TW200622253A - Stacked tip cantilever electrical connector - Google Patents

Stacked tip cantilever electrical connector

Info

Publication number
TW200622253A
TW200622253A TW094129387A TW94129387A TW200622253A TW 200622253 A TW200622253 A TW 200622253A TW 094129387 A TW094129387 A TW 094129387A TW 94129387 A TW94129387 A TW 94129387A TW 200622253 A TW200622253 A TW 200622253A
Authority
TW
Taiwan
Prior art keywords
electrical connector
probe
tip cantilever
cantilever electrical
stacked tip
Prior art date
Application number
TW094129387A
Other languages
English (en)
Inventor
Scott R Williams
John Shuhart
Alan Slopey
B Guy Frick
Original Assignee
K&S Interconnect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K&S Interconnect Inc filed Critical K&S Interconnect Inc
Publication of TW200622253A publication Critical patent/TW200622253A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW094129387A 2004-08-26 2005-08-26 Stacked tip cantilever electrical connector TW200622253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60456104P 2004-08-26 2004-08-26

Publications (1)

Publication Number Publication Date
TW200622253A true TW200622253A (en) 2006-07-01

Family

ID=35431930

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129387A TW200622253A (en) 2004-08-26 2005-08-26 Stacked tip cantilever electrical connector

Country Status (7)

Country Link
US (1) US7279917B2 (zh)
EP (1) EP1782077A1 (zh)
JP (1) JP2008511007A (zh)
KR (1) KR20070060094A (zh)
CN (1) CN101006347A (zh)
TW (1) TW200622253A (zh)
WO (1) WO2006026346A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422830B (zh) * 2009-12-24 2014-01-11
TWI783744B (zh) * 2021-10-22 2022-11-11 中華精測科技股份有限公司 懸臂式探針結構

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JP2006119024A (ja) * 2004-10-22 2006-05-11 Tokyo Electron Ltd プローブおよびその製造方法
US7378734B2 (en) * 2006-05-30 2008-05-27 Touchdown Technologies, Inc. Stacked contact bump
US20070200576A1 (en) * 2006-02-08 2007-08-30 Laurent Edward T Multi-layered probes
WO2007092591A2 (en) * 2006-02-08 2007-08-16 Sv Probe Pte Ltd. Multi-layered probes
WO2007108110A1 (ja) * 2006-03-15 2007-09-27 Kabushiki Kaisha Nihon Micronics 通電試験用プローブおよびプローブ組立体
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
JP5123533B2 (ja) * 2007-02-01 2013-01-23 株式会社日本マイクロニクス 通電試験用プローブおよびその製造方法
KR100767012B1 (ko) * 2007-04-11 2007-10-17 주식회사 아이엠 프로브 카드와 프로브 카드의 니들 및 니들의 제조방법
US20090057866A1 (en) * 2007-08-27 2009-03-05 Chow Linda L W Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same
KR100891025B1 (ko) * 2007-08-27 2009-04-02 (주)미코엠에스티 프로브 카드 구조체 및 그의 형성 방법
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
US20090079455A1 (en) * 2007-09-26 2009-03-26 Formfactor, Inc. Reduced scrub contact element
DE102011008261A1 (de) * 2011-01-11 2012-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schiene für die elektrische Kontaktierung eines elektrisch leitfähigen Substrates
US9052342B2 (en) * 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
WO2014113508A2 (en) 2013-01-15 2014-07-24 Microfabrica Inc. Methods of forming parts using laser machining
US9878401B1 (en) 2013-01-15 2018-01-30 Microfabrica Inc. Methods of forming parts using laser machining
US9351436B2 (en) * 2013-03-08 2016-05-24 Cochlear Limited Stud bump bonding in implantable medical devices
WO2016201289A1 (en) * 2015-06-10 2016-12-15 Translarity, Inc. Shaping of contact structures for semiconductor test, and associated systems and methods
TWI737765B (zh) * 2016-07-08 2021-09-01 美商川斯萊緹公司 用於晶圓測試接觸件之堆疊立柱凸塊接觸及其相關方法
JP2019060817A (ja) * 2017-09-28 2019-04-18 日本特殊陶業株式会社 電子部品検査装置用配線基板
CN111247437B (zh) * 2017-10-31 2022-08-30 佛姆法克特股份有限公司 具有脱开的电气和机械探针连接部的mems探针卡组件
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape

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US5177438A (en) * 1991-08-02 1993-01-05 Motorola, Inc. Low resistance probe for semiconductor
US6722032B2 (en) 1995-11-27 2004-04-20 International Business Machines Corporation Method of forming a structure for electronic devices contact locations
JPH09274066A (ja) * 1996-02-07 1997-10-21 Fujitsu Ltd 半導体試験装置及びこれを利用した試験方法及び半導体装置
US6520778B1 (en) * 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
JPH10253642A (ja) * 1997-03-05 1998-09-25 Canon Inc 微小ティップの製造方法と微小電流または微小力検出用プローブの製造方法、及びその製造に用いる雌型基板、並びにその微小ティップとプローブ
JPH10260223A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 半導体検査装置及びこれを用いた検査方法
US5892223A (en) 1997-06-30 1999-04-06 Harris Corporation Multilayer microtip probe and method
JPH11326379A (ja) * 1998-03-12 1999-11-26 Fujitsu Ltd 電子部品用コンタクタ及びその製造方法及びコンタクタ製造装置
US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6255126B1 (en) 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
DE69908638T2 (de) * 1998-12-02 2004-04-29 Formfactor, Inc., Livermore Lithographische kontaktstrukturen
JP4414502B2 (ja) * 1999-02-25 2010-02-10 東京エレクトロン株式会社 プロービングカード
JP2001091543A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US6426556B1 (en) * 2001-01-16 2002-07-30 Megic Corporation Reliable metal bumps on top of I/O pads with test probe marks
US6960518B1 (en) * 2002-07-19 2005-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Buildup substrate pad pre-solder bump manufacturing
US20040228962A1 (en) * 2003-05-16 2004-11-18 Chang Liu Scanning probe microscopy probe and method for scanning probe contact printing
US6870381B2 (en) * 2003-06-27 2005-03-22 Formfactor, Inc. Insulative covering of probe tips
TW200739083A (en) * 2005-09-30 2007-10-16 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422830B (zh) * 2009-12-24 2014-01-11
TWI783744B (zh) * 2021-10-22 2022-11-11 中華精測科技股份有限公司 懸臂式探針結構

Also Published As

Publication number Publication date
JP2008511007A (ja) 2008-04-10
US7279917B2 (en) 2007-10-09
EP1782077A1 (en) 2007-05-09
KR20070060094A (ko) 2007-06-12
US20060043995A1 (en) 2006-03-02
WO2006026346A1 (en) 2006-03-09
CN101006347A (zh) 2007-07-25

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