TW200705576A - Brittle member treatment apparatus - Google Patents
Brittle member treatment apparatusInfo
- Publication number
- TW200705576A TW200705576A TW095114956A TW95114956A TW200705576A TW 200705576 A TW200705576 A TW 200705576A TW 095114956 A TW095114956 A TW 095114956A TW 95114956 A TW95114956 A TW 95114956A TW 200705576 A TW200705576 A TW 200705576A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhered
- tape
- treatment apparatus
- glass plate
- brittle member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005142246A JP2006319233A (ja) | 2005-05-16 | 2005-05-16 | 脆質部材の処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200705576A true TW200705576A (en) | 2007-02-01 |
Family
ID=37431087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095114956A TW200705576A (en) | 2005-05-16 | 2006-04-26 | Brittle member treatment apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006319233A (ja) |
TW (1) | TW200705576A (ja) |
WO (1) | WO2006123508A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008055155A1 (de) * | 2008-12-23 | 2010-07-01 | Thin Materials Ag | Trennverfahren für ein Schichtsystem umfassend einen Wafer |
JP5996347B2 (ja) * | 2012-09-24 | 2016-09-21 | リンテック株式会社 | シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法 |
JP5589045B2 (ja) * | 2012-10-23 | 2014-09-10 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
JP2015225881A (ja) * | 2014-05-26 | 2015-12-14 | 株式会社ディスコ | テープの貼着方法 |
JP6401009B2 (ja) * | 2014-10-15 | 2018-10-03 | 株式会社ディスコ | ウエーハの加工方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4757442B2 (ja) * | 1997-02-10 | 2011-08-24 | リンテック株式会社 | チップ体製造用粘着シート |
JP4312419B2 (ja) * | 2002-05-09 | 2009-08-12 | リンテック株式会社 | 半導体ウエハの加工方法 |
-
2005
- 2005-05-16 JP JP2005142246A patent/JP2006319233A/ja not_active Withdrawn
-
2006
- 2006-04-24 WO PCT/JP2006/308509 patent/WO2006123508A1/ja active Application Filing
- 2006-04-26 TW TW095114956A patent/TW200705576A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006319233A (ja) | 2006-11-24 |
WO2006123508A1 (ja) | 2006-11-23 |
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