CN207704390U - A kind of radiator of host computer - Google Patents

Abstract

The utility model discloses a kind of radiators of host computer, heat dissipation element includes the electronic components such as CPU, the surface smear of heat dissipation element has heat dissipation silicon chip, the silicon chip that radiates connects aluminium alloy connecting rod, it is carved with asperities in aluminium alloy connecting rod, the aluminium alloy connecting tube other end connects the second heat dissipation silicon chip, and the second heat dissipation silicon chip is applied on heat pipe；The second heat dissipation silicon chip is smeared on trumpet end portion one end, trumpet end portion other end integrally connected shell, shell is internally provided with liquid-sucking core, and shell inside longitudinal axis is provided with isolation section, the shell other end is provided with rounded ends, and rounded ends both sides and host shell are internally provided with sealing baffle；Radiating fin is equidistantly distributed on the end of the center of circle, radiating fin periphery is the extension shell of host housing, and the inside both sides for extending shell are provided with radiator fan, through-hole has also been equidistantly positioned on host housing.The utility model radiates to host by multiple combinations mode, makes host radiating efficiency higher.

Description

A kind of radiator of host computer

Technical field

The utility model is related to a kind of radiators to be related to host computer more particularly, to a kind of radiator of host computer Technical field of heat dissipation.

Background technology

Integrated circuit is largely used in machine element.It is well known that high temperature is the formidable enemy of integrated circuit.High temperature not only can Cause system operation unstable, reduced service life, it could even be possible to certain components is made to burn.The heat of high temperature is caused to be not from Outside computer, but computer-internal, or perhaps IC interior.The effect of radiator be exactly by these heat absorptions, Then it diffuses in cabinet or outside cabinet, ensures that the temperature of machine element is normal.Most radiators by and heat generating components Surface contacts, and absorbs heat, then transfers heat to by various methods at a distance, such as in the air in cabinet, then cabinet These hot-airs are passed to outside cabinet, the heat dissipation of computer is completed.The type of radiator is very more, CPU, video card, mainboard chip Group, hard disk, cabinet, power supply even CD-ROM drive and memory can all need radiator, these different radiators cannot be used with, and What is wherein most often contacted is exactly the radiator of CPU.According to the mode for taking away heat from radiator, radiator can be divided into actively Heat dissipation and passive heat dissipation.The former commonly air-cooled radiator, and the latter it is common be exactly cooling fin.Further subdivision heat dissipation side Formula can be divided into air-cooled, heat pipe, liquid cooling, semiconductor refrigerating, compressor cooling etc.；Hot pipe technique is U.S.'s Loews in 1963 One kind of George Ge Luofo (GeorgeGrover) inventions of my Mo Si National Laboratories is known as the heat transfer element of " heat pipe ", it The quick thermal transport property for taking full advantage of heat-conduction principle and phase change medium passes rapidly the heat of thermal objects through heat pipe It is delivered to outside heat source, the capacity of heat transmission is more than the capacity of heat transmission of any known metal.

Utility model content

The technical problems to be solved in the utility model is to overcome the defect of electric power maintenance equipment, provides a kind of host computer Radiator, to solve the above problems.

To achieve the above object, the utility model provides the following technical solutions：A kind of radiator of host computer, including master Machine shell and heat dissipation element；The heat dissipation element includes the electronic components such as CPU, and the surface smear of the heat dissipation element has first to dissipate Hot silicon chip, the first heat dissipation silicon chip connect aluminium alloy connecting rod, are carved with asperities in the aluminium alloy connecting rod, institute It states the aluminium alloy connecting tube other end and connects the second heat dissipation silicon chip, the second heat dissipation silicon chip is applied on heat pipe；The heat Pipe is made of trumpet end portion, shell, liquid-sucking core, isolation section and rounded ends, and described second is smeared on described trumpet end portion one end Radiate silicon chip, and shell described in the trumpet end portion other end integrally connected, the shell is internally provided with liquid-sucking core, and the pipe Shell inside longitudinal axis is provided with isolation section, and the shell other end is provided with rounded ends, the rounded ends both sides and the master Machine enclosure interior is provided with sealing baffle；Radiating fin, the radiating fin periphery have been equidistantly distributed on the center of circle end For the extension shell of the host housing, the inside both sides for extending shell are provided with radiator fan, on the host housing also etc. Distance is provided with through-hole.

