KR100856186B1 - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100856186B1 KR100856186B1 KR1020077022849A KR20077022849A KR100856186B1 KR 100856186 B1 KR100856186 B1 KR 100856186B1 KR 1020077022849 A KR1020077022849 A KR 1020077022849A KR 20077022849 A KR20077022849 A KR 20077022849A KR 100856186 B1 KR100856186 B1 KR 100856186B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- component
- weight
- resin composition
- ring
- Prior art date
Links
- CPELBVKDXCDYAE-UHFFFAOYSA-N CC1CC(CC2)C2CC1 Chemical compound CC1CC(CC2)C2CC1 CPELBVKDXCDYAE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
- C08K5/31—Guanidine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (7)
- (A) 옥사졸리돈환을 포함하는 에폭시 수지, (B) 노볼락형 에폭시 수지, (C) 구아니딘 유도체 및 (D) 이미다졸류를 성분으로서 포함하는 에폭시 수지 조성물이며, (A) 성분이 옥사졸리돈환과 동시에 이소시아누르환을 포함하고, 옥사졸리돈환에 대한 이소시아누르환의 IR 흡광도의 비가 0.01 이상 0.1 이하이고, (A) 성분과 (B) 성분의 중량비가 5:95 내지 95:5이고, (C) 성분과 (D) 성분의 함유량이 (A) 성분과 (B) 성분을 포함하는 에폭시 수지의 중량의 합 100 중량부당, 각각 0.01 내지 5 중량부, 0.08 중량부 이하이고, 수지 조성물로부터 (C) 성분과 (D) 성분을 제거한 중량을 기준으로 한 브롬 함유율이 10 중량% 이상 20 중량% 이하인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (B) 성분인 노볼락형 에폭시 수지의 연화점이 80 ℃ 이상인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (A) 성분과 (B) 성분의 중량비가 40:60 내지 95:5인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (D) 성분의 함유량이 (A) 성분과 (B) 성분을 포함하는 에폭시 수지의 중량의 합 100 중량부당 0.005 내지 0.08 중량부인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 기재된 에폭시 수지 조성물을 기재에 함침시켜 이루어지는 것을 특징으로 하는 프리프레그.
- 제5항에 기재된 프리프레그를 금속박과 함께 적층 성형하여 이루어지는 금속박 피복 적층판.
- 제5항에 기재된 프리프레그와 제6항에 기재된 금속박 피복 적층판으로 제조되는, 1층 이상의 배선층을 갖는 인쇄 배선판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005110584 | 2005-04-07 | ||
JPJP-P-2005-00110584 | 2005-04-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070117656A KR20070117656A (ko) | 2007-12-12 |
KR100856186B1 true KR100856186B1 (ko) | 2008-09-03 |
Family
ID=37087017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077022849A KR100856186B1 (ko) | 2005-04-07 | 2006-04-07 | 에폭시 수지 조성물 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090032286A1 (ko) |
EP (1) | EP1867672B1 (ko) |
JP (1) | JP4633116B2 (ko) |
KR (1) | KR100856186B1 (ko) |
CN (1) | CN101151294B (ko) |
DE (1) | DE602006019836D1 (ko) |
TW (1) | TW200641037A (ko) |
WO (1) | WO2006109744A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0817181A8 (pt) * | 2007-10-31 | 2016-12-20 | Dow Global Technologies Inc | Polímero termofixo contendo anel de oxazolidinona terminado por epóxi, composição termofixa de revestimento em pó, substrato, método para prover um substrato com um revestimento epóxi ligado por fusão (fbe), substrato revestido, método para preparar um polimero contendo um anel de oxazolidinona terminado por epóxi e polímero |
EP2385974A4 (en) * | 2009-01-06 | 2012-12-05 | Dow Global Technologies Llc | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION METHOD |
US20100255740A1 (en) * | 2009-04-01 | 2010-10-07 | Taiwan Union Technology Corporation | Epoxy resin blend |
US9240523B2 (en) * | 2009-04-03 | 2016-01-19 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components |
DE102009052061A1 (de) | 2009-11-05 | 2011-05-12 | Alzchem Trostberg Gmbh | Verwendung von Guanidin-Derivaten als Härtungsbeschleuniger für Epoxidharze |
US8871892B2 (en) * | 2009-11-12 | 2014-10-28 | Dow Global Technologies Llc | Polyoxazolidone resins |
US9528026B2 (en) | 2011-07-19 | 2016-12-27 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board |
JP2016528361A (ja) * | 2013-08-16 | 2016-09-15 | ダウ グローバル テクノロジーズ エルエルシー | 1k熱硬化性エポキシ組成物 |
US10829603B2 (en) * | 2014-02-25 | 2020-11-10 | Toray Industries, Inc. | Epoxy resin composition, resin cured product, fiber-reinforced composite material, and prepreg |
