200816354 九、發明說明： 【發明所屬之技術領域3 發明領域 本發明係有關於一種在使基板以預定之角度傾斜之起 5 立狀態下進行搬運並使用處理液或氣體等之流體進行處理 之基板處理裝置。 L· Jt 發明背景 使用於液晶顯示裝置之玻璃製基板形成有電路圖案。 10要於基板形成電路圖案係採用蝕刻製程。蝕刻製程係如周 知者般，於前述基板塗布光阻劑，並隔著形成有電路圖案 之光罩照射光於該光阻劑。 接著，除去光阻劑未照射到光之部分或已照射到光之 部分，對除去了基板之光阻劑之部分進行蝕刻。然後，藉 15著重複在蝕刻後進行除去光阻劑之一連串的步驟複數次 後’於前述基板形成電路圖案。 此種姓刻製程中，需要於前述基板藉由顯像液、蝕刻 液或蝕刻後除去光阻之剝離液等處理基板之步驟、進一步 藉由α洗液進行洗淨之步驟、洗淨後使用氣體將附著殘留 2〇於基板之清洗液除去之乾燥步驟。 以往，對基板進行上述之一連串的處理時，前述基板 係稭由軸線呈水平配置之搬運輥子而在大略成水平狀態下 又序搬運到用以進行各種處理之處理室，在各處理室藉由 處理液處理基板，並且在處理後噴射壓縮氣體進行乾燥處 5 200816354 理。 然而，最近使用於液晶顯示裝置之玻璃製基板有大型 化及薄型化之傾向。因此，當水平搬運基板時，由於搬運 輥子間之基板的屈曲變大，因此會產生在各處理室之處理 5 無法均一地遍及基板之板面全體來進行之問題。 又，當基板大型化時，用以搬運該基板之搬運輥子所 設置之搬運軸會長型化。而且，因為基板大型化，供給到 基板上之處理液增多，施加於前述搬運軸之荷重隨基板上 之處理液的量而變大，因此搬運軸會屈曲。因此，基板也 10 會因為搬運軸屈曲而產生屈曲，無法進行均一的處理。 因此，使用處理液處理基板時，為了防止前述基板因 為處理液的重量而屈曲，因此以預定之傾斜角度，例如由 垂直狀悲傾斜15度之75度的角度搬運基板，朝處於傾斜方 向上側之前面喷射處理液，藉此進行其基板之前面的處理。 15 若使基板傾斜來搬運，且於其基板之前面噴射供給處 理液，處理液不會滯留於基板板面，而由上方往下方順利 地流過板面，因此可防止基板因處理液的重量而屈曲。 使基板傾斜預定角度來搬運並進行處理之處理I i 中，如專利文獻1所示，於室内設有支持基板之傾斜方向下 20側之背面之支持輥子、及支持下端之驅動輥子。，驅動^子 安裝於驅動軸，且其驅動軸藉由驅動源來驅動旋轉。 前述處理裝置中，複數之前述支持輥子與前述驅動_ 子係對前述基板之搬運方向以預定間隔配置於室内。# 此，前述基板可藉由前述支持報子而支持背面，且下 6 200816354 前述驅動輥子驅動，搬運到預定方向。 【專利文獻1】日本專利公開公報特開第2004-210511 號 H 明内 5 發明概要 【發明欲解決之課題]】 然而，為了依處理液的種類提高其效果，係由噴嘴體 以如0 · 7MPa左右之高壓將處理液噴射到搬運之基板前面。 另一方面，複數之基板在前後方向上隔著預定之間隔 10依序搬運到室内。也就是說，位於在室内搬運之之搬運方 向下游測之基板後端與位於上游側之基板前端之間有間 隙，在此種搬運狀態下，前述處理液由前述噴嘴體連續地 喷射。 因此，由前述喷嘴體喷射之處理液不僅喷射到基板前 15面，且會通過前後方向之一對基板之前端與後端之間的間 隙而碰擊室之後壁内面。 碰擊室之後壁内面之處理液會在其内面反射而噴濺到 搬運之基板的背面。因此，背面由支持輥子所支持且搬運 之基板會因為喷濺到其背面之處理液的作用而由支持親子 20 浮起。 若基板由支持輥子浮起，則基板的搬運狀態會變得不 安定，當浮起過大時，會與形成於室之端部壁且用以供基 板通過之縫隙相撞，使基板損傷，而不能搬運。 使用處理液進行處理之基板係由清洗液洗淨，接著由 7 200816354 液切刀噴射氣體除去附著於基板板面之處理液。在進行液 切處理¥，由液切刀噴出之氣體也會與室之後壁内面碰 擊’在其内面反射而噴機到搬運之基板背面。因此，由支 持輥子支持背面且搬運之基板也會因液切用之氣體的作用 5 而由支持輥子浮起。 本發明係提供-種即使朝基板噴射之處理液或氣體等 μ體與至之後壁内面碰擊而反射，其流體也難以喷錢到搬 運之基板背面之基板處理裝置。 【解決課題之方法】 本毛明之基板處理裝置，係使基板以預定之角度傾斜 進行搬運，並使用流體進行處理者，包含有··室；支持輥 子係叹置於δ亥至内，並用以支持前述基板之傾斜方向下 側之月面者；驅動輥子，係藉由外周面支持背面由前述支 持親子所支持之前述基板下端並被驅動旋轉而將前述基板 15朝預定方向搬運者；流體供給機構，係朝前述基板之傾斜 方向上側之前面噴射前述流體者；及流體返回防止構件， 係没置於與所搬運之前述基板之背面對向之前述室之後壁 内面，用以防止由前述流體供給機構喷射且與前述室之前 述後壁内面碰撞反射之流體喷濺到前述基板背面者。 20 【發明之效果】 根據本發明，由於可藉由流體返回防止構件阻止由喷 嘴體喷射而與室之後壁内面碰擊之流體 ，因此可防止在室 内搬運之基板由支持輥子浮起。 【實;方式3 8 200816354 較佳實施例之詳細說明 以下’參照圖式說明本發明之實施形態。 第1圖至第4圖係顯示本發明之第1實施形態。第1圖係 顯示本發明之處理裝置之概略構成之透視圖，且該處理裝 5置具有裝置本體1。該裝置本體1係由分割之複數處理單 元、在本實施型態中為第1至第5處理單元1A〜1E可分解地連 結成一列。 各處理單元1A〜1E具有架台2。箱型狀之室3以預定角度 傾斜且保持於該架台2前面。前述架台2與室3的上面設有上 10部搬運部4。前述架台2之下端的寬度方向兩端設有可分解 且成板狀之一對腳體5(僅圖示其中一者）。藉由該腳體5於前 述架台2之下面側形成空間部6。 前述空間部6收納有機器部9，前述機器部9係將控制裝 置等機器7載置於框架8，且該控制裝置等之機器7係用以控 15制供給在前述室3進行如後所述之基板W之處理所使用之 藥液或清洗液專處理液之箱或泵或者處理液之供給。也就 是說，各處理單元1A〜1E係藉以腳體5支持架台2而於室3的 下方形成空間部6 ’分割成位於上下方向之室3、上部搬運 部4及機器部9之3個部分。 20 前述室3係以預定角度、如由垂直狀態傾斜15度之對水 平面為75度的角度傾斜保持於前述架台2，且於寬度方向之 兩側面形成供以75度的角度傾斜搬運之基板w通過之縫降 13(第1圖中僅圖示一處）。 前述室3之内部係如第2圖與第3圖所示，構成傾斜搬運 9 200816354 機構之複數搬運軸15係以預定間隔設置於室3之寬度方向 上。於該搬運軸15，係以預定間隔在軸方向上設置複數< 旋轉之支持輥子14。前述搬運軸15之上端及下端分别由托 架15a支持，且其軸線係傾斜與前述縫隙π相同之角度。 5 基板W係藉由第1圖之虛線所示之第1姿勢變換部I6由 水平狀態變換成75度之角度由前述縫隙13搬入前述室3 内。即，未處理之基板W係藉由前述上部搬運部4而由第5 處理單元1E側搬運到第1處理單元1A側，且在前述第1姿勢 變換部16由水平狀態傾斜成75度之角度搬入到前述第1處 10 理單元1A。 搬入到第1處理單元1A之室3内之基板w係由設置於前 述搬運軸15之支持輥子14支持非裝置面之背面。該基板〜 之下端係由驅動輥子17(如第2圖所示）之外周面所支持。 前述驅動輥子17係設置於驅動單元18之旋轉軸19。而 且’猎驅動该旋轉轴1旋轉，下端由驅動輕子17所支持且为 面由前述支持輥子14支持之前述基板W搬運到前述驅動輥 子17之旋轉方向。 基板W在搬運方向上游側之第1至第3處理單元1A〜1C 使用作為處理液之剝離液除去光阻劑後，在第4處理單元1〇 使用作為處理液之洗淨液進行洗淨處理。然後，在第5處理 單元1E以熱風等流體進行乾燥處理。 依序通過各處理單元1A〜1E而經處理之基板W在以75 度之角度傾斜之狀態下由前述第5處理單元圯搬出。由第5 處理單元1E搬出之基板w在第1圖中以虛線所示之第2姿勢 200816354 變換部23，由傾斜狀態變換成水平狀態之姿勢後朝下一步 驟傳送。 如第2圖所示，前述驅動單元18沿著室3之寬度方向（基 板W之搬運方向）具有長板狀之下部基底構件24。與下部基 5底構件24為相同長度之通道狀上部基底構件25之兩側下端 係固著設置於該下部基底構件24之上面。 與前述下部基底構件24大略相同大小之平板狀安裝構 件26之寬度之一端部與他端部係可對上部基底構件25調整 傾斜度地連結設置於前述上部基底構件25。也就是說，前 10述安裝構件26可調整往室3之前後方向傾斜之角度。 前述安裝構件26之寬度方向之一端與他端分別有複數 之托架31在前述安裝構件26之長向上以預定間隔設置在對 應於寬度方向之位置。可旋轉之前述旋轉軸19之軸方向之 中途部介由未圖示之轴承而受支持於寬度方向上對應之一 15 對托架31。該旋轉軸19之前端安裝有前述驅動輥子17，後 端嵌著第10齒輪33。 接著，若於前述架台2設置室3，則棒狀之4支基準構件 35之下端面可藉由螺絲42而安裝固定於設置於該架台2之 支持部41的上面。前述驅動單元18係下部基底構件24之四 20 隅部下面藉由螺絲而安裝固定於前述基準構件35之上端 面。4支基準構件35之上端面係位於同一平面上。因此，驅 動單元18可安裝固定在其下部基底構件24之寬度方向及長 向而不會產生歪斜。 以基準構件35之上端面為基準而將前述驅動單元18組 11 200816354 裝於室3内時，支持於驅動單元18之複數旋轉軸19的後端部 由朝室3之前壁12b開口之導出孔44突出於驅動室45。而 且，將驅動單元18組裝於室3内後，前述第1齒輪33會嵌著 於前述旋轉軸19之後端。 5 前述驅動室45設有驅動源51。該驅動源51之輸出軸嵌 著有驅動滑車53。該驅動滑車53與被動滑車54張設有帶55。 前述被動滑車54係與未圖示之第2齒輪設置於同轴上。該第 2歯輪與前述第1齒輪33咬合。藉此，若驅動源51作動，由 於前述旋轉軸19會被驅動旋轉，因此設置於該旋轉軸19前 10 端之前述驅動輥子17也會被驅動旋轉。 若驅動親子17被驅動旋轉，由該等驅動輕子17支持下 端之基板W會搬運到前述驅動輥子π之旋轉方向。 與傾斜搬運之基板W之傾斜方向之上側之面、也就是 形成有電路圖案之前面平行且分隔對向之供給管之複數供 15 液管61，係對基板W之搬運方向以預定間隔配置於在將剝 離液喷射到前述基板W前面以除去光阻劑之第丨至第3處理 單元1A〜1C。 於各供液管61，在相對與基板W之搬運方向交錯之轴 線方向以預定間隔設置複數之喷嘴體62。前述供液管管61 20與喷嘴體62形成該發明之處理液供給機構。 剝離液係以〇.7MPa左右之高壓供給到前述供液管61。 藉此，前述處理可以高壓由設置於供液管61之噴嘴體62喷 射到前述基板W之前面。 基板W係以預定間隔在前述各處理單元lA〜ic之室3内 12 200816354 搬運。也就是說，位於搬運方向下游側之基板w之後端與 位於上游側之基板W之前端之間有第3圖所示之間隙G。因 此，由前述噴嘴體62朝基板W前面喷射之處理液的一部分 會通過前述間隙G而與室3之後壁12c的内面碰擊且反射。 5 在室3之後壁12c的内面反射之處理液可藉由液返回防 止構件65而防止噴濺到在室3内搬運之基板w的背面。前述 液返回防止構件65係在前述室3之後壁12c内面之與位於前 述基板W之搬運方向之上游測與下游側之端部之各個供液 管61相對向之位置，也就是其中一液返回防止構件65係位 10 於敢上游側之供液管61之更上游側，而另一液返回防止構 件65係設置於位於最下游側之供液管61之更下游側之位 置。 前述液返回防止構件65係如第2圖所示，具有與基板w 之南度尺寸大約相同之長度尺寸，截面形狀係如第3圖所 15不’由基端固著於前述後壁12c且設置成大略垂直之垂直壁 部65a、以預定之傾斜角度、如45度之角度傾斜設置於該垂 直壁部65a前端之傾斜壁部65t)、及朝向前述後壁12c之内面 且與前述垂直壁部65a平行設置於該傾斜壁部65b前端之返 回防止壁部65c而形成鉤狀。 