SG71753A1 - Optical curing process for integrated circuit package assembly - Google Patents
Optical curing process for integrated circuit package assemblyInfo
- Publication number
- SG71753A1 SG71753A1 SG1998000252A SG1998000252A SG71753A1 SG 71753 A1 SG71753 A1 SG 71753A1 SG 1998000252 A SG1998000252 A SG 1998000252A SG 1998000252 A SG1998000252 A SG 1998000252A SG 71753 A1 SG71753 A1 SG 71753A1
- Authority
- SG
- Singapore
- Prior art keywords
- integrated circuit
- curing process
- circuit package
- package assembly
- optical curing
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25520094A | 1994-06-07 | 1994-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG71753A1 true SG71753A1 (en) | 2000-04-18 |
Family
ID=22967277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998000252A SG71753A1 (en) | 1994-06-07 | 1995-06-07 | Optical curing process for integrated circuit package assembly |
Country Status (5)
Country | Link |
---|---|
US (1) | US5846476A (ko) |
EP (2) | EP0691679A3 (ko) |
JP (1) | JPH08340013A (ko) |
KR (1) | KR100377981B1 (ko) |
SG (1) | SG71753A1 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783025A (en) * | 1994-06-07 | 1998-07-21 | Texas Instruments Incorporated | Optical diebonding for semiconductor devices |
US6041994A (en) * | 1994-06-07 | 2000-03-28 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
TW312045B (en) | 1995-04-25 | 1997-08-01 | Texas Instruments Inc | Radiant chamber and method for lid seal in ceramic packaging |
TW315493B (en) * | 1996-02-28 | 1997-09-11 | Tokyo Electron Co Ltd | Heating apparatus and heat treatment apparatus |
US5993591A (en) * | 1996-12-18 | 1999-11-30 | Texas Instruments Incorporated | Coring of leadframes in carriers via radiant heat source |
US6730541B2 (en) * | 1997-11-20 | 2004-05-04 | Texas Instruments Incorporated | Wafer-scale assembly of chip-size packages |
ID21876A (id) * | 1998-02-26 | 1999-08-05 | Sumitomo Wiring Systems | Pembawa angkutan, sistem pemanasan untuk penggunaan bersamanya dan metoda untuk menutup bagian sambungan kawat |
US6299804B1 (en) * | 1999-09-16 | 2001-10-09 | Husky Injection Molding Systems Ltd. | Air cooling system for preform molding |
DE10147789B4 (de) * | 2001-09-27 | 2004-04-15 | Infineon Technologies Ag | Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips |
JP3786097B2 (ja) * | 2002-03-25 | 2006-06-14 | セイコーエプソン株式会社 | 圧電デバイスの蓋封止方法及び圧電デバイスの製造方法並びに圧電デバイスの蓋封止装置 |
JP4421218B2 (ja) * | 2003-05-21 | 2010-02-24 | 大日本スクリーン製造株式会社 | 熱処理装置 |
US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
DE102005029407B4 (de) * | 2005-06-24 | 2008-06-19 | Mühlbauer Ag | Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat |
US7826724B2 (en) * | 2006-04-24 | 2010-11-02 | Nordson Corporation | Electronic substrate non-contact heating system and method |
DE102006054357A1 (de) * | 2006-11-17 | 2008-05-21 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Sockel für eine Reflektor-Lampenanordnung |
KR101049369B1 (ko) * | 2009-03-10 | 2011-07-14 | 오성엘에스티(주) | 인라인 타입 큐어장치 |
US20130256281A1 (en) * | 2012-03-30 | 2013-10-03 | Tatsumi Tsuchiya | Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive |
CN107112248B (zh) * | 2015-11-05 | 2021-07-27 | 古河电气工业株式会社 | 芯片接合装置以及芯片接合方法 |
JP6419256B1 (ja) * | 2017-04-28 | 2018-11-07 | 株式会社 後島精工 | ボンディング装置の不活性ガスフローシステム |
US11608453B2 (en) * | 2018-01-25 | 2023-03-21 | Kulicke And Soffa Industries, Inc. | Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2388042A (en) * | 1943-02-17 | 1945-10-30 | Gen Motors Corp | Method of sealing storage batteries |
US2638633A (en) * | 1949-09-08 | 1953-05-19 | United Shoe Machinery Corp | Molding of resin dispersions |
