可使用例如低壓水銀燈、高壓水銀燈、超 高壓水銀燈、鹵素燈、殺菌燈等。在該等之中，係以超高 壓水銀燈爲適合。曝光條件，係依照塗布厚度而有所不同， 而通常使用輸出爲1〜100mW/cm2的超高壓水銀燈進行0.1 〜10分鐘的曝光。 曝光後，利用曝光部分與未曝光部分對顯像液的溶解度 差而進行顯像，而在此情況，能夠以浸漬法、淋浴法、噴 霧法、刷塗法進行。 顯像液係採用能夠使感光性導電糊中所欲溶解的有機 成分溶解的溶液。另外，亦可在不失其溶解力的範圍將水 加至有機溶劑。在感光性導電糊中存在具有羧基等酸性基 團的化合物之情況，能夠以鹼水溶液顯像。就鹼水溶液而 -19- 201042664 言，可使用氫氧化鈉、碳酸鈉、碳酸鈉，或氫氧化鈣之水 溶液等，而使用有機鹼水溶液的情況，在燒成時容易除去 鹼成分，故爲佳。就有機鹼而言，可使用一般的胺化合物。 ' 具體而言，可列舉四甲基氫氧化銨、三甲基苄基氫氧化銨、 - 單乙醇胺、二乙醇胺等。鹼水溶液之濃度，係以0.01〜10 重量％爲佳，0.1〜5重量％爲較佳。鹼水溶液之濃度若小於 0.01重量％，則有可溶部無法除去的傾向，若超過10重量％， 則有圖案部位剝離，以及還有腐蝕非可溶部位的傾向。另 〇 外，關於顯像時的顯像溫度，在步驟管理上係以在20〜50 °c進行爲適合。 接下來，以燒成爐進行燒成。燒成環境或溫度，係依照 . 糊或基板之種類而有所不同’而在空氣、氮、氫等環境中 燒成。就燒成爐而言，可使用批次式的燒成爐或輸送帶式 的連續式燒成爐。燒成溫度’通常在400〜1000°c進行。在 玻璃基板上實施圖案加工之情況，通常在450〜620 °C的溫 Q 度保持10〜60分鐘而進行燒成。另外’燒成溫度係依照所 使用的玻璃粉末而決定，而以在圖案形成後形狀不會崩 壞，且玻璃粉末的形狀不會殘留的適當溫度燒成爲佳。 另外，以上塗布或曝光、顯像、燒成之各步驟中’亦可 ' 爲了乾燥、預備反應之目的而導入50〜300°C加熱步驟。 - 藉由前述製造方法所得到本發明之顯示器’不含貴金屬 作爲導電性粉末，而使用含鋁粉末的本發明之感光性導電 糊，因此能夠以低成本製造。另外’由於不含銀或銅’因 -20- 201042664 此可製造出不會有遷移問題或變黃等問題發生、電性安定 的顯示器。 進一步由於富含玻璃粉末及感光性有機成分，因此可防 ' 止燒成時鋁粉末表面氧化所造成的燒結不良、高電阻値 - 化、通電不良等問題。 [實施例] 接下來，以實施例對本發明作較具體地說明，而本發明 並不受到該實施例所侷限。 〇 另外，以下無機粉末之平均粒徑（d5。）及最大粒徑 (D-U)，係使用日機裝股份有限公司製「MT3 3 00」所測定之 値。另外，玻璃粉末之軟化點，係藉由Rigaku公司製造的 - 示差熱分析計而測定。 _ 製造例1 (介電體形成用糊） 力口入由A G-reducing dye, a reducing agent such as ascorbic acid or triethanolamine, or the like. In the present invention, one type or two or more types may be used. The photopolymerization initiator is preferably added in an amount of 0.05 to 20% by weight based on the photosensitive organic component, preferably 0.1 to 15% by weight. When the amount of the photopolymerization initiator exceeds 20% by weight, the residual ratio of the exposed portion tends to be too small. Q sensitizers are added to increase sensitivity. Specific examples of the sensitizer include 2,4·diethylthioxanthone, isopropylthioxanthone, and 2,3-bis(4-diethylaminobenzylidene)cyclopentane. Ketone, 2,6-bis(4-dimethylaminobenzylidene)cyclohexanone, 2,6-bis(4-dimethylaminobenzylidene)-4-methylcyclohexanone , Michelin, 4,4|-bis(diethylamino)-benzophenone, 4,4_-bis(dimethyl'amino) ketone (chalcone), 4,4'-double ( Diethylamino) chalcone, p-dimethylamino cinnamyl fluorenone, p-dimethylaminobenzylidene fluorenone, 2-(p-dimethylaminophenyl phenylene) -isonaphthylthiazole, 1,3-bis(4.dimethyl-15-201042664 aminobenzylidene)acetone, 1,3-carbonyl-bis(4-diethylaminobenzylidene) Acetone, 3,3, carbonyl-bis(7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-tolyldiethanolamine, N-phenyl Ethanol* amine, isoamyl dimethylaminobenzoate, isoamyl ester of diethylaminobenzoate, 3-phenyl-5-benzhydrylthiotetrazole, 1-phenyl-5- Ethoxycarbonylthiotetrazole and the like. In the present invention, one type or two or more types may be used. Further, among the sensitizers, those which are photopolymerization initiators can also be used. When the sensitizer is added to the glass paste of the present invention, the amount of the sensitizer to be added is usually 0.05 to 30% by weight, preferably 0.1 to 20% by weight, based on the photosensitive organic component. When the amount is less than 0.05% by weight, the effect of improving the light sensitivity tends to be difficult to exert. When the amount is more than 30% by weight, the residual ratio of the exposed portion tends to be too small. The polymerization inhibitor is added for the purpose of improving the thermal stability during storage. Specific examples of the polymerization inhibiting agent include hydroquinone, monoester of hydroquinone, N-nitrosodiphenylamine, phenol thiophene, p-t-butylcatechol, and Q N-phenylnaphthalene. Alkylamine, 2,6-di(t-butyl)-p-cresol, chloranil, gallophenol, p-methoxyphenol, etc. In addition, by adding this substance, the threshold of photohardening reaction rises, and the pattern The line width is reduced, and the thick portion of the upper portion