2〇 接著’ 一對液返回防止構件65係使彼此之返回防止壁 W65C相對向且配置於沿著前述室3内之前述基板界之搬運 方向之兩端部’也就是如第3圖所示，配置於室3之寬度方 向兩蠕之端壁12a附近。 在相較於設有前述室3之上部與下部之支持輥子14之 13 200816354 搬運轴15後面之後壁1側之上下端部設有未圖示之配管 或驅動系統之零件等。因此，為了防止前述液返回防止構 件65與配管或驅動系統之零件等干擾，係如第2圖所示，長 度尺寸設定比室3之咼度尺寸短。 5 藉此，在液返回防止構件65之上端與室3之天井壁内面 之間、以及下端與底壁内面之間分別形成有上部空間部66 與下部空間部67。 位於前述室3之寬度方向兩端部之前述液返回防止構 件65之上端部與下端部分別設有通過阻止構件68。第2圖係 1〇 顯示設置於液返回防止構件65之下端側的下部空間部67之 通過阻止構件68,該通過阻止構件68之截面形狀係大略為l 狀，且其基端68a固著於前述室3之端壁12a之内面，中途部 681)與别述室3之後壁12c成平行，且與前述液返回防止構件 65之下端面卡合。進而，前端部68c係朝前述液返回防止構 15 件65之返回防止壁部65c側突出，並且朝前述後壁12〇側彎 曲成大略直角。 前述液返回防止構件65之上端側的上部空間部66也與 下部空間部67同樣設有通過阻止構件68。 設置於液返回防止構件65之上端侧之通過阻止構件 20 68、設置於下端側之通過阻止構件68係分別達前述上部空 間部66與前述下部空間部67之高度方向全長。也就是說， 於各空間部66,67之高度方向無設置間隙。 藉此’即使通過以預定間隔搬運之基板W之前後端間 之前述間隙G之處理液之一部份與室3之後壁丨2(:的内面碰 14 200816354 擊且反射後，通過形成於前述液返回防止構件65之上下端 之上部空間部66與下部空間部67，由於通過各空間部66， 67之處理液與上下一對之通過阻止構件68之内面碰擊，因 此可阻止朝基板W之背面飛散。 在如此構成之處理裝置中，複數之基板W以預定之間 隔依序搬入到第1至第3處理單元1A〜1C之室3内。由設置於 設置於供液管61之喷嘴體62喷射處理液到搬入於室3内之 基板W的前面。藉此，基板W之前面可藉由處理液進行處 理。 10 由前述噴嘴體62喷射之處理液的一部分可能會有通過 以預定間隔搬運之基板W之前端與後端之間隙G(如第3圖 所示）而與室3之後壁12c的内面碰擊，並在其内面反射而喷 濺到在室3内搬運之基板W的背面之虞。此種情況下，基板 W之背面會由支持輥子14浮起，搬運狀態變得不安定，而 15 會無法通過形成於室3之寬度方向之兩側壁之縫隙13。 然而，室3之後壁12c的内面設有液返回防止構件65。 液返回防止構件65係由垂直壁部65a、傾斜壁部65b及返回 防止壁部65c而形成鉤狀。 因此，由於由喷嘴體62噴射且與室3之後壁12c内面碰 20 擊，並在該内面反射之處理液的一部份係如第3圖之箭頭A 或箭頭B所示般，會沿著前述垂直壁部65a、傾斜壁部65b 及返回防止壁部65c形成之鉤型部分的内面捲入般而流 動，不會與在室3内搬運之基板W的背面碰擊，因此基板w 之搬運狀態不會不安定。 15 200816354 藉由一對液返回防止構件65捕捉而阻止返回到基板W 背面之處理液為在室3之後壁12c的内面反射之處理液的一 部分’且剩餘之處理液可能會與基板W之背面碰擊。 然而’即使由一對之液返回防止構件65所捕捉到的處 5理液為一部份，但由於在室3之後壁12c内面反射且作用於 基板W之處理液的力量變弱，藉此可防止損害基板w之順 利的搬運狀態。 前述液返回防止構件65係具有以預定角度傾斜之傾斜 壁部65b之鉤狀。因此，由噴嘴體62喷射且通過搬運之基板 10 W之前後端間之間隙G之處理液即使碰擊到前述傾斜壁部 65b之外面也可如第3圖之箭頭C所示般，朝因應於其傾斜角 度之方向反射。因此，由於在前述傾斜壁部65b之外面反射 之處理液幾乎不會回到基板W之内面，故即使因為上述因 素也難以損害基板W之搬運狀態。 15 前述液返回防止構件65之上下端與室3之天井壁内面 及底壁内面之間分別形成有上部空間部66與下部空間部 67。因此，通過以預定間隔搬運之基板w之前後端間之隙 間G且在室3之後壁12c之内面反射之處理液的一部分會有 通過前述上部空間部66與下部空間部67且在室3之端壁12a 20 的内面反射而碰擊到基板W之背面之虞。 然而，在前述液返回防止構件65之上下端設有通過阻 止構件68，該通過阻止構件68係用以阻止在室3之後壁12c 反射之處理液通過上部空間部66與下部空間部67。 因此，如第3圖之箭頭F所示，即使通過前述間隙g而 200816354 在室3之後壁12c反射之處理液通過形成於前述液返回防止 構件65之上下端之上部空間部66與下部空間部67，也會與 設置於各空間部66、67之通過阻止構件68之中間部68b的内 面衝突，朝室3之後壁12c側反射。 5 朝室3之後壁12c側反射之處理液在室3之端壁12a之内 面朝後壁12c側反射後，碰擊到後壁12c而減弱。 藉此，即使處理液通過形成於液返回防止構件65之上 下端之上部空間部66與下部空間部6也可藉由通過阻止構 件68而阻止朝基板W之背面反射，因此可確實防止通過各 10空間部66、67之處理液碰擊到基板w之背面。 第4圖係顯示本發明之第2實施形態。該實施形態係將2 個液返回防止構件65對1個供液管61，配置於對應前述供液 管61之兩側之位置，也就是配置於較供液管61更上游側與 下游側之位置。 15 若如此配置液返回防止構件65，由1個供液管61之噴嘴 體62喷射且在室3後壁12c之内面反射之處理液的大部分係 如箭頭D所示般，被一對液返回防止構件65捕捉，阻止其在 室3之後壁12c内面反射而返回基板w之背面，因此可使基 板W之搬運狀態更安定化。 20 又，雖未圖示，但亦可於第4圖所示之液返回防止構件 65之上下端设置第1實施形態所示之通過防止構件68。 本發明不僅適用於使用剝離液處理基板之情況，也可 適用於使用純水等其他處理液來處理之情況，又也可適用 於由喷嘴體喷射有氣體與液體混合之混合流體之情況。 17 200816354 又，即使係為了取代使用液體除去附著於基板之液體，而 使用如氣刀等喷射液切用之氣體的情況，亦可適用本發 明。總要來說只要是可以高壓朝基板喷射液體或氣體等流 體之情況即可適用。 5 可在液返回防止構件之上端與室之天井壁之内面之間 不設置配管等。此種情況下，由於可使液返回防止構件之 上端與室之天井壁之内面接觸，因此只要僅於返回防止構 件之下端側設置通過阻止構件即可。 又，雖然係於處於室之寬度方向兩端之端壁附近之液 10 返回防止構件之上下端設置通過阻止構件，但若於室之端 壁附近以外之處設置液返回防止構件的話，也可於該液返 回防止構件之上下端或至少下端設置於通過阻止構件。 t圖式簡單說明3 第1係顯示本發明之第1實施形態之處理裝置之概略構 15 成之立體圖。 第2圖係前述處理裝置之室的縱截面圖。 第3圖係顯示供液管與液返回防止構件之配置關係之1 個室之縱截面圖。 第4圖係顯示本發明之第2實施形態之供液管與液返回 20 防止構件之配置關係之室的部份省略之縱截面圖。 【主要元件符號說明】 1...裝置本體 3...室 1A〜1E. · ·第1〜第5處理單元 4. .·上部搬運部 2…架台 5...腳體 18 200816354 6.. .空間部 7.. .機器 8.. .框架 9.. .機器部 12a...端壁 12b...前壁 12c···後壁 13…縫隙 14…支持輥子 15···搬運幸由 15a，31...托架 16.. .第1姿勢變換部 17…驅動輥子 18…驅動單元 19···旋轉軸 23…第2姿勢變換部 24.. .下部基底構件 25…上部基底構件 26…安裝構件 33…第1齒輪 35…基準構件 41···支持部 42.. .螺絲 44···導出孔 45.. .驅動室 51.. .驅動源 53…驅動滑車 54…被動滑車 55···帶 61.. .供液管 62.. .喷嘴體 65…液返回防止構件 65a...垂直壁部 65b...傾斜壁部 65c...返回防止壁部 66.. .上部空間部 67.. .下部空間部 68…通過阻止構件 68a...基端 68b...中途部 68c···前端部 A，B，C，F.··箭頭 19 200816354 G…間隙 W.··絲 20[Technical Field] The present invention relates to a substrate which is transported in a state where the substrate is tilted at a predetermined angle and is treated with a fluid such as a treatment liquid or a gas. Processing device. L·Jt BACKGROUND OF THE INVENTION A glass substrate used in a liquid crystal display device is formed with a circuit pattern. 10 To form a circuit pattern on the substrate, an etching process is employed. The etching process is such that, as is well known, a photoresist is applied to the substrate, and the photoresist is irradiated through the photomask formed with the circuit pattern. Next, the portion where the photoresist is not irradiated with light or the portion where the light has been irradiated is removed, and the portion of the photoresist from which the substrate has been removed is etched. Then, a circuit pattern is formed on the foregoing substrate by repeating the steps of repeating one of the series of photoresists after etching. In the process of the surname engraving, the step of treating the substrate by the developing solution, the etching solution, or the stripping solution for removing the photoresist after etching, the step of further washing with the α washing liquid, and the gas after washing are required. A drying step of removing the cleaning liquid remaining on the substrate. Conventionally, when the substrate is subjected to one of the above-described series of processes, the substrate-based straw is transported to the processing chamber for performing various processes in a substantially horizontal state by a transport roller arranged horizontally in the horizontal direction, and is processed in each processing chamber by each of the processing chambers. The treatment liquid treats the substrate, and after the treatment, the compressed gas is sprayed to be dried at a location 5 200816354. However, recently, glass substrates used in liquid crystal display devices tend to be larger and thinner. Therefore, when the substrate is transported horizontally, the buckling of the substrate between the transport rollers becomes large, so that the process 5 in each processing chamber cannot be performed uniformly over the entire surface of the substrate. Further, when the substrate is increased in size, the transport shaft provided for the transport roller for transporting the substrate is elongated. Further, since the substrate is increased in size, the amount of the processing liquid supplied onto the substrate increases, and the load applied to the carrier shaft increases with the amount of the processing liquid on the substrate, so that the carrier shaft is bent. Therefore, the substrate 10 is also buckling due to the buckling of the conveyance shaft, and uniform processing cannot be performed. Therefore, when the substrate is treated with the treatment liquid, in order to prevent the substrate from being buckling due to the weight of the treatment liquid, the substrate is conveyed at a predetermined inclination angle, for example, at an angle of 75 degrees from the vertical inclination of 15 degrees, toward the upper side in the oblique direction. The treatment liquid is sprayed on the front side, thereby performing the treatment on the front side of the substrate. 15 When the substrate is tilted and transported, and the processing liquid is sprayed on the front surface of the substrate, the processing liquid does not stay on the substrate surface, and smoothly flows from the upper side to the lower surface, thereby preventing the weight of the substrate due to the processing liquid. And flexion. In the process of transporting and processing the substrate at a predetermined angle, as shown in Patent Document 1, a support roller that supports the back surface of the substrate 20 in the oblique direction and a drive roller that supports the lower end are provided in the chamber. The driver is mounted on the drive shaft, and its drive shaft is driven to rotate by the drive source. In the above-described processing apparatus, a plurality of the support rollers and the drive unit are disposed in the room at a predetermined interval in the conveyance direction of the substrate. # ,, the substrate can support the back surface by the aforementioned supporter, and the driving roller is driven by the aforementioned 6 200816354 to be transported to a predetermined direction. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-210511, No. WO-Min. 5 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] However, in order to improve the effect depending on the type of the treatment liquid, the nozzle body is such as 0. A high pressure of about 7 MPa sprays the treatment liquid to the front of the substrate to be transported. On the other hand, a plurality of substrates are sequentially transported into the room at predetermined intervals 10 in the front-rear direction. In other words, there is a gap between the rear end of the substrate which is measured in the downstream direction of conveyance and the front end of the substrate on the upstream side, and in the conveyed state, the processing liquid is continuously ejected by the nozzle body. Therefore, the treatment liquid sprayed by the nozzle body is not only ejected to the front surface 15 of the substrate, but also hits the inner surface of the wall after the chamber by the gap between the front end and the rear end of the substrate. The treatment liquid on the inner surface of the wall after the impact chamber is reflected on the inner surface and splashed on the back surface of the substrate to be transported. Therefore, the substrate supported by the support roller and transported on the back side is floated by the support parent 20 due to the action of the treatment liquid splashed on the back side. If the substrate is floated by the support roller, the transport state of the substrate may become unstable. When the float is too large, it may collide with the gap formed in the end wall of the chamber and pass through the substrate to damage the substrate. Can not be handled. The substrate treated with the treatment liquid was washed with a cleaning liquid, and then the treatment liquid adhering to the surface of the substrate was removed by a liquid jet of 7 200816354. When the liquid cutting treatment is performed, the gas ejected by the liquid cutting blade also collides with the inner surface of the rear wall of the chamber to reflect on the inner surface of the chamber and spray the nozzle to the back surface of the substrate. Therefore, the substrate supported by the supporting roller and supported by the roller is also