TW200728916A - Photosensitive resin composition and cured object obtained thereof - Google Patents

Photosensitive resin composition and cured object obtained thereof

Info

Publication number
TW200728916A
TW200728916A TW095134079A TW95134079A TW200728916A TW 200728916 A TW200728916 A TW 200728916A TW 095134079 A TW095134079 A TW 095134079A TW 95134079 A TW95134079 A TW 95134079A TW 200728916 A TW200728916 A TW 200728916A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
object obtained
resistance
cured object
Prior art date
Application number
TW095134079A
Other languages
Chinese (zh)
Inventor
Ryutaro Tanaka
Toru Kurihashi
Yasumasa Akatsuka
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200728916A publication Critical patent/TW200728916A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)

Abstract

A photosensitive resin composition and the cured object obtained thereof are disclosed, providing properties such as excellent photosensitivity, flexing characteristics, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc. The photosensitive resin composition comprises a photosensitive resin (A) soluble in an aqueous alkali solution, a reactive crosslinking agent (B), a photopolymerization initiator (C), and a hardener (D), in which the hardener (D) is a 4,4'-bonding bisphenol F epoxy resin represented by the formula (1): [in which n indicates the number of repetitions].
TW095134079A 2005-09-15 2006-09-14 Photosensitive resin composition and cured object obtained thereof TW200728916A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005267777 2005-09-15

Publications (1)

Publication Number Publication Date
TW200728916A true TW200728916A (en) 2007-08-01

Family

ID=37864918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134079A TW200728916A (en) 2005-09-15 2006-09-14 Photosensitive resin composition and cured object obtained thereof

Country Status (4)

Country Link
JP (1) JPWO2007032326A1 (en)
CN (1) CN101268418A (en)
TW (1) TW200728916A (en)
WO (1) WO2007032326A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412881B (en) * 2011-02-17 2013-10-21

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4910610B2 (en) * 2005-10-04 2012-04-04 日立化成工業株式会社 Photosensitive resin composition and photosensitive film
US8252512B2 (en) 2007-05-09 2012-08-28 Adeka Corporation Epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition
WO2015190476A1 (en) * 2014-06-13 2015-12-17 日本化薬株式会社 Photosensitive resin composition, resist laminate, cured product of photosensitive resin composition, and cured product of resist laminate (11)
JP6275620B2 (en) * 2014-10-17 2018-02-07 日本化薬株式会社 Photosensitive resin composition and cured product thereof
JP6232168B2 (en) * 2015-06-24 2017-11-15 互応化学工業株式会社 Solder resist composition, film, coated printed wiring board, film manufacturing method, and coated printed wiring board manufacturing method
CN107357134B (en) * 2016-05-09 2021-12-10 台湾积体电路制造股份有限公司 Composition and method for forming a material layer
TWI655239B (en) 2016-12-21 2019-04-01 日商三菱化學股份有限公司 Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using the same
KR102638920B1 (en) * 2019-08-23 2024-02-23 디아이씨 가부시끼가이샤 Resin compositions and semiconductor encapsulation materials using the same, impregnated substrates, circuit boards, build-up films, prepregs, carbon fiber composite materials, solder resists, dry films, printed wiring boards
CN110951047B (en) * 2019-11-22 2022-06-10 张家港康得新光电材料有限公司 Modified epoxy acrylate resin and preparation method thereof
CN111440483B (en) * 2020-05-15 2022-03-08 新东方油墨有限公司 High-temperature-resistant high-pressure-resistant press-fit removable washable ink and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740213B2 (en) * 1988-12-20 1998-04-15 関西ペイント株式会社 Bisphenol F type epoxy resin and coating composition containing the same
JP2761092B2 (en) * 1990-10-12 1998-06-04 菱電化成株式会社 Two-part curable resin composition
JPH05194902A (en) * 1992-01-06 1993-08-03 Taiyo Ink Seizo Kk Resist ink composition and formation of solder resist film by using the same
JP3154782B2 (en) * 1992-01-06 2001-04-09 太陽インキ製造株式会社 Resist ink composition and method for forming solder resist film
JP2854749B2 (en) * 1992-01-10 1999-02-03 太陽インキ製造株式会社 UV / Heat curable solder resist ink composition
JP2746009B2 (en) * 1992-09-11 1998-04-28 東洋インキ製造株式会社 Photo solder resist composition
JP3539772B2 (en) * 1994-09-09 2004-07-07 新日鐵化学株式会社 Crystalline epoxy resin, production method thereof, epoxy resin composition and cured product using the same
JP3415292B2 (en) * 1994-10-07 2003-06-09 ジャパンエポキシレジン株式会社 Epoxy resin composition for semiconductor encapsulation
JP3971002B2 (en) * 1997-12-08 2007-09-05 関西ペイント株式会社 Resist composition for printed wiring board and method for producing printed wiring board
JP2004198673A (en) * 2002-12-18 2004-07-15 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JP2005247902A (en) * 2004-03-01 2005-09-15 Nippon Kayaku Co Ltd Epoxy resin and epoxy resin composition
JP2006002020A (en) * 2004-06-17 2006-01-05 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and its cured product
CA2578687A1 (en) * 2004-07-20 2006-01-26 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition, and cured product thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412881B (en) * 2011-02-17 2013-10-21

Also Published As

Publication number Publication date
CN101268418A (en) 2008-09-17
JPWO2007032326A1 (en) 2009-03-19
WO2007032326A1 (en) 2007-03-22

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