of the pattern with respect to the gap disappears. The amount of the polymerization inhibiting agent added is preferably 0.01 to 1 '% by weight in the photosensitive conductive paste. When the amount is less than 0.01% by weight, the effect of addition is less likely to be exhibited. When the amount is more than 1% by weight, the sensitivity is lowered. Therefore, the amount of exposure required for pattern formation tends to increase. -16- 201042664 Specific examples of the plasticizer include dibutyl phthalate 'dioctyl decanoate, polyethylene glycol, glycerin and the like. The antioxidant is added to prevent oxidation of the acrylic copolymer during storage. Specific examples of the antioxidant include 2,6-di(t-butyl)-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-4-B. Phenol, 2,2'-methylene-bis(4-methyl-6-tert-butylphenol), 2,2'-methylene-bis(4-ethyl-6-tert-butylphenol) , 4,4'-bis(3-methyl-6-tert-butylphenol), 1,1,3-gin(2-methyl-4-hydroxy-6-t-butylphenyl) Alkane, bis[3,3-biguanide-(4-hydroxy-3-t-butylphenyl)butyric acid]ethylene glycol ester, dilauryl thiodipropionate, triphenyl phosphite, and the like. In the case where an antioxidant is added, the amount thereof is preferably 0.01 to 1% by weight in the glass paste. In the photosensitive conductive paste of the present invention, in the case where the viscosity of the solution is to be adjusted, it is preferred to add an organic solvent. The content of the organic solvent is preferably from 20 to 40% by weight in the paste. Outside of this range, the paste cannot be applied smoothly, and a film having a uniform thickness cannot be obtained. Further, as the organic Q solvent used at this time, cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, or the like can be used. Cyclopentanone, isobutanol, isopropanol, tetrahydrofuran, dimethyl hydrazine, T-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, 'products An alcohol, diethylene glycol monobutyl ether acetate, or the like, or a mixture of organic solvents containing one or more of the above. In the photosensitive conductive paste of the present invention, at least one of the photosensitive monomer, the photosensitive oligomer, and the photosensitive polymer is usually added, and a photopolymerization initiator, an ultraviolet absorber, and a photo-polymerization initiator are further added as necessary. Additives such as sensitizers, sensitizing and polymerization inhibiting agents, plasticizers, tackifiers, organic solvents, antioxidant powders, organic or inorganic precipitation inhibitors, etc., after blending and formulating, using a three-roller or a kneading machine The mixture is produced in a homogeneous manner. The viscosity of the photosensitive conductive paste is suitably adjusted, and its range is preferably ~200 Pa.s. For example, coating to a glass substrate by spin coating is preferably 0.2 to 5 Pa·s, and is applied by screen printing once to obtain a film thickness of 10 to 20 μm, which is 10 to 100 Pa·s. good. Further, the present invention relates to a method of producing a display, comprising the steps of: exposing a paste coating film by a photomask by drying the photosensitive conductive paste to form a paste coating film; and developing the paste after exposure. a step; and a step of forming a pattern by firing. Next, an example in which the paste coating film is formed by the photosensitive paste method will be described, but the present invention is not limited thereto. The photosensitive conductive paste is entirely or partially coated on a glass substrate or a ceramic substrate or a polymer film. As the coating method, a general method such as a screen printing method, a bar coater, a roll coater, or a die coater knife coater can be used. The coating thickness can be adjusted by selecting the