SU651432A1 - Aid for pressing pellet-type semiconductor device to cooler - Google Patents
Aid for pressing pellet-type semiconductor device to coolerInfo
- Publication number
- SU651432A1 SU651432A1 SU762325411A SU2325411A SU651432A1 SU 651432 A1 SU651432 A1 SU 651432A1 SU 762325411 A SU762325411 A SU 762325411A SU 2325411 A SU2325411 A SU 2325411A SU 651432 A1 SU651432 A1 SU 651432A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- elastic element
- semiconductor device
- elastic
- piston
- cooler
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
II
Изобретение относитс к попу проводниковым приборам, в частности к устройствам дл прижима полупроводниковых таблеточных приборов к охладител м . Мощные полупроводниковые диско образные приборы, например тиристоры и диоды, нааываемьзе таблеточными, дл осуществлени хорошего теплового и в некоторых сглуна х электриггесКогб контакта с охладитеием размещаютс между поперечинами, через которые с помощью прюкнмных приспособлений они прижимаютс к охладителюfl.The invention relates to a priory conductor device, in particular to devices for pressing semiconductor tablet devices to coolers. Powerful semiconductor disk-shaped devices, such as thyristors and diodes, are naively tablet, for achieving good thermal and, in some places, electrical contact contact with cooling, they are placed between the crossbars, through which they are pressed to the cooler with the help of fixtures.
Прижимна конструкци должна обесп чивать желаемое усилие прижима . проводншсового прибора к охлади гелю, его, присоед1гаеннек внетаней электричес кой цепи, и отвод возникающего при работе полупроводникового прибора тепла. Необходимо относительно точно определ ть усилие прижима, и равномерно прилагать его к поверхност м электродов этих дискообразных полупроводниковых приборов.The clamping structure must provide the desired clamping force. cooling the device to the gel, its connection between the helix of the external electrical circuit, and the heat arising from the operation of the semiconductor device. It is necessary to determine the pressing force relatively accurately, and uniformly apply it to the electrode surfaces of these disc-shaped semiconductor devices.
к недостаткам известных пр шимных конструкций или устройств относ тс жесткие, чрезмерные на11р жени , вызывающие пружинистость сопр гаемых элементов , неравномерное распределение прижксмного усили , привод щее к слишком большому трен5зю, проникновение пыли и загр знений.The disadvantages of well-known conventional structures or devices include stiff, excessive stresses, which cause springiness of the mating elements, uneven distribution of prizksmnogo effort, resulting in too much traction, the penetration of dust and contaminants.
Наиболее близким техническим решением к предложенному вл етс устройство дл прижима таблеточного прлупроводйикрвого прибора к охладителю, содержащее, по крайней мере, одну поперечину , средства дл закреплени , например болты, и изолирующий элемент, передающий давление 2 J.The closest technical solution to the proposed is a device for clamping the tablet pre-conductive device to the cooler, containing at least one cross-piece, means for fastening, for example, bolts, and an insulating element transmitting pressure 2 J.
Это устройство не обеспечивает равно мерного распределени прижимного уснЛИЯ ..This device does not provide an even distribution of the pressure clamp.
Цель изобретёга - повышение равномерности распределени прижимного э сиЛИЯ .The purpose of the invention is to increase the uniformity of the distribution of the pressure eILY.
Claims (2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CS119375A CS176675B1 (en) | 1975-02-24 | 1975-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SU651432A1 true SU651432A1 (en) | 1979-03-05 |
Family
ID=5345717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU762325411A SU651432A1 (en) | 1975-02-24 | 1976-02-24 | Aid for pressing pellet-type semiconductor device to cooler |
Country Status (6)
Country | Link |
---|---|
CH (1) | CH600570A5 (en) |
CS (1) | CS176675B1 (en) |
DD (1) | DD123251A1 (en) |
DE (1) | DE2604070C3 (en) |
PL (1) | PL97657B1 (en) |
SU (1) | SU651432A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2721438B1 (en) * | 1994-06-21 | 1996-10-18 | Jacques Daniel Lhomme | Clamping device usable in particular for power semiconductors. |
-
1975
- 1975-02-24 CS CS119375A patent/CS176675B1/cs unknown
-
1976
- 1976-01-27 CH CH98976A patent/CH600570A5/xx not_active IP Right Cessation
- 1976-02-03 DE DE19762604070 patent/DE2604070C3/en not_active Expired
- 1976-02-03 PL PL18699976A patent/PL97657B1/en unknown
- 1976-02-20 DD DD19137276A patent/DD123251A1/xx unknown
- 1976-02-24 SU SU762325411A patent/SU651432A1/en active
Also Published As
Publication number | Publication date |
---|---|
DE2604070B2 (en) | 1978-08-31 |
PL97657B1 (en) | 1978-03-30 |
CH600570A5 (en) | 1978-06-15 |
CS176675B1 (en) | 1977-06-30 |
DE2604070A1 (en) | 1976-09-09 |
DE2604070C3 (en) | 1979-05-03 |
DD123251A1 (en) | 1976-12-05 |
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