EP1904861A4 - Probe card assembly with an interchangeable probe insert - Google Patents

Probe card assembly with an interchangeable probe insert

Info

Publication number
EP1904861A4
EP1904861A4 EP06774597.6A EP06774597A EP1904861A4 EP 1904861 A4 EP1904861 A4 EP 1904861A4 EP 06774597 A EP06774597 A EP 06774597A EP 1904861 A4 EP1904861 A4 EP 1904861A4
Authority
EP
European Patent Office
Prior art keywords
probe
card assembly
interchangeable
insert
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06774597.6A
Other languages
German (de)
French (fr)
Other versions
EP1904861A2 (en
Inventor
Benjamin N Eldridge
Takao Saeki
Nobuhiro Kawamata
Carl V Reynolds
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Priority claimed from PCT/US2006/026723 external-priority patent/WO2007008790A2/en
Publication of EP1904861A2 publication Critical patent/EP1904861A2/en
Publication of EP1904861A4 publication Critical patent/EP1904861A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
EP06774597.6A 2005-07-08 2006-07-07 Probe card assembly with an interchangeable probe insert Withdrawn EP1904861A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59548005P 2005-07-08 2005-07-08
US36027005A 2005-12-21 2005-12-21
PCT/US2006/026723 WO2007008790A2 (en) 2005-07-08 2006-07-07 Probe card assembly with an interchangeable probe insert

Publications (2)

Publication Number Publication Date
EP1904861A2 EP1904861A2 (en) 2008-04-02
EP1904861A4 true EP1904861A4 (en) 2013-05-29

Family

ID=39126467

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06774597.6A Withdrawn EP1904861A4 (en) 2005-07-08 2006-07-07 Probe card assembly with an interchangeable probe insert

Country Status (3)

Country Link
EP (1) EP1904861A4 (en)
JP (1) JP2009500633A (en)
KR (1) KR101304031B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101278131B1 (en) * 2009-04-28 2013-07-05 가부시키가이샤 어드밴티스트 Wiring board unit and testing apparatus
KR101897008B1 (en) * 2012-03-08 2018-09-12 주식회사 코리아 인스트루먼트 Probe Card
JP6220596B2 (en) 2013-08-01 2017-10-25 東京エレクトロン株式会社 Prober
TW201606314A (en) * 2014-08-14 2016-02-16 漢民科技股份有限公司 台北巿大安區敦化南路2 段38 號14 樓 Probe card structure, assembling method thereof and replacing method thereof
KR102393600B1 (en) * 2020-09-11 2022-05-03 스테코 주식회사 Probe card

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656943A (en) * 1995-10-30 1997-08-12 Motorola, Inc. Apparatus for forming a test stack for semiconductor wafer probing and method for using the same
US20020118029A1 (en) * 1999-05-14 2002-08-29 Rikihito Yamasaka Probe card and contactor
US20030099097A1 (en) * 2001-11-27 2003-05-29 Sammy Mok Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US20040108848A1 (en) * 2002-03-21 2004-06-10 Jacobsen Chris R. Adapter method and apparatus for interfacing a tester with a device under test
US20050012513A1 (en) * 2003-07-17 2005-01-20 Shih-Jye Cheng Probe card assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163221B2 (en) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 Probe device
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
AU6509500A (en) * 1999-07-28 2001-02-19 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies
US6847218B1 (en) * 2002-05-13 2005-01-25 Cypress Semiconductor Corporation Probe card with an adapter layer for testing integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656943A (en) * 1995-10-30 1997-08-12 Motorola, Inc. Apparatus for forming a test stack for semiconductor wafer probing and method for using the same
US20020118029A1 (en) * 1999-05-14 2002-08-29 Rikihito Yamasaka Probe card and contactor
US20030099097A1 (en) * 2001-11-27 2003-05-29 Sammy Mok Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US20040108848A1 (en) * 2002-03-21 2004-06-10 Jacobsen Chris R. Adapter method and apparatus for interfacing a tester with a device under test
US20050012513A1 (en) * 2003-07-17 2005-01-20 Shih-Jye Cheng Probe card assembly

Also Published As

Publication number Publication date
JP2009500633A (en) 2009-01-08
KR101304031B1 (en) 2013-09-04
EP1904861A2 (en) 2008-04-02
KR20080041643A (en) 2008-05-13

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080204

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR IT

DAX Request for extension of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR IT

RIN1 Information on inventor provided before grant (corrected)

Inventor name: KAWAMATA, NOBUHIRO

Inventor name: SAEKI, TAKAO

Inventor name: ELDRIDGE, BENJAMIN, N.

Inventor name: REYNOLDS, CARL, V.

A4 Supplementary search report drawn up and despatched

Effective date: 20130426

RIC1 Information provided on ipc code assigned before grant

Ipc: G01R 1/073 20060101ALI20130422BHEP

Ipc: G01R 31/02 20060101AFI20130422BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20131126