WO2008031391A1 - Boîtier pouvant être monté en surface pour puce semi-conductrice - Google Patents
Boîtier pouvant être monté en surface pour puce semi-conductrice Download PDFInfo
- Publication number
- WO2008031391A1 WO2008031391A1 PCT/DE2007/001531 DE2007001531W WO2008031391A1 WO 2008031391 A1 WO2008031391 A1 WO 2008031391A1 DE 2007001531 W DE2007001531 W DE 2007001531W WO 2008031391 A1 WO2008031391 A1 WO 2008031391A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing according
- lead frame
- recess
- mountable
- mountable housing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 230000005693 optoelectronics Effects 0.000 claims description 18
- 238000004049 embossing Methods 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 9
- 239000012815 thermoplastic material Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000004873 anchoring Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- portions of the lead frame 2, on which the contact surfaces 7 are arranged project laterally out of the housing part 1.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Boîtier montable en surface pour au moins une puce semi-conductrice, comprenant au moins un élément boîtier (1) en matière plastique, et un cadre conducteur (2). Le cadre conducteur (2) présente une surface de montage de puce (3) pour au moins une puce semi-conductrice, le cadre conducteur (2) présentant au moins un évidement (4) et au moins un creux (5), et l'élément boîtier (1) destiné à la fixation au cadre conducteur (2) entre en prise aussi bien dans l'évidement (4) que dans le creux (5).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006043404.8 | 2006-09-15 | ||
| DE200610043404 DE102006043404A1 (de) | 2006-09-15 | 2006-09-15 | Oberflächenmontierbares Gehäuse für einen Halbleiterchip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008031391A1 true WO2008031391A1 (fr) | 2008-03-20 |
Family
ID=39047775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2007/001531 WO2008031391A1 (fr) | 2006-09-15 | 2007-08-27 | Boîtier pouvant être monté en surface pour puce semi-conductrice |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102006043404A1 (fr) |
| TW (1) | TW200830482A (fr) |
| WO (1) | WO2008031391A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008083672A2 (fr) * | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans un boîtier |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040159850A1 (en) * | 2003-02-18 | 2004-08-19 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
| DE102004003928A1 (de) * | 2004-01-26 | 2005-08-25 | Tay Kheng Chiong | Ein miniaturisiertes mit SM-Technologie bestückbares optoelektronisches Bauelement |
| WO2006071098A1 (fr) * | 2004-12-30 | 2006-07-06 | Luxpia Co., Ltd. | Grille de connexion, boitier a semiconduteur l’utilisant et procede de fabrication du boitier a semiconducteur |
-
2006
- 2006-09-15 DE DE200610043404 patent/DE102006043404A1/de not_active Withdrawn
-
2007
- 2007-08-27 WO PCT/DE2007/001531 patent/WO2008031391A1/fr active Application Filing
- 2007-09-13 TW TW96134152A patent/TW200830482A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040159850A1 (en) * | 2003-02-18 | 2004-08-19 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
| DE102004003928A1 (de) * | 2004-01-26 | 2005-08-25 | Tay Kheng Chiong | Ein miniaturisiertes mit SM-Technologie bestückbares optoelektronisches Bauelement |
| WO2006071098A1 (fr) * | 2004-12-30 | 2006-07-06 | Luxpia Co., Ltd. | Grille de connexion, boitier a semiconduteur l’utilisant et procede de fabrication du boitier a semiconducteur |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008083672A2 (fr) * | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans un boîtier |
| WO2008083672A3 (fr) * | 2007-01-11 | 2008-12-18 | Osram Opto Semiconductors Gmbh | Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans un boîtier |
| US9054279B2 (en) | 2007-01-11 | 2015-06-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006043404A1 (de) | 2008-03-27 |
| TW200830482A (en) | 2008-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102006047989B4 (de) | Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung | |
| EP1566846B1 (fr) | Dispositif opto-électronique | |
| DE19926128B4 (de) | Leistungs-Halbleiterbauteil-Gehäuse | |
| EP2396832B1 (fr) | Dispositif semi-conducteur optoélectronique encapsulé à couche d'arrêt brasée, et procédé correspondant | |
| WO2004051757A2 (fr) | Composant optoelectronique | |
| WO2017032772A1 (fr) | Composant laser et procédé de réalisation | |
| EP1597764A1 (fr) | Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique | |
| WO2014154632A1 (fr) | Composant à semi-conducteur et procédé de fabrication d'un composant à semi-conducteur | |
| WO2004109812A2 (fr) | Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant | |
| WO2011157522A1 (fr) | Composant optoélectronique pouvant être monté en surface et procédé de fabrication d'un composant optoélectronique pouvant être monté en surface | |
| EP2415077B1 (fr) | Composant optoélectronique | |
| DE10004410A1 (de) | Halbleiterbauelement mit an der Unterseite befindlichen Kontakten und Verfahren zur Herstellung | |
| EP3360167A1 (fr) | Élément optoélectronique doté d'un châssis de connexion pourvu d'une structure de renforcement | |
| DE102020111652A1 (de) | Halbleitergehäuse mit leitfähigem clip mit mehreren ebenen zur kühlung der oberseite | |
| DE102015223300B4 (de) | Halbleitervorrichtung | |
| DE19614501C2 (de) | Verfahren zum Herstellen eines Keramik-Metall-Substrates sowie Keramik-Metall-Substrat | |
| WO2001033607A2 (fr) | Dispositif a diode laser et procede permettant de le produire | |
| WO2008031391A1 (fr) | Boîtier pouvant être monté en surface pour puce semi-conductrice | |
| DE10153615C1 (de) | Verfahren zur Herstellung von elektronischen Bauteilen | |
| DE112022003241T5 (de) | Laserkomponente und Laserbauteil | |
| DE102006059702A1 (de) | Optoelektronisches Bauelement | |
| WO2015039808A1 (fr) | Composant luminescent optoélectronique et assemblage formant châssis de conducteurs | |
| WO2021185598A1 (fr) | Boîtier pour composant semi-conducteur optoélectronique et composant semi-conducteur optoélectronique | |
| DE10321257A1 (de) | Metallträger (Leadframe) zur Aufnahme und Kontaktierung elektrischer und/oder optoelektronischer Bauelemente | |
| EP1153792A1 (fr) | Dispositif de feux à plusieurs LEDs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07801284 Country of ref document: EP Kind code of ref document: A1 |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 07801284 Country of ref document: EP Kind code of ref document: A1 |