TW200730655A - Sputtering method and device thereof - Google Patents

Sputtering method and device thereof

Info

Publication number
TW200730655A
TW200730655A TW095138649A TW95138649A TW200730655A TW 200730655 A TW200730655 A TW 200730655A TW 095138649 A TW095138649 A TW 095138649A TW 95138649 A TW95138649 A TW 95138649A TW 200730655 A TW200730655 A TW 200730655A
Authority
TW
Taiwan
Prior art keywords
substrate
rotating mechanism
magnet
target
deposition
Prior art date
Application number
TW095138649A
Other languages
English (en)
Inventor
Keiji Ishibashi
Shunichi Wakayanagi
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of TW200730655A publication Critical patent/TW200730655A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0617—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW095138649A 2005-11-22 2006-10-20 Sputtering method and device thereof TW200730655A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005337635A JP4721878B2 (ja) 2005-11-22 2005-11-22 スパッタリング装置

Publications (1)

Publication Number Publication Date
TW200730655A true TW200730655A (en) 2007-08-16

Family

ID=38052383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138649A TW200730655A (en) 2005-11-22 2006-10-20 Sputtering method and device thereof

Country Status (4)

Country Link
US (1) US20070114122A1 (zh)
JP (1) JP4721878B2 (zh)
KR (1) KR20070054108A (zh)
TW (1) TW200730655A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101468727B1 (ko) * 2008-07-28 2014-12-08 위순임 자기 조절 수단을 구비한 플라즈마 반응기
EP2306489A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
JP5364172B2 (ja) * 2009-11-10 2013-12-11 キヤノンアネルバ株式会社 スパッタリング装置による成膜方法およびスパッタリング装置
US20130220797A1 (en) * 2010-05-19 2013-08-29 General Plasma, Inc. High target utilization moving magnet planar magnetron scanning method
EP2437280A1 (en) * 2010-09-30 2012-04-04 Applied Materials, Inc. Systems and methods for forming a layer of sputtered material
SG11201401977UA (en) * 2011-11-04 2014-05-29 Intevac Inc Linear scanning sputtering system and method
JP5875462B2 (ja) * 2012-05-21 2016-03-02 株式会社アルバック スパッタリング方法
JPWO2013179548A1 (ja) * 2012-05-31 2016-01-18 東京エレクトロン株式会社 マグネトロンスパッタ装置、マグネトロンスパッタ方法及び記憶媒体
KR102090712B1 (ko) * 2013-07-25 2020-03-19 삼성디스플레이 주식회사 박막 증착 장치와, 이를 이용한 증착 방법 및 유기 발광 표시 장치의 제조 방법
DE102013014335A1 (de) * 2013-08-28 2015-03-05 Centrotherm Sitec Gmbh Verfahren und vorrichtung zum beschichten eines reaktorgefässes sowie ein reaktorgefäss
CN103924200B (zh) * 2013-12-30 2017-07-04 上海天马有机发光显示技术有限公司 一种薄膜沉积装置
EP3232463B1 (en) * 2016-04-11 2020-06-24 SPTS Technologies Limited Dc magnetron sputtering
GB201714646D0 (en) * 2017-09-12 2017-10-25 Spts Technologies Ltd Saw device and method of manufacture
JP7229014B2 (ja) * 2018-12-27 2023-02-27 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP6635492B1 (ja) * 2019-10-15 2020-01-29 サンテック株式会社 基板回転装置
JP2022101218A (ja) * 2020-12-24 2022-07-06 東京エレクトロン株式会社 スパッタ装置及びスパッタ装置の制御方法
CN117488248B (zh) * 2024-01-02 2024-03-12 上海米蜂激光科技有限公司 修正板的设计方法、修正板、镀膜装置以及镀膜方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235560A (ja) * 1985-04-11 1986-10-20 Fujitsu Ltd マグネトロンスパツタ装置
JPH06264229A (ja) * 1993-03-11 1994-09-20 Fujitsu Ltd スパッタリング装置
US5540821A (en) * 1993-07-16 1996-07-30 Applied Materials, Inc. Method and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processing
KR100262768B1 (ko) * 1996-04-24 2000-08-01 니시히라 순지 스퍼터성막장치
JP4213777B2 (ja) * 1997-12-26 2009-01-21 パナソニック株式会社 スパッタリング装置及び方法
JP3749383B2 (ja) * 1998-08-25 2006-02-22 株式会社昭和真空 スパッタ装置における膜厚分布制御方法とその装置

Also Published As

Publication number Publication date
JP2007138275A (ja) 2007-06-07
US20070114122A1 (en) 2007-05-24
JP4721878B2 (ja) 2011-07-13
KR20070054108A (ko) 2007-05-28

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