lifted by the supporting roller by the action of the gas for liquid cutting. The present invention provides a substrate processing apparatus in which a fluid such as a processing liquid or a gas which is ejected toward a substrate is reflected by a collision with an inner surface of the rear wall, and the fluid is hard to be ejected onto the back surface of the substrate to be transported. [Means for Solving the Problem] The substrate processing apparatus of the present invention is that the substrate is conveyed at a predetermined angle and is processed by a fluid, and includes a chamber, and the support roller is placed within a range of δH, and is used for Supporting the lunar surface of the lower side of the substrate in the oblique direction; driving the roller by the outer peripheral surface supporting the lower end of the substrate supported by the supporting parent on the back surface and being driven to rotate to transport the substrate 15 in a predetermined direction; a mechanism for injecting the fluid toward a front surface of the upper side in the oblique direction of the substrate; and a fluid return preventing member not being placed on the inner surface of the chamber rear surface opposite to the back surface of the substrate to be transported, for preventing the fluid from being A fluid sprayed by the supply mechanism and colliding with the inner surface of the rear wall of the chamber is sprayed onto the back surface of the substrate. [Effect of the Invention] According to the present invention, since the fluid returning member can prevent the fluid that is ejected by the nozzle body from colliding with the inner surface of the chamber rear wall, it is possible to prevent the substrate conveyed in the chamber from being lifted by the supporting roller. [Embodiment 3 8 200816354 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 to Fig. 4 show a first embodiment of the present invention. Fig. 1 is a perspective view showing a schematic configuration of a processing apparatus of the present invention, and the processing apparatus 5 has a device body 1. The apparatus main body 1 is decomposed and connected in a row by the divided plurality of processing units, and in the present embodiment, the first to fifth processing units 1A to 1E. Each of the processing units 1A to 1E has a gantry 2. The box-shaped chamber 3 is inclined at a predetermined angle and held in front of the gantry 2. The upper portion of the gantry 2 and the chamber 3 is provided with upper and lower conveying portions 4. Both ends of the lower end of the gantry 2 in the width direction are provided with a pair of legs 5 which are decomposable and plate-shaped (only one of which is shown). The space portion 6 is formed on the lower surface side of the gantry 2 by the leg body 5. The space unit 6 accommodates the machine unit 9, and the machine unit 9 mounts the device 7 such as a control device on the frame 8, and the device 7 such as the control device is used to control the supply of the device 7 in the chamber 3 as follows. The supply of the chemical liquid or the cleaning liquid special treatment liquid tank or the pump or the treatment liquid used for the treatment of the substrate W is described. In other words, each of the processing units 1A to 1E supports the gantry 2 by the leg body 5, and the space portion 6' is formed below the chamber 3, and is divided into three portions of the chamber 3, the upper conveying portion 4, and the machine portion 9 which are located in the vertical direction. . The chamber 3 is held at a predetermined angle, at an angle of 75 degrees from the vertical state, at an angle of 75 degrees to the horizontal surface, and is formed on the gantry 2 at both sides in the width direction, and is formed on the side surface of the width direction at an angle of 75 degrees. The seam is lowered by 13 (only one is shown in Fig. 1). The inside of the chamber 3 is as shown in Figs. 2 and 3, and the plurality of transport shafts 15 constituting the inclined transport 9 200816354 mechanism are disposed at predetermined intervals in the width direction of the chamber 3. The carrier shaft 15 is provided with a plurality of rotating support rollers 14 in the axial direction at predetermined intervals. The upper end and the lower end of the transport shaft 15 are respectively supported by the bracket 15a, and the axis thereof is inclined at the same angle as the slit π. The substrate W is carried into the chamber 3 by the slit 13 from the horizontal state to the angle of 75 degrees by the first posture converting portion I6 shown by the broken line in Fig. 1 . In other words, the unprocessed substrate W is transported to the first processing unit 1A side by the fifth processing unit 1E side by the upper transport unit 4, and the first posture converting unit 16 is inclined at an angle of 75 degrees from the horizontal state. Move to the first unit 10A unit 1A. The substrate w carried into the chamber 3 of the first processing unit 1A is supported by the support roller 14 provided on the conveyance