TW200504166A - Fine-grain silver powder and process for producing the same (issue 1) - Google Patents

Fine-grain silver powder and process for producing the same (issue 1)

Info

Publication number
TW200504166A
TW200504166A TW093118759A TW93118759A TW200504166A TW 200504166 A TW200504166 A TW 200504166A TW 093118759 A TW093118759 A TW 093118759A TW 93118759 A TW93118759 A TW 93118759A TW 200504166 A TW200504166 A TW 200504166A
Authority
TW
Taiwan
Prior art keywords
flow channel
grain
fine
silver powder
grain silver
Prior art date
Application number
TW093118759A
Other languages
Chinese (zh)
Other versions
TWI304832B (en
Inventor
Takuya Sasaki
Masashi Kato
Katsuhiko Yoshimaru
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200504166A publication Critical patent/TW200504166A/en
Application granted granted Critical
Publication of TWI304832B publication Critical patent/TWI304832B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

This invention is to provide a fine-grain silver powder that has a grain size of minuteness not known in the prior art, exhibiting dispersion close to monodispersion with reduced grain aggregation. For obtaining the fine-grain silver powder, an aqueous solution of silver ammine complex (S1) is caused to flow through given flow channel (hereinafter referred to as "first flow channel"). Second flow channel (b) is disposed so as to join the middle of the first flow channel (a), and an organic reducing agent optionally together with an additive (S2) is caused to flow through the second flow channel (b). At confluence (m) of the first flow channel (a) and the second flow channel (b), contact and mixing is carried out so as to effect reduction deposition. Thus, there is obtained fine-grain silver powder of such powder characteristics not known in the prior art that the average diameter of primary grain (DIA) obtained by an image analysis of scanning electron microscope images is 0.6 m or less (a), the crystallite diameter 10 nm or less (b) and the sintering initiation temperature 240 DEG C or below.
TW093118759A 2003-07-29 2004-06-28 Fine-grain silver powder and process for producing the same (issue 1) TW200504166A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003281659A JP4489388B2 (en) 2003-07-29 2003-07-29 Method for producing fine silver powder

Publications (2)

Publication Number Publication Date
TW200504166A true TW200504166A (en) 2005-02-01
TWI304832B TWI304832B (en) 2009-01-01

Family

ID=34100959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118759A TW200504166A (en) 2003-07-29 2004-06-28 Fine-grain silver powder and process for producing the same (issue 1)

Country Status (9)

Country Link
US (1) US20080138238A1 (en)
JP (1) JP4489388B2 (en)
KR (1) KR101132282B1 (en)
CN (1) CN100455382C (en)
CA (1) CA2534107A1 (en)
DE (1) DE112004001399T5 (en)
HK (1) HK1092101A1 (en)
TW (1) TW200504166A (en)
WO (1) WO2005009651A1 (en)

Cited By (1)

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TWI468240B (en) * 2007-03-30 2015-01-11 Mitsubishi Materials Corp Silver fine particles, method for manufacturing silver fine particles, and apparatus for manufacturing silver fine particles

