200522310 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種適合做為發熱性電子零件用途之熱 傳導性複合片。 【先前技術】 近年來’自發熱體移除熱在許多領域成為問題。特別 是電子儀器或個人電腦等之電子裝置’自發熱體移除熱成 為重要的課題。該等發熱性電子零件於運作時會發熱而造 成溫度顯著上升。伴隨溫度的上升，會因為自發熱性電子 零件所產生之熱而引起錯誤運作，造成發熱性電子零件之 特性降低而成為儀器故障的原因。 以往在此等發熱性電子零件之放熱上，多採用於發熱 性電子零件安裝散熱器或導熱塊（thermal bl〇ck)等來傳導、 釋放熱量之方法。發熱性電子零件與散熱器、導熱塊之接 蜀面由於為金屬彼此之接觸或是塑膠與金屬之接觸，所以 基於彌補接觸面彼此的密合性之目的，乃於發熱性電子零 件與散熱益或導熱塊之間設置··於矽酮橡膠或矽酮油中配 a…、傳導J1填充材而成之散熱片、散熱脂或是相變 化i片材’並使用於各種領域上（例如下述專利文獻1)。 [專利文獻1]特開2002-329989號公報 發熱性電子零件之發熱量近年來愈來愈大，所以於矽 酮橡膠或矽酮油中配合熱傳導性填充材之以往的散熱片、 散熱脂或是相變化型片材等需要有更高的熱傳導率。再 200522310 者，將散熱片、散熱脂或是相變化型片材等裝設於發熱性 電子零件與散熱器、導熱塊之間之後，會因為通電所發生 之熱造成彼此強固地密合，當要自發熱性電子零件卸除散 " 導熱塊之時，必須施加較大的力量來移除，常常合 k成毛熱丨生電子零件從基板脫落、或是發生變形、損壞等， 此為問題所在。 【發明内容】 本毛月為了解決七述課題，乃提供一種熱傳導性複合 片’在安裝發熱性電子零件與散熱器、導熱塊後，可輕易 地自發熱性電子零件卸除散熱器、導熱塊，且可將自發熱 性電子零件所產生之熱高效率地傳導至散熱器、導熱塊。 本毛月係種熱傳導性複合片，係將金屬箔黏著固定 於附黏著劑之樹脂膜的黏著面上，並使得基礎聚合物中添 加有熱傳導性填料之熱傳導性配合物以薄膜狀成形於該金 屬箔表面所得者。 【實施方式】 、本U之熱傳導性複合片，由於含有熱傳導性填料， 、‘、’、阻值低，且在金屬箔的部分有界面破壞，所以组裝 後可輕易地從發熱性電子零件卸除散熱器、導熱塊。 使得熱傳導性配合物以膜狀成形於金屬落上之際所使 :之黏著固定用附黏著之樹脂膜的黏著力以6gf/25mm以下 為佳。若附黏著之樹脂膜的黏著力過強，則將熱傳導性複 200522310 列自附黏著之樹脂膜剝離之際，金屬箔會產生皺摺或破 衣無法良好地剝除。又若附黏著之樹脂膜的黏著力過弱， 貝:將製品做切斷加工之後’熱傳導性複合片與附黏著之樹 月曰膜會放開成為單品狀態，所以黏著力的管理極為重要。 、做為附黏著之樹脂膜的基材（樹脂膜）的材質有聚丙 烯二聚乙烯等，可使用市售I，若考慮到耐熱性，則以聚 對苯二甲酸乙二醇酯等之聚酯為佳。 為了在樹脂膜表面將金屬猪黏著固定所塗佈之黏著劑 可使用市售之丙烯酸系、矽酮系等任一者。較佳為矽酮系。 金屬箔之厚度以m〜8〇//m為佳，更佳為1〇〜4〇" I。胃金屬/之材質以銅、鋁等之相對軟質金屬為佳。金屬箱 之：度若未滿8"m，則於壓延加工時熱傳導性配合物在金 屬，上流動時之力會造成金屬箔破裂，或是表面出現明顯 "使用性不佳。若金屬箔過厚，由於相對於發熱性電 子零件或散熱器、導熱塊表面之凹凸欠缺柔軟性、追隨性 故發熱性電子零件與散熱器、導熱塊之接觸狀態會惡化造 成熱傳導性能降低。 立將金屬泊貼附於附黏著之樹脂膜的情況，必須充分注 意避免貼合時於m與金屬之相互制積存^氣或是 產生皺摺，以層合法來進行兩者之貼合為佳。 於附黏著之樹脂膜所黏著固定之金屬箱的單面載放熱 ^導f生配合物之方法有利用石牙光輥之壓延法、塗佈法、層 :法、加壓法等各種方法。若考量量產性又以塗佈法或層 合法來於金屬箱上成形出熱傳導性配合物為佳。 200522310 熱傳導性配合物，以於樹脂、橡膠、油類等之高分子 基礎材料中添加熱傳導性填料為佳。熱傳導性填料相對於 问7刀子基礎材料丨00質量份若添加丨〇〇質量份，則熱傳導 率成為約0.5W/m · k。熱傳導性填料之較佳上限為3〇〇〇質 量份。 熱傳導性配合物以未硬化狀態之油灰（putty)狀配合物 為佳。所謂的未硬化狀態亦包含防止過程中刻意硬化者。 孟屬 '名上之熱傳導性配合物之厚度以〇 〜3 為佳。 ^高分子基礎材料可舉出乙烯一乙酸乙烯共聚物、乙 烯一甲基丙烯酸乙酯共聚物、乙烯一甲基丙烯酸酯共聚 物％氧树脂等之合成樹脂，在橡膠方面有矽酮橡膠、丁 基橡I苯乙烯—異戊烯共聚物、苯乙烯—丁二稀共聚物， 於油類方面有矽酮油等。 2是，從耐熱性之觀點考量，較佳為以石夕酉同系化合物 做為南分子基礎材料。 於熱傳導性配合物中所添加之熱傳導性填料有金屬氧 化物、氮化物、碳化物、肥粒料，可使用一種類或由兩 種類以上所混合者。再者亦可對於熱傳導性填料之表面以 眾知技術施行表面處理。 基於提高熱傳導性配合物與金屬箱彼此間之接著性的 目的，亦可於金屬羯之表面施以底漆處理。可隨在金屬箱 上所設置之熱傳導性配合物的 處理。 物的種類來選擇使用適宜的底漆 其次使用圖式做說明。圖 所示係本發明之一實施例 200522310 之附金屬箱之熱傳導性配合物片材之製造方法的截面圖。 於附黏著之樹脂们上貼附金屬，於其上載放熱傳導性 配口物成刀(於矽酮油等之基礎樹脂中配合熱傳導性填料所 成者）’ #由塗刀4進行塗佈（圖1A〜B)。以此方式所得之複 合^ UM系示於目1C。亦即，於附黏著之樹脂膜以貼附金 屬箔2，於其上積層熱傳導性配合物片3。 圖2係顯示使用狀態之截面圖。於cpu之禱模（㈣部 分5之表面透過熱傳導性接著劑6將金屬肖2與熱傳導性 配合物片3做貼附’於其上使得散熱器7 —體化設置。當 去除散熱器7之時，往箭頭8之方法撕扯，由於在金屬羯2 之4刀谷易發生界面破壞，所以可輕易去除。 以下使用實施例對本發明做更具體的說明。下述實施 例中之測定方法如下述般。 (1) 熱阻值：依據ASTM D5470以負荷5Psi(34.5kPa)做 測定。 (2) 組裝後之卸除试驗：將之表面尺寸的 cpu***插座，通電後將熱槽（heat sink)上提，測定與cPU 之分離性。 下述實施例所使用之熱傳導片中所使用的材料如下所 述0 (1)附黏者之樹脂膜 附黏著之樹脂膜係以下述方式製作。於SD4560(東麗· 道客寧谷矽酮公司）100質量份中加入SRX212(東麗•道客 争谷矽酮公司）〇·9份、二甲苯1 〇〇質量份進行攪拌來得到黏 200522310 著劑溶液。 (2) 黏著劑 其次將黏著劑溶液利用 上均勻塗佈，以力决在；度100# m之聚酯膜 M加熱爐在120V推γ 、 到黏著劑層之厚户A 1 進仃15分鐘加熱硬化，得 /予沒馮3 // m之附叙M丄•丄 ^ ^ ^lt ^ 附站者之樹脂膜。 ^者W層之厚度為3 m # 據JIS-Z-0238來測—夕姓旦、.黏者之樹脂膜的黏著力依 .f/ 、疋、、、°果，對於不鏽鋼SUS304板表面為 3gf/25mm之黏著力。 攸衣囬馬 (3) 金屬箔 rn 13C /11 金屬工業八二广銘羯為厚度30心之硬質材(住友輕 八司制：、°. A)’銅箔為厚度35"m之硬質材(曰本製箔 么司lie)，對於戶斤有的金屬 、、n 、 β 0金屬咱表面以異丙醇來進行脫脂、 ^以便可I!易地於金屬落表面使得熱傳導性配合物成 形為均勻的薄膜狀。 (4)金屬箔與附黏著之樹脂膜的貼合 金屬 >白肖附黏著之樹脂膜相互貼合之方法係以層合法 來進行。 臼口〆 (5) 熱傳導性配合物之表面處理 其次以下述方式來製作熱傳導性配合物。於實施例所 使用之氧化鋁係賦予六曱基二矽氮烷（TSL8802 GE，東芝矽 酉同公司）1質量％做表面處理。