TW200828531A - Package having shield case - Google Patents
Package having shield case Download PDFInfo
- Publication number
- TW200828531A TW200828531A TW096147389A TW96147389A TW200828531A TW 200828531 A TW200828531 A TW 200828531A TW 096147389 A TW096147389 A TW 096147389A TW 96147389 A TW96147389 A TW 96147389A TW 200828531 A TW200828531 A TW 200828531A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- package
- shield case
- sealing resin
- sealing
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B1/00—Details
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- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/45144—Gold (Au) as principal constituent
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
200828531 九、發明說明: 本申請案根據及主張2006年12月13日所提出之日本 專利申請案第2006-335958號之優先權,藉此以提及方式 併入该日本專利申請案之整個内容。 【發明所屬之技術領域】 本揭露係有關於一種具有一屏蔽殼之封裝件,以及更特 別地,是關於一種封裝件,其中以一金屬屏蔽殼覆蓋一基 板之一上面安裝有一電子零件之表面。 (【先前技術】 在一種具有一屏蔽殼之封裝件中,以一金屬屏蔽殼覆蓋 一基板之一上面安裝有一電子零件之表面,以及在例如曰 本未審查專利公告第10一284935號中提出圖4所示之封裝 件。 在圖4所示之封裝件中,每一爪部ι〇4、ι〇4、…係形 成於一用以覆蓋一基板1〇〇之一表面的金屬屏蔽殼1〇2之 c下端側上且被裝入在該基板100之側表面中所形成之凹 部106、106、…的一對應凹部106。 在圖4所示之封裝件中,用以覆蓋在該基板1〇〇之表面 上所安裝之電子零件108、1〇8、…(例如:半導體元件) 的屏蔽殼102之爪部104被裝入在該基板1〇〇之侧表面中 所形成之凹部1 〇 6且如圖5之剖面圖所示亦以焊料】丨2被 焊接於該凹部106之一壁面上所形成之一電鍍層11〇上。 此外,在該基板1〇〇之另一表面上形成做為複數個外部 連接端之焊球114、114、…。 312ΧΡ/發明說明書(補件)/97-01/96147389 6 200828531 —圖4及5所示之封裝件最好使用於在—基板之一表面上 女裝一做為一電子零件之高頻零件的封裝中。 ΛΛ:而在具有5亥屏蔽殼之傳統封裝件中,如圖6所示, 必需使用該基板100,其中在該等側表面中形成該等凹部 106 1〇6、…。因此,很難使用一樹脂來密封在該基板 100之表面上所安裝之電子零件1〇8、1〇8、…。 亦即’在產業製造圖6所示之基板1GG的情況中,如圖 7所不,在形成—具有複數個基板100、1〇〇、…之大尺寸 f始基板2GG後,在大尺寸原始基板200之要形成該等凹 106 106、...之部分中形成橢圓通孔202、202、…, 以及然後’使用無電鑛等在該等橢圓通孔挪、聊、··. 之内壁表面上形成該電鍍層110。 接下,在一由該等橢圓通孔202、202、…所包圍之 區域上安震各種電子零件,依據通過該等橢圓通孔挪、 之中。的線204、204、…來切割該原始基板2〇〇, 以及然後,謂得圖6所示之基板1〇〇。 後使°亥屏蔽喊102附著至該基板100及將在該屏蔽 殼102之下端側中所形成之對應爪冑104裝入在該基板 ⑽之側表面中所形成之每一凹部1〇6、1〇6、…及 接該等爪部104。 在此丨月况中,§在形成有該等橢圓通孔202、202、··· 之基板10二的表面上安襄該等電子零件1〇8、⑽…後, !=月“封„亥等電子零件i08、⑽、…時’有該密封 ㈣冬入該等橢圓則L 2G2之可能性及因而無法安裝該 312XP/發明說明書(補件)/97·〇丨觸丨47389 7 200828531 屏蔽殼102之爪部l〇4。 因此,在該基板100之表面上所安裝之電子零件108 108、…沒有被該樹脂所密封。