TW200541396A - Flat panel display and manufacturing method thereof, and device for shaving outer part - Google Patents

Flat panel display and manufacturing method thereof, and device for shaving outer part Download PDF

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TW200541396A
TW200541396A TW094118342A TW94118342A TW200541396A TW 200541396 A TW200541396 A TW 200541396A TW 094118342 A TW094118342 A TW 094118342A TW 94118342 A TW94118342 A TW 94118342A TW 200541396 A TW200541396 A TW 200541396A
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outside
nozzle
solution
glass substrate
external
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TW094118342A
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Chinese (zh)
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TWI296897B (en
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Shintaro Yanagisawa
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Song Gi Hun
Shintaro Yanagisawa
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075Cleaning of glass
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present invention provides practical technology for enabling thickness reduction of a flat panel display. Electrodes 11 are formed on one of a pair of glass substrates 1. The glass substrates 1 are pasted together with sealing material 12. After sealing of the interior is carried out, an outer part shaving process is performed to remove outer part of the glass substrates 1 to reduce thickness. In the outer part shaving process, an solution liquid L made of hydrofluoric acid is jetted toward the outer part of the glass substrates 1, and the solution liquid L is jetted to the outer part of the glass substrates 1 with a pressure in the range of 0.5kg/cm<SP>2</SP> to 3.5kg/cm<SP>2</SP>. The outer part of the glass substrates 1 are solved by the solution liquid L and the outer part is removed by the chemical reaction of the solution L and the physical operation caused by the impact so as to reduce the thickness.

Description

.200541396 j 九、發明說明·· 【發明所屬之技術領域】 本發明係有關於液晶顯示器或電漿顯示器、有機電激 發光顯示器等平面顯示器之製造方法。 【先前技術】.200541396 j IX. Description of the invention ... [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a flat display such as a liquid crystal display, a plasma display, an organic electroluminescent display, and the like. [Prior art]

液晶顯示器與電漿顯示器等平面顯示器多用於電腦之 顯示裝置與Ί7顯示裝置、行動電話之顯示裝置等各種電子 產品。近來,有機電激發光顯示器的開發不斷地進二Flat-panel displays such as liquid crystal displays and plasma displays are used in various electronic products such as computer display devices, Ί7 display devices, and mobile phone display devices. Recently, the development of organic electroluminescent displays has continued to progress.

/ 月!J 景相當看好。其中上述有機電激發光顯示器具有高應答速 度以及不需要背光源就可以自己發光。 上述平面顯示器的重要課題之一就是薄型化的要求。 所谓的薄型化就是連同被搭載的電子產品也要薄型化與小 型化以及輕量化。例如,筆記型電腦與攜帶電話更要求薄 型化與輕里化,因此平面顯示器必須要朝輕薄化發展。 為了要將平面顯示器薄型化與輕量化,其中玻璃基板 是最重要的一個要素。在液晶顯示器、電漿顯示器、有播 電激發光顯示器中,老β H + ^ Λ 、 中^在—對貼合的玻璃基板之間配置 玻璃基板的比重很大’而且為了碎保機械 砂. ^ 的厚度。因此,玻璃基板對平面顯示 器之薄型化與輕量化的要欠 &quot;、 妁要衣上造成一定程度的限制。 多數的平面顯示器之製程中,都是從大尺 玻璃基板切割許多小尺寸的平面顯示器。並且在一對大: 寸的玻璃基板中依不同用途於不同區域形成晝素電極。: 5147-7143-PF;Forever769 5 .200541396 進行完貼合工程之後,就會進行玻璃基板的切割製程。 在上述的製程中,由於製程相當密集且製造成本低 廉,因此玻璃基板朝向大型化發展。例如,在液晶顯示器 的製程中,使用220Ommx 1 800mm左右的基板。如此大的基 板在搬運的時候,如果玻璃基板的厚度不夠厚則會很容易 破裂,而且因為本身的重量也會使得玻璃基板呈現彎曲。 因此,必須要具有相當程度的厚度。 另外,經過切割製程之後的半成品或成品的時候,玻 璃基板的厚度如果很薄的話,因為尺寸較小的關係也不會 發生問題。由於上述原因,於特開平5一249422號公報之發 明中,在貼合一對玻璃基板後,將其中一面玻璃基板之外 部進行蝕刻以減少其厚度,之後再進行切割製程。 【發明内容】 上述公報所述之發明中,並由 如θ τ 具甲上述蝕刻製程係將玻璃/ Month! J King is quite optimistic. The above organic electroluminescent display has a high response speed and can emit light by itself without requiring a backlight. One of the important issues of the flat panel display described above is the requirement for thinning. The so-called thinness means that the electronic products to be mounted must also be thinner, smaller, and lighter. For example, notebook computers and mobile phones require thinner and lighter phones, so flat-panel displays must be made thinner and lighter. In order to reduce the thickness and weight of a flat display, a glass substrate is one of the most important elements. In the liquid crystal display, plasma display, and electric excitation light display, the old β H + ^ Λ, middle ^-the proportion of the glass substrate placed between the pair of laminated glass substrates is very large 'and to protect the mechanical sand. ^ thickness of. Therefore, the thinness and lightness of the flat panel display due to the glass substrate owes a certain degree of limitation to the clothing. In most flat display manufacturing processes, many small flat displays are cut from large glass substrates. And a pair of large: inch glass substrates are used to form day electrodes in different areas according to different uses. : 5147-7143-PF; Forever769 5 .200541396 After the bonding process is completed, the glass substrate cutting process will be performed. In the above-mentioned manufacturing process, since the manufacturing process is relatively intensive and the manufacturing cost is low, the glass substrate is developing toward large-scale. For example, in the manufacturing process of a liquid crystal display, a substrate of about 220 mm x 1 800 mm is used. When such a large substrate is transported, if the thickness of the glass substrate is not thick enough, it will be easily broken, and the glass substrate will also be bent due to its own weight. Therefore, it must have a considerable thickness. In addition, when the semi-finished product or finished product after the cutting process is used, if the thickness of the glass substrate is thin, there is no problem due to the small size. For the above reasons, in the invention disclosed in Japanese Unexamined Patent Publication No. Hei 5-249422, after bonding a pair of glass substrates, the outside of one of the glass substrates is etched to reduce its thickness, and then the cutting process is performed. [Summary of the Invention] In the invention described in the above publication, glass is formed by the above-mentioned etching process such as θ τ

基板浸於溶解液之中。但是,根據本發明之發明人的研究, 上述蝕刻的方法’ ϋ沒有辦法得到相當好的平坦性,因此 沒有辦法十分充分地確認平面顯示器的品f。關於此點, 說明如下。 如前述公報之内容所述,僅揭露浸潰法的内容,但是 究竟使用何種的蝕刻液,並沒有具體的說明。本發明之發 明人的研究指出,㈣氟酸作為蝕刻液。但是,:果將‘ 璃基板浸潰於氟st中,並不能達到平面顯示器所要求之平 坦性,因此很難進行前述公報所提之蝕刻法。 5147-7143-PF;Forever769 6 200541396 一旦將玻璃基板浸潰於氟酸中,表面之玻璃會與I酸 反應而慢慢地軟化溶解。若要將蝕刻後之表面平坦化的 話,必須以新鮮、未反應的蝕刻液取代反應後的蝕刻液, 且均一地供給在玻璃基板表面。但是,在浸潰法中則相當 的困難。雖然必須將蝕刻液以及經過反應之後軟化溶融之 玻璃材料去除,並供給下層玻璃新鮮的蝕刻液,但是由於 要均一地去除軟化溶融之玻璃材料是非常困難,因此蝕刻 後之玻璃表面的平坦性非常的差。 另外’玻璃基板的組成與結晶狀態並非是完全均〜 地,不均一的情形在所難免。使用浸潰法的蝕刻製程中, 僅僅利用化學作用,很容易受到玻璃組成與結晶不均一性 的衫#。也就是說,局部的玻璃由於組成與結晶狀態不岣 一的緣故’因此不易被#刻而造成殘留的現象。所以會對 平坦性造成影響。玻璃基板之外部的平坦性不均的時候, 很容易引起由光散射所造成之顯示不均的現t,因此上述 Φ 採用浸潰法之蝕刻方式並不實用。 本發明同樣為了解決相關的課題, 顯示器之薄型化的實用技術。 種十面 為了解決上述問題,申請專利範圍1所記载之發明係 平面顯示器之製造方法,包括:電極形成製程,❹在_ 對基板之至少-方上形成電極,纟中該基板之—或雙方 玻璃基板;封裝製程,用於在電極形成製程後利用封膠材 科將該對基板封裝;外部賴製程,料㈣製 該對玻璃基板之-方或雙方的厚度;其特徵在於:該外= 5147-7143-PF;Forever769 7 200541396 中,利用可以溶解該玻璃基板之外部材料的溶解 :、者该外部喷射,以大於重力加速度之加速度對著該外 ^噴射’衝擊該外部,因此由於溶解液之化學作用加上衝 、成之物理作用而將該外部溶解,並削減該外部之厚 2所記载之 3所記載之 °·5kg/cm2 另外,為了解決上述問題,申請專利範圍 發明揭露:該溶解液是氟酸。The substrate is immersed in the solution. However, according to the study by the inventors of the present invention, the above-mentioned etching method ′ ϋ does not provide a fairly good flatness, and therefore there is no way to confirm the quality f of the flat panel display sufficiently. This point is explained below. As described in the aforementioned bulletin, only the contents of the dipping method are disclosed, but exactly which etching solution is used is not specifically described. Studies by the inventors of the present invention have pointed out that gadofluoric acid is used as an etchant. However, if the glass substrate is immersed in fluorine st, the flatness required for a flat display cannot be achieved, so it is difficult to perform the etching method mentioned in the aforementioned publication. 5147-7143-PF; Forever769 6 200541396 Once the glass substrate is immersed in hydrofluoric acid, the glass on the surface will react with the I acid to soften and dissolve slowly. To flatten the surface after etching, it is necessary to replace the etching solution after the reaction with a fresh, unreacted etching solution and supply it uniformly on the surface of the glass substrate. However, it is quite difficult in the impregnation method. Although it is necessary to remove the etching solution and the softened and melted glass material after the reaction, and provide fresh etching solution for the lower glass, it is very difficult to uniformly remove the softened and melted glass material, so the flatness of the glass surface after etching is very Bad. In addition, the composition and crystalline state of the 'glass substrate are not completely uniform, and unevenness is inevitable. In the etching process using the dipping method, it is easy to be affected by the heterogeneity of the glass composition and the crystal # by using only chemical action. That is to say, local glass is not easy to be engraved and cause a residual phenomenon because the composition and crystal state are different. So it will affect the flatness. When the flatness of the exterior of the glass substrate is uneven, it is easy to cause the display unevenness caused by light scattering. Therefore, the above-mentioned etching method using the dipping method is not practical. The present invention is also a practical technique for reducing the thickness of a display in order to solve the related problems. In order to solve the above problems, the invention described in the patent application 1 is a method for manufacturing a flat display, including: an electrode forming process, forming an electrode on at least one of the pair of substrates, and one of the substrates—or Both glass substrates; a packaging process for packaging the pair of substrates with an encapsulant material branch after the electrode forming process; an external manufacturing process to fabricate the thickness of one or both sides of the pair of glass substrates; = 5147-7143-PF; Forever769 7 200541396, the dissolution of the external material that can dissolve the glass substrate: the external spray, impacting the exterior with an acceleration greater than the acceleration of gravity ^ jet 'impacts the exterior, so due to the dissolution The chemical action of the liquid plus the physical action of punching and forming dissolves the exterior, and reduces the thickness of the exterior by 5 ° / 5 kg / cm2 as described in 2 and 3. In addition, in order to solve the above problems, apply for a patent scope disclosure : This solution is hydrofluoric acid.