JP6441632B2 (ja) * | 2014-09-30 | 2018-12-19 | 旭化成株式会社 | エポキシ樹脂の製造方法 |
CN112638973B (zh) * | 2018-07-30 | 2023-03-31 | 陶氏环球技术有限责任公司 | 可固化的树脂组合物 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0543657A (ja) * | 1991-08-19 | 1993-02-23 | Asahi Chiba Kk | エポキシ樹脂組成物 |
JPH0971634A (ja) * | 1995-09-07 | 1997-03-18 | Mitsubishi Rayon Co Ltd | プリプレグ用エポキシ樹脂組成物 |
JPH09100358A (ja) * | 1995-10-04 | 1997-04-15 | Mitsubishi Rayon Co Ltd | 炭素繊維強化複合材料用エポキシ樹脂組成物 |
JPH09143244A (ja) * | 1995-11-20 | 1997-06-03 | Mitsubishi Rayon Co Ltd | 複合材料用エポキシ樹脂組成物 |
JP2000159911A (ja) * | 1998-11-25 | 2000-06-13 | Matsushita Electric Works Ltd | プリプレグ及び積層板 |
KR20010079646A (ko) * | 1998-08-14 | 2001-08-22 | 그래햄 이. 테일러 | 열경화성 수지 조성물을 위한 점도 조정제 |
KR20020026408A (ko) * | 2000-07-26 | 2002-04-10 | 이마이 기요스케 | 에폭시 수지 조성물, 프리프레그 및 복합금속 적층판 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3323122A1 (de) * | 1983-06-27 | 1985-05-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von reaktionsharzformstoffen |
GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
SG43193A1 (en) | 1990-05-21 | 1997-10-17 | Dow Chemical Co | Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom |
JP3322909B2 (ja) | 1991-08-15 | 2002-09-09 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
US5545697A (en) * | 1994-02-14 | 1996-08-13 | Ciba-Geigy Corporation | Urethane modified epoxy resin compositions |
WO1998044017A1 (fr) * | 1997-03-27 | 1998-10-08 | Mitsubishi Rayon Co., Ltd. | Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition |
GB9827367D0 (en) * | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
JP2003261744A (ja) * | 2002-01-04 | 2003-09-19 | Mitsubishi Rayon Co Ltd | エポキシ樹脂組成物、及び自己接着性プリプレグ |
JP3981659B2 (ja) | 2003-10-08 | 2007-09-26 | 新日本製鐵株式会社 | 支線タイプ防風壁 |
US7671147B2 (en) * | 2004-06-29 | 2010-03-02 | Asahi Kasei Chemicals Corporation | Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent |
-
2006
- 2006-04-07 EP EP20060731438 patent/EP1867672B1/en active Active
- 2006-04-07 US US11/887,920 patent/US20090032286A1/en not_active Abandoned
- 2006-04-07 JP JP2007512985A patent/JP4633116B2/ja active Active
- 2006-04-07 KR KR1020077022849A patent/KR100856186B1/ko active IP Right Grant
- 2006-04-07 DE DE200660019836 patent/DE602006019836D1/de active Active
- 2006-04-07 TW TW095112558A patent/TW200641037A/zh unknown
- 2006-04-07 CN CN2006800108128A patent/CN101151294B/zh active Active
- 2006-04-07 WO PCT/JP2006/307491 patent/WO2006109744A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0543657A (ja) * | 1991-08-19 | 1993-02-23 | Asahi Chiba Kk | エポキシ樹脂組成物 |
JPH0971634A (ja) * | 1995-09-07 | 1997-03-18 | Mitsubishi Rayon Co Ltd | プリプレグ用エポキシ樹脂組成物 |
JPH09100358A (ja) * | 1995-10-04 | 1997-04-15 | Mitsubishi Rayon Co Ltd | 炭素繊維強化複合材料用エポキシ樹脂組成物 |
JPH09143244A (ja) * | 1995-11-20 | 1997-06-03 | Mitsubishi Rayon Co Ltd | 複合材料用エポキシ樹脂組成物 |
KR20010079646A (ko) * | 1998-08-14 | 2001-08-22 | 그래햄 이. 테일러 | 열경화성 수지 조성물을 위한 점도 조정제 |
JP2000159911A (ja) * | 1998-11-25 | 2000-06-13 | Matsushita Electric Works Ltd | プリプレグ及び積層板 |
KR20020026408A (ko) * | 2000-07-26 | 2002-04-10 | 이마이 기요스케 | 에폭시 수지 조성물, 프리프레그 및 복합금속 적층판 |
Also Published As
Publication number | Publication date |
---|---|
KR20070117656A (ko) | 2007-12-12 |
TWI319421B (ko) | 2010-01-11 |
JP4633116B2 (ja) | 2011-02-16 |
EP1867672A4 (en) | 2009-09-02 |
CN101151294A (zh) | 2008-03-26 |
EP1867672B1 (en) | 2011-01-26 |
EP1867672A1 (en) | 2007-12-19 |
TW200641037A (en) | 2006-12-01 |
WO2006109744A1 (ja) | 2006-10-19 |
US20090032286A1 (en) | 2009-02-05 |
CN101151294B (zh) | 2011-02-09 |
DE602006019836D1 (de) | 2011-03-10 |
JPWO2006109744A1 (ja) | 2008-11-20 |
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