200522310 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a thermally conductive composite sheet suitable for use as a heat-generating electronic component. [Prior Art] In recent years, removal of heat from a heating element has become a problem in many fields. In particular, an electronic device such as an electronic device or a personal computer 'is an important subject to remove heat from a heating element. These exothermic electronic parts generate heat during operation and cause a significant increase in temperature. As the temperature rises, malfunctions may occur due to the heat generated by the self-heating electronic parts, which will cause the characteristics of the heat-generating electronic parts to decrease and cause the instrument to malfunction. In the past, in such heat-generating electronic components, a heat sink or a thermal block was used to conduct and release heat by using a heat sink or a thermal block. Because the contact surfaces of the heat-generating electronic parts with the heat sink and the heat-conducting block are metal-to-metal contact or plastic-to-metal contact. Or between heat-conducting blocks ·· a…, a heat sink made of conductive J1 filler, a heat sink, or a phase change i sheet in silicone rubber or silicone oil and used in various fields (such as the following See Patent Document 1). [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-329989 has increased the amount of heat generated by exothermic electronic parts in recent years. Therefore, conventional heat sinks, heat sinks, or greases that incorporate thermally conductive fillers in silicone rubber or silicone oil Phase change sheets and the like require higher thermal conductivity. In 200522310, after the heat sink, heat sink or phase change sheet is installed between the heat-generating electronic parts and the heat sink and the heat conduction block, they will be firmly adhered to each other due to the heat generated by the electricity. To dissipate the self-heating electronic parts, a large force must be applied to remove the thermally conductive block. Frequently, the thermally generated electronic parts fall off from the substrate, or are deformed or damaged. This is a problem. Where. [Summary of the Invention] In order to solve the seven problems mentioned above, this Maoyue provides a thermally conductive composite sheet, which can easily remove the heat sink and heat conduction block from the heat emitting electronic part after installing the heat generation electronic part and the heat sink and heat conduction block. In addition, the heat generated by the self-heating electronic parts can be efficiently transmitted to the heat sink and the heat conduction block. This hairy month is a type of thermally conductive composite sheet. The metal foil is adhered and fixed to the adhesive surface of a resin film with an adhesive, and the thermally conductive compound with a thermally conductive filler added to the base polymer is formed into a thin film. Obtained on the surface of metal foil. [Embodiment] Since the thermally conductive composite sheet of this U contains a thermally conductive filler, the resistance value is low, and there is interface damage in the metal foil part, so it can be easily removed from the heat-generating electronic parts after assembly. Remove the heat sink and thermal block. When the thermally conductive complex is formed into a film on a metal, the adhesive force of the resin film for adhesion and fixing is preferably 6 gf / 25 mm or less. If the adhesive force of the adhesive resin film is too strong, when the thermal conductivity is removed from the adhesive resin film 200522310, the metal foil may be wrinkled or the clothing may not be peeled off well. If the adhesive force of the adhesive resin film is too weak, bei: After cutting the product, the thermally conductive composite sheet and the adhesive tree will be released into a single product, so the management of adhesive force is extremely important. 