As a kind of optimal technical scheme of the utility model, the trumpet end portion of the heat pipe is evaporation ends.

As a kind of optimal technical scheme of the utility model, the rounded ends of the heat pipe are condensation end.

As a kind of optimal technical scheme of the utility model, the liquid-sucking core is arranged on the inner wall of tube shell.

As a kind of optimal technical scheme of the utility model, the liquid-sucking core is made of the more empty materials of capillary.

As a kind of optimal technical scheme of the utility model, the radiating fin is made of albronze.

As a kind of optimal technical scheme of the utility model, the heat pipe solidification one, and formed inside the shell Negative pressure.

Working fluid is filled as a kind of optimal technical scheme of the utility model, inside the shell after negative pressure to add With sealing.

Compared with prior art, the utility model has the beneficial effects that：The utility model by radiate silicon chip, heat pipe, dissipate The multiple combinations mode such as hot fin and fan radiates to host, and the silicon chip that radiates is carved with increase and air contact area Asperities, radiating fin, with techniques such as high albronzes, make host radiating efficiency higher using heat conductivity..

Description of the drawings

Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings：

FIG. 1 is a schematic structural view of the utility model；

1, host housing in figure；2, heat dissipation element；3, the first heat dissipation silicon chip；4, aluminium alloy connecting rod；5, asperities；31、 Second heat dissipation silicon chip；6, heat pipe；7, trumpet end portion；8, shell；9, liquid-sucking core；10, isolation section；11, sealing baffle；12, round End；13, radiating fin；14, radiator fan；15, through-hole.

Specific implementation mode

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment is based on the embodiments of the present invention, and those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.

Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of radiator of host computer, including outside host Shell 1 and heat dissipation element 2；It is characterized in that：The surface smear of the electronic components such as including CPU of heat dissipation element 2, heat dissipation element 2 has One heat dissipation silicon chip 3, the first heat dissipation silicon chip 3 connect aluminium alloy connecting rod 4, asperities 5 are carved in aluminium alloy connecting rod 4, The aluminium alloy connecting tube other end connects the second heat dissipation silicon chip 31, and the second heat dissipation silicon chip 31 is applied on heat pipe 6；Heat pipe 6 by Trumpet end portion 7, shell 8, liquid-sucking core 9, isolation section 10 and rounded ends 12 form, and the second heat dissipation is smeared on 7 one end of trumpet end portion Silicon chip 31,7 other end integrally connected shell 8 of trumpet end portion, shell 8 is internally provided with liquid-sucking core 9, and 8 inside longitudinal axis of shell is set It is equipped with isolation section 10,8 other end of shell is provided with rounded ends 12, and 12 both sides of rounded ends and host shell are internally provided with close Block plate 11；Radiating fin 13 has been equidistantly distributed on the end of the center of circle, 13 periphery of radiating fin is the extension shell of host housing 1, The inside both sides for extending shell are provided with radiator fan 14, and through-hole 15 has also been equidistantly positioned on host housing 1.

Further, the trumpet end portion 7 of heat pipe 6 is evaporation ends, is used to absorb the heat that the second heat dissipation silicon chip 31 transmits Evaporation latent heat.

Further, the rounded ends 12 of heat pipe 6 are condensation end, are used for the latent heat of condensation

Further, liquid-sucking core 9 is arranged on 8 inner wall of shell.

Further, liquid-sucking core 9 is made of the more empty materials of capillary.

Further, radiating fin 13 is made of albronze.

Further, heat pipe 6 cures one, and 8 inside of shell forms negative pressure.

Further, working fluid is filled inside shell 8 after negative pressure to be sealed.