coating number, the mesh of the screen, and the viscosity of the paste. In addition, a method such as a laminator for a photosensitive sheet coated with a photosensitive glass paste on a film such as a polyester film, or a method of transferring a photosensitive conductive paste on a substrate may be used after applying the photosensitive conductive paste. The exposure device is exposed to the agent, and is divided into two parts for coating, and the one side of the film is coated and scraped to make it. Exposure -18- 201042664 Light is generally a method of mask exposure using a photomask as is the case with conventional photolithography. The mask to be used is selected to be either a negative type or a positive type depending on the type of photosensitive organic component. Alternatively, a method of directly drawing a red or blue laser light without using a photomask may be employed. As the exposure device, a stepper exposure machine, a proximity exposure machine, or the like can be used. Further, when a large-area exposure is performed, a photosensitive glass paste is applied onto a substrate such as a glass substrate, and then exposed while being conveyed, whereby a large-area exposure can be performed with an exposure machine having a small exposure area. Examples of the active light source to be used include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are preferred, and as the light source, for example, a low pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a halogen lamp, a germicidal lamp, or the like can be used. Among these, ultra-high pressure mercury lamps are suitable. The exposure conditions vary depending on the coating thickness, and an ultrahigh pressure mercury lamp having an output of 1 to 100 mW/cm 2 is usually used for exposure for 0.1 to 10 minutes. After the exposure, development is performed by the difference in solubility between the exposed portion and the unexposed portion to the developing solution, and in this case, it can be carried out by a dipping method, a shower method, a spray method, or a brush method. The developing solution is a solution capable of dissolving an organic component to be dissolved in the photosensitive conductive paste. In addition, water can be added to the organic solvent without losing its solubility. In the case where a compound having an acidic group such as a carboxyl group is present in the photosensitive conductive paste, it can be developed with an aqueous alkali solution. In the case of an aqueous alkali solution, -19-201042664, an aqueous solution of sodium hydroxide, sodium carbonate, sodium carbonate, or calcium hydroxide can be used, and in the case of using an aqueous solution of an organic alkali, it is preferred to remove an alkali component during firing. . As the organic base, a general amine compound can be used. Specific examples thereof include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine, and the like. The concentration of the aqueous alkali solution is preferably 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. When the concentration of the aqueous alkali solution is less than 0.01% by weight, the soluble portion tends not to be removed, and if it exceeds 10% by weight, the pattern portion is peeled off and the non-soluble portion tends to be corroded. In addition, the development temperature at the time of development is suitable for step management at 20 to 50 °C. Next, it fires in a baking furnace. The firing environment or temperature is different depending on the type of paste or substrate, and is fired in an environment such as air, nitrogen or hydrogen. In the case of the firing furnace, a batch type firing furnace or a conveyor type continuous firing furnace can be used. The firing temperature ' is usually carried out at 400 to 1000 ° C. When pattern processing is performed on a glass substrate, it is usually baked at a temperature Q of 450 to 620 ° C for 10 to 60 minutes. Further, the firing temperature is determined in accordance with the glass powder to be used, and it is preferred to burn at a suitable temperature so that the shape does not collapse after pattern formation and the shape of the glass powder does not remain. Further, in the above steps of coating, exposure, development, and firing, the heating step of 50 to 300 °C may be introduced for the purpose of drying and preliminary reaction. - The display of the present invention obtained by the above-described production method does not contain a noble metal as a conductive powder, and the photosensitive conductive paste of the present invention containing an aluminum powder can be produced at a low cost. In addition, because there is no silver or copper, -20- 201042664, it is possible to manufacture a display that does not have problems such as migration or yellowing, and is electrically stable. Further, since it is rich in glass powder and a photosensitive organic component, it is possible to prevent problems such as poor sintering, high resistance enthalpy, and poor current due to oxidation of the surface of the aluminum powder during firing. [Examples] Next, the present invention will be specifically described by way of examples, and the present invention is not limited by the examples. 〇 In addition, the average particle diameter (d5.) and the maximum particle diameter (D-U) of the following inorganic powders were measured using "MT3 3 00" manufactured by Nikkiso Co., Ltd. Further, the softening point of the glass powder was measured by a differential thermal analyzer manufactured by Rigaku Corporation. _ Manufacturing Example 1 (Metal for forming a dielectric body)

Bi2〇3/Si〇2/Ah〇3/ZnO/B2〇3/BaO= 25/30/5/10/25/5(重量 ％) Q 所構成之玻璃粉末（平均粒徑2# m)40重量份、氧化鈦1〇重 量份、氧化矽10重量份、乙基纖維素3重量份、單體（三羥 甲基丙烷三丙烯酸酯）1 5重量份、萜品醇25重量份’以三輥 輪機混合、分散，得到介電體形成用糊。 ' 製造例2 (間隔壁形成用糊） 加入由Bi2〇3/Si〇2/Ah〇3/ZnO/B2〇3/BaO= 25/30/5/10/25/5 (% by weight) Q The glass powder (average particle size 2# m) 40 Parts by weight, titanium oxide 1 part by weight, cerium oxide 10 parts by weight, ethyl cellulose 3 parts by weight, monomer (trimethylolpropane triacrylate) 15 parts by weight, terpineol 25 parts by weight 'three The roller turbine is mixed and dispersed to obtain a paste for forming a dielectric body. 'Production Example 2 (partition forming paste)

Si〇2/Al2〇3/ZnO/B2〇3/BaO/LhO= 20/20/5/30/1 5/1 0(重量 ％) 所構成之玻璃粉末（平均粒徑2 # m)67重量份、聚合物 -21 - 201042664 (Cyclomer P ACA250’ DAICEL化學工業股份有限公司製）ι〇 重量份、單體（三羥甲基丙烷三丙烯酸酯）1〇重量份、氧化 鈦（平均粒徑0.2 // m)3重量份、苄醇4重量份、丁基卡必醇醋 酸酯3重量份，以三輥輪機混合、分散，而得到間隔壁形成 - 用糊。 <比電阻之測定> 針對於已製作出電極的背板，測定面內9線電極之電阻 値、厚度、線寬，算出各線之比電阻。對所算出之値求取 〇 平均値，定爲比電阻之測定値》 < L *値、a *値、b *値之測定〉 針對於已形成間隔壁的背板，使用分光測色計（Minolta - 股份有限公司製CM-2002)從間隔壁形成膜面的兩側測定b* 値。在相同基板內取3點，取相異的基板3枚，合計測定9 點，求得平均値，而當作各測定値。 <密著強度之評估> 〇 針對於已形成間隔壁的背板，以1 920條玻璃紙膠帶，對 電極端子部位進行剝離測試（使用Nichiban公司製 Cello tape (註冊商標））’將沒有剝離者定爲優、僅1處剝離者 定爲良、2處以上剝離者定爲不良。 <印刷性之評估> 在印刷有感光性導電糊的基板，對於面內36處之膜厚進 行測定’將最大値與最小値之差小於2 m者定爲優、2以m 以上而小於小於3# m者定爲良、3ym以上者定爲不良。 -22- 201042664 <圖案形狀之評估> 塗布感光性導電糊並使其乾燥之後，藉由曝光、顯像而 使圖案形成後進行燒成，將圖案沒有缺損者定爲優、1處至 5處者定爲良、6處以上者定爲不良。 ' 實施例1〜17、比較例1〜10 將表1所揭示的特性之鋁粉末、表2所揭示的特性之玻璃 粉末、以及下述添加物，以表3〜5所揭示的種類及添加量’ 0 藉由三輥輪機混合，製作感光性導電糊。 感光性聚合物：酸價= 85、Mw=32,000之感光性丙烯酸 聚合物（Tore股份有限公司製APX-7 16) 感光性單體：三羥甲基丙烷三丙烯酸酯 • 光聚合起始劑：2-苄基-2-二甲基胺基-1-(4-嗎啉苯基）- - 丁酮-1 分散劑：聚醚-酯型陰離子系界面活性劑（楠本化成股份 有限公司製，「DISPARLON」7004) 〇 聚合禁止劑：對-甲氧基酚 有機溶劑：二乙二醇單丁醚醋酸酯 形成尺寸大小42吋的AC(交流）型電漿顯示器面板之背 板，並實施評估。對於形成方法依序進行說明。 使用590x964x2.8mm之42吋尺寸大小的PD-200(旭硝子股 份有限公司製）作爲玻璃基板。在此基板上，以絲網印刷塗 布前述方法所得到之感光性導電糊，並且進行乾燥，以作 爲定址電極。隔著既定之光罩，曝光既定次數之後，進行 -23- 201042664 顯像，形成未燒成圖案。圖案形成後，在590。(3進行15分鐘 之燒成。 對此基板實施製造例1所得到之介電體形成用糊之塗 布、乾燥。 ' 另外，藉由模具塗布機將製造例2所得到之間隔壁形成 用糊塗布成既定厚度之後，以無塵烘箱在100 °C乾燥40分 鐘，形成塗布膜。