2. The material of the base material (resin film) for the adhesive resin film is polypropylene diethylene. Commercially available I can be used. If heat resistance is considered, polyethylene terephthalate and other materials can be used. Polyester is preferred. The adhesive to be applied in order to fix and fix the metal pig on the surface of the resin film may be any of commercially available acrylics and silicones. Preferably it is a silicone type. The thickness of the metal foil is preferably m ~ 80 // m, and more preferably 10 ~ 40. Gastric metal is preferably made of relatively soft metals such as copper and aluminum. Metal box: If the degree is less than 8 " m, the thermally conductive complex on the metal during the rolling process will cause the metal foil to crack, or the surface will be significantly " poor in use. If the metal foil is too thick, since the unevenness on the surface of the heat-generating electronic component or the heat sink and the heat-conducting block lacks flexibility and followability, the contact state between the heat-generating electronic part and the heat sink and the heat-conducting block will deteriorate, resulting in a decrease in heat conduction performance. When attaching a metal poise to an adhered resin film, you must pay sufficient attention to avoid the accumulation of gas or wrinkles between m and the metal during bonding. It is better to use a lamination method to bond the two. . There are various methods for carrying heat on one side of the metal box to which the adhesive resin film is attached and fixed. The method for guiding the bio-complexes includes a calendering method using a satin roller, a coating method, a layer method, and a pressure method. In consideration of mass productivity, it is better to form a thermally conductive complex on a metal box by a coating method or a lamination method. 200522310 Thermally conductive complexes. It is better to add thermally conductive fillers to polymer-based materials such as resins, rubbers, and oils. When the thermally conductive filler is added to 00 parts by mass of 0.007 parts by mass of the knife base material, the thermal conductivity becomes about 0.5 W / m · k. A preferable upper limit of the thermally conductive filler is 3,000 parts by mass. The heat-conductive complex is preferably a putty-like complex in an unhardened state. The so-called unhardened state also includes those who intentionally harden during the process. The thickness of the thermally conductive complex of Meng's name is preferably 0 ~ 3. ^ Polymer base materials include synthetic resins such as ethylene-vinyl acetate copolymer, ethylene-ethyl methacrylate copolymer, ethylene-methacrylate copolymer% oxygen resin, etc. In the rubber aspect, there are silicone rubber, butadiene Base rubber I styrene-isoprene copolymer, styrene-butadiene copolymer, silicone oil and other oils. 2 is that from the viewpoint of heat resistance, it is preferable to use Shi Xiyong's homologous compound as the southern molecular base material. The thermally conductive fillers added to the thermally conductive complex include metal oxides, nitrides, carbides, and fertilizer pellets. One type or a mixture of two or more types can be used. Furthermore, the surface of the thermally conductive filler may be surface-treated by a known technique. For the purpose of improving the adhesion between the thermally conductive complex and the metal box, a primer may be applied to the surface of the metal grate. It can be disposed with the heat conductive complex provided on the metal box. Choose the appropriate primer for the type of object. Next, use drawings to explain. The figure shows a cross-sectional view of a method for manufacturing a thermally conductive complex sheet with a metal case 200522310 according to an embodiment of the present invention. A metal is attached to the resins that are adhered, and a heat-conducting compound is formed on the resin (made by adding a thermally conductive filler to a base resin such