TW200830482A - Surface-mount housing for semiconductor chip - Google Patents

Surface-mount housing for semiconductor chip Download PDF

Info

Publication number
TW200830482A
TW200830482A TW96134152A TW96134152A TW200830482A TW 200830482 A TW200830482 A TW 200830482A TW 96134152 A TW96134152 A TW 96134152A TW 96134152 A TW96134152 A TW 96134152A TW 200830482 A TW200830482 A TW 200830482A
Authority
TW
Taiwan
Prior art keywords
lead frame
surface mount
wafer
cover
mount type
Prior art date
Application number
TW96134152A
Other languages
English (en)
Chinese (zh)
Inventor
Georg Bogner
Rolf Hanggi
Thomas Zeiler
Original Assignee
Osram Opto Semiconductors Gmbh
Rolf Hanggi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Rolf Hanggi filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200830482A publication Critical patent/TW200830482A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW96134152A 2006-09-15 2007-09-13 Surface-mount housing for semiconductor chip TW200830482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610043404 DE102006043404A1 (de) 2006-09-15 2006-09-15 Oberflächenmontierbares Gehäuse für einen Halbleiterchip

Publications (1)

Publication Number Publication Date
TW200830482A true TW200830482A (en) 2008-07-16

Family

ID=39047775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96134152A TW200830482A (en) 2006-09-15 2007-09-13 Surface-mount housing for semiconductor chip

Country Status (3)

Country Link
DE (1) DE102006043404A1 (fr)
TW (1) TW200830482A (fr)
WO (1) WO2008031391A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007001706A1 (de) * 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
DE102004003928B4 (de) * 2004-01-26 2012-02-23 Tay Kheng Chiong Ein miniaturisiertes mit SM-Technologie bestückbares optoelektronisches Bauelement und Verfahren zur Herstellung dieses Bauelements
KR100708004B1 (ko) * 2004-12-30 2007-04-16 럭스피아(주) 리드프레임, 이를 이용한 반도체 패키지 및 반도체 패키지제조방법

Also Published As

Publication number Publication date
DE102006043404A1 (de) 2008-03-27
WO2008031391A1 (fr) 2008-03-20

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