TW200613910A - Photocurable/thermosetting resin composition, dry film using same, and cured product thereof - Google Patents
Photocurable/thermosetting resin composition, dry film using same, and cured product thereofInfo
- Publication number
- TW200613910A TW200613910A TW094123010A TW94123010A TW200613910A TW 200613910 A TW200613910 A TW 200613910A TW 094123010 A TW094123010 A TW 094123010A TW 94123010 A TW94123010 A TW 94123010A TW 200613910 A TW200613910 A TW 200613910A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photocurable
- thermosetting resin
- cured product
- dry film
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 6
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 4
- 239000000945 filler Substances 0.000 abstract 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000003513 alkali Substances 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 150000004292 cyclic ethers Chemical group 0.000 abstract 1
- 150000004294 cyclic thioethers Chemical group 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/151—Matting or other surface reflectivity altering material
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004200961 | 2004-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200613910A true TW200613910A (en) | 2006-05-01 |
TWI376572B TWI376572B (zh) | 2012-11-11 |
Family
ID=35782959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094123010A TW200613910A (en) | 2004-07-07 | 2005-07-07 | Photocurable/thermosetting resin composition, dry film using same, and cured product thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US7585611B2 (zh) |
JP (1) | JPWO2006004158A1 (zh) |
KR (1) | KR100845657B1 (zh) |
CN (1) | CN1981237B (zh) |
TW (1) | TW200613910A (zh) |
WO (1) | WO2006004158A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI584070B (zh) * | 2012-04-23 | 2017-05-21 | 日立化成股份有限公司 | 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法 |
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WO2004027502A1 (ja) * | 2002-09-19 | 2004-04-01 | Mitsui Chemicals, Inc. | 液晶シール剤組成物及びそれを用いた液晶表示パネルの製造方法 |
WO2006006671A1 (ja) * | 2004-07-14 | 2006-01-19 | Fujifilm Corporation | 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法 |
TW200710572A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same |
US7723404B2 (en) * | 2006-04-06 | 2010-05-25 | Ppg Industries Ohio, Inc. | Abrasion resistant coating compositions and coated articles |
US7838197B2 (en) | 2006-11-15 | 2010-11-23 | Taiyo Ink Mfg. Co., Ltd. | Photosensitive composition |
KR100963354B1 (ko) | 2006-11-15 | 2010-06-14 | 다이요 잉키 세이조 가부시키가이샤 | 감광성 조성물 |
TW200844652A (en) * | 2006-11-15 | 2008-11-16 | Taiyo Ink Mfg Co Ltd | Process for forming solder resist film and photosensitive composition |
KR100979436B1 (ko) * | 2007-03-02 | 2010-09-02 | 삼성전자주식회사 | 광대역 무선 접속 시스템에서 멀티캐스트 및 브로드캐스트 서비스 방송 채널에 대한 채널 전환 장치 및 방법 |
KR100889774B1 (ko) * | 2007-03-06 | 2009-03-24 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 격벽 및 이를 포함하는 플라즈마디스플레이 패널 |
TW200903160A (en) * | 2007-04-27 | 2009-01-16 | Sumitomo Chemical Co | Photosensitive resin composition |
JP5298653B2 (ja) * | 2007-07-06 | 2013-09-25 | Jsr株式会社 | 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子 |
US8399156B2 (en) * | 2007-07-26 | 2013-03-19 | Nippon Steel Chemical Co., Ltd. | Volume phase hologram recording material and optical information recording medium using the same |
WO2009076255A2 (en) | 2007-12-06 | 2009-06-18 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for making same |
CN104353457B (zh) | 2008-09-02 | 2017-05-24 | 日产自动车株式会社 | 废气净化用催化剂及其制造方法 |
JP5377021B2 (ja) * | 2009-03-23 | 2013-12-25 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP6054012B2 (ja) | 2009-03-31 | 2016-12-27 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板 |