as silicone oil) '# Coating by a coating knife 4 ( (Figures 1A-B). The composite ^ UM obtained in this way is shown in head 1C. That is, a metal foil 2 is attached to an adhered resin film, and a heat conductive complex sheet 3 is laminated thereon. FIG. 2 is a cross-sectional view showing a use state. In the prayer mode of the cpu (the surface of the part 5 passes the thermally conductive adhesive 6 and attaches the metal shawl 2 and the thermally conductive complex sheet 3 to it, so that the heat sink 7 is integrated. When the heat sink 7 is removed, At this time, the method of tearing to the arrow 8 can be easily removed because the interface breaks easily in the 4 blade valley of the metal ridge 2. The following examples are used to explain the present invention in more detail. The measurement methods in the following examples are as follows (1) Thermal resistance value: measured according to ASTM D5470 with a load of 5Psi (34.5kPa). (2) Disassembly test after assembly: insert the surface-sized cpu into the socket, and then heat the heat sink (heat sink) ) Lift up and measure the separation from the cPU. The materials used in the thermally conductive sheets used in the following examples are as follows. 0 (1) Resin film with adherent The resin film with adhesion is produced in the following manner. SD4560 (Toray Dow Ninggu Silicone Co., Ltd.) was added with 100 parts by mass of SRX212 (Toray Dow Zinggu Silicone Co., Ltd.) 0.9 parts and xylene 100 parts by mass, and stirred to obtain a sticky 200522310. (2) Adhesive Secondly dissolve the adhesive Use a uniform coating on the top to make sure; the 100 ° m polyester film M heating furnace pushes γ at 120V to the thicker layer A 1 of the adhesive layer and heat-hardens it for 15 minutes. / m Attachment M 丄 • 丄 ^ ^ ^ lt ^ The resin film of the stationer. ^ The thickness of the W layer is 3 m # Measured according to JIS-Z-0238-Xi Xingdan, the resin film of the sticker The adhesion force of .f /, 疋 ,,, °°, for the surface of stainless steel SUS304 plate is 3gf / 25mm adhesion. You Yi Hui Ma (3) Metal foil rn 13C / 11 30-heart hard material (Sumitomo Light Yasushi :, °. A) 'copper foil is a hard material with a thickness of 35 &m; The surface of the metal is degreased with isopropyl alcohol, so that it can easily be formed on the surface of the metal so that the thermally conductive compound is formed into a uniform thin film. (4) Laminated metal of metal foil and adhesive resin film> The method of laminating the resin films attached to Bai Xiao with each other is performed by lamination. Usukiguchi (5) Surface treatment of thermally conductive complexes Secondly, the thermal conductivity is made in the following manner Complex: The alumina used in the examples was given a hexafluorenyl disilazane (TSL8802 GE, Toshiba Silicon Corporation) as a surface treatment.
(6) 熱傳導性配合物A 將矽酮油10〇質量份（SH200CV 300CS東麗•道客寧谷 矽酮公司製造）、氧化鋁900質量份（AS30昭和電工公司製 200522310 造）、鐵黑4質量份均勻混練調製成熱傳導性配合物a。 實施例1 將厚度30" m之銘落黏著固定於附黏著之樹脂膜的黏 ^面上後，將熱傳導性配合物A以壓延法在_面上形成 厚度170# m之片材，得到鋁箔與熱傳導性配合物a之總厚 為0.2mm之熱傳導性複合片。 實施例2 “將厚度35# m之銅黏著固定於附黏著之樹脂膜的黏 :面上後’將熱傳導性配合物A以壓延法在銅箔面上形成 厚度165//m之片材，得到銅箔與熱傳導性配合物a之總厚 為〇_2mm之熱傳導性複合片。 …子 比較例1 傳導性配合物A以壓延法直接載放在厚度30// m 鋁石單面表面，知到鋁箔與熱傳導性配合物A她 〇.2mm之埶傳導性斿人y Ά馬 …導禝5片。此時並不使用附黏著之樹脂膜。 比較例2 ' m 將熱傳導性配合物A以壓延法直接載放在厚度 之㈣單面表面，得到與熱傳導性配合物A二二 〇.2mm之熱傳導性禎人y 、心J子馬 將κ?,Μ〜杂片。此日夺並不使用附黏著之樹脂膜。 各埶僂H Λ施例2以及比較例1〜比較例2所製作之 各熱傳導性複合h ^^ ^ 裁切為30x30mm，測定熱阻值。盆姓 果示於表1。 