在此情況中, 金屬屏蔽殼102與該等電子零件1〇8、1〇8、...間之 必需經常確保在該屏1〇2與該等電子裳件⑽’ :制:。之空間及因而對該封裝件之尺她 再者’在該等電子零件⑽與該基板刚間之電性 中無法使用-會造成與該屏蔽殼1〇2接觸之接合線, 只能使用一覆晶接合。因而,要求甚 = 封裝件使用一接人綍於兮贫+ 甚至對,、有该屏蔽殼之 之電=二 4電子零件⑽與該基板 【發明内容】 本發明解決在該傳統封裝件中I ^ ^ ^ 以一樹脂密封在一 二反之-表面上所安裝之―電子零件㈣題,以 之一目的係要提供一種具有一屏蔽殼 么月 使用-接合線以電性連接一電子零件之與封―衣:板== 樹脂密封在該基板之表面上 = 成尺寸縮小。 心包于令件來達 依據本發明之—個或多個觀點,—種 一封裝體,包括: ^* 一基板; ::子零件,安裝於該基板之1 —表面上; 松封樹脂層,用以密封該電子零件;以及 312XP/^__ (補件)/97-01/96147389 200828531 屏i文殼,用以霜罢姑$ 所製成且在剖_ + — *封樹脂層,該屏蔽殼係、由金屬 ^ , σ圖中具有一倒u型形狀, 具中以下歹I]方4 Ρ > 相對於第1成該遮蔽殼之—f曲部:朝該基板之 一部分以^$二表面f曲該屏蔽殼之—端的至少 该幫曲部鄰接該第一 板。 弟—表面,以便使該屏蔽殼附著至該基 依據本發明 > 楚_ 時,該彎曲邻飞 點’當該彎曲部鄰接肖第二表面 = 具有—朝該第二表面之彈力。 依據本發明之第r顴 形成於由金屬所製成之連接墊可以 嫩〜曲部所鄰接之第二表面的一部分上。 據本毛明之第四觀點,該封裝體可以 由一接合線電性义拿技石吟 返乂匕栝猎 可以由节灾44社 该電子零件之接合墊及該接合線 由"亥⑴封树脂層來密封。 件㈣本^明之弟五觀點’該電子零件可以是—半導體元 板依1觀點’可以使該屏蔽殼附著至該基 密接觸。…设之一内表面與該密封樹脂層之-表面緊 板依據本發明之第:觀點,可確實使該屏蔽殼附著至該基 = 本發明之第三觀點,可藉由焊接該屏蔽殼之彎曲部 亥基板之連接墊使該屏蔽殼牢固地附著至該基板。 依據本發明之第四觀點,可確實防止該接合線與該屏蔽 312ΧΡ/發明說明書(補件)/97-〇ι/96147389 9 200828531 殼間之接觸。 依據本發明之第六觀點,可小型化該封裝件。 著不需要提供一用以使該屏蔽殼附 基板之一侧表面的附著部,以便可形成用以密封為
该基板之一表面(哮笛一 ^ — X 封樹脂層。 表面)上所女…子零件的密 並且’可確實防止該屏蔽殼與該電子零件間之接觸及 「需要在該電子零件與該屏蔽殼間提供m因而 型化該封震件。 .此外’甚至當在該基板之-表面(第-表面)上所安裝之 電t零件藉由一接合線電性連接至該基板時,可形成:用 以您封該電子零件及該接合線之密封樹脂層及可確實 止該接合線與該屏蔽殼間之接觸。 、 【實施方式】 从圖1顯线#本發明之—具有_屏蔽殼之封 乾例。在圖1卢斤+ + θ + 的 -.. α所不之一具有一屏蔽殼的封裝件10中,附 者一金屬屏蔽殼14,以便 從後盍封衣體12。该屏蔽殼14 、、,5、,桌及辞之合金(諸如鎳銀合金)所製 為約50μιη。 久序度 _ = 2顯示該封裝件10之剖面圖。在該封裝體12中,在 杜^板16之一表面(以下稱為"第―表面")上安裝電子突 件(諸如一半導^ 16之笛I 或—電容器_及-在該基板 人缘^: 所形成之接合塾部(未顯示)藉由金之接 。線2〇、20電性連接至該半導體元件…之—電極(未顯 12XP/發明說明書(補件)/97-01/96147389 10 200828531 :)。错由一用以形成一密封樹脂層22之密封樹脂來密封 遠專電子零件及接合線20、20。 士:,亥,封樹脂層22之屏蔽殼14中,剖面形狀係 2 ' !形狀以及使下端之部分彎曲至該基板16之另 "表面(以下稱為"第二表面")及因而形成彎曲部。哕 ^部14a鄰接在該基板16之第二表面上所形成之連= 塾24、24及附著至該基板16。 將圖2所不之屏蔽殼14的彎曲部14a彎曲成一"v" t及f該!,彎曲部—鄰接該基板16之連接墊24、:4 牯該等育曲部14a具有一朝該等連接墊Μ、Μ之彈性 力及因而該屏蔽殼14可確實附著至該基板16。 藉由焊接該等彎曲部14a在該等連接塾24、24上所鄰 位置,可更牢固地使該屏蔽殼14附著至該基板16。 ==咖封裝件1〇之外部連接端的焊球Μ 附者至該基板16之第二表面。 和ΓΛ1/2/斤示之封裝件10中’以下列方式使該屏蔽 ^ (者至该基板16 ••該屏蔽殼14之―内表面與該密 子::層22緊密接觸。藉由該密封樹脂層22密封該等; 子諸如該半導體元件18a)及用以電性連接 5之Λ該基板16之接合線2〇,以及甚至當以該屏蔽 =4之内表面與該密封樹脂層㈡之表面緊密接觸之方式 3 =殼U附著至該基板16時,該屏蔽殼η不可能 電該等接合線接觸。