另卜為了解決上述問題,申請專利範圍 表月揭路·該溶解液對該外部之衝擊壓力係介於 至 3· 5kg/cm2 之間。 另外, 發明揭露: 板保持靜止 ^ 了解決上述問題,中請專利範圍4所記载之 溶解液在噴射時與該外部呈垂直狀態,且該美 狀態。 土In addition, in order to solve the above-mentioned problems, the scope of the patent application is revealed. The impact pressure of the solution on the outside is between 3.5 kg / cm2. In addition, the disclosure of the invention: the plate remains stationary ^ solves the above problem, the solution described in patent claim 4 when sprayed is perpendicular to the outside and beautiful. earth

另外,為了解決上述問題 發明揭露··該貼合之玻璃基板 體之厚度變薄。 ’申請專利範圍5所記载之 之雙方的外部同時削減,整 6所記載之 而且該喷嘴 1 0 0mm之間。 7所記載之 各噴射孔係 另外,為了解決上述 發明揭露:外部削減裝置 另外,為了解決上述問題,申請專利範圍 發明揭露:該溶解液係由噴嘴之喷射孔喷出, 之噴射孔至該基板之外部的距離係介於5咖至 另外,為了解決上述問題,申請專利範圍 發明揭露:該溶解液係由喷嘴之喷射孔噴出, 等距設置’且各喷射孔至料部的距離皆相等 門題,申请專利範圍8所記載之 ,用於削減平面顯示器之玻璃基 5147-7143 _P:FzF〇rever769 8 200541396 板之外部的厚度,包括··處理室,用於進行外部削減處理; 基板保持具,用於將該玻璃基板保持在處理是内之預定位 置上,具有喷射孔之喷嘴,用於將溶解液喷射在固定於基 板保持具上之該玻璃基板之外部;溶解液供給系統,用於 供給溶解液至喷嘴;其特徵在於··該溶解液供給系統係以 特定之壓力將溶解液供給至該喷嘴,其中在該壓力下溶解 液以大於重力加速度之加速度噴射至該外部以衝擊該外 部,因而利用溶解液之化學作用m衝擊所引起之物理作 ®用而將該外部溶解並削減厚度。 另外,為了解決上述問題,申請專利範圍9所記載之 發明揭路·該溶解液是氟酸。 另外’為了解決上述問題,中請專利範圍i Q所記載之 發明揭露:該供給系統在介於05kg/cm2至35kg/cm2之壓 力下將該溶解液供給至該噴嘴,以使得該溶解液由該嗔嘴 之喷射孔噴射至該玻璃基板之外部而衝擊該外部。In addition, in order to solve the above-mentioned problems, the invention is disclosed. The thickness of the bonded glass substrate body is reduced. The externalities of both of the nozzles described in the scope of the patent application 5 are reduced simultaneously, and the nozzles of the nozzles are between 100 mm and 6 mm. In addition, in order to solve the above-mentioned invention disclosure, each of the injection holes described in 7: an external reduction device. In addition, in order to solve the above-mentioned problems, the invention disclosed in the scope of the patent application discloses that the dissolving liquid is ejected from the injection hole of the nozzle, and the injection hole is to the substrate. The distance from the outside is between 5 ° C. In addition, in order to solve the above-mentioned problems, the invention of the patent application discloses that the dissolving liquid is sprayed from the spray holes of the nozzle, and is equidistantly set, and the distances from the spray holes to the material are equal. Problem, as described in the scope of patent application 8, for reducing the glass substrate of flat display 5147-7143 _P: FzFror769 8 200541396 The external thickness of the board, including the processing chamber for external reduction processing; substrate holder For holding the glass substrate at a predetermined position within the processing chamber, and a nozzle with a spray hole for spraying a solution on the outside of the glass substrate fixed on the substrate holder; a solution supply system for Supplying a dissolving liquid to a nozzle; characterized in that the dissolving liquid supply system supplies the dissolving liquid to the nozzle at a specific pressure, Wherein, under the pressure, the dissolving liquid is sprayed to the outside at an acceleration greater than the acceleration of gravity to impact the outside. Therefore, the physical action of the dissolving liquid caused by the impact m is used to dissolve the outside and reduce the thickness. In addition, in order to solve the above-mentioned problems, the invention disclosed in Patent Application No. 9 discloses the solution. The solution is hydrofluoric acid. In addition, in order to solve the above-mentioned problem, the invention disclosed in the patent range i Q is disclosed: the supply system supplies the dissolving solution to the nozzle under a pressure between 05kg / cm2 and 35kg / cm2, so that the dissolving solution is supplied by The nozzle of the nozzle is sprayed to the outside of the glass substrate and impacts the outside.

發明揭露 另外’為了解決上述問題,申請專利範圍㈣記載之 定並使得溶解液與該外部呈垂直狀態 該基板保持具與溶解液喷射時,將玻璃基板固 另外’為了解決上述問題,申請專利範圍12所記載之 發明揭露:為了同時削減貼合之該對玻璃基板之外部,該 喷嘴設置在被固定於基板侔姓目* # μ ^ 、 ’、寺,、之該對玻璃基板的兩側。 另外’為了解決上述問題,中請專利範圍13所記載之 發明揭露·在開始進行削、、或制 士 減1粒時該噴嘴之喷射孔至該玻 璃基板之外部的距離係介於5咖至1〇〇mm之間。 5147-7143-PF;Forever769 9 -200541396 另外為了解决上述問題,申請專利範圍Η所記載之 發明揭露:該喷射孔係以笠花#堪 ^ ^ τ 乂等距设置’而且各噴射孔至該外 部之距離皆相等。 另外為了解決上述問題,申請專利範圍i 5所記载之 發明揭露:平面顯示器,具有-對已經貼合之玻璃基板, 且該對玻璃基板之内部具有光穿透控制部或發光部;其特 徵在於:該對玻璃基板之外部被溶解液喷射,其中該溶解 液係利用大於重力加速度之加速度喷射至該外部以衝擊該 籲外部而削減該外部之厚度,其中最頂部與最底部之距料 於0· 1微米,因此該平面顯示器具有良好之平坦性。 如下列之說明,根據本發明之申請專利範圍第五項或 8項所述之發明,新鮮(沒有融人外部材料)的溶解液依序 地供給’因為融入外部材料之溶解液由於衝擊的關係依序 地流出’因而可以進行效率良好且均—性良好的削減製 程。即使外部之玻璃的組成與結晶狀態有不均一的地方, φ但是由於併用物理作用的緣故,可以充分均一地削減。由 於上述緣故,削減外部的平坦性提高了,所製作出的平面 顯不器之顯不性能也提高了。 另外,根據申請專利範圍第3或10項所述之發明,除 了上述效果之外’ Χϋ為溶解液衝擊上述外部的壓力介於 0.5kg/Cra2至3.5kg/cm2之間’不但可以充分地供給新鮮的 溶解液而削減玻璃基板之外部,又因為可以充分地利用物 理作用,所以即使玻璃之組成或結晶狀態不均一也可以充 分地削減玻璃基板的外部,而且可以確保提高平扭性 5147-7143-PF;Forever769 10 .200541396 另外,根據申請範圍第4或1 1項所述之發明,除了上 述效果之外,在噴射溶解液的時候玻璃基板外部與溶解液 呈垂直狀態,因此可以促進玻璃基板外部之溶解液的置換 效果,可以十分有效率地進行外部削減製程。 另外,根據申請範圍第5或1 2項所述之發明,除了上 述效果之外’在已經貼合之一對玻璃基板的外部同時進行 削減製程,因此整體的厚度就變薄了,所以除了有助於已 經貼合之面板的薄型化要求之外,也可以提高製程的生產 另外’根據申睛範圍第6或1 3項所述之發明,除了上 述效果之外,於削減製程開始的時候喷嘴之噴射孔至基板 外部的距離係介於5mm至1 〇 〇匪之間,因此可以確保衝擊 i也均—十生0 另外,根據申請範圍第7或14項所述之發明,除了上 述效果,噴嘴之各喷射孔均等間隔設置,而且各噴射孔至 ♦外部的距離皆相同的緣故,所以可以很均-地控制噴射之 溶解液的衝擊廢力,由於上述的緣故可以提高平坦性並有 利於削減處理。 因為提供薄 化與輕量化 因而可以提 另外’根據申請範圍第1 5項所述之發明, 型化之顯示器,所以對應用之電子製品的薄型 相當有貢獻,另外因為提高了平坦性的緣故, 供顯示不均之缺陷較少且具有優越性能的製品 【實施方式】 5147-7143-PF;F〇rever769 11 .200541396 以下,說明本發明之較佳實施例。 平面的說明中’據液晶顯示器(以下,簡稱_為 千面顯不器的一個例子作為說明。 第1圖係緣示根據本發明一 λα制4 +丄 孕乂佳只施例之平面顯示器 的製造方法。在第1圖之Disclosure of the invention In addition, in order to solve the above-mentioned problems, the scope of the application for patents is determined and the dissolved solution is perpendicular to the outside. When the substrate holder and the dissolved solution are sprayed, the glass substrate is fixed separately. The invention disclosed in 12 discloses: in order to reduce the outside of the pair of glass substrates to be attached at the same time, the nozzle is provided on both sides of the pair of glass substrates fixed to the substrate 侔 侔 目 * # μ ^, ', temple, and the like. In addition, in order to solve the above-mentioned problems, the invention disclosed in Patent Range 13 is required to disclose the distance between the spray hole of the nozzle and the outside of the glass substrate when cutting is started, or when the master is reduced by one. 100mm. 5147-7143-PF; Forever769 9 -200541396 In addition, in order to solve the above-mentioned problems, the invention disclosed in the scope of application for patent disclosure: the spray holes are set at an equal distance with 笠 花 # 堪 ^ ^ τ 乂 and each spray hole is to the outside The distances are all equal. In addition, in order to solve the above-mentioned problems, the invention disclosed in the application patent scope i 5 discloses: a flat display having a pair of glass substrates that have been bonded, and the pair of glass substrates has a light transmission control part or a light emitting part inside; The reason is that the outside of the pair of glass substrates is sprayed with a dissolving liquid, wherein the dissolving liquid is sprayed to the outside with an acceleration greater than the acceleration of gravity to impact the outside and reduce the thickness of the outside. The distance between the top and bottom is at 0.1 micron, so the flat display has good flatness. As described below, according to the invention described in the fifth or eighth aspect of the patent application scope of the present invention, fresh (without melting external materials) dissolving solution is sequentially supplied 'because the dissolving solution incorporating external materials is due to impact Sequential outflow 'can therefore be performed with a highly efficient and uniform reduction process. Even if the composition and crystal state of the external glass are not uniform, φ can be sufficiently uniformly reduced due to the combined use of physical effects. Because of the above, the flatness of the exterior is reduced, and the display performance of the manufactured flat display device is also improved. In addition, according to the invention described in item 3 or 10 of the scope of the patent application, in addition to the above effects, 'Xϋ is the impact of the solution on the external pressure between 0.5kg / Cra2 and 3.5kg / cm2', which can not only provide sufficient supply The fresh solution can reduce the outside of the glass substrate, and because the physical action can be fully utilized, the outside of the glass substrate can be sufficiently reduced even if the composition or crystal state of the glass is not uniform, and the flat twist property can be improved. 5147-7143 -PF; Forever769 10 .200541396 In addition, according to the invention described in item 4 or 11 of the scope of application, in addition to the above effects, the outside of the glass substrate is perpendicular to the solution when the solution is sprayed, so the glass substrate can be promoted. The external dissolving liquid can effectively perform the external reduction process. In addition, according to the invention described in the 5th or 12th of the scope of application, in addition to the above-mentioned effects, the process of reducing the outside of the glass substrate is performed simultaneously on one of the already bonded, so the overall thickness becomes thinner. In addition to helping to reduce the thickness of laminated panels, the production of the process can also be improved. In addition, according to the invention described in item 6 or 13 of the Shin-eye range, in addition to the above effects, the nozzle is reduced at the beginning of the process. The distance from the spray hole to the outside of the substrate is between 5mm and 100mm. Therefore, it is possible to ensure that the impact i is even-ten years. In addition, according to the invention described in the 7th or 14th application scope, in addition to the above effects, The spray holes of the nozzle are arranged at equal intervals, and the distance from each spray hole to the outside is the same. Therefore, the impact waste force of the sprayed solution can be controlled very evenly. Because of the above, it can improve the flatness and be beneficial to Cut processing. Because it provides thinness and light weight, it is possible to add another 'typed display according to the invention described in item 15 of the application scope, so it contributes significantly to the thinness of the applied electronic products, and because it improves the flatness, For products with less uneven display defects and superior performance [Embodiment] 5147-7143-PF; Forever769 11 .200541396 The following describes preferred embodiments of the present invention. In the description of the plane, according to the liquid crystal display (hereinafter, abbreviated as _ is an example of a thousand-face display device as an illustration. Figure 1 is a diagram illustrating a flat display according to the present invention, a λα 4 + Manufacturing method. In Figure 1