US2941934A (en) * | 1957-01-16 | 1960-06-21 | Gen Aniline & Film Corp | Polymerization by temperature controlled irradiation |
US4167669A (en) * | 1971-09-09 | 1979-09-11 | Xenon Corporation | Apparatus for rapid curing of resinous materials and method |
JPS5475065A (en) * | 1977-11-28 | 1979-06-15 | Asahi Chemical Ind | Preparation of film circuit substrate |
JPS562646A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Removal and reinstallation of silicon chip |
US4460537A (en) * | 1982-07-26 | 1984-07-17 | Motorola, Inc. | Slot transfer molding apparatus and methods |
JPS5930470A (ja) * | 1982-08-13 | 1984-02-18 | Hitachi Ltd | 配線基板のハンダ付方法 |
EP0114258A1 (en) * | 1982-11-30 | 1984-08-01 | Kabushiki Kaisha Toshiba | Resin encapsulation type photo-semiconductor devices |
US4699888A (en) * | 1985-09-16 | 1987-10-13 | Technology Glass Corporation | Die/attach composition |
FR2592221B1 (fr) * | 1985-12-20 | 1988-02-12 | Radiotechnique Compelec | Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique |
JPH0674479B2 (ja) * | 1986-10-09 | 1994-09-21 | スカイアルミニウム株式会社 | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 |
JPS63283054A (ja) * | 1987-03-11 | 1988-11-18 | Fuji Plant Kogyo Kk | ピン保持部付リードフレームの製造方法 |
JPS6442136A (en) * | 1987-08-07 | 1989-02-14 | Nitto Denko Corp | Manufacture of semiconductor device |
JPS6451619A (en) * | 1987-08-21 | 1989-02-27 | Dainippon Screen Mfg | Heat treatment equipment for substrate |
EP0307608B1 (de) * | 1987-09-16 | 1992-05-13 | Siemens Aktiengesellschaft | Anordnung zur Durchführung eines Ausheilprozesses an einer Halbleiterscheibe und Verfahren zum Ausheilen einer Halbleiterscheibe |
DE3744764A1 (de) * | 1987-11-20 | 1989-06-01 | Messerschmitt Boelkow Blohm | Verfahren zur herstellung von klebeverbindungen mittels laser |
DE3806738C1 (ko) * | 1988-03-02 | 1989-09-07 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | |
JP2684677B2 (ja) * | 1988-05-25 | 1997-12-03 | 株式会社日立製作所 | 半導体装置の製造方法 |
US4913930A (en) * | 1988-06-28 | 1990-04-03 | Wacker Silicones Corporation | Method for coating semiconductor components on a dielectric film |
KR0157844B1 (ko) * | 1988-07-15 | 1998-10-15 | 모리나카 마사미 | 수지봉지형 반도체장치 및 제조방법 |
JPH0322543A (ja) * | 1989-06-05 | 1991-01-30 | Siemens Ag | 電子デバイスの被覆方法及び装置 |
JPH0482215A (ja) * | 1990-07-25 | 1992-03-16 | Sumitomo Electric Ind Ltd | ランプアニール装置 |
US4996170A (en) * | 1990-07-30 | 1991-02-26 | Motorola, Inc. | Molding process for encapsulating semiconductor devices using a thixotropic compound |
DE4127009C2 (de) * | 1991-08-16 | 1994-07-28 | Brkljacic Silva Geb Marjanovic | Verfahren zum Prüfen von fotopolymeren Lötabdeckmasken, die auf Leiterplatten aus glasfaserverstärktem Epoxidharz aufgetragen sind und Vorrichtung zur Durchführung des Verfahrens |
JP3175979B2 (ja) * | 1992-09-14 | 2001-06-11 | 株式会社東芝 | 樹脂封止型半導体装置 |
-
1995
- 1995-06-05 KR KR1019950014791A patent/KR100377981B1/ko not_active IP Right Cessation
- 1995-06-06 JP JP7139337A patent/JPH08340013A/ja active Pending
- 1995-06-07 SG SG1998000252A patent/SG71753A1/en unknown
- 1995-06-07 EP EP95108776A patent/EP0691679A3/en not_active Withdrawn
- 1995-06-07 EP EP96105280A patent/EP0723289A3/en not_active Ceased
-
1997
- 1997-05-02 US US08/848,942 patent/US5846476A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0723289A2 (en) | 1996-07-24 |
JPH08340013A (ja) | 1996-12-24 |
US5846476A (en) | 1998-12-08 |
EP0691679A2 (en) | 1996-01-10 |
EP0691679A3 (en) | 1996-05-01 |
KR100377981B1 (ko) | 2003-05-27 |
EP0723289A3 (en) | 1997-04-09 |
KR960002709A (ko) | 1996-01-26 |
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