因此,不需要在該等 屏Μ 14間提供-空間’以及可縮小該封 312ΧΡ/發明說明書(補件)/97·01/96147389 π 200828531 裝件之尺寸。 在製造圖1及2所示之封裝件1G中,絲成該封裝體 12° 在該封裝體12中,形成一能形成複數個基板16之大尺 •寸原始基板。在此原始基板中不形成一通孔(例如··圖7 所示之橢圓通孔202、202、…)。 在垓原始基板之第一表面上對應於每一基板16之部分 【的第一表面之預定位置上安裝像該半導體元件18&或該 i電容器18b之電子零件後,該安裝半導體元件…藉由該 等接合線20電性連接至對應於該基板16之部分。 然後,藉由樹脂塑造對應於每一基板16之部分及提供 用以密封該等接合線20及在對應於每一基板16之部分上 所女衣之迅子令件的密封樹脂層22。之後,藉由切割該 原始基板’可形成具有一預定形狀之封裝體12。 再者,當在該基板16之背面側上形成用以附著做為外 I部連接端之焊球的端子連接墊(未顯示)時,最好在該基板 16之背面側上同時形成該等連接墊24、24。 使該所獲得封裝體12***藉由沖壓加工(press working)所事先形成之屏蔽殼ι4及然後附著,以及使該 封裝體12之每一彎曲部14a與該基板16之每一連接墊 24相配。 再者’當使該封裝體12更牢固地固定至該基板16時, 最好焊接該封裝體12之每一彎曲部14a在該基板16之每 一連接墊24上的鄰接部。 312XP/發明說明書(補件)/97-01/96147389 12 200828531 在圖1及2所示之屏蔽殼14中,在該屏蔽殼14之下端 的一侧上形成一彎曲部14a ’然而可以形成複數個彎曲= 14a。在該下端之一側上形成有該複數個彎曲部14&的屏 蔽殼14中,可使該屏蔽殼14確實地附著至該基板丨6 再者,像圖3所示之屏蔽殼14,可以沿著該屏蔽殼η 之下端的一側之邊緣形成該等彎曲部14a。在此情況中, 取好在該屏蔽殼14之另外一侧中形成一制止部i4b,以 便在使該封裝體12從該屏蔽殼14之一侧***及附著時可 防止該封裝體12之過度***。 在圖1至3之描述中,雖然該安裝半導體元件i8a藉由 該等接合線20電性連接至該基板16,但是將明顯易^該 半導體元件18a可以藉由一覆晶接合電性連接至該基板 16° 雖然已描述有關於本發明之示範性具體例,但是熟習該 項技藝者將明顯易知在不脫離本發明之情況下可以實施 (各種變更及修改。因此,意欲在所附請求項中涵蓋落二本 發明之精神及範圍内的所有此等變更及修改。 【圖式簡單說明】 圖1係顯示依據本發明之一具有一屏蔽殼之封裝件的 一範例之立體圖; 圖2係圖1所示之封裝件的剖面圖; 圖3係顯示一能使用於本發明中之屏蔽殼的另一範例 之立體圖; 圖4係顯示-具有-屏蔽殼之傳統封裝件的立體圖; 312XP/發明說明書(補件)/97-01/96147389 13 200828531 圖 6係一在圖5 圖, 以及 圖 7係一要形成圖 【主要元件符號說明 10 封裝件 12 封裝體 14 金屬屏蔽殼 14a 彎曲部 14b 制止部 16 基板 18a 半導體元件 18b 電容器 20 接合線 22 密封樹脂層 24 連接墊 26 焊球 100 基板 102 金屬屏蔽殼 104 爪部 106 凹部 108 電子零件 110 電鍍層 112 焊料 圖 所示之基板的原始基板之立體圖 312XP/發明說明書(補件州挪附仍的 14 200828531 114 焊球 200 原始基板 202 橢圓通孔 204 線 312XP/發明說明書(補件)/97-01/96147389 15
Claims (1)
- 200828531 十、申請專利範圍: i. 一種封裝件,包括: 一封衷體,包括: 一基板; 一,子零件,安裝於該基板之—第 -岔封樹脂層’用以密封該 ·' , -屏蔽殼,用以覆蓋該密封樹脂芦,;:二及 所製成且在剖面圖中且 θ该屏敝忒係由金屬 口甲具有一倒ϋ型形狀, ^ ,该遮蔽殼之一彎曲部的形成方々么, 相對於第-表面的第二表面-曲該尸'式為,朝該基板之 一部分,以及 Λ开敝Λ又之一端的至少 板料曲部鄰接該第二表面,以便使該屏蔽殼附著至該基 接第1項之封裝件,其中當該f曲部鄰 t. 曲部具有-朝該第二表面之彈: 3. 如申凊專利範圍第u 泮力 成之連接墊係形成於”曲部所鄰妾之、所製 分上。 β伐<弟一表面的一部 4. 如申請專利範圍第丨項 步包括-藉由-接合線電性二其:二封裝體進- 塾5’::該接合線係以該密封樹腊層件之接合 ;·如申請專利·第4項之封裳件,其中 4電子零件係一半導體元件。 6·如申請專利範圍第1項之 才衣件,其中使該屏蔽殼附 312XP_^ 明書(補件)/97-01/96147389 1/C 16 200828531 著至該基板,以便使該屏蔽殼之一内表面與該密封樹脂層 之一表面緊密接觸。312XP/發明說明書(補件)/97-01/96147389 17