shaft 15 to support the back surface of the non-device surface. The substrate to the lower end is supported by the outer peripheral surface of the driving roller 17 (shown in Fig. 2). The drive roller 17 is provided on the rotary shaft 19 of the drive unit 18. Further, the hunting shaft drives the rotating shaft 1 to rotate, and the lower end is supported by the driving lug 17 and the substrate W supported by the supporting roller 14 is conveyed to the rotating direction of the driving roller 17. The first to third processing units 1A to 1C on the upstream side in the transport direction use the stripping liquid as the processing liquid to remove the photoresist, and then use the cleaning liquid as the processing liquid in the fourth processing unit 1 to perform the cleaning treatment. . Then, the fifth processing unit 1E performs a drying process with a fluid such as hot air. The substrate W processed through the processing units 1A to 1E in this order is carried out by the fifth processing unit 状态 in a state of being inclined at an angle of 75 degrees. The substrate w carried out by the fifth processing unit 1E is in the second posture shown by a broken line in Fig. 1 . The converted portion 23 is converted into a horizontal state by the tilting state, and then transmitted to the next step. As shown in Fig. 2, the drive unit 18 has a long plate-like lower base member 24 along the width direction of the chamber 3 (the conveyance direction of the substrate W). The lower ends of the both sides of the channel-shaped upper base member 25 having the same length as the lower base 5 bottom member 24 are fixed to the upper surface of the lower base member 24. One end of the width of the flat-shaped mounting member 26 having substantially the same size as the lower base member 24 and the other end portion are coupled to the upper base member 25 so as to be inclined to the upper base member 25. That is, the mounting member 26 of the first embodiment can adjust the angle of inclination to the front and rear directions of the chamber 3. A plurality of brackets 31 each having one end and the other end in the width direction of the mounting member 26 are disposed at a predetermined interval in the longitudinal direction of the mounting member 26 at a position corresponding to the width direction. The middle portion of the rotatable shaft A of the rotating shaft 19 is supported by a pair of brackets 31 corresponding in the width direction via a bearing (not shown). The drive roller 17 is attached to the front end of the rotary shaft 19, and the 10th gear 33 is fitted to the rear end. Next, when the chamber 3 is provided in the gantry 2, the lower end faces of the four rod-shaped reference members 35 can be attached and fixed to the upper surface of the support portion 41 provided on the gantry 2 by screws 42. The drive unit 18 is attached to the upper end surface of the reference member 35 by screws on the lower surface of the lower base member 24. The upper end faces of the four reference members 35 are located on the same plane. Therefore, the driving unit 18 can be mounted and fixed in the width direction and the longitudinal direction of the lower base member 24 without causing skew. When the drive unit 18 group 11 200816354 is mounted in the chamber 3 with reference to the upper end surface of the reference member 35, the rear end portion of the plurality of rotary shafts 19 supported by the drive unit 18 is opened by the opening toward the front wall 12b of the chamber 3. 44 protrudes from the drive chamber 45. Further, after the drive unit 18 is assembled in the chamber 3, the first gear 33 is fitted to the rear end of the rotary shaft 19. 5 The drive chamber 45 is provided with a drive source 51. A drive pulley 53 is embedded in the output shaft of the drive source 51. The drive block 53 and the passive block 54 are provided with a belt 55. The passive pulley 54 is disposed coaxially with a second gear (not shown). The second wheel is engaged with the first gear 33. Thereby, when the drive source 51 is actuated, since the rotary shaft 19 is driven to rotate, the drive roller 17 provided at the front end 10 of the rotary shaft 19 is also driven to rotate. When the driving parent 17 is driven to rotate, the substrate W supported by the driving lepton 17 is conveyed to the rotational direction of the driving roller π. The surface of the upper side in the oblique direction of the substrate W which is obliquely conveyed, that is, the plurality of liquid supply tubes 61 which are parallel to the front surface of the circuit pattern and which are disposed opposite to each other, are disposed at predetermined intervals in the conveyance direction of the substrate W. The stripping liquid is sprayed on the front side of the substrate W to remove the third to third processing units 1A to 1C of the photoresist. In each of the liquid supply pipes 61, a plurality of nozzle bodies 62 are provided at predetermined intervals in a direction parallel to the conveyance direction of the substrate W. The liquid supply pipe 6120 and