八、、Ό 11 200522310 [表i](6) Thermally conductive complex A: 100 parts by mass of silicone oil (manufactured by SH200CV 300CS Toray Dow Ningu Silicone Co., Ltd.), 900 parts by mass of alumina (manufactured by AS30, Showa Denko Corporation 200522310), and iron black 4 The mass parts are uniformly kneaded to prepare a thermally conductive complex a. Example 1 After the thickness of 30 m was adhered and fixed on the adhesive surface of the resin film with adhesion, the thermally conductive complex A was calendered to form a sheet with a thickness of 170 # m on the surface to obtain an aluminum foil. A thermally conductive composite sheet having a total thickness of 0.2 mm with the thermally conductive complex a. Example 2 "The copper with a thickness of 35 # m is fixed to the adhesive: adhesive surface of the resin film with adhesion." The thermally conductive complex A is formed into a copper foil with a thickness of 165 // m by the rolling method. A thermally conductive composite sheet with a total thickness of 0_2 mm of the copper foil and the thermally conductive complex a was obtained.… Comparative Example 1 The conductive complex A was directly placed on the single-sided surface of alumina with a thickness of 30 // m by the rolling method. It is known that aluminum foil and thermally conductive complex A have a conductivity of 0.2 mm, which is human y Ά horse ... 5 conductive sheets. At this time, an adhesive resin film is not used. Comparative Example 2'm A thermally conductive complex A Directly placed on the single-sided surface of the thickness by the calendering method to obtain a thermal conductivity of 222,2 mm with the thermally conductive complex A, the heart, the child, and the child will be κ ?, M ~ miscellaneous pieces. No adhesive resin film is used. Each of the thermally conductive composites h ^ H Λ produced in Example 2 and Comparative Examples 1 to 2 was cut to 30x30mm and the thermal resistance was measured. Table 1. VIII, Ό 11 200522310 [Table i]
(備考）熱阻值測定方法係依據ASTM D547〇來進行 於本發明之實施例 定於附黏著之樹脂膜上 刀塗法以薄膜狀成形於 面均句載放著熱傳導性 傳導性複合片。 1〜2中，分別將鋁箔與銅箔黏著固 後’將熱傳導性配合物以壓延法或 金屬箔上，藉此，可得到金屬箔表 配合物且金屬箔無皺摺與破裂之熱 〜 啊泌泊興鋼I箔黏著固 疋於附黏者之樹脂膜上，而是脾勃 一 疋將…、傳導性配合物以壓延法 〆 ^法以薄膜狀成形於金屬箔上，# f A M > . . 自上結果金屬箔會出現皺 或皮裂而無法得到所需之熱傳導性複合片。 其次，針對於金屬箔 合物m π > i “形成薄膜狀之熱傳導性配 口物所仔之熱傳導性複合片做探 料士 A J 从Ά施例3與實施例4 對本發明做更具體的說明。 只她1夕J 4 附黏著之樹脂膜係以下述方 麗·、*分一 ” 逑方式來製作。於SD4560(東 鹿道客f合矽酮公司）1 〇〇質# 貝里知中加入SRX212(東麗· 12 200522310 道客寧谷矽酮公司)0·9份、二甲1 _ 到黏著劑溶液。 、里知進仃攪拌來得 其次將黏著劑溶液利用刀塗法在 上均勻塗佈，以力舳峻 。 又 以爪之聚酯臈 η 土佈❹熱爐在12(rc進行15分鐘加 到黏著劑層之厚度為3⑽之附黏著之樹脂膜。'“、匕’传 黏著劑層之厚度為3”之附黏著之樹 據似侧來測定之結果，對於_者= 3gf/25mm之黏著力。 攸衣面為 金屬羯’在紹箱方面為厚度30"爪之硬質材(住友_金 屬工業公司製造），在㈣方面為厚度…以硬質材（日本 製箱公司製造）’對於所有的金屬以面以異丙醇來進行脫 脂、洗淨’以便可輕易地於金屬羯表面使得熱傳導性配合 物成形為均勻的薄膜狀。 金屬箔與附黏著之樹脂膜相互貼合之方法係以層合法 來進行。 Ό / 其次以下述方式來製作熱傳導性配合物。於實施例所 使用之氧化鋁係賦予六曱基二矽氮烷（TSL88〇2 GE，東芝矽 _ 酮公司）1質量％做表面處理。 (熱傳導性配合物A) 將矽酮油100質量份（SH2〇〇CV 300cs東麗•道客寧谷 矽酮公司製造）、氧化鋁900質量份（AS30昭和電工公司製 造）、鐵黑4質量份均勻混練調製成熱傳導性配合物a。 (熱傳導性配合物C) 於矽酮橡膠100質量份（TSE3〇33 GE·東芝矽酮公司） 13 200522310 添加氧化鋁450質量份（AL43L昭和電工公司）進行混合， 於混合物中添加二甲苯100質量份做成熱傳導性配合匚 之分散物。 實施例3 ^將厚度30 之鋁箱黏著固定於附黏著之樹脂膜的黏 著面上，對於鋁箔面以壓延法載放熱傳導性配合物A，得到 鋁箔與熱傳導性配合物A之總厚度為〇 2mm之片材。于 其次將熱傳導性配合物A之形成薄膜狀的面暫時固定 於壓花膜上後，將附黏著之樹脂膜剝離使得鋁箔面露出。 其次以刀塗法將熱傳導性配合物c之分散物載放於露 出之鋁箔面，然後進行加熱硬化得到於鋁箔之單面上載放 者厚度l〇//m熱傳導性配合物C的〇21mm之熱傳導性 合片。 u 以中間夾住铭箔的方式獲得單面載放著熱傳導性配合 物A、另一單面載放著硬化後之熱傳導性配合物◦之熱傳 導性複合片。 貫施例4 將尽度3 5 // m之銅箔黏著固定於附黏著之樹脂膜的黏 著面上’對於銅箔面以壓延法載放熱傳導性配合物A，得到 鋼、名與熱傳導性配合物A之總厚度為〇·2ηιηι之片材。 其次將熱傳導性配合物Α之形成薄膜狀的面暫時固定 表壓化膜上後，將附黏著之樹脂膜剝離使得銅箔面露出。 其次以刀塗法將熱傳導性配合物C之分散物載放於露 出之銅箱面，然後進行加熱硬化得到於銅箔之單面上載放 200522310 著尽度1 0 // m熱傳導性配合物C的0 · 21 mm之熱傳導性複 合片。以中間夾住銅箔的方式獲得單面載放著熱傳導性配 合物A、另一單面載放著硬化後之熱傳導性配合物c之熱 傳導性複合片。 比較例3 將尽度3 0 // m之紹箔黏著固定於附黏著之樹脂膜的黏 著面上後，將熱傳導性配合物A以壓延法直接載放在銘羯 之單面表面，得到鋁箔與熱傳導性配合物A之總厚為〇.2mm 之熱傳導性複合片。 比較例4 將厚度35 # m之銅箔黏著固定於附黏著之樹脂膜的黏 著面上後，將熱傳導性配合物A以壓延法直接載放在鋼箔 之單面表面，得到銅箔與熱傳導性配合物A之總厚為〇.2mm 之熱傳導性複合片。 比較例5 以上下兩片之聚丙烯膜來夾住熱傳導性配合物A，以壓 延法做壓延得到厚度〇.2mm之熱傳導性配合物A之片材。 將實施例3〜實施例4以及比較例3〜比較例5所製作之 所有的熱傳導性複合片裁切為30x30mm，測定熱阻值，檢 討結果示於表2。 15 200522310 [表2] 實施例3 實施例4 比較例3 比較例4 比較例5 金屬羯之種類 鋁 銅 在呂 銅 無 金屬箔之厚度（//m) 30 35 30 35 — 熱傳導性配合物之種類 A · C A · C A A A 熱阻值(°C · cm/W2) 0.35 0.41 0.45 0.50 0.25 組裝後卸除 容易 容易 容易 容易 無法進行 (備考）熱阻值測定方法係依據ASTM D5470來進行。 