TW200514485A - Adapter method and apparatus for interfacing a tester with a device under test - Google Patents

Adapter method and apparatus for interfacing a tester with a device under test

Info

Publication number
TW200514485A
TW200514485A TW093111111A TW93111111A TW200514485A TW 200514485 A TW200514485 A TW 200514485A TW 093111111 A TW093111111 A TW 093111111A TW 93111111 A TW93111111 A TW 93111111A TW 200514485 A TW200514485 A TW 200514485A
Authority
TW
Taiwan
Prior art keywords
tester
interface assembly
under test
device under
assembly
Prior art date
Application number
TW093111111A
Other languages
English (en)
Inventor
Chris R Jacobsen
Phillip A Driggers
John E Siefers
Brent W Thordarson
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200514485A publication Critical patent/TW200514485A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/3025Wireless interface with the DUT

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
TW093111111A 2003-10-10 2004-04-21 Adapter method and apparatus for interfacing a tester with a device under test TW200514485A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/685,327 US7009381B2 (en) 2002-03-21 2003-10-10 Adapter method and apparatus for interfacing a tester with a device under test

Publications (1)

Publication Number Publication Date
TW200514485A true TW200514485A (en) 2005-04-16

Family

ID=33452809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111111A TW200514485A (en) 2003-10-10 2004-04-21 Adapter method and apparatus for interfacing a tester with a device under test

Country Status (5)

Country Link
US (1) US7009381B2 (zh)
CN (1) CN1605881A (zh)
DE (1) DE102004030586A1 (zh)
GB (1) GB2407643A (zh)
TW (1) TW200514485A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494569B (zh) * 2009-04-03 2015-08-01 Dtg Int Gmbh 用於測試印刷電路板之測試裝置的接觸單元
TWI631345B (zh) * 2015-08-07 2018-08-01 美商克斯希拉公司 用於測試電路板之平行測試器的定位裝置及用於測試電路板的平行測試器

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7375542B2 (en) * 2004-06-30 2008-05-20 Teradyne, Inc. Automated test equipment with DIB mounted three dimensional tester electronics bricks
JP3875254B2 (ja) * 2005-05-30 2007-01-31 株式会社アドバンテスト 半導体試験装置及びインターフェースプレート
EP1904861A4 (en) * 2005-07-08 2013-05-29 Formfactor Inc TEST CARD ASSEMBLY WITH AN INTERCHANGEABLE TEST INSERT
SG131801A1 (en) * 2005-10-20 2007-05-28 Agilent Technologies Inc No-wire pcb with integrated circuit and method for testing using the same
US20090179657A1 (en) * 2008-01-11 2009-07-16 Eddie Lee Williamson Printed circuit board for coupling probes to a tester, and apparatus and test system using same
CN103308844B (zh) * 2012-03-16 2016-03-16 展讯通信(上海)有限公司 测试样板、故障定位方法、控制板和夹具的调试方法
CN104345189B (zh) * 2013-08-05 2018-08-10 深圳市共进电子股份有限公司 治具制作方法和治具
CN104316731B (zh) * 2014-10-29 2017-09-29 上海华岭集成电路技术股份有限公司 芯片测试板及芯片测试***
CN105866654A (zh) * 2016-05-25 2016-08-17 上海华岭集成电路技术股份有限公司 晶圆测试的控制方法
CN106324460B (zh) * 2016-11-08 2024-03-22 沈小晴 一种可换针盘式通用测试机构
USD851516S1 (en) * 2018-02-05 2019-06-18 Virginia Panel Corporation Interface test adapter

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK291184D0 (da) 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
EP0305734A3 (de) 1987-08-26 1989-04-05 Siemens Aktiengesellschaft Prüfanordnung für Leiterplatten
GB2214362A (en) 1988-01-13 1989-08-31 Gab Hsu Detachable open/short testing fixture device for testing P.C. Boards
FR2634025B1 (fr) 1988-07-08 1990-11-09 Thomson Csf Adaptateur de brochage pour le test de circuits imprimes de haute densite
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US5457380A (en) 1994-05-11 1995-10-10 Genrad, Inc. Circuit-test fixture that includes shorted-together probes
US5602490A (en) * 1995-03-14 1997-02-11 Genrad, Inc. Connector for automatic test equipment
US5896037A (en) * 1996-10-10 1999-04-20 Methode Electronics, Inc. Interface test adapter for actively testing an integrated circuit chip package
NL1004510C2 (nl) 1996-11-12 1998-05-14 Charmant Beheer B V Werkwijze voor het vervaardigen van een test-adapter alsmede test-adapter en een werkwijze voor het testen van printplaten.
US5986447A (en) 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6429671B1 (en) * 1998-11-25 2002-08-06 Advanced Micro Devices, Inc. Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card
US6476628B1 (en) 1999-06-28 2002-11-05 Teradyne, Inc. Semiconductor parallel tester
US6650134B1 (en) 2000-02-29 2003-11-18 Charles A. Schein Adapter assembly for connecting test equipment to a wireless test fixture
US6828773B2 (en) * 2002-03-21 2004-12-07 Agilent Technologies, Inc. Adapter method and apparatus for interfacing a tester with a device under test
US6759842B2 (en) 2002-04-17 2004-07-06 Eagle Test Systems, Inc. Interface adapter for automatic test systems

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494569B (zh) * 2009-04-03 2015-08-01 Dtg Int Gmbh 用於測試印刷電路板之測試裝置的接觸單元
TWI631345B (zh) * 2015-08-07 2018-08-01 美商克斯希拉公司 用於測試電路板之平行測試器的定位裝置及用於測試電路板的平行測試器

Also Published As

Publication number Publication date
GB2407643A (en) 2005-05-04
US20040108848A1 (en) 2004-06-10
DE102004030586A1 (de) 2005-05-12
CN1605881A (zh) 2005-04-13
US7009381B2 (en) 2006-03-07
GB0422306D0 (en) 2004-11-10

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