the nozzle body 62 form the treatment liquid supply mechanism of the invention. The stripping liquid is supplied to the liquid supply pipe 61 at a high pressure of about 7 MPa. Thereby, the above-described process can be performed at a high pressure by the nozzle body 62 provided in the liquid supply pipe 61 to the front surface of the substrate W. The substrate W is transported at a predetermined interval in the chamber 3 of the aforementioned processing units 1A to 1C 12 200816354. That is, there is a gap G shown in Fig. 3 between the rear end of the substrate w on the downstream side in the transport direction and the front end of the substrate W on the upstream side. Therefore, a part of the processing liquid sprayed from the nozzle body 62 toward the front surface of the substrate W hits and reflects the inner surface of the rear wall 12c of the chamber 3 through the gap G. The treatment liquid reflected on the inner surface of the wall 12c after the chamber 3 can be prevented from being sprayed onto the back surface of the substrate w conveyed in the chamber 3 by the liquid returning prevention member 65. The liquid return preventing member 65 is disposed at a position opposite to each of the liquid supply pipes 61 at the inner end of the rear wall 12c of the chamber 3 and upstream of the conveyance direction of the substrate W, that is, one of the liquid returns. The prevention member 65 is positioned 10 on the upstream side of the liquid supply pipe 61 on the upstream side, and the other liquid return prevention member 65 is disposed on the downstream side of the liquid supply pipe 61 on the most downstream side. As shown in FIG. 2, the liquid return preventing member 65 has a length dimension approximately the same as the south dimension of the substrate w, and the cross-sectional shape is not fixed from the base end to the rear wall 12c as shown in FIG. a vertical wall portion 65a that is disposed substantially vertically, an inclined wall portion 65t) disposed obliquely at a front end of the vertical wall portion 65a at a predetermined inclination angle, such as an angle of 45 degrees, and an inner surface facing the rear wall 12c and the vertical wall The portion 65a is provided in a hook shape in parallel with the return preventing wall portion 65c at the tip end of the inclined wall portion 65b. 2〇 Next, the pair of liquid return preventing members 65 are disposed such that the return preventing walls W65C are opposed to each other and disposed at both end portions in the conveying direction of the substrate boundary in the chamber 3, that is, as shown in FIG. , disposed in the width direction of the chamber 3 near the two end walls 12a. A pipe or a drive system component or the like is provided at a lower end portion of the rear side wall 1 side of the transport shaft 15 behind the support roller 14 having the upper and lower support rollers 14 of the chamber 3. Therefore, in order to prevent the liquid return preventing member 65 from interfering with the components of the piping or the drive system, as shown in Fig. 2, the length dimension is set shorter than the twist dimension of the chamber 3. 5 Thereby, the upper space portion 66 and the lower space portion 67 are formed between the upper end of the liquid return preventing member 65 and the inner surface of the chamber wall of the chamber 3, and between the lower end and the inner surface of the bottom wall. The upper end portion and the lower end portion of the liquid return preventing member 65 located at both end portions in the width direction of the chamber 3 are provided with a passage preventing member 68, respectively. Fig. 2 shows a passage preventing member 68 provided in the lower space portion 67 provided on the lower end side of the liquid return preventing member 65, the cross-sectional shape of the passage preventing member 68 being substantially l-shaped, and the base end 68a is fixed to The inner surface of the end wall 12a of the chamber 3, the intermediate portion 681) is parallel to the rear wall 12c of the chamber 3, and is engaged with the lower end surface of the liquid return preventing member 65. Further, the distal end portion 68c protrudes toward the return preventing wall portion 65c side of the liquid return preventing member 15, and is bent toward the rear side of the rear wall 12 to a substantially right angle. The upper space portion 66 on the upper end side of the liquid return preventing member 65 is also provided with a passage preventing member 68 in the same manner as the lower space portion 67. The passage preventing member 2068 provided on the upper end side of the liquid return preventing member 65 and the passage preventing member 68 provided on the lower end side respectively reach the total length in the height direction of the upper space portion 66 and the lower space portion 67. That is, no gap is provided in the height direction of each of the space portions 66, 67. By this, even if one part of the treatment liquid of the gap G between the front end and the front end of the substrate