έ中例如疋行動電話用的LCD 的製造方法。如篦彳同私一 …一弟圖所不之方法’包括:電極形成製程, 用於在一對基板丨之至少一 上七成電極11,其中該基板 1之一或雙方是破璃基板;封駐制# #裝製転,用於在電極形成製 Μ利用封膠材料12將該對基板1封裝,並注入液晶13; 外Μ減製程,用於封襄製程後削減該對玻璃基板】之一 方或雙方的厚度。 如第1圖所示之製造方法 &lt;乃古,仗大致上相同形狀且相同 大小之一對玻璃基板1中產Ψ说垂▲ Απ τ 低上甲產出稷數個LCD。上述一對之玻 璃基板1係根據所產出之各La沾田、 的用途而進形步同的電極 形成製程’其中上述電極形成劁 成裳私係在相關區域中進行。 上述電極形成製程包括:透 攻月鬼極形成製程以及驅動 電極與共通電極的形成製 衣狂具中上述透明電極係由ιτο 所組成之透明導電膜形忐, 、 上述驅動電極與共通電極係 藉由電漿化學氣相沉積法所製造 1衣w之低皿多晶矽膜所組成。 在上述各製程中’包括曝光,顯影,蝕刻等微影蝕刻製程。 外一個玻璃基板1上方則進行彩色遽光片製程。上述 採色濾'光片製程就是在玻璃基板i上面形成顏色層與黑色 矩陣層以及透明電極。上M ^…、 逑顏色層的形成方法包括微影 法、印刷法、或電著法,以形成顯示彩色影像的顏料圖案。 5147-7l43-PF;Forever769 12 200541396 上黑色矩陣層係沿著晝素之間的部分而形成之遮 於“對比與防止混色,在多數的場合 、:用 而形成。上述透明電極在多數 ’、θ —化製程 形成之m旗。 夕數的、合係利用圖案化製程而 ,材::程中,在其中-個破璃基板〗的表面上圓部封 =二上述封裝材料]2係沿著所產出之 : 廓而塗佈。在上述封裝材料 輪 旦的广曰彳Q 2所包圍之内側區域内滴下定 Γ:::之後,散佈間隙子,並在預定的位置上與另 外一個玻璃基板i對準合貼合。 另 接著,進行本實施例之特徵-外部削減製程。在本實施 例之外部削減製程中,將可溶解玻璃基板1之外部材 溶解液L對著外部噴射,其中溶解液L以大於重力加速度 之加速度對著外部喷射。利用溶解液L喷射的結果,溶解 液L的化學作用加上喷射所造成之物理作用而將外部溶 解。而且’本實施例並不是單單地散佈溶解液l,而且其 喷射的加速度也不僅僅相者私舌 个值彳皇祁田於重力加速度,這是最大的不 同處。 而且,在本說明書中,一對基板相互面對的内側稱為 内部,而與内部相反的則稱為外部。在本實施例之外部削 咸耘中扣的疋將已經貼合的一對玻璃基板(以下,稱為 已經接貼合的面板10)之雙方的外部削減的製程。 如第1圖所示,在本實施例中,將已經接貼合的面板 1 〇保持直立,然後在已經接貼合的面板1 〇的兩側配置喷 鳴4,並由喷嘴4喷射出溶解液l。上述溶解液[可以使用 5147-7143-PF;Forever7 6 9 13 200541396 氟鲅。上述氟酸經與水稀釋後之濃度約介於至 (體積百分率)。作用於已經接貼合的面板1G之外部上的衝 擊壓力係介於〇.5kg/cy至3.5kg/cm2之間。 由噴嘴4所喷射出溶解液[衝擊在已經接貼合的面板For example, a method for manufacturing an LCD for a mobile phone. For example, a method that is not shared by the same person ... includes: an electrode forming process for forming 70% of the electrodes 11 on at least one of a pair of substrates, wherein one or both of the substrates 1 are glass-breaking substrates;封住 制 # # 装 制 転, used to seal the pair of substrates 1 with an encapsulant material 12 in the electrode formation system and inject liquid crystal 13; the outer M reduction process is used to reduce the pair of glass substrates after the sealing process] One or both thicknesses. The manufacturing method shown in FIG. 1 &lt; Nagou, one of the LCDs 1 produced in the glass substrate 1 having substantially the same shape and the same size ▲ Απ τ produces several LCDs. The above-mentioned pair of glass substrates 1 are formed in the same electrode formation process according to the purpose of each produced La Latian, wherein the above-mentioned electrode formation is performed in a relevant area. The above-mentioned electrode forming process includes: a through-the-moon ghost pole forming process and a driving electrode and a common electrode. In the manufacturing tool, the transparent electrode is a transparent conductive film formed by ιτο, and the driving electrode and the common electrode are borrowed. It consists of a low-poly polycrystalline silicon film made by plasma chemical vapor deposition. In each of the above processes, 'includes a photolithographic etching process such as exposure, development, and etching. Above the outer glass substrate 1, a color phosphor film process is performed. The above-mentioned color filter process is to form a color layer, a black matrix layer, and a transparent electrode on the glass substrate i. The formation method of the upper M ^, 逑 color layer includes a lithography method, a printing method, or an electronic writing method to form a pigment pattern displaying a color image. 5147-7l43-PF; Forever769 12 200541396 The black matrix layer is formed along the part between the day and day, and is covered by "contrast and prevention of color mixing. In most cases, it is used. The above-mentioned transparent electrodes are in most ', θ —m flag formed by the chemical process. The number and combination use the patterning process, and the material is: in the process, the round seal on the surface of one of the broken glass substrates = two of the above packaging materials] 2 system along Produced by: coating on the surface. After the titration of Γ ::: in the inner area surrounded by the above-mentioned encapsulation material Q 2 Q2, the gaps are spread, and at a predetermined position with another one The glass substrate i is aligned and bonded. Next, the external reduction process, which is a feature of this embodiment, is performed. In the external reduction process of this embodiment, the external material dissolving liquid L that dissolves the glass substrate 1 is sprayed toward the outside, The dissolving liquid L is sprayed toward the outside at an acceleration greater than the acceleration of gravity. The result of spraying the dissolving liquid L is that the chemical action of the dissolving liquid L plus the physical effect caused by the spraying will dissolve the outside. And 'this embodiment is not Dispersion of the dissolving liquid l alone, and the acceleration of its spray is not only the value of each other. This is the biggest difference between gravitational acceleration. Moreover, in this specification, a pair of substrates face each other. The inside is called the inside, and the opposite is called the outside. In this embodiment, a pair of glass substrates (hereinafter, referred to as a bonded panel 10) will be bonded together. As shown in Fig. 1, in this embodiment, the panel 10 that has been bonded is kept upright, and then the blasting is arranged on both sides of the panel 10 that is already bonded. And the dissolving solution l is sprayed from the nozzle 4. The dissolving solution [5147-7143-PF; Forever7 6 9 13 200541396 can be used. The concentration of the above-mentioned hydrofluoric acid after dilution with water is about (volume percentage). The impact pressure on the outside of the bonded panel 1G is between 0.5 kg / cy and 3.5 kg / cm2. The dissolving solution ejected by the nozzle 4 [impact on the bonded panel

