TW200728916A - Photosensitive resin composition and cured object obtained thereof - Google Patents

Photosensitive resin composition and cured object obtained thereof

Info

Publication number
TW200728916A
TW200728916A TW095134079A TW95134079A TW200728916A TW 200728916 A TW200728916 A TW 200728916A TW 095134079 A TW095134079 A TW 095134079A TW 95134079 A TW95134079 A TW 95134079A TW 200728916 A TW200728916 A TW 200728916A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
object obtained
resistance
cured object
Prior art date
Application number
TW095134079A
Other languages
English (en)
Inventor
Ryutaro Tanaka
Toru Kurihashi
Yasumasa Akatsuka
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200728916A publication Critical patent/TW200728916A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
TW095134079A 2005-09-15 2006-09-14 Photosensitive resin composition and cured object obtained thereof TW200728916A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005267777 2005-09-15

Publications (1)

Publication Number Publication Date
TW200728916A true TW200728916A (en) 2007-08-01

Family

ID=37864918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134079A TW200728916A (en) 2005-09-15 2006-09-14 Photosensitive resin composition and cured object obtained thereof

Country Status (4)

Country Link
JP (1) JPWO2007032326A1 (zh)
CN (1) CN101268418A (zh)
TW (1) TW200728916A (zh)
WO (1) WO2007032326A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412881B (zh) * 2011-02-17 2013-10-21

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4910610B2 (ja) * 2005-10-04 2012-04-04 日立化成工業株式会社 感光性樹脂組成物及び感光性フィルム
CN101622236B (zh) 2007-05-09 2014-06-18 株式会社艾迪科 环氧化合物、碱显影性树脂组合物以及碱显影性感光性树脂组合物
CN106662814B (zh) 2014-06-13 2019-12-17 日本化药株式会社 感光性树脂组合物、光刻胶层叠体以及它们的固化物(11)
JP6275620B2 (ja) * 2014-10-17 2018-02-07 日本化薬株式会社 感光性樹脂組成物及びその硬化物
CN107710074B (zh) * 2015-06-24 2019-07-16 互应化学工业株式会社 阻焊剂组合物、被膜、被覆印刷布线板、被膜的制造方法和被覆印刷布线板的制造方法
CN107357134B (zh) * 2016-05-09 2021-12-10 台湾积体电路制造股份有限公司 组成物及形成一材料层的方法
TWI655239B (zh) * 2016-12-21 2019-04-01 日商三菱化學股份有限公司 硬化性樹脂組成物，以及使用該組成物的膜、成形品、預浸體及纖維強化塑膠
WO2021039111A1 (ja) * 2019-08-23 2021-03-04 Dic株式会社 樹脂組成物及びそれを用いた半導体封止材料、含侵基材、回路基板、ビルドアップフィルム、プリプレグ、炭素繊維複合材料、ソルダーレジスト、ドライフィルム、プリント配線板
CN110951047B (zh) * 2019-11-22 2022-06-10 张家港康得新光电材料有限公司 改性环氧丙烯酸酯树脂及其制备方法
CN111440483B (zh) * 2020-05-15 2022-03-08 新东方油墨有限公司 一种耐高温高压压合的可退洗油墨及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740213B2 (ja) * 1988-12-20 1998-04-15 関西ペイント株式会社 ビスフエノールｆ型エポキシ樹脂及びそれを含む塗料組成物
JP2761092B2 (ja) * 1990-10-12 1998-06-04 菱電化成株式会社 ２液混合型硬化性樹脂組成物
JPH05194902A (ja) * 1992-01-06 1993-08-03 Taiyo Ink Seizo Kk レジストインキ組成物及びそれを用いたソルダーレジスト膜形成方法
JP3154782B2 (ja) * 1992-01-06 2001-04-09 太陽インキ製造株式会社 レジストインキ組成物及びソルダーレジスト膜形成法
JP2854749B2 (ja) * 1992-01-10 1999-02-03 太陽インキ製造株式会社 紫外線・熱併用硬化性ソルダーレジストインキ組成物
JP2746009B2 (ja) * 1992-09-11 1998-04-28 東洋インキ製造株式会社 フォトソルダーレジスト組成物
JP3539772B2 (ja) * 1994-09-09 2004-07-07 新日鐵化学株式会社 結晶状エポキシ樹脂、その製造法、それを用いたエポキシ樹脂組成物および硬化物
JP3415292B2 (ja) * 1994-10-07 2003-06-09 ジャパンエポキシレジン株式会社 半導体封止用エポキシ樹脂組成物
JP3971002B2 (ja) * 1997-12-08 2007-09-05 関西ペイント株式会社 プリント配線板用レジスト組成物およびプリント配線板の製造方法
JP2004198673A (ja) * 2002-12-18 2004-07-15 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
JP2005247902A (ja) * 2004-03-01 2005-09-15 Nippon Kayaku Co Ltd エポキシ樹脂及びエポキシ樹脂組成物
JP2006002020A (ja) * 2004-06-17 2006-01-05 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR20070043716A (ko) * 2004-07-20 2007-04-25 니폰 가야꾸 가부시끼가이샤 에폭시 수지, 에폭시 수지 조성물 및 그의 경화물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412881B (zh) * 2011-02-17 2013-10-21

Also Published As

Publication number Publication date
WO2007032326A1 (ja) 2007-03-22
JPWO2007032326A1 (ja) 2009-03-19
CN101268418A (zh) 2008-09-17

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