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WO2006126614A1 (en) * 2005-05-25 2006-11-30 Nihon Handa Co., Ltd. Paste-like silver composition, method for producing same, method for producing solid silver, solid silver, bonding method, and method for manufacturing circuit board
TWI441924B (en) * 2006-07-28 2014-06-21 Mitsubishi Materials Corp Silver particles, method for producing the same and apparatus for producing the same
WO2009090915A1 (en) 2008-01-17 2009-07-23 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
JP5355007B2 (en) * 2008-09-17 2013-11-27 Ｄｏｗａエレクトロニクス株式会社 Method for producing spherical silver powder
JP5492096B2 (en) 2009-01-23 2014-05-14 日亜化学工業株式会社 Semiconductor device and manufacturing method thereof
EP3163602A3 (en) 2009-01-23 2017-08-09 Nichia Corporation Method of producing a semiconductor device by bonding silver on a surface of a semiconductor element with silver on a surface of a base in air or in an oxygen environment
US8836130B2 (en) 2009-01-23 2014-09-16 Nichia Corporation Light emitting semiconductor element bonded to a base by a silver coating
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
TW201100185A (en) * 2009-05-01 2011-01-01 Du Pont Silver particles and a process for making them
KR101340171B1 (en) 2009-07-21 2013-12-10 니치아 카가쿠 고교 가부시키가이샤 Method for producing conductive material, conductive material obtained by the same method, electronic device containing the conductive material, and light-emitting device
TW201108249A (en) * 2009-08-25 2011-03-01 Du Pont Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP2011080094A (en) * 2009-10-02 2011-04-21 Toda Kogyo Corp Fine silver particle, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device
JP5659495B2 (en) * 2010-01-26 2015-01-28 三菱マテリアル株式会社 Method for forming electrode or wiring pattern
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
WO2012063747A1 (en) * 2010-11-08 2012-05-18 ナミックス株式会社 Metal particles and manufacturing method for same
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
CN102133635B (en) * 2011-05-02 2012-09-19 杨荣春 Silver powder and manufacturing method thereof
KR20140047663A (en) * 2011-07-29 2014-04-22 도다 고교 가부시끼가이샤 Fine silver particles, conductive paste containing fine silver particles, conductive film and electronic device
JP5354041B2 (en) 2012-02-24 2013-11-27 住友金属鉱山株式会社 Silver powder manufacturing method
WO2013133085A1 (en) * 2012-03-05 2013-09-12 ナミックス株式会社 Sintered silver microparticle compact
JP5510531B1 (en) * 2012-11-29 2014-06-04 住友金属鉱山株式会社 Silver powder and silver paste
TWI508799B (en) * 2012-12-06 2015-11-21 China Steel Corp A Method for Synthesis of Silver Powder with Adjustable Particle Size
JP6115405B2 (en) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 Silver powder manufacturing method
JP6086145B2 (en) * 2015-12-22 2017-03-01 住友金属鉱山株式会社 Silver powder manufacturing method
KR102033545B1 (en) * 2017-06-05 2019-10-17 대주전자재료 주식회사 Silver particle and method of manufacture thereof
CN107520460A (en) * 2017-07-26 2017-12-29 华南理工大学 A kind of superfine nano gold/nano-cellulose composite solution and preparation method thereof
EP4066968A4 (en) 2019-11-28 2023-08-02 M. Technique Co., Ltd. Method for producing fine particles of silver
CN114682792B (en) * 2022-04-14 2024-02-13 宁夏中色新材料有限公司 Spherical silver powder with high specific surface area and preparation method thereof
JP2023164097A (en) * 2022-04-28 2023-11-10 Ｄｏｗａエレクトロニクス株式会社 Spherical silver powder, method for producing spherical silver powder, apparatus for producing spherical silver powder, and conductive paste

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JPH01287210A (en) * 1988-05-12 1989-11-17 Tanaka Kikinzoku Kogyo Kk Manufacture of silver fine particle
US4979985A (en) * 1990-02-06 1990-12-25 E. I. Du Pont De Nemours And Company Process for making finely divided particles of silver metal
JPH04333504A (en) * 1991-05-10 1992-11-20 Sumitomo Metal Mining Co Ltd Continuous production of monodisperse fine silver powder
JP2001107101A (en) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd High dispersibility spherical silver powder and its producing method
JP4185267B2 (en) * 2001-07-25 2008-11-26 三井金属鉱業株式会社 Copper powder, method for producing the copper powder, copper paste using the copper powder, and printed wiring board using the copper paste
CN1174827C (en) * 2001-08-17 2004-11-10 中国科学院过程工程研究所 Preparation of hexagonal plate silver powder by chemical reduction process
JP2003129106A (en) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd Method for manufacturing nickel powder, nickel powder, nickel paste, and laminated ceramic electronic component
JP4109520B2 (en) * 2002-09-12 2008-07-02 三井金属鉱業株式会社 Low cohesive silver powder, method for producing the low cohesive silver powder, and conductive paste using the low cohesive silver powder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468240B (en) * 2007-03-30 2015-01-11 Mitsubishi Materials Corp Silver fine particles, method for manufacturing silver fine particles, and apparatus for manufacturing silver fine particles

Also Published As

Publication number Publication date
TWI304832B (en) 2009-01-01
US20080138238A1 (en) 2008-06-12
CN100455382C (en) 2009-01-28
WO2005009651A1 (en) 2005-02-03
KR20060035781A (en) 2006-04-26
CA2534107A1 (en) 2005-02-03
JP2005048236A (en) 2005-02-24
KR101132282B1 (en) 2012-04-02
JP4489388B2 (en) 2010-06-23
DE112004001399T5 (en) 2006-06-22
CN1826197A (en) 2006-08-30
HK1092101A1 (en) 2007-02-02

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