之外部後’由於溶解液k化學作用而溶解已經接貼合 '板之外°卩,而外部上的溶解液L·也由於溶解液衝擊 々關係而往下。目此,外部的厚度被削減,所以玻璃基 板1的厚度(已經接貼合的面板10之全體厚度)變薄。 的時候,上述保護膠帶可以是聚丙浠(PGlyprcwiene)、或 鐵氟龍(註冊商標)等含氟樹脂之耐酸性玻片中塗佈有數十 微米厚的黏著劑之材料。例如,曰東電工股份有限公司所 製造之SPV-362M等。 進行削減製程的時候,為了不碰觸溶解液L,可以貼 附保護膠帶(masking tape)作為保護。t溶解液l是強酸 在上述外部削減製程後,進行外部洗淨製程並進行切 割製程。上述切割製程係沿著產出之各LCD的輪廟,將1〇 切割之製程。 根據上述之本貫施例的製造方法 為利用可以溶解 , 9 ^ / N 4 該玻璃基板1之外部材料的溶解㈣著該外部喷射,並以 大於重力加速度之加速度對著該外部噴射,以衝擊該:卜 部’藉由溶解液之化學作用加上衝擊所造成之物理作用而 將該外部溶解,並削減該外部之厚度;而新鮮(沒有融入外 部材料)的溶解液依序地供給.,因為融入外部祌料之 由於衝擊的關係依序地流出,因而可以 彳 逆仃效率良好且均 5147-7143-PF;Forever769 14 •200541396 一性良好的削減製程。即使外部之玻璃的組成與結晶狀態 有不均一的地方,但是由於併用物理作用的緣故,可以充 刀均地削減。由於上述緣故,削減外部的平坦性提高了, 所製作出的平面顯示器之顯示性能也提高了。 接著,說明適用於上述製造方法之外部削減裝置。以 下的說性係包括外部削減裝置的一較佳實施例。After the exterior ’, the dissolution solution has been bonded to the outside of the plate due to the chemical action of the dissolution solution k, and the dissolution solution L · on the outside is also lowered due to the impact of the dissolution solution. As a result, the thickness of the exterior is reduced, so that the thickness of the glass substrate 1 (the entire thickness of the pasted panel 10) becomes thin. In this case, the protective tape may be made of PGlyprcwiene or Teflon (registered trademark) or other fluorine-containing resin acid-resistant glass coated with an adhesive having a thickness of tens of microns. For example, SPV-362M manufactured by Yuedong Denko Co., Ltd. and the like. During the reduction process, a masking tape can be attached to protect the solution L from contact. The dissolving solution l is a strong acid. After the external reduction process described above, an external washing process is performed and a cutting process is performed. The above cutting process is a process of cutting 10 along the wheel temples of each produced LCD. The manufacturing method according to the above-mentioned embodiment is to dissolve 9 ^ / N 4 by dissolving the external material of the glass substrate 1 against the external jet, and spray the external jet with an acceleration greater than the acceleration of gravity to impact the external jet. The: Bubu 'dissolves the outside by the chemical action of the dissolving solution plus the physical effect caused by the impact, and reduces the thickness of the outside; and the fresh (without incorporating external materials) dissolving solution is sequentially supplied, because The external materials are sequentially discharged due to the impact of the impact, so they can be reversed with good efficiency and are all 5147-7143-PF; Forever769 14 • 200541396 Good reduction process. Even if the composition and crystalline state of the external glass are not uniform, the physical effect can be used to reduce the blade uniformly. Due to the above, the flatness of the exterior is reduced, and the display performance of the manufactured flat display is also improved. Next, an external reduction device suitable for the manufacturing method will be described. The following description is a preferred embodiment including an external reduction device.

第2圖係繪不根據本發明一較佳實施例之外部削減裝 置之正面示意圖。第3圖係繪示第2圖所示之裝置之側面 剖面示意圖。在第2圖以及第3圖所示之外部削減裝置中, 包括··處理室2,用於進行外部削減處理;基板保持具3, 用於將該玻璃基板1保持在處理室2内之預定位置上;具 有喷射孔之喷嘴4,用於將溶解液L噴射在固定於基板保 持具3上之該玻璃基板1之外部;溶解液供給系統5,用 於供給溶解液L至喷嘴4 ;其中該溶解液供給系統5係以 特定之壓力將溶解液L供給至該喷嘴4。在此實施例中, 為了在貼合製程後進行外部蝕刻製程,上述基板保持具3 係用於固定已經貼合之面板1 〇。 口 22 ;其中上述搬入 而上述搬出口 22用於 以及搬出口 22係由封 封鎖閘門2 3移動之方 2之紙面垂直方向)。 處理室2具有搬入口 21與搬出 口 21用於搬入已經貼合之面板1 〇, 搬出已經貼合之面板10。搬入口 21 鎖閘門23來控制開關狀態。而且, 向係與搬送方向垂直之水平方向(圖 处掀迗機構30甩於將已 設置搬送機構 貼合之面板ίο運送通過搬入口 21以及搬出口 22。基板保 5147-7143-PF;Forever769 15 200541396 持具3係構成搬送機構3Q的部分㈣。第4圖料示第2 及3时所示之裝置中基板保持具3之斜視示意圖。 第4圖所不,基板保持具3用於將已經貼合之面板 10保持在垂直站立的狀態。基板保持具3主要由水平之底 板3卜設置於底板31上之支柱32、|置於支柱32上的緩 衝具33所構成。Fig. 2 is a schematic front view of an external reduction device not according to a preferred embodiment of the present invention. Figure 3 is a schematic side sectional view of the device shown in Figure 2. The external reduction device shown in FIGS. 2 and 3 includes a processing chamber 2 for performing external reduction processing, and a substrate holder 3 for holding the glass substrate 1 in a predetermined position in the processing chamber 2. Position; nozzle 4 with spray holes for spraying the solution L on the outside of the glass substrate 1 fixed to the substrate holder 3; solution supply system 5 for supplying the solution L to the nozzle 4; The dissolving liquid supply system 5 supplies the dissolving liquid L to the nozzle 4 at a specific pressure. In this embodiment, in order to perform an external etching process after the bonding process, the above-mentioned substrate holder 3 is used to fix the panel 10 already bonded. Port 22; where the above-mentioned move-in is used and the above-mentioned move-out port 22 is used and the move-out port 22 is perpendicular to the paper surface of the square 2 moved by the sealing gate 23. The processing chamber 2 has a loading inlet 21 and a loading outlet 21 for carrying in the bonded panels 10 and carrying out the bonded panels 10. The entrance 21 is locked to the gate 23 to control the switch state. Moreover, the horizontal direction is perpendicular to the conveying direction (the lifting mechanism 30 in the figure is thrown to the panel where the conveying mechanism is attached, and is conveyed through the conveying inlet 21 and the conveying outlet 22. Substrate security 5147-7143-PF; Forever769 15 200541396 The holder 3 is part of the conveying mechanism 3Q. Figure 4 shows a schematic perspective view of the substrate holder 3 in the device shown in the second and third hours. Not shown in Figure 4, the substrate holder 3 is used for The attached panel 10 is kept in a vertical standing state. The substrate holder 3 is mainly composed of a horizontal bottom plate 3 and a pillar 32 provided on the bottom plate 31, and a buffer 33 placed on the pillar 32.