與既定光罩的間隙取爲150ym，對所形 成的塗布膜實施曝光。 ❹ 藉由絲網印刷法，在以如此方式所形成的間隔壁，塗布 各色螢光體糊，並且燒成（500°C，30分鐘），在間隔壁的側 面及底部形成螢光體層。 - 將所得到之背板與前述的前板貼合並且密封之後’封Λ _ 放電用氣體，連接驅動電路，製作出電漿顯示器（PDP) ° 將實施例1〜18及比較例1〜1〇之感光性導電糊之評估Si〇2/Al2〇3/ZnO/B2〇3/BaO/LhO= 20/20/5/30/1 5/1 0 (% by weight) Glass powder (average particle size 2 # m) 67 weight , polymer-21 - 201042664 (made by Cyclomer P ACA250' DAICEL Chemical Industry Co., Ltd.) ι by weight, monomer (trimethylolpropane triacrylate), 1 part by weight, titanium oxide (average particle size 0.2 // m) 3 parts by weight, 4 parts by weight of benzyl alcohol, and 3 parts by weight of butyl carbitol acetate were mixed and dispersed in a three-roll mill to obtain a partition forming paste. <Measurement of specific resistance> The resistance 値, thickness, and line width of the in-plane 9-line electrode were measured for the back sheet on which the electrode was fabricated, and the specific resistance of each line was calculated. The average of the calculated enthalpy is determined as the measurement of the specific resistance 値" < L * 値, a * 値, b * 値 measurement> For the backing plate in which the partition walls have been formed, a spectrophotometer is used. (Minolta - Co., Ltd. CM-2002) b* 値 was measured from both sides of the partition film forming film surface. Three points were taken in the same substrate, and three different substrates were taken, and nine points were measured in total, and the average enthalpy was determined, and each measurement was performed. <Evaluation of adhesion strength> 〇For the back sheet in which the partition walls have been formed, peeling test (using Cello tape (registered trademark) manufactured by Nichiban Co., Ltd.) with 1 920 pieces of cellophane tape is not peeled off Those who are determined to be excellent, only one peeling is determined to be good, and two or more peelings are determined to be bad. <Evaluation of Printability> In the substrate on which the photosensitive conductive paste was printed, the film thickness in the in-plane 36 was measured. 'The difference between the maximum 値 and the minimum 小于 is less than 2 m, and is preferably 2 or more. Less than 3# m is determined to be good, and 3ym or more is determined to be bad. -22- 201042664 <Evaluation of pattern shape> After the photosensitive conductive paste is applied and dried, the pattern is formed by exposure and development, and then baked, and the pattern is not defective, and one is made to one. 5 people were determined to be good, and 6 or more were classified as bad. Examples 1 to 17 and Comparative Examples 1 to 10 The aluminum powder of the characteristics disclosed in Table 1, the glass powder of the characteristics disclosed in Table 2, and the following additives are listed in Tables 3 to 5 and added. The amount ' 0 was mixed by a three-roll mill to prepare a photosensitive conductive paste. Photosensitive polymer: Photosensitive acrylic polymer having an acid value of 85 and Mw = 32,000 (APX-7 16 manufactured by Tore Co., Ltd.) Photosensitive monomer: trimethylolpropane triacrylate • Photopolymerization initiator: 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1 dispersant: polyether-ester type anionic surfactant (manufactured by Nanben Chemical Co., Ltd., "DISPARLON" 7004) Antimony polymerization inhibitor: p-methoxyphenol organic solvent: diethylene glycol monobutyl ether acetate forms a back sheet of an AC (alternating) type plasma display panel of size 42吋, and is evaluated. . The formation method will be described in order. As a glass substrate, a 42-inch size PD-200 (manufactured by Asahi Glass Co., Ltd.) of 590 x 964 x 2.8 mm was used. On this substrate, the photosensitive conductive paste obtained by the above method was applied by screen printing, and dried to serve as an address