Concrete principle：The utility model between heat pipe and heat dissipation element by being arranged the first heat dissipation silicon chip, aluminium alloy company Extension bar and the second heat dissipation silicon chip, can pass through the known technology of heat pipe by the heat transfer to heat pipe of heat dissipation element：Heat pipe is Make heat at the phase transition process of cold end condensation (evaporation latent heat and the latent heat of condensation that utilize liquid) after hot junction is evaporated using medium Amount quickly conduction.General heat pipe is made of shell, liquid-sucking core and end cap.Inside heat pipe is to be pumped into negative pressure state, and it is appropriate to be filled with Liquid, this boiling point of liquid is low, readily volatilized.Tube wall has liquid-sucking core, is made of capillary-porous material.Heat pipe one end is to steam Originator, other end is condensation end, and when heat pipe one end is heated, the liquid rapid vaporization in capillary, steam is in thermal diffusion Other end is flowed under power, and releases heat in cold end condensation, and liquid flows back to evaporation along porous material by capillarity again End, so cycle are more than, and until heat pipe both ends, temperature is equal (stopping of steam thermal diffusion at this time).This cycle is quickly to carry out , heat, which can be conducted continuously, to be come；It can be quickly transferred in rounded ends to the heat of heat dissipation element, circle The radiating fin of albronze support is provided on shape end, host housing is provided with through-hole, and internal symmetry is provided with radiation air Fan so that heat is scattered in air.

The utility model dissipates host by the multiple combinations modes such as silicon chip, heat pipe, radiating fin and fan that radiate Heat, and the silicon chip that radiates is carved with the asperities of increase and air contact area, radiating fin is using heat conductivity with high copper aluminium The techniques such as alloy make host radiating efficiency higher.

Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it still can be with technical scheme described in the above embodiments is modified, or to which part technical characteristic Equivalent replacement is carried out, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (8)

1. a kind of radiator of host computer, including host housing (1) and heat dissipation element (2)；It is characterized in that：The heat dissipation member Part (2) includes the electronic components such as CPU, and the surface smear of the heat dissipation element (2) has the first heat dissipation silicon chip (3), and described first dissipates Hot silicon chip (3) connects aluminium alloy connecting rod (4), and asperities (5), the aluminium are carved on the aluminium alloy connecting rod (4) The alloy connecting tube other end connects the second heat dissipation silicon chip (31), and the second heat dissipation silicon chip (31) is applied on heat pipe (6)； The heat pipe (6) is made of trumpet end portion (7), shell (8), liquid-sucking core (9), isolation section (10) and rounded ends (12), described The second heat dissipation silicon chip (31) is smeared on trumpet end portion (7) one end, is managed described in trumpet end portion (7) other end integrally connected Shell (8), the shell (8) is internally provided with liquid-sucking core (9), and the shell (8) inside longitudinal axis is provided with isolation section (10), institute It states shell (8) other end and is provided with rounded ends (12), be arranged inside rounded ends (12) both sides and the host shell There is sealing baffle (11)；Radiating fin (13) is equidistantly distributed on the center of circle end, radiating fin (13) periphery is The extension shell of the host housing (1), the inside both sides for extending shell are provided with radiator fan (14), the host housing (1) through-hole (15) has also been equidistantly positioned on.

2. a kind of radiator of host computer according to claim 1, it is characterised in that：The loudspeaker of the heat pipe (6) End (7) is evaporation ends.

3. a kind of radiator of host computer according to claim 1, it is characterised in that：The round nose of the heat pipe (6) Portion (12) is condensation end.

4. a kind of radiator of host computer according to claim 1, it is characterised in that：Liquid-sucking core (9) setting exists On shell (8) inner wall.

5. a kind of radiator of host computer according to claim 1, it is characterised in that：The liquid-sucking core (9) uses hair Thin more empty materials are made.

6. a kind of radiator of host computer according to claim 1, it is characterised in that：The radiating fin (13) uses Albronze is made.

7. a kind of radiator of host computer according to claim 1, it is characterised in that：Heat pipe (6) the solidification one, And negative pressure is formed inside the shell (8).

8. a kind of radiator of host computer according to claim 1, it is characterised in that：The shell (8) is internal negative Filling working fluid is sealed after pressure.