SG65717A1 - Printed circuit boards - Google Patents
Printed circuit boardsInfo
- Publication number
- SG65717A1 SG65717A1 SG1997004665A SG1997004665A SG65717A1 SG 65717 A1 SG65717 A1 SG 65717A1 SG 1997004665 A SG1997004665 A SG 1997004665A SG 1997004665 A SG1997004665 A SG 1997004665A SG 65717 A1 SG65717 A1 SG 65717A1
- Authority
- SG
- Singapore
- Prior art keywords
- printed circuit
- circuit boards
- boards
- printed
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0588—Second resist used as pattern over first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7139501A JPH08335781A (ja) | 1995-06-06 | 1995-06-06 | 多層プリント配線板 |
JP14451695A JPH08340173A (ja) | 1995-06-12 | 1995-06-12 | プリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG65717A1 true SG65717A1 (en) | 1999-06-22 |
Family
ID=26472294
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997004665A SG65717A1 (en) | 1995-06-06 | 1996-06-06 | Printed circuit boards |
SG1998003654A SG71838A1 (en) | 1995-06-06 | 1996-06-06 | Printed circuit boards |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998003654A SG71838A1 (en) | 1995-06-06 | 1996-06-06 | Printed circuit boards |
Country Status (7)
Country | Link |
---|---|
US (2) | US6291778B1 (ko) |
EP (1) | EP0776150B1 (ko) |
KR (1) | KR100307776B1 (ko) |
CN (1) | CN1080981C (ko) |
DE (1) | DE69636212T2 (ko) |
SG (2) | SG65717A1 (ko) |
WO (1) | WO1996039796A1 (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3050807B2 (ja) | 1996-06-19 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JP3050812B2 (ja) | 1996-08-05 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
CN101106872B (zh) * | 1997-07-08 | 2010-06-23 | 伊比登株式会社 | 印刷电路板及其制造方法 |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
WO1999021224A1 (fr) | 1997-10-17 | 1999-04-29 | Ibiden Co., Ltd. | Substrat d'un boitier |
WO1999034654A1 (fr) * | 1997-12-29 | 1999-07-08 | Ibiden Co., Ltd. | Plaquette a circuits imprimes multicouche |
KR100633678B1 (ko) | 1998-02-26 | 2006-10-11 | 이비덴 가부시키가이샤 | 필드 바이어 구조를 갖는 다층프린트 배선판 |
JPH11297889A (ja) | 1998-04-16 | 1999-10-29 | Sony Corp | 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法 |
JP2001251040A (ja) * | 2000-03-06 | 2001-09-14 | Stanley Electric Co Ltd | 高周波用回路基板及びその製造方法 |
JP2001274537A (ja) * | 2000-03-28 | 2001-10-05 | Ngk Spark Plug Co Ltd | 配線基板及び配線基板の製造方法 |
KR100546695B1 (ko) * | 2000-08-24 | 2006-01-26 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 가요성 필름 구조 |
US7759803B2 (en) * | 2001-07-25 | 2010-07-20 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing the same |
EP1392089A1 (en) * | 2002-08-21 | 2004-02-25 | Ultratera Corporation | Printed circuit board with self align bonding pads thereon |
DE112005000522T5 (de) * | 2004-03-03 | 2007-01-18 | Shinko Electric Industries Co., Ltd. | Platinen-Herstellungsverfahren und Platine |
US7190157B2 (en) * | 2004-10-25 | 2007-03-13 | Agilent Technologies, Inc. | Method and apparatus for layout independent test point placement on a printed circuit board |
JP5050384B2 (ja) | 2006-03-31 | 2012-10-17 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
US20080123335A1 (en) * | 2006-11-08 | 2008-05-29 | Jong Kun Yoo | Printed circuit board assembly and display having the same |
JP2008147458A (ja) * | 2006-12-11 | 2008-06-26 | Nec Electronics Corp | プリント配線板およびその製造方法 |
CN100531527C (zh) * | 2007-01-23 | 2009-08-19 | 李东明 | 印刷电路板掩膜露孔电镀成型工艺 |
JP2008205132A (ja) * | 2007-02-19 | 2008-09-04 | Nec Corp | プリント配線板及びこれとフレキシブルプリント基板とのはんだ接続構造並びに方法 |
JP2009246166A (ja) * | 2008-03-31 | 2009-10-22 | Fujitsu Ltd | 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法 |
KR101022942B1 (ko) * | 2008-11-12 | 2011-03-16 | 삼성전기주식회사 | 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법 |
US8388824B2 (en) * | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
JP5269563B2 (ja) * | 2008-11-28 | 2013-08-21 | 新光電気工業株式会社 | 配線基板とその製造方法 |
KR101038235B1 (ko) | 2009-08-31 | 2011-06-01 | 삼성전기주식회사 | 인쇄회로기판 |
CN101754579B (zh) * | 2009-11-16 | 2012-02-22 | 华为终端有限公司 | 城堡式模块及终端设备 |