electrode. After a predetermined number of exposures through a predetermined mask, -23-201042664 is developed to form an unfired pattern. After the pattern is formed, at 590. (3) The substrate was fired for 15 minutes. The substrate was coated and dried with the paste for forming a dielectric material obtained in Production Example 1. In addition, the partition wall forming paste obtained in Production Example 2 was paste-coated by a die coater. After being formed into a predetermined thickness, it was dried in a dust-free oven at 100 ° C for 40 minutes to form a coating film. The gap with the predetermined mask was taken as 150 μm, and the formed coating film was exposed. 藉 By screen printing, The phosphor pastes of the respective colors were applied to the partition walls formed in this manner, and fired (500 ° C, 30 minutes) to form a phosphor layer on the side and bottom sides of the partition walls. - The obtained back sheet and the foregoing After the front plate is bonded and sealed, the sealing _ discharge gas is connected to the driving circuit to produce a plasma display (PDP). Evaluation of the photosensitive conductive pastes of Examples 1 to 18 and Comparative Examples 1 to 1

結果揭示於表6。 鋁粉末 平均粒徑 (μ, m) 比表面積 (m2/s) 最大粒徑 (a m) 球形率 (Ψ〇) A 2.0 0.8 4.0 85 B 1.0 1.3 4.5 so . C 1.5 1.2 4.0 80 D 3.0 0.6 7.0 85 E 4.0 0.4 8.0 85 F 2.0 0.6 5.0 60 G 2.0 0.5 6.0 50 Η 2.0 1.9 3.5 55 I 2.0 0.7 15.0 80 J 0.8 2.0 4.0 80 K 5.0 0.3 15.0 80 -24- 201042664The results are disclosed in Table 6. Aluminum powder Average particle size (μ, m) Specific surface area (m2/s) Maximum particle size (am) Spherical ratio (Ψ〇) A 2.0 0.8 4.0 85 B 1.0 1.3 4.5 so . C 1.5 1.2 4.0 80 D 3.0 0.6 7.0 85 E 4.0 0.4 8.0 85 F 2.0 0.6 5.0 60 G 2.0 0.5 6.0 50 Η 2.0 1.9 3.5 55 I 2.0 0.7 15.0 80 J 0.8 2.0 4.0 80 K 5.0 0.3 15.0 80 -24- 201042664

[表2] 玻璃粉末 軟化點 CC ) 平均粒徑 (β m) 最大粒徑 (β m) L 490 0.8 3.0 Μ 490 1.5 4.0 Ν 440 0.8 3.0 〇 530 0.8 3.0 Ρ 390 0.8 3.0 Q 570 0.8 3.0 -25- 201042664[Table 2] Glass powder softening point CC) Average particle diameter (β m) Maximum particle diameter (β m) L 490 0.8 3.0 Μ 490 1.5 4.0 Ν 440 0.8 3.0 〇 530 0.8 3.0 Ρ 390 0.8 3.0 Q 570 0.8 3.0 -25 - 201042664

OD 【ε漱】 實施例 C<1 1 1 1 1 1 1 1 1 1 1 1 1 1 ο 1 1 ο ο 寸 IT) νη νη i 1 ο 1 1 1 1 1 1 1 1 1 1 1 1 ο τ < 1 1 1 2 ο 寸 CN Ο 穿 1 1 1 1 1 1 1 1 1 1 1 ο 1 1 1 1 ο ο 寸 ΙΤΪ un <Ν 1 1 1 1 1 1 1 1 ο 1 1 ο «111 Η 1 1 1 1 1 ο ο 寸 wn wn CN οο 1 1 1 1 1 1 1 ο 1 1 1 ο ι—Η 1 1 1 1 1 2 ο 寸 νη Οί Γ- 1 1 1 1 1 1 ο 1 1 1 1 ο ι i 1 1 1 1 1 ο ο 寸 CS 1 1 1 1 1 ο 1 1 1 1 1 ο r__H 1 1 1 1 1 ο ο 寸 <Τ) νη CN ι〇 1 1 1 1 ο 1 1 1 1 1 1 ο τ Η 1 1 1 1 1 ο ο 寸 ν〇 C<I 寸 1 1 1 ο 1 1 1 1 1 1 1 ο 1 1 1 1 1 ο ο 寸 wn <Ν CO 1 1 ο 1 1 1 i 1 1 1 1 ο ι 1 1 i 1 1 1 2 ο 寸 ν〇 νη <Ν ο<ι 1 ο 1 1 1 1 1 1 1 1 1 ο ι" "Η 1 1 1 1 1 ο ο 寸 ιη <Ν t < ο 1 1 1 1 1 1 1 1 1 1 ο ι—Η 1 1 1 1 1 ο ο 寸 ΙΟ νη CN < ΡΡ ο Q W Ρ-. ο r-Ή Μ ζ ο 〇Η α <Π 嵌 飽 aa ΉΠΒ nmL cnir 鏺 蘅 <Π 分散劑 蘅 Ή 撕 <Π 有機溶劑 鋁粉末 玻璃粉末 _φ 侧 '—^ ,900- 201042664 ο ο 【寸撇】 比較例 1 1 1 1 1 1 1 1 1 VO 1 1 1 1 1 寸 »〇 v〇 cs v〇 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 VO 寸 ΙΟ 〇 cs 寸 Ο 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ο ο ο 寸 m 〇 in o \T) CsJ cn Ο 1 1 1 1 1 1 1 1 1 1 1 1 1 1 o ”蜱 1 ο ο 寸 *〇 <N CM 1 1 1 1 1 1 1 1 1 1 ο o r~H 1 1 1 1 1 2 ο 寸 wo ο *〇 o <N 1 < 1 1 1 1 1 1 1 1 1 ο 1 o 1 1 1 1 1 2 ο 寸 νη \n CS 翠 oo 1 1 1 1 1 1 1 1 1 1 f" H 1 1 1 1 1 νο CO 0.75 1 0.25 csi r-j 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 ιη ιη 寸 in vn cs 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 τ—< 寸 (N 4¾ n 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 'Ο 寸 ίη v〇 (N 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 CN r-H cn f—Η 寸 CO 1 1 1 1 1 1 1 1 1 1 υη 1 1 1 1 1 ο ο 寸 ίη v〇 v〇 cs < PQ U Q ω Ρ-, ϋ κ t-H ；Zi o ο <□ 嵌 a m 感光性單體 光聚合起始劑 1分散劑 聚合禁止劑 有機溶劑 鋁粉末 玻璃粉末 摻合量 (重量份） -Ll_ 