支柱32主要設置在細長的長方形之底板的四個角 :部分上4計4個。喷射孔34沿著底板Μ之長邊方向 又置且係在支柱32的上端而補強基板保持具各支柱 32比已經貼合之面板1〇稍微高一點。位於底板μ之短邊 上的兩根支柱32之間的間隔比已經貼合 務微大—點。_位在底板31之長邊方向上的兩支支柱 的間比已經貼合之面板j。的長度稍微長一點。已經貼合 之面板1 G則是被固定在四支支柱所圍出的空間。 缓衝八3 3疋直接接觸已經貼合之面板^ Q的零件,以 固定以接合之面板1Ge緩衝具33係由不會被溶解液^斤 腐=之材料所構成(耐藥性佳的村料),❹是鐵I龍(註冊 商標)之氟素樹脂所組成之材料。 如第4圖所示,緩衝具33設置於底板31之長邊方向 的兩端上並與各支柱之下端聯繫,同時也設置於底板31之 長邊方向之兩端上並與各支柱32的上端相聯繫。已經貼合 之面板10纟與上述緩衝具之各角落接觸。已經貼合之面板 1 〇的下端角部接觸之下側的緩衝貧33中,,短邊方向的剖 面形狀呈現凹狀而長邊方向的剖面形狀呈現[字型狀。二 5147-7143-PF;Forever769 16 200541396 外,與已經at人々工, 一 6 板1 〇上端角落接觸的緩衝具3 3中, 短邊方向的判品/ &quot; &gt;狀呈現凹狀。如第4圖所示,在放置已 經貼合之面柘7 η从士 牡風置巳 、%候,由上而下***並與各緩衝 的凹部接觸。 及珂,、w 構Μ例如是由支架與小齒輪(andpinic)n)所組 /、底板31作為支架(rack),而小齒輪3〇1與底板 3二义°而構成搬送機構30。小齒輪沿著搬送線以一定的間 U。小齒輪301設置於處理室2内外。另外,可以$ 置導引零件以導引基板保持具3。 °又 如第3圖所示’噴嘴4係設置於被固定在基板保持具 已經貼合之面板10的兩側並對著已經貼合之面板!。的 兩側之外部同時噴射溶解液L。第5圖係緣示第3圖所示 之噴嘴4之形狀之斜視示意圖。 如第5圖所示,噴嘴4係具有噴射孔41的管狀零件, 如第5圖所示,噴嘴4沿著垂直方向配置,並在已經點人 之面板1〇的長度方向(搬送方向)上等間隔地設置。喷射孔 41係設置於噴嘴4之中並設置在靠近已經點合之面板、。 的位置’而且沿著圓管的方向(垂直方向)上等距離設置。 另外’噴嘴4的構成除了如第5圖所示之外,數量上可以 增加或減少。另外,喷嘴4的構成也可以是沿著水平方向 或傾斜方向設置之複數個喷嘴的構成。另外,噴嘴4的形 狀除了管狀之外也可以是板狀或其它形狀。 溶解液供給系統5由儲存溶解液L之..液體儲檜51、連 接液體儲槽51以及各喷嘴4之配管52、設置於配管52上 5l47-7l43-PF;Forever769 17 200541396 的間件心幫浦54等構成。另外也可以設㈣網與調整 屋力用的閥件,其令上述遽網用於從供給之溶解液L除去 雜質與垃圾。 /合解/夜L由〆谷解液供給系、统5輸送至各喷嘴[鈇後 由各喷射孔41噴向被^於基板保持具3的已經貼合之面 板1〇的外部。被噴射出來的溶解液L衝擊基板外部,並溶 解基板的外部而削減基板外部的厚度。 卜士第2圖所不’處理室2的底部是漏斗狀,最 下面的部分設置排出孔24。排出孔24連接排出管25,其 中上述排出管25用於排放使用過後的溶解液l。如上所述 之含有已㈣合之面板10之材料的溶解液係流至處理室2 的底部,然後藉由排出孔24以及排出管25排放至外界。 料4_室2的内壁’處理室2内的各零件之表 面都是由耐藥性的材料所構成’都可以抵抗溶解液L的侵 钱。例如溶解液是氣酸的時候,内壁面與各零件的表面皆 塗佈㈣氟龍(註冊商標)等氟酸樹脂材料。另外,控制搬 入口 2i與搬出口 22之開關狀態的封鎖閑門以 解液漏出的功能。 本實施例之襄置中,為了提高削減後之外部的平坦 性,因此對噴嘴4下了特別的功夫。關於這點,由第5圖 以及第6圖加以說明。篦R岡焱;立 # 6 圖’用於說明溶解液 L從各噴射孔41均一地喳AΊ n t 地噴在面板10之外部上的嘴射點。 如第5圖所示’各噴射孔41係货外在與嘴嘴4之管的 延伸方向(垂直方向)呈45度傾斜的方向上。因此,如第5 5147-7143-PF;Forever769 18 200541396 從各噴射孔41噴射出來的溶解液L在上述傾斜的 方向上呈現往外擴之喇叭狀。 =6之中,示單一喷嘴4之各喷孔“所喷射出來 二Ή。在圖6的右側,此圖是從已經貼合之面板 /來看,各喷射孔41之溶解液L的喷射量的分佈 圖。已經貼合之面你彳n 工y Ϊ 之面板10通過兩側之噴嘴4之間 7合之面板1()之外部的各點可以接受來自任何_個嘴已 孔41所供給之溶解液L。此時,位於外部之點p通下The pillars 32 are mainly provided at the four corners of the slender rectangular bottom plate: four on the part. The spray holes 34 are placed along the longitudinal direction of the bottom plate M and tied to the upper ends of the pillars 32 to reinforce each of the pillars 32 of the substrate holder slightly higher than the panel 10 already bonded. The distance between the two pillars 32 on the short side of the bottom plate μ is slightly larger than the already-fitted service by a point. The distance between the two pillars located in the long side direction of the bottom plate 31 is the panel j that has been fitted. The length is slightly longer. The fitted panel 1 G is a space surrounded by four pillars. Buffer 8 3 3 疋 Directly contact the parts of the panel ^ Q that has been attached to fix the panel. The 1Ge buffer 33 is made of a material that will not be dissolved by the solution ^ catty = Material), 材料 is a material composed of iron resin (registered trademark) fluorine resin. As shown in FIG. 4, the buffer 33 is provided on both ends in the long-side direction of the bottom plate 31 and communicates with the lower ends of the pillars, and is also provided on both ends in the long-side direction of the bottom plate 31 and communicates with the pillars 32. The upper end is connected. The pasted panel 10 纟 is in contact with each corner of the buffer. In the lower corner corner of the pasted panel 10, the lower part of the buffer lean 33 has a cross-sectional shape in the short-side direction and a cross-sectional shape in the long-side direction. 2 5147-7143-PF; Forever769 16 200541396 In addition, in the bumper 3 3 that has been in contact with the upper corner of the 6 board 10, the short side direction judgment / &quot; &gt; shape is concave. As shown in Fig. 4, on the surface where the bonding has been placed, 7 η is placed from the top, and it is inserted from top to bottom and contacts the recessed portions of each buffer. For example, the structure w is composed of a bracket and a pinion (n), a base plate 31 is used as a rack, and the pinion 3101 and the base plate 3 are formed to form a transfer mechanism 30. The pinions are spaced a certain distance along the transfer line. The pinion 301 is provided inside and outside the processing chamber 2. In addition, a guide part may be placed to guide the substrate holder 3. ° Again, as shown in Fig. 3, 'the nozzle 4 is provided on both sides of the panel 10 which is fixed to the substrate holder and faces the panel which is already bonded! . Dissolve the solution L simultaneously on the outside of both sides. FIG. 5 is a schematic perspective view showing the shape of the nozzle 4 shown in FIG. As shown in FIG. 5, the nozzle 4 is a tubular part having a spray hole 41. As shown in FIG. 5, the nozzle 4 is arranged in the vertical direction and is in the length direction (conveying direction) of the panel 10 that has been pointed. Set at regular intervals. The injection hole 41 is provided in the nozzle 4 and is provided near the panel which has been clicked.的 位置 'Moreover, it is set at equal distances in the direction (vertical direction) of the circular tube. In addition, the configuration of the 'nozzles 4' can be increased or decreased in number, as shown in FIG. The configuration of the nozzle 4 may be a configuration of a plurality of nozzles provided in the horizontal direction or the oblique direction. In addition, the shape of the nozzle 4 may be a plate shape or other shapes in addition to the tube shape. The dissolving liquid supply system 5 is composed of a storing liquid L: a liquid storage tank 51, a piping 52 connecting the liquid storage tank 51 and each nozzle 4, and a 5l47-7l43-PF provided on the piping 52; an intermediate piece of Forever769 17 200541396 Pu 54 and so on. It is also possible to provide a gauze net and a valve for adjusting the roofing force. The gauze net is used to remove impurities and garbage from the supplied solution L. / Combined solution / night L is transported to each nozzle by the Kariya solution supply system [5], and then sprayed from each ejection hole 41 to the outside of the already-adhered surface plate 10 held on the substrate holder 3. The sprayed solution L impacts the outside of the substrate, and dissolves the outside of the substrate to reduce the thickness of the outside of the substrate. The bottom of the processing chamber 2 shown in FIG. 2 is funnel-shaped, and a discharge hole 24 is provided at the lowermost portion. The discharge hole 24 is connected to a discharge pipe 25, wherein the above-mentioned discharge pipe 25 is used to discharge the dissolved solution 1 after use. The dissolving solution containing the material of the panel 10 as described above flows to the bottom of the processing chamber 2 and is then discharged to the outside through the discharge hole 24 and the discharge pipe 25. The inner wall of the material 4_ chamber 2 'The surface of each part in the processing chamber 2 is made of a resistant material' and can resist the invasion of the solution L. For example, when the dissolving solution is a gas acid, the inner wall surface and the surface of each component are coated with a fluoric acid resin material such as Teflon (registered trademark). In addition, the function of closing the idle door of the opening and closing ports 2i and 22 is controlled to release the liquid. In order to improve the flatness of the exterior after the reduction in the placement of this embodiment, special efforts have been made on the nozzle 4. This point will be described with reference to FIGS. 5 and 6.篦 R 焱 焱; 立 # 6 FIG. 'Is used to illustrate the point where the dissolving liquid L is sprayed uniformly from the spray holes 41 on the outside of the panel 10. As shown in Fig. 5 ', each of the spray holes 41 is outwardly inclined in a direction inclined at 45 degrees with respect to the extending direction (vertical direction) of the nozzle 4 tube. Therefore, as in No. 5 5147-7143-PF; Forever769 18 200541396, the dissolving liquid L ejected from each ejection hole 41 has a flared shape expanding outward in the above-mentioned oblique direction. In = 6, each nozzle hole of a single nozzle 4 is shown as "two shots from the nozzle." On the right side of Fig. 6, this figure is the injection amount of the dissolved liquid L of each injection hole 41 from the panel / view. The distribution of the surface that has been attached to you 彳 n y y Ϊ panel 10 through the nozzles 4 on both sides of the 7-closed panel 1 () outside the points can accept from any _ mouth has holes 41 Solution L. At this point, the external point p is below

目鄰之兩個噴射孔41之正中間的位置時,上述點P接受I 上迷兩個相鄰之喷射孔41所喷射之溶解液L。由於上过 …於形成树之溶解液的端部位置,如第6圖之= 側圖所示,點P接受於來自一 其他點的二分之一,而上下射孔的洛解液L的量是 旦力扭士 ❿上下兩相鄰之噴射孔之溶解液的 =加起來就是-個喷射孔41所供應之溶解^的量。因的 二已經貼合之面板1〇之高度方向上,外部個點所接受到 的溶解液L之供給量是均—地。另外,如第5圖所 解液L·呈現喇叭狀之外,也可以β 丁如 形狀(正方形、長方形) 疋/圓狀、圓狀、方 曼$狀、平行四邊形等形狀。 接著,說明上述裝置的作動情形。 放置ί =裝工程完成之後’已經貼合之面板1〇被舉起並 置在處理室2外面的基板保持具3上面 作可以利用機器手臂完成, 戰的動 # ^ , σ以由作業員徒手完成。於 濩膠Τ進行保護的動作。 保 5147-7143-PF;Forever769 •200541396 接著,搬送機構30開始動作,搬入口 23打開,基板保持具通過搬 貞閘門 z 1而在處理室2内款氣 接著,基板保持具3將已經心之面 内移動。 嘴“間的預定位置上。搬入口21的::置於兩側之喷 „ 山士 的封鎖間門23接著關 閉。此時,溶解液供給系統5的閥件 =者關 體的幫浦54以預定的壓力my r 丁開接考輸运液 、 刀將冷解液L送至各噴嘴4。姓里 溶解液由各噴嘴4的各喷射孔41喷 ,、°, _ ^ ^出,在預疋的#力 =已經貼合之面板10的外部。因此,削減了已經:! :10的外部。混有溶解之外部材料的溶解液L往下流 至排出孔24而排出。 溶解液L喷射了一定時間之後, m 〇 、寶/有54關掉’並關 ]閥件53。接著,搬送機構3〇 ^ 4 j作動,移動基板保持 去。之後 '至。接者,利用純水等洗淨液將保護勝帶除 云 之後,進行切割製程。 2述裝置的作動中’於溶解液L喷射時需改變已經 貼δ之面板10的位置。已經貼合之面 與各噴嘴4之各喷射孔41之相對距離 卜°卩上各點, 離最紐的點所受的衝擊 車父馬’因此必須在溶解液L喷射的時候將已經貼合之 反:前後移動’以使得外部個點所受的衝擊壓力均相 。此,可以提高削減後之平坦性。另外, 面板10的移動方向也可以是上下方向。 上述裝置具有控制全體的控制..部,(圖未顯示)^上述控 制部可以有頻率地控制各部,可以控制上述的作動、以: 5147-7143-PF;p〇rever769 2〇 200541396 為了將衝擊均—几七#、 另外二之基板保持具3的移動動作。 另外,在上述裝置的構成中,幫 塵力介於0.叫/W至3. 5kg/cffi :送溶解液L之 各喷射孔41盥外$ &amp; # 4扦,各喷嘴4之 的斤因之一 ^ P㈣(如第3圖所示之D)是非常重要 ’、 距離D較大的時候,若不弹一紐 體之塵力則無法達到上述溶解液l之衝擊南幫《送液 離&quot;交小的時候,衝擊壓力較 #外,距 嗔射孔4Ϊ县4 竿又易保持在最適值,但是距離 S的點所承受的衝擊壓力會過高,而演伸衝擊 壓力不均的問題。衝擊的均負伸衝擎 若要砝# Μ 4 (也就疋說,削減的平坦性) :確保的話,距離D較佳者是介於^…〇〇龍之間。 解液L進行削減的過程中,嗔射孔4!至外部 =之變化非常的少,其開始削減時的距離大約介於5_ 至100_之間。 、另外’-旦衝擊壓力小於0.5kg/CIn2,因為新鮮之溶解 液L的供給量變少而無法進行削減,而且也因為完全沒有 物理作用的緣故,益法香公士浴丨 …沄死刀地削減玻璃之組成與結晶狀態 不均-的地方,因此平坦性會將低。料,一旦衝擊遷力 大於3.5kg/cm2,只有距離喷嘴4之噴射孔41最短的點被 削除最多,因此在這各點的平坦性非常不良。因此,較佳 的衝擊壓力之範圍大約介於〇5kg/cm2至35kg/cm2之間。 根據上述裝置,因為可以利用溶解液L的化學作用再 加上衝擊所引起之物理作用而將外部削減,除了可以提高 削減的平坦性之外,由於玻璃基板1之搬送與射減處理皆 自動化的關係,因此生產效率非常高。 5147-7143-PF;F〇rever769 21 200541396 另外喷觜4之各喷射孔41都是等距離設置,因為各 喷射孔41至外部的距離都_樣的關係,所以很容易控制嘴 射出來之公解液L的衝擊璧力,因此對於提高削減處理之 平坦性也很有貢獻。 另外’已經貼合之面板1〇保持在垂直站力的狀態,因 此可以促進外部之溶解液L的置換,可以十分有效率進行 外部削減製程。 ❿且’喷嘴4設置於已經貼合之面板10的兩側,因為 籲同時削減兩邊基板之外部,因此可以將已經貼合之面板 薄型化,另外也可以提高生產效率。 在上述之各實施例之構成中,上述利用溶解液所進行 之外部削減製程也可以採用钱刻的方式。但是,除了化學 作用之外’因為也併用物理作料緣故,因此與單純浸2 於钱刻液中以使得钕刻液散佈之化學姓刻法相比的話,本 質上並不相同。 • 接著,上述實施例中,外部削減處理係於貼合一對破 璃基板1之後進行,但是也可以在貼合面板之前進行外部 削減處理。也就是說,在電極形成製程之前進行外部削減 處理,在彩色濾光片形成製程進行外部削減處理。此時, 基板保持具3 —次只固定一個玻璃基板2。一旦將破^基 板1薄化,會產生強度的問題。但是使用氟酸等強酸進行 削減的時候,由於強酸的作用也會使得玻璃產生強化的效 果,因此即使玻璃厚度變薄也不會有問題。而且,也可以 在切割製程之後再進行外部削減製程。另外,同時固定複 5147-7143-pp;p〇rever7g9 22 200541396 數個已經貼合之面板1 0,π π士 k υ问時進行外部削減處理。 在上述實施例中,掂 才木用LCD,但是其他實施例也可以 採用電漿顯示器與有機電激-抑 电歲毛先顯不斋。由於電漿顯示器 與有機電激發光顯示器不需 ^ 卜而要月先源,因此有一個基板可 以不是玻璃基板。換句話句 說,/、要其中一個基板是玻璃基 板即可。另外,在本發明中 ^ 月中,對此一對玻璃基板中之一進 行外面削減處理,也可u、去 也」以達到本發明的效果。 接著,平面顯示器之發明的實施例之說明。 第7圖係繪示根據本發 一 ^罕乂侄X細例之平面顯示哭 之剖面示意圖。如第7圖所示 % σ〇 q π不 &lt; 十面顯不态,係由一對已 經貼合之玻璃基板1所組成 取如第7圖所不,以前述之實 施例讓使用液晶顯示器作為% 、 邗為說明。在一對的玻璃基板之内 部形成光透過控制部。上祕本、泰、a '上述先透過控制部係由形成於盆中 -個玻璃基板!之内面上的電極(元件電極、共通電極 等川與封於内部之液晶ϊ3。另外,在另—個玻璃基板^ 的内面上形成彩色濾光片14。上沭# n u上迷光透過控制部之構成盥 習知的液晶顯示器一樣。 〃 ,上述第7圖所示之平面顯示器的特徵在於,使用外部 削減處理以削減-對玻璃基板!之兩個基板的外部。上述 外部削減處理因為與上述各實施例相同,因此在此省略= 加詳述。此實施例之平面顯示器最大特徵在於,進行如上 =述之外不削減處理’外部100具有良好的平坦性,^就 是說外部的表面高度差在〇·;[微米以下。 如第7圖之放大圖所示’外部1〇〇的最頂部ι〇ι與最 5147-7143-PF;Forever769 23 200541396 底部102的距離相者认主 田於表面粗糙度測定中所測定到的最大 粗才造度(Rmax )。可以你古 士 k市面上販買之用於測定表面粗糙度的When the position is exactly in the middle of the two adjacent injection holes 41, the above point P receives the dissolved liquid L sprayed from two adjacent injection holes 41 on I. Due to the position of the end of the dissolving solution forming the tree, as shown in Figure 6 = side view, the point P is accepted by one-half from another point, and The amount is the amount of the dissolving solution of the two adjacent spray holes on the top and bottom of the twisted pair, which adds up to the amount of dissolution provided by one spray hole 41. Therefore, in the height direction of the panel 10 already bonded, the supply amount of the dissolving liquid L received by the external points is uniform-ground. In addition, as shown in Fig. 5, the solution L · may have a trumpet shape, but may also have a β shape (square, rectangular) 疋 / circular shape, round shape, square shape, parallelogram shape, and the like. Next, the operation of the device will be described. Placement: After the installation process is completed, the bonded panel 10 is lifted and placed on the substrate holder 3 outside the processing chamber 2 and can be completed by a robotic arm. The movement of the battle # ^, σ is completed by the operator with bare hands. . Protective action is performed on the adhesive.保 5147-7143-PF; Forever769 • 200541396 Next, the transfer mechanism 30 starts to operate, the transfer inlet 23 is opened, and the substrate holder is charged in the processing chamber 2 by moving the gate z1. Then, the substrate holder 3 will be attentive Move in plane. Mouth "in the predetermined position. Carrying in the entrance 21 :: placed on both sides of the spray door" Sanshi's blockade door 23 "and then closed. At this time, the valve 54 of the dissolving solution supply system 5 is the pump 54 of the body, and the test solution is transported to the nozzle 4 by a knife at a predetermined pressure my r Ding. The dissolved solution is sprayed from the spray holes 41 of each nozzle 4 in the last name, °, _ ^ ^, and is outside the # force = pre-attached panel 10. So cut it already :! : 10 outside. The dissolving liquid L mixed with the dissolved external material flows down to the discharge hole 24 and is discharged. After the dissolving liquid L is sprayed for a certain period of time, m0, Po / Yu 54 is closed and the valve member 53 is closed. Next, the transfer mechanism 30 ^ 4j is operated to hold the moving substrate. After 'to. Then, the protective tape is removed from the cloud with a washing liquid such as pure water, and then the cutting process is performed. During the operation of the device described above, it is necessary to change the position of the panel 10 to which δ has been applied when the dissolving liquid L is sprayed. The relative distance between the surface that is already attached and each injection hole 41 of each nozzle 4 is at each point, and the impact received from the closest point is therefore necessary. The opposite: move forward and backward 'to make the impact pressure on the external points uniform. This can improve the flatness after the reduction. The moving direction of the panel 10 may be the vertical direction. The above device has a control unit that controls the whole, (not shown in the figure) ^ The above control unit can control each unit with frequency, and can control the above-mentioned actions to: 5147-7143-PF; p769ever769 2〇200541396均 — 几 七 #, the other two of the substrate holder 3 movement. In addition, in the structure of the above-mentioned device, the dust-removing force is between 0.5 and 3.5 kg / cffi: each injection hole 41 for sending the dissolving liquid L is cleaned, and the weight of each nozzle 4 is One of the reasons ^ P㈣ (as shown in D in Figure 3) is very important. When the distance D is large, the impact of the above-mentioned dissolving solution l cannot be achieved without the dust force of a button. When the distance is small, the impact pressure is smaller than #. It is easy to maintain the optimal value for the 4 rods in the 嗔 perforation 4 and the county. However, the impact pressure on the point S is too high, and the extension impact pressure is uneven. The problem. The impact of the impact of the negative extension to the weight # Μ 4 (that is, the flatness of the cut): If it is ensured, the distance D is better between ^ ... 〇〇 龙. During the reduction of the solution L, the change of the perforation hole 4! To the outer = is very small, and the distance at the beginning of the reduction is about 5_ to 100_. In addition,-the impact pressure is less than 0.5kg / CIn2, because the supply of fresh dissolved solution L is reduced and cannot be reduced, and because there is no physical effect at all, the Yifaxiang official bath 丨 ... Since the composition and the crystalline state of glass are reduced, the flatness is low. It is expected that once the impact force is greater than 3.5 kg / cm2, only the shortest point from the injection hole 41 of the nozzle 4 is cut off the most, so the flatness at these points is very poor. Therefore, the preferred range of impact pressure is between about 0.5 kg / cm2 and 35 kg / cm2. According to the above-mentioned device, since the chemical action of the dissolving liquid L and the physical action caused by the impact can be used to reduce the outside, in addition to improving the flatness of the reduction, the glass substrate 1 can be automatically transported and reduced. Relationship, so production efficiency is very high. 5147-7143-PF; Focus769 21 200541396 In addition, the spray holes 41 of spray nozzle 4 are all equidistantly set, because the distance from each spray hole 41 to the outside is the same, so it is easy to control the mouth The impact force of the solution L also contributes to the improvement of the flatness of the reduction process. In addition, the already-adhered panel 10 is maintained in a vertical standing force state. Therefore, the replacement of the external dissolved solution L can be promoted, and the external reduction process can be performed very efficiently. Furthermore, the 'nozzles 4' are provided on both sides of the already-attached panel 10, and since the outer sides of the substrates on both sides are reduced at the same time, the already-attached panels can be made thin, and the production efficiency can be improved. In the configuration of each of the above-mentioned embodiments, the external reduction process using the dissolving solution may also be performed in a engraved manner. However, in addition to chemical action, because physical materials are also used, it is not fundamentally the same as the chemical surname method, which is simply immersed in a coin solution to spread the neodymium solution. • Next, in the above embodiment, the external reduction processing is performed after the pair of glass substrates 1 are bonded, but the external reduction processing may be performed before the panels are bonded. That is, an external reduction process is performed before the electrode formation process, and an external reduction process is performed in the color filter formation process. At this time, the substrate holder 3 fixes only one glass substrate 2 at a time. Once the broken substrate 1 is thinned, a problem of strength arises. However, when using a strong acid such as fluoric acid for reduction, the effect of strong acid will also strengthen the glass, so there is no problem even if the thickness of the glass is reduced. Furthermore, an external reduction process may be performed after the cutting process. In addition, at the same time, a fixed number of 5147-7143-pp; p〇rever7g9 22 200541396 several externally bonded panels 10, π π ± k k υ will be subject to external reduction processing when asked. In the above-mentioned embodiment, the LCD is used for the wood, but other embodiments may also use a plasma display and an organic electro-excitation-suppression. Since plasma displays and organic electroluminescent displays do not need to be sourced, one substrate may not be a glass substrate. In other words, one of the substrates is a glass substrate. In addition, in the present invention, one of the pair of glass substrates may be subjected to external reduction treatment, and the effects of the present invention may also be achieved. Next, an embodiment of the invention of the flat panel display will be described. FIG. 7 is a schematic cross-sectional view showing a plane display crying according to the detailed example of the present invention. As shown in Fig. 7,% σ〇q π does not have a ten-sided display, which is composed of a pair of glass substrates 1 that have been bonded. As shown in Fig. 7, the liquid crystal display is used in the foregoing embodiment. As%, 邗 is explained. A light transmission control portion is formed inside a pair of glass substrates. On the secret book, Thai, a 'the above-mentioned first transmission control unit is formed in the basin-a glass substrate! Electrodes on the inner surface (element electrodes, common electrodes, etc.) and liquid crystal ϊ3 sealed inside. In addition, a color filter 14 is formed on the inner surface of another glass substrate ^. 上 沭 # nu 上 迷 光光 控制 控 部 的It is the same as the conventional liquid crystal display. 〃 The flat display shown in FIG. 7 is characterized by using an external reduction process to reduce the outside of the two substrates to the glass substrate! The external reduction process is the same as each of the above. The embodiment is the same, so it is omitted here = added in detail. The biggest feature of the flat display of this embodiment is that the above-mentioned processing is not reduced. 〇; [micron or less. As shown in the enlarged view of FIG. 7 'The top of the outer 100 and the top 5147-7143-PF; Forever769 23 200541396 The distance between the bottom 102 and the main field is considered rough. The maximum roughness (Rmax) measured in the determination of the surface roughness. You can use it on the market for measuring the surface roughness.

