DD123251A1 - - Google Patents
Info
- Publication number
- DD123251A1 DD123251A1 DD19137276A DD19137276A DD123251A1 DD 123251 A1 DD123251 A1 DD 123251A1 DD 19137276 A DD19137276 A DD 19137276A DD 19137276 A DD19137276 A DD 19137276A DD 123251 A1 DD123251 A1 DD 123251A1
- Authority
- DD
- German Democratic Republic
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CS119375A CS176675B1 (en) | 1975-02-24 | 1975-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
DD123251A1 true DD123251A1 (en) | 1976-12-05 |
Family
ID=5345717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD19137276A DD123251A1 (en) | 1975-02-24 | 1976-02-20 |
Country Status (6)
Country | Link |
---|---|
CH (1) | CH600570A5 (en) |
CS (1) | CS176675B1 (en) |
DD (1) | DD123251A1 (en) |
DE (1) | DE2604070C3 (en) |
PL (1) | PL97657B1 (en) |
SU (1) | SU651432A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2721438B1 (en) * | 1994-06-21 | 1996-10-18 | Jacques Daniel Lhomme | Clamping device usable in particular for power semiconductors. |
-
1975
- 1975-02-24 CS CS119375A patent/CS176675B1/cs unknown
-
1976
- 1976-01-27 CH CH98976A patent/CH600570A5/xx not_active IP Right Cessation
- 1976-02-03 DE DE19762604070 patent/DE2604070C3/en not_active Expired
- 1976-02-03 PL PL18699976A patent/PL97657B1/en unknown
- 1976-02-20 DD DD19137276A patent/DD123251A1/xx unknown
- 1976-02-24 SU SU762325411A patent/SU651432A1/en active
Also Published As
Publication number | Publication date |
---|---|
DE2604070B2 (en) | 1978-08-31 |
PL97657B1 (en) | 1978-03-30 |
SU651432A1 (en) | 1979-03-05 |
CH600570A5 (en) | 1978-06-15 |
CS176675B1 (en) | 1977-06-30 |
DE2604070A1 (en) | 1976-09-09 |
DE2604070C3 (en) | 1979-05-03 |