TW201325338A (zh) * | 2011-12-14 | 2013-06-16 | Wistron Corp | 避免金手指結構沾錫之電路板 |
KR20140086531A (ko) * | 2012-12-28 | 2014-07-08 | 삼성전기주식회사 | 패키지 기판 및 그 제조방법, 그리고 패키지 온 패키지 기판 |
KR20160010960A (ko) * | 2014-07-21 | 2016-01-29 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US10515884B2 (en) * | 2015-02-17 | 2019-12-24 | Advanced Semiconductor Engineering, Inc. | Substrate having a conductive structure within photo-sensitive resin |
US10204889B2 (en) * | 2016-11-28 | 2019-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of forming thereof |
US20220046792A1 (en) * | 2020-08-07 | 2022-02-10 | Infineon Technologies Ag | Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118595A (en) * | 1977-06-06 | 1978-10-03 | Bell Telephone Laboratories, Incorporated | Crossovers and method of fabrication |
FR2567709B1 (fr) * | 1984-07-11 | 1990-11-09 | Nec Corp | Ensemble a paillette comprenant un substrat de cablage multi-couche |
AT389793B (de) | 1986-03-25 | 1990-01-25 | Philips Nv | Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten |
US4866507A (en) * | 1986-05-19 | 1989-09-12 | International Business Machines Corporation | Module for packaging semiconductor integrated circuit chips on a base substrate |
JPH0311792A (ja) | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | はんだバンプの形成方法 |
JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
FR2666173A1 (fr) * | 1990-08-21 | 1992-02-28 | Thomson Csf | Structure hybride d'interconnexion de circuits integres et procede de fabrication. |
JPH04337695A (ja) | 1991-05-15 | 1992-11-25 | Hitachi Cable Ltd | 多層配線構造体 |
JPH04354398A (ja) | 1991-05-31 | 1992-12-08 | Internatl Business Mach Corp <Ibm> | 配線基板及びその製造方法 |
JP2541063Y2 (ja) * | 1991-09-04 | 1997-07-09 | 日本電気株式会社 | プリント基板のパターン構造 |
JP2658661B2 (ja) * | 1991-09-18 | 1997-09-30 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
JPH0572177U (ja) * | 1992-03-05 | 1993-09-28 | ティーディーケイ株式会社 | 多層基板による回路モジュール |
JPH05206622A (ja) | 1992-07-23 | 1993-08-13 | Ibiden Co Ltd | プリント配線板 |
JP2713037B2 (ja) | 1992-07-30 | 1998-02-16 | 凸版印刷株式会社 | プリント配線板及びその製造方法 |
JPH0669615A (ja) | 1992-08-21 | 1994-03-11 | Ibiden Co Ltd | プリント配線板 |
JPH07112107B2 (ja) | 1992-12-21 | 1995-11-29 | 日本電気株式会社 | プリント配線板及びその製造方法 |
JPH06204631A (ja) | 1993-01-08 | 1994-07-22 | Nec Toyama Ltd | 印刷配線板 |
DE4310930A1 (de) | 1993-04-02 | 1994-10-06 | Siemens Ag | Leiterplattenanordnung und Verfahren zur Herstellung einer bestückten Leiterplatte |
JPH06350230A (ja) | 1993-06-08 | 1994-12-22 | Fujitsu Ten Ltd | プリント配線基板及びその製造方法 |
JPH0794885A (ja) | 1993-09-20 | 1995-04-07 | Fujitsu Ltd | 並設プラグイン実装用プリント板の前面板 |
JP2550881B2 (ja) | 1993-09-27 | 1996-11-06 | 日本電気株式会社 | プリント配線板及びその検査方法 |
KR0141952B1 (ko) * | 1994-12-19 | 1998-06-01 | 문정환 | 반도체 패키지 및 그 제조방법 |
-
1996
- 1996-06-06 KR KR1019970700629A patent/KR100307776B1/ko not_active IP Right Cessation
- 1996-06-06 SG SG1997004665A patent/SG65717A1/en unknown
- 1996-06-06 US US08/765,451 patent/US6291778B1/en not_active Expired - Fee Related
- 1996-06-06 EP EP96916328A patent/EP0776150B1/en not_active Expired - Lifetime
- 1996-06-06 CN CN96190598A patent/CN1080981C/zh not_active Expired - Lifetime
- 1996-06-06 SG SG1998003654A patent/SG71838A1/en unknown
- 1996-06-06 DE DE69636212T patent/DE69636212T2/de not_active Expired - Lifetime
- 1996-06-06 WO PCT/JP1996/001539 patent/WO1996039796A1/ja active IP Right Grant
-
1998
- 1998-09-11 US US09/152,250 patent/US6303880B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69636212D1 (de) | 2006-07-20 |
SG71838A1 (en) | 2000-04-18 |
EP0776150A4 (en) | 1999-03-31 |
US6303880B1 (en) | 2001-10-16 |
KR100307776B1 (ko) | 2001-11-22 |
KR970705331A (ko) | 1997-09-06 |
CN1155968A (zh) | 1997-07-30 |
CN1080981C (zh) | 2002-03-13 |
EP0776150A1 (en) | 1997-05-28 |
WO1996039796A1 (fr) | 1996-12-12 |
US6291778B1 (en) | 2001-09-18 |
EP0776150B1 (en) | 2006-06-07 |
DE69636212T2 (de) | 2007-04-05 |
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