W conveyed at a predetermined interval and the inner surface of the chamber 3 are hit and reflected, the The upper portion of the upper portion of the liquid return preventing member 65 and the lower space portion 67 are prevented from colliding with the inner surface of the blocking member 68 by the processing liquid passing through the respective space portions 66, 67. In the processing apparatus configured as described above, the plurality of substrates W are sequentially carried into the chambers 3 of the first to third processing units 1A to 1C at predetermined intervals. The nozzles are disposed in the nozzles provided in the liquid supply tube 61. The body 62 ejects the treatment liquid to the front surface of the substrate W carried in the chamber 3. Thereby, the front surface of the substrate W can be treated by the treatment liquid. 10 A part of the treatment liquid sprayed by the nozzle body 62 may be passed through The gap G between the front end and the rear end of the substrate W (as shown in FIG. 3) is intermittently struck and hits the inner surface of the rear wall 12c of the chamber 3, and is reflected on the inner surface thereof and splashed onto the substrate W transported in the chamber 3. The back of the back. In this case, The back surface of the substrate W is floated by the support roller 14, and the conveyance state becomes unstable, and 15 cannot pass through the slit 13 formed in the two side walls in the width direction of the chamber 3. However, the inner surface of the rear wall 12c of the chamber 3 is provided with liquid. The liquid return preventing member 65 is formed in a hook shape by the vertical wall portion 65a, the inclined wall portion 65b, and the return preventing wall portion 65c. Therefore, it is ejected by the nozzle body 62 and faces the inner surface of the rear wall 12c of the chamber 3 by 20 And a portion of the treatment liquid reflected on the inner surface is formed along the vertical wall portion 65a, the inclined wall portion 65b, and the return prevention wall portion 65c as indicated by an arrow A or an arrow B in FIG. Since the inner surface of the hook-shaped portion is wound and flows, and does not hit the back surface of the substrate W conveyed in the chamber 3, the conveyance state of the substrate w is not unstable. 15 200816354 Captured by the pair of liquid return preventing members 65 The treatment liquid which is prevented from returning to the back surface of the substrate W is a part of the treatment liquid which is reflected on the inner surface of the wall 12c after the chamber 3' and the remaining treatment liquid may hit the back surface of the substrate W. However, even if it is returned by a pair of liquids Preventing member 65 from capturing In the case where the liquid repellency is at the same time, the force of the treatment liquid which acts on the inner surface of the wall 12c after the chamber 3 and the substrate W is weakened, thereby preventing the smooth transportation state of the substrate w. The preventing member 65 has a hook shape of the inclined wall portion 65b inclined at a predetermined angle. Therefore, the treatment liquid sprayed by the nozzle body 62 and passing through the gap G between the front end and the rear end of the substrate 10 W is even struck to the inclined wall portion. The outer surface of 65b can also be reflected in the direction of the inclination angle as indicated by the arrow C in Fig. 3. Therefore, the treatment liquid reflected on the outer surface of the inclined wall portion 65b hardly returns to the inner surface of the substrate W. Therefore, it is difficult to impair the conveyance state of the substrate W even because of the above factors. The upper space portion 66 and the lower space portion 67 are formed between the lower end of the liquid return preventing member 65 and the inner surface of the patio wall and the inner surface of the bottom wall, respectively. Therefore, a part of the treatment liquid reflected by the gap G between the rear end before the substrate w conveyed at a predetermined interval and on the inner surface of the rear wall 12c of the chamber 3 passes through the upper space portion 66 and the lower space portion 67 and is in the chamber 3 The inner surface of the end wall 12a 20 is reflected to strike the ridge of the back surface of the substrate W. However, the lower end of the liquid return preventing member 65 is provided with a passage preventing member 68 for preventing the treatment liquid reflected by the wall 12c after the chamber 3 from passing through the upper space portion 66 and the lower space portion 67. Therefore, as shown by the arrow F in FIG. 3, the treatment liquid reflected by the wall 16c of the chamber 3 after the above-mentioned gap g 200816354 passes through the upper space portion 66 and the lower space portion formed at the lower end of the liquid return preventing member 65. 