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CN107864551B (zh) * | 2017-10-31 | 2019-11-12 | 中国电子科技集团公司第二十九研究所 | 一种点预固定薄膜电路电磁屏蔽封装方法 |
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JP3085865B2 (ja) * | 1994-11-08 | 2000-09-11 | 松下電器産業株式会社 | 回路ユニットのシールド装置 |
JPH10284935A (ja) | 1997-04-09 | 1998-10-23 | Murata Mfg Co Ltd | 電圧制御発振器およびその製造方法 |
JPH10294585A (ja) * | 1997-04-22 | 1998-11-04 | Kokusai Electric Co Ltd | プリント基板用シールドケース |
JP2002534933A (ja) * | 1999-01-07 | 2002-10-15 | サーノフ コーポレイション | プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器 |
JP2001148594A (ja) * | 1999-11-19 | 2001-05-29 | Murata Mfg Co Ltd | シールドケース付き電子部品 |
JP3793421B2 (ja) * | 2001-04-10 | 2006-07-05 | アルプス電気株式会社 | 面実装型電子回路ユニット及び面実装型電子回路ユニットの製造方法 |
JP2004128334A (ja) * | 2002-10-04 | 2004-04-22 | Hitachi Metals Ltd | 高周波電子部品 |
JP4020795B2 (ja) * | 2003-02-14 | 2007-12-12 | 三菱電機株式会社 | 半導体装置 |
JP2005101365A (ja) * | 2003-09-25 | 2005-04-14 | Kyocera Corp | 電子装置 |
JP2006252390A (ja) * | 2005-03-14 | 2006-09-21 | Renesas Technology Corp | Icカードの製造方法およびicカード |
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- 2007-12-12 TW TW096147389A patent/TW200828531A/zh unknown
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Cited By (3)
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US9520387B2 (en) | 2010-12-02 | 2016-12-13 | Samsung Electronics Co., Ltd. | Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer |
TWI578485B (zh) * | 2010-12-02 | 2017-04-11 | 三星電子股份有限公司 | 堆疊的封裝結構、封裝層疊裝置及其製造方法 |
TWI786082B (zh) * | 2017-03-13 | 2022-12-11 | 新加坡商星科金朋私人有限公司 | 半導體裝置及藉由鐵磁性材料形成磁場屏蔽的方法 |
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JP2008147572A (ja) | 2008-06-26 |
CN101202275A (zh) | 2008-06-18 |
KR20080055670A (ko) | 2008-06-19 |
JP4972391B2 (ja) | 2012-07-11 |
US20080157296A1 (en) | 2008-07-03 |
US7911042B2 (en) | 2011-03-22 |
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