由上述結果可知，於本發明之實施例中，與金屬箔成 一體化之熱傳導性複合片於組裝後可輕易卸除。另外，於 載放了熱傳導性配合物A之金屬箔的相反面載放熱傳導性 配合物C之熱傳導性複合片，發熱性電子零件與散熱器、 導熱塊之接觸狀態獲得改善，熱阻值可進一步降低。 相對於此，比較例3〜4之片材，並無厚度為1〇 #历之 熱傳導性配合物C，金屬络面呈外露狀態，所以接觸面之接 觸熱阻高’非所喜好者。實施例3、4中由於在ig ”之金 屬箔面存在著熱傳導性配合@ c層，乃可降低接觸面之接 觸熱阻。是以，可使得散熱片整體之熱阻降低。 又，比較例5之片材，發熱性電子零件與散熱器、導 熱塊間的密合性高’組裝後不易自發熱性電子零 器、導熱塊卸除。 熱 如以上所說明般，本發明之實施例卜4所得之 性複合片藉由將金屬辖黏合固定於附黏著之樹脂膜上，可 16 200522310 在不致產生敏指、破裂乃至凹凸的前提下將熱傳導性配合 物涛錄於金屬&上，能以均勻的厚度來成形。以此方式所 得之熱傳導性複合片之熱阻值低，且前述熱傳導性複合片 在組裝後，可極為輕易地自發熱性 器、導熱塊，可充分地達成目桿 :“ P除放熱 X ^ 又貝施例3〜4所得之埶 rnrr較於實施例1〜2在發熱性電子零件與散熱 兔之接觸熱阻可更為降低，且前述熱傳導性複人 可極為輕易地卸除散熱器、導熱塊，可充分地達成目標。 ^發熱性電子零件（例如⑽等）之冷卻對策上，以往 二=、油灰當作散熱材來使用，而透過散熱材利用密 :需i相=果來自發熱性電子零件卸除散熱器、導熱塊 度的力量，但在本發明中則是將機械強度弱 …屬治黏者固定於附黏著劑之樹脂膜上之後 熱傳導性配合物-體化，藉此，可做出容=(Remarks) The method for measuring the thermal resistance value is performed in accordance with ASTM D5470. In the examples of the present invention, it is determined on the resin film with adhesion. The knife coating method is formed into a thin film on the surface and a heat conductive conductive composite sheet is placed on it. In 1 ~ 2, after the aluminum foil and the copper foil are adhered and fixed, respectively, the thermally conductive complex is calendered or metal foil, thereby obtaining the metal foil surface complex without the heat of wrinkles and cracks ~ Ah Bipoxing Steel I foil is adhered and fixed on the resin film of the adherent, but the spleen is formed by forming the conductive complex with a thin film on the metal foil by the rolling method. # F AM > ... From the above results, the metal foil will appear wrinkled or cracked, and the desired thermally conductive composite sheet cannot be obtained. Next, for the metal foil compound m π > i "to form a thin film of a thermally conductive composite sheet made of thermally conductive composite sheet AJ Prospector AJ From Example 3 and Example 4 to make the present invention more specific Explanation: Only the resin film with J 4 attached on the night is made by the following Fang Li, * Fen Yi "method. Add SDRX60 (Donglu Daike Silicone Co., Ltd.) 1 〇〇quality # Bailey know SRX212 (Toray · 12 200522310 Daoke Ninggu Silicone Co., Ltd.) 0.9 parts, Dimethyl 1 _ to the adhesive Solution. , Li Zhi into the stirrer to get the second. The adhesive solution is evenly coated on the surface with a knife coating method. Then use claw of polyester 臈 η soil cloth ❹ hot furnace at 12 (rc for 15 minutes to add to the adhesive layer with a thickness of 3 ⑽ attached to the resin film. The thickness of the "", dagger "transmission adhesive layer is 3" The result of measuring the attached tree according to the similar side is for the adhesion force of _ = 3gf / 25mm. Youyi surface is metal 羯 'in the case, it is a hard material with a thickness of 30 " claw (made by Sumitomo_Metal Industry Co., Ltd.) ), The thickness in terms of concrete ... the hard material (manufactured by Nippon Kogyo Co., Ltd.) 'degreases and cleans all surfaces with isopropanol for all metals' so that the thermally conductive complex can be easily formed on the surface of metal It is a uniform thin film. The method of bonding the metal foil and the adhered resin film to each other is performed by lamination. 其次 / Next, a thermally conductive complex is produced in the following manner. The aluminum oxide used in the examples is given six 1% by mass of fluorenyldisilazane (TSL88〇2GE, Toshiba Silicone Corporation) is used for surface treatment. (Thermal conductive complex A) 100 parts by mass of silicone oil (SH200CV 300cs Toray Dow) (Made by Ninggu Silicone Co., Ltd.), alumina 9 00 parts by mass (manufactured by AS30 Showa Denko) and 4 parts by mass of iron black are uniformly kneaded to prepare a thermally conductive complex a. (Thermal conductive complex C) 100 parts by mass of