TW200710568A - Photosensitive resin composition for forming light shielding pattern of plasma display - Google Patents

Photosensitive resin composition for forming light shielding pattern of plasma display

Info

Publication number
TW200710568A
TW200710568A TW095129984A TW95129984A TW200710568A TW 200710568 A TW200710568 A TW 200710568A TW 095129984 A TW095129984 A TW 095129984A TW 95129984 A TW95129984 A TW 95129984A TW 200710568 A TW200710568 A TW 200710568A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
light
plasma display
light shielding
Prior art date
Application number
TW095129984A
Other languages
English (en)
Other versions
TWI319118B (zh
Inventor
Yukihiko Tanaka
Hitoshi Setsuda
Taisuke Shiroyama
Hiroyuki Obiya
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200710568A publication Critical patent/TW200710568A/zh
Application granted granted Critical
Publication of TWI319118B publication Critical patent/TWI319118B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095129984A 2005-09-08 2006-08-15 Photosensitive resin composition for forming light shielding pattern of plasma display TW200710568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005261220A JP4640971B2 (ja) 2005-09-08 2005-09-08 プラズマディスプレイの遮光性パターン形成用感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200710568A true TW200710568A (en) 2007-03-16
TWI319118B TWI319118B (zh) 2010-01-01

Family

ID=37858723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129984A TW200710568A (en) 2005-09-08 2006-08-15 Photosensitive resin composition for forming light shielding pattern of plasma display

Country Status (4)

Country Link
JP (1) JP4640971B2 (zh)
KR (1) KR100899410B1 (zh)
CN (1) CN1928718B (zh)
TW (1) TW200710568A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675872B (zh) * 2016-04-11 2019-11-01 日商東洋油墨Ｓｃ控股股份有限公司 遮光層形成用樹脂組合物及其製造方法、遮光層、以及遮光性構件及其製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795086B2 (ja) * 2006-04-13 2011-10-19 富士フイルム株式会社 感光性組成物及びそれを用いた感光性転写材料、表示装置用遮光膜及びその製造方法、ブラックマトリクス、遮光膜付基板並びに表示装置
KR101142631B1 (ko) * 2007-12-14 2012-05-10 코오롱인더스트리 주식회사 샌드블라스트 레지스트용 감광성 수지 조성물 및 드라이필름 포토레지스트
JP5266958B2 (ja) * 2008-08-22 2013-08-21 凸版印刷株式会社 液晶表示装置用カラーフィルタ
KR101261619B1 (ko) * 2010-03-16 2013-05-07 주식회사 엘지화학 컬러 필터 제조용 잉크 조성물
JP5732222B2 (ja) * 2010-09-30 2015-06-10 太陽ホールディングス株式会社 感光性樹脂組成物
WO2017078271A1 (en) * 2015-11-04 2017-05-11 Rohm And Haas Electronic Materials Korea Ltd. Colored photosensitive resin composition and light shielding spacer prepared therefrom
KR102674086B1 (ko) * 2022-04-01 2024-06-14 (주)호전에이블 구리 소결 페이스트 조성물 및 이의 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010824A (en) 1992-11-10 2000-01-04 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same
JPH1184125A (ja) * 1997-09-12 1999-03-26 Tokyo Ohka Kogyo Co Ltd 色フィルタ用光重合性組成物、および色フィルタの製造方法
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
JP2001261761A (ja) * 2000-03-22 2001-09-26 Jsr Corp 感放射線性樹脂組成物および表示パネル用スペーサー
JP4130102B2 (ja) * 2001-09-18 2008-08-06 富士フイルム株式会社 感放射線性着色組成物
TW200714651A (en) * 2002-10-28 2007-04-16 Mitsubishi Chem Corp Photopolymerization composition and color filter using the same
KR100581971B1 (ko) * 2003-02-11 2006-05-22 주식회사 동진쎄미켐 미세 전극 형성용 고점도 Ａｇ 페이스트 조성물 및 이를이용하여 제조된 미세 전극
JP4437651B2 (ja) * 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP2005091853A (ja) * 2003-09-18 2005-04-07 Toppan Printing Co Ltd 感光性組成物およびそれを用いて形成したフォトスペーサを有するカラーフィルタ
JP2005129319A (ja) * 2003-10-23 2005-05-19 Matsushita Electric Ind Co Ltd 光硬化型組成物、それを用いたプラズマディスプレイパネルおよびその製造方法
JP2005202252A (ja) * 2004-01-16 2005-07-28 Dainippon Printing Co Ltd 固体撮像素子カラーフィルター用感光性着色組成物、固体撮像素子カラーフィルター、固体撮像素子、及び固体撮像素子カラーフィルターの製造方法
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675872B (zh) * 2016-04-11 2019-11-01 日商東洋油墨Ｓｃ控股股份有限公司 遮光層形成用樹脂組合物及其製造方法、遮光層、以及遮光性構件及其製造方法

Also Published As

Publication number Publication date
TWI319118B (zh) 2010-01-01
CN1928718B (zh) 2010-05-26
KR100899410B1 (ko) 2009-05-26
JP2007073434A (ja) 2007-03-22
KR20070029064A (ko) 2007-03-13
JP4640971B2 (ja) 2011-03-02
CN1928718A (zh) 2007-03-14

Similar Documents

Publication Publication Date Title
TW200710568A (en) Photosensitive resin composition for forming light shielding pattern of plasma display
TW200615694A (en) Photosensitive composition
TW200700903A (en) Photosensitive composition and black matrix
TW200700905A (en) Color photosensitive resin composition and hardened product of the same
WO2009061159A3 (en) Colored dispersion, photoresist composition and black matrix
TW200700902A (en) Photosensitive composition containing organic fine particle
TW200712767A (en) Black photosensitive resin composition
TW200641523A (en) Photosensitive resin composition for use in forming light-blocking layer, light-blocking layer and color filter
TW200628976A (en) Photosensitive composition for forming shading film and black matrix formed from photosensitive composition
WO2011002247A3 (ko) 300nm 이하의 초단파장 노광기를 이용한 고체 촬상 소자의 컬러 필터 제조용 착색 감광성 수지 조성물, 이를 이용한 컬러 필터 및 이를 포함하는 고체 촬상 소자
TW200700918A (en) Colorant-containing curable engative-type composition, color filter using the composition, and method of manufacturing the same
ZA200601259B (en) Indicator device
WO2008111247A1 (ja) 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板
AU2003288748A1 (en) Color filter black matrix resist composition
EP1596251A4 (en) IMERSION EXPOSURE USE RESEARCH FILM EDUCATION MATERIAL, COMPILED FILM AND RESISTMAT EDUCATION PROCESS
TWI340870B (en) Negative-type photosensitive resin composition containing epoxy-containing material
WO2006048443A3 (en) Photopolymerizable composition
TW200710449A (en) Process for proudcing color filter, color filter and liquid crystal display device
DE602005005710D1 (de) Thiolverbindung und lichtempfindliche zusammensetzung, die diese enthält
WO2009069974A3 (en) Coating composition and coating film having enhanced abrasion resistance and fingerprint traces removability
TWI319514B (en) Negative-type photosensitive resin composition containing epoxy-containing material
TW200617604A (en) Composition for forming antireflective film and method for forming wiring using the same
TW200710577A (en) Photosensitive composition and color filter formed from the same
TW200612193A (en) Method for producing substrate having light-shielding pattern and producing light-shielding pattern, and photosensitive resin composition, transferring material, color filter, and display device
TW200630746A (en) Photosensitive composition for forming light blocking film and black matrix formed with the photosensitive composition for forming light blocking film

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees