TW200618129A - Substrate heating device - Google Patents

Abstract

The object of the present invention is to provide a substrate heating device capable of coping with changes in size of substrate, and preventing the characteristics of coated film deposited on the substrate from being uneven without locally heating the substrate with lifter pins. The solution of the present invention is that a substrate heating device is provided with a heating section 2 that heats uniformly almost the entire surface of a substrate 1 on which a film or laminated deposition is formed, a number of the lifter pins 5 that receive and support the substrates and are penetratably-protrudably/sinkably-retreatably provided from a number of pin holes 3 provided in the heater 2, and a substrate receiving mechanism including a pin driver 6 that drives a number of the lifter pins 5 forward and backward, the substrate receiving mechanism is configured to protrude the lifter pins 5 through the pin holes 3 of the heater 2 to allow the lifter pins 5 to support the substrate 1 and to receive the substrate 1 and to sink the protruding lifter pins 5 back into the heater 2 so as to carry the substrate 1 in a condition of resting on or being close to the heater 2 and to allow the heater 2 to uniformly heating almost the entire surface of the substrate 1, and is characterized in that the lifter pins 5 that are can be sunk and retreated to load the substrate 1 received and supported by the lifter pins 5 on the heater 2 are configured so as to be able to sink/retreat in the pin driver 6 from the heater 2 further to a lower position without allowing the lifter pins to stand by in the heater 2, and the lifter pins 5 are configured so as to be penetratable/protrudable from a position lower the heater 2.