67 is also collided with the inner surface of the intermediate portion 68b of the passage preventing member 68 provided in each of the space portions 66, 67, and is reflected toward the rear wall 12c side of the chamber 3. The treatment liquid which is reflected toward the rear wall 12c side of the chamber 3 is reflected toward the rear wall 12c side inside the end wall 12a of the chamber 3, and then hits the rear wall 12c to be weakened. Thereby, even if the processing liquid passes through the upper space portion 66 and the lower space portion 6 formed on the upper end of the liquid return preventing member 65, the reflection of the back surface of the substrate W can be prevented by the blocking member 68, so that it is possible to surely prevent the passage of each The processing liquid of the 10 space portions 66 and 67 hits the back surface of the substrate w. Fig. 4 is a view showing a second embodiment of the present invention. In this embodiment, the two liquid return preventing members 65 are disposed on one of the liquid supply pipes 61, and are disposed on the both sides of the liquid supply pipe 61, that is, on the upstream side and the downstream side of the liquid supply pipe 61. position. When the liquid return preventing member 65 is disposed as described above, most of the processing liquid sprayed from the nozzle body 62 of one liquid supply pipe 61 and reflected on the inner surface of the rear wall 12c of the chamber 3 is a pair of liquid as indicated by an arrow D. The return preventing member 65 catches and prevents it from being reflected on the inner surface of the rear wall 12c of the chamber 3 and returns to the back surface of the substrate w, so that the conveyance state of the substrate W can be made more stable. Further, although not shown, the passage preventing member 68 shown in the first embodiment may be provided at the lower end of the liquid return preventing member 65 shown in Fig. 4 . The present invention is not only applicable to the case of treating a substrate with a peeling liquid, but also to a case where it is treated with another treatment liquid such as pure water, or to a case where a mixed fluid in which a gas and a liquid are mixed by a nozzle body is applied. 17 200816354 Further, the present invention can be applied to a case where a gas to be used for cutting a liquid such as an air knife is used instead of a liquid to be used for removing the liquid adhering to the substrate. In general, it is applicable as long as it can eject a liquid such as a liquid or a gas to the substrate at a high pressure. 5 No piping or the like may be provided between the upper end of the liquid return preventing member and the inner surface of the chamber wall of the chamber. In this case, since the upper end of the liquid return preventing member can be brought into contact with the inner surface of the chamber wall of the chamber, the passage preventing member can be provided only on the lower end side of the return preventing member. Further, although the liquid 10 is disposed in the vicinity of the end wall at both ends in the width direction of the chamber, the lower end of the liquid returning prevention member is provided with the blocking member, but if the liquid return preventing member is provided at a position other than the vicinity of the end wall of the chamber, The lower end or at least the lower end of the liquid return preventing member is disposed on the passage preventing member. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a schematic configuration of a processing apparatus according to a first embodiment of the present invention. Fig. 2 is a longitudinal sectional view of a chamber of the aforementioned processing apparatus. Fig. 3 is a longitudinal sectional view showing one chamber in which the liquid supply pipe and the liquid return preventing member are disposed. Fig. 4 is a longitudinal cross-sectional view showing a portion of the chamber in which the liquid supply pipe and the liquid returning 20 are disposed in the second embodiment of the present invention. [Explanation of main component symbols] 1: Apparatus main body 3: Room 1A to 1E. · First to fifth processing units 4. .. Upper conveying unit 2: Rack 5: Foot body 18 200816354 6. . Space Division 7.. Machine 8.. Frame 9.. Machine Part 12a... End Wall 12b... Front Wall 12c... Rear Wall 13... Slit 14... Support Roller 15···Transportation Fortunately, 15a, 31... bracket 16: first posture changing unit 17... drive roller 18... drive unit 19... rotating shaft 23... second posture changing unit 24. lower base member 25... upper portion Base member 26...mounting member 33...first gear 35...reference member 41···support portion 42.. screw 44···export hole 45.. drive chamber 51.. drive source 53... drive pulley 54... Passive pulley 55··· belt 61.. Liquid supply pipe 62.. nozzle body 65... liquid return preventing member 65a... vertical wall portion 65b... inclined wall portion 65c... returning prevention wall portion 66. . The upper space portion 67.. the lower space portion 68... passes the blocking member 68a... the base end 68b... the middle portion 68c... the front end portion A, B, C, F.·· arrow 19 200816354 G... Gap W.··20