TW200907107A - Surface treating agent - Google Patents

Surface treating agent Download PDF

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Publication number
TW200907107A
TW200907107A TW097124748A TW97124748A TW200907107A TW 200907107 A TW200907107 A TW 200907107A TW 097124748 A TW097124748 A TW 097124748A TW 97124748 A TW97124748 A TW 97124748A TW 200907107 A TW200907107 A TW 200907107A
Authority
TW
Taiwan
Prior art keywords
surface treatment
treatment agent
acid
compound
zinc
Prior art date
Application number
TW097124748A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Nishie
Noriko Yaguma
Yoshiaki Furukawa
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Publication of TW200907107A publication Critical patent/TW200907107A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • C07D235/08—Radicals containing only hydrogen and carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
TW097124748A 2007-07-20 2008-07-01 Surface treating agent TW200907107A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189950 2007-07-20

Publications (1)

Publication Number Publication Date
TW200907107A true TW200907107A (en) 2009-02-16

Family

ID=40149312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097124748A TW200907107A (en) 2007-07-20 2008-07-01 Surface treating agent

Country Status (5)

Country Link
JP (1) JP2009046761A (ko)
KR (1) KR20090009734A (ko)
CN (1) CN101348913B (ko)
DE (1) DE102008033348A1 (ko)
TW (1) TW200907107A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10184186B2 (en) 2014-06-24 2019-01-22 Okuno Chemical Industries Co., Ltd. Composition for blackening copper-based or silver-based metals
CN105750354A (zh) * 2016-03-31 2016-07-13 常州易藤电气有限公司 一种冷镀锡铁道用铜镁合金绞线的制备方法
CN105880432A (zh) * 2016-03-31 2016-08-24 常州易藤电气有限公司 一种热镀锡铁道用铜镁合金绞线的制备方法
JP6402134B2 (ja) * 2016-05-12 2018-10-10 株式会社タムラ製作所 水溶性プリフラックス、それを用いた表面処理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772645A (en) * 1986-05-07 1988-09-20 Minnesota Mining And Manufacturing Company Epoxy resin composition
JP2561150B2 (ja) * 1989-06-09 1996-12-04 四国化成工業株式会社 銅及び銅合金の表面処理方法
JP2972295B2 (ja) * 1990-08-10 1999-11-08 四国化成工業株式会社 銅及び銅合金の表面処理方法
JP2834884B2 (ja) * 1990-10-29 1998-12-14 四国化成工業株式会社 銅及び銅合金の表面処理方法
JPH05163585A (ja) * 1991-12-12 1993-06-29 Shikoku Chem Corp 銅及び銅合金の表面処理方法
JPH05237688A (ja) 1992-02-28 1993-09-17 Shikoku Chem Corp はんだ付け用フラックス組成物
JP2923596B2 (ja) 1993-08-11 1999-07-26 メック株式会社 イミダゾール系化合物を用いた銅および銅合金の表面処理剤
US5747623A (en) * 1994-10-14 1998-05-05 Tonen Corporation Method and composition for forming ceramics and article coated with the ceramics
JPH09316649A (ja) * 1996-05-27 1997-12-09 Matsushita Electric Ind Co Ltd 無電解めっき液
JPH10251867A (ja) * 1997-03-07 1998-09-22 Shikoku Chem Corp 銅及び銅合金の表面処理剤
JPH11177218A (ja) 1997-12-12 1999-07-02 Tamura Kaken Co Ltd 電子回路用金属面具備部品及びその表面保護剤
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
JP2007115497A (ja) * 2005-10-20 2007-05-10 Mitsubishi Materials Corp ニッケル被覆銅微粒子とその製造方法、導電ペースト、及び、導電膜の製造方法

Also Published As

Publication number Publication date
JP2009046761A (ja) 2009-03-05
KR20090009734A (ko) 2009-01-23
DE102008033348A1 (de) 2009-01-22
CN101348913B (zh) 2011-09-07
CN101348913A (zh) 2009-01-21

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