TW200641037A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
TW200641037A
TW200641037A TW095112558A TW95112558A TW200641037A TW 200641037 A TW200641037 A TW 200641037A TW 095112558 A TW095112558 A TW 095112558A TW 95112558 A TW95112558 A TW 95112558A TW 200641037 A TW200641037 A TW 200641037A
Authority
TW
Taiwan
Prior art keywords
weight
epoxy resin
component
resin composition
content
Prior art date
Application number
TW095112558A
Other languages
English (en)
Other versions
TWI319421B (zh
Inventor
Masaaki Urakawa
Takeshi Arai
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200641037A publication Critical patent/TW200641037A/zh
Application granted granted Critical
Publication of TWI319421B publication Critical patent/TWI319421B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/31—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
TW095112558A 2005-04-07 2006-04-07 Epoxy resin composition TW200641037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005110584 2005-04-07

Publications (2)

Publication Number Publication Date
TW200641037A true TW200641037A (en) 2006-12-01
TWI319421B TWI319421B (zh) 2010-01-11

Family

ID=37087017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112558A TW200641037A (en) 2005-04-07 2006-04-07 Epoxy resin composition

Country Status (8)

Country Link
US (1) US20090032286A1 (zh)
EP (1) EP1867672B1 (zh)
JP (1) JP4633116B2 (zh)
KR (1) KR100856186B1 (zh)
CN (1) CN101151294B (zh)
DE (1) DE602006019836D1 (zh)
TW (1) TW200641037A (zh)
WO (1) WO2006109744A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418579B (zh) * 2009-04-01 2013-12-11 Taiwan Union Technology Corp 環氧樹脂摻合物

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0817181A8 (pt) * 2007-10-31 2016-12-20 Dow Global Technologies Inc Polímero termofixo contendo anel de oxazolidinona terminado por epóxi, composição termofixa de revestimento em pó, substrato, método para prover um substrato com um revestimento epóxi ligado por fusão (fbe), substrato revestido, método para preparar um polimero contendo um anel de oxazolidinona terminado por epóxi e polímero
EP2385974A4 (en) * 2009-01-06 2012-12-05 Dow Global Technologies Llc METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION METHOD
US9240523B2 (en) * 2009-04-03 2016-01-19 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components
DE102009052061A1 (de) 2009-11-05 2011-05-12 Alzchem Trostberg Gmbh Verwendung von Guanidin-Derivaten als Härtungsbeschleuniger für Epoxidharze
US8871892B2 (en) * 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
US9528026B2 (en) 2011-07-19 2016-12-27 Panasonic Intellectual Property Management Co., Ltd. Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
JP2016528361A (ja) * 2013-08-16 2016-09-15 ダウ グローバル テクノロジーズ エルエルシー １ｋ熱硬化性エポキシ組成物
US10829603B2 (en) * 2014-02-25 2020-11-10 Toray Industries, Inc. Epoxy resin composition, resin cured product, fiber-reinforced composite material, and prepreg
JP6441632B2 (ja) * 2014-09-30 2018-12-19 旭化成株式会社 エポキシ樹脂の製造方法
CN112638973B (zh) * 2018-07-30 2023-03-31 陶氏环球技术有限责任公司 可固化的树脂组合物

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DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
SG43193A1 (en) 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
JP3322909B2 (ja) 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3290449B2 (ja) * 1991-08-19 2002-06-10 旭化成エポキシ株式会社 エポキシ樹脂組成物
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
JP3634903B2 (ja) * 1995-09-07 2005-03-30 三菱レイヨン株式会社 プリプレグ用エポキシ樹脂組成物
JPH09100358A (ja) * 1995-10-04 1997-04-15 Mitsubishi Rayon Co Ltd 炭素繊維強化複合材料用エポキシ樹脂組成物
JP3415349B2 (ja) * 1995-11-20 2003-06-09 三菱レイヨン株式会社 複合材料用エポキシ樹脂組成物
WO1998044017A1 (fr) * 1997-03-27 1998-10-08 Mitsubishi Rayon Co., Ltd. Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
JP3514146B2 (ja) * 1998-11-25 2004-03-31 松下電工株式会社 プリプレグ及び積層板
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
KR100454375B1 (ko) * 2000-07-26 2004-10-26 마츠시다 덴코 가부시키가이샤 에폭시 수지 조성물, 프리프레그 및 복합금속 적층판
JP2003261744A (ja) * 2002-01-04 2003-09-19 Mitsubishi Rayon Co Ltd エポキシ樹脂組成物、及び自己接着性プリプレグ
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418579B (zh) * 2009-04-01 2013-12-11 Taiwan Union Technology Corp 環氧樹脂摻合物

Also Published As

Publication number Publication date
KR20070117656A (ko) 2007-12-12
TWI319421B (zh) 2010-01-11
JP4633116B2 (ja) 2011-02-16
EP1867672A4 (en) 2009-09-02
CN101151294A (zh) 2008-03-26
EP1867672B1 (en) 2011-01-26
EP1867672A1 (en) 2007-12-19
WO2006109744A1 (ja) 2006-10-19
US20090032286A1 (en) 2009-02-05
CN101151294B (zh) 2011-02-09
KR100856186B1 (ko) 2008-09-03
DE602006019836D1 (de) 2011-03-10
JPWO2006109744A1 (ja) 2008-11-20

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