silicone rubber (TSE3033 GE · Toshiba Silicone Co., Ltd.) ) 13 200522310 Add 450 parts by mass of alumina (AL43L Showa Denko Corporation) and mix, and add 100 parts by mass of xylene to the mixture to make a thermally conductive dispersing dispersion. Example 3 ^ A 30-thick aluminum box is adhered and fixed to On the adhesive surface of the resin film with the adhesive, the aluminum foil surface was loaded with a heat conductive complex A by a rolling method to obtain a sheet having a total thickness of 0.02 mm between the aluminum foil and the heat conductive complex A. Next, the heat conductive complex A After the film-shaped surface is temporarily fixed on the embossed film, the adhesive resin film is peeled off to expose the aluminum foil surface. Next, the dispersion of the thermally conductive complex c is placed on the exposed aluminum foil surface by a knife coating method, and then Heat-harden to obtain a thermally conductive composite sheet with a thickness of 10 // m and a thermally conductive complex C with a thickness of 10 // m placed on one side of the aluminum foil. U Obtain the sheet by sandwiching the foil in between. A thermally conductive composite sheet on which the thermally conductive complex A is placed and the cured thermally conductive complex ◦ on one side is placed. Example 4 The copper foil with a degree of 3 5 // m is fixed to the adhesive On the adhesive surface of the resin film, the heat conductive complex A was loaded and rolled on the copper foil surface by the rolling method to obtain a sheet having a total thickness of 0.2 mm and the thickness of the steel, the heat conductive complex A, and the heat conductive complex. After the film-formed surface of A was temporarily fixed on the gauge pressure film, the adhesive resin film was peeled off to expose the copper foil surface. Next, the dispersion of the heat-conductive complex C was placed on the exposed copper box by a knife coating method. Surface, and then heat-hardened to obtain a thermally conductive composite sheet of 0 · 21 mm with a thermal conductivity of 0 0 21 m on a single surface of a copper foil. A heat-conductive composite sheet having a heat conductive compound A on one side and a cured heat conductive complex c on one side was obtained by sandwiching a copper foil in the middle. Comparative Example 3 After the foil with a degree of 3 0 // m was adhered and fixed on the adhesive surface of the resin film with the adhesive, the thermally conductive complex A was directly placed on the single-sided surface of Mingyu by the rolling method to obtain an aluminum foil. A thermally conductive composite sheet having a total thickness of 0.2 mm with the thermally conductive complex A. Comparative Example 4 After a copper foil having a thickness of 35 # m was adhered and fixed on the adhesive surface of the resin film with the adhesive, the thermally conductive complex A was directly placed on the single-sided surface of the steel foil by the rolling method to obtain copper foil and heat conduction. The total thickness of the sexual complex A is 0.2 mm. Comparative Example 5 The thermally conductive complex A was sandwiched between two polypropylene films, and rolled by a rolling method to obtain a sheet of the thermally conductive complex A having a thickness of 0.2 mm. All the thermally conductive composite sheets produced in Examples 3 to 4 and Comparative Examples 3 to 5 were cut to 30x30 mm, and the thermal resistance values were measured. The results are shown in Table 2. 