工具中選出幾個,以用协 A 用於測疋上述外部1 0 0之平坦性。根 據本發明之發明人的辟处 y 的研九,進行上述外部削減處理之後, 一個玻璃基板1的厚彦女&amp; 予度大約在〇· 5mm以下,平坦性(RMAx)可 以控制在0.1微米以下,^ 、 下除了可以達到薄型化、輕量化的 要求之外,也可以避务黯+ 您光顯不不均的現象而提高平面顯示器Select a few from the tool to use CoA to measure the flatness of the above external 100. According to the research of the inventor of the inventor of the present invention, after performing the above-mentioned external reduction processing, the thickness of the glass substrate 1 is about 0.5 mm or less, and the flatness (RMAx) can be controlled to 0.1 μm or less. In addition to the requirements of thinning and lightening, you can also avoid the darkening of your work and increase the unevenness of your light display to improve the flat display.

的顯示性能。另外,伎梯认&amp; L 乂樣的千坦性以進行外部削減處理之 w 前的玻璃基板1之外部的in α上水 r σ|的十坦性相當,因此進行外面削減 處理並不會影響玻璃基板的平坦性。 在上述的例子中’以最大粗縫度作為平坦性,另外也 可以以中心線平均粗輪度(Ra)作為平坦性的依據。其實, 可以將外部100之凹凸的平均高度求出來,在將凹凸部分 的高度與平均高度之差異的絕對值的平均求出來。因為也 p、使用市面上販I的表面粗糙度計測定中心線平均粗縫 Φ )所以可以使用適當的工具。當中心線平均粗糙度 在〇· 03mm以下的日守候,平面顯示器就不會出現顯示不均的 現象’而這樣的平坦性也可以利用上述外部削減處理來達 成。 另外,上述的構成除了適用於液晶顯示器以外,也可 以適用其他的平面顧千哭 卞”、、員不裔例如有機電激發光顯示器等之 發光的平面顯示中,| w —ru Β ^ 〇 T 了以5又置發光部代替光透過控制部。 圖式簡單說明】 5147-7143~Pp;porever769 200541396 第1圖係繪示根據本發明 之概略製程剖面圖。 第2圖係繪示根據本發明 置之正面示意圖。 一較佳實施例之平面顯示器 一較佳實施例之外部削減裝 第3圖係繪示第 第4圖係繪示第 3之斜視示意圖。 2圖所示之裴置之側面剖面示意圖。 2及3圖中所示之裝置中基板保持具 圖所示之噴嘴 第5圖係繪示第 圖0 之形狀之斜視示意 第6圖係示意®,用於說明 一地喑i ,合解液L從各噴射孔41均 喷在面板10之外部上的喷射點。 第7圖係繪示根據本發明一較佳fY f 之剖面示意圖。 …例之平面顯示器 【主要元件符號說明】 L〜溶解液; 2〜處理室; 4〜喷嘴; 11〜電極; 13〜液晶; 21〜搬入口; 23〜封鎖閘門; 30〜搬送機構; 3 2〜支柱; 1〜破璃基板; 3〜基板保持具; 5〜溶解液供給系統; 12〜封膠部; 14〜彩色濾光片; 22〜搬出口 ; 24〜排出孔; 31〜底板; 33〜緩衝具; 5147-7143-PF;Forever7 6 9 25 200541396 41~喷射孔; 5卜 52〜配管; 53〜 54〜幫浦; 301 液體儲槽; 閥件; 〜小齒輪。Display performance. In addition, it is recognized that the &amp; L-like nature is equal to the tenness of the in α water r σ | outside the glass substrate 1 before the external reduction process, so the external reduction process is not necessary. Affects the flatness of the glass substrate. In the above-mentioned example, 'the maximum shirring degree is used as the flatness, and the centerline average rough roundness (Ra) may also be used as the basis for the flatness. Actually, the average height of the unevenness of the outer 100 can be calculated, and the absolute value of the difference between the height of the unevenness and the average height can be calculated. Since the centerline average thick seam Φ is also measured using a commercially available surface roughness meter (p), an appropriate tool can be used. When the average roughness of the center line is less than 0.03 mm, the flat display will not exhibit display unevenness', and such flatness can also be achieved by the above-mentioned external reduction processing. In addition, the above-mentioned structure can be applied to liquid crystal displays, and other flat-screen displays such as organic light-emitting displays such as organic electroluminescence displays. | W —ru Β ^ 〇T In order to replace the light transmission control part with 5 light emitting parts. Brief description of the drawing] 5147-7143 ~ Pp; porever769 200541396 Figure 1 shows a schematic cross-sectional view of the process according to the present invention. Figure 2 shows a cross-section according to the present invention. Front view of a flat display. A preferred embodiment of a flat display. External cut-out device of a preferred embodiment. Figure 3 is a diagram showing Figure 4. Figure 4 is a schematic diagram showing the oblique view of Figure 3. Side view of Pei Zhi shown in Figure 2. Schematic cross-section. The nozzles shown in the substrate holders in the devices shown in Figures 2 and 3. Figure 5 is an oblique view showing the shape of Figure 0. Figure 6 is a schematic view ® for explaining a place 喑 i, The solution solution L is sprayed from each spray hole 41 on the outside of the panel 10. FIG. 7 is a schematic cross-sectional view showing a preferred fY f according to the present invention.... L ~ dissolving solution; 2 Processing chamber; 4 ~ nozzle; 11 ~ electrode; 13 ~ liquid crystal; 21 ~ carrying entrance; 23 ~ blocking gate; 30 ~ carrying mechanism; 3 2 ~ pillar; 1 ~ broken glass substrate; 3 ~ substrate holder; 5 ~ dissolved Liquid supply system; 12 ~ sealing section; 14 ~ color filter; 22 ~ report; 24 ~ discharge hole; 31 ~ bottom plate; 33 ~ buffer; 5147-7143-PF; Forever7 6 9 25 200541396 41 ~ jet Hole; 5 Bu 52 ~ Piping; 53 ~ 54 ~ Pump; 301 liquid storage tank; Valves; ~ Pinion gear.

5147-7143-PF;Forever769 265147-7143-PF; Forever769 26

Claims (1)

200541396 •十、申請專利範圍·· 1. 種平面gg + $ …員不裔之製造方法,包括·· 電極形成製程,用 極,其中該基板之1雙=對基板之至少一方上形成電 A雙方疋玻璃基板; 封裝製程,用於尤 對基板封裝;以及' 成製程後利用封耀材料將該 方今雔削減I私’用於封裝製程後削減該對玻璃基板之 一方或雙方的厚度; •其特徵在於: 該外部削減製程Φ,糾 ^^^ 中利用可以溶解該玻璃基板之外部 著該外部噴射,以大於重力加速度之加速 =υ 噴射’以衝擊該外部,藉由溶解液之化學作 用加上衝擊所造成之物 理作用而將該外部溶解,並削減該 外部之厚度。 、·如申明專利靶圍第1項所述之平面顯示器之製造方 • 法,其中該溶解液是氟酸。 3·如申請專利範圍第1或2項中任一項所記载之平面 顯示器之製造方法,其中該溶解液對該外部之衝擊麼力係 介於 0.5kg/cm2 至 3.5kg/cm2 之間。 4·如申請專利範圍第1至3項中任-項所述之平面顯 不盗之製造方法’其中溶解液在噴射時與該外部呈垂直狀 態,且該基板保持靜止狀態。 .如申請專利範圍第1至4項中任-項所述之平面顯 不器之製造方法,其中該貼合之玻璃基板之雙方的外部同 5147-7143-PF;Forever769 200541396 時被削減,整體之厚度變薄。 6·如申請專利範圍第1至5項中任一項所述之 示器之製造方法,其中該溶解液係由噴嘴之喷射孔噴出 而且該喷嘴之噴射孔至該基板之外部的距離係介於5mm至 1 ◦ Omm之間。 7·如申請專利範圍第1至5項中任一項所述之平面顯 示器之製造方法,其中該溶解液係由喷嘴之喷射孔噴出, 各噴射孔係等距設置,且各喷射孔至該外部的距離皆相等。 8· —種外部削減裝置,用於削減平面顯示器之玻璃基 板之外部的厚度,包括: 處理室,用於進行外部削減處理; 基板保持具,用於將該玻璃基板保持在處理室内之預 定位置上; 具有喷射孔之喷嘴,用於將溶解液喷射在固定於基板 保持具上之該玻璃基板之外部;以及 溶解液供給系統,用於供給溶解液至喷嘴; 其特徵在於: 該/合解液供給系統係以特定之壓力將溶解液供給至該 噴嘴,其中在該壓力下溶解液以大於重力加速度之加速度 噴射至該外部以衝擊該外部,因而利用溶解液之化學作用 以及衝擊所引起之物理作用而將該外部溶解並削減厚度。 9 ·如申請專利範圍第8項所述之外部削減裝置,其中 該溶解液是氟酸。 1 〇_如申請專利範圍第8或9項之任一項所述之外部削 5l47-7143-PF;Forever769 28 200541396 減裝置,其中該供給系統在介於0.5kg/cm2至3 5kg/cjn2之 屢力下將該溶解液供給至該喷嘴,以使得該溶解液由該喷 嘴之喷射孔喷射至該玻璃基板之外部而衝擊該外部。 11.如申請專利範圍第8至1〇項所述之外部削減裝 置,其中該基板保持具於溶解液喷射_,將玻璃基板固定 並使传丨谷解液與該外部呈垂直狀態。 12.如申請專利範圍第8至^項中任何一項所述之外 部削減裝置’其中為了同時削減貼合之該對玻璃基板之外 卩該噴嘴口 又置在被固定於基板保持具之該對玻璃基板的 兩側。 13. 如申請專利範圍第8至12項中任何—項所述之外 部削減裝置,其中在開始進行削減製程時該喷嘴之嗔射孔 至該玻璃基板之外部的距離係介於5咖至1〇〇龍之間。 14. 如申請專利範圍第8至13項巾任何—項所述之外 部削減裝置’其中該喷射孔係以等距設置,而且各喷射孔 至該外部之距離皆相等。 15· —種平面顯示器,包括: 一對已經貼合之玻璃其知,n ^ 土板且該對玻璃基板之内部具 有光穿透控制部或發光部; 其特徵在於: 該對玻璃基板之外部被溶解 攸/合鮮履噴射,其甲該溶解液係 利用大於重力加速度之加诘许+ &amp; ^ ^ i&lt;加速度噴射至該外部以衝擊該外部 而削減該外部之厚度,盆φ导苔A 度其中最頂部與最底部之距離小於0.1 微米’因此該平面顯示器具有良好之平坦性。 5147-7143-PF;Forever769 29200541396 • X. Patent application scope 1. A manufacturing method of plane gg + $… including electrode formation process, using electrode, where one pair of the substrate = electricity is formed on at least one side of the substrate Both sides have glass substrates; the packaging process is used to package the substrates in particular; and the use of sealing materials after the manufacturing process is used to reduce the thickness of the glass substrate to the thickness of one or both of the pair of glass substrates after the packaging process; • It is characterized in that the external reduction process Φ, ^^^ utilizes the external spray that can dissolve the glass substrate to the external spray, and accelerates with acceleration greater than the acceleration of gravity = υ sprays to impact the external, by the chemical of the dissolving solution The effect is added to the physical effect caused by the impact to dissolve the exterior and reduce the thickness of the exterior. 2. The method of manufacturing a flat panel display as described in Item 1 of the patent claim, wherein the dissolving solution is fluoric acid. 3. The method for manufacturing a flat panel display as described in any one of the items 1 or 2 of the scope of patent application, wherein the impact force of the dissolving solution on the outside is between 0.5 kg / cm2 and 3.5 kg / cm2 . 4. The method of manufacturing a flat display as described in any one of items 1 to 3 of the scope of patent application ', wherein the dissolving liquid is perpendicular to the outside when sprayed, and the substrate remains stationary. The method of manufacturing a flat display device as described in any one of items 1 to 4 of the scope of patent application, wherein the exterior of both sides of the laminated glass substrate is the same as 5147-7143-PF; Forever769 200541396 was reduced and the whole The thickness becomes thinner. 6. The method for manufacturing a display device as described in any one of claims 1 to 5, wherein the dissolving liquid is sprayed from a spray hole of a nozzle and the distance from the spray hole of the nozzle to the outside of the substrate is introduced. Between 5mm and 1 ◦ Omm. 7. The method for manufacturing a flat panel display as described in any one of claims 1 to 5, wherein the dissolving liquid is sprayed from a spraying hole of a nozzle, each spraying hole is equidistantly arranged, and each spraying hole reaches the The outer distances are all equal. 8 · —An external reduction device for reducing the thickness of the outside of the glass substrate of a flat panel display, including: a processing chamber for external reduction processing; a substrate holder for holding the glass substrate in a predetermined position in the processing chamber A nozzle having a spray hole for spraying the dissolving liquid on the outside of the glass substrate fixed on the substrate holder; and a dissolving liquid supply system for supplying the dissolving liquid to the nozzle; The liquid supply system supplies the dissolving liquid to the nozzle at a specific pressure. Under the pressure, the dissolving liquid is sprayed to the outside at an acceleration greater than the acceleration of gravity to impact the outside. Therefore, the chemical action of the dissolving liquid and the impact caused by the impact are used. Physically dissolve the outside and reduce the thickness. 9. The external reduction device according to item 8 of the scope of patent application, wherein the dissolving solution is fluoric acid. 1 〇_External cutting 5l47-7143-PF as described in any one of the items 8 or 9 of the scope of patent application; Forever769 28 200541396 minus device, wherein the supply system is between 0.5kg / cm2 to 3 5kg / cjn2 The dissolving liquid is repeatedly supplied to the nozzle, so that the dissolving liquid is sprayed from the spray hole of the nozzle to the outside of the glass substrate and impacts the outside. 11. The external reduction device according to items 8 to 10 of the scope of the patent application, wherein the substrate holder is in the solution spraying stage, the glass substrate is fixed and the transmission solution is perpendicular to the outside. 12. The external reduction device according to any one of claims 8 to ^ in the scope of the patent application, wherein in order to simultaneously reduce the pair of glass substrates to be bonded together, the nozzle opening is placed in the fixed to the substrate holder. On both sides of the glass substrate. 13. The external reduction device as described in any one of items 8 to 12 of the scope of patent application, wherein the distance between the perforation of the nozzle and the outside of the glass substrate when the reduction process is started is 5 to 1 〇〇 Long. 14. The external reduction device according to any one of items 8 to 13 of the scope of the patent application, wherein the spray holes are arranged at equal distances, and the distances from the spray holes to the outside are equal. 15 · —A kind of flat display, comprising: a pair of laminated glass, n ^ earth plate, and a light transmission control part or a light emitting part inside the pair of glass substrates; characterized in that: the outside of the pair of glass substrates The solution is sprayed by the dissolver / mixer, and the dissolving liquid is sprayed to the outside with acceleration greater than the acceleration of gravity + & ^ ^ i &lt; acceleration to the outside to impact the outside and reduce the thickness of the outside. A degree where the distance between the top and the bottom is less than 0.1 micron ', so the flat display has good flatness. 5147-7143-PF; Forever769 29
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KR101300524B1 (en) * 2006-09-19 2013-09-02 (주)에스티아이 Etching Apparatus and etching method
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KR101240959B1 (en) * 2011-06-22 2013-03-11 주식회사 이코니 Apparatus including nozzle for spraying etching solution and apparatus for etching glass substrate

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CN110231725B (en) * 2019-05-20 2022-03-08 深圳市华星光电半导体显示技术有限公司 Method for thinning micro-image glass and control system thereof

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