201042664 [表5] 比較例 7 8 9 10 摻合量 (重量份） 鋁粉末 A 40 40 48 35 B — 一 — — C — 一 — — D E — — — — F — — — — G — — — — Η — — — — I — — — — J — — — — K — — — — 玻璃粉末 L 20 2 11 7 Μ — — — ~ N — — — ~ 〇 — — — ~ P — — — ~ Q — — — ~ 感光性聚合物 8 12 5 13.5 感光性單體 7 13 5 13.5 光聚合起始劑 4 4 3 4 分散劑 0.5 0.5 0.75 0.5 聚合禁止劑 0.5 0.5 0.25 0.5 有機溶劑 20 28 27 28OD [ε漱] Example C<1 1 1 1 1 1 1 1 1 1 1 1 1 1 ο 1 1 ο ο IT IT) νη νη i 1 ο 1 1 1 1 1 1 1 1 1 1 1 1 ο τ < 1 1 1 2 ο 寸 CN 穿 wear 1 1 1 1 1 1 1 1 1 1 1 ο 1 1 1 1 ο ο ΙΤΪ ΙΤΪ un <Ν 1 1 1 1 1 1 1 ο 1 1 ο «111 Η 1 1 1 1 1 ο ο inch wn wn CN οο 1 1 1 1 1 1 1 ο 1 1 1 ο ι—Η 1 1 1 1 1 2 ο ννη Οί Γ- 1 1 1 1 1 1 ο 1 1 1 1 ο ι i 1 1 1 1 1 ο ο inch CS 1 1 1 1 1 ο 1 1 1 1 1 ο r__H 1 1 1 1 1 ο ο inch <Τ) νη CN ι〇1 1 1 1 ο 1 1 1 1 1 1 ο τ Η 1 1 1 1 1 ο ο 寸ν〇C<I inch 1 1 1 ο 1 1 1 1 1 1 1 ο 1 1 1 1 1 ο ο inch wn <Ν CO 1 1 ο 1 1 1 i 1 1 1 1 ο ι 1 1 i 1 1 1 2 ο 〇ν〇νη <Ν ο<ι 1 ο 1 1 1 1 1 1 1 1 ο ι"""Η 1 1 1 1 1 ο ο inch Ιη <Ν t < ο 1 1 1 1 1 1 1 1 1 1 ο ι—Η 1 1 1 1 1 ο ο ΙΟ ΙΟ νη CN < ΡΡ ο QW Ρ-. ο r-Ή Μ ζ ο 〇Η &<Π embedded aa ΉΠΒ nmL cnir 鏺蘅<Π dispersant 蘅Ή tear <Π organic Aluminum powder glass powder _φ side '-^ , 900- 201042664 ο ο [inch inch] Comparative example 1 1 1 1 1 1 1 1 1 VO 1 1 1 1 1 inch »〇v〇cs v〇1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 VO inch ΙΟ 〇cs inch Ο 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ο ο ο 寸 m 〇in o \T) CsJ cn Ο 1 1 1 1 1 1 1 1 1 1 1 1 1 1 o ”蜱1 ο ο 寸*〇<N CM 1 1 1 1 1 1 1 1 1 1 ο or~H 1 1 1 1 1 2 ο inch wo ο *〇 o <N 1 < 1 1 1 1 1 1 1 1 1 ο 1 o 1 1 1 1 1 2 ο 寸νη \n CS 翠oo 1 1 1 1 1 1 1 1 1 1 f" H 1 1 1 1 1 νο CO 0.75 1 0.25 csi rj 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 ιη ιη inch in vn cs 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 τ—< N (1⁄4 n 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 'Ο inch ίη v〇(N 1 1 1 1 1 1 1 1 1 1 o 1 1 1 1 1 CN rH cn f—寸 inch CO 1 1 1 1 1 1 1 1 1 1 υη 1 1 1 1 1 ο ο inch ίη v〇v〇cs < PQ UQ ω Ρ-, ϋ κ tH ;Zi o ο <□ embedded am photosensitive Monomer photopolymerization initiator 1 dispersant polymerization inhibitor organic solvent Aluminium powder glass powder blending amount (parts by weight) - Ll_ 201042664 [Table 5] Comparative Example 7 8 9 10 Blending amount (parts by weight) Aluminum powder A 40 40 48 35 B — One — — C — One — — DE — — — — F — — — — G — — — — Η — — — — I — — — — J — — — — K — — — — Glass powder L 20 2 11 7 Μ — — — ~ N — — — ~ 〇— — — ~ P — — — ~ Q — — — ~ Photosensitive polymer 8 12 5 13.5 Photosensitive monomer 7 13 5 13.5 Photopolymerization initiator 4 4 3 4 Dispersant 0.5 0.5 0.75 0.5 Polymerization inhibitor 0.5 0.5 0.25 0.5 organic solvent 20 28 27 28

-28- .201042664 [表6] 比電阻 (# Ω .cm) 密著強度 b*値 印刷性 圖案形狀 實施例1 500 優 2.2 優 優 實施例2 960 良 2.4 優 良 實施例3 860 優 2.6 優 優 實施例4 750 優 2.1 優 優 實施例5 920 良 2.5 優 良 實施例6 600 優 2.6 優 優 實施例7 640 優 2.6 優 優 實施例8 720 優 3.0 優 優 實施例9 670 優 2.4 優 良 實施例10 520 優 2.5 優 良 實施例11 590 優 2.4 優 優 實施例12 540 良 2.6 優 優 實施例13 530 良 2.9 優 優 實施例14 860 優 3.0 良 良 實施例15 520 優 2.5 優 良 實施例16 800 優 2.6 良 良 實施例17 990 良 2.5 優 良 實施例18 750 優 2.6 良 良 比較例1 2940 不良 2.4 良 不良 比較例2 1300 不良 2.6 優 不良 比較例3 850 優 3.0 優 不良 比較例4 1450 不良 2.5 優 優 比較例5 1050 優 2.5 優 不良 比較例6 1690 良 3.4 良 良 比較例7 1880 優 2.9 優 良 比較例8 610 不良 2.5 良 優 比較例9 1260 優 2.6 良 不良 比較例10 1010 良 2.5 良 優 -29- 201042664 實施例1〜18所得到之背板電極，可形成良好的電極圖 案，另外，在已形成間隔壁的狀態，電極密著性評估方面 以及背板變黃程度b*値的測定方面，得到了良好的結果。 實施例1〜18任一者皆良好。關於比較例1〜1〇,無法得 到在電極之電阻値、密著強度、及電極圖案加工性方面全 部令人滿意的結果。 【圖式簡單說明】 無。 【主要元件符號說明】 無。 -30--28- .201042664 [Table 6] Specific resistance (# Ω .cm) Adhesion strength b*値 Printability pattern shape Example 1 500 Excellent 2.2 Excellent example 2 960 Good 2.4 Excellent Example 3 860 Excellent 2.6 Excellent example 4 750 Excellent 2.1 Excellent Example 5 920 Good 2.5 Excellent Example 6 600 Excellent 2.6 Excellent Example 7 640 Excellent 2.6 Excellent Example 8 720 Excellent 3.0 Excellent Example 9 670 Excellent 2.4 Excellent Example 10 520 Excellent 2.5 Excellent Example 11 590 Excellent 2.4 Excellent Example 12 540 Good 2.6 Excellent Example 13 530 Good 2.9 Excellent Example 14 860 Excellent 3.0 Good Example 15 520 Excellent 2.5 Excellent Example 16 800 Excellent 2.6 Good Example 17 990 Good 2.5 Excellent Example 18 750 Excellent 2.6 Liangliang Comparative Example 1 2940 Bad 2.4 Good Bad Comparative Example 2 1300 Bad 2.6 Good Bad Comparative Example 3 850 Excellent 3.0 Good Bad Comparative Example 4 1450 Bad 2.5 Excellent Comparative Example 5 1050 Excellent 2.5 Excellent Comparative Example 6 1690 Good 3.4 Liangliang Comparative Example 7 1880 Excellent 2.9 Excellent Comparative Example 8 610 Bad 2.5 Good Excellent Comparative Example 9 1260 Excellent 2.6 Good Bad Comparison Example 10 1010 Good 2.5 Liangyou -29- 201042664 The back plate electrodes obtained in Examples 1 to 18 can form a good electrode pattern, and in the state in which the partition walls have been formed, the evaluation of the electrode adhesion and the yellowing of the back sheet Good results were obtained in terms of the degree of b*値. Any of Examples 1 to 18 was good. With respect to Comparative Examples 1 to 1 , all satisfactory results in terms of resistance 値, adhesion strength, and electrode pattern processability of the electrode could not be obtained. [Simple description of the diagram] None. [Main component symbol description] None. -30-

Claims (1)

201042664 七、申請專利範圍： 1. —種感光性導電糊，其係含有：（A)平均粒徑爲1〜4ym 的鋁粉末30〜45重量％、（B)軟化點爲400〜550°C的玻璃 • 粉末5〜15重量％、（C)感光性有機成分15〜30重量％、 » 及（D)溶劑20〜40重量％。 2. 如申請專利範圍第1項之感光性導電糊，其中該（A)鋁粉 末與該（B)玻璃粉末之重量比係在75: 25〜95: 5的範圍 內。 f) 3. 如申請專利範圍第1或2項之感光性導電糊’其中該（A) 鋁粉末之球形率係6 0 %以上。 4. 如申請專利範圍第1、2或3項之感光性導電糊’其中該 . (A)鋁粉末之平均粒徑Da與該（B)玻璃粉末的平均粒徑Dg 滿足以下式子： ψ 0.3# mS Dg 各 DaS 10〆 m。 5. 如申請專利範圍第1、2、3或4項之感光性導電糊，其 ◎ 中該（A)銘粉末之比表面積係0.2〜1.4m2/g。 6. —種顯示器之製造方法，其係包含：將如申請專利範圍 第1、2、3、4或5項之感光性導電糊塗布在基板上並使 其乾燥而形成糊塗布膜的步驟；隔著光罩對糊塗布膜實 施曝光的步驟；使曝光後的糊塗布膜顯像的步驟；及藉 由燒成而形成圖案的步驟。 7. —種顯示器，其係藉由如申請專利範圍第6項之顯示器 之製造方法所得到者。 -31- .201042664 四、指定代表圖： (一) 本案指定代表圖為：無。 (二) 本代表圖之元件符號簡單說明： Μ 〇201042664 VII. Patent application scope: 1. A photosensitive conductive paste containing: (A) 30 to 45 wt% of aluminum powder having an average particle diameter of 1 to 4 μm, and (B) a softening point of 400 to 550 ° C Glass • 5 to 15% by weight of the powder, (C) 15 to 30% by weight of the photosensitive organic component, » and (D) solvent 20 to 40% by weight. 2. The photosensitive conductive paste according to claim 1, wherein the weight ratio of the (A) aluminum powder to the (B) glass powder is in the range of 75: 25 to 95: 5. f) 3. The photosensitive conductive paste of claim 1 or 2 wherein the spherical ratio of the (A) aluminum powder is 60% or more. 4. The photosensitive conductive paste of claim 1, 2 or 3, wherein the average particle diameter Da of the (A) aluminum powder and the average particle diameter Dg of the (B) glass powder satisfy the following formula: 0.3# mS Dg Each DaS 10〆m. 5. For the photosensitive conductive paste of claim 1, 2, 3 or 4, the specific surface area of the (A) powder is 0.2 to 1.4 m2/g. 6. A method of manufacturing a display, comprising: a step of applying a photosensitive conductive paste according to claim 1, 2, 3, 4 or 5 to a substrate and drying it to form a paste coating film; a step of exposing the paste coating film through a photomask; a step of developing the paste coating film after exposure; and a step of forming a pattern by firing. 7. A display obtained by the method of manufacturing a display of claim 6 of the patent application. -31- .201042664 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: Μ 〇 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式：5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: