SG80537A1 - Low viscosity and solvent-free one-component type epoxy resin adhesive composition - Google Patents
Low viscosity and solvent-free one-component type epoxy resin adhesive compositionInfo
- Publication number
- SG80537A1 SG80537A1 SG9606076A SG1996006076A SG80537A1 SG 80537 A1 SG80537 A1 SG 80537A1 SG 9606076 A SG9606076 A SG 9606076A SG 1996006076 A SG1996006076 A SG 1996006076A SG 80537 A1 SG80537 A1 SG 80537A1
- Authority
- SG
- Singapore
- Prior art keywords
- solvent
- free
- epoxy resin
- adhesive composition
- type epoxy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/145—Compounds containing one epoxy group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26497392 | 1992-10-02 | ||
JP20420393A JP3454437B2 (ja) | 1992-10-02 | 1993-08-18 | 低粘度無溶媒の一液型エポキシ樹脂接着性組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG80537A1 true SG80537A1 (en) | 2001-05-22 |
Family
ID=26514339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9606076A SG80537A1 (en) | 1992-10-02 | 1993-09-30 | Low viscosity and solvent-free one-component type epoxy resin adhesive composition |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0590975A1 (zh) |
JP (1) | JP3454437B2 (zh) |
KR (1) | KR940009311A (zh) |
CN (1) | CN1087366A (zh) |
SG (1) | SG80537A1 (zh) |
TW (1) | TW276267B (zh) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06248053A (ja) * | 1993-02-23 | 1994-09-06 | Dainippon Toryo Co Ltd | エポキシ樹脂塗料組成物 |
CA2138077A1 (en) * | 1993-12-21 | 1995-06-22 | Dilipkumar N. Shah | Flexibilized polyepoxide resins |
JP3399095B2 (ja) * | 1994-07-04 | 2003-04-21 | 新日本理化株式会社 | 液状エポキシ樹脂組成物 |
JPH08100049A (ja) * | 1994-09-30 | 1996-04-16 | Dainippon Ink & Chem Inc | 半導体封止材料用エポキシ樹脂組成物 |
JP3340882B2 (ja) * | 1995-05-02 | 2002-11-05 | 日東電工株式会社 | 半導体素子封止用エポキシ樹脂組成物と樹脂封止型半導体装置 |
US5575956A (en) * | 1995-07-19 | 1996-11-19 | Hughes Aircraft Company | Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives |
EP0754741B1 (en) * | 1995-07-19 | 2001-10-24 | Raytheon Company | Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
JP3568742B2 (ja) * | 1997-08-01 | 2004-09-22 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
JP3568743B2 (ja) * | 1997-08-05 | 2004-09-22 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
JP3608908B2 (ja) * | 1997-08-05 | 2005-01-12 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
CA2304539C (en) | 1997-09-26 | 2008-08-05 | The Dow Chemical Company | Flexible epoxy sound damping coatings |
US6153709A (en) * | 1998-01-26 | 2000-11-28 | Essex Specialty Products, Inc. | Chip resistant, vibration damping coatings for vehicles |
JP2000013033A (ja) * | 1998-06-25 | 2000-01-14 | Denso Corp | プリント配線板及び電子装置 |
EP1203792A4 (en) | 1999-02-25 | 2002-05-29 | Nitto Denko Corp | RESIN COMPOSITION FOR SEMICONDUCTOR ENCLOSURE, SEMICONDUCTOR COMPONENT OBTAINED therefrom, AND METHOD FOR THE PRODUCTION OF SEMICONDUCTOR COMPONENTS |
ES2281412T3 (es) | 2000-04-21 | 2007-10-01 | Mitsubishi Rayon Co., Ltd. | Composicion de resina epoxi y prepreg fabricado con la composicion de resina epoxi. |
US20060128835A1 (en) * | 2002-10-25 | 2006-06-15 | Taketoshi Usui | Capsule type hardener and composition |
CN101143998B (zh) * | 2002-12-05 | 2011-03-09 | 索尼化学株式会社 | 潜在性硬化剂、其制造方法和粘接剂 |
US7186945B2 (en) * | 2003-10-15 | 2007-03-06 | National Starch And Chemical Investment Holding Corporation | Sprayable adhesive material for laser marking semiconductor wafers and dies |
US6974728B2 (en) * | 2003-12-08 | 2005-12-13 | Intel Corporation | Encapsulant mixture having a polymer bound catalyst |
JP2005272647A (ja) * | 2004-03-25 | 2005-10-06 | Aisin Chem Co Ltd | 構造用接着剤組成物 |
JP5057011B2 (ja) * | 2005-06-06 | 2012-10-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP4877717B2 (ja) * | 2005-09-29 | 2012-02-15 | 旭化成イーマテリアルズ株式会社 | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP4877716B2 (ja) * | 2005-09-29 | 2012-02-15 | 旭化成イーマテリアルズ株式会社 | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
WO2007088889A1 (ja) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ-バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
WO2009005135A1 (ja) * | 2007-07-05 | 2009-01-08 | Asahi Kasei E-Materials Corporation | エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 |
JP2010053353A (ja) * | 2008-07-29 | 2010-03-11 | Hitachi Chem Co Ltd | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料 |
JP5596385B2 (ja) * | 2010-03-23 | 2014-09-24 | 旭化成イーマテリアルズ株式会社 | マスターバッチ型エポキシ樹脂用硬化剤 |
JP4965715B1 (ja) * | 2011-02-03 | 2012-07-04 | ナミックス株式会社 | エポキシ樹脂組成物およびそれを用いた半導体封止材 |
CN102174244B (zh) * | 2011-02-11 | 2013-03-13 | 宁波大榭开发区综研化学有限公司 | 一种绝缘防水环氧树脂组合物及胶带及其制备方法 |
CN102153979B (zh) * | 2011-03-01 | 2013-04-24 | 北京工业大学 | 一种可用于无铅焊接中的中温快速固化贴片胶 |
JP5677883B2 (ja) * | 2011-03-29 | 2015-02-25 | 住友化学株式会社 | 光硬化性接着剤、偏光板および積層光学部材 |
JP5827483B2 (ja) * | 2011-03-29 | 2015-12-02 | 住友化学株式会社 | 光硬化性接着剤を使用した偏光板および積層光学部材 |
DE102011050871A1 (de) | 2011-06-06 | 2012-12-06 | Dürr Systems GmbH | Verfahren zum Beschichten und/oder Lackieren von Fahrzeugteilen, zur Herstellung ausgehärteter Kunststoffmassen sowie ein Zwei- oder Mehrkomponenten-Reaktivsystem hierfür |
JP5772450B2 (ja) * | 2011-09-28 | 2015-09-02 | 住友ベークライト株式会社 | 一液性エポキシ樹脂組成物及び硬化物 |
CN103012775B (zh) * | 2012-12-03 | 2017-08-01 | 合肥杰事杰新材料股份有限公司 | 一种浇铸尼龙6复合材料及其制备方法 |
KR102175696B1 (ko) * | 2012-12-14 | 2020-11-06 | 블루 큐브 아이피 엘엘씨 | 고 고형분 에폭시 코팅 |
WO2016075708A1 (en) | 2014-11-11 | 2016-05-19 | Council Of Scientific & Industrial Research | Microcapsule composition containing watersoluble amine and a process for the preparation thereof |
CN104371624A (zh) * | 2014-11-24 | 2015-02-25 | 南京信息工程大学 | 一种封装电涌保护器的环氧薄封胶及其制备、使用方法 |
CN104589667B (zh) * | 2014-12-02 | 2017-04-12 | 陕西生益科技有限公司 | 覆铜板用粘结片的制备方法及其应用 |
CN105038492A (zh) * | 2015-06-16 | 2015-11-11 | 湘潭瑞鑫电气科技有限责任公司 | 一种非晶合金专用无溶剂环氧整体浸渍漆及其制备方法 |
JP6915025B2 (ja) * | 2015-11-20 | 2021-08-04 | 旭化成株式会社 | 封止材用エポキシ樹脂組成物、及び封止材 |
KR20180114950A (ko) * | 2016-03-18 | 2018-10-19 | 대니 워렌 | Bpa 프리의 분무가능한 에폭시 수지 |
US11059967B2 (en) | 2016-12-13 | 2021-07-13 | 3M Innovative Properties Company | Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods |
CN110317560B (zh) * | 2018-03-30 | 2023-01-31 | 住友橡胶工业株式会社 | 有机纤维用黏合剂组合物、有机纤维的处理方法、有机纤维和轮胎 |
JP2019189864A (ja) * | 2018-04-24 | 2019-10-31 | 阪本薬品工業株式会社 | エポキシ樹脂組成物およびその硬化物 |
CN109266276A (zh) * | 2018-09-20 | 2019-01-25 | 佛山市蓝瑞欧特信息服务有限公司 | 建筑材料用的高效快干型硬化胶 |
EP3873986A4 (en) * | 2018-10-29 | 2022-06-22 | Henkel AG & Co. KGaA | THERMOCONDUCTIVE COATING COMPOSITION |
CN109637753A (zh) * | 2019-01-24 | 2019-04-16 | 铜陵有色金属集团铜冠建筑安装股份有限公司 | 一种铜排表面三色绝缘管套装方法 |
CN111793450B (zh) * | 2020-07-23 | 2023-01-24 | 黑龙江省科学院石油化学研究院 | 一种应用在吸声降噪蜂窝板上的具有热破性能的中高温固化环氧结构胶膜及其制备方法 |
CN112341975B (zh) * | 2020-11-25 | 2022-03-08 | 中路交科科技股份有限公司 | 一种二阶环氧粘层油、制备方法及其应用方法 |
JPWO2023286499A1 (zh) | 2021-07-12 | 2023-01-19 | ||
CN114456755B (zh) * | 2021-12-30 | 2024-03-12 | 江苏中科科化新材料股份有限公司 | 环氧树脂组合物及其制备方法和应用 |
CN115011294B (zh) * | 2022-06-07 | 2023-02-10 | 道尔化成电子材料(上海)有限公司 | 一种芯片封装用烧结型纳米银导电胶及其制备方法 |
CN117603640B (zh) * | 2024-01-12 | 2024-04-05 | 苏州润邦半导体材料科技有限公司 | 一种单组分环氧遮光胶及其制备方法和液晶显示器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0348416A (ja) * | 1989-07-17 | 1991-03-01 | Nitsuko Corp | フィルムコンデンサ用下塗り含浸剤 |
JPH03281625A (ja) * | 1990-03-30 | 1991-12-12 | Somar Corp | 液状エポキシ樹脂組成物 |
EP0552976A1 (en) * | 1992-01-22 | 1993-07-28 | W.R. Grace & Co.-Conn. | Spherical potential curing agent for epoxy resin and preparation thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0813955B2 (ja) * | 1988-10-07 | 1996-02-14 | 日立化成工業株式会社 | フイルム状接着剤の製造方法 |
JPH02292325A (ja) * | 1989-05-02 | 1990-12-03 | Nitto Denko Corp | マイクロカプセル型アミン系硬化剤を用いたエポキシ樹脂組成物 |
JPH02300229A (ja) * | 1989-05-16 | 1990-12-12 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
-
1993
- 1993-08-18 JP JP20420393A patent/JP3454437B2/ja not_active Expired - Fee Related
- 1993-09-27 KR KR1019930020539A patent/KR940009311A/ko not_active Application Discontinuation
- 1993-09-30 CN CN93114445A patent/CN1087366A/zh active Pending
- 1993-09-30 SG SG9606076A patent/SG80537A1/en unknown
- 1993-09-30 EP EP93307751A patent/EP0590975A1/en not_active Withdrawn
- 1993-10-01 TW TW082108080A patent/TW276267B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0348416A (ja) * | 1989-07-17 | 1991-03-01 | Nitsuko Corp | フィルムコンデンサ用下塗り含浸剤 |
JPH03281625A (ja) * | 1990-03-30 | 1991-12-12 | Somar Corp | 液状エポキシ樹脂組成物 |
EP0552976A1 (en) * | 1992-01-22 | 1993-07-28 | W.R. Grace & Co.-Conn. | Spherical potential curing agent for epoxy resin and preparation thereof |
Also Published As
Publication number | Publication date |
---|---|
JP3454437B2 (ja) | 2003-10-06 |
EP0590975A1 (en) | 1994-04-06 |
TW276267B (zh) | 1996-05-21 |
JPH06207152A (ja) | 1994-07-26 |
KR940009311A (ko) | 1994-05-20 |
CN1087366A (zh) | 1994-06-01 |
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