CN102483571B (zh) * | 2009-09-10 | 2013-10-23 | 积水化学工业株式会社 | 感光性组合物及印刷布线板 |
JP5583941B2 (ja) * | 2009-09-30 | 2014-09-03 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
GB2476976A (en) | 2010-01-18 | 2011-07-20 | Lintfield Ltd | Protected aryl ketones and their use as photoinitiators |
JP5661293B2 (ja) * | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
JP2013522687A (ja) * | 2010-03-22 | 2013-06-13 | エルジー・ケム・リミテッド | 光硬化性及び熱硬化性を有する樹脂組成物、並びにドライフィルムソルダレジスト |
JP5285648B2 (ja) * | 2010-03-31 | 2013-09-11 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP5647910B2 (ja) * | 2011-01-31 | 2015-01-07 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子 |
US9822088B2 (en) | 2011-03-30 | 2017-11-21 | The United States Of America As Represented By The Administrator Of Nasa | Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor |
KR20130133304A (ko) * | 2011-04-08 | 2013-12-06 | 다이요 잉키 세이조 가부시키가이샤 | 감광성 조성물, 그의 경화 피막, 및 그것들을 사용한 프린트 배선판 |
JP5838200B2 (ja) * | 2011-04-13 | 2016-01-06 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板 |
KR101946646B1 (ko) * | 2011-05-30 | 2019-02-11 | 스미또모 가가꾸 가부시끼가이샤 | 경화성 수지 조성물 |
CN104010815B (zh) * | 2011-12-22 | 2016-08-17 | 太阳油墨制造株式会社 | 干膜及使用其的印刷电路板、印刷电路板的制造方法、以及倒装芯片安装基板 |
CN104704426A (zh) * | 2012-08-01 | 2015-06-10 | 株式会社Lg化学 | 具有光固化性能和热固化性能的树脂组合物及阻焊干膜 |
WO2014084190A1 (ja) * | 2012-11-27 | 2014-06-05 | 富士フイルム株式会社 | 光硬化性組成物、転写材料、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置並びにタッチパネル表示装置 |
KR101629942B1 (ko) * | 2013-06-12 | 2016-06-13 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물, 및 드라이 필름 솔더 레지스트 |
JP5639697B1 (ja) * | 2013-08-08 | 2014-12-10 | 東海神栄電子工業株式会社 | 識別文字・記号及び絵等の視認が可能な回路基板の製造方法 |
CN105467753B (zh) * | 2014-07-31 | 2020-01-14 | 太阳油墨(苏州)有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
JP6723788B2 (ja) * | 2016-03-31 | 2020-07-15 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
EP3824349A1 (en) | 2018-07-19 | 2021-05-26 | Lintfield Limited | Thioxanthone derivatives, composition comprising the same and pattern forming method comprising said composition |
JP6963047B2 (ja) * | 2019-02-22 | 2021-11-05 | 株式会社タムラ製作所 | 青色感光性樹脂組成物 |
WO2020203790A1 (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | フォトレジスト組成物およびその硬化物 |
GB202000736D0 (en) | 2020-01-17 | 2020-03-04 | Lintfield Ltd | Modified thioxanthone photoinitators |
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KR20030085031A (ko) * | 2001-03-23 | 2003-11-01 | 다이요 잉키 세이조 가부시키가이샤 | 활성 에너지선 경화성 수지, 이것을 함유하는광경화성ㆍ열경화성 수지 조성물 및 그의 경화물 |
JP4161683B2 (ja) * | 2001-11-01 | 2008-10-08 | 東レ株式会社 | 感光性セラミックス組成物 |
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US7232650B2 (en) | 2002-10-02 | 2007-06-19 | 3M Innovative Properties Company | Planar inorganic device |
-
2005
- 2005-07-06 KR KR1020077000229A patent/KR100845657B1/ko active IP Right Grant
- 2005-07-06 CN CN2005800226929A patent/CN1981237B/zh active Active
- 2005-07-06 WO PCT/JP2005/012494 patent/WO2006004158A1/ja active Application Filing
- 2005-07-06 JP JP2006528938A patent/JPWO2006004158A1/ja active Pending
- 2005-07-07 TW TW094123010A patent/TW200613910A/zh unknown
-
2007
- 2007-01-05 US US11/620,350 patent/US7585611B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI584070B (zh) * | 2012-04-23 | 2017-05-21 | 日立化成股份有限公司 | 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2006004158A1 (ja) | 2008-04-24 |
KR20070039531A (ko) | 2007-04-12 |
KR100845657B1 (ko) | 2008-07-10 |
CN1981237B (zh) | 2010-05-05 |
CN1981237A (zh) | 2007-06-13 |
WO2006004158A1 (ja) | 2006-01-12 |
US7585611B2 (en) | 2009-09-08 |
TWI376572B (zh) | 2012-11-11 |
US20070122742A1 (en) | 2007-05-31 |
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