SG43003A1 - Method of resin molding and resin molding machine for the same - Google Patents

Method of resin molding and resin molding machine for the same

Info

Publication number
SG43003A1
SG43003A1 SG1996002124A SG1996002124A SG43003A1 SG 43003 A1 SG43003 A1 SG 43003A1 SG 1996002124 A SG1996002124 A SG 1996002124A SG 1996002124 A SG1996002124 A SG 1996002124A SG 43003 A1 SG43003 A1 SG 43003A1
Authority
SG
Singapore
Prior art keywords
resin molding
same
molding machine
machine
resin
Prior art date
Application number
SG1996002124A
Other languages
English (en)
Inventor
Fumio Miyajima
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG43003A1 publication Critical patent/SG43003A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG1996002124A 1995-02-22 1996-02-16 Method of resin molding and resin molding machine for the same SG43003A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03349395A JP3246848B2 (ja) 1995-02-22 1995-02-22 汎用ゲート位置樹脂モールド装置および樹脂モールド方法

Publications (1)

Publication Number Publication Date
SG43003A1 true SG43003A1 (en) 1997-10-17

Family

ID=12388089

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996002124A SG43003A1 (en) 1995-02-22 1996-02-16 Method of resin molding and resin molding machine for the same

Country Status (6)

Country Link
US (1) US5824252A (ja)
EP (1) EP0728567B1 (ja)
JP (1) JP3246848B2 (ja)
KR (1) KR0178698B1 (ja)
DE (1) DE69608153T2 (ja)
SG (1) SG43003A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3255646B2 (ja) 1997-02-10 2002-02-12 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP2971834B2 (ja) * 1997-06-27 1999-11-08 松下電子工業株式会社 樹脂封止型半導体装置の製造方法
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
NL1008488C2 (nl) * 1998-03-05 1999-09-07 Fico Bv Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
JP3490606B2 (ja) * 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型
US6523803B1 (en) 1998-09-03 2003-02-25 Micron Technology, Inc. Mold apparatus used during semiconductor device fabrication
NL1010567C2 (nl) * 1998-11-16 2000-05-17 3P Licensing Bv Inrichting voor het omhullen van elektronische componenten.
JP4077118B2 (ja) * 1999-06-25 2008-04-16 富士通株式会社 半導体装置の製造方法および半導体装置製造用金型
US6413801B1 (en) * 2000-05-02 2002-07-02 Advanced Semiconductor Engineering, Inc. Method of molding semiconductor device and molding die for use therein
US6916683B2 (en) * 2000-05-11 2005-07-12 Micron Technology, Inc. Methods of fabricating a molded ball grid array
US6481996B1 (en) * 2000-05-25 2002-11-19 The Tech Group, Inc. Tapered mold runner block
JP2002009096A (ja) * 2000-06-20 2002-01-11 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
DE10119817A1 (de) * 2001-04-23 2002-10-24 Envision Technologies Gmbh Vorrichtung und Verfahren für die zerstörungsfreie Trennung ausgehärteter Materialschichten von einer planen Bauebene
US6969918B1 (en) * 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
DE602004026191D1 (de) * 2003-07-18 2010-05-06 Nissha Printing In der form verziertes geformtes produkt und verfahren zur herstellung desselben
WO2007060892A1 (ja) * 2005-11-25 2007-05-31 Dai-Ichi Seiko Co., Ltd. 樹脂封止装置及び樹脂封止方法
US9067342B2 (en) * 2012-09-26 2015-06-30 Intel Corporation Mold chase for integrated circuit package assembly and associated techniques and configurations
US9498920B2 (en) 2013-02-12 2016-11-22 Carbon3D, Inc. Method and apparatus for three-dimensional fabrication
BR112015017976A2 (pt) 2013-02-12 2017-07-11 Carbon3D Inc impressão de interfase líquida contínua
US9360757B2 (en) 2013-08-14 2016-06-07 Carbon3D, Inc. Continuous liquid interphase printing
US11260208B2 (en) 2018-06-08 2022-03-01 Acclarent, Inc. Dilation catheter with removable bulb tip
MX2016017099A (es) 2014-06-20 2017-08-07 Carbon Inc Impresion tridimensional con alimentacion reciproca de liquido polimerizable.
CN114734628A (zh) 2014-06-23 2022-07-12 卡本有限公司 由具有多重硬化机制的材料制备三维物体的方法
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3083408A (en) * 1957-11-21 1963-04-02 Bichl Josef Machine for injection molding of selfhardening resins
US3216060A (en) * 1960-12-05 1965-11-09 Trojanowski George Apparatus for the manufacture of molded articles
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
JPS6328042A (ja) * 1986-07-21 1988-02-05 Nec Corp 樹脂封止型半導体装置の樹脂封止方法
US4826931A (en) * 1986-10-09 1989-05-02 Mitsubishi Denki Kabushiki Kaisha Tablet for resin-molding semiconductor devices
JPH01202848A (ja) * 1988-02-08 1989-08-15 Nec Corp リードフレーム
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
JPH01293523A (ja) * 1988-05-20 1989-11-27 Mitsubishi Electric Corp 樹脂封止型半導体装置用封止金型
JPH01299008A (ja) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp モールド装置
JPH0290632A (ja) * 1988-09-28 1990-03-30 Matsushita Electron Corp 半導体装置の樹脂封止装置
JPH02134835A (ja) * 1988-11-15 1990-05-23 Nec Corp 樹脂封止型半導体装置用リードフレーム
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
JPH03256712A (ja) * 1990-03-08 1991-11-15 Toshiba Corp トランスファ成形装置
JPH0425054A (ja) * 1990-05-16 1992-01-28 Nec Kyushu Ltd 半導体装置用リードフレーム
JPH06342816A (ja) * 1993-06-02 1994-12-13 Mitsubishi Electric Corp 半導体装置及びその製造方法並びにそれらに用いるリードフレーム
NL9302265A (nl) * 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips

Also Published As

Publication number Publication date
JPH08224752A (ja) 1996-09-03
KR0178698B1 (ko) 1999-05-15
JP3246848B2 (ja) 2002-01-15
DE69608153D1 (de) 2000-06-15
US5824252A (en) 1998-10-20
EP0728567B1 (en) 2000-05-10
DE69608153T2 (de) 2000-11-09
EP0728567A1 (en) 1996-08-28
KR960031109A (ko) 1996-09-17

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