FR2721438B1 - Clamping device usable in particular for power semiconductors. - Google Patents

Clamping device usable in particular for power semiconductors.

Info

Publication number
FR2721438B1
FR2721438B1 FR9407849A FR9407849A FR2721438B1 FR 2721438 B1 FR2721438 B1 FR 2721438B1 FR 9407849 A FR9407849 A FR 9407849A FR 9407849 A FR9407849 A FR 9407849A FR 2721438 B1 FR2721438 B1 FR 2721438B1
Authority
FR
France
Prior art keywords
clamping device
power semiconductors
device usable
usable
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9407849A
Other languages
French (fr)
Other versions
FR2721438A1 (en
Inventor
Jacques Daniel Lhomme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR9407849A priority Critical patent/FR2721438B1/en
Publication of FR2721438A1 publication Critical patent/FR2721438A1/en
Application granted granted Critical
Publication of FR2721438B1 publication Critical patent/FR2721438B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9407849A 1994-06-21 1994-06-21 Clamping device usable in particular for power semiconductors. Expired - Fee Related FR2721438B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9407849A FR2721438B1 (en) 1994-06-21 1994-06-21 Clamping device usable in particular for power semiconductors.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9407849A FR2721438B1 (en) 1994-06-21 1994-06-21 Clamping device usable in particular for power semiconductors.

Publications (2)

Publication Number Publication Date
FR2721438A1 FR2721438A1 (en) 1995-12-22
FR2721438B1 true FR2721438B1 (en) 1996-10-18

Family

ID=9464666

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9407849A Expired - Fee Related FR2721438B1 (en) 1994-06-21 1994-06-21 Clamping device usable in particular for power semiconductors.

Country Status (1)

Country Link
FR (1) FR2721438B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2234154B1 (en) 2000-04-19 2016-03-30 Denso Corporation Coolant cooled type semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT992650B (en) * 1973-07-19 1975-09-30 Ates Componenti Elettron ELEMENT FOR COUPLING A HEAT RADIATOR WITH THE THERMAL MASS OF A DEVICE INTEGRATED IN THE MOUNTING ON THE PRINT CIRCUIT
CS176675B1 (en) * 1975-02-24 1977-06-30
DE2841370A1 (en) * 1978-09-22 1980-03-27 Siemens Ag Clamping device for semiconductor chip - is pressed by set of cup springs with degressive characteristic, with each spring compressed to reach degressive area
FR2639476B1 (en) * 1988-11-24 1992-12-04 Commissariat Energie Atomique ELECTRICALLY INSULATING COMPOSITE ELEMENTS AND GOOD THERMAL CONDUCTORS AND ASSEMBLIES USING SUCH ELEMENTS
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors

Also Published As

Publication number Publication date
FR2721438A1 (en) 1995-12-22

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Legal Events

Date Code Title Description
ST Notification of lapse