15 200522310 [Table 2] Example 3 Example 4 Comparative Example 3 Comparative Example 4 Comparative Example 5 Types of metal rhenium Aluminum copper in Lu copper without metal foil thickness (// m) 30 35 30 35 — of thermally conductive complexes Type A · CA · CAAA Thermal resistance (° C · cm / W2) 0.35 0.41 0.45 0.50 0.25 After assembly, it is easy to remove and easy to use (remarks) The method for measuring the thermal resistance is based on ASTM D5470. From the above results, it can be known that in the embodiment of the present invention, the heat conductive composite sheet integrated with the metal foil can be easily removed after assembly. In addition, the thermal conductive composite sheet on which the thermal conductive complex C is placed on the opposite side of the metal foil on which the thermal conductive complex A is placed, the contact state between the heat-generating electronic part and the heat sink and the heat conducting block is improved, and the thermal resistance value can be improved. Further decrease. In contrast, the sheets of Comparative Examples 3 to 4 did not have a thermally conductive complex C having a thickness of 10 mm, and the metal surface was exposed. Therefore, the contact surface had high thermal contact resistance, which is not preferred. In Examples 3 and 4, the thermal conductivity with the @c layer exists on the metal foil surface of ig ", which can reduce the contact thermal resistance of the contact surface. Therefore, the overall thermal resistance of the heat sink can be reduced. Also, a comparative example The sheet 5 has high adhesion between the heat-generating electronic parts, the heat sink, and the heat-conducting block, and it is not easy to remove the self-heating electronic parts and heat-conducting block after assembly. The heat is as explained above, and the embodiments of the present invention The obtained sexual composite sheet can be adhered and fixed on the resin film with adhesion, and the thermal conductive complex Tao can be recorded on the metal & without causing sensitive fingers, cracks or even unevenness. Formed with uniform thickness. The thermal resistance of the thermally conductive composite sheet obtained in this way is low, and after assembly, the aforementioned thermally conductive composite sheet can be easily self-heating and thermally conductive, which can fully achieve the goal: "In addition to exothermic X ^ rnrnrr obtained in Examples 3 to 4, compared with Examples 1 to 2, the thermal resistance between the exothermic electronic parts and the heat-dissipating rabbit can be reduced, and the aforementioned thermal conductivity can be easily recovered. Ground removal The heat sink and heat conduction block can fully achieve the goal. ^ In the cooling measures of heat-generating electronic parts (such as ⑽), in the past, the putty was used as a heat-dissipating material, and the use of the heat-dissipating material was dense: i phase was required. Block strength, but in the present invention, the mechanical strength is weak ... It is a heat-conductive complex-body body after fixing the adhesive to the resin film with the adhesive, so that it can be made into a volume =
【圖式簡單說明】 所不係本發明之一實施例的附金屬箔之熱傳導个 “勿片材之製造方法之截面圖。 - 圖2係顯示熱傳導性配合物片材之使用狀態之截面圖 【主要元件符號說明】 附黏著之樹脂膜 17 200522310 2 金屬箔 3 熱傳導性配合物片材 y 熱傳導性配合物成分 4 塗刀 5 CPU之鑄模部分 6 熱傳導性接著劑 7 散熱器 10 熱傳導性複合片[Brief description of the drawings] A cross-sectional view of a method for manufacturing a sheet of heat-conducting "not sheet" with a metal foil attached according to an embodiment of the present invention.-Figure 2 is a cross-sectional view showing a state of use of a sheet of a thermally conductive complex. [Description of main component symbols] Adhesive resin film 17 200522310 2 Metal foil 3 Thermally conductive complex sheet y Thermally conductive complex component 4 Coating knife 5 CPU mold part 6 Thermally conductive adhesive 7 Radiator 10 Thermally conductive composite sheet
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